Top View 16mm [0.630"] 0.8mm [0.031"] 0.8mm [0.031"] 0.8mm typ. 16mm [0.630"] 14.4mm square [0.567"] 1 4.55mm [0.179"] 2.96mm [0.116"] 2 0.2mm dia. [0.008"] RoHS Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non clad 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Description: Giga-snaP BGA SMT Land Socket 361 position BGA surface mount land pattern to terminal pins (0.8mm centers, 19x19 array) Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice. LS-BGA361E-61 Drawing © 2005 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com Status: Released Scale: 6:1 Rev: C Drawing: S.Natarajan Date: 5/11/05 File: LS-BGA361E-61 Dwg.mcd Modified: 01/18/13, DH