Datasheet 2ch High Side Switch ICs 0.5A Current Limit High Side Switch ICs BD2046AFJ BD2056AFJ General Description Key Specifications BD2046AFJ and BD2056AFJ are dual channel high side switch ICs with an over current protection for Universal Serial Bus (USB) power supply line. The IC’s switch unit has two channels of N-Channel power MOSFET. Over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in. Features Input Voltage Range: 2.7V to 5.5V ON-Resistance: 100mΩ(Typ) Continuous Current Load: 0.25A Over-Current Threshold: 0.3A (Min), 0.9A (Max) Standby Current: 0.01μA (Typ) Output Rise Time: 1.8ms (Typ) Operating Temperature Range: -40°C to +85°C W(Typ) Package Dual N-MOS High Side Switch Control Input Logic Active-Low: BD2046AFJ Active-High: BD2056AFJ Soft Start Circuit Over Current Detection Thermal Shutdown Under Voltage Lockout Open Drain Error Flag Output Reverse-Current Protection when Switch Off Flag Output Delay D(Typ) H(Max) SOP-J8 4.90mm x 6.00mm x 1.65mm Applications USB Hub in Consumer Appliances, Note PC, PC Peripheral Equipment, and so forth Typical Application Circuit 5V(Typ) GND /OC1 CL CIN IN /EN1 (EN1) /EN2 (EN2) OUT1 OUT2 Data /OC2 CL Data Lineup Min Over-Current Threshold Typ Max Control Input Logic Package Orderable Part Number 0.3A 0.5A 0.9A Low SOP-J8 Reel of 2500 BD2046AFJ-E2 0.3A 0.5A 0.9A High SOP-J8 Reel of 2500 BD2056AFJ-E2 ○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays www.rohm.com TSZ02201-0E3E0H300140-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 1/23 TSZ22111･14･001 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Block Diagram TSD1 /EN1 EN1 /OC1 Gate Logic1 Delay OCD1 Charge Pump1 IN OUT1 UVLO OUT2 /EN2 EN2 OCD2 Charge Pump2 /OC2 Gate Logic2 Delay GND TSD2 Pin Configurations BD2046AFJ TOP VIEW BD2056AFJ TOP VIEW GND /OC1 GND /OC1 IN OUT1 IN OUT1 /EN1 OUT2 EN1 OUT2 /EN2 V CC /OC2 EN2 /OC2 Pin Description Pin No. Symbol I/O Pin Function 1 GND I Ground. 2 IN I Power supply input. Input terminal to the switch and power supply input terminal of the internal circuit. 3, 4 EN, /EN I Enable input. /EN: Switch on at low level. (BD2046AFJ) EN: Switch on at high level. (BD2056AFJ) High level input > 2.0V, low level input < 0.8V. 5, 8 /OC O Error flag output. low at over current, thermal shutdown. Open drain output. 6, 7 OUT O Switch output. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Absolute Maximum Ratings(Ta=25°C) Parameter Symbol Rating Unit Supply Voltage V IN -0.3 to +6.0 V Enable Voltage V EN , V /EN -0.3 to +6.0 V /OC Voltage V /OC -0.3 to +6.0 V /OC Current I /OC 10 mA OUT Voltage V OUT -0.3 to +6.0 V Storage Temperature Tstg -55 to +150 °C Power Dissipation (Note 1) Pd 0.67 W (Note 1) Mounted on 70mm x 70mm x 1.6mm glass-epoxy PCB. Derating : 5.4mW/ oC above Ta=25 oC Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Rating Min Typ Max Unit Operating Voltage V IN 2.7 - 5.5 Operating Temperature Topr -40 - +85 °C I LO 0 - 250 mA Continuous Output Current V Electrical Characteristics BD2046AFJ (Unless otherwise specified, V IN = 5.0V, Ta = 25°C) Limit Parameter Symbol Min Typ Max Unit Conditions Operating Current I DD - 110 140 μA V /EN = 0V, OUT = OPEN Standby Current I STB - 0.01 1 μA V /EN = 5V, OUT = OPEN V /ENH 2.0 - - V High Input - - 0.8 V Low Input - - 0.4 V Low Input 2.7V≤ V IN ≤4.5V /EN Input Voltage V /ENL /EN Input Current I /EN -1.0 +0.01 +1.0 μA V /EN = 0V or V /EN = 5V /OC Output Low Voltage V /OC - - 0.5 V I /OC = 5mA /OC Output Leak Current I L/OC - 0.01 1 μA V /OC = 5V /OC Delay Time t /OC - 2.5 8 ms ON-Resistance R ON - 100 130 mΩ Over-Current Threshold I TH 0.3 0.5 0.9 A Short Circuit Output Current I SC 0.3 0.5 0.7 A Output Rise Time t ON1 - 1.8 10 ms Output Turn ON Time t ON2 - 2.1 20 ms Output Fall Time t OFF1 - 1 20 μs Output Turn OFF Time t OFF2 - 3 40 μs V TUVH 2.1 2.3 2.5 V Increasing V IN V TUVL 2.0 2.2 2.4 V Decreasing V IN UVLO Threshold www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/23 I OUT = 250mA V IN = 5V, V OUT = 0V, C L = 100μF (RMS) R L = 20Ω , C L = OPEN TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Electrical Characteristics - continued BD2056AFJ (Unless otherwise specified, V IN = 5.0V, Ta = 25°C) Limit Parameter Symbol Min Typ Max Unit Conditions Operating Current I DD - 110 140 μA V EN = 5V , OUT = OPEN Standby Current I STB - 0.01 1 μA V EN = 0V , OUT = OPEN V ENH 2.0 - - V High Input - - 0.8 V Low Input - - 0.4 V Low Input 2.7V≤ V IN ≤4.5V I EN -1.0 +0.01 +1.0 μA V EN = 0V or V EN = 5V /OC Output Low Voltage V /OC - - 0.5 V I /OC = 5mA /OC Output Leak Current I L/OC - 0.01 1 μA V /OC = 5V /OC Delay Time t /OC - 2.5 8 ms ON-Resistance R ON - 100 130 mΩ Over-Current Threshold I TH 0.3 0.5 0.9 A Short Circuit Output Current I SC 0.3 0.5 0.7 A Output Rise Time t ON1 - 1.8 10 ms Output Turn ON Time t ON2 - 2.1 20 ms Output Fall Time t OFF1 - 1 20 μs Output Turn OFF Time t OFF2 - 3 40 μs V TUVH 2.1 2.3 2.5 V Increasing V IN V TUVL 2.0 2.2 2.4 V Decreasing V IN /EN Input Voltage /EN Input Current UVLO Threshold www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 V ENL 4/23 I OUT = 250mA V IN = 5V , V OUT = 0V, C L = 100μF (RMS) R L = 20Ω , C L = OPEN TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Measurement Circuit VDD VDD 1µF 1µF A GND GND /OC1 IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 10k 1µF GND IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 RL RL A. Operating Current VDD OUT1 VEN EN1 OUT2 VEN EN2 /OC2 CL CL B. EN, /EN Input Voltage, Output Rise / Fall Time VDD 10k VDD GND IOUT IOUT /OC1 IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 C.ON-Resistance, Over Current Detection IOUT IOUT 1µF /OC1 IN /OC1 D. /OC Output Low Voltage Figure 1. Measurement Circuit Timing Diagram tOFF1 tOFF1 tON1 tON1 90% 90% VOUT 10% 10% tON2 V/EN V/ENL 90% 10% 10% tON2 tOFF2 VEN V/ENH Figure 2. Timing Diagram (BD2046AFJ) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 90% VOUT VENH tOFF2 VENL Figure 3. Timing Diagram (BD2056AFJ) 5/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Typical Performance Curves 140 140 Ta=25°C 120 VIN=5.0V Operating Current: IDD [µA] : OPERATING CURRENT IDD [uA] Operating Current: IDD [µA] 120 100 100 80 80 60 60 40 40 20 20 0 -50 0 2 3 4 5 IN [V] SUPPLY :V SupplyVOLTAGE Voltage: VIN [V] 6 Figure 4. Operating Current vs Supply Voltage (EN, /EN Enable) 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Ambient Temperature: Ta[°C] Figure 5. Operating Current vs Ambient Temperature (EN, /EN Enable) 1.0 1.0 VIN=5.0V Ta=25°C 0.8 OPERATING CURRENT Standby Current: ISTB [µA]: ISTB [uA] OPERATING CURRENT Standby Current: ISTB [µA]: ISTB [uA] 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0.0 0.0 2 3 4 5 SUPPLY IN [V] SupplyVOLTAGE Voltage: V:INV[V] 6 -50 Figure 6. Standby Current vs Supply Voltage (EN, /EN Disable) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 Ambient TEMPERATURE Temperature: Ta[°C] AMBIENT : Ta[℃] Figure 7. Standby Current vs Ambient Temperature (EN, /EN Disable) 6/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Typical Performance Curves - continued 2.0 Enable Input Voltage: VEN, V/EN [V] Ta=25°C 1.5 VEN, V /EN [V] 0 ENABLE INPUT VOLTAGE Enable Input Voltage: VEN, V/EN:[V] 2.0 Low to High High to Low 1.0 0.5 VIN=5.0V 1.5 High to Low 1.0 0.5 0.0 0.0 2 3 4 5 SUPPLY VOLTAGE VIN [V] Supply Voltage: VIN:[V] -50 0 50 100 Ambient Temperature: Ta[°C] AMBIENT TEMPERATURE : Ta[℃] 6 Figure 8. EN, /EN Input Voltage vs Supply Voltage Figure 9. EN, /EN Input Voltage vs Ambient Temperature 0.5 0.5 Ta=25°C /OC LOW VOLTAGE : /OCOUTPUT Output Low Voltage: V/OC [V] V/OC [V] /OC LOW VOLTAGE : /OCOUTPUT Output Low Voltage: V/OC [V] V/OC [V] Low to High 0.4 0.3 0.2 0.1 VIN=5.0V 0.4 0.3 0.2 0.1 0.0 0.0 2 3 4 5 Supply Voltage: :VV [V][V] SUPPLY VOLTAGE INDD -50 6 Figure 10. /OC Output Low Voltage vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 AmbientTEMPERATURE Temperature: Ta[°C] AMBIENT : Ta[℃] Figure 11. /OC Output Low Voltage vs Ambient Temperature 7/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Typical Performance Curves - continued 200 200 VIN=5.0V ON RESISTANCE : ON-Resistance: RON [mΩ] RON [mΩ] ON RESISTANCE : ON-Resistance: RON [mΩ] R ON[mΩ] Ta=25°C 150 150 100 100 50 0 2 3 4 5 SupplyVOLTAGE Voltage: VIN [V] SUPPLY :V DD [V] 0 -50 6 Figure 12. ON-Resistance vs Supply Voltage 0 50 100 AmbientTEMPERATURE Temperature: Ta[°C] AMBIENT : Ta[℃] Figure 13. ON-Resistance vs Ambient Temperature 2.0 2.0 Ta=25°C Over-Current Threshold: ITH [A] Over-Current Threshold: ITH [A] 50 1.5 1.0 0.5 0.0 2 3 4 5 1.5 1.0 0.5 0.0 6 -50 Supply Voltage: VIN[V] Figure 14. Over-Current Threshold vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VIN=5.0V 0 50 Ambient Temperature: Ta[°C] 100 Figure 15. Over-Current Threshold vs Ambient Temperature 8/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Typical Performance Curves - continued 2.0 SHORT CIRCUIT : Short Circuit Output CURRENT Current: ISC [A] ISC [A] Short Circuit Output Current: ISC [A] 2.0 Ta=25°C VIN=5.0V 1.5 1.5 1.0 1.0 0.5 0.5 0.0 0.0 2 3 4 5 SupplyVOLTAGE Voltage: VIN: [V] SUPPLY VIN [V] -50 6 Figure 16. Short Circuit Output Current vs Supply Voltage Figure 17. Short Circuit Output Current vs Ambient Temperature 5.0 5.0 VIN=5.0V Ta=25°C 4.0 OutputRISE Rise TIME Time: :tON1 [ms] T ON1[ms] RISE TIME : T ON1[ms] Output Rise Time: tON1 [ms] 0 50 100 Ambient TEMPERATURE Temperature: Ta[°C] AMBIENT : Ta[℃] 3.0 2.0 1.0 0.0 2 3 4 5 Supply Voltage: VIN:[V] SUPPLY VOLTAGE VIN [V] 3.0 2.0 1.0 0.0 -50 6 Figure 18. Output Rise Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4.0 0 50 100 AmbientTEMPERATURE Temperature: Ta[°C] AMBIENT : Ta[℃] Figure 19. Output Rise Time vs Ambient Temperature 9/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Typical Performance Curves - continued 5.0 5.0 VIN=5.0V ONTime: TIMEtON2 : [ms] OutputTURN Turn ON TURNTurn ON ON TIME :T ON2 Output Time: tON2[ms] [ms] Ta=25°C 4.0 3.0 TON2 [ms] 3.0 4.0 2.0 1.0 2.0 1.0 0.0 -50 0.0 2 3 4 5 SUPPLY VIN [V] Supply VOLTAGE Voltage: VIN:[V] 6 Figure 20. Output Turn ON Time vs Supply Voltage 50 100 Figure 21. Output Turn ON Time vs Ambient Temperature 5.0 5.0 VIN=5.0V Ta=25°C FALL Output Fall TIME Time: :tOFF1 [µs] 4.0 3.0 4.0 3.0 T OFF1[us] T OFF1[us] TIME t:OFF1 [µs] OutputFALL Fall Time: 0 Ambient Temperature: Ta[°C] AMBIENT TEMPERATURE : Ta[℃] 2.0 1.0 2.0 1.0 0.0 0.0 2 3 4 5 SUPPLY IN [V] SupplyVOLTAGE Voltage: V:INV [V] -50 6 Figure 22. Output Fall Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 AmbientTEMPERATURE Temperature: Ta[°C] AMBIENT : Ta[℃] Figure 23. Output Fall Time vs Ambient Temperature 10/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Typical Performance Curves - continued 5.0 Ta=25°C 5.0 VIN=5.0V TURN TIME t:OFF2 [µs] Output Turn OFF OFF Time: OFF2 T [us] OFFTime: TIMEtOFF2 : [µs] OutputTURN Turn OFF TOFF2 [us] 6.0 4.0 4.0 3.0 3.0 2.0 2.0 1.0 1.0 0.0 0.0 2 3 4 5 Supply Voltage: VIN:[V] SUPPLY VOLTAGE VIN [V] -50 6 Figure 24. Output Turn OFF Time vs Supply Voltage 0 50 100 AMBIENT : Ta[℃] AmbientTEMPERATURE Temperature: Ta[°C] Figure 25. Output Turn OFF Time vs Ambient Temperature 2.0 2.0 1.5 /OC Delay Time: t/OC [ms] /OC Delay Time: t/OC [ms] Ta=25°C 1.0 0.5 0.0 2 3 4 5 1.0 0.5 VIN=5.0V 0.0 6 -50 Supply Voltage: VIN[V] Figure 26. /OC Delay Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 1.5 0 50 Ambient Temperature: Ta[°C] 100 Figure 27. /OC Delay Time vs Ambient Temperature 11/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Typical Performance Curves - continued 1.0 2.4 UVLO Hysteresis Voltage: VHYS [V] UVLO THRESHOLD : UVLO Threshold : VVOLTAGE TUVH, VTUVL [V] VUVLOH , V UVLOL [V] 2.5 VTUVH 2.3 VTUVL 2.2 2.1 2.0 0.8 0.6 0.4 0.2 0.0 -50 0 50 100 AMBIENT : Ta[℃] AmbientTEMPERATURE Temperature: Ta[°C] -50 Figure 28. UVLO Threshold Voltage vs Ambient Temperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 Ambient Temperature: Ta[°C] 100 Figure 29. UVLO Hysteresis Voltage vs Ambient Temperature 12/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Typical Wave Forms VEN (5V/div.) VEN (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V RL=10Ω CL=100μF VIN=5V RL=10Ω CL=100μF IOUT (0.5A/div.) IOUT (0.5A/div.) TIME(1ms/div.) TIME(1ms/div.) Figure 31. Output Fall Characteristic (BD2056AFJ) Figure 30. Output Rise Characteristic (BD2056AFJ) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VIN=5V RL=20Ω VIN=5V RL=20Ω CL=200µF CL=147µF IOUT (0.2A/div.) VIN=5V IOUT (0.5A/div.) CL=100µF CL=47µF TIME(20ms/div.) TIME(500µs/div.) Figure 33. Over Current Response Ramped Load (BD2056AFJ) Figure 32. Inrush Current Response (BD2056AFJ) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Typical Wave Forms - continued V/OC (5V/div.) VEN (5V/div.) VOUT (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VIN=5V VIN=5V CL=100μF IOUT (0.5A/div.) IOUT (0.5A/div.) TIME(2ms/div.) TIME (2ms/div.) Figure 34. Over Current Response Ramped Load (BD2056AFJ) Figure 35. Over Current Response Enable to Short Circuit (BD2056AFJ) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V CL=100μF VIN=5V CL=100μF Thermal Shutdown IOUT (1.0A/div.) IOUT (1.0A/div.) TIME (1ms/div.) TIME (500ms/div.) Figure 36. Over Current Response 1Ω short at Enable (BD2056AFJ) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Figure 37. Over Current Response 1Ω short at Enable (BD2056AFJ) 14/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Typical Wave Forms - continued VIN (5V/div.) VIN (5V/div.) VOUT (5V/div.) VOUT (5V/div.) IOUT (0.5A/div.) IOUT (0.5A/div.) V/OC (5V/div.) V/OC (5V/div.) RL=20Ω CL=100μF RL=20Ω CL=100μF TIME (1s/div.) TIME (1s/div.) Figure 38. UVLO Response when Increasing VIN (BD2056AFJ) Figure 39. UVLO Response when Decreasing VIN (BD2056AFJ) Regarding the output rise/fall and over current detection characteristics of BD2046AFJ, refer to the characteristic of BD2056AFJ. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Typical Application Circuit 5V(Typ) 10k to 100k 10k to 100k VBUS IN OUT ON/OFF GND /OC1 CL D+ OC CIN DRegulator GND OC ON/OFF Data IN /EN1 (EN1) /EN2 (EN2) OUT1 OUT2 Data /OC2 CL BD2046AFJ/56AFJ USB Controller Data Application Information When excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power source line and IC. This may cause bad effects on IC operations. In order to avoid this case, connect a bypass capacitor across IN terminal and GND terminal of IC. 1μF or higher is recommended. Pull up /OC output by a resistance value of 10kΩ to 100kΩ. Set up values for CL which satisfies the application. This application circuit does not guarantee its operation. When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including AC/DC characteristics as well as dispersion of the IC. Functional Description 1. Switch Operation IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal is also used as power source input to internal control circuit. When the switch is turned on from EN/EN control input, the IN terminal and OUT terminal are connected by a 100mΩ switch. In ON status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of the IN terminal, current flows from OUT terminal to IN terminal. Since a parasitic diode between the drain and the source of switch MOSFET is not present during OFF status, it is possible to prevent current from flowing reversely from OUT to IN. 2. Thermal Shutdown Circuit (TSD) Thermal shutdown circuit have dual thermal shutdown threshold. Thermal shutdown works when a high junction temperature due to an over current occurs, then the switch turns off and outputs an error flag (/OC). Thermal shut down action has hysteresis. When the junction temperature goes down, the switch automatically turns on and resets the error flag. Unless the cause of increase of the chip’s temperature is removed or the output of power switch is turned off, this operation repeats. The thermal shutdown circuit works when the switch of either OUT1 or OUT2 is on (EN, /EN signal is active). www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ 3. Datasheet BD2056AFJ Over Current Detection (OCD) The over current detection circuit limits current (I SC ) and outputs an error flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over current. The over current detection circuit works when the switch is on (EN, /EN signal is active). (1) When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status immediately. (2) When the output short-circuits or high-current load is connected while the switch is on, very large current flows until the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out. (3) When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under Voltage Lockout (UVLO) UVLO circuit prevents the switch from turning on until the V IN exceeds 2.3V (Typ). If V IN drops below 2.2V (Typ) while the switch is still ON, then UVLO shuts off the switch. UVLO has a hysteresis of 100mV (Typ). Note: Under voltage lockout circuit works when the switch of either OUT1 or OUT2 is on (EN, /EN signal is active). 5. Error Flag (/OC) Output Error flag output is N-MOS open drain output. At over current and/or thermal shutdown detection, the output level is low. Over current detection has a delay filter. This delay filter prevents current detection flags from being sent during instantaneous events such as surge current at switch on or hot plug. If fault flag output is unused, /OC pin should be connected to open or ground line. V/EN Output Short Circuit VOUT Thermal Shutdown IOUT V/OC /OC Delay Time Figure 40. Over Current Detection, Thermal Shutdown Timing (BD2046AFJ) VEN Output Short Circuit VOUT Thermal Shutdown IOUT V/OC /OC Delay Time Figure 41. Over Current Detection, Thermal Shutdown Timing (BD2056AFJ) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Power Dissipation (SOP-J8) 700 Power Dissipation: Pd[mW] POWER DISSIPATION : Pd [mW] 600 500 400 300 200 100 0 0 25 50 75 100 AMBIENT [℃] AmbientTEMPERATURE Temperature:: TaTa[°C] 125 150 70mm x 70mm x 1.6mm Glass Epoxy Board Figure 42. Power Dissipation Curve (Pd-Ta Curve) I/O Equivalence Circuit Symbol Pin No Equivalence Circuit /EN1(EN1) /EN2(EN2) EN1(/EN1) EN2(/EN2) 3, 4 /OC1 /OC2 /OC1 /OC2 OUT1 OUT2 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5, 8 OUT1 OUT2 6, 7 18/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. In rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Operational Notes - continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin A N P+ N P N P+ N Parasitic Elements N P+ GND E N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B Parasitic Elements GND GND Figure 43. Example of monolithic IC structure N Region close-by GND 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Ordering Information B D 2 0 4 6 A Part Number B D F J - Package FJ: SOP-J8 2 0 5 6 A Part Number F J Package FJ: SOP-J8 E2 Packaging and forming specification E2: Embossed tape and reel - E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram SOP-J8 (TOP VIEW) Part Number Marking LOT Number 1PIN MARK Part Number Part Number Marking BD2046AFJ D046A BD2056AFJ D056A www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SOP-J8 22/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 BD2046AFJ Datasheet BD2056AFJ Revision History Date Revision 11.Mar.2013 001 21.Aug.2014 002 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Changes New Release Applied the ROHM Standard Style. Add Typical Performance Curves for Over-Current Threshold and /OC Delay Time. 23/23 TSZ02201-0E3E0H300140-1-2 21.Aug.2014 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD2046AFJ - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD2046AFJ SOP-J8 2500 2500 Taping inquiry Yes