BCD AP2810BMTR-G1 1.0a high-side power distribution switch with enable and flag Datasheet

Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
General Description
Features
The AP2810 is an integrated high-side power switch
that consists of N-Channel MOSFET, charge pump,
over current & temperature and other related protection
circuits. The switch’s low RDS (ON), 60mΩ, design
easily to meet USB voltage drop requirements. It
includes soft-start to limit inrush current, over-current
protection, load short protection with fold-back, and
thermal shutdown to avoid switch failure during hot
plug-in. Under voltage lockout (UVLO) function is
used to ensure the device remain off unless there is a
valid input voltage present. A Flag output is available
to indicate fault conditions to the local USB
controller.
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The AP2810 is available in standard packages of
SOIC-8 and MSOP-8.
AP2810
Low MOSFET on Resistance: 60mΩ
@VIN=5.0V
Compliant to USB Specifications
Operating Voltage Range: 2.7V to 5.5V
Low Supply Current: 65µA (Typ)
Low Shutdown Current: 1.0µA (Max)
Guarantee 1.0A Continuous Load
Current Limit: 1.1A (Min), 2.1A (Max)
Under-voltage Lockout
Logic Level Enable Pin: Available in
Active-high or Active-low Version
Over-current Protection
Over Temperature Protection
Load Short Protection with Fold-back
No Reverse Current When Power off
With Output Shutdown Pull-low Resistor for
A/C Versions
Applications
•
•
•
•
•
SOIC-8
USB Power Management
USB Bus/Self Powered Hubs
Hot-plug Power Supplies
Battery-charger Circuits
Notebooks, Motherboard PCs
MSOP-8
Figure 1. Package Types of AP2810
Jul. 2012
Rev 1. 2
BCD Semiconductor Manufacturing Limited
1
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Pin Configuration
M/MM Package
(SOIC-8/MSOP-8)
Figure 2. Pin Configuration of AP2810 (Top View)
Pin Descriptions
Pin Number
Pin Name
1
GND
Ground
2, 3
VIN
Supply input pin
4
Chip enable control input, active low or high
5
Fault flag pin, output with open drain, need a pull-up resistor in
application, active low to indicate OCP or OTP
6, 7, 8
Jul. 2012
Function
VOUT
Switch output voltage
Rev 1. 2
BCD Semiconductor Manufacturing Limited
2
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Functional Block Diagram
Figure 3. Functional Block Diagram of AP2810
Jul. 2012
Rev 1. 2
BCD Semiconductor Manufacturing Limited
3
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Ordering Information
AP2810
G1: Green
Circuit Type
TR: Tape & Reel
Blank: Tube
Condition
A: Active High with Auto Discharge
B: Active High without Auto Discharge
C: Active Low with Auto Discharge
D: Active Low without Auto Discharge
Product Package
Condition
Package
M: SOIC-8
MM: MSOP-8
Temperature Part Number
Range
Green
SOIC-8
Active High
AP2810A
with Auto Discharge
-40 to 85°C
MSOP-8
SOIC-8
Active High
AP2810B
without Auto Discharge
-40 to 85°C
MSOP-8
SOIC-8
AP2810C
MSOP-8
SOIC-8
AP2810D
MSOP-8
Active Low
with Auto Discharge
Active Low
without Auto Discharge
-40 to 85°C
-40 to 85°C
Marking ID
Green
Packing
Type
AP2810AM-G1
2810AM-G1
Tube
AP2810AMTR-G1
2810AM-G1
Tape & Reel
AP2810AMM-G1
2810AMM-G1
Tube
AP2810AMMTR-G1
2810AMM-G1
Tape & Reel
AP2810BM-G1
2810BM-G1
Tube
AP2810BMTR-G1
2810BM-G1
Tape & Reel
AP2810BMM-G1
2810BMM-G1
Tube
AP2810BMMTR-G1
2810BMM-G1
Tape & Reel
AP2810CM-G1
2810CM-G1
Tube
AP2810CMTR-G1
2810CM-G1
Tape & Reel
AP2810CMM-G1
2810CMM-G1
Tube
AP2810CMMTR-G1
2810CMM-G1
Tape & Reel
AP2810DM-G1
2810DM-G1
Tube
AP2810DMTR-G1
2810DM-G1
Tape & Reel
AP2810DMM-G1
2810DMM-G1
Tube
AP2810DMMTR-G1
2810DMM-G1
Tape & Reel
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant
and Green.
Jul. 2012
Rev 1. 2
BCD Semiconductor Manufacturing Limited
4
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Absolute Maximum Ratings (Note 1)
Parameter
Power Supply Voltage
Operating Junction Temperature
Range
Storage Temperature Range
Lead Temperature (Soldering,10
Seconds)
Thermal Resistance Junction to
Ambient
Symbol
Value
Unit
VIN
6.0
V
TJ
150
ºC
TSTG
-65 to 150
ºC
TLEAD
260
ºC
θJA
SOIC-8
135
MSOP-8
150
o
C/W
ESD (Machine Model)
200
V
ESD (Human Body Model)
2000
V
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute
Maximum Ratings” for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter
Supply Voltage
Operating Ambient
Range
Jul. 2012
Temperature
Symbol
Min
Max
Unit
VIN
2.7
5.5
V
TA
-40
85
°C
Rev 1. 2
BCD Semiconductor Manufacturing Limited
5
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Electrical Characteristics
(VIN=5.0V, CIN=2.2µF, COUT=1.0µF, Typical TA=25°C, unless otherwise specified)
Parameter
Symbol
Input Voltage Range
VIN
Switch On Resistance
RDS(ON)
Conditions
Min
Typ Max Unit
2.7
5.5
V
60
80
mΩ
1.5
2.1
A
85
µA
VIN=5V, IOUT=1.0A
Current Limit
ILIMIT
VOUT=4.0V
Supply Current
ISUPPLY
VIN=5V, No Load
65
Fold-back Short Current
ISHORT
VOUT=0
0.6
Shutdown Supply Current
Enable
High
Threshold
Enable
Low
Threshold
Input
Input
Enable Pin Input Current
Under Voltage Lockout
Threshold Voltage
ISHUTDOWN
VENL
0
1.0
V
Force 0V to 5.0V at EN Pin
-1.0
1.0
µA
VIN Increasing from 0V
2.2
2.7
V
IEN
VUVLO
RDISCHARGE
tON
Flag Delay Time
tDFLG
Flag Low Voltage
VFLG
Jul. 2012
ILEAKAGE
Shutdown
Shutdown
µA
V
IREVERSE
Thermal
Temperature
Thermal
Hysteresis
1
5.5
Reverse Current
Flag Leakage
0.1
1.6
VUVLOHY
Output Turn-on Time
Shutdown
A
VENH
Under Voltage Hysteresis
Output
Pull
Low
Resistance after Shutdown
Chip Disable,
Mode
1.1
2.5
0.2
V
Chip Disable, VOUT>VIN
0.1
1.0
µA
AP2810A, AP2810C only
100
200
Ω
From Enable Active to 90%
of Output
From Fault Condition to Flag
Active
ISINK=5mA
500
5
µs
10
15
ms
35
70
mV
1.0
µA
Flag Disable, Force 5.0V
TOTSD
150
o
C
THYOTSD
30
o
C
Rev 1. 2
BCD Semiconductor Manufacturing Limited
6
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Typical Performance Characteristics
100
100
80
80
Supply Current (μA)
Supply Current (μA)
90
VIN=5V
Enable Active
No Load
90
70
60
50
40
30
70
60
50
o
40
TA=-40 C
30
TA= 25 C
o
o
TA= 85 C
Enable Active
20
20
10
10
0
0
-40
-20
0
20
40
60
-10
1.0
80
1.5
2.0
2.5
o
Figure 4. Supply Current vs. Ambient Temperature
3.5
4.0
4.5
5.0
5.5
Figure 5. Supply Current vs. Supply Voltage
1.8
2.0
1.9
o
TA=25 C
Enable Active
VIN=3.3V
VIN=5V
Enable Active
1.7
Current Limit (A)
1.8
Current Limit (A)
3.0
Supply Voltage (V)
Ambient Temperature ( C)
1.7
1.6
1.5
1.4
1.6
1.5
1.4
1.3
1.3
1.2
1.2
1.1
1.1
1.0
3.0
3.5
4.0
4.5
5.0
1.0
-40
5.5
Supply Voltage (V)
0
20
40
60
80
o
Ambient Temperature ( C)
Figure 6. Current Limit vs. Supply Voltage
Jul. 2012
-20
Figure 7. Current Limit vs. Ambient Temperature
Rev 1. 2
BCD Semiconductor Manufacturing Limited
7
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Typical Performance Characteristics (Continued)
1.0
0.80
Output Short Current (A)
Output Short Current (A)
TA=25 C
Enable Active
0.75
VIN=5V
Enable Active
0.9
o
0.70
0.65
0.60
0.55
0.50
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.45
0.40
0.1
3.0
3.5
4.0
4.5
5.0
0.0
-40
5.5
-20
vs.
60
80
vs.
1.0
0.8
0.4
0.2
0.0
-0.2
-0.4
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.6
-0.8
-0.8
-20
0
20
40
60
VIN=3.5V
VOUT=4.5V
Disable Active
0.8
VIN=5V
Disable Active
0.6
Reverse Current (μA)
Shutdown Current (μA)
40
Figure 9. Output Short Current
Ambient Temperature
1.0
-1.0
-40
80
-20
0
20
40
60
80
o
o
Ambient Temperature ( C)
Ambient Temperature ( C)
Figure 10. Shutdown Current vs. Ambient Temperature
Jul. 2012
20
Ambient Temperature ( C)
Figure 8. Output Short Current
Input Voltage
-1.0
-40
0
o
Input Voltage (V)
Figure 11. Reverse Current vs. Ambient Temperature
Rev 1. 2
BCD Semiconductor Manufacturing Limited
8
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Typical Performance Characteristics (Continued)
VEN
(5V/div)
VEN
(5V/div)
IINRUSH
(1A/div)
IINRUSH
(20mA/div)
VOUT
(1V/div)
VOUT
(1V/div)
Time(500µs/div)
Time(500µs/div)
Figure 12. Output Turn ON and Rise Time
(CIN=1.0μF, COUT=1.0μF, No Load)
Figure 13. Output Turn ON and Rise Time
(CIN=1.0μF, COUT=1.0μF, RL=5.0Ω)
VEN
(5V/div)
VEN
(5V/div)
VOUT
(1V/div)
IINRUSH
(1A/div)
VOUT
(1V/div)
COUT=470μF
COUT=22μF
COUT=220μF
COUT=100μF
Time(500µs/div)
Time(5ms/div)
Figure 14. Output Turn ON and Rise Time
(CIN=1.0μF, COUT=100μF, No Load)
Jul. 2012
COUT=1μF
Figure 15. Output Turn OFF and Falling Time
(VIN=5V, CIN=1.0μF, No Load)
Rev 1. 2
BCD Semiconductor Manufacturing Limited
9
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Typical Performance Characteristics (Continued)
VEN
(5V/div)
VOUT
(1V/div)
VEN
(5V/div)
VOUT
(1V/div)
IOUT
(1A/div)
IOUT
(1A/div)
Time(2ms/div)
Time(100ms/div)
Figure 16. Output Turn OFF and Falling Time
(VIN=5V, CIN=1.0μF, COUT=470μF, RL=5.0Ω)
Figure 17. Output Short to GND Current
(VIN=5V,CIN=1.0μF)
VFLAG
(1V/div)
VOUT
(1V/div)
IOUT
(1A/div)
VFLAG
(1V/div)
VOUT
(1V/div)
IOUT
(1A/div)
Time(5ms/div)
Time(5ms/div)
Figure 18. FLAG Response During Over Current
(VIN=5V, CIN=1.0μF, COUT=470μF)
Jul. 2012
Figure 19. FLAG Response During Over Temperature
(VIN=5V, CIN=1.0μF, COUT=220μF, RL=5.0Ω)
Rev 1. 2
BCD Semiconductor Manufacturing Limited
10
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Typical Application
Note 2: 2.2μF input capacitor is enough in most application cases.
If the VOUT is short to ground frequently during usage, large size input capacitor is necessary, recommend
22μF.
Figure 20. Typical Application of AP2810
Jul. 2012
Rev 1. 2
BCD Semiconductor Manufacturing Limited
11
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Mechanical Dimensions
SOIC-8
4.700(0.185)
5.100(0.201)
7°
Unit: mm(inch)
0.320(0.013)
1.350(0.053)
1.750(0.069)
8°
8°
7°
0.675(0.027)
0.725(0.029)
D
5.800(0.228)
1.270(0.050)
6.200(0.244)
TYP
D
20:1
0.300(0.012)
R0.150(0.006)
0.100(0.004)
0.800(0.031)
0.200(0.008)
0°
8°
1.000(0.039)
3.800(0.150)
4.000(0.157)
0.330(0.013)
0.510(0.020)
0.190(0.007)
0.250(0.010)
0.900(0.035)
1°
5°
R0.150(0.006)
0.450(0.017)
0.800(0.031)
Note: Eject hole, oriented hole and mold mark is optional.
Jul. 2012
Rev 1. 2
BCD Semiconductor Manufacturing Limited
12
Advance Datasheet
1.0A High-side Power Distribution Switch with Enable and Flag
AP2810
Mechanical Dimensions (Continued)
2.900(0.114)
3.100(0.122)
0.200(0.008)
0.000(0.000)
4.700(0.185)
5.100(0.201)
Jul. 2012
Unit: mm(inch)
0.410(0.016)
0.650(0.026)
MSOP-8
Rev 1. 2
BCD Semiconductor Manufacturing Limited
13
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