Top View 0.75mm [0.030"] 42.50mm [1.673"] 1.00mm [0.039"] 0.75mm [0.030"] 42.50mm [1.673"] Side View 1 1.68mm [0.066"] 3.76mm [0.148"] 0.20mm [0.008"]±0.0005" 2 41.00mm [1.614"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Description: Giga-snaP BGA SMT Land Socket 1704 position BGA surface mount land pattern to terminal pins (1.0mm [0.039"] centers, 42x42 array) Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice. Scale: 3:1 LS-BGA1704A-41 Drawing Status: Released © 2005 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Drawing: S.Natarajan Date: 3/3/05 File: LS-BGA1704A-41 Dwg Modified:4/18/05 Rev: B