Diodes DMP2010UFG 20v p-channel enhancement mode mosfet Datasheet

DMP2010UFG
20V P-CHANNEL ENHANCEMENT MODE MOSFET
®
POWERDI
V(BR)DSS
-20V
Features
RDS(ON) Max
ID Max
TC = +25°C

Low RDS(ON) – Ensures On State Losses Are Minimized

-42A

Small Form Factor Thermally Efficient Package Enables Higher
Density End Products
Occupies Just 33% of The Board Area Occupied by SO-8
Enabling Smaller End Product
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
9.5mΩ @ VGS = -4.5V
12.5mΩ @ VGS = -2.5V


Description
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)), yet maintain superior switching performance, making it
ideal for high efficiency power management applications.


Mechanical Data


Applications
Case: POWERDI®3333-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See Diagram
Terminals: Finish  Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (Approximate)



Load Switch
Power Management Functions

POWERDI®3333-8
D
Pin 1
S
S
S
G
G
D
D
D
S
D
Top View
Bottom View
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMP2010UFG-7
DMP2010UFG-13
Notes:
Case
POWERDI®3333-8
POWERDI®3333-8
Packaging
2000/Tape & Reel
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
YYWW
ADVANCE INFORMATION
INFORMATION
ADVANCE
NEW PRODUCT
Product Summary
S49 = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 15 = 2015)
WW = Week Code (01 to 53)
S49
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DMP2010UFG
Document number: DS37848 Rev. 2 - 2
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September 2015
© Diodes Incorporated
DMP2010UFG
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
ADVANCE INFORMATION
INFORMATION
ADVANCE
NEW PRODUCT
Characteristic
Symbol
Drain-Source Voltage
Gate-Source Voltage
VDSS
VGSS
TA = +25°C
TC = +25°C
Continuous Drain Current, VGS = -4.5V (Note 6)
ID
Maximum Continuous Body Diode Forward Current (Note 6)
Value
-20
±10
Unit
V
V
-12.7
-42
A
IS
IDM
-3
A
Pulsed Drain Current (380µs Pulse, Duty Cycle = 1%)
-80
A
Avalanche Current, L=0.1mH (Note 7)
IAS
-35
A
Avalanche Energy, L=0.1mH (Note 7)
EAS
64
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
Symbol
PD
RJA
PD
RJA
RJC
TJ, TSTG
Steady State
Steady State
Value
0.9
136
2.3
54
4
-55 to +150
Unit
W
°C/W
W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-20
—
—
—
—
—
—
-1
±100
µA
VGS(TH)
Static Drain-Source On-Resistance
RDS(ON)
VSD
-0.4
—
—
—
—
—
—
-0.7
-1.2
9.5
12.5
-1.2
Ciss
Coss
Crss
RG
Qg
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
—
3350
527
460
10.7
50
103
6.0
14.4
9.7
30
235
110
64
60
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = -4.5V)
Total Gate Charge (VGS = -10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
V
nA
V
mΩ
V
Test Condition
VGS = 0V, ID = -1mA
VDS = -16V, VGS = 0V
VGS = ±8V, VDS = 0V
VDS = VGS, ID = -250µA
VGS = -4.5V, ID = -3.6A
VGS = -2.5V, ID = -3.6A
VGS = 0V, IS = -10A
pF
VDS = -10V, VGS = 0V
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = -10V, ID = -3.6A
ns
VDD = -10V, VGS = -4.5V,
RGEN = 4.7Ω, ID = -3.6A
ns
nC
IF = -3.6A, di/dt = 100A/µs
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
POWERDI is a registered trademark of Diodes Incorporated.
DMP2010UFG
Document number: DS37848 Rev. 2 - 2
2 of 7
www.diodes.com
September 2015
© Diodes Incorporated
DMP2010UFG
30
30.0
VGS= -2.0V
VDS= -5V
25
20.0
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS= -2.5V
VGS= -3.0V
VGS= -4.0V
15.0
VGS= -4.5V
10.0
VGS= -1.5V
5.0
20
15
10
85℃
125℃
5
25℃
150℃
VGS= -1.2V
0.5
1
1.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
0
2
0.5
1
1.5
2
2.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
0.015
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
-55℃
0
0.0
0.012
VGS= -2.5V
0.009
VGS= -4.5V
0.006
0.003
0.02
0.018
0.016
0.014
0.012
0.01
ID= -3.6A
0.008
0.006
0.004
0.002
0
0
0
0
5
10
15
20
25
30
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
2
4
6
8
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
10
2.5
0.015
VGS= -4.5V
0.012
85℃
125℃
150℃
0.009
25℃
-55℃
0.006
0.003
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
ADVANCE INFORMATION
INFORMATION
ADVANCE
NEW PRODUCT
25.0
2
VGS= -4.5V, ID= -5A
1.5
1
VGS= -2.5V, ID= -5A
0.5
0
0
0
5
10
15
20
25
30
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Junction Temperature
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Junction
Temperature
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DMP2010UFG
Document number: DS37848 Rev. 2 - 2
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0.015
VGS= -2.5V, ID= -5A
0.01
VGS= -4.5V, ID= -5A
0.005
1.2
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.02
1
ID= -1mA
0.8
ID= -250μA
0.6
0.4
0.2
0
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Junction
Temperature
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
30
100000
150℃
IDSS, LEAKAGE CURRENT (nA)
IS, SOURCE CURRENT (A)
25
VGS=0V, TJ=125℃
20
VGS=0V, TJ=150℃
15
VGS=0V, TJ=85℃
10
VGS=0V, TJ=25℃
5
10000
125℃
1000
85℃
100
25℃
10
1
VGS=0V, TJ=-55℃
0.1
0
0
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
0
5
10
15
20
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Drain-Source Leakage Current vs.
Voltage
1.5
10000
10
f=1MHz
Ciss
8
VGS (V)
CT, JUNCTION CAPACITANCE (pF)
ADVANCE INFORMATION
INFORMATION
ADVANCE
NEW PRODUCT
DMP2010UFG
1000
Coss
6
VDS= -10V, ID= -3.6A
4
Crss
2
0
100
0
5
10
15
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 11. Typical Junction Capacitance
20
0
10
20
30
40
50 60 70 80
Qg (nC)
Figure 12. Gate Charge
90 100
POWERDI is a registered trademark of Diodes Incorporated.
DMP2010UFG
Document number: DS37848 Rev. 2 - 2
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September 2015
© Diodes Incorporated
DMP2010UFG
100
PW =100μs
ID, DRAIN CURRENT (A)
10
PW =1ms
1
PW =10ms
PW =100ms
TJ(MAX)=150℃
TC=25℃
Single Pulse
DUT on 1*MRP board
VGS= -4.5V
0.1
0.01
0.01
0.1
PW =1s
PW =10s
DC
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 13. SOA, Safe Operation Area
1
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCE INFORMATION
INFORMATION
ADVANCE
NEW PRODUCT
RDS(ON) Limited
D=0.5
D=0.3
D=0.9
0.1
D=0.7
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJA (t)=r(t) * RθJA
RθJA=136℃/W
Duty Cycle, D=t1 / t2
D=Single Pulse
0.001
1E-05
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 14. Transient Thermal Resistance
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DMP2010UFG
Document number: DS37848 Rev. 2 - 2
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DMP2010UFG
Package Outline Dimensions
ADVANCE INFORMATION
INFORMATION
ADVANCE
NEW PRODUCT
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
A1
A3
A
Seating Plane
D
L(4x)
D2
1
Pin #1 ID
b2(4x)
E
E2
e1
8
z(4x)
b
POWERDI®3333-8
Dim Min Max Typ
A
0.75 0.85 0.80
A1 0.00 0.05 0.02
A3

 0.203
b
0.27 0.37 0.32
b2
0.20


D
3.25 3.35 3.30
D2 2.22 2.32 2.27
E
3.25 3.35 3.30
E2 1.56 1.66 1.61
e
0.65


e1 0.79 0.89 0.84
L
0.35 0.45 0.40
L1
0.39


z

 0.515
All Dimensions in mm
L1(3x)
e
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X3
X2
8
Y2
X1
Y1
Y3
Y
Dimensions Value (in mm)
C
0.650
X
0.420
X1
0.420
X2
0.230
X3
2.370
Y
0.700
Y1
1.850
Y2
2.250
Y3
3.700
1
X
C
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DMP2010UFG
Document number: DS37848 Rev. 2 - 2
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September 2015
© Diodes Incorporated
DMP2010UFG
ADVANCE INFORMATION
INFORMATION
ADVANCE
NEW PRODUCT
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
POWERDI is a registered trademark of Diodes Incorporated.
DMP2010UFG
Document number: DS37848 Rev. 2 - 2
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www.diodes.com
September 2015
© Diodes Incorporated
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