Cypress BCM43455 Single-chip 5g wifi ieee 802.11ac mac/baseband/ radio with integrated bluetooth 4.1 and fm receiver Datasheet

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Document Number: 002-15051 Rev. *I
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Revised July 1, 2016
Preliminary Data Sheet
BCM43455
Single-Chip 5G WiFi IEEE 802.11ac MAC/Baseband/
Radio with Integrated Bluetooth 4.1 and FM
Receiver
GE NE R AL DE S C RI PT ION
The Broadcom® BCM43455 single-chip device
provides the highest level of integration for a mobile or
handheld wireless system with integrated singlestream IEEE 802.11ac MAC/baseband/radio,
Bluetooth 4.1,and FM receiver.
In IEEE 802.11ac mode, the WLAN operation
supports rates of MCS0–MCS9 (up to 256 QAM) in
20 MHz, 40 MHz, and 80 MHz channels for data rates
of up to 433.3 Mbps. All rates specified in the IEEE
802.11a/b/g/n are supported. Included on-chip are
2.4 GHz and 5 GHz transmit amplifiers and receive
low-noise amplifiers. Optional external PAs and LNAs
are also supported.
The WLAN section supports the following host
interface options: an SDIO v3.0 interface that can
operate in 4b or 1b mode, a high-speed 4-wire UART,
and a PCIe Gen1 (3.0 compliant) interface. The
Bluetooth section supports a high-speed 4-wire UART
interface.
Using advanced design techniques and process
technology to reduce active and idle power, the
BCM43455 is designed to address the needs of
mobile devices that require minimal power
consumption and compact size. It includes a power
management unit which simplifies the system power
topology and allows for direct operation from a mobile
platform battery while maximizing battery life.
The BCM43455 implements highly sophisticated
enhanced collaborative coexistence hardware
mechanisms and algorithms, which ensure that
WLAN and Bluetooth collaboration is optimized for
maximum performance. In addition, coexistence
support for external radios (such as LTE cellular and
GPS) is provided via an external interface. As a result,
enhanced overall quality for simultaneous voice,
video, and data transmission on a handheld system is
achieved.
Figure 1: Functional Block Diagram
VIO
WLAN
Host I/F
WL_REG_ON
PCIe
UART
SDIO
External
Coexistence I/F
COEX
BT_REG_ON
Bluetooth
Host I/F FM
Rx Host I/F
VBAT
5 GHz WLAN Tx
5 GHz WLAN Rx
2.4 GHz WLAN Tx
2.4 GHz WLAN/BT Rx
Bluetooth Tx
FEM or
T/R
Switch
FEM or
Optional
T/R
Switch
CBF
BCM43455
UART
I2 S
PCM
BT_DEV_WAKE
BT_HOST_WAKE
FM Rx
FM I/F
FM Audio Out
I2 S
43455-DS109-R
5300 California Avenue • Irvine, CA 92617 • Phone: 949-926-5000 • Fax: 949-926-5203
November 5, 2015
BCM43455 Preliminary Data Sheet
Revision History
F E A T U RE S
IEEE 802.11x Key Features
• IEEE 802.11ac compliant.
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Support for TurboQAM® (MCS0–MCS8
86 Mbps and MCS0–MCS9 96 Mbps) HT20,
20 MHz channel bandwidth.
Single-stream spatial multiplexing up to
433.3 Mbps data rate.
Supports 20, 40, and 80 MHz channels with
optional SGI (256 QAM modulation).
Full IEEE 802.11a/b/g/n legacy compatibility with
enhanced performance.
Supports explicit IEEE 802.11ac transmit
beamforming.
TX and RX low-density parity check (LDPC)
support for improved range and power efficiency.
On-chip power amplifiers and low-noise amplifiers
for both bands.
Support for optional front-end modules (FEM) with
external PAs and LNAs.
Supports optional integrated T/R switch for
2.4 GHz band.
Supports RF front-end architecture with a single
dual-band antenna shared between Bluetooth
and WLAN for lowest system cost.
Shared Bluetooth and WLAN receive signal path
eliminates the need for an external power splitter
while maintaining excellent sensitivity for both
Bluetooth and WLAN.
Internal fractional-n PLL allows support for a wide
range of reference clock frequencies.
Supports IEEE 802.15.2 external coexistence
interface to optimize bandwidth utilization with
other co-located wireless technologies such as
LTE or GPS.
Supports standard SDIO v3.0 (including DDR50
mode at 50 MHz and SDR104 mode at 208 MHz,
4-bit and 1-bit) interfaces.
Broadcom®
November 5, 2015 • 43455-DS109-R
Bluetooth Key Features
• Complies with Bluetooth Core Specification
Version 4.1 with provisions for supporting future
specifications.
• Bluetooth Class 1 or Class 2 transmitter
operation.
• Supports extended synchronous connections
(eSCO), for enhanced voice quality by allowing for
retransmission of dropped packets.
• Adaptive frequency hopping (AFH) for reducing
radio frequency interference.
• Interface support, host controller interface (HCI)
using a high-speed UART interface and PCM for
audio data.
• FM unit supports HCI for communication.
• FM receiver: 65 MHz to 108 MHz FM bands;
supports the European radio data systems (RDS)
and the North American radio broadcast data
system (RBDS) standards.
• Low power consumption improves battery life of
handheld devices.
• Supports multiple simultaneous Advanced Audio
Distribution Profiles (A2DP) for stereo sound.
• Automatic frequency detection for standard
crystal and TCXO values.
General Features
• Supports battery voltage range from 3.0V to 5.25V
supplies with internal switching regulator.
• Programmable dynamic power management
• 6 Kbit OTP for storing board parameters.
• GPIOs: 15
• 140-ball WLBGA package (4.47 mm × 5.27 mm,
0.4 mm pitch).
•
BROADCOM CONFIDENTIAL
Page 2
F E A T U RE S
IEEE 802.11x Key Features (Cont.)
• Backward compatible with SDIO v2.0 host
interfaces.
• PCIe mode complies with PCI Express base
specification revision 3.0 compliant Gen1
interface for ×1 lane and power management
base specification.
• Integrated ARMCR4 processor with tightly
coupled memory for complete WLAN subsystem
functionality and minimizing the need to wake-up
the applications processor for standard WLAN
functions. This allows for further minimization of
power consumption, while maintaining the ability
to field upgrade with future features. On-chip
memory includes 800 KB SRAM and 704 KB
ROM.
•
General Features (Cont.)
• Security:
– WPA and WPA2 (Personal) support for
powerful encryption and authentication
– AES and TKIP in hardware for faster data
encryption and IEEE 802.11i compatibility
– Reference WLAN subsystem provides Cisco
Compatible Extensions (CCX, CCX 2.0, CCX
3.0, and CCX 4.0)
– Reference WLAN subsystem provides Wi-Fi
Protected Setup (WPS)
• Worldwide regulatory support: Global products
supported with worldwide homologated design.
OneDriver™ software architecture for easy
migration from existing embedded WLAN and
Bluetooth devices as well as future devices.
Broadcom Corporation
5300 California Avenue
Irvine, CA 92617
© 2015 by Broadcom Corporation
All rights reserved
Printed in the U.S.A.
Broadcom®, the pulse logo, Connecting everything®, the Connecting everything logo, OneDriver™,
SmartAudio®, and TurboQAM® are among the trademarks of Broadcom Corporation and/or its affiliates in the
United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the
property of their respective owners.
This data sheet (including, without limitation, the Broadcom component(s) identified herein) is not designed,
intended, or certified for use in any military, nuclear, medical, mass transportation, aviation, navigations,
pollution control, hazardous substances management, or other high-risk application. BROADCOM
PROVIDES THIS DATA SHEET “AS-IS,” WITHOUT WARRANTY OF ANY KIND. BROADCOM DISCLAIMS
ALL WARRANTIES, EXPRESSED AND IMPLIED, INCLUDING, WITHOUT LIMITATION, THE IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NONINFRINGEMENT.
BCM43455 Preliminary Data Sheet
Revision History
Revision History
Revision
Date
Change Description
43455-DS109-R
11/05/15
Updated:
• Table 17: “WLBGA Pin List by Pin Number,” on page 81.
• Table 18: “WLBGA Pin List by Pin Name,” on page 83.
• Table 19: “Signal Descriptions,” on page 85.
43455-DS108-R
09/25/15
43455-DS107-R
07/29/15
43455-DS106-R
07/09/15
43455-DS105-R
04/06/15
Updated:
• Figure 55: “140-Ball WLBGA Package Mechanical Information,” on page
24: nominal height (A) is 0.55 mm.
Updated:
• Figure 56: “140-Balls WLBGA Keep-out Areas for PCB Layout —Top
View with Balls Facing Down,” on page 169
Updated:
• Table 22: “WLBGA Signal Descriptions,” on page 97.
• Table 26: “I/O States,” on page 106.
• Table 37: “WLAN 2.4 GHz Receiver Performance Specifications,” on
page 125.
• Table 39: “WLAN 5 GHz Receiver Performance Specifications,” on
page 130.
• Figure 56: “140-Balls WLBGA Keep-out Areas for PCB Layout—Top
View with Balls Facing Down,” on page 168.
Updated:
• Table 36: “WLAN 2.4 GHz Transmitter Performance Specifications,” on
page 122.
• Table 38: “WLAN 5 GHz Transmitter Performance Specifications,” on
page 128.
Broadcom®
November 5, 2015 • 43455-DS109-R
BROADCOM CONFIDENTIAL
Page 4
BCM43455 Preliminary Data Sheet
Revision History
Revision
Date
Change Description
43455-DS104-R
03/31/15
Updated:
• “JTAG/SWD Interface” on page 73.
• Table 22: “WLBGA Signal Descriptions,” on page 97: WLAN GPIO
interface and JTAG interface.
• Table 29: “ESD Specifications,” on page 110.
• Table 31: “Bluetooth Receiver RF Specifications,” on page 113.
• Table 32: “Bluetooth Transmitter RF Specifications,” on page 116.
• Table 33: “Local Oscillator Performance,” on page 118.
• Table 34: “BLE RF Specifications,” on page 118.
• Table 36: “2.4 GHz Band General RF Specifications,” on page 125.
• Table 37: “WLAN 2.4 GHz Receiver Performance Specifications,” on
page 125.
• Table 38: “WLAN 2.4 GHz Transmitter Performance Specifications,” on
page 129.
• Table 40: “WLAN 5 GHz Transmitter Performance Specifications,” on
page 135.
• “Transmitter Spurious Emissions Specifications” on page 137.
• Section 18: “Internal Regulator Electrical Specifications,” on page 141.
• Table 53: “2.4 GHz Mode WLAN Power Consumption,” on page 147.
• Table 54: “5 GHz Mode WLAN Power Consumption,” on page 148.
• Table 55: “Bluetooth and BLE Current Consumption,” on page 149.
Added:
• “SWD Timing” on page 161.
Broadcom®
November 5, 2015 • 43455-DS109-R
BROADCOM CONFIDENTIAL
Page 5
BCM43455 Preliminary Data Sheet
Revision History
Revision
Date
Change Description
43455-DS103-R
02/04/15
Updated:
• “External Coexistence Interface” on page 72.
• Table 31: “Bluetooth Receiver RF Specifications,” on page 113.
• Table 32: “Bluetooth Transmitter RF Specifications,” on page 116.
• Table 33: “Local Oscillator Performance,” on page 118.
• Table 34: “BLE RF Specifications,” on page 118.
• Table 35: “FM Receiver Specifications,” on page 119.
• Table 37: “WLAN 2.4 GHz Receiver Performance Specifications,” on
page 125.
• Table 38: “WLAN 2.4 GHz Transmitter Performance Specifications,” on
page 128.
• Table 39: “WLAN 5 GHz Receiver Performance Specifications,” on page
129.
• Table 40: “WLAN 5 GHz Transmitter Performance Specifications,” on
page 133.
• Table 42: “2.4 GHz Band, 20 MHz Channel Spacing TX Spurious
Emissions Specifications,” on page 135.
• Table 43: “5 GHz Band, 20 MHz Channel Spacing TX Spurious
Emissions Specifications,” on page 136.
• Table 44: “5 GHz Band, 40 MHz Channel Spacing TX Spurious
Emissions Specifications,” on page 137.
• Table 45: “5 GHz Band, 80 MHz Channel Spacing TX Spurious
Emissions Specifications,” on page 138.
• Table 46: “2G and 5G General Receiver Spurious Emissions,” on page
139.
• Table 53: “2.4 GHz Mode WLAN Power Consumption,” on page 146.
• Table 54: “5 GHz Mode WLAN Power Consumption,” on page 147.
43455-DS102-R
11/20/14
Updated:
• Table 26: “ESD Specifications,” on page 104.
43455-DS101-R
11/06/14
43455-DS100-R
10/27/14
Updated:
• Figure 3: “Typical Power Topology (Page 1 of 2),” on page 22 and
Figure 4: “Typical Power Topology (Page 2 of 2),” on page 23.
• Figure 38: “Port Locations for Bluetooth Testing,” on page 109.
• Figure 39: “Port Locations for WLAN Testing,” on page 121.
Initial release.
Broadcom®
November 5, 2015 • 43455-DS109-R
BROADCOM CONFIDENTIAL
Page 6
BCM43455 Preliminary Data Sheet
Table of Contents
Table of Contents
About This Document ................................................................................................................................ 17
Purpose and Audience .......................................................................................................................... 17
Acronyms and Abbreviations................................................................................................................. 17
Document Conventions ......................................................................................................................... 17
References ............................................................................................................................................ 17
Technical Support ...................................................................................................................................... 18
Section 1: BCM43455 Overview ....................................................................................... 19
Overview...................................................................................................................................................... 19
Standards Compliance............................................................................................................................... 21
Mobile Phone Usage Model ....................................................................................................................... 22
Section 2: Power Supplies and Power Management ..................................................... 23
Power Supply Topology............................................................................................................................. 23
BCM43455 PMU Features .......................................................................................................................... 23
WLAN Power Management ........................................................................................................................ 26
PMU Sequencing ........................................................................................................................................ 26
Power-Off Shutdown .................................................................................................................................. 27
Power-Up/Power-Down/Reset Circuits..................................................................................................... 28
Section 3: Frequency References.................................................................................... 29
Crystal Interface and Clock Generation ................................................................................................... 29
External Frequency Reference.................................................................................................................. 30
Frequency Selection .................................................................................................................................. 32
External 32.768 kHz Low-Power Oscillator .............................................................................................. 33
Section 4: Bluetooth and FM Subsystem Overview....................................................... 34
Features....................................................................................................................................................... 34
Bluetooth Radio.......................................................................................................................................... 36
Transmit ................................................................................................................................................ 36
Digital Modulator ................................................................................................................................... 36
Digital Demodulator and Bit Synchronizer............................................................................................. 36
Power Amplifier ..................................................................................................................................... 36
Receiver ................................................................................................................................................ 37
Digital Demodulator and Bit Synchronizer............................................................................................. 37
Receiver Signal Strength Indicator........................................................................................................ 37
Local Oscillator Generation ................................................................................................................... 37
Calibration ............................................................................................................................................. 37
Section 5: Bluetooth Baseband Core .............................................................................. 38
Bluetooth 4.0 Features............................................................................................................................... 38
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
Table of Contents
Bluetooth 4.1 Features............................................................................................................................... 39
Bluetooth Low Energy ............................................................................................................................... 39
Link Control Layer...................................................................................................................................... 39
Test Mode Support ..................................................................................................................................... 40
Bluetooth Power Management Unit .......................................................................................................... 40
RF Power Management ........................................................................................................................ 40
Host Controller Power Management ..................................................................................................... 40
BBC Power Management...................................................................................................................... 43
Wideband Speech.......................................................................................................................... 43
Packet Loss Concealment ............................................................................................................. 43
Audio Rate-Matching Algorithms.................................................................................................... 44
Codec Encoding............................................................................................................................. 44
Multiple Simultaneous A2DP Audio Stream................................................................................... 44
FM Over Bluetooth ................................................................................................................................ 44
Burst Buffer Operation ................................................................................................................... 44
Adaptive Frequency Hopping.................................................................................................................... 45
Advanced Bluetooth/WLAN Coexistence................................................................................................. 45
Fast Connection (Interlaced Page and Inquiry Scans) ........................................................................... 45
Section 6: Microprocessor and Memory Unit for Bluetooth.......................................... 46
RAM, ROM, and Patch Memory ................................................................................................................. 46
Reset............................................................................................................................................................ 46
Section 7: Bluetooth Peripheral Transport Unit ............................................................. 47
SPI Interface................................................................................................................................................ 47
SPI/UART Transport Detection.................................................................................................................. 47
PCM Interface.............................................................................................................................................. 48
Slot Mapping ......................................................................................................................................... 48
Frame Synchronization ......................................................................................................................... 48
Data Formatting..................................................................................................................................... 48
Wideband Speech Support ................................................................................................................... 49
Multiplexed Bluetooth Over PCM .......................................................................................................... 49
Burst PCM Mode ................................................................................................................................... 49
PCM Interface Timing............................................................................................................................ 50
Short Frame Sync, Master Mode ................................................................................................... 50
Short Frame Sync, Slave Mode ..................................................................................................... 51
Long Frame Sync, Master Mode.................................................................................................... 52
Long Frame Sync, Slave Mode...................................................................................................... 53
Short Frame Sync, Burst Mode...................................................................................................... 54
Long Frame Sync, Burst Mode ...................................................................................................... 55
Broadcom®
November 5, 2015 • 43455-DS109-R
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Table of Contents
UART Interface............................................................................................................................................ 56
I2S Interface................................................................................................................................................. 57
I2S Timing.............................................................................................................................................. 58
Section 8: FM Receiver Subsystem ................................................................................. 60
FM Radio ..................................................................................................................................................... 60
Digital FM Audio Interfaces ....................................................................................................................... 60
FM Over Bluetooth ..................................................................................................................................... 60
eSCO............................................................................................................................................................ 60
Wideband Speech Link .............................................................................................................................. 61
A2DP ............................................................................................................................................................ 61
Autotune and Search Algorithms ............................................................................................................. 61
Audio Features ........................................................................................................................................... 62
RDS/RBDS................................................................................................................................................... 64
Section 9: WLAN Global Functions ................................................................................. 65
WLAN CPU and Memory Subsystem........................................................................................................ 65
One-Time Programmable Memory ............................................................................................................ 65
GPIO Interface............................................................................................................................................. 65
External Coexistence Interface ................................................................................................................. 66
UART Interface............................................................................................................................................ 67
JTAG/SWD Interface................................................................................................................................... 67
Section 10: WLAN Host Interfaces................................................................................... 68
SDIO v3.0..................................................................................................................................................... 68
SDIO Pins.............................................................................................................................................. 69
PCI Express Interface................................................................................................................................. 70
Transaction Layer Interface................................................................................................................... 71
Data Link Layer ..................................................................................................................................... 71
Physical Layer ....................................................................................................................................... 71
Logical Subblock ................................................................................................................................... 71
Scrambler/Descrambler......................................................................................................................... 71
8B/10B Encoder/Decoder...................................................................................................................... 72
Elastic FIFO........................................................................................................................................... 72
Electrical Subblock ................................................................................................................................ 72
Configuration Space.............................................................................................................................. 72
Section 11: Wireless LAN MAC and PHY ........................................................................ 73
IEEE 802.11ac MAC .................................................................................................................................... 73
PSM....................................................................................................................................................... 74
WEP ...................................................................................................................................................... 75
TXE ....................................................................................................................................................... 75
Broadcom®
November 5, 2015 • 43455-DS109-R
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Table of Contents
RXE ....................................................................................................................................................... 75
IFS......................................................................................................................................................... 75
TSF........................................................................................................................................................ 76
NAV ....................................................................................................................................................... 76
MAC-PHY Interface............................................................................................................................... 76
IEEE 802.11ac PHY ..................................................................................................................................... 76
Section 12: WLAN Radio Subsystem ............................................................................. 78
Receiver Path.............................................................................................................................................. 78
Transmit Path.............................................................................................................................................. 78
Calibration................................................................................................................................................... 78
Section 13: Ball Map and Pin Descriptions..................................................................... 80
Ball Map....................................................................................................................................................... 80
Pin List by Pin Number .............................................................................................................................. 81
Pin List by Pin Name .................................................................................................................................. 83
Pin Descriptions ......................................................................................................................................... 85
WLAN GPIO Signals and Strapping Options ........................................................................................... 91
Multiplexed Bluetooth GPIO Signals ..................................................................................................... 92
I/O States ..................................................................................................................................................... 94
Section 14: DC Characteristics ........................................................................................ 97
Absolute Maximum Ratings ...................................................................................................................... 97
Environmental Ratings .............................................................................................................................. 98
Electrostatic Discharge Specifications .................................................................................................... 98
Recommended Operating Conditions and DC Characteristics ............................................................. 99
Section 15: Bluetooth RF Specifications ...................................................................... 100
Section 16: FM Receiver Specifications........................................................................ 107
Section 17: WLAN RF Specifications ............................................................................ 112
Introduction............................................................................................................................................... 112
2.4 GHz Band General RF Specifications............................................................................................... 113
WLAN 2.4 GHz Receiver Performance Specifications .......................................................................... 113
WLAN 2.4 GHz Transmitter Performance Specifications ..................................................................... 117
WLAN 5 GHz Receiver Performance Specifications ............................................................................. 118
WLAN 5 GHz Transmitter Performance Specifications ........................................................................ 124
General Spurious Emissions Specifications ......................................................................................... 125
Transmitter Spurious Emissions Specifications .................................................................................. 125
2.4 GHz Band Spurious Emissions .............................................................................................. 126
20 MHz Channel Spacing .................................................................................................... 126
5 GHz Band Spurious Emissions ................................................................................................. 127
Broadcom®
November 5, 2015 • 43455-DS109-R
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Table of Contents
20 MHz Channel Spacing .................................................................................................... 127
40 MHz Channel Spacing .................................................................................................... 128
80 MHz Channel Spacing .................................................................................................... 129
Receiver Spurious Emissions Specifications ...................................................................................... 129
Section 18: Internal Regulator Electrical Specifications ............................................. 130
Core Buck Switching Regulator.............................................................................................................. 130
3.3V LDO (LDO3P3) .................................................................................................................................. 131
2.5V LDO (BTLDO2P5) ............................................................................................................................. 132
CLDO ......................................................................................................................................................... 133
LNLDO ....................................................................................................................................................... 134
PCIe LDO ................................................................................................................................................... 135
Section 19: System Power Consumption...................................................................... 136
WLAN Current Consumption................................................................................................................... 136
2.4 GHz Mode ..................................................................................................................................... 136
5 GHz Mode ........................................................................................................................................ 137
Bluetooth Current Consumption............................................................................................................. 138
Section 20: Interface Timing and AC Characteristics .................................................. 139
SDIO Timing .............................................................................................................................................. 139
SDIO Default Mode Timing ................................................................................................................. 139
SDIO High-Speed Mode Timing.......................................................................................................... 141
SDIO Bus Timing Specifications in SDR Modes ................................................................................. 142
Clock Timing ................................................................................................................................ 142
Card Input Timing......................................................................................................................... 143
Card Output Timing...................................................................................................................... 144
SDIO Bus Timing Specifications in DDR50 Mode............................................................................... 146
Data Timing.................................................................................................................................. 147
PCI Express Interface Parameters .......................................................................................................... 148
JTAG Timing ............................................................................................................................................. 150
SWD Timing .............................................................................................................................................. 150
Section 21: Power-Up Sequence and Timing ............................................................... 151
Sequencing of Reset and Regulator Control Signals ........................................................................... 151
Description of Control Signals ............................................................................................................. 151
Control Signal Timing Diagrams.......................................................................................................... 152
Section 22: Package Information ................................................................................... 154
Package Thermal Characteristics ........................................................................................................... 154
Junction Temperature Estimation and PSIJT Versus THETAJC ........................................................... 154
Environmental Characteristics................................................................................................................ 154
Broadcom®
November 5, 2015 • 43455-DS109-R
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Table of Contents
Section 23: Mechanical Information .............................................................................. 155
Section 24: Ordering Information .................................................................................. 157
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
List of Figures
List of Figures
Figure 1: Functional Block Diagram................................................................................................................... 1
Figure 2: BCM43455 Block Diagram ............................................................................................................... 20
Figure 3: Typical Power Topology (Page 1 of 2).............................................................................................. 24
Figure 4: Typical Power Topology (Page 2 of 2).............................................................................................. 25
Figure 5: Recommended Oscillator Configuration ........................................................................................... 29
Figure 6: Recommended Circuit to Use With an External Reference Clock .................................................... 30
Figure 7: Startup Signaling Sequence Prior to Software Download ................................................................ 42
Figure 8: CVSD Decoder Output Waveform Without PLC ............................................................................... 44
Figure 9: CVSD Decoder Output Waveform After Applying PLC..................................................................... 44
Figure 10: Functional Multiplex Data Diagram................................................................................................. 49
Figure 11: PCM Timing Diagram (Short Frame Sync, Master Mode) .............................................................. 50
Figure 12: PCM Timing Diagram (Short Frame Sync, Slave Mode) ................................................................ 51
Figure 13: PCM Timing Diagram (Long Frame Sync, Master Mode)............................................................... 52
Figure 14: PCM Timing Diagram (Long Frame Sync, Slave Mode)................................................................. 53
Figure 15: PCM Burst Mode Timing (Receive Only, Short Frame Sync) ......................................................... 54
Figure 16: PCM Burst Mode Timing (Receive Only, Long Frame Sync) ......................................................... 55
Figure 17: UART Timing .................................................................................................................................. 57
Figure 18: I2S Transmitter Timing .................................................................................................................... 59
Figure 19: I2S Receiver Timing........................................................................................................................ 59
Figure 20: Audio SNR for Blend, Switch, and FME Modes.............................................................................. 62
Figure 21: Stereo Separation for Blend, Switch, and FME Modes .................................................................. 63
Figure 22: Example Soft Mute Characteristic .................................................................................................. 63
Figure 23: Broadcom GCI or BT-SIG WCI-2 LTE Coexistence Interface ........................................................ 66
Figure 24: 3-Wire LTE Coexistence Interface.................................................................................................. 66
Figure 25: Signal Connections to SDIO Host (SD 4-Bit Mode) ........................................................................ 69
Figure 26: Signal Connections to SDIO Host (SD 1-Bit Mode) ........................................................................ 69
Figure 27: PCI Express Layer Model ............................................................................................................... 70
Figure 28: WLAN MAC Architecture ................................................................................................................ 73
Figure 29: WLAN PHY Block Diagram............................................................................................................. 77
Figure 30: Radio Functional Block Diagram .................................................................................................... 79
Figure 31: 140-Ball WLBGA Map—Bottom View (Balls Facing Up) ............................................................... 80
Figure 32: Port Locations for Bluetooth Testing............................................................................................. 100
Figure 33: Port Locations for WLAN Testing ................................................................................................. 112
Figure 34: SDIO Bus Timing (Default Mode) ................................................................................................. 139
Figure 35: SDIO Bus Timing (High-Speed Mode).......................................................................................... 141
Broadcom®
November 5, 2015 • 43455-DS109-R
BROADCOM CONFIDENTIAL
Page 13
BCM43455 Preliminary Data Sheet
List of Figures
Figure 36: SDIO Clock Timing (SDR Modes) ................................................................................................ 142
Figure 37: SDIO Bus Input Timing (SDR Modes) .......................................................................................... 143
Figure 38: SDIO Bus Output Timing (SDR Modes up to 100 MHz) ............................................................... 144
Figure 39: SDIO Bus Output Timing (SDR Modes 100 MHz to 208 MHz)..................................................... 144
Figure 40: ∆tOP Consideration for Variable Data Window (SDR 104 Mode) ................................................ 145
Figure 41: SDIO Clock Timing (DDR50 Mode) .............................................................................................. 146
Figure 42: SDIO Data Timing (DDR50 Mode) ............................................................................................... 147
Figure 43: SWD Read and Write Timing........................................................................................................ 150
Figure 44: WLAN = ON, Bluetooth = ON ....................................................................................................... 152
Figure 45: WLAN = OFF, Bluetooth = OFF.................................................................................................... 152
Figure 46: WLAN = ON, Bluetooth = OFF ..................................................................................................... 153
Figure 47: WLAN = OFF, Bluetooth = ON ..................................................................................................... 153
Figure 48: 140-Ball WLBGA Package Mechanical Information ..................................................................... 155
Figure 49: 140-Balls WLBGA Keep-out Areas for PCB Layout—Top View with Balls Facing Down ............ 156
Broadcom®
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BCM43455 Preliminary Data Sheet
List of Tables
List of Tables
Table 1: Power-Up/Power-Down/Reset Control Signals.................................................................................. 28
Table 2: Crystal Oscillator and External Clock—Requirements and Performance ......................................... 30
Table 3: External 32.768 kHz Sleep Clock Specifications ............................................................................... 33
Table 4: Power Control Pin Description ........................................................................................................... 41
Table 5: SPI-to-UART Signal Mapping ............................................................................................................ 47
Table 6: PCM Interface Timing Specifications (Short Frame Sync, Master Mode).......................................... 50
Table 7: PCM Interface Timing Specifications (Short Frame Sync, Slave Mode)............................................ 51
Table 8: PCM Interface Timing Specifications (Long Frame Sync, Master Mode) .......................................... 52
Table 9: PCM Interface Timing Specifications (Long Frame Sync, Slave Mode) ............................................ 53
Table 10: PCM Burst Mode (Receive Only, Short Frame Sync) ...................................................................... 54
Table 11: PCM Burst Mode (Receive Only, Long Frame Sync) ...................................................................... 55
Table 12: Example of Common Baud Rates.................................................................................................... 56
Table 13: UART Timing Specifications ............................................................................................................ 57
Table 14: Timing for I2S Transmitters and Receivers ...................................................................................... 58
Table 15: 3-Wire External Coexistence Interface ............................................................................................ 66
Table 16: SDIO Pin Description ....................................................................................................................... 69
Table 17: WLBGA Pin List by Pin Number ...................................................................................................... 81
Table 18: WLBGA Pin List by Pin Name.......................................................................................................... 83
Table 19: Signal Descriptions .......................................................................................................................... 85
Table 20: Strapping Options ............................................................................................................................ 91
Table 21: GPIO Multiplexing Matrix ................................................................................................................. 92
Table 22: Multiplexed GPIO Signals ................................................................................................................ 93
Table 23: I/O States ......................................................................................................................................... 94
Table 24: Absolute Maximum Ratings ............................................................................................................. 97
Table 25: Environmental Ratings ..................................................................................................................... 98
Table 26: ESD Specifications .......................................................................................................................... 98
Table 27: Recommended Operating Conditions and DC Characteristics ........................................................ 99
Table 28: Bluetooth Receiver RF Specifications............................................................................................ 101
Table 29: Bluetooth Transmitter RF Specifications....................................................................................... 104
Table 30: Local Oscillator Performance......................................................................................................... 106
Table 31: BLE RF Specifications ................................................................................................................... 106
Table 32: FM Receiver Specifications ........................................................................................................... 107
Table 33: 2.4 GHz Band General RF Specifications...................................................................................... 113
Table 34: WLAN 2.4 GHz Receiver Performance Specifications .................................................................. 113
Table 35: WLAN 2.4 GHz Transmitter Performance Specifications .............................................................. 117
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BCM43455 Preliminary Data Sheet
List of Tables
Table 36: WLAN 5 GHz Receiver Performance Specifications ..................................................................... 118
Table 37: WLAN 5 GHz Transmitter Performance Specifications ................................................................. 124
Table 38: Recommended Spectrum Analyzer Settings ................................................................................. 125
Table 39: 2.4 GHz Band, 20 MHz Channel Spacing TX Spurious Emissions Specifications ........................ 126
Table 40: 5 GHz Band, 20 MHz Channel Spacing TX Spurious Emissions Specifications ........................... 127
Table 41: 5 GHz Band, 40 MHz Channel Spacing TX Spurious Emissions Specifications ........................... 128
Table 42: 5 GHz Band, 80 MHz Channel Spacing TX Spurious Emissions Specifications ........................... 129
Table 43: 2G and 5G General Receiver Spurious Emissions ........................................................................ 129
Table 44: Core Buck Switching Regulator (CBUCK) Specifications .............................................................. 130
Table 45: LDO3P3 Specifications .................................................................................................................. 131
Table 46: BTLDO2P5 Specifications ............................................................................................................. 132
Table 47: CLDO Specifications ...................................................................................................................... 133
Table 48: LNLDO Specifications .................................................................................................................... 134
Table 49: PCIe LDO Specifications ............................................................................................................... 135
Table 50: 2.4 GHz Mode WLAN Power Consumption ................................................................................... 136
Table 51: 5 GHz Mode WLAN Power Consumption ...................................................................................... 137
Table 52: Bluetooth and BLE Current Consumption...................................................................................... 138
Table 53: SDIO Bus Timing Parameters (Default Mode)............................................................................... 139
Table 54: SDIO Bus Timing Parameters (High-Speed Mode)....................................................................... 141
Table 55: SDIO Bus Clock Timing Parameters (SDR Modes) ....................................................................... 142
Table 56: SDIO Bus Input Timing Parameters (SDR Modes) ........................................................................ 143
Table 57: SDIO Bus Output Timing Parameters (SDR Modes up to 100 MHz)............................................. 144
Table 58: SDIO Bus Output Timing Parameters (SDR Modes 100 MHz to 208 MHz) .................................. 145
Table 59: SDIO Bus Clock Timing Parameters (DDR50 Mode) .................................................................... 146
Table 60: SDIO Bus Timing Parameters (DDR50 Mode) .............................................................................. 147
Table 61: PCI Express Interface Parameters ................................................................................................ 148
Table 62: JTAG Timing Characteristics ......................................................................................................... 150
Table 63: SWD Read and Write Timing Parameters ..................................................................................... 150
Table 64: Package Thermal Characteristics .................................................................................................. 154
Table 65: Part Ordering Information .............................................................................................................. 157
Broadcom®
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BCM43455 Preliminary Data Sheet
About This Document
About This Document
Purpose and Audience
This data sheet provides details on the functional, operational, and electrical characteristics for the Broadcom®
BCM43455. It is intended for hardware design, application, and OEM engineers.
Acronyms and Abbreviations
In most cases, acronyms and abbreviations are defined on first use.
For a comprehensive list of acronyms and other terms used in Broadcom documents, go to:
http://www.broadcom.com/press/glossary.php.
Document Conventions
The following conventions may be used in this document:
Convention
Description
Bold
User input and actions: for example, type exit, click OK, press ALT+C
Monospace
Code: #include <iostream>
HTML: <td rowspan = 3>
Command line commands and parameters: wl [-l] <command>
<>
Placeholders for required elements: enter your <username> or wl <command>
[]
Indicates optional command-line parameters: wl [-l]
Indicates bit and byte ranges (inclusive): [0:3] or [7:0]
References
The references in this section may be used in conjunction with this document.
Note: Broadcom provides customer access to technical documentation and software through its
Customer Support Portal (CSP) and Downloads & Support site (see Technical Support).
For Broadcom documents, replace the “xx” in the document number with the largest number available in the
repository to ensure that you have the most current version of the document.
Document (or Item) Name
Number
Source
[1]
Bluetooth MWS Coexistence 2-wire Transport Interface –
Specification
[2]
PCI Bus Local Bus Specification, Revision 2.3
–
www.pcisig.com
[3]
PCIe Base Specification Version 1.1
–
www.pcisig.com
Broadcom®
November 5, 2015 • 43455-DS109-R
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www.bluetooth.com
Page 17
BCM43455 Preliminary Data Sheet
Technical Support
Technical Support
Broadcom provides customer access to a wide range of information, including technical documentation,
schematic diagrams, product bill of materials, PCB layout information, and software updates through its
customer support portal (https://support.broadcom.com). For a CSP account, contact your Sales or Engineering
support representative.
In addition, Broadcom provides other product support through its Downloads & Support site
(http://www.broadcom.com/support/).
Broadcom®
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BCM43455 Preliminary Data Sheet
BCM43455 Overview
Section 1: BCM43455 Overview
Overview
The Broadcom BCM43455 single-chip device provides the highest level of integration for a mobile or handheld
wireless system, with integrated IEEE 802.1 a/b/g/n/ac MAC/baseband/radio, Bluetooth 4.1 + EDR (enhanced
data rate), and FM receiver. It provides a small form-factor solution with minimal external components to drive
down cost for mass volumes and allows for handheld device flexibility in size, form, and function.
Comprehensive power management circuitry and software ensure the system can meet the needs of highly
mobile devices that require minimal power consumption and reliable operation.
Figure 2 on page 20 shows the interconnect of all the major physical blocks in the BCM43455 and their
associated external interfaces, which are described in greater detail in the following sections.
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BCM43455 Preliminary Data Sheet
Overview
Figure 2: BCM43455 Block Diagram
SECI UART and GCI GPIOs
GCI
UART
Port Control
BT_HOST_WAKE
BT_DEV_WAKE
UART
USB 1.1
PCM
I2S
Other GPIOs
RAM
ROM
VBAT
TCM
RAM 800 KB
ROM 704 KB
PCM
ARMCM3
ARMCR4
USB
AHB Bus Matrix
WLAN
Master Slave
DMA
JTAG Master
GPIO
Timers
WD
Pause
WLAN BT Access
SDIOD
AXI2ANB
AHB2AXI
SDIO 3.0
PCIE
Chip Common
(OTP)
RX/TX
PCIE
AXI2APB
BLE
LCU
AHB2APB
PMU
WLAN RAM Sharing
I2S
Registers
WL_REG_ON
BT_REG_ON
WL_HOST_WAKE
UART
WL_DEV_WKAE
JTAG
Other GPIOs
WLAN
NIC-301 AXI Backplane
BTFM
APU
BlueRF
GCI Coex I/F
DOT11MAC (D11)
Shared LNA
Control and Other
Coex I/F
1×1 IEEE 802.11ac PHY (Rev. 4)
RF
Switch
Controls
Modem
FM Analog
Audio
FM RX
32 kHz
External
LPO
BT RF
2.4 GHz/5 GHz
TINY Radio
CLB
XTAL
BT PA
5 GHz
PA Driver
Shared
2.4 LNA
LNA
LNA
5 GHz
PA
L
L
2.4 GHz
PA
WLAN:
5 GHz: iPA, iLNA, eLG, eTR
2 GHz: iPA, iLNA, eLG, iTR
BT:
Shared LNA, iTR
eTR
Diplexer
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BCM43455 Preliminary Data Sheet
Standards Compliance
Standards Compliance
The BCM43455 supports the following standards:
•
Bluetooth 2.1 + EDR
•
Bluetooth 3.0
•
Bluetooth 4.1 (Bluetooth Low Energy)
•
IEEE 802.11ac single-stream mandatory and optional requirements for 20, 40, and 80 MHz channels
•
IEEE 802.11n (Handheld Device Class, Section 11)
•
IEEE 802.11a
•
IEEE 802.11b
•
IEEE 802.11g
•
IEEE 802.11d
•
IEEE 802.11h
•
IEEE 802.11i
•
Security:
– WEP
– WPA Personal
– WPA2 Personal
– WMM
– WMM-PS (U-APSD)
– WMM-SA
– AES (hardware accelerator)
– TKIP (hardware accelerator)
– CKIP (software support)
•
Proprietary protocols:
– CCXv2
– CCXv3
– CCXv4
– CCXv5
– WFAEC
•
IEEE 802.15.2 Coexistence Compliance (on-silicon solution compliant with IEEE 3-wire requirements)
The BCM43455 supports the following future drafts/standards:
•
IEEE 802.11r (fast roaming between APs)
•
IEEE 802.11w (secure management frames)
Broadcom®
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
•
Mobile Phone Usage Model
IEEE 802.11 Extensions:
– IEEE 802.11e QoS Enhancements (as per the WMM specification is already supported)
– IEEE 802.11h 5 GHz Extensions
– IEEE 802.11i MAC Enhancements
– IEEE 802.11k Radio Resource Measurement
Mobile Phone Usage Model
The BCM43455 incorporates a number of unique features to simplify integration into mobile phone platforms.
Its flexible PCM and UART interfaces enable it to transparently connect with the existing circuits. In addition, the
TCXO and LPO inputs allow the use of existing handset features to further minimize the size, power, and cost
of the complete system.
•
The PCM interface provides multiple modes of operation to support both master and slave as well as hybrid
interfacing to single or multiple external codec devices.
•
The UART interface supports hardware flow control with tight integration to power control sideband
signaling to support the lowest power operation.
•
The crystal oscillator interface accommodates any of the typical reference frequencies used by cell phones.
•
FM digital interfaces can use either I2S or PCM.
•
The highly linear design of the radio transceiver ensures that the device has the lowest spurious emissions
output regardless of the state of operation. It has been fully characterized in the global cellular bands.
•
The transceiver design has excellent blocking and intermodulation performance in the presence of a
cellular transmission (LTE, GSM, GPRS, CDMA, WCDMA, or iDEN).
The BCM43455 is designed to directly interface with new and existing handset designs.
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BCM43455 Preliminary Data Sheet
Power Supplies and Power Management
Section 2: Power Supplies and Power
Management
Power Supply Topology
One Buck regulator, multiple LDO regulators, and a power management unit (PMU) are integrated into the
BCM43455. All regulators are programmable via the PMU. These blocks simplify power supply design for
Bluetooth, and WLAN functions in embedded designs.
A single VBAT (3.0V to 5.25V DC max.) and VIO supply (1.8V to 3.3V) can be used, with all additional voltages
being provided by the regulators in the BCM43455.
Two control signals, BT_REG_ON and WL_REG_ON, are used to power-up the regulators and take the
respective section out of reset. The CBUCK CLDO and LNLDO power-up when any of the reset signals are
deasserted. All regulators are powered down only when both BT_REG_ON and WL_REG_ON are deasserted.
The CLDO and LNLDO may be turned off/on based on the dynamic demands of the digital baseband.
The BCM43455 allows for an extremely low power-consumption mode by completely shutting down the
CBUCK, CLDO, and LNLDO regulators. When in this state, the LPLDO1 (which is the low-power linear regulator
that is supplied by the system VIO supply) provides the BCM43455 with all required voltage, further reducing
leakage currents.
BCM43455 PMU Features
•
VBAT to 1.35Vout (170 mA nominal, 600 mA maximum) Core-Buck (CBUCK) switching regulator
•
VBAT to 3.3Vout (200 mA nominal, 450 mA–850 mA maximum) LDO3P3
•
VBAT to 2.5Vout (15 mA nominal, 70 mA maximum) BTLDO2P5
•
1.35V to 1.2Vout (100 mA nominal, 150 mA maximum) LNLDO
•
1.35V to 1.2Vout (80 mA nominal, 200 mA maximum) CLDO with bypass mode for deep-sleep
•
1.35V to 1.2Vout (35 mA nominal, 55 mA maximum) LDO for PCIE
•
Additional internal LDOs (not externally accessible)
•
PMU internal timer auto-calibration by the crystal clock for precise wake-up timing from extremely low
power-consumption mode.
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BCM43455 PMU Features
BCM43455 Preliminary Data Sheet
Figure 3 and Figure 4 on page 25 show the regulators and a typical power topology.
Figure 3: Typical Power Topology (Page 1 of 2)
WL RF -
BCM43455
Shaded areas are internal to the device.
Internal LNLDO
80 mA
1.2V
Internal LNLDO
10 mA
1.2V
Internal VCOLDO
80 mA
1.2V
Internal LNLDO
80 mA
1.2V
Internal LNLDO
10 mA
1.2V
XTAL LDO
30 mA
1.2V
TX MIXER and PA (not all versions)
WL RF - LOGEN
WL RF – LNA
WL RF – AFE and TIA
WL RF – TX
WL RF – ADC REF
WL RF – XTAL
VBAT
2.2 µH
0806
CORE BUCK
WL_REG_ON
BT_REG_ON
REGULATOR
CBUCK
Max 600 mA
Avg 170 mA
1.35V
LPLDO1
3 mA
1.1V
LNLDO
100 mA
0603
4.7 µF
0402
GND
VDDIO
1 µF
0402
1.2V
WL RF – RFPLL PFD and MMD
BT RF
2.2 µF
0402
0.1
µF
0201
PCIe LDO
Max 55 mA
Avg 35 mA
(bypass/off in
deepsleep)
1.2V
PCIE PLL, RXTX
0.47 µF
0201
WL BBPLL/DFLL
WLAN/BT/CLB/Top, Always ON
CLDO
Max 200 mA
Avg 80 mA
(bypass in
deep sleep)
1.3V- 1.2V- 0.95V
(AVS)
WL OTP
WL PHY
4.7 µF
0402
WL Subcore
WL VDDM (SRAMs + AOS)
BT VDDM
BT Digital
Power switch
No power switch
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BROADCOM CONFIDENTIAL
BCM43455 PMU Features
BCM43455 Preliminary Data Sheet
Figure 4: Typical Power Topology (Page 2 of 2)
BCM43455
Shaded areas are internal to the device.
BTLDO2P5
Max 70 mA
Avg 15 mA
2.5V
BT CLASS 1 PA
2.2 µF
0402
10 pF
0201
WL RF – PA (2.4 GHz, 5 GHz)
VBAT
LDO3P3
Spike 800 mA
Max 450 mA
Avg 200 mA
WL RF – PAD (2.4 GHz, 5 GHz)
3.3V
VDDIO_RF
4.7 µF
0402
WL OTP 3.3V
2.5V Internal LNLDO
10 mA
2.5V Internal LNLDO
25 mA
2.5V Internal LNLDO
8 mA
2.5V
WL RF – RX, TX, NMOS miniPMU LDOs
2.5V
WL RF – VCO
2.5V
Power switch
No power switch
WL RF – CP
No dedicated power switch, but
internal power-down modes and
block-specific power switches.
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN Power Management
WLAN Power Management
The BCM43455 has been designed with the stringent power consumption requirements of mobile devices in
mind. All areas of the chip design are optimized to minimize power consumption. Silicon processes and cell
libraries were chosen to reduce leakage current and supply voltages. Additionally, the BCM43455 integrated
RAM is a high Vt memory with dynamic clock control. The dominant supply current consumed by the RAM is
leakage current only. Additionally, the BCM43455 includes an advanced WLAN power management unit (PMU)
sequencer. The PMU sequencer provides significant power savings by putting the BCM43455 into various
power management states appropriate to the current environment and activities that are being performed. The
power management unit enables and disables internal regulators, switches, and other blocks based on a
computation of the required resources and a table that describes the relationship between resources and the
time needed to enable and disable them. Power-up sequences are fully programmable. Configurable, freerunning counters (running at 32.768 kHz LPO clock) in the PMU sequencer are used to turn on/turn off individual
regulators and power switches. Clock speeds are dynamically changed (or gated altogether) for the current
mode. Slower clock speeds are used wherever possible.
The BCM43455 WLAN power states are described as follows:
•
Active mode— All WLAN blocks in the BCM43455 are powered up and fully functional with active carrier
sensing and frame transmission and receiving. All required regulators are enabled and put in the most
efficient mode based on the load current. Clock speeds are dynamically adjusted by the PMU sequencer.
•
Doze mode—The radio, analog domains, and most of the linear regulators are powered down. The rest of
the BCM43455 remains powered up in an IDLE state. All main clocks (PLL, crystal oscillator or TCXO) are
shut down to reduce active power to the minimum. The 32.768 kHz LPO clock is available only for the PMU
sequencer. This condition is necessary to allow the PMU sequencer to wake-up the chip and transition to
Active mode. In Doze mode, the primary power consumed is due to leakage current.
•
Deep-sleep mode—Most of the chip including both analog and digital domains and most of the regulators
are powered off. Logic states in the digital core are saved and preserved into a retention memory in the
always-ON domain before the digital core is powered off. Upon a wake-up event triggered by the PMU
timers, an external interrupt or a host resume through the PCIe bus, logic states in the digital core are
restored to their pre-deep-sleep settings to avoid lengthy HW reinitialization.
•
Power-down mode—The BCM43455 is effectively powered off by shutting down all internal regulators. The
chip is brought out of this mode by external logic re-enabling the internal regulators.
PMU Sequencing
The PMU sequencer is used to minimize system power consumption. It enables and disables various system
resources based on a computation of required resources and a table that describes the relationship between
resources and the time required to enable and disable them.
Resource requests may derive from several sources: clock requests from cores, the minimum resources defined
in the ResourceMin register, and the resources requested by any active resource request timers. The PMU
sequencer maps clock requests into a set of resources required to produce the requested clocks.
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BCM43455 Preliminary Data Sheet
Power-Off Shutdown
Each resource is in one of four states:
•
enabled
•
disabled
•
transition_on
•
transition_off
The timer contains 0 when the resource is enabled or disabled and a non-zero value in the transition states. The
timer is loaded with the time_on or time_off value of the resource when the PMU determines that the resource
must be enabled or disabled. That timer decrements on each 32.768 kHz PMU clock. When it reaches 0, the
state changes from transition_off to disabled or transition_on to enabled. If the time_on value is 0, the resource
can transition immediately from disabled to enabled. Similarly, a time_off value of 0 indicates that the resource
can transition immediately from enabled to disabled. The terms enable sequence and disable sequence refer
to either the immediate transition or the timer load-decrement sequence.
During each clock cycle, the PMU sequencer performs the following actions:
•
Computes the required resource set based on requests and the resource dependency table.
•
Decrements all timers whose values are non zero. If a timer reaches 0, the PMU clears the
ResourcePending bit for the resource and inverts the ResourceState bit.
•
Compares the request with the current resource status and determines which resources must be enabled
or disabled.
•
Initiates a disable sequence for each resource that is enabled, no longer being requested, and has no
powered up dependents.
•
Initiates an enable sequence for each resource that is disabled, is being requested, and has all of its
dependencies enabled.
Power-Off Shutdown
The BCM43455 provides a low-power shutdown feature that allows the device to be turned off while the host,
and any other devices in the system, remain operational. When the BCM43455 is not needed in the system,
VDDIO_RF and VDDC are shut down while VDDIO remains powered. This allows the BCM43455 to be
effectively off while keeping the I/O pins powered so that they do not draw extra current from any other devices
connected to the I/O.
During a low-power shutdown state, provided VDDIO remains applied to the BCM43455, all outputs are
tristated, and most inputs signals are disabled. Input voltages must remain within the limits defined for normal
operation. This is done to prevent current paths or create loading on any digital signals in the system, and
enables the BCM43455 to be fully integrated in an embedded device and take full advantage of the lowest
power-savings modes.
When the BCM43455 is powered on from this state, it is the same as a normal power-up and the device does
not retain any information about its state from before it was powered down.
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BCM43455 Preliminary Data Sheet
Power-Up/Power-Down/Reset Circuits
Power-Up/Power-Down/Reset Circuits
The BCM43455 has two signals (see Table 1) that enable or disable the Bluetooth and WLAN circuits and the
internal regulator blocks, allowing the host to control power consumption. For timing diagrams of these signals
and the required power-up sequences, see Section 21: “Power-Up Sequence and Timing,” on page 151.
Table 1: Power-Up/Power-Down/Reset Control Signals
Signal
Description
WL_REG_ON This signal is used by the PMU (with BT_REG_ON) to power-up the WLAN section. It is also
OR-gated with the BT_REG_ON input to control the internal BCM43455 regulators. When this
pin is high, the regulators are enabled and the WLAN section is out of reset. When this pin is
low, the WLAN section is in reset. If BT_REG_ON and WL_REG_ON are both low, the
regulators are disabled. This pin has an internal 200 k pull-down resistor that is enabled by
default. It can be disabled through programming.
BT_REG_ON
This signal is used by the PMU (with WL_REG_ON) to decide whether or not to power down
the internal BCM43455 regulators. If BT_REG_ON and WL_REG_ON are low, the regulators
will be disabled. This pin has an internal 200 k pull-down resistor that is enabled by default.
It can be disabled through programming.
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BCM43455 Preliminary Data Sheet
Frequency References
S e c t i o n 3 : F re q u e n c y R e f e r e n c e s
An external crystal is used for generating all radio frequencies and normal operation clocking. As an alternative,
an external frequency reference may be used. In addition, a low-power oscillator (LPO) is provided for lower
power mode timing.
Crystal Interface and Clock Generation
The BCM43455 can use an external crystal to provide a frequency reference. The recommended configuration
for the crystal oscillator including all external components is shown in Figure 5. Consult the reference
schematics for the latest configuration.
Figure 5: Recommended Oscillator Configuration
C
WRF_XTAL_XOP
27 pF
37.4 MHz
C
x ohms
WRF_XTAL_XON
27 pF
Note: A reference schematic is available for further details.
Contact your Broadcom FAE.
A fractional-N synthesizer in the BCM43455 generates the radio frequencies, clocks, and data/packet timing,
enabling it to operate using a wide selection of frequency references.
The recommended default frequency reference is a 37.4 MHz crystal. The signal characteristics for the crystal
interface are listed in Table 2 on page 30.
Note: Although the fractional-N synthesizer can support alternative reference frequencies,
frequencies other than the default require support to be added in the driver, plus additional extensive
system testing. Contact Broadcom for further details.
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BCM43455 Preliminary Data Sheet
External Frequency Reference
External Frequency Reference
As an alternative to a crystal, an external precision frequency reference can be used, provided that it meets the
Phase Noise requirements listed in Table 2.
If used, the external clock should be connected to the WRF_XTAL_XOP pin through an external 1000 pF
coupling capacitor, as shown in Figure 6. The internal clock buffer connected to this pin will be turned OFF when
the BCM43455 goes into sleep mode. When the clock buffer turns ON and OFF there will be a small impedance
variation. Power must be supplied to the WRF_XTAL_VDD1P35 pin.
Figure 6: Recommended Circuit to Use With an External Reference Clock
1000 pF
Reference
Clock
WRF_XTAL_XOP
NC
WRF_XTAL_XON
Table 2: Crystal Oscillator and External Clock—Requirements and Performance
Crystala
External Frequency
Referenceb c
Parameter
Conditions/Notes
Min.
Typ.
Max.
Min.
Typ.
Max.
Units
Frequency
2.4G and 5G bands,
IEEE 802.11ac operation
35
–
52
–
52
–
MHz
Frequency
5G Band,
IEEE 802.11n operation only
19
–
52
35
–
52
MHz
2.4G band IEEE 802.11n
Between 19 MHz and 52 MHz d, e
operation, and both bands legacy
IEEE 802.11a/b/g operation only
Frequency tolerance Without trimming
over the lifetime of
the equipment,
including
temperaturef
–20
–
20
–20
–
20
ppm
Crystal load
capacitance
–
–
16
–
–
–
–
pF
ESR
–
–
–
60
–
–
–
Ω
Drive level
External crystal must be able to
tolerate this drive level.
200
–
–
–
–
–
μW
Input impedance
Resistive
(WRF_XTAL_XOP) Capacitive
WRF_XTAL_XOP
Input low level
DC-coupled digital signal
–
–
–
30k
100k
–
Ω
–
–
7.5
–
–
7.5
pF
–
–
–
0
–
0.2
V
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
External Frequency Reference
Table 2: Crystal Oscillator and External Clock—Requirements and Performance (Cont.)
Crystala
External Frequency
Referenceb c
Parameter
Conditions/Notes
Min.
Typ.
Max.
Min.
Typ.
Max.
Units
WRF_XTAL_XOP
Input high level
DC-coupled digital signal
–
–
–
1.0
–
1.26
V
WRF_XTAL_XOP
input voltage
(see Figure 6 on
page 30)
IEEE 802.11a/b/g operation only –
–
–
400
–
1200
mVp-p
WRF_XTAL_XOP
input voltage
(see Figure 6 on
page 30)
IEEE 802.11n/ac AC-coupled
analog input
–
–
–
1
–
–
Vp-p
Duty cycle
37.4 MHz clock
–
–
–
40
50
60
%
Phase
(IEEE 802.11b/g)
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–129
dBc/Hz
37.4 MHz clock at 100 kHz offset –
–
–
–
–
–136
dBc/Hz
Phase Noiseg
(IEEE 802.11a)
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–137
dBc/Hz
37.4 MHz clock at 100 kHz offset –
–
–
–
–
–144
dBc/Hz
Phase Noiseg
(IEEE 802.11n,
2.4 GHz)
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–134
dBc/Hz
37.4 MHz clock at 100 kHz offset –
–
–
–
–
–141
dBc/Hz
Phase Noiseg
(IEEE 802.11n,
5 GHz)
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–142
dBc/Hz
37.4 MHz clock at 100 kHz offset –
–
–
–
–
–149
dBc/Hz
Phase Noiseg
(IEEE 802.11ac,
5 GHz)
37.4 MHz clock at 10 kHz offset
–
–
–
–
–
–148
dBc/Hz
37.4 MHz clock at 100 kHz offset –
–
–
–
–
–155
dBc/Hz
Noiseg
a. (Crystal) Use WRF_XTAL_XON and WRF_XTAL_XOP.
b. See “External Frequency Reference” on page 30 for alternative connection methods.
c. For a clock reference other than 37.4 MHz, 20 × log10(f/ 37.4) dB should be added to the limits, where f = the
reference clock frequency in MHz.
d. BT_TM6 should be tied low for a 52 MHz clock reference. For other frequencies, BT_TM6 should be tied high.
Note that 52 MHz is not an auto-detected frequency using the LPO clock.
e. The frequency step size is approximately 80 Hz resolution.
f. It is the responsibility of the equipment designer to select oscillator components that comply with these
specifications.
g. Assumes that external clock has a flat phase noise response above 100 kHz.
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BCM43455 Preliminary Data Sheet
Frequency Selection
Frequency Selection
Any frequency within the ranges specified for the crystal and TCXO reference may be used. These include not
only the standard handset reference frequencies of 19.2, 19.8, 24, 26, 33.6, 37.4, 38.4, and 52 MHz, but also
other frequencies in this range, with approximately 80 Hz resolution. The BCM43455 must have the reference
frequency set correctly in order for any of the UART or PCM interfaces to function correctly, since all bit timing
is derived from the reference frequency.
Note: The fractional-N synthesizer can support many reference frequencies. However, frequencies
other than the default require support to be added in the driver plus additional, extensive system
testing. Contact Broadcom for further details.
The reference frequency for the BCM43455 may be set in the following ways:
•
Set the xtalfreq=xxxxx parameter in the nvram.txt file (used to load the driver) to correctly match the crystal
frequency.
•
Auto-detect any of the standard handset reference frequencies using an external LPO clock.
For applications such as handsets and portable smart communication devices, where the reference frequency
is one of the standard frequencies commonly used, the BCM43455 automatically detects the reference
frequency and programs itself to the correct reference frequency. In order for auto frequency detection to work
correctly, the BCM43455 must have a valid and stable 32.768 kHz LPO clock that meets the requirements listed
in Table 3 on page 33 and is present during power-on reset.
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BCM43455 Preliminary Data Sheet
External 32.768 kHz Low-Power Oscillator
External 32.768 kHz Low-Power Oscillator
The BCM43455 uses a secondary low frequency clock for low-power-mode timing. Either the internal lowprecision LPO or an external 32.768 kHz precision oscillator is required. The internal LPO frequency range is
approximately 33 kHz ± 30% over process, voltage, and temperature, which is adequate for some applications.
However, one trade-off caused by this wide LPO tolerance is a small current consumption increase during power
save mode that is incurred by the need to wake-up earlier to avoid missing beacons.
Whenever possible, the preferred approach is to use a precision external 32.768 kHz clock that meets the
requirements listed in Table 3.
Table 3: External 32.768 kHz Sleep Clock Specifications
Parameter
LPO Clock
Units
Nominal input frequency
32.768
kHz
Frequency accuracy
±200
ppm
Duty cycle
30–70
%
Input signal amplitude
200–3300
mV, p-p
Signal type
Square-wave or sine-wave
–
>100k
<5
Ω
pF
<10,000
ppm
Input
impedancea
Clock jitter (during initial start-up)
a. When power is applied or switched off.
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Bluetooth and FM Subsystem Overview
Section 4: Bluetooth and FM Subsystem
Overview
The BCM43455 is a Bluetooth 4.1 + EDR-compliant, baseband processor with 2.4 GHz transceiver with an
integrated FM/RDS/RBDS receiver. It features the highest level of integration and eliminates all critical external
components, thus minimizing the footprint, power consumption, and system cost of a Bluetooth plus FM radio
solution.
The BCM43455 is the optimal solution for any Bluetooth voice and/or data application that also requires an FM
radio receiver. The Bluetooth subsystem presents a standard host controller interface (HCI) via a high-speed
UART and PCM for audio. The FM subsystem supports the HCI control interface, analog output, as well as I2S
and PCM interfaces. The BCM43455 incorporates all Bluetooth 4.1 features including secure simple pairing,
sniff subrating, and encryption pause and resume.
The BCM43455 Bluetooth radio transceiver provides enhanced radio performance to meet the most stringent
mobile phone temperature applications and the tightest integration into mobile handsets and portable devices.
It provides full radio compatibility to operate simultaneously with GPS, WLAN, and cellular radios.
The Bluetooth transmitter also features a Class 1 power amplifier with Class 2 capability.
Features
Primary BCM43455 Bluetooth features include:
•
Supports key features of upcoming Bluetooth standards
•
Fully supports Bluetooth Core Specification version 4.1 + EDR features:
– Adaptive frequency hopping (AFH)
– Quality of service (QoS)
– Extended synchronous connections (eSCO)—voice connections
– Fast connect (interlaced page and inquiry scans)
– Secure simple pairing (SSP)
– Sniff subrating (SSR)
– Encryption pause resume (EPR)
– Extended inquiry response (EIR)
– Link supervision timeout (LST)
•
UART baud rates up to 4 Mbps
•
Supports all Bluetooth 4.1 + HS packet types
•
Supports maximum Bluetooth data rates over HCI UART
•
Multipoint operation with up to seven active slaves
– Maximum of seven simultaneous active ACL links
– Maximum of three simultaneous active SCO and eSCO connections with scatternet support
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BCM43455 Preliminary Data Sheet
Features
•
Trigger Broadcom fast connect (TBFC)
•
Narrowband and wideband packet loss concealment
•
Scatternet operation with up to four active piconets with background scan and support for scatter mode
•
High-speed HCI UART transport support with low-power out-of-band BT_DEV_WAKE and
BT_HOST_WAKE signaling (see “Host Controller Power Management” on page 40)
•
Channel quality driven data rate and packet type selection
•
Standard Bluetooth test modes
•
Extended radio and production test mode features
•
Full support for power savings modes
– Bluetooth clock request
– Bluetooth standard sniff
– Deep-sleep modes and software regulator shutdown
•
Supports a low-power crystal, which can be used during power save mode for better timing accuracy.
Major FM radio features include:
•
65 MHz to 108 MHz FM bands supported (US, Europe, and Japan)
•
FM subsystem control using the Bluetooth HCI interface
•
FM subsystem operates from reference clock inputs.
•
Improved audio interface capabilities with full-featured bidirectional PCM and I2S
•
I2S can be master or slave.
FM receiver-specific features include:
•
Excellent FM radio performance with 1 μV sensitivity for 26 dB (S + N) ÷ N
•
Signal-dependent stereo/mono blending
•
Signal dependent soft mute
•
Auto search and tuning modes
•
Audio silence detection
•
RSSI, IF frequency, status indicators
•
RDS and RBDS demodulator and decoder with filter and buffering functions
•
Automatic frequency jump
Broadcom®
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BCM43455 Preliminary Data Sheet
Bluetooth Radio
Bluetooth Radio
The BCM43455 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth
wireless systems. It has been designed to provide low-power, low-cost, robust communications for applications
operating in the globally available 2.4 GHz unlicensed ISM band. It is fully compliant with the Bluetooth Radio
Specification and EDR specification and meets or exceeds the requirements to provide the highest
communication link quality of service.
Transmit
The BCM43455 features a fully integrated zero-IF transmitter. The baseband transmit data is GFSK-modulated
in the modem block and upconverted to the 2.4 GHz ISM band in the transmitter path. The transmitter path
consists of signal filtering, I/Q upconversion, output power amplifier, and RF filtering. The transmitter path also
incorporates /4-DQPSK for 2 Mbps and 8-DPSK for 3 Mbps to support EDR. The transmitter section is
compatible to the Bluetooth Low Energy specification. The transmitter PA bias can also be adjusted to provide
Bluetooth class 1 or class 2 operation.
Digital Modulator
The digital modulator performs the data modulation and filtering required for the GFSK, /4-DQPSK, and
8-DPSK signal. The fully digital modulator minimizes any frequency drift or anomalies in the modulation
characteristics of the transmitted signal and is much more stable than direct VCO modulation schemes.
Digital Demodulator and Bit Synchronizer
The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency
tracking and bit-synchronization algorithm.
Power Amplifier
The fully integrated PA supports Class 1 or Class 2 output using a highly linearized, temperature-compensated
design. This provides greater flexibility in front-end matching and filtering. Due to the linear nature of the PA
combined with some integrated filtering, external filtering is required to meet the Bluetooth and regulatory
harmonic and spurious requirements. For integrated mobile handset applications in which Bluetooth is
integrated next to the cellular radio, external filtering can be applied to achieve near thermal noise levels for
spurious and radiated noise emissions. The transmitter features a sophisticated on-chip transmit signal strength
indicator (TSSI) block to keep the absolute output power variation within a tight range across process, voltage,
and temperature.
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BCM43455 Preliminary Data Sheet
Bluetooth Radio
Receiver
The receiver path uses a low-IF scheme to downconvert the received signal for demodulation in the digital
demodulator and bit synchronizer. The receiver path provides a high degree of linearity, an extended dynamic
range, and high-order on-chip channel filtering to ensure reliable operation in the noisy 2.4 GHz ISM band. The
front-end topology with built-in out-of-band attenuation enables the BCM43455 to be used in most applications
with minimal off-chip filtering. For integrated handset operation, in which the Bluetooth function is integrated
close to the cellular transmitter, external filtering is required to eliminate the desensitization of the receiver by
the cellular transmit signal.
Digital Demodulator and Bit Synchronizer
The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency
tracking and bit synchronization algorithm.
Receiver Signal Strength Indicator
The radio portion of the BCM43455 provides a receiver signal strength indicator (RSSI) signal to the baseband,
so that the controller can take part in a Bluetooth power-controlled link by providing a metric of its own receiver
signal strength to determine whether the transmitter should increase or decrease its output power.
Local Oscillator Generation
A local oscillator (LO) generation provides fast frequency hopping (1600 hops/second) across the 79 maximum
available channels. The LO generation subblock employs an architecture for high immunity to LO pulling during
PA operation. The BCM43455 uses an internal RF and IF loop filter.
Calibration
The BCM43455 radio transceiver features an automated calibration scheme that is fully self contained in the
radio. No user interaction is required during normal operation or during manufacturing to provide the optimal
performance. Calibration optimizes the performance of all the major blocks within the radio to within 2% of
optimal conditions, including gain and phase characteristics of filters, matching between key components, and
key gain blocks. This takes into account process variation and temperature variation. Calibration occurs
transparently during normal operation during the settling time of the hops and calibrates for temperature
variations as the device cools and heats during normal operation in its environment.
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
Bluetooth Baseband Core
Section 5: Bluetooth Baseband Core
The Bluetooth Baseband Core (BBC) implements all of the time critical functions required for high-performance
Bluetooth operation. The BBC manages the buffering, segmentation, and routing of data for all connections. It
also buffers data that passes through it, handles data flow control, schedules SCO/ACL TX/RX transactions,
monitors Bluetooth slot usage, optimally segments and packages data into baseband packets, manages
connection status indicators, and composes and decodes HCI packets. In addition to these functions, it
independently handles HCI event types, and HCI command types.
The following transmit and receive functions are also implemented in the BBC hardware to increase reliability
and security of the TX/RX data before sending over the air:
•
Symbol timing recovery, data deframing, forward error correction (FEC), header error control (HEC), cyclic
redundancy check (CRC), data decryption, and data dewhitening in the receiver.
•
Data framing, FEC generation, HEC generation, CRC generation, key generation, data encryption, and
data whitening in the transmitter.
Bluetooth 4.0 Features
The BBC supports all Bluetooth 4.0 features, with the following benefits:
•
Dual-mode Bluetooth Low Energy (BT and BLE operation)
•
Extended Inquiry Response (EIR): Shortens the time to retrieve the device name, specific profile, and
operating mode.
•
Encryption Pause Resume (EPR): Enables the use of Bluetooth technology in a much more secure
environment.
•
Sniff Subrating (SSR): Optimizes power consumption for low duty cycle asymmetric data flow, which
subsequently extends battery life.
•
Secure Simple Pairing (SSP): Reduces the number of steps for connecting two devices, with minimal or no
user interaction required.
•
Link Supervision Time Out (LSTO): Additional commands added to HCI and Link Management Protocol
(LMP) for improved link time-out supervision.
•
QoS enhancements: Changes to data traffic control, which results in better link performance. Audio, human
interface device (HID), bulk traffic, SCO, and enhanced SCO (eSCO) are improved with the erroneous data
(ED) and packet boundary flag (PBF) enhancements.
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
Bluetooth 4.1 Features
Bluetooth 4.1 Features
The BBC supports all Bluetooth 4.1 features, with the following benefits:
•
Dual-mode classic Bluetooth and classic low energy (BT and BLE) operation
•
Low-energy physical layer
•
Low-energy link layer
•
Enhancements to HCI for low energy
•
Low-energy direct test mode
•
128 AES-CCM secure connection for both BT and BLE
Note: The BCM43455 is compatible with the Bluetooth Low Energy operating mode, which provides
a dramatic reduction in the power consumption of the Bluetooth radio and baseband. The primary
application for this mode is to provide support for low data rate devices, such as sensors and remote
controls.
Bluetooth Low Energy
The BCM43455 supports the Bluetooth Low Energy operating mode.
Link Control Layer
The link control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the
link control unit (LCU). This layer consists of the command controller that takes commands from the software,
and other controllers that are activated or configured by the command controller, to perform the link control
tasks. Each task performs a different state in the Bluetooth Link Controller.
•
Major states:
– Standby
– Connection
•
Substates:
– Page
– Page Scan
– Inquiry
– Inquiry Scan
– Sniff
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
Test Mode Support
Test Mode Support
The BCM43455 fully supports Bluetooth Test mode as described in Part I:1 of the Specification of the Bluetooth
System Version 3.0. This includes the transmitter tests, normal and delayed loopback tests, and reduced
hopping sequence.
In addition to the standard Bluetooth Test Mode, the BCM43455 also supports enhanced testing features to
simplify RF debugging and qualification and type-approval testing. These features include:
•
Fixed frequency carrier wave (unmodulated) transmission
– Simplifies some type-approval measurements (Japan)
– Aids in transmitter performance analysis
•
Fixed frequency constant receiver mode
– Receiver output directed to I/O pin
– Allows for direct BER measurements using standard RF test equipment
– Facilitates spurious emissions testing for receive mode
•
Fixed frequency constant transmission
– 8-bit fixed pattern or PRBS-9
– Enables modulated signal measurements with standard RF test equipment
Bluetooth Power Management Unit
The Bluetooth Power Management Unit (PMU) provides power management features that can be invoked by
either software through power management registers or packet handling in the baseband core.
The power management functions provided by the BCM43455 are:
•
RF Power Management
•
Host Controller Power Management
•
“BBC Power Management” on page 43
•
“FM Over Bluetooth” on page 44
RF Power Management
The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to
the 2.4 GHz transceiver. The transceiver then processes the power-down functions accordingly.
Host Controller Power Management
When running in UART mode, the BCM43455 may be configured so that dedicated signals are used for power
management hand-shaking between the BCM43455 and the host. The basic power saving functions supported
by those hand-shaking signals include the standard Bluetooth defined power savings modes and standby
modes of operation. Table 4 on page 41 describes the power-control handshake signals used with the UART
interface.
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
Bluetooth Power Management Unit
Note: Pad function Control Register is set to 0 for these pins. See “DC Characteristics” on page 97 for
more details.
Table 4: Power Control Pin Description
Signal
Mapped to Pin
Type
Description
BT_DEV_WAKE
BT_GPIO_0
I
Bluetooth device wake-up: Signal from the host to the
BCM43455 indicating that the host requires attention.
• Asserted: The Bluetooth device must wake-up or
remain awake.
• Deasserted: The Bluetooth device may sleep when
sleep criteria are met.
The polarity of this signal is software configurable and
can be asserted high or low.
BT_HOST_WAKE
BT_GPIO_1
O
Host wake-up. Signal from the BCM43455 to the host
indicating that the BCM43455 requires attention.
• Asserted: host device must wake-up or remain
awake.
• Deasserted: host device may sleep when sleep
criteria are met.
The polarity of this signal is software configurable and
can be asserted high or low.
BT_CLK_REQ
BT_CLK_REQ_OUT
WL_CLK_REQ_OUT
O
The BCM43455 asserts BT_CLK_REQ when Bluetooth
or WLAN wants the host to turn on the reference clock.
The BT_CLK_REQ polarity is active-high. Add an
external 100 kΩ pull-down resistor to ensure the signal
is deasserted when the BCM43455 powers up or resets
when VDDIO is present.
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November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
Bluetooth Power Management Unit
Figure 7 shows the startup signaling sequence prior to software download.
Figure 7: Startup Signaling Sequence Prior to Software Download
LPO
Host IOs unconfigured
VDDIO
Host IOs configured
T1
HostResetX
BT_DEV_WAKE
T2
BTH IOs unconfigured
BTH IOs configured
BT_REG_ON
T3
BT_HOST_WAKE
BT_UART_CTS_N
Host side drives this line
low
BT_UART_RTS_N
T4
CLK_REQ_OUT
T5
BTH device drives this line low
indicating transport is ready
Driven
Pulled
Notes :
T1 is the time for Host to settle it’s IOs after a reset.
T2 is the time for Host to drive BT_REG_ON high after the Host IOs are configured.
T3 is the time for BTH (Bluetooth) device to settle its IOs after a reset and reference clock settling time has elapsed.
T4 is the time for BTH device to drive BT_UART_RTS_N low after the Host drives BT_UART_CTS_N low. This assumes the BTH device has already
completed initialization.
T5 is the time for BTH device to drive CLK_REQ_OUT high after BT_REG_ON goes high. Note this pin is used for designs that use an external reference
clock source from the Host. This pin is irrelevant for Crystal reference clock based designs where the BTH device generates it’s own reference clock from
an external crystal connected to it’s oscillator circuit.
Timing diagram assumes VBAT is present.
Broadcom®
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BCM43455 Preliminary Data Sheet
Bluetooth Power Management Unit
BBC Power Management
The following are low-power operations for the BBC:
•
Physical layer packet-handling turns the RF on and off dynamically within transmit/receive packets.
•
Bluetooth-specified low-power connection modes: sniff, hold, and park. While in these modes, the
BCM43455 runs on the low-power oscillator and wakes up after a predefined time period.
•
A low-power shutdown feature allows the device to be turned off while the host and any other devices in the
system remain operational. When the BCM43455 is not needed in the system, the RF and core supplies
are shut down while the I/O remains powered. This allows the BCM43455 to effectively be off while keeping
the I/O pins powered so they do not draw extra current from any other devices connected to the I/O.
During the low-power shutdown state, provided VDDIO remains applied to the BCM43455, all outputs are
tristated, and most input signals are disabled. Input voltages must remain within the limits defined for normal
operation. This is done to prevent current paths or create loading on any digital signals in the system and
enables the BCM43455 to be fully integrated in an embedded device to take full advantage of the lowest
power-saving modes.
Two BCM43455 input signals are designed to be high-impedance inputs that do not load the driving signal
even if the chip does not have VDDIO power supplied to it: the frequency reference input (WRF_TCXO_IN)
and the 32.768 kHz input (LPO). When the BCM43455 is powered on from this state, it is the same as a
normal power-up, and the device does not contain any information about its state from the time before it was
powered down.
Wideband Speech
The BCM43455 provides support for wideband speech (WBS) using on-chip Broadcom SmartAudio®
technology. The BCM43455 can perform subband-codec (SBC), as well as mSBC, encoding and decoding of
linear 16 bits at 16 kHz (256 Kbps rate) transferred over the PCM bus.
Packet Loss Concealment
Packet Loss Concealment (PLC) improves apparent audio quality for systems with marginal link performance.
Bluetooth messages are sent in packets. When a packet is lost, it creates a gap in the received audio bit-stream.
Packet loss can be mitigated in several ways:
•
Fill in zeros.
•
Ramp down the output audio signal toward zero (this is the method used in current Bluetooth headsets).
•
Repeat the last frame (or packet) of the received bit-stream and decode it as usual (frame repeat).
These techniques cause distortion and popping in the audio stream. The BCM43455 uses a proprietary
waveform extension algorithm to provide dramatic improvement in the audio quality. Figure 8 and Figure 9 on
page 44 show audio waveforms with and without Packet Loss Concealment. Broadcom PLC/BEC algorithms
also support wideband speech.
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
Bluetooth Power Management Unit
Figure 8: CVSD Decoder Output Waveform Without PLC
Packet Loss Causes Ramp-down
Figure 9: CVSD Decoder Output Waveform After Applying PLC
Audio Rate-Matching Algorithms
The BCM43455 has an enhanced rate-matching algorithm that uses interpolation algorithms to reduce audio
stream jitter that may be present when the rate of audio data coming from the host is not the same as the
Bluetooth audio data rates.
Codec Encoding
The BCM43455 can support SBC and mSBC encoding and decoding for wideband speech.
Multiple Simultaneous A2DP Audio Stream
The BCM43455 has the ability to take a single audio stream and output it to multiple Bluetooth devices
simultaneously. This allows a user to share his or her music (or any audio stream) with a friend.
FM Over Bluetooth
FM Over Bluetooth enables the BCM43455 to stream data from FM over Bluetooth without requiring the host to
be awake. This can significantly extend battery life for usage cases where someone is listening to FM radio on
a Bluetooth headset.
Burst Buffer Operation
The BCM43455 has a data buffer that can buffer data being sent over the HCI and audio transports, then send
the data at an increased rate. This mode of operation allows the host to sleep for the maximum amount of time,
dramatically reducing system current consumption.
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BCM43455 Preliminary Data Sheet
Adaptive Frequency Hopping
Adaptive Frequency Hopping
The BCM43455 gathers link quality statistics on a channel by channel basis to facilitate channel assessment
and channel map selection. The link quality is determined using both RF and baseband signal processing to
provide a more accurate frequency-hop map.
Advanced Bluetooth/WLAN Coexistence
The BCM43455 includes advanced coexistence technologies that are only possible with a Bluetooth/WLAN
integrated die solution. These coexistence technologies are targeted at small form-factor platforms, such as cell
phones and media players, including applications such as VoWLAN + SCO and Video-over-WLAN + High
Fidelity BT Stereo.
Support is provided for platforms that share a single antenna between Bluetooth and WLAN. Dual-antenna
applications are also supported. The BCM43455 radio architecture allows for lossless simultaneous Bluetooth
and WLAN reception for shared antenna applications. This is possible only via an integrated solution (shared
LNA and joint AGC algorithm). It has superior performance versus implementations that need to arbitrate
between Bluetooth and WLAN reception.
The BCM43455 integrated solution enables MAC-layer signaling (firmware) and a greater degree of sharing via
an enhanced coexistence interface. Information is exchanged between the Bluetooth and WLAN cores without
host processor involvement.
The BCM43455 also supports Transmit Power Control on the STA together with standard Bluetooth TPC to limit
mutual interference and receiver desensitization. Preemption mechanisms are utilized to prevent AP
transmissions from colliding with Bluetooth frames. Improved channel classification techniques have been
implemented in Bluetooth for faster and more accurate detection and elimination of interferers (including nonWLAN 2.4 GHz interference).
The Bluetooth AFH classification is also enhanced by the WLAN core’s channel information.
Fast Connection (Interlaced Page and Inquiry Scans)
The BCM43455 supports page scan and inquiry scan modes that significantly reduce the average inquiry
response and connection times. These scanning modes are compatible with the Bluetooth version 2.1 page and
inquiry procedures.
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BCM43455 Preliminary Data Sheet
Microprocessor and Memory Unit for Bluetooth
Section 6: Microprocessor and Memory
Unit for Bluetooth
The Bluetooth microprocessor core is based on the ARM Cortex-M3 32-bit RISC processor with embedded ICERT debug and JTAG interface units. It runs software from the link control (LC) layer, up to the host controller
interface (HCI).
The ARM core is paired with a memory unit that contains 845 KB of ROM memory for program storage and boot
ROM, 270 KB of RAM for data scratchpad and patch RAM code. The internal ROM allows for flexibility during
power-on reset to enable the same device to be used in various configurations. At power-up, the lower-layer
protocol stack is executed from the internal ROM memory.
External patches may be applied to the ROM-based firmware to provide flexibility for bug fixes or features
additions. These patches may be downloaded from the host to the BCM43455 through the UART transports.
The mechanism for downloading via UART is identical to the proven interface of the BCM4329 and BCM4330
devices.
RAM, ROM, and Patch Memory
The BCM43455 Bluetooth core has 270 KB of internal RAM which is mapped between general purpose scratch
pad memory and patch memory and 845 KB of ROM used for the lower-layer protocol stack, test mode software,
and boot ROM. The patch memory capability enables the addition of code changes for purposes of feature
additions and bug fixes to the ROM memory.
Reset
The BCM43455 has an integrated power-on reset circuit that resets all circuits to a known power-on state. The
BT power-on reset (POR) circuit is out of reset after BT_REG_ON goes High. If BT_REG_ON is low, then the
POR circuit is held in reset.
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BCM43455 Preliminary Data Sheet
Bluetooth Peripheral Transport Unit
Section 7: Bluetooth Peripheral Transport Unit
SPI Interface
The BCM43455 supports a slave SPI HCI transport with an input clock range of up to 16 MHz. Higher clock rates
can be possible. The physical interface between the SPI master and the BCM43455 consists of the four SPI
signals (SPI_CSB, SPI_CLK, SPI_SI, and SPI_SO) and one interrupt signal (SPI_INT). The SPI signals are
muxed onto the UART signals (see Table 5). The BCM43455 can be configured to accept active-low or activehigh polarity on the SPI_CSB chip select signal. It can also be configured to drive an active-low or active-high
SPI_INT interrupt signal. Bit ordering on the SPI_SI and SPI_SO data lines can be configured as either littleendian or big-endian. Additionally, proprietary sleep mode and half-duplex handshaking is implemented
between the SPI master and the BCM43455. The SPI_INT is required to negotiate the start of a transaction. The
SPI interface does not require flow control in the middle of a payload. The FIFO is large enough to handle the
largest packet size. Only the SPI master can stop the flow of bytes on the data lines, since it controls SPI_CSB
and SPI_CLK. Flow control should be implemented in the higher layer protocols.
Table 5: SPI-to-UART Signal Mapping
SPI Signals
UART Signals
SPI_CLK
BT_UART_CTS_N
SPI_CSB
BT_UART_RTS_N
SPI_MISO
BT_UART_RXD
SPI_MOSI
BT_UART_TXD
SPI_INT
BT_HOST_WAKE
SPI/UART Transport Detection
The BT_HOST_WAKE (BT_GPIO1) pin is also used for BT transport detection. The transport detection occurs
during the power-up sequence. It selects either UART or SPI transport operation based on the following pin
state:
•
If the BT_HOST_WAKE (BT_GPIO1) pin is pulled low by an external pull-down during power-up, it selects
the SPI transport interface.
•
If the BT_HOST_WAKE (BT_GPIO1) pin is not pulled low externally during power-up, then the default
internal pull-up is detected as a high and it selects the UART transport interface.
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BCM43455 Preliminary Data Sheet
PCM Interface
PCM Interface
The BCM43455 supports two independent PCM interfaces that share the pins with the I2S interfaces. The PCM
Interface on the BCM43455 can connect to linear PCM Codec devices in master or slave mode. In master mode,
the BCM43455 generates the PCM_CLK and PCM_SYNC signals, and in slave mode, these signals are
provided by another master on the PCM interface and are inputs to the BCM43455.
The configuration of the PCM interface may be adjusted by the host through the use of vendor-specific HCI
commands.
Slot Mapping
The BCM43455 supports up to three simultaneous full-duplex SCO or eSCO channels through the PCM
interface. These three channels are time-multiplexed onto the single PCM interface by using a time-slotting
scheme where the 8 kHz or 16 kHz audio sample interval is divided into as many as 16 slots. The number of
slots is dependent on the selected interface rate of 128 kHz, 512 kHz, or 1024 kHz. The corresponding number
of slots for these interface rate is 1, 2, 4, 8, and 16, respectively. Transmit and receive PCM data from an SCO
channel is always mapped to the same slot. The PCM data output driver tristates its output on unused slots to
allow other devices to share the same PCM interface signals. The data output driver tristates its output after the
falling edge of the PCM clock during the last bit of the slot.
Frame Synchronization
The BCM43455 supports both short- and long-frame synchronization in both master and slave modes. In shortframe synchronization mode, the frame synchronization signal is an active-high pulse at the audio frame rate
that is a single-bit period in width and is synchronized to the rising edge of the bit clock. The PCM slave looks
for a high on the falling edge of the bit clock and expects the first bit of the first slot to start at the next rising edge
of the clock. In long-frame synchronization mode, the frame synchronization signal is again an active-high pulse
at the audio frame rate; however, the duration is three bit periods and the pulse starts coincident with the first
bit of the first slot.
Data Formatting
The BCM43455 may be configured to generate and accept several different data formats. For conventional
narrowband speech mode, the BCM43455 uses 13 of the 16 bits in each PCM frame. The location and order of
these 13 bits can be configured to support various data formats on the PCM interface. The remaining three bits
are ignored on the input and may be filled with 0s, 1s, a sign bit, or a programmed value on the output. The
default format is 13-bit 2’s complement data, left justified, and clocked MSB first.
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BCM43455 Preliminary Data Sheet
PCM Interface
Wideband Speech Support
When the host encodes Wideband Speech (WBS) packets in transparent mode, the encoded packets are
transferred over the PCM bus for an eSCO voice connection. In this mode, the PCM bus is typically configured
in master mode for a 4 kHz sync rate with 16-bit samples, resulting in a 64 Kbps bit rate. The BCM43455 also
supports slave transparent mode using a proprietary rate-matching scheme. In SBC-code mode, linear 16-bit
data at 16 kHz (256 Kbps rate) is transferred over the PCM bus.
Multiplexed Bluetooth Over PCM
Bluetooth supports multiple audio streams within the Bluetooth channel and both 16 kHz and 8 kHz streams can
be multiplexed. This mode of operation is only supported when the Bluetooth host is the master. Figure 10
shows the operation of the multiplexed transport with three simultaneous SCO connections. To accommodate
additional SCO channels, the transport clock speed is increased. To change between modes of operation, the
transport must be halted and restarted in the new configuration.
Figure 10: Functional Multiplex Data Diagram
1 frame
BT SCO 1 Rx
BT SCO 2 Rx
BT SCO 3 Rx
BT SCO 1 Tx
BT SCO 2 Tx
BT SCO 3 Tx
PCM_OUT
PCM_IN
PCM_SYNC
CLK
PCM_CLK
16 bits per SCO frame
Each SCO channel duplicates the data 6 times. Each
WBS frame duplicates the data 3 times per frame
Burst PCM Mode
In this mode of operation, the PCM bus runs at a significantly higher rate of operation to allow the host to duty
cycle its operation and save current. In this mode of operation, the PCM bus can operate at a rate of up to
24 MHz. This mode of operation is initiated with an HCI command from the host.
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BCM43455 Preliminary Data Sheet
PCM Interface
PCM Interface Timing
Short Frame Sync, Master Mode
Figure 11: PCM Timing Diagram (Short Frame Sync, Master Mode)
1
2
3
PC M _B C LK
4
P C M _SY N C
8
H IG H IM PED AN C E
PC M _O U T
5
7
6
PC M_IN
Table 6: PCM Interface Timing Specifications (Short Frame Sync, Master Mode)
Reference Characteristics
Minimum
Typical
Maximum Unit
1
PCM bit clock frequency
–
–
12
2
PCM bit clock LOW
41
–
–
ns
3
PCM bit clock HIGH
41
–
–
ns
4
PCM_SYNC delay
0
–
25
ns
5
PCM_OUT delay
0
–
25
ns
6
PCM_IN setup
8
–
–
ns
7
PCM_IN hold
8
–
–
ns
8
Delay from rising edge of PCM_BCLK during last bit
period to PCM_OUT becoming high impedance
0
–
25
ns
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BCM43455 Preliminary Data Sheet
PCM Interface
Short Frame Sync, Slave Mode
Figure 12: PCM Timing Diagram (Short Frame Sync, Slave Mode)
1
2
3
PCM_BCLK
4
5
PCM_SYNC
9
PCM_OUT
HIGH IMPEDANCE
6
8
7
PCM_IN
Table 7: PCM Interface Timing Specifications (Short Frame Sync, Slave Mode)
Reference Characteristics
Minimum Typical Maximum Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock LOW
41
–
–
ns
3
PCM bit clock HIGH
41
–
–
ns
4
PCM_SYNC setup
8
–
–
ns
5
PCM_SYNC hold
8
–
–
ns
6
PCM_OUT delay
0
–
25
ns
7
PCM_IN setup
8
–
–
ns
8
PCM_IN hold
8
–
–
ns
9
Delay from rising edge of PCM_BCLK during last bit
period to PCM_OUT becoming high impedance
0
–
25
ns
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BCM43455 Preliminary Data Sheet
PCM Interface
Long Frame Sync, Master Mode
Figure 13: PCM Timing Diagram (Long Frame Sync, Master Mode)
1
2
3
PCM_BCLK
4
PCM_SYNC
8
PCM_OUT
Bit 0
Bit 1
Bit 0
Bit 1
HIGH IMPEDANCE
5
6
PCM_IN
7
Table 8: PCM Interface Timing Specifications (Long Frame Sync, Master Mode)
Reference Characteristics
Minimum Typical
Maximum Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock LOW
41
–
–
ns
3
PCM bit clock HIGH
41
–
–
ns
4
PCM_SYNC delay
0
–
25
ns
5
PCM_OUT delay
0
–
25
ns
6
PCM_IN setup
8
–
–
ns
7
PCM_IN hold
8
–
–
ns
8
Delay from rising edge of PCM_BCLK during last bit
period to PCM_OUT becoming high impedance
0
–
25
ns
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BCM43455 Preliminary Data Sheet
PCM Interface
Long Frame Sync, Slave Mode
Figure 14: PCM Timing Diagram (Long Frame Sync, Slave Mode)
1
2
3
PC M _BC LK
4
5
PCM_SYNC
9
B it 0
PC M _O U T
H IG H IM P E D A N C E
B it 1
6
8
7
P C M _ IN
B it 0
B it 1
Table 9: PCM Interface Timing Specifications (Long Frame Sync, Slave Mode)
Reference Characteristics
Minimum Typical
Maximum Unit
1
PCM bit clock frequency
–
12
2
PCM bit clock LOW
41
–
–
ns
3
PCM bit clock HIGH
41
–
–
ns
4
PCM_SYNC setup
8
–
–
ns
5
PCM_SYNC hold
8
–
–
ns
6
PCM_OUT delay
0
–
25
ns
7
PCM_IN setup
8
–
–
ns
8
PCM_IN hold
8
–
–
ns
9
Delay from rising edge of PCM_BCLK during last bit
period to PCM_OUT becoming high impedance
0
–
25
ns
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–
MHz
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BCM43455 Preliminary Data Sheet
PCM Interface
Short Frame Sync, Burst Mode
Figure 15: PCM Burst Mode Timing (Receive Only, Short Frame Sync)
1
2
3
PCM_BCLK
4
5
PCM_SYNC
7
6
PCM_IN
Table 10: PCM Burst Mode (Receive Only, Short Frame Sync)
Reference Characteristics
Minimum
Typical Maximum Unit
1
PCM bit clock frequency
–
–
24
MHz
2
PCM bit clock LOW
20.8
–
–
ns
3
PCM bit clock HIGH
20.8
–
–
ns
4
PCM_SYNC setup
8
–
–
ns
5
PCM_SYNC hold
8
–
–
ns
6
PCM_IN setup
8
–
–
ns
7
PCM_IN hold
8
–
–
ns
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BCM43455 Preliminary Data Sheet
PCM Interface
Long Frame Sync, Burst Mode
Figure 16: PCM Burst Mode Timing (Receive Only, Long Frame Sync)
1
2
3
PCM_BCLK
4
5
PCM_SYNC
7
6
PCM_IN
Bit 0
Bit 1
Table 11: PCM Burst Mode (Receive Only, Long Frame Sync)
Reference Characteristics
Minimum Typical Maximum Unit
1
PCM bit clock frequency
–
–
24
MHz
2
PCM bit clock LOW
20.8
–
–
ns
3
PCM bit clock HIGH
20.8
–
–
ns
4
PCM_SYNC setup
8
–
–
ns
5
PCM_SYNC hold
8
–
–
ns
6
PCM_IN setup
8
–
–
ns
7
PCM_IN hold
8
–
–
ns
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BCM43455 Preliminary Data Sheet
UART Interface
UART Interface
The UART is a standard 4-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 9600 bps to
4.0 Mbps. The interface features an automatic baud rate detection capability that returns a baud rate selection.
Alternatively, the baud rate may be selected through a vendor-specific UART HCI command.
UART has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to support EDR. Access to the FIFOs is
conducted through the AHB interface through either DMA or the CPU. The UART supports the Bluetooth 4.1
UART HCI specification: H4, a custom Extended H4, and H5. The default baud rate is 115.2 Kbaud.
The UART supports the 3-wire H5 UART transport, as described in the Bluetooth specification (Three-wire
UART Transport Layer). Compared to H4, the H5 UART transport reduces the number of signal lines required
by eliminating the CTS and RTS signals.
The BCM43455 UART can perform XON/XOFF flow control and includes hardware support for the Serial Line
Input Protocol (SLIP). It can also perform wake-on activity. For example, activity on the RX or CTS inputs can
wake the chip from a sleep state.
Normally, the UART baud rate is set by a configuration record downloaded after device reset, or by automatic
baud rate detection, and the host does not need to adjust the baud rate. Support for changing the baud rate
during normal HCI UART operation is included through a vendor-specific command that allows the host to adjust
the contents of the baud rate registers. The BCM43455 UARTs operate correctly with the host UART as long as
the combined baud rate error of the two devices is within ±2%.
Table 12: Example of Common Baud Rates
Desired Rate
Actual Rate
Error (%)
4000000
4000000
0.00
3692000
3692308
0.01
3000000
3000000
0.00
2000000
2000000
0.00
1500000
1500000
0.00
1444444
1454544
0.70
921600
923077
0.16
460800
461538
0.16
230400
230796
0.17
115200
115385
0.16
57600
57692
0.16
38400
38400
0.00
28800
28846
0.16
19200
19200
0.00
14400
14423
0.16
9600
9600
0.00
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I2S Interface
BCM43455 Preliminary Data Sheet
Figure 17: UART Timing
BT_UART_CTS_N
1
2
BT_UART_TXD
Midpoint of STOP bit
Midpoint of STOP bit
BT_UART_RXD
3
BT_UART_RTS_N
Table 13: UART Timing Specifications
Ref
Characteristics
1
2
3
Min.
Typ.
Max.
Unit
Delay time, BT_UART_CTS_N low to BT_UART_TXD valid –
–
1.5
Bit periods
Setup time, BT_UART_CTS_N high before midpoint of stop –
bit
–
0.5
Bit periods
Delay time, midpoint of stop bit to BT_UART_RTS_N high
–
0.5
Bit periods
–
I2S Interface
The BCM43455 supports an I2S digital audio port for Bluetooth audio. The I2S signals are:
•
I2S clock: I2S SCK
•
I2S Word Select: I2S WS
•
I2S Data Out: I2S SDO
•
I2S Data In: I2S SDI
I2S SCK and I2S WS become outputs in master mode and inputs in slave mode, while I2S SDO always stays
as an output. The channel word length is 16 bits and the data is justified so that the MSB of the left-channel data
is aligned with the MSB of the I2S bus, per the I2S specification. The MSB of each data word is transmitted one
bit clock cycle after the I2S WS transition, synchronous with the falling edge of bit clock. Left-channel data is
transmitted when I2S WS is low, and right-channel data is transmitted when I2S WS is high. Data bits sent by
the BCM43455 are synchronized with the falling edge of I2S_SCK and should be sampled by the receiver on
the rising edge of I2S_SSCK.
The clock rate in master mode is either of the following:
48 kHz x 32 bits per frame = 1.536 MHz
48 kHz x 50 bits per frame = 2.400 MHz
The master clock is generated from the input reference clock using a N/M clock divider. In the slave mode, any
clock rate is supported to a maximum of 3.072 MHz.
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I2S Interface
BCM43455 Preliminary Data Sheet
I2S Timing
Note: Timing values specified in Table 14 are relative to high and low threshold levels.
Table 14: Timing for I2S Transmitters and Receivers
Transmitter
Clock Period T
Receiver
Lower LImit
Upper Limit
Lower Limit
Upper Limit
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Notes
Ttr
–
–
–
Tr
–
–
–
a
Master Mode: Clock generated by transmitter or receiver
HIGH tHC
0.35Ttr –
–
–
0.35Ttr –
–
–
b
LOWtLC
0.35Ttr –
–
–
0.35Ttr –
–
–
b
Slave Mode: Clock accepted by transmitter or receiver
HIGH tHC
–
0.35Ttr –
–
–
0.35Ttr –
–
c
LOW tLC
–
0.35Ttr –
–
–
0.35Ttr –
–
c
Rise time tRC
–
–
0.15Ttr –
–
–
–
–
d
Delay tdtr
–
–
–
0.8T
–
–
–
–
e
Hold time thtr
0
–
–
–
–
–
–
–
d
Setup time tsr
–
–
–
–
–
0.2Tr
–
–
f
Hold time thr
–
–
–
–
–
0
–
–
f
Transmitter
Receiver
a. The system clock period T must be greater than Ttr and Tr because both the transmitter and receiver have to be
able to handle the data transfer rate.
b. At all data rates in master mode, the transmitter or receiver generates a clock signal with a fixed mark/space
ratio. For this reason, tHC and tLC are specified with respect to T.
c. In slave mode, the transmitter and receiver need a clock signal with minimum HIGH and LOW periods so that
they can detect the signal. So long as the minimum periods are greater than 0.35Tr, any clock that meets the
requirements can be used.
d. Because the delay (tdtr) and the maximum transmitter speed (defined by Ttr) are related, a fast transmitter driven
by a slow clock edge can result in tdtr not exceeding tRC which means thtr becomes zero or negative. Therefore,
the transmitter has to guarantee that thtr is greater than or equal to zero, so long as the clock rise-time tRC is not
more than tRCmax, where tRCmax is not less than 0.15Ttr.
e. To allow data to be clocked out on a falling edge, the delay is specified with respect to the rising edge of the
clock signal and T, always giving the receiver sufficient setup time.
f. The data setup and hold time must not be less than the specified receiver setup and hold time.
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I2S Interface
BCM43455 Preliminary Data Sheet
Note: The time periods specified in Figure 18 and Figure 19 are defined by the transmitter speed. The
receiver specifications must match transmitter performance.
Figure 18: I2S Transmitter Timing
T
tRC*
tLC > 0.35T
tHC > 0.35T
VH = 2.0V
SCK
VL = 0.8V
thtr > 0
totr < 0.8T
SD and WS
T = Clock period
Ttr = Minimum allowed clock period for transmitter
T = Ttr
* tRC is only relevant for transmitters in slave mode.
Figure 19: I2S Receiver Timing
T
tLC > 0.35T
tHC > 0.35
VH = 2.0V
SCK
VL = 0.8V
tsr > 0.2T
thr > 0
SD and WS
T = Clock period
Tr = Minimum allowed clock period for transmitter
T > Tr
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BCM43455 Preliminary Data Sheet
FM Receiver Subsystem
Section 8: FM Receiver Subsystem
FM Radio
The BCM43455 includes a completely integrated FM radio receiver with RDS/RBDS covering all FM bands from
65 MHz to 108 MHz. The receiver is controlled through commands on the HCI. FM received audio is available
in analog form or in digital form through I2S or PCM. The FM radio operates from the external clock reference.
Digital FM Audio Interfaces
The FM audio can be transmitted via the shared PCM and I2S pins, and the sampling rate is programmable.
The BCM43455 supports a three-wire PCM or I2S audio interface in either master or slave configuration. The
master or slave configuration is selected using vendor specific commands over the HCI interface. In addition,
multiple sampling rates are supported, derived from either the FM or Bluetooth clocks. In master mode, the clock
rate is either of the following:
•
48 kHz x 32 bits per frame = 1.536 MHz
•
48 kHz x 50 bits per frame = 2.400 MHz
In slave mode, any clock rate is supported up to a maximum of 3.072 MHz.
FM Over Bluetooth
The BCM43455 can output received FM audio onto Bluetooth using one of following three links: eSCO, WBS,
and A2DP. In all of the above modes, once the link has been set up, the host processor can enter sleep mode
while the BCM43455 continues to stream FM audio to the remote Bluetooth device, allowing the system current
consumption to be minimized.
eSCO
In this use case, the stereo FM audio is downsampled to 8 kHz and a mono or stereo stream is then sent through
the Bluetooth eSCO link to a remote Bluetooth device, typically a headset. Two Bluetooth voice connections
must be used to transport stereo.
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BCM43455 Preliminary Data Sheet
Wideband Speech Link
Wideband Speech Link
In this case, the stereo FM audio is downsampled to 16 kHz and a mono or stereo stream is then sent through
the Bluetooth wideband speech link to a remote Bluetooth device, typically a headset. Two Bluetooth voice
connections must be used to transport stereo.
A2DP
In this case, the stereo FM audio is encoded by the on-chip SBC encoder and transported as an A2DP link to a
remote Bluetooth device. Sampling rates of 48 kHz, 44.1 kHz, and 32 kHz joint stereo are supported. An A2DP
“lite” stack is implemented in the BCM43455 to support this use case, which eliminates the need to route the
SBC-encoded audio back to the host to create the A2DP packets.
Autotune and Search Algorithms
The BCM43455 supports a number of FM search and tune functions that allows the host to implement many
convenient user functions, which are accessed through the Broadcom FM stack.
•
Tune to Play—Allows the FM receiver to be programmed to a specific frequency.
•
Search for SNR > Threshold—Checks the power level of the available channel and the estimated SNR of
the channel to help achieve precise control of the expected sound quality for the selected FM channel.
Specifically, the host can adjust its SNR requirements to retrieve a signal with a specific sound quality, or
adjust this to return the weakest channels.
•
Alternate Frequency Jump—Allows the FM receiver to automatically jump to an alternate FM channel that
carries the same information, but has a better SNR. For example, when traveling, a user may pass through
a region where a number of channels carry the same station. When the user passes from one area to the
next, the FM receiver can automatically switch to another channel with a stronger signal to spare the user
from having to manually change the channel to continue listening to the same station.
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BCM43455 Preliminary Data Sheet
Audio Features
Audio Features
A number of features are implemented in the BCM43455 to provide the best possible audio experience for the
user.
•
Mono/Stereo Blend, Switch, or FME—The BCM43455 provides automatic control of the stereo or mono
settings based on the FM signal carrier-to-noise ratio (C/N). This feature is used to maintain the best
possible audio SNR based on the FM channel condition. Three modes of operation are supported:
– Blend: In this mode, fine control of stereo separation is used to achieve optimal audio quality over a
wide range of input C/N. The amount of separation is fully programmable. In Figure 20, the separation is
programmed to maintain a minimum 50 dB SNR across the blend range.
– Extended blend: In this mode, stereo separation is maximized across a wide range of input CNR.
Broadcom static suppression typically gives a static-free user experience to within 3 dB of ultimate
sensitivity.
– Switch: In this mode, the audio switches from full stereo to full mono at a predetermined level to
maintain optimal audio quality. The stereo-to-mono switch point and the mono-to-stereo switch points
are fully programmable to provide the desired amount of audio SNR. In Figure 21 on page 63, the
switch point is programmed to switch to mono to maintain a 40 dB SNR.
– FM enhancement (FME): In this mode, advanced digital signal processing in the FM receiver greatly
enhances the stereo separation of the received audio. Traditional FM receivers deliver a full stereo
signal at a high carrier-to-noise ratio (CNR) and gradually blend into mono as the CNR drops. The
Broadcom stereo extension allows full stereo separation to within 2 dB of the FM receiver sensitivity
threshold. The same signal processing delays the onset of pops at the FM sensitivity threshold and
reduces the ambient background noise by more than 20 dB in the low CNR region near sensitivity. The
result is a low-noise full stereo signal at input RF levels lower than previously achievable.
Figure 20: Audio SNR for Blend, Switch, and FME Modes
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Audio Features
Figure 21: Stereo Separation for Blend, Switch, and FME Modes
•
Soft Mute—Improves the user experience by dynamically muting the output audio proportionate to the FM
signal C/N. This prevents the user from being assaulted with a blast of static. The mute characteristic is
fully programmable to accommodate fine tuning of the output signal level. An example mute characteristic
is shown in Figure 22.
Figure 22: Example Soft Mute Characteristic
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RDS/RBDS
•
High Cut—A programmable high-cut filter is provided to reduce the amount of high-frequency noise
caused by static in the output audio signal. Like the soft mute circuit, it is fully programmable to allow for
any amount of high cut based on the FM signal C/N.
•
Audio Pause Detect—The FM receiver monitors the magnitude of the audio signal and notifies the host
through an interrupt when the magnitude of the signal has fallen below the threshold set for a
programmable period. This feature can be used to provide alternate frequency jumps during periods of
silence to minimize disturbances to the listener. Filtering techniques are used within the audio pause
detection block to provide more robust presence-to-silence detection and silence-to-presence detection.
•
Automatic Antenna Tuning—The BCM43455 has an on-chip automatic antenna tuning network. When
used with a single off-chip inductor, the on-chip circuitry automatically chooses an optimal on-chip matching
component to obtain the highest signal strength for the desired frequency. The high-Q nature of this
matching network simultaneously provides out-of-band blocking protection as well as a reduction of
radiated spurious emissions from the FM antenna. It is designed to accommodate a wide range of external
wire antennas.
RDS/RBDS
The BCM43455 integrates a RDS/RBDS modem and codec, the decoder includes programmable filtering and
buffering functions, and the encoder includes the option to encode messages to PS or RT frame format with
programmable scrolling in PS mode. The RDS/RBDS data can be read out in receive mode or delivered in
transmit mode through either the HCI interface.
In addition, the RDS/RBDS functionality supports the following:
Receive
•
Block decoding, error correction and synchronization
•
Flywheel synchronization feature, allowing the host to set parameters for acquisition, maintenance, and
loss of sync. (It is possible to set up the BCM43455 such that synchronization is achieved when a minimum
of two good blocks (error free) are decoded in sequence. The number of good blocks required for sync is
programmable.)
•
Storage capability up to 126 blocks of RDS data
•
Full or partial block B match detect and interrupt to host
•
Audio pause detection with programmable parameters
•
Program identification (PI) code detection and interrupt to host
•
Automatic frequency jump
•
Block E filtering
•
Soft mute
•
Signal dependent mono/stereo blend
•
Programmable pre-emphasis
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BCM43455 Preliminary Data Sheet
WLAN Global Functions
Section 9: WLAN Global Functions
WLAN CPU and Memory Subsystem
The BCM43455 WLAN section includes an integrated ARM Cortex-R4 32-bit processor with internal RAM and
ROM. The ARM Cortex-R4 is a low-power processor that features low gate count, low interrupt latency, and lowcost debug capabilities. It is intended for deeply embedded applications that require fast interrupt response
features. Delivering more than 30% performance gain over ARM7TDMI, the ARM Cortex-R4 implements the
ARM v7-R architecture with support for the Thumb-2 instruction set.
At 0.19 µW/MHz, the Cortex-R4 is the most power efficient general-purpose microprocessor available,
outperforming 8- and 16-bit devices on MIPS/µW. It supports integrated sleep modes.
Using multiple technologies to reduce cost, the ARM Cortex-R4 offers improved memory utilization, reduced pin
overhead, and reduced silicon area. It supports independent buses for Code and Data access (ICode/DCode
and System buses), and extensive debug features including real time trace of program execution.
On-chip memory for the CPU includes 800 KB SRAM and 704 KB ROM.
One-Time Programmable Memory
Various hardware configuration parameters may be stored in an internal 6144-bit (768 bytes) One-Time
Programmable (OTP) memory, which is read by the system software after device reset. In addition, customerspecific parameters, including the system vendor ID and the MAC address can be stored, depending on the
specific board design.
The initial state of all bits in an unprogrammed OTP device is 0. After any bit is programmed to a 1, it cannot be
reprogrammed to 0. The entire OTP array can be programmed in a single write cycle using a utility provided with
the Broadcom WLAN manufacturing test tools. Alternatively, multiple write cycles can be used to selectively
program specific bytes, but only bits which are still in the 0 state can be altered during each programming cycle.
Prior to OTP programming, all values should be verified using the appropriate editable nvram.txt file, which is
provided with the reference board design package.
GPIO Interface
The following number of general-purpose I/O (GPIO) pins are available on the WLAN section of the BCM43455
that can be used to connect to various external devices:
•
WLBGA package – 15 GPIOs
Upon power-up and reset, these pins become tristated. Subsequently, they can be programmed to be either
input or output pins via the GPIO control register. In addition, the GPIO pins can be assigned to various other
functions.
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External Coexistence Interface
External Coexistence Interface
An external handshake interface is available to enable signaling between the device and an external co-located
wireless device, such as GPS or LTE to manage wireless medium sharing for optimum performance.
Figure 23 shows the WCI-2 LTE coexistence interface. See Table 13: “UART Timing Specifications,” on page 57
for UART baud rate.
Figure 23: Broadcom GCI or BT-SIG WCI-2 LTE Coexistence Interface
LTE\IC
WLAN
GCI
SECI_OUT/BT_TXD/GPIO5
UART_IN
SECI_IN/BT_RXD/GPIO4
UART_OUT
BT
BCM43455
NOTES:
 SECI_OUT/BT_TXD and SECI_IN/BT_RXD on the BCM4345X are multiplexed on GPIO5 and GPIO4, respectively.
 The 2-wire LTE coexistence interface is intended for future compatibility with the BT SIG 2-wire interface that is being standardized for
Core 4.1.
 ORing to generate ISM_RX_PRIORITY for ERCX_TXCONF or BT_RX_PRIORITY is achieved by setting the GPIO mask registers
appropriately.
Figure 24 and Table 15 on page 66 define an alternate 3-wire LTE coexistence interface.
Figure 24: 3-Wire LTE Coexistence Interface
LTE\IC
WLAN
ERCX
BT
GPIO2
ERCX_WL_PRIO
GPIO3
ERCX_LTETX
GPIO4
ERCX_LTERX
BCM43455
Table 15: 3-Wire External Coexistence Interface
GPIO Name Coexistence Signal
Type
Comment
GPIO_2
ERCX_WL_PRIO
Output
Notify LTE of request to sleep
GPIO_3
ERCX_LTE_TX
Input
Notify WLAN RX of requirement to sleep
GPIO_4
ERCX_LTE_RX
Input
Notify WLAN TX to reduce TX power
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UART Interface
UART Interface
A high-speed 4-wire CTS/RTS UART interface can be enabled by software as an alternate function on GPIO
pins. Provided primarily for debugging during development, this UART enables the BCM43455 to operate as
RS-232 data termination equipment (DTE) for exchanging and managing data with other serial devices. It is
compatible with the industry standard 16550 UART, and provides a FIFO size of 64 × 8 in each direction.
JTAG/SWD Interface
The BCM43455 supports IEEE 1149.1 JTAG boundary scan and reduced pin-count Serial Wire Debug (SWD)
mode to access the chip’s internal blocks and backplane for system bring-up and debugging. This interface
allows Broadcom engineers to assist customers with proprietary debug and characterization test tools. It is
highly recommended that customers provide access to at least the SWD pins on all PCB designs by using either
test points or a header.
The SWD interface uses two of the JTAG signals: TMS for bidirectional data (SWDIO) and TCK for the clock
(SWCLK). The debug access port (DAP) embedded in the ARM processor supports both SWD and JTAG
interfaces and can be switched from one to the other through a specific sequence on the TMS/SWD lines. In
addition to the ARM debug interface, an internal JTAG master on the DAP allows access to test access points
(TAPs) in the BCM43455 for hardware debugging.
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WLAN Host Interfaces
Section 10: WLAN Host Interfaces
SDIO v3.0
All three package options of the BCM43455 WLAN section provide support for SDIO version 3.0, including the
new UHS-I modes:
•
DS: Default speed (DS) up to 25 MHz, including 1- and 4-bit modes (3.3V signaling).
•
HS: High speed up to 50 MHz (3.3V signaling).
•
SDR12: SDR up to 25 MHz (1.8V signaling).
•
SDR25: SDR up to 50 MHz (1.8V signaling).
•
SDR50: SDR up to 100 MHz (1.8V signaling).
•
SDR104: SDR up to 208 MHz (1.8V signaling)
•
DDR50: DDR up to 50 MHz (1.8V signaling).
Note: The BCM43455 is backward compatible with SDIO v2.0 host interfaces.
The SDIO interface also has the ability to map the interrupt signal on to a GPIO pin for applications requiring an
interrupt different from the one provided by the SDIO interface. The ability to force control of the gated clocks
from within the device is also provided. SDIO mode is enabled by strapping options. See Table 20 on page 91
for strapping options.
The following three functions are supported:
•
Function 0 Standard SDIO function (Max BlockSize/ByteCount = 32B)
•
Function 1 Backplane Function to access the internal system-on-chip (SoC) address space
(Max BlockSize/ByteCount = 64B)
•
Function 2 WLAN Function for efficient WLAN packet transfer through DMA
(Max BlockSize/ByteCount = 512B).
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SDIO v3.0
SDIO Pins
Table 16: SDIO Pin Description
SD 4-Bit Mode
SD 1-Bit Mode
DATA0
Data line 0
DATA
Data line
DATA1
Data line 1 or Interrupt
IRQ
Interrupt
DATA2
Data line 2 or Read Wait
RW
Read Wait
DATA3
Data line 3
N/C
Not used
CLK
Clock
CLK
Clock
CMD
Command line
CMD
Command line
Figure 25: Signal Connections to SDIO Host (SD 4-Bit Mode)
CLK
SD Host
CMD
BCM43455
DAT[3:0]
Figure 26: Signal Connections to SDIO Host (SD 1-Bit Mode)
CLK
CMD
SD Host
DATA
BCM43455
IRQ
RW
Note: Per Section 6 of the SDIO specification, pull-ups in the 10 kΩ to 100 kΩ range are required on
the four DATA lines and the CMD line. This requirement must be met during all operating states either
through the use of external pull-up resistors or through proper programming of the SDIO host’s internal
pull-ups.
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BCM43455 Preliminary Data Sheet
PCI Express Interface
PCI Express Interface
The PCI Express (PCIe) core on the BCM43455 is a high-performance serial I/O interconnect that is protocol
compliant and electrically compatible with the PCI Express Base Specification v2.0. This core contains all the
necessary blocks, including logical and electrical functional subblocks to perform PCIe functionality and
maintain high-speed links, using existing PCI system configuration software implementations without
modification.
Organization of the PCIe core is in logical layers: Transaction Layer, Data Link Layer, and Physical Layer, as
shown in Figure 27. A configuration or link management block is provided for enumerating the PCIe
configuration space and supporting generation and reception of System Management Messages by
communicating with PCIe layers.
Each layer is partitioned into dedicated transmit and receive units that allow point-to-point communication
between the host and BCM43455 device. The transmit side processes outbound packets while the receive side
processes inbound packets. Packets are formed and generated in the Transaction and Data Link Layer for
transmission onto the high-speed links and onto the receiving device. A header is added at the beginning to
indicate the packet type and any other optional fields.
Figure 27: PCI Express Layer Model
HW/SW Interface
HW/SW Interface
Transaction
Layer
Transaction
Layer
Data Link
Layer
Data Link
Layer
Physical Layer
Physical Layer
Logical Subblock
Logical Subblock
Electrical Subblock
Electrical Subblock
TX
RX
TX
RX
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PCI Express Interface
Transaction Layer Interface
The PCIe core employs a packet-based protocol to transfer data between the host and BCM43455 device,
delivering new levels of performance and features. The upper layer of the PCIe is the Transaction Layer. The
Transaction layer is primarily responsible for assembly and disassembly of Transaction Layer Packets (TLPs).
TLP structure contains header, data payload, and End-to-End CRC (ECRC) fields, which are used to
communicate transactions, such as read and write requests and other events.
A pipelined full split-transaction protocol is implemented in this layer to maximize efficient communication
between devices with credit-based flow control of TLP, which eliminates wasted link bandwidth due to retries.
Data Link Layer
The data link layer serves as an intermediate stage between the transaction layer and the physical layer. Its
primary responsibility is to provide reliable, efficient mechanism for the exchange of TLPs between two directly
connected components on the link. Services provided by the data link layer include data exchange, initialization,
error detection and correction, and retry services.
Data Link Layer Packets (DLLPs) are generated and consumed by the data link layer. DLLPs are the
mechanism used to transfer link management information between data link layers of the two directly connected
components on the link, including TLP acknowledgment, power management, and flow control.
Physical Layer
The physical layer of the PCIe provides a handshake mechanism between the data link layer and the high-speed
signaling used for Link data interchange. This layer is divided into the logical and electrical functional subblocks.
Both subblocks have dedicated transmit and receive units that allow for point-to-point communication between
the host and BCM43455 device. The transmit section prepares outgoing information passed from the data link
layer for transmission, and the receiver section identifies and prepares received information before passing it to
the data link layer. This process involves link initialization, configuration, scrambler, and data conversion into a
specific format.
Logical Subblock
The logical sub block primary functions are to prepare outgoing data from the data link layer for transmission
and identify received data before passing it to the data link layer.
Scrambler/Descrambler
This PCIe PHY component generates pseudo-random sequence for scrambling of data bytes and the idle
sequence. On the transmit side, scrambling is applied to characters prior to the 8b/10b encoding. On the receive
side, descrambling is applied to characters after 8b/10b decoding. Scrambling may be disabled in polling and
recovery for testing and debugging purposes.
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PCI Express Interface
8B/10B Encoder/Decoder
The PCIe core on the BCM43455 uses an 8b/10b encoder/decoder scheme to provide DC balancing,
synchronizing clock and data recovery, and error detection. The transmission code is specified in the ANSI
X3.230-1994, clause 11 and in IEEE 802.3z, 36.2.4.
Using this scheme, 8-bit data characters are treated as 3 bits and 5 bits mapped onto a 4-bit code group and a
6-bit code group, respectively. The control bit in conjunction with the data character is used to identify when to
encode one of the twelve Special Symbols included in the 8b/10b transmission code. These code groups are
concatenated to form a 10-bit symbol, which is then transmitted serially. Special Symbols are used for link
management, frame TLPs, and DLLPs, allowing these packets to be quickly identified and easily distinguished.
Elastic FIFO
An elastic FIFO is implemented in the receiver side to compensate for the differences between the transmit clock
domain and the receive clock domain, with worse case clock frequency specified at 600 ppm tolerance. As a
result, the transmit and receive clocks can shift one clock every 1666 clocks. In addition, the FIFO adaptively
adjusts the elastic level based on the relative frequency difference of the write and read clock. This technique
reduces the elastic FIFO size and the average receiver latency by half.
Electrical Subblock
The high-speed signals utilize the Common Mode Logic (CML) signaling interface with on-chip termination and
de-emphasis for best-in-class signal integrity. A de-emphasis technique is employed to reduce the effects of
Intersymbol Interference (ISI) due to the interconnect by optimizing voltage and timing margins for worst case
channel loss. This results in a maximally open “eye” at the detection point, thereby allowing the receiver to
receive data with acceptable Bit-Error Rate (BER).
To further minimize ISI, multiple bits of the same polarity that are output in succession are de-emphasized.
Subsequent same bits are reduced by a factor of 3.5 dB in power. This amount is specified by PCIe to allow for
maximum interoperability while minimizing the complexity of controlling the de-emphasis values. The highspeed interface requires AC coupling on the transmit side to eliminate the DC common mode voltage from the
receiver. The range of AC capacitance allowed is 75 nF to 200 nF.
Configuration Space
The PCIe function in the BCM43455 implements the configuration space as defined in the PCI Express Base
Specification v2.0.
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Wireless LAN MAC and PHY
S e c t i o n 11 : Wi r e l e s s L A N M A C a n d P H Y
IEEE 802.11ac MAC
The BCM43455 WLAN MAC is designed to support high-throughput operation with low-power consumption. It
does so without compromising the Bluetooth coexistence policies, thereby enabling optimal performance over
both networks. In addition, several power saving modes have been implemented that allow the MAC to consume
very little power while maintaining network-wide timing synchronization. The architecture diagram of the MAC
is shown in Figure 28.
The following sections provide an overview of the important modules in the MAC.
Figure 28: WLAN MAC Architecture
Embedded CPU Interface
Host Registers, DMA Engines
TX-FIFO
(32 KB)
PMQ
RX-FIFO
(10 KB)
PSM
UCODE
PSM
Memory
IFS
Backoff, BTCX
WEP
TKIP, AES, WAPI
TSF
SHM
BUS
IHR
NAV
EXT- IHR
BUS
RXE
TXE
TX A-MPDU
RX A-MPDU
Shared Memory
(6 KB)
MAC-PHY Interface
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IEEE 802.11ac MAC
The BCM43455 WLAN media access controller (MAC) supports features specified in the IEEE 802.11 base
standard, and amended by IEEE 802.11n. The key MAC features include:
•
Enhanced MAC for supporting IEEE 802.11ac features
•
Transmission and reception of aggregated MPDUs (A-MPDU) for high throughput (HT)
•
Support for power management schemes, including WMM power-save, power-save multi-poll (PSMP) and
multiphase PSMP operation
•
Support for immediate ACK and Block-ACK policies
•
Interframe space timing support, including RIFS
•
Support for RTS/CTS and CTS-to-self frame sequences for protecting frame exchanges
•
Back-off counters in hardware for supporting multiple priorities as specified in the WMM specification
•
Timing synchronization function (TSF), network allocation vector (NAV) maintenance, and target beacon
transmission time (TBTT) generation in hardware
•
Hardware offload for AES-CCMP, legacy WPA TKIP, legacy WEP ciphers, WAPI, and support for key
management
•
Support for coexistence with Bluetooth and other external radios
•
Programmable independent basic service set (IBSS) or infrastructure basic service set functionality
•
Statistics counters for MIB support
PSM
The programmable state machine (PSM) is a microcoded engine, which provides most of the low-level control
to the hardware, to implement the IEEE 802.11 specification. It is a microcontroller that is highly optimized for
flow control operations, which are predominant in implementations of communication protocols. The instruction
set and fundamental operations are simple and general, which allows algorithms to be optimized until very late
in the design process. It also allows for changes to the algorithms to track evolving IEEE 802.11 specifications.
The PSM fetches instructions from the microcode memory. It uses the shared memory to obtain operands for
instructions, as a data store, and to exchange data between both the host and the MAC data pipeline (via the
SHM bus). The PSM also uses a scratchpad memory (similar to a register bank) to store frequently accessed
and temporary variables.
The PSM exercises fine-grained control over the hardware engines, by programming internal hardware registers
(IHR). These IHRs are co-located with the hardware functions they control, and are accessed by the PSM via
the IHR bus.
The PSM fetches instructions from the microcode memory using an address determined by the program
counter, instruction literal, or a program stack. For ALU operations the operands are obtained from shared
memory, scratchpad, IHRs, or instruction literals, and the results are written into the shared memory, scratchpad,
or IHRs.
There are two basic branch instructions: conditional branches and ALU based branches. To better support the
many decision points in the IEEE 802.11 algorithms, branches can depend on either a readily available signals
from the hardware modules (branch condition signals are available to the PSM without polling the IHRs), or on
the results of ALU operations.
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IEEE 802.11ac MAC
WEP
The wired equivalent privacy (WEP) engine encapsulates all the hardware accelerators to perform the
encryption and decryption, and MIC computation and verification. The accelerators implement the following
cipher algorithms: legacy WEP, WPA TKIP, WPA2 AES-CCMP.
The PSM determines, based on the frame type and association information, the appropriate cipher algorithm to
be used. It supplies the keys to the hardware engines from an on-chip key table. The WEP interfaces with the
TXE to encrypt and compute the MIC on transmit frames, and the RXE to decrypt and verify the MIC on receive
frames.
TXE
The transmit engine (TXE) constitutes the transmit data path of the MAC. It coordinates the DMA engines to
store the transmit frames in the TXFIFO. It interfaces with WEP module to encrypt frames, and transfers the
frames across the MAC-PHY interface at the appropriate time determined by the channel access mechanisms.
The data received from the DMA engines are stored in transmit FIFOs. The MAC supports multiple logical
queues to support traffic streams that have different QoS priority requirements. The PSM uses the channel
access information from the IFS module to schedule a queue from which the next frame is transmitted. Once
the frame is scheduled, the TXE hardware transmits the frame based on a precise timing trigger received from
the IFS module.
The TXE module also contains the hardware that allows the rapid assembly of MPDUs into an A-MPDU for
transmission. The hardware module aggregates the encrypted MPDUs by adding appropriate headers and pad
delimiters as needed.
RXE
The receive engine (RXE) constitutes the receive data path of the MAC. It interfaces with the DMA engine to
drain the received frames from the RXFIFO. It transfers bytes across the MAC-PHY interface and interfaces with
the WEP module to decrypt frames. The decrypted data is stored in the RXFIFO.
The RXE module contains programmable filters that are programmed by the PSM to accept or filter frames
based on several criteria such as receiver address, BSSID, and certain frame types.
The RXE module also contains the hardware required to detect A-MPDUs, parse the headers of the containers,
and disaggregate them into component MPDUS.
IFS
The IFS module contains the timers required to determine interframe space timing including RIFS timing. It also
contains multiple backoff engines required to support prioritized access to the medium as specified by WMM.
The interframe spacing timers are triggered by the cessation of channel activity on the medium, as indicated by
the PHY. These timers provide precise timing to the TXE to begin frame transmission. The TXE uses this
information to send response frames or perform transmit frame-bursting (RIFS or SIFS separated, as within a
TXOP).
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IEEE 802.11ac PHY
The backoff engines (for each access category) monitor channel activity, in each slot duration, to determine
whether to continue or pause the backoff counters. When the backoff counters reach 0, the TXE gets notified,
so that it may commence frame transmission. In the event of multiple backoff counters decrementing to 0 at the
same time, the hardware resolves the conflict based on policies provided by the PSM.
The IFS module also incorporates hardware that allows the MAC to enter a low-power state when operating
under the IEEE power save mode. In this mode, the MAC is in a suspended state with its clock turned off. A
sleep timer, whose count value is initialized by the PSM, runs on a slow clock and determines the duration over
which the MAC remains in this suspended state. Once the timer expires the MAC is restored to its functional
state. The PSM updates the TSF timer based on the sleep duration ensuring that the TSF is synchronized to
the network.
The IFS module also contains the PTA hardware that assists the PSM in Bluetooth coexistence functions.
TSF
The timing synchronization function (TSF) module maintains the TSF timer of the MAC. It also maintains the
target beacon transmission time (TBTT). The TSF timer hardware, under the control of the PSM, is capable of
adopting timestamps received from beacon and probe response frames in order to maintain synchronization
with the network.
The TSF module also generates trigger signals for events that are specified as offsets from the TSF timer, such
as uplink and downlink transmission times used in PSMP.
NAV
The network allocation vector (NAV) timer module is responsible for maintaining the NAV information conveyed
through the duration field of MAC frames. This ensures that the MAC complies with the protection mechanisms
specified in the standard.
The hardware, under the control of the PSM, maintains the NAV timer and updates the timer appropriately based
on received frames. This timing information is provided to the IFS module, which uses it as a virtual carriersense indication.
MAC-PHY Interface
The MAC-PHY interface consists of a data path interface to exchange RX/TX data from/to the PHY. In addition,
there is an programming interface, which can be controlled either by the host or the PSM to configure and control
the PHY.
IEEE 802.11ac PHY
The BCM43455 WLAN Digital PHY is designed to comply with IEEE 802.11ac and IEEE 802.11a/b/g/n singlestream specifications to provide wireless LAN connectivity supporting data rates from 1 Mbps to 433.3 Mbps for
low-power, high-performance handheld applications.
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BCM43455 Preliminary Data Sheet
IEEE 802.11ac PHY
The PHY has been designed to work in the presence of interference, radio nonlinearity, and various other
impairments. It incorporates optimized implementations of the filters, FFT and Viterbi decoder algorithms.
Efficient algorithms have been designed to achieve maximum throughput and reliability, including algorithms for
carrier sense/rejection, frequency/phase/timing acquisition and tracking, channel estimation and tracking. The
PHY receiver also contains a robust IEEE 802.11b demodulator. The PHY carrier sense has been tuned to
provide high throughput for IEEE 802.11g/11b hybrid networks with Bluetooth coexistence. It has also been
designed for shared single antenna systems between WL and BT to support simultaneous RX-RX.
The key PHY features include:
•
Programmable data rates from MCS0–MCS9 in 20, 40, and 80 MHz channels, as specified in
IEEE 802.11ac.
•
Supports Optional Short GI and Green Field modes in TX and RX.
•
TX and RX LDPC for improved range and power efficiency.
•
All scrambling, encoding, forward error correction, and modulation in the transmit direction and inverse
operations in the receive direction.
•
Supports IEEE 802.11h/k for worldwide operation.
•
Advanced algorithms for low power, enhanced sensitivity, range, and reliability.
•
Algorithms to improve performance in presence of Bluetooth.
•
Automatic gain control scheme for blocking and non blocking application scenario for cellular applications.
•
Closed loop transmit power control.
•
Digital RF chip calibration algorithms to handle CMOS RF chip non-idealities.
•
On-the-fly channel frequency and transmit power selection.
•
Supports per-packet RX antenna diversity.
•
Available per-packet channel quality and signal strength measurements.
•
Designed to meet FCC and other worldwide regulatory requirements.
Figure 29: WLAN PHY Block Diagram
Filters
and
Radio
Comp
AFE
and
Radio
Radio
Control
Block
Carrier Sense,
AGC, and Rx
FSM
TX
FSM
Common
Logic
Block
Filters
and
Radio
Comp
CCK/DSSS
Demodulate
Frequency
and Timing
Synch
OFDM
Demodulate
Buffers
Viterbi Decoder
Descramble
and Deframe
FFT/IFFT
MAC
Interface
Modulation
and Coding
Frame and
Scramble
PA Comp
Modulate/
Spread
COEX
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 77
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN Radio Subsystem
Section 12: WLAN Radio Subsystem
The BCM43455 includes an integrated dual-band WLAN RF transceiver that has been optimized for use in
2.4 GHz and 5 GHz Wireless LAN systems. It has been designed to provide low-power, low-cost, and robust
communications for applications operating in the globally available 2.4 GHz unlicensed ISM or 5 GHz U-NII
bands. The transmit and receive sections include all on-chip filtering, mixing, and gain control functions.
Ten RF control signals are available to drive external RF switches and support optional external power amplifiers
and low-noise amplifiers for each band. See the reference board schematics for further details.
A block diagram of the radio subsystem is shown in Figure 30 on page 79. Note that integrated on-chip baluns
(not shown) convert the fully differential transmit and receive paths to single-ended signal pins.
Receiver Path
The BCM43455 has a wide dynamic range, direct conversion receiver that employs high order on-chip channel
filtering to ensure reliable operation in the noisy 2.4 GHz ISM band or the entire 5 GHz U-NII band. An on-chip
low-noise amplifier (LNA) in the 2.4 GHz path is shared between the Bluetooth and WLAN receivers, while the
5 GHz receive path has a dedicated on-chip LNA. Control signals are available that can support the use of
optional LNAs for each band, which can increase the receive sensitivity by several dB.
Transmit Path
Baseband data is modulated and upconverted to the 2.4 GHz ISM or 5-GHz U-NII bands, respectively. Linear
on-chip power amplifiers are included, which are capable of delivering high output powers while
meeting IEEE 802.11ac and IEEE 802.11a/b/g/n specifications without the need for external PAs. When using
the internal PAs, closed-loop output power control is completely integrated. As an option, external PAs can be
used for even higher output power, in which case the closed-loop output power control is provided by means of
a-band and g-band TSSI inputs from external power detectors.
Calibration
The BCM43455 features dynamic and automatic on-chip calibration to continually compensate for temperature
and process variations across components. These calibration routines are performed periodically in the course
of normal radio operation. Examples of some of the automatic calibration algorithms are baseband filter
calibration for optimum transmit and receive performance, and LOFT calibration for carrier leakage reduction.
In addition, I/Q Calibration, R Calibration, and VCO Calibration are performed on-chip. No per-board calibration
is required in manufacturing test, which helps to minimize the test time and cost in large volume production.
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 78
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Calibration
Figure 30: Radio Functional Block Diagram
WL DAC
WL PA
WL PGA
WL TXLPF
WL TX G-Mixer
WL DAC
WL A-PA WL A-PAD WL A-PGA
WL TXLPF
WL TX A-Mixer
WLAN BB
WL ADC
WL A-LNA11 WL A-LNA12
Voltage
Regulators
WL RXLPF
WL RX A-Mixer
WL ADC
SLNA
WL G-LNA12
WL RXLPF
WL RX G-Mixer
WL ATX
WL ARX
WL GTX
WL GRX
Gm
BT LNA GM
WL
LOGEN
CLB
WL PLL
Shared XO
BT RX
BT TX
BT
LOGEN
BT PLL
LPO/Ext LPO/RCAL
BT ADC
BT RXLPF
BT ADC
BT LNA Load
BT PA
BT RX Mixer BT RXLPF
BT BB
BT
BT DAC
BT DAC
BT TX Mixer
BT TXLPF
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Ball Map and Pin Descriptions
Section 13: Ball Map and Pin Descriptions
Ball Map
Figure 31: 140-Ball WLBGA Map—Bottom View (Balls Facing Up)
11
A
10
9
8
7
PCIE_TDN PCIE_RDN PCIE_RDP SDIO_CLK
6
5
4
3
2
1
SDIO_DAT LDO_VDDB
LDO_VDD1 SR_VDDBA
VOUT_3P3
SR_PVSS
A_3
AT5V
P5
T5V
A
B
PCIE_RXT
PCIE_REF
PCIE_CLK SDIO_DAT SDIO_DAT VOUT_BTL VOUT_LNL VOUT_CLD VOUT_PCI
PCIE_TDP X_AVDD1P
CLKP
REQ_L
A_1
A_2
DO2P5
DO
O
ELDO
2
SR_VLX
B
C
PCIE_REF PCIE_PLL_
PCIE_VSS
CLKN
AVDD1P2
GPIO_0
C
D
GPIO_13
E
NC2
GPIO_14
NC1
VDDC
SDIO_DAT
SDIO_CMD
A_0
VSSC
PERST_L
PCI_PME_
VDDIO_SD
L
VDDIO
AVSS_BBP AVDD_BBP
LL
LL
NC3
VDDIO_RF
GPIO_2
GPIO_1
GPIO_3
GPIO_6
D
GPIO_4
GPIO_5
VDDC
GPIO_7
E
VSSC
GPIO_9
GPIO_10
BT_VDDC
LPO_IN
F
GPIO_8
BT_VDDO
BT_PCM_S
YNC
VSSC
BT_PCM_I
N
G
NC
BT_PCM_O
BT_PCM_C
BT_I2S_DO
UT
LK
H
RF_SWCT
JTAG_SEL
RL_8
F
RF_SW_CT RF_SW_CT
RL_0
RL_1
G
WRF_XTAL WRF_XTAL RF_SW_CT RF_SW_CT RF_SWCT RF_SWCT
_XON
_GND1P2
RL_2
RL_3
RL_5
RL_6
H
WRF_SYN
WRF_XTAL WRF_XTAL WRF_XTAL
TH_VDD3P
_XOP
_VDD1P35 _VDD1P2
3
J
WRF_SYN
WRF_PMU
WRF_SYN WRF_VCO BT_GPIO_ BT_UART_
TH_VDD1P
_VDD1P35
TH_GND
_GND
2
CTS_N
2
VDDC
BT_VDDC
BT_I2S_CL
BT_I2S_W
BT_I2S_DI
K
S
J
K
WRF_RX5 WRF_AFE_ WRF_GEN WRF_EXT_
G_GND
VDD1P35 ERAL_GND
TSSIA
VSSC
BT_GPIO_ BT_UART_ BT_UART_ BT_UART_
5
RTS_N
TXD
RXD
K
L
WRF_GEN
WRF_RFIN
WRF_AFE_ WRF_GPAI BT_LNAVD
BT_PLLVS BT_CLK_R BT_HOST_
BT_IFVSS
ERAL2_GN
_5G
GND
O_OUT
D1P2
S
EQ
WAKE
D
M
WRF_PAO WRF_PA_ WRF_TXMI WRF_RX2 BT_LNAVS
BT_PLLVD FM_PLLVS
FM_PLLVD BT_DEV_W
BT_PAVSS
FM_RFVSS
UT_5G
GND3P3
X_VDD
G_GND
S
D1P2
S
D1P2
AKE
M
N
WRF_PA_V
DD3P3
N
11
VSSC
RF_SWCT RF_SWCT
RL_4
RL_7
WL_REG_ BT_REG_O
PMU_AVSS
ON
N
VDDC
WRF_PAO WRF_RFIN
UT_2G
_2G
10
9
8
BT_GPIO_ BT_GPIO_
3
4
GPIO_15
BT_RF
7
GPIO_16
VSSC
BT_VDDC
BT_PAVDD BT_IFVDD1
FM_RFVDD
FM_RFIN
FM_AOUT2 FM_AOUT1
2P5
P2
1P2
6
5
Broadcom®
November 5, 2015 • 43455-DS109-R
4
3
2
L
1
Page 80
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Pin List by Pin Number
Pin List by Pin Number
Table 17 lists BCM43455 pins by pin number. For a list of BCM43455 pins by pin name, see Table 18 on
page 83.
Table 17: WLBGA Pin List by Pin Number
Table 17: WLBGA Pin List by Pin Number (Cont.)
Ball
Name
Ball
Name
A1
SR_PVSS
D1
GPIO_6
A2
SR_VDDBAT5V
D2
GPIO_3
A3
LDO_VDD1P5
D3
GPIO_1
A4
VOUT_3P3
D4
GPIO_2
A5
LDO_VDDBAT5V
D5
VDDIO
A6
SDIO_DATA_3
D6
VDDIO_SD
A7
SDIO_CLK
D7
PCI_PME_L
A8
PCIE_RDP
D8
PERST_L
A9
PCIE_RDN
D9
NC1
A10
PCIE_TDN
D10
GPIO_14
A11
–
D11
GPIO_13
B1
SR_VLX
E1
GPIO_7
B2
VOUT_PCIELDO
E2
VDDC
B3
VOUT_CLDO
E3
GPIO_5
B4
VOUT_LNLDO
E4
GPIO_4
B5
VOUT_BTLDO2P5
E5
JTAG_SEL
B6
SDIO_DATA_2
E6
RF_SW_CTRL_8
B7
SDIO_DATA_1
E7
VDDIO_RF
B8
PCIE_CLKREQ_L
E8
NC3
B9
PCIE_RXTX_AVDD1P2
E9
AVDD_BBPLL
B10
PCIE_TDP
E10
AVSS_BBPLL
B11
PCIE_REFCLKP
C1
GPIO_0
C2
PMU_AVSS
C3
BT_REG_ON
C4
WL_REG_ON
C5
VSSC
C6
SDIO_CMD
C7
SDIO_DATA_0
C8
VDDC
C9
PCIE_VSS
C10
PCIE_PLL_AVDD1P2
C11
PCIE_REFCLKN
E11
NC2
F1
LPO_IN
F2
BT_VDDC
F3
GPIO_10
F4
GPIO_9
F5
VSSC
F6
RF_SW_CTRL_7
F7
RF_SW_CTRL_4
F8
VDDC
F9
VSSC
F10
RF_SW_CTRL_1
F11
RF_SW_CTRL_0
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 81
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Pin List by Pin Number
Table 17: WLBGA Pin List by Pin Number (Cont.)
Table 17: WLBGA Pin List by Pin Number (Cont.)
Ball
Name
Ball
Name
G1
BT_PCM_IN
K7
GPIO_15
G2
VSSC
K8
WRF_EXT_TSSIA
G3
BT_PCM_SYNC
K9
WRF_GENERAL_GND
G4
BT_VDDO
K10
WRF_AFE_VDD1P35
G5
GPIO_8
K11
WRF_RX5G_GND
G6
RF_SW_CTRL_6
L1
BT_VDDC
G7
RF_SW_CTRL_5
L2
VSSC
G8
RF_SW_CTRL_3
L3
BT_HOST_WAKE
G9
RF_SW_CTRL_2
L4
BT_CLK_REQ
G10
WRF_XTAL_GND1P2
L5
BT_PLLVSS
G11
WRF_XTAL_XON
L6
BT_IFVSS
H1
BT_PCM_CLK
L7
BT_LNAVDD1P2
H2
BT_I2S_DO
L8
WRF_GPAIO_OUT
H3
BT_PCM_OUT
L9
WRF_AFE_GND
H4
NC
L10
WRF_GENERAL2_GND
H5
BT_GPIO_4
L11
WRF_RFIN_5G
H6
BT_GPIO_3
M1
BT_DEV_WAKE
H7
–
M2
FM_PLLVDD1P2
H8
WRF_SYNTH_VDD3P3
M3
FM_RFVSS
H9
WRF_XTAL_VDD1P2
M4
FM_PLLVSS
H10
WRF_XTAL_VDD1P35
M5
BT_PLLVDD1P2
H11
WRF_XTAL_XOP
M6
BT_PAVSS
J1
BT_I2S_CLK
M7
BT_LNAVSS
J2
BT_I2S_DI
M8
WRF_RX2G_GND
J3
BT_I2S_WS
M9
WRF_TXMIX_VDD
J4
BT_VDDC
M10
WRF_PA_GND3P3
J5
VDDC
M11
WRF_PAOUT_5G
J6
BT_UART_CTS_N
N1
FM_AOUT1
J7
BT_GPIO_2
N2
FM_AOUT2
J8
WRF_VCO_GND
N3
FM_RFVDD1P2
J9
WRF_SYNTH_GND
N4
FM_RFIN
J10
WRF_SYNTH_VDD1P2
N5
BT_IFVDD1P2
J11
WRF_PMU_VDD1P35
N6
BT_PAVDD2P5
K1
BT_UART_RXD
N7
BT_RF
K2
BT_UART_TXD
N8
WRF_RFIN_2G
K3
BT_UART_RTS_N
N9
WRF_PAOUT_2G
K4
BT_GPIO_5
N10
–
K5
VSSC
N11
WRF_PA_VDD3P3
K6
GPIO_16
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 82
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Pin List by Pin Name
Pin List by Pin Name
Table 18 lists BCM43455 pins by pin name. For a list of BCM43455 pins by pin number, see Table 17 on
page 81.
Table 18: WLBGA Pin List by Pin Name
Table 18: WLBGA Pin List by Pin Name (Cont.)
Name
Ball
Name
Ball
AVDD_BBPLL
E9
BT_VDDC
L1
AVSS_BBPLL
E10
BT_VDDO
G4
BT_CLK_REQ
L4
FM_AOUT1
N1
BT_DEV_WAKE
M1
FM_AOUT2
N2
BT_GPIO_2
J7
FM_PLLVDD1P2
M2
BT_GPIO_3
H6
FM_PLLVSS
M4
BT_GPIO_4
H5
FM_RFIN
N4
BT_GPIO_5
K4
FM_RFVDD1P2
N3
BT_HOST_WAKE
L3
FM_RFVSS
M3
BT_I2S_CLK
J1
GPIO_0
C1
BT_I2S_DI
J2
GPIO_1
D3
BT_I2S_DO
H2
GPIO_2
D4
BT_I2S_WS
J3
GPIO_3
D2
BT_IFVDD1P2
N5
GPIO_4
E4
BT_IFVSS
L6
GPIO_5
E3
BT_LNAVDD1P2
L7
GPIO_6
D1
BT_LNAVSS
M7
GPIO_7
E1
BT_PAVDD2P5
N6
GPIO_8
G5
BT_PAVSS
M6
GPIO_9
F4
BT_PCM_CLK
H1
GPIO_10
F3
BT_PCM_IN
G1
GPIO_13
D11
BT_PCM_OUT
H3
GPIO_14
D10
BT_PCM_SYNC
G3
GPIO_15
K7
BT_PLLVDD1P2
M5
GPIO_16
K6
BT_PLLVSS
L5
JTAG_SEL
E5
BT_REG_ON
C3
LDO_VDD1P5
A3
BT_RF
N7
LDO_VDDBAT5V
A5
BT_UART_CTS_N
J6
LPO_IN
F1
BT_UART_RTS_N
K3
NC
H4
BT_UART_RXD
K1
NC1
D9
BT_UART_TXD
K2
NC2
E11
BT_VDDC
F2
NC3
E8
BT_VDDC
J4
PCIE_CLKREQ_L
B8
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 83
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Pin List by Pin Name
Table 18: WLBGA Pin List by Pin Name (Cont.)
Table 18: WLBGA Pin List by Pin Name (Cont.)
Name
Ball
Name
Ball
PCIE_PLL_AVDD1P2
C10
VOUT_CLDO
B3
PCIE_RDN
A9
VOUT_LNLDO
B4
PCIE_RDP
A8
VOUT_PCIELDO
B2
PCIE_REFCLKN
C11
VSSC
C5
PCIE_REFCLKP
B11
VSSC
F5
PCIE_RXTX_AVDD1P2
B9
VSSC
F9
PCIE_TDN
A10
VSSC
G2
PCIE_TDP
B10
VSSC
K5
PCIE_VSS
C9
VSSC
L2
PCI_PME_L
D7
WL_REG_ON
C4
PERST_L
D8
WRF_AFE_GND
L9
PMU_AVSS
C2
WRF_AFE_VDD1P35
K10
RF_SW_CTRL_0
F11
WRF_EXT_TSSIA
K8
RF_SW_CTRL_1
F10
WRF_GENERAL2_GND
L10
RF_SW_CTRL_2
G9
WRF_GENERAL_GND
K9
RF_SW_CTRL_3
G8
WRF_GPAIO_OUT
L8
RF_SW_CTRL_4
F7
WRF_PAOUT_2G
N9
RF_SW_CTRL_5
G7
WRF_PAOUT_5G
M11
RF_SW_CTRL_6
G6
WRF_PA_GND3P3
M10
RF_SW_CTRL_7
F6
WRF_PA_VDD3P3
N11
RF_SW_CTRL_8
E6
WRF_PMU_VDD1P35
J11
SDIO_CLK
A7
WRF_RFIN_2G
N8
SDIO_CMD
C6
WRF_RFIN_5G
L11
SDIO_DATA_0
C7
WRF_RX2G_GND
M8
SDIO_DATA_1
B7
WRF_RX5G_GND
K11
SDIO_DATA_2
B6
WRF_SYNTH_GND
J9
SDIO_DATA_3
A6
WRF_SYNTH_VDD1P2
J10
SR_PVSS
A1
WRF_SYNTH_VDD3P3
H8
SR_VDDBAT5V
A2
WRF_TXMIX_VDD
M9
SR_VLX
B1
WRF_VCO_GND
J8
VDDC
C8
WRF_XTAL_GND1P2
G10
VDDC
E2
WRF_XTAL_VDD1P2
H9
VDDC
F8
WRF_XTAL_VDD1P35
H10
VDDC
J5
WRF_XTAL_XON
G11
VDDIO
D5
WRF_XTAL_XOP
H11
VDDIO_RF
E7
–
A11
VDDIO_SD
D6
–
H7
VOUT_3P3
A4
–
N10
VOUT_BTLDO2P5
B5
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 84
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Pin Descriptions
Pin Descriptions
The signal name, type, and description of each pin in the BCM43455 is listed in Table 19. The symbols shown
under Type indicate pin directions (I/O = bidirectional, I = input, O = output) and the internal pull-up/pull-down
characteristics (PU = weak internal pull-up resistor and PD = weak internal pull-down resistor), if any.
Table 19: Signal Descriptions
Signal Name
WLBGA Ball
Type
Description
I
2.4 GHz Bluetooth and WLAN receiver
shared input.
WLAN and Bluetooth Receive RF Signal Interface
WRF_RFIN_2G
N8
WRF_RFIN_5G
L11
I
5 GHz WLAN receiver input.
WRF_PAOUT_2G
N9
O
2.4 GHz WLAN PA output.
WRF_PAOUT_5G
M11
O
5 GHz WLAN PA output.
WRF_EXT_TSSIA
K8
I
5 GHz TSSI input from an optional
external power amplifier/power detector.
WRF_GPAIO_OUT
L8
I/O
GPIO or 2.4 GHz TSSI input from an
optional external power amplifier/power
detector.
RF_SW_CTRL_0
F11
O
RF_SW_CTRL_1
F10
O
RF_SW_CTRL_2
G9
O
Programmable RF switch control lines.
The control lines are programmable via
the driver and NVRAM file.
RF Switch Control Lines
RF_SW_CTRL_3
G8
O
RF_SW_CTRL_4
F7
O
RF_SW_CTRL_5
G7
O
RF_SW_CTRL_6
G6
O
RF_SW_CTRL_7
F6
O
RF_SW_CTRL_8
E6
O
WLAN PCI Express Interface
PCIE_CLKREQ_L
B8
OD
PCIe clock request signal which
indicates when the REFCLK to the PCIe
interface can be gated.
1 = the clock can be gated.
0 = the clock is required.
PERST_L
D8
I (PU)
PCIe System Reset. This input is the
PCIe reset as defined in the PCIe Base
Specification Version 1.1.
PCIE_RDN
A9
I
Receiver differential pair (×1 lane).
PCIE_RDP
A8
I
PCIE_REFCLKN
C11
I
PCIE_REFCLKP
B11
I
PCIe differential clock inputs (negative
and positive), 100 MHz differential.
PCIE_TDN
A10
O
Transmitter differential pair (×1 lane).
PCIE_TDP
B10
O
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Pin Descriptions
Table 19: Signal Descriptions (Cont.)
Signal Name
WLBGA Ball
Type
Description
PCI_PME_L
D7
OD
PCI power management event output.
Used to request a change in the device
or system power state. The assertion
and deassertion of this signal is
asynchronous to the PCIe reference
clock. This signal has an open-drain
output structure, as per the PCI Bus
Local Bus Specification, Revision 2.3.
WLAN SDIO Bus Interface
Note: These signals can also have alternate functionality depending on package and host interface mode.
SDIO_CLK
A7
I
SDIO clock input.
SDIO_CMD
C6
I/O
SDIO command line.
SDIO_DATA_0
C7
I/O
SDIO data line 0.
SDIO_DATA_1
B7
I/O
SDIO data line 1.
SDIO_DATA_2
B6
I/O
SDIO data line 2.
SDIO_DATA_3
A6
I/O
SDIO data line 3.
WLAN GPIO Interface
Note: The GPIO signals can be multiplexed via software and the JTAG_SEL pin to behave as various specific
functions.
GPIO_0
C1
I/O
GPIO_1
D3
I/O
GPIO_2
D4
I/O
GPIO_3
D2
I/O
GPIO_4
E4
I/O
GPIO_5
E3
I/O
GPIO_6
D1
I/O
GPIO_7
E1
I/O
GPIO_8
G5
I/O
GPIO_9
F4
I/O
GPIO_10
F3
I/O
GPIO_13
D11
I/O
GPIO_14
D10
I/O
GPIO_15
K7
I/O
GPIO_16
K6
I/O
Programmable GPIO pins:
GPIO_2 is TCK/SWCLK if
JTAG_SEL = 1
GPIO_3 is TMS/SWDIO if
JTAG_SEL = 1
GPIO_4 is TDIO if JTAG_SEL = 1
GPIO_5 is TDO if JTAG_SEL = 1
GPIO_6 is TRST_L if JTAG_SEL = 1
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Pin Descriptions
Table 19: Signal Descriptions (Cont.)
Signal Name
WLBGA Ball
Type
Description
E5
I/O
JTAG select. This pin must be
connected to ground if the
JTAG/SWD interface is not used. It must
be high to select
SWD OR JTAG. When JTAG_SEL = 1:
• GPIO_2 is TCK/SWCLK
• GPIO_3 is TMS/SWDIO
• GPIO_4 is TDIO
• GPIO_5 is TDO
• GPIO_6 is TRST_L
WRF_XTAL_XOP
H11
I
XTAL oscillator input.
WRF_XTAL_XON
G11
O
XTAL oscillator output.
JTAG/SWD Interface
JTAG_SEL
Clocks
LPO_IN
F1
I
External sleep clock input (32.768 kHz).
BT_CLK_REQ
L4
O
Reference clock request (shared by BT
and WLAN).
Bluetooth/FM Transceiver
BT_RF
N7
O
Bluetooth PA output.
FM_RFIN
N4
I
FM radio antenna port.
FM_AOUT1
N1
O
FM DAC output 1.
FM_AOUT2
N2
O
FM DAC output 2.
BT_PCM_CLK
H1
I/O
PCM or SLIMbus clock; can be master
(output) or slave (input).
BT_PCM_IN
G1
I
PCM data input or SLIMbus transport
sensing.
BT_PCM_OUT
H3
O
PCM data output.
BT_PCM_SYNC
G3
I/O
PCM sync; can be master (output) or
slave (input), or SLIMbus data.
BT_UART_CTS_N
J6
I
UART clear-to-send. Active-low clear-tosend signal for the HCI UART interface.
BT_UART_RTS_N
K3
O
UART request-to-send. Active-low
request-to-send signal for the HCI UART
interface. BT LED control pin.
BT_UART_RXD
K1
I
UART serial input. Serial data input for
the HCI UART interface. BT RF disable
pin 2.
BT_UART_TXD
K2
O
UART serial output. Serial data output
for the HCI UART interface.
Bluetooth PCM
Bluetooth UART
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
Pin Descriptions
Table 19: Signal Descriptions (Cont.)
Signal Name
WLBGA Ball
Type
Description
BT_I2S_CLK
J1
I/O
I2S clock, can be master (output) or
slave (input).
BT_I2S_DI
J2
I/O
I2S data input.
BT_I2S_DO
H2
I/O
I2S data output.
BT_I2S_WS
J3
I/O
I2S WS; can be master (output) or slave
(input).
Bluetooth/FM I2S
Bluetooth GPIO
BT_GPIO_2
J7
I/O
Bluetooth general-purpose I/O.
BT_GPIO_3
H6
I/O
Bluetooth general-purpose I/O.
BT_GPIO_4
H5
I/O
Bluetooth general-purpose I/O.
BT_GPIO_5
K4
I/O
Bluetooth general-purpose I/O.
WL_REG_ON
C4
I
Used by PMU to power-up or power
down the internal BCM43455 regulators
used by the WLAN section. Also, when
deasserted, this pin holds the WLAN
section in reset. This pin has an internal
200 kΩ pull-down resistor that is
enabled by default. It can be disabled
through programming.
BT_REG_ON
C3
I
Used by PMU to power-up or power
down the internal BCM43455 regulators
used by the Bluetooth/FM section. Also,
when deasserted, this pin holds the
Bluetooth/FM section in reset. This pin
has an internal 200 kΩ pull-down
resistor that is enabled by default. It can
be disabled through programming.
BT_DEV_WAKE
M1
I/O
Bluetooth DEV_WAKE.
BT_HOST_WAKE
L3
I/O
Bluetooth HOST_WAKE.
Miscellaneous
Integrated Voltage Regulators
SR_VDDBAT5V
A2
I
VBAT.
SR_VLX
B1
O
CBUCK switching regulator output.
Refer to Table 44 on page 130 for details
of the inductor and capacitor required on
this output.
LDO_VDD1P5
A3
I
LNLDO input.
LDO_VDDBAT5V
A5
I
LDO VBAT.
WRF_XTAL_VDD1P35
H10
I
XTAL LDO input (1.35V).
WRF_XTAL_VDD1P2
H9
O
XTAL LDO output (1.2V).
VOUT_LNLDO
B4
O
Output of LNLDO.
VOUT_CLDO
B3
O
Output of core LDO.
VOUT_BTLDO2P5
B5
O
Output of BT LDO.
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Pin Descriptions
Table 19: Signal Descriptions (Cont.)
Signal Name
WLBGA Ball
Type
Description
VOUT_3P3
A4
O
LDO 3.3V output.
BT_PAVDD2P5
N6
PWR
Bluetooth PA power supply.
BT_LNAVDD1P2
L7
PWR
Bluetooth LNA power supply.
BT_IFVDD1P2
N5
PWR
Bluetooth IF block power supply.
BT_PLLVDD1P2
M5
PWR
Bluetooth RF PLL power supply.
FM_RFVDD1P2
N3
PWR
FM RF power supply.
FM_PLLVDD1P2
M2
PWR
FM PLL power supply.
WRF_SYNTH_VDD3P3
H8
PWR
Synthesizer VDD 3.3V supply.
WRF_PA_VDD3P3
N11
PWR
2 GHz and 5 GHz PA 3.3V VBAT supply.
WRF_PMU_VDD1P35
J11
PWR
PMU 1.35V supply.
WRF_TXMIX_VDD
M9
PWR
3.3V supply for the TX Mix.
WRF_SYNTH_VDD1P2
J10
PWR
1.2V supply for the synthesizer.
WRF_AFE_VDD1P35
K10
PWR
1.35V supply for the AFE.
Bluetooth Supplies
FM Transceiver Supplies
WLAN Supplies
Miscellaneous Supplies
VDDC
C8, E2, F8, J5
PWR
1.2V core supply for the WLAN.
VDDIO
D5
PWR
1.8V–3.3V VDDIO supply for the WLAN.
Must be directly connected to
PMU_VDDO and BT_VDDO on the
PCB.
BT_VDDC
F2, J4, L1
PWR
1.2V core supply for the BT.
BT_VDDO
G4
PWR
1.8V–3.3V VDDIO supply for the BT.
Must be directly connected to
PMU_VDDO and VDDIO on the PCB.
VDDIO_SD
D6
PWR
1.8V–3.3V supply for the SDIO pads.
VDDIO_RF
E7
PWR
IO supply for the RF switch control pads
(3.3V).
AVDD_BBPLL
E9
PWR
1.2V supply for the baseband PLL.
PCIE_PLL_AVDD1P2
C10
PWR
1.2V supply for the PCIe PLL.
VOUT_PCIELDO
B2
PWR
1.2V supply for the PCIe.
PCIE_RXTX_AVDD1P2
B9
PWR
1.2V supply for the PCIe TX/RX.
WRF_VCO_GND
J8
GND
VCO/LOGEN ground.
WRF_AFE_GND
L9
GND
AFE ground.
WRF_XTAL_GND1P2
G10
GND
XTAL ground.
WRF_RX2G_GND
M8
GND
RX 2 GHz ground.
WRF_RX5G_GND
K11
GND
RX 5 GHz ground.
WRF_PA_GND3P3
M10
GND
PA ground.
WRF_GENERAL_GND
K9
GND
General ground.
Ground
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Pin Descriptions
Table 19: Signal Descriptions (Cont.)
Signal Name
WLBGA Ball
Type
Description
WRF_GENERAL2_GND
L10
GND
General ground.
WRF_SYNTH_GND
J9
GND
Ground.
VSSC
C5, F5, F9,
G2, K5, L2
GND
Core ground for WLAN and BT.
SR_PVSS
A1
GND
Power ground.
PMU_AVSS
C2
GND
Quiet ground.
BT_PAVSS
M6
GND
Bluetooth PA ground.
BT_LNAVSS
M7
GND
Bluetooth LNA ground.
BT_IFVSS
L6
GND
Bluetooth IF block ground.
BT_PLLVSS
L5
GND
Bluetooth PLL ground.
FM_PLLVSS
M4
GND
FM PLL ground.
FM_RFVSS
M3
GND
FM RF ground.
AVSS_BBPLL
E10
GND
Baseband PLL ground.
PCIE_VSS
C9
GND
PCIe ground.
NC1
D9
–
No connect.
NC2
E11
No Connect
NC3
E8
NC
H4
–
No connect.
A11, H7, N10
–
–
Depopulated Pins
–
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN GPIO Signals and Strapping Options
WLAN GPIO Signals and Strapping Options
This section describes WLAN GPIO signals and strapping options. The pins are sampled at power-on reset
(POR) to determine the various operating modes. Sampling occurs a few milliseconds after an internal POR or
deassertion of the external POR. After the POR, each pin assumes the GPIO or alternative function specified
in the signal descriptions table. Each strapping option pin has an internal pull-up (PU) or pull-down (PD) resistor
that determines the default mode. To change the mode, connect an external PU resistor to VDDIO or a PD
resistor to GND, using a 10 kΩ resistor or less.
Note: Refer to the reference board schematics for more information.
Table 20: Strapping Options
Pin Name
Strap
WLBGA
Ball
GPIO_7
sdio_padvddio
E1
Default Internal
Pull During
Strap
Description
1
Default pull = 1.
SDIO interface voltage.
1 = 1.8V,
0 = 3.3V.
Default is 1.8V.
GPIO_16
host_iface_sdio
K6
0
Broadcom®
November 5, 2015 • 43455-DS109-R
Default is PCIe. Pull high during
POR to select SDIO.
Page 91
BROADCOM CONFIDENTIAL
WLAN GPIO Signals and Strapping Options
BCM43455 Preliminary Data Sheet
Multiplexed Bluetooth GPIO Signals
The Bluetooth GPIO pins (BT_GPIO_0 to BT_GPIO_7) are multiplexed pins and can be programmed to be used as GPIOs or for other Bluetooth interface
signals such as I2S. The specific function for a given BT_GPIO_X pin is chosen by programming the Pad Function Control register for that specific pin.
Table 21 shows the possible options for each BT_GPIO_X pin. Note that each BT_GPIO_X pin's Pad Function Control register setting is independent
(BT_GPIO_5 can be set to pad function 7 at the same time that BT_GPIO_3 is set to pad function 0). When the Pad Function Control register is set to
0, the BT_GPIOs do not have specific functions assigned to them and behave as generic GPIOs. The A_GPIO_X pins described below are multiplexed
behind the BCM43455's PCM and I2S interface pins.
Table 21: GPIO Multiplexing Matrix
Pad Function Control Register Setting
Pin Name
0
1
2
3
4
5
6
7
15
BT_UART_CTS_N
UART_CTS_N
–
–
–
–
–
–
A_GPIO[1]
–
BT_UART_RTS_N
UART_RTS_N
–
–
–
–
–
–
A_GPIO[0]
–
BT_UART_RXD
UART_RXD
–
–
–
–
–
–
GPIO[5]
–
BT_UART_TXD
UART_TXD
–
–
–
–
–
–
GPIO[4]
–
BT_PCM_IN
A_GPIO[3]
PCM_IN
PCM_IN
HCLK
–
–
–
I2S_SSDI/MSDI
SF_MISO
BT_PCM_OUT
A_GPIO[2]
PCM_OUT
PCM_OUT
LINK_IND
–
I2S_MSDO
–
I2S_SSDO
SF_MOSI
BT_PCM_SYNC
A_GPIO[1]
PCM_SYNC
PCM_SYNC
HCLK
–
I2S_MWS
–
I2S_SWS
SF_SPI_CSN
BT_PCM_CLK
A_GPIO[0]
PCM_CLK
PCM_CLK
–
–
I2S_MSCK
–
I2S_SSCK
SF_SPI_CLK
BT_I2S_DO
A_GPIO[5]
PCM_OUT
–
–
I2S_SSDO
I2S_MSDO
–
STATUS
–
BT_I2S_DI
A_GPIO[6]
PCM_IN
–
HCLK
I2S_SSDI/MSDI –
–
TX_CON_FX
–
BT_I2S_WS
GPIO[7]
PCM_SYNC
–
LINK_IND
–
I2S_MWS
–
I2S_SWS
–
BT_I2S_CLK
GPIO[6]
PCM_CLK
–
–
INT_LPO
I2S_MSCK
–
I2S_SSCK
–
BT_GPIO_5
GPIO[5]
HCLK
–
I2S_MSCK
I2S_SSCK
–
–
CLK_REQ
–
BT_GPIO_4
GPIO[4]
LINK_IND
–
I2S_MSDO
I2S_SSDO
–
–
–
–
BT_GPIO_3
GPIO[3]
–
–
I2S_MWS
I2S_SWS
–
–
–
–
BT_GPIO_2
GPIO[2]
–
–
–
I2S_SSDI/MSDI –
–
–
–
BT_CLK_REQ
WL/BT_CLK_REQ
–
–
–
–
–
A_GPIO[7]
–
Broadcom®
November 5, 2015 • 43455-DS109-R
–
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN GPIO Signals and Strapping Options
The multiplexed GPIO signals are described in Table 22.
Table 22: Multiplexed GPIO Signals
Pin Name
Type
Description
UART_CTS_N
I
Host UART clear to send.
UART_RTS_N
O
Device UART request to send.
UART_RXD
I
Device UART receive data.
UART_TXD
O
Host UART transmit data.
PCM_IN
I
PCM data input.
PCM_OUT
O
PCM data output.
PCM_SYNC
I/O
PCM sync signal, can be master (output) or slave (input).
PCM_CLK
I/O
PCM clock, can be master (output) or slave (input).
GPIO[7:0]
I/O
General-purpose I/O.
A_GPIO[7:0]
I/O
A group general-purpose I/O.
I2S_MSDO
O
I2S master data output.
I2S_MWS
O
I2S master word select.
I2S_MSCK
O
I2S master clock.
I2S_SSCK
I
I2S slave clock.
I2S_SSDO
O
I2S slave data output.
I2S_SWS
I
I2S slave word select.
I2S_SSDI/MSDI
I
I2S slave/master data input.
STATUS
O
Signals Bluetooth priority status.
TX_CON_FX
I
WLAN-BT coexist. Transmission confirmation; permission for BT to transmit.
RF_ACTIVE
O
WLAN-BT coexist. Asserted (logic high) during local BT RX and TX slots.
LINK_IND
O
BT receiver/transmitter link indicator.
CLK_REQ
O
WLAN/BT clock request output.
SF_SPI_CLK
O
SFlash SCLK: serial clock (output from master).
SF_MISO
I
SFlash MISO; SOMI: master input, slave output (output from slave).
SF_MOSI
O
SFlash MOSI; SIMO: master output, slave input (output from master).
SF_SPI_CSN
O
SFlash SS: slave select (active low, output from master).
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
I/O States
BCM43455 Preliminary Data Sheet
I/O States
The following notations are used in Table 23:
•
I: Input signal
•
O: Output signal
•
I/O: Input/Output signal
•
PU = Pulled up
•
PD = Pulled down
•
NoPull = Neither pulled up nor pulled down
Table 23: I/O States
Power-downb
Low Power State/Sleep (BT_REG_ON and
(All Power Present)
WL_REG_ON Held Low)
Out-of-Reset;
Before SW Download
(BT_REG_ON High;
WL_REG_ON High)
(WL_REG_ON High and
BT_REG_ON = 0) and
VDDIOs Are Present
Power Rail
Name
I/O
Keepera Active Mode
WL_REG_ON
I
N
Input; PD (pull-down can Input; PD (pull-down can Input; PD (of 200K)
be disabled)
be disabled)
Input; PD (of 200K)
Input; PD (of 200K)
–
BT_REG_ON
I
N
Input; PD (pull down can Input; PD (pull down can Input; PD (of 200K)
be disabled)
be disabled)
Input; PD (of 200K)
Input; PD (of 200K)
–
BT_CLK_REQ
I/O
Y
Open drain or push-pull Open drain or push-pull High-Z, NoPull
(programmable). Active (programmable). Active
high.
high
Open drain. Active high
Open drain. Active high.
BT_VDDO
BT_HOST_WAKE I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable) NoPull (programmable)
Input, PU
Input, PD
BT_VDDO
BT_DEV_WAKE
I/O
Y
Input/Output; PU, PD,
Input; PU, PD, NoPull
NoPull (programmable) (programmable)
High-Z, NoPull
Input, PD
Input, PD
BT_VDDO
BT_GPIO_2,
BT_GPIO_3
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable) NoPull (programmable)
Input, PD
Input, PD
BT_VDDO
BT_GPIO_4,
BT_GPIO_5
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable) NoPull (programmable)
Input, PU
Input, PU
BT_VDDO
BT_UART_CTS_N I
Y
Input; NoPull
Input; NoPull
High-Z, NoPull
Input; PU
Input; PU
BT_VDDO
BT_UART_RTS_N O
Y
Output; NoPull
Output; NoPull
High-Z, NoPull
Input; PU
Input; PU
BT_VDDO
BT_UART_RXD
I
Y
Input; PU
Input; NoPull
High-Z, NoPull
Input; PU
Input; PU
BT_VDDO
BT_UART_TXD
O
Y
Output; NoPull
Output; NoPull
High-Z, NoPull
Input; PU
Input; PU
BT_VDDO
SDIO_DATA[0:3]
I/O
N
Input/Output; PU (SDIO Input; PU (SDIO Mode) High-Z, NoPull
Mode)
Input; PU (SDIO Mode)
Input; PU (SDIO Mode)
WL_VDDIO
Broadcom®
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BROADCOM CONFIDENTIAL
I/O States
BCM43455 Preliminary Data Sheet
Table 23: I/O States (Cont.)
Power-downb
Low Power State/Sleep (BT_REG_ON and
(All Power Present)
WL_REG_ON Held Low)
Out-of-Reset;
Before SW Download
(BT_REG_ON High;
WL_REG_ON High)
(WL_REG_ON High and
BT_REG_ON = 0) and
VDDIOs Are Present
Power Rail
Name
I/O
Keepera Active Mode
SDIO_CMD
I/O
N
Input/Output; PU (SDIO Input; PU (SDIO Mode) High-Z, NoPull
Mode)
Input; PU (SDIO Mode)
Input; PU (SDIO Mode)
WL_VDDIO
SDIO_CLK
I
N
Input; NoPull
Input; noPull
High-Z, NoPull
Input; noPull
Input; noPull
WL_VDDIO
Input; NoPull
c
High-Z, NoPull
Input, PD
Input, PD
BT_VDDO
Input; NoPull
c
High-Z, NoPull
Input, PD
Input, PD
BT_VDDO
BT_PCM_CLK
I/O
Y
Input; NoPull
c
BT_PCM_IN
I/O
Y
Input; NoPull
c
BT_PCM_OUT
I/O
Y
Input; NoPullc
Input; NoPullc
High-Z, NoPull
Input, PD
Input, PD
BT_VDDO
BT_PCM_SYNC
I/O
Y
Input; NoPull c
Input; NoPullc
High-Z, NoPull
Input, PD
Input, PD
BT_VDDO
BT_I2S_WS
I/O
Y
Input;
NoPulld
Input;
NoPulld
High-Z, NoPull
Input, PD
Input, PD
BT_VDDO
BT_I2S_CLK
I/O
Y
Input;
NoPulld
Input;
NoPulld
High-Z, NoPull
Input, PD
Input, PD
BT_VDDO
BT_I2S_DI
I/O
Y
Input; NoPull
d
High-Z, NoPull
Input, PD
Input, PD
BT_VDDO
BT_I2S_DO
I/O
Y
Input; NoPulld
Input; NoPulld
High-Z, NoPull
Input, PD
Input, PD
BT_VDDO
GPIO_0
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: PD])
[Default: PD])
Input; PD
Input; PD
WL_VDDIO
GPIO_1
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_2
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_3
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: PD])
[Default: PD])
Input; PD
Input; PD
WL_VDDIO
GPIO_4
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_5
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: PD])
[Default: PD])
Input; PD
Input; PD
WL_VDDIO
GPIO_6
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_7
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
d
Input; NoPull
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
I/O States
BCM43455 Preliminary Data Sheet
Table 23: I/O States (Cont.)
Power-downb
Low Power State/Sleep (BT_REG_ON and
(All Power Present)
WL_REG_ON Held Low)
Out-of-Reset;
Before SW Download
(BT_REG_ON High;
WL_REG_ON High)
(WL_REG_ON High and
BT_REG_ON = 0) and
VDDIOs Are Present
Power Rail
Name
I/O
Keepera Active Mode
GPIO_8
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: PD])e
[Default: PD])e
Input; PDe
Input; PDe
WL_VDDIO
GPIO_9
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: PD])
[Default: PD])
Input; PD
Input; PD
WL_VDDIO
GPIO_10
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_13
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_14
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_15
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
GPIO_16
I/O
Y
Input/Output; PU, PD,
Input/Output; PU, PD,
High-Z, NoPull
NoPull (programmable NoPull (programmable
[Default: NoPull])
[Default: NoPull])
Input; NoPull
Input; NoPull
WL_VDDIO
RF_SW_CTRL
[0:8]
I/O
Y
Output; NoPull
Output; NoPull
Output; NoPull
VDDIO_RF
Output; NoPull
High-Z
a. Keeper column: N = pad has no keeper. Y = pad has a keeper. Keeper is always active except in power-down state. If there is no keeper, and it is an input
and there is NoPull, then the pad should be driven to prevent leakage due to floating pad (SDIO_CLK, for example).
b. In the power-down state (xx_REG_ON=0): High-Z; NoPull => the pad is disabled because power is not supplied.
c. Depending on whether the PCM interface is enabled and the configuration of PCM is in master or slave mode, it can be either output or input.
d. Depending on whether the I2S interface is enabled and the configuration of I2S is in master or slave mode, it can be either output or input.
e. NoPull when in SDIO mode.
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 96
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
DC Characteristics
S e c t i o n 1 4 : D C C h a r a c t e ri s t i c s
Note: Values in this data sheet are design goals and are subject to change based on the results of
device characterization.
Absolute Maximum Ratings
Caution! The absolute maximum ratings in Table 24 indicate levels where permanent damage to the
device can occur, even if these limits are exceeded for only a brief duration. Functional operation is
not guaranteed under these conditions. Operation at absolute maximum conditions for extended
periods can adversely affect long-term reliability of the device.
Table 24: Absolute Maximum Ratings
Rating
Symbol
Value
Unit
DC supply for the VBAT and PA driver supply
VBAT
–0.5 to +6.0
V
DC supply voltage for digital I/O
VDDIO
–0.5 to 3.9
V
DC supply voltage for RF switch I/Os
VDDIO_RF
–0.5 to 3.9
V
DC input supply voltage for CLDO and LNLDO
–
–0.5 to 1.575
V
DC supply voltage for RF analog
VDDRF
–0.5 to 1.32
V
DC supply voltage for core
VDDC
–0.5 to 1.32
V
–
–0.5 to 3.63
V
Vundershoot
–0.5
V
Maximum overshoot voltage for I/Oa
Vovershoot
VDDIO + 0.5
V
Maximum junction temperature
Tj
125
°C
WRF_TCXO_VDD
Maximum undershoot voltage for I/O
a
a. Duration not to exceed 25% of the duty cycle.
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 97
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Environmental Ratings
Environmental Ratings
The environmental ratings are shown in Table 25.
Table 25: Environmental Ratings
Characteristic
Value
Units
Conditions/Comments
Ambient Temperature (TA)
–30 to +85
°C
Functional operationa
Storage Temperature
–40 to +125
°C
–
Relative Humidity
Less than 60
%
Storage
Less than 85
%
Operation
a. Functionality is guaranteed across this ambient temperature range. Optimal RF performance specified in the
data sheet, however, is guaranteed only for –20°C to 75°C.
Electrostatic Discharge Specifications
Extreme caution must be exercised to prevent electrostatic discharge (ESD) damage. Proper use of wrist and
heel grounding straps to discharge static electricity is required when handling these devices. Always store
unused material in its antistatic packaging.
Table 26: ESD Specifications
Minimum
ESD Rating Unit
Pin Type
Symbol
Condition
ESD
Handling Reference:
NQY00083, Section 3.4,
Group D9, Table B
ESD_HAND_HBM
Human body model contact discharge
per JEDEC EID/JESD22-A114
1
kV
CDM
ESD_HAND_CDM
Charged device model contact
discharge per JEDEC EIA/JESD22C101
250
V
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 98
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Recommended Operating Conditions and DC Characteristics
Recommended Operating Conditions and DC Characteristics
Caution! Functional operation is not guaranteed outside of the limits shown in Table 27. Operation
outside these limits for extended periods can adversely affect long-term reliability of the device.
Note: For DC absolute maximum rating (AMR), see Table 24 on page 97.
Table 27: Recommended Operating Conditions and DC Characteristics
Value
Parameter
Symbol
Minimum
Typical
Maximum
Unit
DC supply voltage for VBAT
VBAT
–
VDD
VDDRF
WRF_TCXO_VDD
VDDIO
VDDIO_RF
TSSI
Vth_POR
1.2
1.2
1.8
–
3.3
–
–
5.25 b
1.26
1.26
1.98
3.63
3.46
0.95
0.7
V
DC supply voltage for core
DC supply voltage for RF blocks in chip
DC supply voltage for TCXO input buffer
DC supply voltage for digital I/O
DC supply voltage for RF switch I/Os
External TSSI input
Internal POR threshold
3.0a
1.14
1.14
1.62
1.62
3.13
0.15
0.4
V
V
V
V
V
V
V
VIH
VIL
VOH
VOL
0.65 × VDDIO
–
VDDIO – 0.45
–
–
–
–
–
–
0.35 × VDDIO
–
0.45
V
V
V
V
VIH
VIL
VOH
VOL
2.00
–
VDDIO – 0.4
–
–
–
–
–
–
0.80
–
0.40
V
V
V
V
VOH
VOL
COUT
VDDIO – 0.4
–
–
–
–
–
–
0.40
5
V
V
pF
Other Digital I/O Pins
For VDDIO = 1.8V:
Input high voltage
Input low voltage
Output high voltage @ 2 mA
Output low voltage @ 2 mA
For VDDIO = 3.3V:
Input high voltage
Input low voltage
Output high voltage @ 2 mA
Output low Voltage @ 2 mA
RF Switch Control Output Pinsc
For VDDIO_RF = 3.3V:
Output high voltage @ 2 mA
Output low voltage @ 2 mA
Output capacitance
a. The BCM43455 is functional across this range of voltages. Optimal RF performance specified in the data sheet,
however, is guaranteed only for 3.2V < VBAT < 4.8V.
b. The maximum continuous voltage is 5.25V.
c. Programmable 2 mA to 16 mA drive strength. Default is 10 mA.
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 99
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Bluetooth RF Specifications
S e c t i on 1 5 : B l u e t o o th R F S p e c i f i c a t i o n s
Note: Values in this data sheet are design goals and are subject to change based on device
characterization results.
Unless otherwise stated, limit values apply for the conditions specified in Table 25: “Environmental Ratings,” on
page 98 and Table 27: “Recommended Operating Conditions and DC Characteristics,” on page 99. Typical
values apply for the following conditions:
•
VBAT = 3.6V
•
Ambient temperature +25°C
Figure 32: Port Locations for Bluetooth Testing
2.4G Configured with iTR
2.4G Configured with eTR
BT
PA
BT
PA
2G
PA
Chip
Port
RF Port
Optional Filter
Optional
Filter
Diplexer
Chip
Port
LNA
2G
RF Port
Chip
Port
Chip
Port
LNA
2G
Antenna
Port
Antenna
Port
Chip
Port
Diplexer
2G
PA
Chip
Port
5G
PA
RF Port
LNA
5G
Chip
Port
Chip
Port
5G
PA
LNA
5G
Note: All Bluetooth specifications are measured at the chip port, unless otherwise defined.
Note: The specifications in Table 28 on page 101 are measured at the chip port input, unless
otherwise defined.
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 100
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Bluetooth RF Specifications
Table 28: Bluetooth Receiver RF Specifications
Parameter
Conditions
Minimum
–
2402
Typical
Maximum Unit
General
Frequency range
–
2480
MHz
GFSK, 0.1% BER, 1 Mbps –
–93.5
–
dBm
/4-DQPSK, 0.01% BER,
2 Mbps
–
–95.5
–
dBm
8-DPSK, 0.01% BER,
3 Mbps
–
–89.5
–
dBm
Input IP3
–
–16
–
–
dBm
Maximum input at RF port
–
–
–
–20
dBm
–
–
–
–90
dBm
C/I co-channel
GFSK, 0.1% BER
–
–
11
dB
C/I 1 MHz adjacent channel
GFSK, 0.1% BER
–
–
0
dB
C/I 2 MHz adjacent channel
GFSK, 0.1% BER
–
–
–30
dB
C/I  3 MHz adjacent channel GFSK, 0.1% BER
–
–
–40
dB
C/I image channel
GFSK, 0.1% BER
–
–
–9
dB
C/I 1-MHz adjacent to image
channel
GFSK, 0.1% BER
–
–
–20
dB
C/I co-channel
/4-DQPSK, 0.1% BER
–
–
13
dB
C/I 1 MHz adjacent channel
/4-DQPSK, 0.1% BER
–
–
0
dB
C/I 2 MHz adjacent channel
/4-DQPSK, 0.1% BER
–
–
–30
dB
C/I  3 MHz adjacent channel /4-DQPSK, 0.1% BER
–
–
–40
dB
C/I image channel
/4-DQPSK, 0.1% BER
–
–
–7
dB
C/I 1 MHz adjacent to image
channel
/4-DQPSK, 0.1% BER
–
–
–20
dB
C/I co-channel
8-DPSK, 0.1% BER
–
–
21
dB
C/I 1 MHz adjacent channel
8-DPSK, 0.1% BER
–
–
5
dB
C/I 2 MHz adjacent channel
RX
sensitivitya
RX LO Leakage
2.4 GHz band
Interference Performanceb
8-DPSK, 0.1% BER
–
–
–25
dB
C/I  3 MHz adjacent channel 8-DPSK, 0.1% BER
–
–
–33
dB
C/I Image channel
8-DPSK, 0.1% BER
–
–
0
dB
C/I 1 MHz adjacent to image
channel
8-DPSK, 0.1% BER
–
–
–13
dB
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 101
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Bluetooth RF Specifications
Table 28: Bluetooth Receiver RF Specifications (Cont.)
Parameter
Conditions
Minimum
Typical
Maximum Unit
Out-of-Band Blocking Performance (CW)
30–2000 MHz
0.1% BER
–
–10
–
dBm
2000–2399 MHz
0.1% BER
–
–27
–
dBm
2498–3000 MHz
0.1% BER
–
–27
–
dBm
3000 MHz–12.75 GHz
0.1% BER
–
–10
–
dBm
Out-of-Band Blocking Performance, Modulated Interferer
GFSK (1 Mbps) c
698–716 MHz
WCDMA
–
–14
–
dBm
776–849 MHz
WCDMA
–
–14
–
dBm
824–849 MHz
GSM850
–
–14
–
dBm
824–849 MHz
WCDMA
–
–14
–
dBm
880–915 MHz
E-GSM
–
–13
–
dBm
880–915 MHz
WCDMA
–
–13
–
dBm
1710–1785 MHz
GSM1800
–
–18
–
dBm
1710–1785 MHz
WCDMA
–
–17
–
dBm
1850–1910 MHz
GSM1900
–
–20
–
dBm
1850–1910 MHz
WCDMA
–
–19
–
dBm
1880–1920 MHz
TD-SCDMA
–
–20
–
dBm
1920–1980 MHz
WCDMA
–
–20
–
dBm
2010–2025 MHz
TD–SCDMA
–
–20
–
dBm
2500–2570 MHz
WCDMA
–
–23
–
dBm
2500–2570 MHz
Band 7
–
–25
–
dBm
2300–2400 MHze
Band 40
–
–35.2
–
dBm
2570–2620 MHzf
Band 38
–
–21
–
dBm
2545–2575 MHzg
XGP Band
–
–22
–
dBm
d
/4-DPSK (2 Mbps) c
698–716 MHz
WCDMA
–
–10
–
dBm
776–794 MHz
WCDMA
–
–10
–
dBm
824–849 MHz
GSM850
–
–11
–
dBm
824–849 MHz
WCDMA
–
–11
–
dBm
880–915 MHz
E-GSM
–
–10
–
dBm
880–915 MHz
WCDMA
–
–10
–
dBm
1710–1785 MHz
GSM1800
–
–16
–
dBm
1710–1785 MHz
WCDMA
–
–16
–
dBm
1850–1910 MHz
GSM1900
–
–17
–
dBm
1850–1910 MHz
WCDMA
–
–16
–
dBm
1880–1920 MHz
TD-SCDMA
–
–18
–
dBm
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 102
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Bluetooth RF Specifications
Table 28: Bluetooth Receiver RF Specifications (Cont.)
Parameter
Conditions
Minimum
Typical
Maximum Unit
1920–1980 MHz
WCDMA
–
–17
–
dBm
2010–2025 MHz
TD-SCDMA
–
–19
–
dBm
2500–2570 MHz
WCDMA
–
–23
–
dBm
2500–2570 MHzd
Band 7
–
–24.4
–
dBm
2300–2400 MHze
Band 40
–
–36.5
–
dBm
2570–2620 MHzf
Band 38
–
–21
–
dBm
2545–2575 MHzg
XGP Band
–
–22
–
dBm
8-DPSK (3 Mbps) c
698-716 MHz
WCDMA
–
–13
–
dBm
776-794 MHz
WCDMA
–
–13
–
dBm
824-849 MHz
GSM850
–
–13
–
dBm
824-849 MHz
WCDMA
–
–14
–
dBm
880-915 MHz
E-GSM
–
–13
–
dBm
880-915 MHz
WCDMA
–
–13
–
dBm
1710-1785 MHz
GSM1800
–
–18
–
dBm
1710-1785 MHz
WCDMA
–
–17
–
dBm
1850-1910 MHz
GSM1900
–
–19
–
dBm
1850-1910 MHz
WCDMA
–
–19
–
dBm
1880-1920 MHz
TD-SCDMA
–
–19
–
dBm
1920-1980 MHz
WCDMA
–
–19
–
dBm
2010-2025 MHz
TD-SCDMA
–
–20
–
dBm
2500-2570 MHz
WCDMA
–
–23
–
dBm
2500–2570 MHzd
Band 7
–
–24.7
–
dBm
2300–2400 MHze
Band 40
–
–36.7
–
dBm
2570–2620 MHzf
Band 38
–
–21
–
dBm
2545–2575 MHzg
XGP Band
–
–22
–
dBm
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 103
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Bluetooth RF Specifications
Table 28: Bluetooth Receiver RF Specifications (Cont.)
Parameter
Conditions
Minimum
Typical
Maximum Unit
30 MHz–1 GHz
–
–95
–62
dBm
1–12.75 GHz
–
–70
–47
dBm
851–894 MHz
–
–147
–
dBm/Hz
925–960 MHz
–
–147
–
dBm/Hz
1805–1880 MHz
–
–147
–
dBm/Hz
1930–1990 MHz
–
–147
–
dBm/Hz
2110–2170 MHz
–
–147
–
dBm/Hz
Spurious Emissions
a. Dirty TX is off.
b. The maximum value represents the actual Bluetooth specification required for Bluetooth qualification as defined
in the version 4.1 specification.
c. 3 dB receiver desense.
d. 2560 MHz performance is used.
e. 2360 MHz performance is used.
f. 2580 MHz performance is used.
g. 2555 MHz performance is used.
Table 29: Bluetooth Transmitter RF Specifications
Parameter
Conditions
Minimum Typical Maximum Unit
Note: The specifications in this table are measured at the Bluetooth chip port output, unless otherwise defined.
General
Frequency range
2402
–
2480
MHz
Basic rate (GFSK) TX power at Bluetooth
–
12
–
dBm
QPSK TX Power at Bluetooth
–
8
–
dBm
8PSK TX Power at Bluetooth
–
8
–
dBm
2
4
8
dB
–
0.93
1
MHz
M – N = the frequency range for –
which the spurious emission is –
measured relative to the
–
transmit center frequency.
–38
–26
dBc
Power control step
–
Note: Output power is with TCA and TSSI enabled.
GFSK In-Band Spurious Emissions
–20 dBc BW
–
EDR In-Band Spurious Emissions
1.0 MHz < |M – N| < 1.5 MHz
1.5 MHz < |M – N| < 2.5 MHz
|M – N|  2.5
MHza
Broadcom®
November 5, 2015 • 43455-DS109-R
–31
–20
dBm
–43
–40
dBm
Page 104
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Bluetooth RF Specifications
Table 29: Bluetooth Transmitter RF Specifications (Cont.)
Parameter
Conditions
Minimum Typical Maximum Unit
Out-of-Band Spurious Emissions
30 MHz to 1 GHz
–
–
–
–36 b, c
dBm
1 GHz to 12.75 GHz
–
–
–
–30 b, d, e
dBm
1.8 GHz to 1.9 GHz
–
–
–
–47
dBm
5.15 GHz to 5.3 GHz
–
–
–
–47
dBm
–
–
–103
–
dBm
FM RX
–
–147
–
dBm/Hz
776–794 MHz
CDMA2000
–
–146
–
dBm/Hz
869–960 MHz
cdmaOne, GSM850
–
–146
–
dBm/Hz
925–960 MHz
E-GSM
–
–146
–
dBm/Hz
1570–1580 MHz
GPS
–
–146
–
dBm/Hz
1805–1880 MHz
GSM1800
–
–144
–
dBm/Hz
1930–1990 MHz
GSM1900, cdmaOne, WCDMA –
–143
–
dBm/Hz
2110–2170 MHz
WCDMA
–
–137
–
dBm/Hz
2500–2570 MHz
Band 7
–
–130
–
dBm/Hz
2300–2400 MHz
Band 40
–
–130
–
dBm/Hz
2570–2620 MHz
Band 38
–
–132
–
dBm/Hz
2545–2575 MHz
XGP Band
–
–135
–
dBm/Hz
GPS Band Spurious Emissions
Spurious emissions
Out-of-Band Noise Floor f
65–108 MHz
a.
b.
c.
d.
e.
f.
The typical number is measured at ± 3 MHz offset.
The maximum value represents the value required for Bluetooth qualification as defined in the v4.1 specification.
The spurious emissions during Idle mode are the same as specified in Table 29 on page 104.
Specified at the Bluetooth Antenna port.
Meets this specification using a front-end band-pass filter.
Transmitted power in cellular and FM bands at the antenna port. See Figure 32 on page 100 for location of the
port.
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 105
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Bluetooth RF Specifications
Table 30: Local Oscillator Performance
Parameter
Minimum
Typical
Maximum Unit
LO Performance
Lock time
–
72
–
s
Initial carrier frequency tolerance
–
±25
±75
kHz
DH1 packet
–
±8
±25
kHz
DH3 packet
–
±8
±40
kHz
DH5 packet
–
±8
±40
kHz
Drift rate
–
5
20
kHz/50 µs
00001111 sequence in payloada
140
155
175
kHz
10101010 sequence in payloadb
115
140
–
kHz
Channel spacing
–
1
–
MHz
Frequency Drift
Frequency Deviation
a. This pattern represents an average deviation in payload.
b. Pattern represents the maximum deviation in payload for 99.9% of all frequency deviations.
Table 31: BLE RF Specifications
Parameter
Conditions
Minimum
Typical
Maximum Unit
Frequency range
–
2402
–
2480
MHz
GFSK, 0.1% BER, 1 Mbps
–
–96.5
–
dBm
–
–
8.5
–
dBm
Mod Char: delta F1 average –
225
255
275
kHz
Mod Char: delta F2 max.c
–
230
–
–
%
Mod Char: ratio
–
0.8
1
–
%
RX
sensea
TX powerb
a. Dirty TX is Off.
b. The BLE TX power cannot exceed 10 dBm EIRP specification limit. The front-end losses and antenna gain/loss
must be factored in so as not to exceed the limit.
c. At least 99.9% of all delta F2 max. frequency values recorded over 10 packets must be greater than 185 kHz.
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 106
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
FM Receiver Specifications
Section 16: FM Receiver Specifications
Unless otherwise stated, limit values apply for the conditions specified in Table 25: “Environmental Ratings,” on
page 98 and Table 27: “Recommended Operating Conditions and DC Characteristics,” on page 99. Typical
values apply for the following conditions:
•
VBAT = 3.6V
•
Ambient temperature +25°C
Table 32: FM Receiver Specifications
Conditionsa
Minimum Typical Maximum Units
Operating frequencyb
Frequencies inclusive
65
–
108
MHz
Sensitivityc
FM only
SNR > 26 dB
–
–1
–
dBμV EMF
–
0.9
–
μV EMF
–
–7
–
dBμV
–
dB
Parameter
RF Parameters
Receiver adjacent
channel selectivityc, d
Measured for 30 dB SNR at the audio output with best tune.
Signal of interest: 23 dBμV EMF (14.1 μV EMF),
At ± 200 kHz.
–
51
At ± 400 kHz
–
62
–
dB
Intermediate signal plus
noise-to-noise ratio
(S+N)/Nc
Vin = 20 dBμV EMF (10 μV EMF)
45
53
–
dB
Intermodulation
performancec, d
Blocker level increased until desired at –
30 dB SNR
Wanted Signal: 33 dBμV EMF (45 μV
EMF)
Modulated Interferer: At fWanted
+ 400 kHz and +4 MHz
CW Interferer: At fWanted + 800 kHz and
+ 8 MHz
55
–
dBc
AM suppression, monoc
Vin = 23 dBμV EMF (14.1 μV EMF)
AM at 400 Hz with m = 0.3
No A-weighted or any other filtering
applied.
40
–
–
dB
RDS deviation = 1.2 kHz
–
16
–
dBμV EMF
–
6.3
–
μV EMF
RDS
RDS Sensitivity e, f
RDS deviation = 2 kHz
–
10
–
dBμV
–
12
–
dBμV EMF
–
4
–
μV EMF
–
6
–
dBμV
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 107
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
FM Receiver Specifications
Table 32: FM Receiver Specifications (Cont.)
Parameter
Conditionsa
RDS selectivityf
Wanted Signal: 33 dBμV EMF (45 μV EMF), 2 kHz RDS deviation with best tune
Interferer: ∆f = 40 kHz, fmod = 1 kHz
Minimum Typical Maximum Units
± 200 kHz
–
49
–
dB
± 300 kHz
–
52
–
dB
± 400 kHz
–
52
–
dB
–
1.5
–
–
kΩ
Antenna tuning capacitor –
2.5
–
30
pF
–
–
113
dBμV EMF
–
–
446
mV EMF
–
–
107
dBμV
RF conducted emissions Local oscillator breakthrough measured –
on the reference port
–
–55
dBm
–
–
–90
dBm
GSM850, E-GSM (std), BW = 0.2 MHz, –
824–849 MHz
880–915 MHz
5
–
dBm
–
–4
–
dBm
GSM DCS 1800, PCS 1900 (std/edge), –
BW = 0.2 MHz,
1710–1785 MHz
1850–1910 MHz
12
–
dBm
–
12
–
dBm
RF input impedance
c
Maximum input level
SNR > 26 dB
869–894 MHz, 925–960 MHz,
1805–1880 MHz, 1930–1990 MHz.
GPS
RF blocking levels at the
FM antenna input 40 dB
SNR (assumes a 50Ω at
the radio input and
excludes spurs)
GSM850, E-GSM (edge),
BW = 0.2 MHz,
824–849 MHz
880–915 MHz
WCDMA: II(I), III (IV, X),
BW = 5 MHz,
1850–1980 MHz (1920–1980 MHz),
1710–1785 MHz (1710–1755 MHz,
1710–1770 MHz)
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 108
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
FM Receiver Specifications
Table 32: FM Receiver Specifications (Cont.)
Parameter
Conditionsa
Minimum Typical Maximum Units
–
WCDMA: V(VI), VIII, XII, XIII, XIV,
BW = 5 MHz,
824–849 MHz (830–840 MHz),
880–915 MHz
–
1
–
dBm
CDMA2000, cdmaOne,
BW = 1.25 MHz,
824–849 MHz,
887–925 MHz,
776–794 MHz
–
–3
–
dBm
CDMA2000, cdmaOne,
BW = 1.25 MHz,
1850–1910 MHz,
1750–1780 MHz,
1920–1980 MHz
–
12
–
dBm
Bluetooth, BW = 1 MHz,
2402–2480 MHz
–
11
–
dBm
IEEE 802.11g/b, BW = 20 MHz,
2400–2483.5 MHz
–
11
–
dBm
IEEE 802.11a, BW = 20 MHz,
4915–5825 MHz
–
6
–
dBm
2500–2570 MHz
Band 7
–
11
–
dBm
2300–2400 MHz
Band 40
–
11
–
dBm
2570–2620 MHz
Band 38
–
11
–
dBm
2545–2575 MHz
XGP Band
–
11
–
dBm
Frequency step
–
10
–
–
kHz
Settling time
Single-frequency switch in any direction –
to a frequency within the bands 88–
108 MHz or 76–90 MHz. Time
measured to within 5 kHz of the final
frequency.
150
–
μs
Search time
–
Total time for an automatic search to
sweep from 88–108 MHz or 76–90 MHz
(and reverse direction) assuming no
channels are found.
–
8
sec
Audio output levelg
–
–14.5
–
–12.5
dBFS
Maximum audio output
levelh
–
–
–
0
dBFS
72
–
88
mVrms
Tuning
General Audio
Audio DAC output levelg –
Maximum DAC audio
output levelh
–
–
333
–
mVrms
Audio DAC output level
differencei
–
–1
–
1
dB
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 109
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
FM Receiver Specifications
Table 32: FM Receiver Specifications (Cont.)
Parameter
Conditionsa
Minimum Typical Maximum Units
Left and right AC mute
FM input signal fully muted with DAC
enabled
60
–
–
dB
Left and right hard mute
FM input signal fully muted with DAC
disabled
80
–
–
dB
–
Soft mute attenuation and Muting is performed dynamically
start level
proportional to the FM wanted input
signal C/N. The muting characteristic is
fully programmable. Refer to “Audio
Features” on page 62 for further details.
–
–
–
Maximum signal plus
noise-to-noise ratio
(S + N)/N, mono i
–
–
68
–
dB
Maximum signal plus
noise-to-noise ratio
(S + N) ÷ N, stereog
–
–
64
–
dB
–
–
1.5
%
∆f = 75 kHz, fmod = 1 kHz
–
–
–60
%
∆f = 75 kHz, fmod = 3 kHz
–
–
0.8
%
∆f = 100 kHz, fmod = 1 kHz
–
–
1.0
%
Total harmonic distortion, Vin = 66 dBμV EMF (2 mV EMF)
stereo
∆f = 67.5 kHz, fmod = 1 kHz, ∆f
Pilot = 7.5 kHz, L = R
–
–
1.5
%
Audio spurious productsi Range from 300 Hz to 15 kHz, with
respect to 1 kHz tone
–
–
–60
dBc
Audio bandwidth, upper
(–3 dB point)
15
–
–
kHz
–
–
20
Hz
Total harmonic distortion, Vin = 66 dBμV EMF (2 mV EMF),
mono
∆f = 75 kHz, fmod = 400 Hz
Vin = 66 dBμV EMF (2 mV EMF)
∆f = 8 kHz, for 50 μs
Audio bandwidth, lower
(–3 dB point)
Audio in-band ripple
100 Hz to 13 kHz,
Vin = 66 dBμV EMF (2 mV EMF)
∆f = 8 kHz, for 50 μs
–0.5
–
0.5
dB
De-emphasis time
constant tolerance
With respect to 50 and 75 μs
–
–
±5
%
RSSI range
With 1 dB resolution and ± 5 dB
accuracy at room temp
3
–
83
dBμV EMF
1.41
–
1.41E + 04 μV EMF
–3
–
77
dBμV
–
48
–
dB
Stereo Decoder
Stereo channel
separation
Forced Stereo mode
Vin = 66 dBμV EMF (2 mV EMF),
∆f = 67.5 kHz, fmod = 1 kHz,
∆f Pilot = 6.75 kHz
R = 0, L = 1
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 110
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
FM Receiver Specifications
Table 32: FM Receiver Specifications (Cont.)
Parameter
Conditionsa
Mono stereo blend and
switching
Blending and switching is dynamically –
proportional to the FM wanted input
signal C/N. The blending and switching
characteristics are fully programmable.
Refer to “Audio Features” on page 62
for further details.
Pilot suppression
Vin = 66 dBμV EMF (2 mV EMF),
∆f = 75 kHz, fmod = 1 kHz
46
–
–
–
–
–
dB
Audio level at which a
pause is detected
Relative to 1 kHz tone, ∆f = 22.5 kHz
–
–
–
–
Four values in 3 dB steps
–21
–
–12
dB
Audio pause duration
Four values
20
–
40
ms
Minimum Typical Maximum Units
Pause detection
a. Following conditions are applied to all relevant tests unless otherwise indicated: Pre-emphasis and de-emphasis
of 50 us, R = L for mono, DAC Load > 20 kΩ, BAF = 300 Hz to 15 kHz, and A-weighted filtering applied.
b. Contact Broadcom regarding applications that operate between 65 and 76 MHz.
c. Wanted Signal: ∆f = 22.5 kHz, and fmod = 1 kHz.
d. Interferer: ∆f = 22.5 kHz, and fmod = 1 kHz.
e. RDS sensitivity numbers are for 87.5–108 MHz only.
f. Vin = ∆f = 32 kHz, fmod = 1 kHz, ∆f Pilot = 7.5 kHz, and 95% of blocks decoded with no errors after correction
g. Vin = 66 dBμV EMF (2 mV EMF), ∆f = 22.5 kHz, fmod = 1 kHz, and ∆f Pilot = 6.75 kHz.
h. Vin = 66 dBμV EMF (2 mV EMF), ∆f = 100 kHz, fmod = 1 kHz, and ∆f Pilot = 6.75 kHz.
i. Vin = 66 dBμV EMF (2 mV EMF), ∆f = 22.5 kHz, and fmod = 1 kHz.
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 111
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN RF Specifications
Section 17: WLAN RF Specifications
Introduction
The BCM43455 includes an integrated dual-band direct conversion radio that supports the 2.4 GHz and the
5 GHz bands. This section describes the RF characteristics of the 2.4 GHz and 5 GHz radio.
Note: Values in this section of the data sheet are design goals and are subject to change based on device
characterization results.
Unless otherwise stated, limit values apply for the conditions specified in Table 25: “Environmental Ratings,” on
page 98 and Table 27: “Recommended Operating Conditions and DC Characteristics,” on page 99. Typical
values apply for the following conditions:
•
VBAT = 3.6V
•
Ambient temperature +25°C
Figure 33: Port Locations for WLAN Testing
2.4G Configured with iTR
2.4G Configured with eTR
BT
PA
BT
PA
2G
PA
Chip
Port
RF Port
Optional Filter
Optional
Filter
Diplexer
Chip
Port
LNA
2G
RF Port
Chip
Port
Chip
Port
LNA
2G
Antenna
Port
Antenna
Port
Chip
Port
Diplexer
2G
PA
Chip
Port
5G
PA
RF Port
LNA
5G
Chip
Port
Chip
Port
5G
PA
LNA
5G
Note: Unless otherwise defined, all WLAN specifications are provided at the chip port.
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
2.4 GHz Band General RF Specifications
2.4 GHz Band General RF Specifications
Table 33: 2.4 GHz Band General RF Specifications
Item
Condition
Minimum Typical
Maximum
Unit
TX/RX switch time
Including TX ramp down –
–
5
µs
RX/TX switch time
Including TX ramp up
–
–
2
µs
Power-up and power-down ramp
time
DSSS/CCK modulations –
–
<2
µs
WLAN 2.4 GHz Receiver Performance Specifications
Note: The specifications shown in the following table are provided at the chip port, unless otherwise
defined.
Table 34: WLAN 2.4 GHz Receiver Performance Specifications
Parameter
Condition/Notes
Frequency range
RX sensitivity IEEE 802.11b
(8% PER for 1024 octet
PSDU)
–
2400
1 Mbps DSSS
–
2 Mbps DSSS
–
5.5 Mbps DSSS
–
11 Mbps DSSS
–
6 Mbps OFDM
–
9 Mbps OFDM
–
12 Mbps OFDM
–
18 Mbps OFDM
–
24 Mbps OFDM
–
36 Mbps OFDM
–
48 Mbps OFDM
–
54 Mbps OFDM
–
20 MHz channel spacing for all MCS rates
MCS0
–
MCS1
–
MCS2
–
MCS3
–
MCS4
–
MCS5
–
MCS6
–
MCS7
–
RX sensitivity IEEE 802.11g
(10% PER for 1024 octet
PSDU)
RX sensitivity IEEE 802.11n
(10% PER for 4096 octet
PSDU) a Defined for default
parameters: 800 ns GI and
non-STBC.
Minimum Typical
Broadcom®
November 5, 2015 • 43455-DS109-R
Maximum Unit
–
–98.7
–96.0
–94.4
–90.7
–95.3
–94.3
–93.5
–90.9
–87.7
–84.4
–79.6
–78.2
2500
–
–
–
–
–
–
–
–
–
–
–
–
MHz
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
–94.8
–92.3
–89.8
–86.4
–83.3
–78.6
–76.7
–74.7
–
–
–
–
–
–
–
–
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
Page 113
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN 2.4 GHz Receiver Performance Specifications
Table 34: WLAN 2.4 GHz Receiver Performance Specifications (Cont.)
Parameter
Condition/Notes
Minimum Typical
RX sensitivity
20 MHz channel spacing for all MCS rates
IEEE 802.11ac
MCS0
–
(10% PER for 4096 octet
MCS1
–
PSDU) b Defined for default
MCS2
–
parameters: 800 ns GI and
MCS3
–
non-STBC
MCS4
–
MCS5
–
MCS6
–
MCS7
–
MCS8
–
20 MHz channel spacing for all MCS rates
RX sensitivity IEEE
802.11ac with LDPC (10%
MCS7
–
PER for 4096 octet PSDU)
MCS8
–
at RF port. Defined for
MCS9
–
default parameters: 800 ns
GI, LDPC coding, and nonSTBC.
Broadcom®
November 5, 2015 • 43455-DS109-R
Maximum Unit
–95.0
–92.3
–90.1
–87.0
–83.6
–78.7
–76.8
–75.9
–71.5
–
–
–
–
–
–
–
–
–
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
–77.8
–74.0
–72.0
–
–
–
dBm
dBm
dBm
Page 114
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN 2.4 GHz Receiver Performance Specifications
Table 34: WLAN 2.4 GHz Receiver Performance Specifications (Cont.)
Parameter
Condition/Notes
Minimum Typical
Maximum Unit
Blocking level for 3 dB RX
sensitivity degradation
(without external filtering)c
776–794 MHz (CDMA2000):
Blocker frequency = 794 MHz
–
–16
–
dBm
–
–11
–
dBm
–
–11
–
dBm
–
–11
–
dBm
–
–12
–
dBm
–
–13
–
dBm
–
–5
–
dBm
–
–19
–
dBm
–
–19
–
dBm
–
–
–29
–35
–
–
dBm
dBm
–
–
–39
–35
–
–
dBm
dBm
–
–35
–
dBm
–
–
–42
–17
–
–
dBm
dBm
–
–80
–33
–
–
–
dBm
dBm
–
–
–10
15
–
–
dBm
dBm
MHzd
(cdmaOne):
824–849
Blocker frequency = 849 MHz
824–849 MHz (GSM850):
Blocker frequency = 849 MHz
880–915 MHz (E-GSM):
Blocker frequency = 915 MHz
1710–1785 MHz (GSM1800):
Blocker frequency = 1785 MHz
1850–1910 MHz (GSM1900):
Blocker frequency = 1910 MHz
1850–1910 MHz (cdmaOne):
Blocker frequency = 1910 MHz
1850–1910 MHz (WCDMA):
Blocker frequency = 1910 MHz
1920–1980 MHz (WCDMA):
Blocker frequency = 1980 MHz
2300–2400 MHz (LTE band 40)
Blocker frequency = 2300 MHz
Blocker frequency = 2365 MHz
2500–2570 MHz (LTE band 7):
Blocker frequency = 2505 MHz
Blocker frequency = 2565 MHz
2570–2620 MHz (LTE band 38):
Blocker frequency = 2575 MHz
2496-2690 MHz (LTE band 41):
Blocker frequency = 2501 MHz
Blocker frequency = 2685 MHz
2545–2575 MHz (XGP Band):
Blocker frequency = 2550 MHz
In-band static CW jammer RX PER < 1%, 54 Mbps OFDM,
immunity
1000 octet PSDU for:
(fc – 8 MHz < fcw < + 8 MHz) (RxSens + 23 dB < Rxlevel < max.
input level)
Input In-Band IP3
Maximum LNA gain
Minimum LNA gain
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 115
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN 2.4 GHz Receiver Performance Specifications
Table 34: WLAN 2.4 GHz Receiver Performance Specifications (Cont.)
Parameter
Condition/Notes
Minimum Typical
Maximum Unit
Maximum Receive Level
@ 2.4 GHz
@ 1, 2 Mbps (8% PER, 1024 octets)
@ 5.5, 11 Mbps (8% PER, 1024
octets)
@ 6–54 Mbps (10% PER, 1024
octets)
@ MCS0–MCS7 rates (10% PER,
4095 octets)
@ MCS8–MCS9 rates (10% PER,
4095 octets)
–3.5
–9.5
–
–
–
–
dBm
dBm
–9.5
–
–
dBm
–9.5
–
–
dBm
–11.5
–
–
dBm
–
–
–
–
dB
dB
–
–
dB
–
–
dB
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
70
3
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
5
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
Range above –30 dBm
–8
Zo = 50Ω, across the dynamic range 10
–
11.5
8
13
dB
dB
At maximum gain
4
–
dB
Adjacent channel rejection- Desired and interfering signal 30 MHz apart
DSSS
1 Mbps DSSS –74 dBm
35
(Difference between
2 Mbps DSSS –74 dBm
35
interfering and desired
signal at 8% PER for 1024 Desired and interfering signal 25 MHz apart
octet PSDU with desired
5.5 Mbps
–70 dBm
35
signal level as specified in
DSSS
Condition/Notes)
11 Mbps
–70 dBm
35
DSSS
–79 dBm
16
Adjacent channel rejection- 6 Mbps OFDM
OFDM
9 Mbps OFDM
–78 dBm
15
(Difference between
12 Mbps OFDM –76 dBm
13
interfering and desired
18 Mbps OFDM –74 dBm
11
signal (25 MHz apart) at
24
Mbps
OFDM
–71
dBm
8
10% PER for 1024 octet
PSDU with desired signal 36 Mbps OFDM –67 dBm
4
level as specified in
48 Mbps OFDM –63 dBm
0
Condition/Notes)
54 Mbps OFDM –62 dBm
–1
–79 dBm
16
Adjacent channel rejection MCS0
MCS0–MCS9 (Difference MCS1
–76 dBm
13
between interfering and
MCS2
–74
dBm
11
desired signal (25 MHz
–71 dBm
8
apart) at 10% PER for 4096 MCS3
octet PSDU with desired
MCS4
–67 dBm
4
signal level as specified in MCS5
–63 dBm
0
Condition/Notes)
MCS6
–62 dBm
–1
MCS7
–61 dBm
–2
MCS8
–59 dBm
–4
MCS9
–57 dBm
–6
Maximum receiver gain
–
–
–
Gain control step
–
–
–
e
f
–5
RSSI accuracy
Range –95 dBm to –30 dBm
Return loss
Receiver cascaded noise
figure
–
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 116
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN 2.4 GHz Transmitter Performance Specifications
a. Sensitivity degradations for alternate settings in MCS modes. SGI: 2 dB drop.
b. Sensitivity degradations for alternate settings in MCS modes. SGI: 2 dB drop.
c. The cellular standard listed for each band indicates the type of modulation used to generate the interfering signal
in that band for the purpose of this test. It is not intended to indicate any specific usage of each band in any
specific country.
d. The blocking levels are valid for channels 1 to 11. (For higher channels, the performance may be lower due to
third harmonic signals (3 × 824 MHz) falling within band.)
e. The minimum and maximum values shown have a 95% confidence level.
f. –95 dBm with calibration at time of manufacture, –92 dBm without calibration.
WLAN 2.4 GHz Transmitter Performance Specifications
Note: Unless otherwise noted, the values shown in the following table are provided at the WLAN chip
port output.
Table 35: WLAN 2.4 GHz Transmitter Performance Specifications
Parameter
Condition/Notes
Minimum Typical
Maximum Unit
Frequency range
–
2400
–
2500
MHz
–
–164
–
dBm/Hz
–
–163
–
dBm/Hz
–
–153.6
–
dBm/Hz
–
–151.2
–
dBm/Hz
Transmitted power in
776-794 MHz (CDMA2000)
cellular and FM bands (at 869–960 MHz (cdmaOne,
+21 dBm, 100% duty cycle, GSM850)
1 Mbps CCK) a
1450–1495 (DAB)
1570–1580 MHz (GPS)
1592–1610 MHz (GLONASS)
–
–150.4
–
dBm/Hz
1710–1800 (DSC-1800-Uplink)
–
–145
–
dBm/Hz
1805–1880 MHz (GSM 1800)
–
–139
–
dBm/Hz
1850–1910 MHz (GSM 1900)
–
–139
–
dBm/Hz
1910–1930 MHz (TDSCDMA,LTE) –
–140
–
dBm/Hz
1930–1990 MHz (GSM1900,
cdmaOne, WCDMA)
–
–128
–
dBm/Hz
2010–2075 MHz (TDSCDMA)
–
–131
–
dBm/Hz
2110–2170 MHz (WCDMA)
–
–125
–
dBm/Hz
2305–2370 (LTE band 40)
–
–95
–
dBm/Hz
2370–2400 (LTE band 40)
–
–80
–
dBm/Hz
2496-2530 (LTE band 41)
–
–90
–
dBm/Hz
2530-2560 (LTE band 41)
–
–110
–
dBm/Hz
2570-2690 (LTE band 41)
–
–116
–
dBm/Hz
5000-5900 (WLAN 5G)
–
–155
–
dBm/Hz
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 117
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN 5 GHz Receiver Performance Specifications
Table 35: WLAN 2.4 GHz Transmitter Performance Specifications (Cont.)
Parameter
Condition/Notes
Minimum Typical
Maximum Unit
EVM Does Not Exceed
TX power at the chip port
for highest power level
setting at 25°C and
VBAT = 3.6V with spectral
mask and EVM compliance
Phase noise
802.11b
(DSSS/CCK)
–9 dB
–
21.5
–
dBm
OFDM, BPSK
–8 dB
–
20
–
dBm
OFDM, 64QAM
–25 dB
–
19
–
dBm
MCS7
–27 dB
–
19
–
dBm
MCS8
–30 dB
–
17
–
dBm
0.45
–
Degrees
37.4 MHz crystal, integrated from –
10 kHz to 10 MHz
TX power control dynamic –
range
10
–
–
dB
Closed-loop TX power
variation at highest
power level setting
Across full temperature and
voltage range. Applies to 10 dBm
to 20 dBm output power range.
–
–
±1.5
dB
Carrier suppression
–
15
–
–
dBc
Gain control step
–
–
0.25
–
dB
–
6
–
dB
Return loss at Chip port TX Zo = 50Ω
a. The cellular standards listed indicate only typical usages of that band in some countries. Other standards may
also be used within those bands.
WLAN 5 GHz Receiver Performance Specifications
Note: Unless otherwise noted, the values shown in the following table are provided at the chip port
input.
Table 36: WLAN 5 GHz Receiver Performance Specifications
Parameter
Condition/Notes
Minimum
Typical
Maximum
Unit
Frequency range
–
4900
–
5845
MHz
–
–94.5
–
dBm
6 Mbps OFDM
RX sensitivity a
IEEE 802.11a (10% PER 9 Mbps OFDM
for 1000 octet PSDU)
12 Mbps OFDM
–
–93.5
–
dBm
–
–92.7
–
dBm
18 Mbps OFDM
–
–90.1
–
dBm
24 Mbps OFDM
–
–86.9
–
dBm
36 Mbps OFDM
–
–83.6
–
dBm
48 Mbps OFDM
–
–78.6
–
dBm
54 Mbps OFDM
–
–77.4
–
dBm
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 118
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN 5 GHz Receiver Performance Specifications
Table 36: WLAN 5 GHz Receiver Performance Specifications (Cont.)
Parameter
Condition/Notes
RX sensitivity a
IEEE 802.11n (10% PER
for 4096 octet PSDU)
Defined for default
parameters: 800 ns GI
and non-STBC.
20 MHz channel spacing for all MCS rates
a
RX sensitivity
IEEE 802.11n (10% PER
for 4096 octet PSDU)
Defined for default
parameters: 800 ns GI
and non-STBC.
a
RX sensitivity
IEEE 802.11ac (10%
PER for 4096 octet
PSDU)
Defined for default
parameters: 800 ns GI
and non-STBC.
RX sensitivity a
IEEE 802.11ac (10%
PER for 4096 octet
PSDU)
Defined for default
parameters: 800 ns GI
and non-STBC.
Minimum
Typical
Maximum
Unit
MCS0
–
–94.0
–
dBm
MCS1
–
–91.5
–
dBm
MCS2
–
–89.0
–
dBm
MCS3
–
–85.6
–
dBm
MCS4
–
–82.5
–
dBm
MCS5
–
–77.8
–
dBm
MCS6
–
–75.9
–
dBm
MCS7
–
–73.9
–
dBm
40 MHz channel spacing for all MCS rates
MCS0
–
–92.0
–
dBm
MCS1
–
–89.0
–
dBm
MCS2
–
–86.5
–
dBm
MCS3
–
–83.2
–
dBm
MCS4
–
–79.9
–
dBm
MCS5
–
–75.3
–
dBm
MCS6
–
–73.8
–
dBm
MCS7
–
–72.2
–
dBm
20 MHz channel spacing for all MCS rates
MCS0
–
–94.2
–
dBm
MCS1
–
–91.5
–
dBm
MCS2
–
–89.3
–
dBm
MCS3
–
–86.2
–
dBm
MCS4
–
–82.8
–
dBm
MCS5
–
–77.9
–
dBm
MCS6
–
–76.0
–
dBm
MCS7
–
–75.1
–
dBm
MCS8
–
–70.7
–
dBm
40 MHz channel spacing for all MCS rates
MCS0
–
–92.3
–
dBm
MCS1
–
–89.3
–
dBm
MCS2
–
–86.9
–
dBm
MCS3
–
–83.6
–
dBm
MCS4
–
–80.2
–
dBm
MCS5
–
–75.6
–
dBm
MCS6
–
–74.0
–
dBm
MCS7
–
–72.6
–
dBm
MCS8
–
–68.3
–
dBm
MCS9
–
–66.7
–
dBm
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
WLAN 5 GHz Receiver Performance Specifications
Table 36: WLAN 5 GHz Receiver Performance Specifications (Cont.)
Parameter
Condition/Notes
RX sensitivity a
IEEE 802.11ac (10%
PER for 4096 octet
PSDU)
Defined for default
parameters: 800 ns GI
and non-STBC.
80 MHz channel spacing for all MCS rates
RX sensitivity a
IEEE 802.11ac 20/40/80
MHz channel spacing
with LDPC (10% PER for
4096 octet PSDU) at RF
port.
Defined for default
parameters: 800 ns GI,
LDPC coding and nonSTBC.
Minimum
Typical
Maximum
Unit
MCS0
–
–89.0
–
dBm
MCS1
–
–86.0
–
dBm
MCS2
–
–83.3
–
dBm
MCS3
–
–80.1
–
dBm
MCS4
–
–76.8
–
dBm
MCS5
–
–72.2
–
dBm
MCS6
–
–70.9
–
dBm
MCS7
–
–69.2
–
dBm
MCS8
–
–65.2
–
dBm
MCS9
–
–63.6
–
dBm
MCS7
20 MHz
–
–76.8
–
dBm
MCS8
20 MHz
–
–72.9
–
dBm
MCS9
20 MHz
–
–70.7
–
dBm
MCS7
40 MHz
–
–74.8
–
dBm
MCS8
40 MHz
–
–70.9
–
dBm
MCS9
40 MHz
–
–68.9
–
dBm
MCS7
80 MHz
–
–71.5
–
dBm
MCS8
80 MHz
–
–67.6
–
dBm
MCS9
80 MHz
–
–65.5
–
dBm
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
WLAN 5 GHz Receiver Performance Specifications
Table 36: WLAN 5 GHz Receiver Performance Specifications (Cont.)
Parameter
Condition/Notes
Minimum
Typical
Maximum
Unit
–21
–
dBm
–
–20
–
dBm
–
–10
–
dBm
–
–12
–
dBm
–13
–
dBm
–13
–
dBm
–18
–
dBm
–20
–
dBm
–20
–
dBm
–19
–
dBm
–16
–
dBm
–16
–
dBm
–16
–
dBm
–18
–
dBm
Blocking level for 3 dB RX 776–794 MHz (CDMA2000):
sensitivity degradation
Blocker frequency =
–
(without external
794 MHz
filtering)b
824–849 MHzc (cdmaOne):
Blocker frequency =
849 MHz
824–849 MHz (GSM850):
Blocker frequency =
849 MHz
880–915 MHz (E-GSM):
Blocker frequency =
915 MHz
1710–1785 MHz (GSM1800):
Blocker frequency =
1785 MHz
–
1850–1910 MHz (GSM1900):
Blocker frequency =
1910 MHz
–
1850–1910 MHz (cdmaOne):
Blocker frequency =
1910 MHz
–
1850–1910 MHz (WCDMA):
Blocker frequency =
1910 MHz
–
1920–1980 MHz (WCDMA):
Blocker frequency =
1980 MHz
–
2300–2400 MHz (LTE band 40)
Blocker frequency =
2395 MHz
–
2500–2570 MHz (LTE band 7):
Blocker frequency =
2565 MHz
–
2570–2620 MHz (LTE band 38):
Blocker frequency =
2615 MHz
–
2496-2690 MHz (LTE band 41):
Blocker frequency =
2685 MHz
–
2545–2575 MHz (XGP Band):
Blocker frequency =
2570 MHz
–
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
WLAN 5 GHz Receiver Performance Specifications
Table 36: WLAN 5 GHz Receiver Performance Specifications (Cont.)
Parameter
Condition/Notes
Minimum
Typical
Maximum
Unit
Input In-Band IP3
Maximum LNA gain
–
–11
–
dBm
Minimum LNA gain
–
5
–
dBm
Maximum receive level @ @ 6, 9, 12 Mbps
–9.5
5.24 GHz
@ 18, 24, 36, 48, 54 Mbps –14.5
–
–
dBm
–
–
dBm
6 Mbps
OFDM
–79 dBm
16
–
–
dB
9 Mbps
OFDM
–78 dBm
15
–
–
dB
12 Mbps
OFDM
–76 dBm
13
–
–
dB
18 Mbps
OFDM
–74 dBm
11
–
–
dB
24 Mbps
OFDM
–71 dBm
8
–
–
dB
36 Mbps
OFDM
–67 dBm
4
–
–
dB
48 Mbps
OFDM
–63 dBm
0
–
–
dB
54 Mbps
OFDM
–62 dBm
–1
–
–
dB
65 Mbps
OFDM
–61 dBm
–2
–
–
dB
6 Mbps
OFDM
–78.5 dBm
32
–
–
dB
9 Mbps
OFDM
–77.5 dBm
31
–
–
dB
12 Mbps
OFDM
–75.5 dBm
29
–
–
dB
18 Mbps
OFDM
–73.5 dBm
27
–
–
dB
24 Mbps
OFDM
–70.5 dBm
24
–
–
dB
36 Mbps
OFDM
–66.5 dBm
20
–
–
dB
48 Mbps
OFDM
–62.5 dBm
16
–
–
dB
54 Mbps
OFDM
–61.5 dBm
15
–
–
dB
65 Mbps
OFDM
–60.5 dBm
14
–
–
dB
Adjacent channel
rejection
(Difference between
interfering and desired
signal (20 MHz apart) at
10% PER for 1000 octet
PSDU with desired signal
level as specified in
Condition/Notes)
Alternate adjacent
channel rejection
(Difference between
interfering and desired
signal (40 MHz apart) at
10% PER for 1000d octet
PSDU with desired signal
level as specified in
Condition/Notes)
Maximum receiver gain
–
–
65
–
dB
Gain control step
–
–
3
–
dB
Broadcom®
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN 5 GHz Receiver Performance Specifications
Table 36: WLAN 5 GHz Receiver Performance Specifications (Cont.)
Parameter
Condition/Notes
Minimum
Typical
Maximum
Unit
RSSI accuracye
Range –98 dBm to –30
dBm
–5
–
5
dB
Range above –30 dBm
–8
–
8
dB
Zo = 50Ω, across the
dynamic range
10
–
13
dB
–
4
–
dB
Return loss
Receiver cascaded noise At maximum gain
figure
a. For PCIE derate 5G RX sensitivity by 1.5 dB
b. The cellular standard listed for each band indicates the type of modulation used to generate the interfering signal
in that band for the purpose of this test. It is not intended to indicate any specific usage of each band in any
specific country.
c. The blocking levels are valid for channels 1 to 11. (For higher channels, the performance may be lower due to
third harmonic signals (3 × 824 MHz) falling within band.)
d. For 65 Mbps, the size is 4096.
e. The minimum and maximum values shown have a 95% confidence level.
Broadcom®
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
WLAN 5 GHz Transmitter Performance Specifications
WLAN 5 GHz Transmitter Performance Specifications
Note: Unless otherwise noted, the values shown in the following table are provided at the WLAN chip
port output.
Table 37: WLAN 5 GHz Transmitter Performance Specifications
Parameter
Condition/Notes
Minimum Typical
Maximu
m
Unit
Frequency range
–
4900
–
5845
MHz
–
–164
–
dBm/Hz
–
–166
–
dBm/Hz
–
–166
–
dBm/Hz
–
–166
–
dBm/Hz
1592–1610 MHz (GLONASS)
–
–165.5
–
dBm/Hz
1710–1800(DSC-1800-Uplink)
–
–135
–
dBm/Hz
1805–1880 MHz (GSM 1800)
–
–165
–
dBm/Hz
1850–1910 MHz (GSM 1900)
–
–165
–
dBm/Hz
1910–1930 MHz (TDSCDMA, LTE)
–
–165
–
dBm/Hz
1930–1990 MHz (GSM1900,
cdmaOne, WCDMA)
–
–165
–
dBm/Hz
2010–2075 MHz (TDSCDMA)
–
–164.5
–
dBm/Hz
2110–2170 MHz (WCDMA)
–
–164
–
dBm/Hz
2305–2370 (LTE band 40)
–
–160
–
dBm/Hz
2370–2400 (LTE band 40)
–
–163
–
dBm/Hz
2400–2500 (WLAN 2G)
–
–160
–
dBm/Hz
2496–2530 (LTE band 41)
–
–161.5
–
dBm/Hz
2530–2560 (LTE band 41)
–
–161.5
–
dBm/Hz
2570–2690 (LTE band 41)
–
–161
–
dBm/Hz
Transmitted power in
776–794 MHz (CDMA2000)
cellular and FM bands (at 869–960 MHz (cdmaOne, GSM850)
+18.5 dBm, 100% duty
1450–1495 (DAB)
cycle, 6 Mbps OFDM) a
1570–1580 MHz (GPS)
EVM Does Not Exceed
TX power at the chip port
for highest power level
setting at 25°C and
VBAT = 3.6V with spectral
mask and EVM
compliance
OFDM, BPSK
–8 dB
–
21.5
–
dBm
OFDM, 64QAM
–25 dB
–
19
–
dBm
MCS7
–27 dB
–
19
–
dBm
MCS9
–32 dB
–
17
–
dBm
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
General Spurious Emissions Specifications
Table 37: WLAN 5 GHz Transmitter Performance Specifications (Cont.)
Parameter
Condition/Notes
Minimum Typical
Maximu
m
Unit
Phase noise
37.4 MHz Crystal, Integrated from
10 kHz to 10 MHz
–
0.5
–
Degrees
TX power control dynamic –
range
10
–
–
dB
Across full-temperature and voltage
Closed loop TX power
variation at highest power range. Applies across 10 to 20 dBm
output power range.
level setting
–
–
±2.0
dB
Carrier suppression
15
–
–
dBc
–
Gain control step
–
–
0.25
–
dB
Return loss
Zo = 50Ω
–
6
–
dB
a. The cellular standards listed indicate only typical usages of that band in some countries. Other standards may
also be used within those bands.
General Spurious Emissions Specifications
This section provides the TX and RX spurious emissions specifications for both the WLAN 2.4 GHz and 5 GHz
bands. The recommended spectrum analyzer settings for the spurious emissions specifications are provided in
Table 38.
Table 38: Recommended Spectrum Analyzer Settings
Parameter
Setting
Resolution Bandwidth (RBW):
1 MHz
Video Bandwidth (VBW):
1 MHz
Sweep:
Auto
Span:
100 MHz
Detector:
Maximum Peak
Trace:
Maximum Hold
Modulation:
OFDM (Orthogonal Frequency-division Multiplexing)
Transmitter Spurious Emissions Specifications
The TX spurious emissions specifications in this subsection are based on the following definitions:
•
AFE = VCO/16 for 2G channels
•
AFE = VCO/18 for 5G 20 MHz channels
•
AFE = VCO/9 for 5G 40 MHz channels
•
AFE = VCO/6 for 5G 80 MHz channels
•
LO = Channel frequency
Broadcom®
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
General Spurious Emissions Specifications
2.4 GHz Band Spurious Emissions
20 MHz Channel Spacing
Note: Possible AFE combinations are as follows. The AFE=VCO/16 specifications for channel 2442
are listed in Table 39.
Table 39: 2.4 GHz Band, 20 MHz Channel Spacing TX Spurious Emissions Specificationsa
Frequency (Fch; MHz) Channel 2442
Spurious Frequency
Power (dBm)
Typical (dBm)
Maximum (dBm)
HD2
21
–22.78
–
HD3
21
–19.54
–
HD4
21
–41.79
–
HD5
21
–61.78
–
VCO – LO
21
–55.13
–
VCO + LO
21
–63.40
–
VCO
21
–48.56
–
LO + AFE
21
–59.2
–
LO-AFE
21
–59.3
–
LO + AFE × 2
21
–68.2
–
LO – AFE × 2
21
–67.4
–
LO + XTAL × 2
21
–56.2
–
LO – XTAL × 2
21
–56.3
–
LO + XTAL × 4
21
–57.5
–
LO – XTAL × 4
21
–56.7
–
LO + XTAL × 8
21
–59.1
–
LO – XTAL × 8
21
–67.2
–
a. VCO = 1.5 × Fch, where Fch is the center frequency of the channel.
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
General Spurious Emissions Specifications
5 GHz Band Spurious Emissions
20 MHz Channel Spacing
Note: Possible AFE combinations are as follows. The AFE=VCO/18 specifications for channels 5180,
5500, and 5825 are listed in Table 40.
Table 40: 5 GHz Band, 20 MHz Channel Spacing TX Spurious Emissions Specifications
CH5180a
CH5500a
CH5825a
Spurious
Frequency
Power
(dBm)
Typ.
(dBm)
Max.
(dBm)
Typ.
(dBm)
Max.
(dBm)
Typ.
(dBm)
Max.
(dBm)
HD2
19
–29.33
–
–32.56
–
–33.14
–
HD3
19
–39.71
–
–38.93
–
–39.87
–
VCO
19
–49.03
–
–48.35
–
–46.70
–
VCO × 2
19
–55.64
–
–60.40
–
–64.77
–
LO + VCO
19
–63.94
–
–62.80
–
–62.16
–
LO – VCO
19
–81.58
–
–72.56
–
–70.58
–
LO – AFE
19
–62.1
–
–63.3
–
–60.4
–
LO + AFE
19
–57.8
–
–59.6
–
–60.6
–
LO – XTAL × 4
19
–60.1
–
–60.1
–
–58.7
–
LO + XTAL × 4
19
–57.2
–
–57.4
–
–58.2
–
LO – XTAL × 6
19
–63.4
–
–59.3
–
–61.1
–
LO + XTAL × 6
19
–60.2
–
–58.9
–
–60.8
–
LO – XTAL × 8
19
–66.1
–
–67.3
–
–63.8
–
LO + XTAL × 8
19
–64.2
–
–63.8
–
–65.8
–
AFE × 12
19
–
–
–
–
–
–
a. VCO = (2/3) × Fch, where Fch is the center frequency of the channel.
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 127
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
General Spurious Emissions Specifications
40 MHz Channel Spacing
Note: Possible AFE combinations are as follows. The AFE=VCO/9 specifications for channels 5190,
5510, and 5795 are listed in Table 41.
Table 41: 5 GHz Band, 40 MHz Channel Spacing TX Spurious Emissions Specifications
CH5190ma
CH5510ma
CH5795ma
Spurious
Frequency
Power
(dBm)
Typ.
(dBm)
Max.
(dBm)
Typ.
(dBm)
Max.
(dBm)
Typ.
(dBm)
Max.
(dBm)
HD2
19
–33.43
–
–35.53
–
–36.49
–
HD3
19
–41.81
–
–42.13
–
–42.33
–
VCO
19
–48.36
–
–47.65
–
–46.93
–
VCO × 2
19
–55.87
–
–59.26
–
–64.45
–
LO + VCO
19
–65.58
–
–64.96
–
–
–
LO – VCO
19
–
–
–
–
–
–
LO – AFE
19
–65.3
–
–67.2
–
–65.2
–
LO + AFE
19
–63.2
–
–64.3
–
–67.3
–
LO – XTAL × 4
19
–59.3
–
–59.7
–
–59.6
–
LO + XTAL × 4
19
–58.3
–
–57.4
–
–57.9
–
LO – XTAL × 6
19
–64.1
–
–63.4
–
–63.2
–
LO + XTAL × 6
19
–61.5
–
–59.4
–
–61.2
–
LO – XTAL × 8
19
–66.3
–
–67.1
–
–64.3
–
LO + XTAL × 8
19
–63.8
–
–64.7
–
–61.2
–
AFE × 12
19
–65.2
–
–66.3
–
–65.4
–
a. VCO = (2/3) × Fch, where Fch is the center frequency of the channel.
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 128
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
General Spurious Emissions Specifications
80 MHz Channel Spacing
Note: Possible AFE combinations are as follows. The AFE=VCO/6 specifications for channels 5210,
5530, and 5775 are listed in Table 42.
Table 42: 5 GHz Band, 80 MHz Channel Spacing TX Spurious Emissions Specifications
CH5210qa
CH5530qa
CH5775qa
Spurious Frequency
Power
(dBm)
Typ.
(dBm)
Max.
(dBm)
Typ.
(dBm)
Max.
(dBm)
Typ.
(dBm)
Max.
(dBm)
HD2
19
–36.28
–
–39.59
–
–41.02
–
HD3
19
–45.00
–
–44.82
–
–46.10
–
VCO
19
–48.00
–
–47.34
–
–46.01
–
VCO × 2
19
–57.04
–
–62.82
–
–66.84
–
LO + VCO
19
–66.66
–
–66.11
–
–66.40
–
LO – VCO
19
–
–
–
–
–
–
LO – AFE
19
–68.5
–
–67.8
–
–66.9
–
LO + AFE
19
–63.8
–
–66.3
–
–68.6
–
LO – XTAL × 4
19
–
–
–
–
–
–
LO + XTAL × 4
19
–
–
–
–
–
–
LO – XTAL × 6
19
–
–
–
–
–
–
LO + XTAL × 6
19
–
–
–
–
–
–
LO – XTAL × 8
19
–
–
–
–
–
–
LO + XTAL × 8
19
–
–
–
–
–
–
AFE × 12
19
–
–
–
–
–
–
a. VCO = (2/3) × Fch, where Fch is the center frequency of the channel.
Receiver Spurious Emissions Specifications
Table 43: 2G and 5G General Receiver Spurious Emissions
Band
Frequency Range
Typical
Maximum
Unit
2G
2.4 GHz < f < 2.5 GHz
–92
–
dBm
3.6 GHz < f < 3.8 GHz
–75.16
–
dBm
5150 MHz < f < 5850 MHz
–70.4
–
dBm
3.45 GHz < f < 3.9 GHz
–59.2
–
dBm
5G
Broadcom®
November 5, 2015 • 43455-DS109-R
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Internal Regulator Electrical Specifications
Section 18: Internal Regulator Electrical
Specifications
Core Buck Switching Regulator
Note: Values in this data sheet are design goals and are subject to change based on device
characterization results.
Note: Functional operation is not guaranteed outside of the specification limits provided in this section.
Table 44: Core Buck Switching Regulator (CBUCK) Specifications
Specification
Notes
Min.
Typ.
Max. Unit
Input supply voltage (DC)
DC voltage range inclusive of disturbances.
3.0
3.6
PWM mode switching
frequency
PWM output current
Output current limit
Output voltage range
PWM output voltage DC
accuracy
PWM ripple voltage, static
CCM, Load > 100 mA VBAT = 3.6V
–
4
5.25a V
–
MHz
–
–
1.2
–4
–
1400
1.35
–
600
–
1.5
4
mA
mA
V
%
–
7
20
mVpp
78
70
–
86
80
400
–
–
500
%
%
μs
–
2.2
–
μH
2.0
4.7
10b
μF
0.67b 4.7
–
μF
40
–
μs
–
–
Programmable, 30 mV steps. Default = 1.35V
Includes load and line regulation.
Forced PWM mode.
Measure with 20 MHz bandwidth limit.
Static Load. Max. Ripple based on VBAT = 3.6V,
Vout = 1.35V, Fsw = 4 MHz, 2.2 μH inductor L >
1.05 μH, Cap + Board total-ESR < 20 mΩ, Cout > 1.9
μF, ESL<200 pH
PWM mode peak efficiency Peak Efficiency at 200 mA load
PFM mode efficiency
10 mA load current
Start-up time from power
VIO already ON and steady. Time from REG_ON
down
rising edge to CLDO reaching 1.2V.
External inductor
0806 size, 2.2 µH, DCR=0.11Ω, ACR=1.18Ω @
4 MHz
External output capacitor
Ceramic, X5R, 0402, ESR <30 mΩ at 4 MHz,
4.7 µF ±20%, 6.3V
External input capacitor
For SR_VDDBATP5V pin, ceramic, X5R, 0603,
ESR < 30 mΩ at 4 MHz, ±4.7uF ±20%, 6.3V
Input supply voltage ramp-up 0 to 4.3V
time
–
a. The maximum continuous voltage is 5.25V. Voltages up to 6.0V for up to 10 seconds, cumulative duration, over
the lifetime of the device are allowed. Voltages as high as 5.0V for up to 250 seconds, cumulative duration, over
the lifetime of the device are allowed.
b. Total capacitance includes those connected at the far end of the active load.
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BCM43455 Preliminary Data Sheet
3.3V LDO (LDO3P3)
3.3V LDO (LDO3P3)
Table 45: LDO3P3 Specifications
Specification
Notes
Input supply voltage, Vin
Min.
Typ.
Max.
Units
Min. = Vo + 0.2V = 3.5V dropout voltage 3.0
requirement must be met under
maximum load for performance
specifications.
3.6
5.25a
V
Output current
–
0.001
–
450
mA
Nominal output voltage, Vo
Default = 3.3V
–
3.3
–
V
Dropout voltage
At max. load.
–
–
200
mV
Output voltage DC accuracy
Includes line/load regulation.
–5
–
+5
%
Quiescent current
No load
–
–
100
μA
Line regulation
Vin from (Vo + 0.2V) to 5.25V, max. load –
–
3.5
mV/V
Load regulation
load from 1 mA to 450 mA
–
–
0.3
mV/mA
PSRR
Vin ≥ Vo + 0.2V,
Vo = 3.3V, Co = 4.7 μF,
Max. load, 100 Hz to 100 kHz
20
–
–
dB
LDO turn-on time
Chip already powered up.
–
160
250
μs
External output capacitor, Co
Ceramic, X5R, 0402,
(ESR: 5 mΩ–240 mΩ), ± 10%, 10V
1.0b
4.7
10
μF
External input capacitor
For SR_VDDBATA5V pin (shared with –
Bandgap) Ceramic, X5R, 0402,
(ESR: 30m-200 mΩ), ± 10%, 10V.
Not needed if sharing VBAT capacitor
4.7 μF with SR_VDDBATP5V.
4.7
–
μF
a. The maximum continuous voltage is 5.25V. Voltages up to 6.0V for up to 10 seconds, cumulative duration, over
the lifetime of the device are allowed. Voltages as high as 5.0V for up to 250 seconds, cumulative duration, over
the lifetime of the device are allowed.
b. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part
tolerance, DC-bias, temperature, and aging.
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BCM43455 Preliminary Data Sheet
2.5V LDO (BTLDO2P5)
2.5V LDO (BTLDO2P5)
Table 46: BTLDO2P5 Specifications
Specification
Notes
Min.
Typ.
Max.
Units
Input supply voltage
Min. = 2.5V + 0.2V = 2.7V.
Dropout voltage requirement must be
met under maximum load for
performance specifications.
3.0
3.6
5.25a
V
Nominal output voltage
Default = 2.5V.
–
2.5
–
V
Output voltage programmability
Range
2.2
2.5
2.8
V
Accuracy at any step (including line/
load regulation), load > 0.1 mA.
–5
–
5
%
Dropout voltage
At maximum load.
–
–
200
mV
Output current
–
0.1
–
70
mA
Quiescent current
No load.
–
8
16
μA
Maximum load at 70 mA.
–
660
700
μA
Leakage current
Power-down mode.
–
1.5
5
μA
Line regulation
Vin from (Vo + 0.2V) to 5.25V,
maximum load.
–
–
3.5
mV/V
Load regulation
Load from 1 mA to 70 mA,
Vin = 3.6V.
–
–
0.3
mV/mA
PSRR
Vin ≥ Vo + 0.2V, Vo = 2.5V, Co = 2.2 μF, 20
maximum load, 100 Hz to 100 kHz.
–
–
dB
LDO turn-on time
Chip already powered up.
–
–
150
μs
In-rush current
Vin = Vo + 0.15V to 5.25V, Co = 2.2 μF, –
No load.
–
250
mA
External output capacitor, Co
Ceramic, X5R, 0402,
(ESR: 5m–240 mΩ), ±10%, 10V
2.2
2.64
μF
External input capacitor
For SR_VDDBATA5V pin (shared with –
Bandgap) ceramic, X5R, 0402,
(ESR: 30–200 mΩ), ±10%, 10V.
Not needed if sharing VBAT 4.7 μF
capacitor with SR_VDDBATP5V.
4.7
–
μF
0.7b
a. The maximum continuous voltage is 5.25V. Voltages up to 6.0V for up to 10 seconds, cumulative duration, over
the lifetime of the device are allowed. Voltages as high as 5.0V for up to 250 seconds, cumulative duration, over
the lifetime of the device are allowed.
b. The minimum value refers to the residual capacitor value after taking into account part-to-part tolerance, DCbias, temperature, and aging.
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BCM43455 Preliminary Data Sheet
CLDO
CLDO
Table 47: CLDO Specifications
Specification
Notes
Min.
Typ.
Max.
Units
Input supply voltage, Vin
Min. = 1.2 + 0.15V = 1.35V dropout voltage
requirement must be met under maximum
load.
1.3
1.35
1.5
V
Output current
–
0.2
–
200
mA
Output voltage, Vo
Programmable in 10 mV steps.
Default = 1.2.V
0.95
1.2
1.26
V
Dropout voltage
At max. load
–
–
150
mV
Output voltage DC accuracy
Includes line/load regulation
–4
–
+4
%
No load
–
13
–
μA
200 mA load
–
1.24
–
mA
Quiescent current
Line Regulation
Vin from (Vo + 0.15V) to 1.5V, maximum load –
–
5
mV/V
Load Regulation
Load from 1 mA to 300 mA
–
0.02
0.05
mV/mA
Leakage Current
Power down
–
5
20
μA
Bypass mode
–
1
3
μA
PSRR
@1 kHz, Vin ≥ 1.35V, Co = 4.7 μF
20
–
–
dB
Start-up Time of PMU
VIO up and steady. Time from the REG_ON
rising edge to the CLDO reaching 1.2V.
–
–
700
μs
LDO Turn-on Time
LDO turn-on time when rest of the chip is up
–
140
180
μs
External Output Capacitor,
Co
Total ESR: 5 mΩ–240 mΩ
1.1a
2.2
–
μF
External Input Capacitor
Only use an external input capacitor at the
–
VDD_LDO pin if it is not supplied from CBUCK
output.
1
2.2
μF
a. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part
tolerance, DC-bias, temperature, and aging.
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BCM43455 Preliminary Data Sheet
LNLDO
LNLDO
Table 48: LNLDO Specifications
Specification
Notes
Input supply voltage, Vin
Min.
Typ.
Max.
Units
Min. VIN = VO + 0.15V = 1.35V (where VO = 1.3
1.2V)dropout voltage requirement must be
met under maximum load.
1.35
1.5
V
Output Current
–
0.1
–
150
mA
Output Voltage, Vo
Programmable in 25 mV steps.
Default = 1.2V
1.1
1.2
1.275
V
Dropout Voltage
At maximum load
–
–
150
mV
Output Voltage DC Accuracy Includes line/load regulation
–4
–
+4
%
Quiescent current
No load
–
44
–
μA
Max. load
–
970
990
μA
Line Regulation
Vin from (Vo + 0.1V) to 1.5V, 150 mA load –
–
5
mV/V
Load Regulation
Load from 1 mA to 150 mA
–
0.02
0.05
mV/mA
Leakage Current
Power-down
–
–
10
μA
Output Noise
@30 kHz, 60–150 mA load Co = 2.2 μF
@100 kHz, 60–150 mA load Co = 2.2 μF
–
–
60
35
nV/rt Hz
nV/rt Hz
PSRR
@ 1kHz, Input > 1.35V, Co= 2.2 μF, Vo =
1.2V
20
–
–
dB
LDO Turn-on Time
LDO turn-on time when rest of chip is up
–
140
180
μs
External Output Capacitor,
Co
Total ESR (trace/capacitor):
5 mΩ–240 mΩ
2.2
4.7
μF
External Input Capacitor
Only use an external input capacitor at the –
VDD_LDO pin if it is not supplied from
CBUCK output.
Total ESR (trace/capacitor): 30 mΩ–200 mΩ
1
2.2
μF
0.5
a
a. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part
tolerance, DC-bias, temperature, and aging.
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BCM43455 Preliminary Data Sheet
PCIe LDO
PCIe LDO
Table 49: PCIe LDO Specifications
Specification
Notes
Min.
Typ.
Max.
Units
Input supply voltage, Vin
Min. VIN = VO + 0.15V = 1.35V (where
VO = 1.2V)dropout voltage requirement
must be met under maximum load.
1.3
1.35
1.5
V
Output Current
Peak load=80 mA. Average load=35 mA
0.1
–
55
mA
Output Voltage, Vo
Programmable in 25 mV steps.
Default = 1.2V
1.1
1.2
1.275
V
Dropout Voltage
At maximum load
–
–
150
mV
Output Voltage DC Accuracy Includes line/load regulation
–4
–
+4
%
Quiescent current
No load
–
10
12
μA
55 mA load
–
550
570
μA
Line Regulation
VIN from (VO + 0.1V) to 1.5V, 150 mA load –
–
5
mV/V
Load Regulation
Load from 1 mA to 150 mA
–
0.02
0.05
mV/mA
Leakage Current
Power-down
–
5
20
μA
Bypass mode
–
0.02
1.5
μA
Output Noise
@30 kHz, 60–150 mA load Co = 2.2 μF
@100 kHz, 60–150 mA load Co = 2.2 μF
–
–
60
35
nV/rt Hz
nV/rt Hz
PSRR
@ 1kHz, Input > 1.35V, Co= 2.2 μF,
Vo = 1.2V
20
–
–
dB
LDO Turn-on Time
LDO turn-on time when balance of chip is up –
140
180
μs
0.47
–
μF
1
2.2
μF
External Output Capacitor, Co Total ESR (trace/capacitor):
5 mΩ–240 mΩ
External Input Capacitor
0.27a
Only use an external input capacitor at the –
VDD_LDO pin if it is not supplied from
CBUCK output.
Total ESR (trace/capacitor): 30 mΩ–200 mΩ
a. Minimum capacitor value refers to the residual capacitor value after taking into account the part-to-part
tolerance, DC-bias, temperature, and aging.
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BCM43455 Preliminary Data Sheet
System Power Consumption
Section 19: System Power Consumption
Note: Values in this data sheet are design goals and are subject to change based on the results of
device characterization.
Note: Unless otherwise stated, these values apply for the conditions specified in
Table 27: “Recommended Operating Conditions and DC Characteristics,” on page 99.
WLAN Current Consumption
The tables in this subsection show the typical, total current consumed by the BCM43455. All values shown are
with the Bluetooth core in reset mode with Bluetooth off.
2.4 GHz Mode
Table 50: 2.4 GHz Mode WLAN Power Consumption
VBAT = 3.6V, VDDIO = 1.8V, TA25°C
VBAT, mA
VIO, uAa
Radio off b
0.006
5
Sleep c
0.020
200
IEEE Power Save: DTIM = 1, single RX d
1.25
200
IEEE Power Save: DTIM = 3, single RX
0.45
200
Continuous RX mode: MCS7, HT20, 1SS e, f
55
60
CRS: HT20 g
50
60
Mode
Sleep Modes
Active RX Modes
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BCM43455 Preliminary Data Sheet
WLAN Current Consumption
Table 50: 2.4 GHz Mode WLAN Power Consumption (Cont.)
VBAT = 3.6V, VDDIO = 1.8V, TA25°C
VBAT, mA
VIO, uAa
400
60
Continuous TX mode: MCS7, HT20, 1SS, 1 TX @ 19 dBm h 350
60
Mode
Active TX Modes – Internal PA
Continuous TX mode: 1 Mbps @ 21.5 dBm h
a.
b.
c.
d.
e.
f.
g.
h.
VIO is specified with all pins idle (not switching) and not driving any loads.
WL_REG_ON and BT_REG_ON are both low. All supplies are present.
Idle, not associated, or inter-beacon.
Beacon Interval = 102.4 ms. Beacon duration = 1 ms @ 1 Mbps. Average current over 3× DTIM intervals.
Duty cycle is 100%. Carrier sense (CS) detect/packet receive.
Measured using packet engine test mode.
Carrier sense (CCA) when no carrier present.
Duty cycle is 100%.
5 GHz Mode
Table 51: 5 GHz Mode WLAN Power Consumption
VBAT = 3.6V, VDDIO = 1.8V, TA25°C
VBAT , mA
VIO, uAa
0.006
5
0.025
200
1.1
200
0.4
200
Continuous RX mode: MCS7, HT20, 1SS e, f
74
60
Continuous RX mode: MCS7, HT40, 1SS e, f
82
60
Continuous RX mode: MCS9, HT40, 1SS e, f
86
60
Continuous RX mode: MCS9, HT80, 1SS e, f
117
60
CRS: HT20 g
70
60
g
79
60
100
60
Continuous TX mode: MCS7, HT20, 1SS, 1 TX @ 19 dBm h 330
Continuous TX mode: MCS7, HT40, 1SS, 1 TX @ 19 dBm h 340
60
Continuous TX mode: MCS9, HT40, 1SS, 1 TX @ 16 dBm h 270
Continuous TX mode: MCS9, HT80, 1SS, 1 TX @ 16 dBm h 270
60
Mode
Sleep Modes
Radio off b
Sleep c
IEEE Power Save: DTIM = 1, single RX
IEEE Power Save: DTIM = 3, single RX
d
Active RX Modes
CRS: HT40
CRS: HT80 g
Active TX Modes – Internal PA
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60
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BCM43455 Preliminary Data Sheet
a.
b.
c.
d.
e.
f.
g.
h.
Bluetooth Current Consumption
VIO is specified with all pins idle (not switching) and not driving any loads.
WL_REG_ON and BT_REG_ON are both low. All supplies present.
Idle, not associated, or inter-beacon.
Beacon Interval = 102.4 ms. Beacon duration = 1ms @ 1Mbps. Average current over 3x DTIM intervals.
Duty cycle is 100%. Carrier sense (CS) detect/packet receive.
Measured using packet engine test mode.
Carrier sense (CCA) when no carrier present.
Duty cycle is 100%.
Bluetooth Current Consumption
The Bluetooth and BLE current consumption measurements are shown in Table 52.
Note: The WLAN core is in reset (WLAN_REG_ON = low) for all measurements provided in Table 52.
Note: The BT current consumption numbers are measured based on GFSK TX output power =
10 dBm.
Table 52: Bluetooth and BLE Current Consumption
Operating Mode
VBAT
VDDIO
Units
Sleep
Standard 1.28s Inquiry Scan
500 ms Sniff Master
DM1/DH1 Master
DM3/DH3 Master
DM5/DH5 Master
3DH5/3DH1 Master
SCO HV3 Master
6
153
216
23.9
29.1
29.8
24.8
11.5
179
295
294
291
0.155
0.164
0.166
0.210
0.166
296
µA
µA
µA
mA
mA
mA
mA
mA
µA
295
146
µA
µA
BLE Scana
BLE Adv—Unconnectable 1.00 sec 69
BLE Connected 1 sec
1960
a. No devices present. A 1.28 second interval with a scan window of 11.25 ms.
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BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Interface Timing and AC Characteristics
S e c t i o n 2 0 : I n t e r f a c e Ti m i n g a n d A C
C h a r a c t e ri s t i c s
SDIO Timing
SDIO Default Mode Timing
SDIO default mode timing is shown by the combination of Figure 34 and Table 53.
Figure 34: SDIO Bus Timing (Default Mode)
fPP
tWL
tWH
SDIO_CLK
tTHL
tTLH
tISU
tIH
Input
Output
tODLY
tODLY
(max)
(min)
Table 53: SDIO Bus Timinga Parameters (Default Mode)
Parameter
Symbol
Minimum
Typical
Maximum Unit
SDIO CLK (All values are referred to minimum VIH and maximum VILb)
Frequency – Data Transfer mode
fPP
0
–
25
MHz
Frequency – Identification mode
fOD
0
–
400
kHz
Clock low time
tWL
10
–
–
ns
Clock high time
tWH
10
–
–
ns
Clock rise time
tTLH
–
–
10
ns
Clock low time
tTHL
–
–
10
ns
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BCM43455 Preliminary Data Sheet
SDIO Timing
Table 53: SDIO Bus Timinga Parameters (Default Mode) (Cont.)
Parameter
Symbol
Minimum
Typical
Maximum Unit
Inputs: CMD, DAT (referenced to CLK)
Input setup time
tISU
5
–
–
ns
Input hold time
tIH
5
–
–
ns
Output delay time – Data Transfer mode
tODLY
0
–
14
ns
Output delay time – Identification mode
tODLY
0
–
50
ns
Outputs: CMD, DAT (referenced to CLK)
a. Timing is based on CL  40 pF load on CMD and Data.
b. Min (Vih) = 0.7 × VDDIO and max (Vil) = 0.2 × VDDIO.
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BCM43455 Preliminary Data Sheet
SDIO Timing
SDIO High-Speed Mode Timing
SDIO high-speed mode timing is shown by the combination of Figure 35 and Table 54.
Figure 35: SDIO Bus Timing (High-Speed Mode)
fPP
tWL
tWH
50% VDD
SDIO_CLK
tTHL
tISU
tTLH
tIH
Input
Output
tODLY
tOH
Table 54: SDIO Bus Timinga Parameters (High-Speed Mode)
Parameter
Symbol
Minimum
Typical
Maximum Unit
SDIO CLK (all values are referred to minimum VIH and maximum VILb)
Frequency – Data Transfer Mode
fPP
0
–
50
MHz
Frequency – Identification Mode
fOD
0
–
400
kHz
Clock low time
tWL
7
–
–
ns
Clock high time
tWH
7
–
–
ns
Clock rise time
tTLH
–
–
3
ns
Clock low time
tTHL
–
–
3
ns
Inputs: CMD, DAT (referenced to CLK)
–
–
–
–
–
Input setup Time
tISU
6
–
–
ns
Input hold Time
tIH
2
–
–
ns
Outputs: CMD, DAT (referenced to CLK)
–
–
–
–
–
Output delay time – Data Transfer Mode
tODLY
–
–
14
ns
Output hold time
tOH
2.5
–
–
ns
Total system capacitance (each line)
CL
–
–
40
pF
a. Timing is based on CL  40 pF load on CMD and Data.
b. Min (Vih) = 0.7 × VDDIO and max (Vil) = 0.2 × VDDIO.
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BCM43455 Preliminary Data Sheet
SDIO Timing
SDIO Bus Timing Specifications in SDR Modes
Clock Timing
Figure 36: SDIO Clock Timing (SDR Modes)
tCLK
SDIO_CLK
tCR
tCF
tCR
Table 55: SDIO Bus Clock Timing Parameters (SDR Modes)
Parameter
Symbol
Minimum
Maximum
Unit
Comments
–
tCLK
40
–
ns
SDR12 mode
20
–
ns
SDR25 mode
10
–
ns
SDR50 mode
4.8
–
ns
SDR104 mode
–
tCR, tCF
–
0.2 × tCLK
ns
tCR, tCF < 2.00 ns (max) @ 100 MHz,
CCARD = 10 pF
tCR, tCF < 0.96 ns (max) @ 208 MHz,
CCARD = 10 pF
Clock duty
cycle
–
30
70
%
–
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BCM43455 Preliminary Data Sheet
SDIO Timing
Card Input Timing
Figure 37: SDIO Bus Input Timing (SDR Modes)
SDIO_CLK
tIS
tIH
CMD input
DAT[3:0] input
Table 56: SDIO Bus Input Timing Parameters (SDR Modes)
Symbol
Minimum
Maximum
Unit
Comments
tIS
1.4
–
ns
CCARD = 10 pF, VCT = 0.975V
tIH
0.8
–
ns
CCARD = 5 pF, VCT = 0.975V
tIS
3.00
–
ns
CCARD = 10 pF, VCT = 0.975V
tIH
0.8
–
ns
CCARD = 5 pF, VCT = 0.975V
SDR104 Mode
SDR50 Mode
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BCM43455 Preliminary Data Sheet
SDIO Timing
Card Output Timing
Figure 38: SDIO Bus Output Timing (SDR Modes up to 100 MHz)
tCLK
SDIO_CLK
tODLY
tOH
CMD input
DAT[3:0] input
Table 57: SDIO Bus Output Timing Parameters (SDR Modes up to 100 MHz)
Symbol
Minimum
Maximum
Unit
Comments
tODLY
–
7.5
ns
tCLK ≥ 10 ns CL= 30 pF using driver type B for SDR50
tODLY
–
14.0
ns
tCLK ≥ 20 ns CL= 40 pF using for SDR12, SDR25
tOH
1.5
–
ns
Hold time at the tODLY (min) CL= 15 pF
Figure 39: SDIO Bus Output Timing (SDR Modes 100 MHz to 208 MHz)
tCLK
SDIO_CLK
tOP
tODW
CMD input
DAT[3:0] input
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BCM43455 Preliminary Data Sheet
SDIO Timing
Table 58: SDIO Bus Output Timing Parameters (SDR Modes 100 MHz to 208 MHz)
Symbol
Minimum
Maximum
Unit
Comments
tOP
0
2
UI
Card output phase
∆tOP
–350
+1550
ps
Delay variation due to temp change after tuning
tODW
0.60
–
UI
tODW = 2.88 ns @ 208 MHz
•
∆tOP = +1550 ps for junction temperature of ∆tOP = 90°C during operation.
•
∆tOP = –350 ps for junction temperature of ∆tOP = –20°C during operation.
•
∆tOP = +2600 ps for junction temperature of ∆tOP = –20°C to +125°C during operation.
Figure 40: ∆tOP Consideration for Variable Data Window (SDR 104 Mode)
Data valid window
Sampling point after tuning
ǻtOP =
1550 ps
ǻtOP =
–350 ps
Data valid window
Sampling point after card junction heating
by +90°C from tuning temperature
Data valid window
Sampling point after card junction cooling
by –20°C from tuning temperature
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
SDIO Timing
SDIO Bus Timing Specifications in DDR50 Mode
Figure 41: SDIO Clock Timing (DDR50 Mode)
tCLK
SDIO_CLK
tCR
tCF
tCR
Table 59: SDIO Bus Clock Timing Parameters (DDR50 Mode)
Parameter
Symbol
Minimum
Maximum
Unit
Comments
–
tCLK
20
–
ns
DDR50 mode
–
tCR,tCF
–
0.2 × tCLK
ns
tCR, tCF < 4.00 ns (max) @50 MHz,
CCARD = 10 pF
Clock duty
cycle
–
45
55
%
–
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BCM43455 Preliminary Data Sheet
SDIO Timing
Data Timing
Figure 42: SDIO Data Timing (DDR50 Mode)
FPP
SDIO_CLK
tISU2x
DAT[3:0]
input
Invalid
tIH2x
tISU2x
Data
Invalid
Data
tODLY2x (max)
tODLY2x
Invalid
tODLY2x
(min)
DAT[3:0]
output
tIH2x
Data
Invalid
tODLY2x (max)
(min)
Data
Available timing
window for card
output transition
Data
Data
Available timing
window for host to
sample data from card
In DDR50 mode, DAT[3:0] lines are sampled on both
edges of the clock (not applicable for CMD line)
Table 60: SDIO Bus Timing Parameters (DDR50 Mode)
Parameter
Symbol
Minimum
Maximum
Unit
Comments
Input setup time
tISU
6
–
ns
CCARD < 10 pF (1 Card)
Input hold time
tIH
0.8
–
ns
CCARD < 10 pF (1 Card)
Output delay time
tODLY
–
13.7
ns
CCARD < 30 pF (1 Card)
Output hold time
tOH
1.5
–
ns
CCARD < 15 pF (1 Card)
Input setup time
tISU2x
3
–
ns
CCARD < 10 pF (1 Card)
Input hold time
tIH2x
0.8
–
ns
CCARD < 10 pF (1 Card)
Output delay time
tODLY2x
–
7.5
ns
CCARD < 25 pF (1 Card)
Output hold time
tODLY2x
1.5
–
ns
CCARD < 15 pF (1 Card)
Input CMD
Output CMD
Input DAT
Output DAT
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
PCI Express Interface Parameters
PCI Express Interface Parameters
Table 61: PCI Express Interface Parameters
Parameter
Symbol
Comments
Minimum Typical Maximum Unit
Baud rate
BPS
–
–
5
–
Gbau
d
Reference clock
amplitude
Vref
LVPECL, AC coupled
1
–
–
V
General
Receiver
Differential termination ZRX-DIFF-DC
Differential termination 80
100
120
Ω
DC impedance
ZRX-DC
DC common-mode
impedance
50
60
Ω
Powered down
termination (POS)
ZRX-HIGH-IMP-DCPOS
Power-down or RESET 100k
high impedance
–
–
Ω
Powered down
termination (NEG)
ZRX-HIGH-IMP-DCNEG
Power-down or RESET 1k
high impedance
–
–
Ω
Input voltage
VRX-DIFFp-p
AC coupled, differential 175
p-p
–
–
mV
Jitter tolerance
TRX-EYE
Minimum receiver eye 0.4
width
–
–
UI
Differential return loss RLRX-DIFF
Differential return loss
–
–
dB
Common-mode return RLRX-CM
loss
Common-mode return 6
loss
–
–
dB
–
Unexpected electrical TRX-IDEL-DET-DIFF- An unexpected
ENTERTIME
electrical idle must be
idle enter detect
recognized no longer
threshold integration
than this time to signal
time
an unexpected idle
condition.
–
10
ms
Signal detect threshold VRX-IDLE-DETDIFFp-p
40
10
Electrical idle detect
threshold
65
–
175
mV
–
1200
mV
Transmitter
Output voltage
VTX-DIFFp-p
Differential p-p,
programmable in 16
steps
0.8
Output voltage rise
time
VTX-RISE
20% to 80%
0.125
–
(2.5 GT/s)
0.15
(5 GT/s)
–
UI
Output voltage fall time VTX-FALL
80% to 20%
–
0.125
(2.5 GT/s)
0.15
(5 GT/s)
–
UI
Broadcom®
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BCM43455 Preliminary Data Sheet
PCI Express Interface Parameters
Table 61: PCI Express Interface Parameters (Cont.)
Parameter
Symbol
Comments
RX detection voltage
swing
VTX-RCV-DETECT
The amount of voltage –
change allowed during
receiver detection.
–
600
mV
TX AC peak common- VTX-CM-AC-PP
mode voltage
(5 GT/s)
TX AC common mode –
voltage (5 GT/s)
–
100
mV
TX AC peak common- VTX-CM-AC-P
mode voltage
(2.5 GT/s)
TX AC common mode –
voltage (2.5 GT/s)
–
20
mV
0
Absolute delta of DC VTX-CM-DC-ACTIVE- Absolute delta of DC
IDLE-DELTA
common-model voltage
common-model
during L0 and electrical
voltage during L0 and
idle.
electrical idle
–
100
mV
Absolute delta of DC
common-model
voltage between D+
and D-
–
25
mV
VTX-CM-DC-LINEDELTA
Minimum Typical Maximum Unit
DC offset between D+ 0
and D-
Electrical idle
VTX-IDLE-DIFF-AC-p Peak-to-peak voltage
differential peak output
voltage
0
–
20
mV
TX short circuit
current
ITX-SHORT
Current limit when TX
output is shorted to
ground.
–
–
90
mA
DC differential TX
termination
ZTX-DIFF-DC
Low impedance defined 80
during signaling
(parameter is captured
for 5.0 GHz by RLTXDIFF)
–
120
Ω
Differential
return loss
RLTX-DIFF
Differential
return loss
–
dB
Common-mode
return loss
RLTX-CM
Common-mode return 6
loss
–
–
dB
TX eye width
TTX-EYE
Minimum TX
eye width
–
–
UI
Broadcom®
November 5, 2015 • 43455-DS109-R
10 (min.) –
for 0.05:
1.25 GHz
8 (min.) for
1.25:
2.5 GHz
0.75
Page 149
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
JTAG Timing
JTAG Timing
Table 62: JTAG Timing Characteristics
Signal Name
Period
Output
Maximum
Output
Minimum
Setup
Hold
TCK
125 ns
–
–
–
–
TDI
–
–
–
20 ns
0 ns
TMS
–
–
–
20 ns
0 ns
TDO
–
100 ns
0 ns
–
–
JTAG_TRST
250 ns
–
–
–
–
SWD Timing
The probe outputs data to SWDIO on the falling edge of SWDCLK and captures data from SWDIO on the rising
edge of SWDCLK. The target outputs data to SWDIO on the rising edge of SWDCLK and captures data from
SWDIO on the rising edge of SWDCLK. SWD timing is defined through the combination of Figure 43 and
Table 63.
Figure 43: SWD Read and Write Timing
Read Cycle
RVI probe output to SWDIO
Thigh Tlow
Stop
Park
TOS
Tri-State
Data
Data
Parity
Start
RVI probe output to SWDCLK
Target output to SWDIO
Tri-State
Acknowledge
Tri-State
Write Cycle
RVI probe output to SWDIO
Stop
Park
Tri-State
Tih
Tis
Start
RVI probe output to SWDCLK
Target output to SWDIO
Tri-State
Acknowledge
Data
Data
Parity
Tri-State
Table 63: SWD Read and Write Timing Parameters
Parameter Description
Min.
Max. Units
Tcyc
SWDCLK cycle time
125
–
ns
Thigh
SWDCLK high period
50
–
ns
Tlow
SWDCLK low period
50
–
ns
Tos
SWDIO output skew to the falling edge of SWDCLK
–5
5
ns
Tis
Input setup time between SWDIO and the rising edge of SWDCLK
20
–
ns
Tih
Input hold time between SWDIO and the rising edge of SWDCLK
0
100
ns
Broadcom®
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BCM43455 Preliminary Data Sheet
Power-Up Sequence and Timing
Section 21: Power-Up Sequence and
Ti m i n g
Sequencing of Reset and Regulator Control Signals
The BCM43455 has two signals that allow the host to control power consumption by enabling or disabling the
Bluetooth, WLAN, and internal regulator blocks. These signals are described below. Additionally, diagrams are
provided to indicate proper sequencing of the signals for various operational states (see Figure 44, Figure 45
on page 152, and Figure 46 on page 153 and Figure 47 on page 153). The timing values indicated are minimum
required values; longer delays are also acceptable.
Description of Control Signals
•
WL_REG_ON: Used by the PMU to power-up the WLAN section. It is also OR-gated with the BT_REG_ON
input to control the internal BCM43455 regulators. When this pin is high, the regulators are enabled and the
WLAN section is out of reset. When this pin is low the WLAN section is in reset. If both the BT_REG_ON
and WL_REG_ON pins are low, the regulators are disabled.
•
BT_REG_ON: Used by the PMU (OR-gated with WL_REG_ON) to power-up the internal BCM43455
regulators. If both the BT_REG_ON and WL_REG_ON pins are low, the regulators are disabled. When this
pin is low and WL_REG_ON is high, the BT section is in reset.
Note: For both the WL_REG_ON and BT_REG_ON pins, there should be at least a 10 ms time delay
between consecutive toggles (where both signals have been driven low). This is to allow time for the
CBUCK regulator to discharge. If this delay is not followed, then there may be a VDDIO in-rush current
on the order of 36 mA during the next PMU cold start.
Note: The BCM43455 has an internal power-on reset (POR) circuit. The device will be held in reset
for a maximum of 110 ms after VDDC and VDDIO have both passed the POR threshold. Wait at least
150 ms after VDDC and VDDIO are available before initiating PCIe accesses.
Note: VBAT should not rise 10%–90% faster than 40 microseconds. VBAT should be up before or at
the same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high.
Broadcom®
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BCM43455 Preliminary Data Sheet
Sequencing of Reset and Regulator Control Signals
Control Signal Timing Diagrams
Figure 44: WLAN = ON, Bluetooth = ON
32.678 kHz
Sleep Clock
VBAT*
90% of VH
VDDIO
~ 2 Sleep cycles
WL_REG_ON
BT_REG_ON
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first
or be held high before VBAT is high.
Figure 45: WLAN = OFF, Bluetooth = OFF
32.678 kHz
Sleep Clock
VBAT*
VDDIO
WL_REG_ON
BT_REG_ON
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before
VBAT is high.
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
Sequencing of Reset and Regulator Control Signals
Figure 46: WLAN = ON, Bluetooth = OFF
32.678 kHz
Sleep Clock
VBAT*
90% of VH
VDDIO
~ 2 Sleep cycles
WL_REG_ON
BT_REG_ON
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before
VBAT is high.
Figure 47: WLAN = OFF, Bluetooth = ON
32.678 kHz
Sleep Clock
VBAT*
90% of VH
VDDIO
~ 2 Sleep cycles
WL_REG_ON
BT_REG_ON
*Notes:
1. VBAT should not rise 10%–90% faster than 40 microseconds.
2. VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before
VBAT is high.
Broadcom®
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BCM43455 Preliminary Data Sheet
Package Information
Section 22: Package Information
Package Thermal Characteristics
Table 64: Package Thermal Characteristicsa
Characteristic
WLBGA
JA (°C/W) (value in still air)
38.73
JB (°C/W)
1.97
JC (°C/W)
3.16
JT (°C/W)
9.3
JB (°C/W)
16.21
Maximum Junction Temperature Tj (°C)
123.6
Maximum Power Dissipation (W)
1.38
a. No heat sink, TA = 70°C. This is an estimate, based on a 4-layer PCB that conforms to EIA/JESD51–7
(101.6 mm × 101.6 mm × 1.6 mm) and P = 1.119W continuous dissipation.
Junction Temperature Estimation and PSIJT Versus THETAJC
Package thermal characterization parameter PSI–JT (JT) yields a better estimation of actual junction
temperature (TJ) versus using the junction-to-case thermal resistance parameter Theta–JC (JC). The reason
for this is that JC assumes that all the power is dissipated through the top surface of the package case. In actual
applications, some of the power is dissipated through the bottom and sides of the package. JT takes into
account power dissipated through the top, bottom, and sides of the package. The equation for calculating the
device junction temperature is:
TJ = TT + P x JT
Where:
•
TJ = Junction temperature at steady-state condition (°C)
•
TT = Package case top center temperature at steady-state condition (°C)
•
P = Device power dissipation (Watts)
•
JT = Package thermal characteristics; no airflow (°C/W)
Environmental Characteristics
For environmental characteristics data, see Table 25: “Environmental Ratings,” on page 98.
Broadcom®
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BCM43455 Preliminary Data Sheet
Mechanical Information
Section 23: Mechanical Information
Figure 48: 140-Ball WLBGA Package Mechanical Information
Broadcom®
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BCM43455 Preliminary Data Sheet
Mechanical Information
Figure 49: 140-Balls WLBGA Keep-out Areas for PCB Layout—Top View with Balls Facing Down
Keep out
#
Horizental
(mm)
vertical
(mm)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
0.11
0.11
0.09
0.09
0.12
0.12
0.08
0.08
0.08
0.08
0.20
0.20
0.15
0.15
0.14
0.14
0.17
0.14
0.05
0.05
0.15
0.15
0.27
0.27
0.16
0.16
0.15
0.15
0.18
0.18
0.13
0.10
0.13
0.13
0.13
0.13
0.18
0.18
0.08
0.08
0.14
0.18
0.10
0.10
0.07
0.07
0.07
0.07
Note: No top-layer metal is allowed in keep-out areas.
Note: A DXF file for the WLBGA keep-out area is available for importation into a layout program.
Contact your Broadcom FAE for more information.
Broadcom®
November 5, 2015 • 43455-DS109-R
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BCM43455 Preliminary Data Sheet
Ordering Information
S e c t i o n 2 4 : O rd e r i n g I n f o r m a t i o n
Table 65: Part Ordering Information
Operating
Ambient
Temperature
Part Number
Package
Description
BCM43455XKUBG
140-ball WLBGA
(4.47 mm × 5.27 mm,
0.4 mm pitch)
Dual-band 2.4 GHz and 5 GHz
WLAN+ BT 4.1 + FMRX
–30°C to +85°C
BCM43455HKUBG
140-ball WLBGA
(4.47 mm × 5.27 mm,
0.4 mm pitch)
Dual-band 2.4 GHz and 5 GHz
WLAN + BT 4.1 + FMRX, BSP
–30°C to +85°C
Broadcom®
November 5, 2015 • 43455-DS109-R
Page 157
BROADCOM CONFIDENTIAL
BCM43455 Preliminary Data Sheet
Broadcom® Corporation reserves the right to make changes without further notice to any products or
data herein to improve reliability, function, or design.
Information furnished by Broadcom Corporation is believed to be accurate and reliable. However,
Broadcom Corporation does not assume any liability arising out of the application or use of this
information, nor the application or use of any product or circuit described herein, neither does it
convey any license under its patent rights nor the rights of others.
®
Broadcom Corporation
5300 California Avenue
Irvine, CA 92617
© 2015 by BROADCOM CORPORATION. All rights reserved.
43455-DS109-R
November 5, 2015
Phone: 949-926-5000
Fax: 949-926-5203
E-mail: [email protected]
Web: www.broadcom.com
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