Standard Product Reference Sheet MFN1106MS-TR Features Package Narrow distribution angle with dome lens , IRED Peak wavelength : 945nm Outer Dimension 3.8 x 3.8 x 2.1mm( L x W x H ) Product Features ・Operating temperature : -40 to +125 deg. ・Radiant intensity : 230mW/sr (TYP.) @ IF = 1A ・Lead–free soldering compatible ・RoHS compliant Recommended Applications ・Automotive use (ADAS: （Advanced Driver Assistance System), Driver monitoring system, light source for Parking assist system camera) etc. ・Other use (TOF (Time Of Flight) sensor, Security equipment) etc. 2017.4.25 Page : 1 Outline Dimensions MFN1106MS-TR Unit Weight Tolerance Cathode mark ② ：mm ：38.0mg ：±0.1 ③ ① ④Cathode ④Anode 4-R0.2 Top view Side view Bottom view NO. PART NAME MATERIALS QTY. ① LED Die AlGaAs 1 ② Encapsulant Silicone resin - ③ Substrate Ceramic 1 ④ Terminal Au plating Anode : 2 Cathode : 1 Recommended Pad Unit Tolerance Cu pattern ：mm ：±0.1 Solder stencil apertural area Solder resist 2017.6.30 Page : 2 MFN1106MS-TR Specifications 【 Product Overview 】 Die material AlGaAs Resin color Water clear 【 Absolute Maximum Ratings 】 ITEM SYMBOL MAXIMUM RATINGS UNITS Operating temperature Topr -40 ～ +125 ℃ Note 1 Storage temperature Tstg -40 ～ +125 ℃ Note 1 Junction temperature Tj 125 ℃ Forward current IF 1 A Pulse forward current(tw≦100μsec, duty≦1%) IFRM 5 A Reverse voltage VR 5 V Electrostatic discharge threshold "HBM" (Ta=25℃) VESD 2 kV Peak temperature of reflow soldering Tsld 260 ℃ Note 1 The ranges of operating and storage temperature are not applied to taping condition. Note 2 ESD testing method : EIAJ4701/300(304) Human Body Model (HBM) 1.5kΩ, 100pF 【 Thermal Characteristics 】 Note 2 (Ta=25℃) ITEM SYMBOL TYP. MAX. UNITS Thermal resistance(Junction - Soldering Point) Rth(j-s) 5.0 7.0 ℃/W 2017.4.25 Page : 3 MFN1106MS-TR Specifications 【 Electro-Optical Characteristics 】 (Ta=25℃) ITEM SYMBOL CONDITIONS MIN. TYP. MAX. UNITS Radiant intensity Ie IF = 1A 140 230 300 mW/sr Total radiant flux φe IF = 1A - 950 - mW Peak wavelength λp IF = 1A 925 945 965 nm Spectral bandwidth at 50% of Imax Δλ IF = 1A - 45 - nm Half intensity angle 2θ1/2 － - 120 - deg. Response time tr / tf IF = 1A RL = 50Ω - 15 - ns Forward voltage VF IF = 1A 1.1 1.5 2.1 V Reverse current IR VR = 5V - - 5 μA Terminal capacitance Ct V = 0V f = 1MHz - 215 - pF Note 3 Note 3 This product is classified "Exempt" according to "Photobiological safety of lamps and lamp systems: IEC62471". 【 Sorting Chart for Radiant Intensity 】 LEDs shall be sorted out "Radiant intensity" into the following chart and each rank parts shall be packed separately when shipping. Rank Radiant intensity(mW/sr) Min. Max. A 140 200 B 200 300 Conditions IF=1A Ta=25℃ Notes Measurement tolerance: ±7% 【 Sorting Chart for Forward Voltage 】 LEDs shall be sorted out "Forward voltage" into the following chart and each rank parts shall be packed separately when shipping. Rank Forward voltage(V) Min. Max. A 1.1 1.6 B 1.6 2.1 Notes 2017.7.18 Conditions IF = 1A Ta = 25℃ Measurement tolerance: ±0.1V Page : 4 MFN1106MS-TR Technical Data Relative Radiant Intensity vs. Wavelength Conditions: Ta = 25℃, IF =1A 1.2 Relative radiant intensity 1.0 0.8 0.6 0.4 0.2 0.0 800 850 900 950 1,000 1,050 Wavelength (nm) Spatial Distribution Conditions: Ta = 25℃, IF=1A 100 x 0 -30 30 y x and y direction : same shape -60 -90 100 -10 0 60 50 -50 50 0 0 0 50 50 90 100 100 Relative radiant intensity (%) 2017.4.25 Page : 5 MFN1106MS-TR Technical Data Forward Current vs. Relative Total Radiant Flux Junction Temp. vs. Relative Total Radiant Flux Condition : Ta = 25℃, tw = 100μs Condition : IF = 1A 10 130 Relative total radiant flux : (%) 120 Relative total radiant flux 1 0.1 0.01 110 100 90 80 70 0.001 0.01 60 0.1 1 10 -40 -20 0 20 40 60 80 100 Forward current : IF (A) Junction Temp. : Tj (℃) Forward Voltage vs. Forward Current Junction Temp. vs. Forward Voltage Condition : Ta = 25℃, tw = 100μs Condition : IF= 1A 10 120 0.3 Forward voltage : VF (V) Forward current : IF (A) 0.2 1 0.1 0.1 0 -0.1 -0.2 -0.3 -0.4 0.01 1 1.5 2 Forward voltage : VF (V) 2017.4.25 2.5 3 -40 -20 0 20 40 60 80 100 120 Junction Temp. : Tj (℃) Page : 6 MFN1106MS-TR Technical Data Junction Temp. vs. Peak Wavelength Fluctuation Maximum Ratings of Forward Current Conditions : IF = 1A 40 1.0 Forward current : IF (mA) Peak wavelength fluctuation : λp (nm) 30 20 10 0 -10 0.8 0.6 0.4 0.2 -20 0.0 -30 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 Soldering point temp. : Ts (℃) Junction temp. : Tj (℃) Maximum Ratings of Pulse Forward Current Condition : Ts = 85℃ 5.0 4.8 duty=0.005 Pulse forward current : IFRM (A) 4.6 duty=0.01 4.4 duty=0.02 4.2 duty=0.05 4.0 duty=0.1 3.8 duty=0.2 3.6 duty=0.5 3.4 3.2 3.0 2.8 2.6 2.4 2.2 0.0001 0.001 0.01 Pulse width : tw (s) 2017.4.25 Page : 7 Soldering Condition MFN1106MS-TR 【Soldering Precaution】 (acc.to EIAJ-4701/300) 1. Heat stress during soldering will influence the reliability of LEDs, however that effect will vary on heating method. Also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (e.g., surface mount LED). 2. The LEDs constituent parts, including the resin, do not stabilize immediately after soldering. Any mechanical stress may cause damage to the products. Please avoid stacking the PCBs, or any other storage method which may cause the PCBs to bend; also, prevent contact of LED with any materials. 3. The recommended temperature profile for reflow soldering is listed as the top surface temperature. This is due to the fact that temperature distribution varies on heating method, PCB material, other components in the assembly, and concentration of the parts mounted. Typically, when FR-4 PCB is mounted with one single LED and heated via Far infrared and hot air, the difference in temperature between PCB and LED resin will be around 5-10°C. Please do not repeat the heating process during reflow more than two times. 【Recommended Reflow Soldering Condition】 Peak Temperature (Soldering ） 260℃ MAX. +1.5～+5℃/s -1.5～-5℃/s 230℃ MAX. 90~120sec MAX. （ Pre-heating ） 150℃～180℃ 40sec MAX. Note 1 Recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. This should be the maximum temperature for soldering. Lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability. Note 2 The reflow soldering process should be done up to twice(2 times Max). When second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of LED. The second soldering process should not be done until LEDs have returned to room temperature (by nature-cooling) after first soldering process. 2017.4.25 Page : 8 Soldering Condition MFN1106MS-TR 4. When using a metal PCB, the solder may crack and problems may occur due to major stress on the soldered portion caused by thermal shock. Please carry out a thorough advance verification before use. For the metal PCB's insulation, it is recommended to use stress-reducing materials 5. The products cannot be used for hand soldering and dipping (Through the Wave) soldering. 6. When cleaning, using isopropyl alcohol is recommended. Some chemicals, including Freon substitute detergent could corrode the surface of products, which cause discoloration, clouding, cracks and so on. Please review the reference chart below when cleaning. If water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the LED before using. Cleaning with supersonic wave is not recommended. 2017.4.25 Cleaning Agents Recommended / Not recommended Isopropyl Alcohol Ethyl Alcohol Pure water Trichloroethylene Chlorothene Acetone Thinner Recommended Recommended Recommended x Not recommended x Not recommended x Not recommended x Not recommended Page : 9 Handling Precaution MFN1106MS-TR 【For Electric Static Discharge ( ESD)】 1. Electrification/Static Electricity protection In order to avoid product (die) damage from static electricity caused by electrified operator and other materials electrified friction coming in contact with the product, Stanley recommends taking the following precautions. ① Do not place electrified non-conductive materials near the LED product. Avoid LED products from coming into contact with metallic materials.( Should the metallic material be electrified , the sudden surge voltage will most likely damage the product.) ② Avoid a working process which may cause the LED product to rub against other materials. ③ Install ground wires for any equipment, where they can be installed, with measures to avoid static electricity surges. ④ Prepare a ESD protective area by placing a Conductive Mattress (1MΩ MAX.) and Ionizer to remove any static electricity. ⑤ Operators should wear a protective wrist-strap. ⑥ Operators should wear conductive work-clothes and shoes. ⑦ To handle the products directly, Stanley recommends the use of ceramic, and not metallic, tweezers. 2. Working Environment ① Dry environment is more likely to cause static electricity. Although a dry environment is ideal for storage state of LED products, Stanley recommends an environment with approximately 50% humidity after the soldering process. ② Recommended static electricity level in the working environment is 150V or less, which is the same value as Integrated Circuits (which are sensitive to static electricity). 2017.4.25 Page : 10 Handling Precaution MFN1106MS-TR 【Other Precautions】 1. The products are designed to achieve higher performance reliability, however, they can be influenced by usage conditions. 2. Absolute maximum ratings are set to prevent LED products from failing due to excess stress (temperature, current, voltage, etc.). These ratings must never be overrun even for a moment. 3. To achieve the highest performance reliability, it is necessary to take into account, factors such as forward voltage adjusted to the usage temperature condition, derating of the power consumption, and other variable factors. 4. Please insert Straight Protective Resistors into the circuit in order to stabilize LED operation and to prevent the device from igniting due to excess current. 5. Please avoid to using the products with materials and products that contain sulfur and chlorine elements because the reliability may be decreased. Please keep in desiccator before and after mounting, to prevent the products from being affected by corrosive gas. Also please make sure there isn't any gas in the surrounding area or entering from outside when using the products. 6. Please avoid to stick foreign material because molding resin in the products has adhesiveness. And please don't touch lens portion. 7. Supersonic wave welding is not recommended because wire open circuit may occur. ex) bonding outer lens to this product or housing 8. Please check the actual performance in the assembly because the Specification Sheets are described for LED device only. 9. When there is a process of supersonic wave welding etc. after mounting the product, there is a possibility of affecting on the reliability of junction part in package (junction part of die bonding and wire bonding). Please make sure there is no problem before using. 10. The products are designed to perform without failure in the recommended usage conditions. However, please take the necessary precautions to prevent fire, injury, and other damage from these unexpected failures. 11. The products are manufactured to be used for ordinary electronic equipment. Please contact our sales staff in advance when exceptional quality and reliability are required, when the failure or malfunction of the products might directly jeopardize life or health (such as for airplanes, aerospace, medical applications, nuclear reactor control systems and so on). 2017.4.25 Page : 11 Handling Precaution MFN1106MS-TR 【Other Precautions】 12. Please avoid overload to the product when using tweezers to pick up LEDs. Overload might cause deformation, disconnection, chip-outs and consequently lead to lighting failure. Tweezers with flat tips is recommended, please avoid using tweezers with sharp tips. Do not pick up by this area. (Lens part) Pick up point : substrate part. 13. Low hardness resin is used for lens. Please avoid overload to the surface of lens which might cause chip-outs, encapsulant delamination, and deformation, nicks, wire disconnection and decreasing reliability. Be careful when dealing with the products and pay attention to following points. a) During mounting process, keep lens from coming in contact with absorbing nozzle and refer to precautions on next page. b) Pay attention to handling and storage of LEDs even after mounting, because overload caused by stacking PCBs and shock due to dropping and crashing might also lead to deformation, disconnection, and chip-outs. c) In the processes of water pressure during cleaning, air pressure, drying and other processes after mounting, overload to lends should be avoided. Wire deforming caused by pressure test from upper side of lens 14. The formal specification sheets should be exchanged and signed by both parties. 2017.4.25 Page : 12 Handling Precaution MFN1106MS-TR 【 Handling Precautions for Product Mounting 】 ＜Recommended conditions＞ Pick up point : Substrate area of LED ( area) (Shown below) Non allowed pick up area (Lens portion) Load : Less than 5N：reference （to avoid the product breakage） Pick up area(Substrate area) A convex shape lens. Please adjust the load, the pick up point, the nozzle diameter and etc. before mounting because the over load can cause the breakage of the surrounding of LED. Recommendation of nozzle ・Internal diameter of nozzle : φ3.3mm ・External diameter of nozzle : φ3.7mm ・Pick-up position of nozzle : From the top of emboss tape ・If nozzle size is larger than opening part of emboss tape, pick-up should be done 0.1mm upper from emboss tape, or you can set holes (so that air can leak) on nozzle. 2017.4.25 Page : 13 Packaging Specifications MFN1106MS-TR This product is shipped in moisture-proof packaging (as shown below) to minimize moisture absorption during shipping. However, in regards to storing the products, the use of dry-box under the following conditions is recommended. Moisture-proof bag as the packaging is made of anti-static material but packaging box is not. 【Recommended Storage Condition / Products Warranty Period】 Temperature +5～30℃ Humidity Under 60% In the case of the package unopened , 6 months under 【 Recommended storage condition 】. Please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. 【Time Elapsed after Package Opening】 This product is equivalent to IPC/JEDEC J-STD-020D MSL 2a. (4 weeks) The package should not be opened until immediately prior to its use. If any components should remain after their use, please seal the package and store them under the conditions described in the above 【 Recommended Storage Condition 】. Baking process should be performed after putting out from package. Baking conditions: 10h(min.), at +60±5℃ just before use Baking may be performed in the tape-reel form, however if it is performed with the reel stacked over one another, it may case deformation of the reels and taping materials, which may cause problems during production. Please make sure that the product has cooled to normal temperature after performing the baking process. Provided that, baking process shall be 2 times MAX. 2017.4.25 Page : 14 Packaging Specification MFN1106MS-TR 【Moisture-proof Packaging Specification】 Fastener for re-storage after opening bag ① Customer's opening position Product Label A Heat Sealing position (after product being put in) (Desiccant with indicator for moisture level is enclosed.) NO. PART NAME MATELRIAL REMARKS ① Moisture-proof bag with Aluminum layer PET+Al+PE with ESD protection Flow chart：Package to Mounting 【Flow Chart-package OpeningOpening to Mounting】 Stored under recommended condition Moisture-proof package first time opening Allowable leaving time exceeded (*) Yes No Discoloration of silica gel Yes No Baking LED under recommended condition Product Mounting Allowable leaving time means the maximum allowable leaving time after opening package, which depends on each LED type. The allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. When judging if the allowable leaving time has exceeded or not, please subtract the soldering time. The allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. Unused-product remained Yes Return to moisture-proof package and seal No Finished Reopen the moisture-proof package 2017.4.25 Page : 15 Packaging Specifications MFN1106MS-TR 【Packing Box】 ( RoHS・ELV Compliant) Box Type Outline dimension L × W × H (mm) Capacity of the box Type A 280 × 265 × 45 (mm) 2 reels Type B 310 × 235 × 265 (mm) 10 reels Type C 440 × 310 × 265 (mm) 20 reels The above measures are all the reference values. The box is selected out of the above table by shipping quantity. Type A Material / box ： Cardboard C5BF 2017.4.25 Type B,C Material / box ： Cardboard K5AF Partition ： Cardboard K5AF NO. PART NAME MATERIAL REMARKS ② Packing Box Corrugated Cardbord without ESD protection Page : 16 Packaging Specifications MFN1106MS-TR 【Label Specification】 ( acc.to JIS-X0503(Code-39) A Product label A. Parts number B. Bar-code for parts number C. Parts code (In-house identification code for each parts number) D. Packed parts quantity E. Bar-Code for packed parts quantity F. Lot number & Rank (refer to Lot Number Notational System for details ) G. Bar-Code for Lot number & Rank B Opto device label A. Customer Name B. Parts Type C. Parts Code D. Parts Number E. Packed Parts Quantity F. Carton Number G. Shipping Date H. Bar-Code for In-house identification Number <Remarks> Bar-code font : acc.to Code-39(JIX0503) 2017.4.25 Page : 17 Taping and Reel Specifications MFN1106MS-TR (acc.to JIS-C0806-03） Cathode mark 【Appearance】 Cathode side Cover tape Trailer area Parts loaded area Leader area Note "-TR" means Cathode Side of LEDs should be placed on the sprocket-hole side. Items Specifications Remarks Cover-tape Cover-tape shall be longer than 300mm without carrier-tape The end of cover-tape shall be held with adhesive tape. Carrier-tape Empty pocket shall be more than 13 pieces. (100mm) Please refer to the above figure for Taping & reel orientation . Empty pocket shall be more than 20 pieces. (160mm) The end of taping shall be inserted into a slit of the hub. Leader area Trailer area 2017.4.25 Page : 18 Taping and Reel Specifications MFN1106MS-TR (acc.to JIS-C0806-03） 【Qty. per Reel】 500parts/reel Minimum Qty. per reel might be 100 parts when getting less than 500 parts. In such case, parts of 100-unit-qty. shall be packed in a reel and the qty. shall be identified on the label. 【Mechanical Strength】 Cover-tape adhesive strength shall be 0.1～1.3N ( An angle between carrier-tape and cover-tape shall be170 deg. ) Both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. 【Others】 Reversed-orientation, Up-side down placing, side placing and out of spec. parts mixing shall not be held. Empty pocket per reel is assumed until 1 piece. 2017.4.25 Page : 19 Taping and Reel Specifications MFN1106MS-TR (acc.to JIS-C0806-03） ：mm Unit 【Taping Dimensions】 Cathode side ① ② A－A’ cross section Center hole 【Reel Dimensions】 ③ 2017.4.25 NO. PART NAME REMARKS ① Carrier-tape with ESD protection ② Cover-tape with ESD protection ③ Carrier-reel with ESD protection Page : 20 Lot Number Notational System ① ② ③ ④ ⑤ MFN1106MS-TR ⑥ ⑦ ⑧ ⑨ ① - 1digit ： Production Location (Mark identify alphabet) ② - 1digit ： Production Year (Last digit of Production Year 2017→7, 2020→0, 2021→1,･･･) ③ - 2digits ： Production Month (Jan. to Sep. , should be 01,02,03,･････) ④ - 2digits ： Production Date ⑤ - 3digits ： Serial Number ⑥ - 2digits ： Tape and Reel following Number ⑦ - 2digits ： Radiant intensity rank. (If luminous intensity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑧ - 2digits ： Chromaticity Rank (If chromaticity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑨ - 1digit ： Option Rank (Stanley normally print "-" to indicate) 2017.4.25 Page : 21 MFN1106MS-TR Correspondence to RoHS・ELV Instruction This product is in compliance with RoHS・ELV. Prohibition substance and it's criteria value of RoHS・ELV are as follows. ・RoHS instruction …… Refer to following (1)～(6). ・ELV instruction ………. Refer to following (1)～(4). 2017.4.25 Substance group name Criteria value (1) Lead and its compounds 1,000ppm Max (2) Cadmium and its compounds 100ppm Max (3) Mercury and its compounds 1,000ppm Max (4) Hexavalent chromium 1,000ppm Max (5) PBB 1,000ppm Max (6) PBDE 1,000ppm Max Page : 22 Reliability Testing Result MFN1106MS-TR 1. Reliability Testing Result No. Test Item Test Condition Duration Failure 1 High Temperature Operating Life Tj=125℃, IF =1,000mA 1,000h 0/18 2 Low Temperature Operating Life Ta=-40℃, IF =1,000mA 1,000h 0/18 3 High Temperature Humidity Bias Operating Life Ta=85℃, 85% Rh, IF =1,000mA 1,000h 0/18 4 Pulse Operating Life Ts=85℃, tw=100μs, 1%duty, IF=5,000mA 1,000h 0/18 5 High Temperature Intermission Blinking Operating Life Ta=85℃, IF =1,000mA (5minON-5minOFF) Blinking 85times/min. 1,000h 0/18 6 Low Temperature Intermission Blinking Operating Life Ta=-40℃, IF =1,000mA (5minON-5minOFF) Blinking 85times/min. 1,000h 0/18 7 High Temperature Storage Life Ta=125℃ 1,000h 0/18 8 Low Temperature Storage Life Ta=-40℃ 1,000h 0/18 9 Gas Exposure Test H2 S 3ppm, Ta=40℃,80% Rh 96h 0/18 10 Thermal Shock Ta=-40℃(15min) ～125℃(15min) 1,000cycles 0/18 11 Resistance to Reflow Soldering M oisture Soak:Jedec Level 2a Preheating:150～180℃ 120sec M AX. Soldering:260℃ 5sec 2times 0/18 12 Thermal Shock Operateing Cycle Ta=-40℃(15min.)～85℃(15min.), IF =1,000mA (Fig. 1) 1,000cycles 0/18 13 Temperature and humidity cycle Ta=-30～80℃, 90% Rh, IF =1,000mA 5min./on←→5min./off (Fig. 2) 30cycles 0/18 14 Electric Static Discharge HBM(C=100pF, R2=1.5kΩ, ±8kV) 3times of each polarity 0/18 15 Vibration Test 196m/s 2 , 50～500Hz x,y,z 20h of each direction 0/18 Fig.1 Thermal shock operating cycle Fig.2 Temperature and humidity cycle test 1cycle 8h 1cycle 30min. 90% Rh 1hr 85℃ 80℃ 15min. ON 1hr Normal Temp. 25℃ 2017.4.25 1hr 1hr 15min. OFF -40℃ 1hr 1hr -30℃ 1hr 1hr Page : 23 Reliability Testing result MFN1106MS-TR 2. Failure Criteria Item Symbol Acceptance Criteria Total radiant flux Φe Initial Value × 0.8 ＜Testing MIN. Value & Initial Value × 1.2 ≦ Testing MAX. Value Forward voltage VF Initial Value × 0.9 ＜ Measured Value ＜ Initial Value × 1.1 Appearance － Notable discoloration, deformation and crack 2017.4.25 Page : 24 MFN1106MS-TR Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com/en/ 2017.4.25 Page : 25