Diodes DMTH4005SPS N-channel enhancement mode mosfet Datasheet

DMTH4005SPS
Green
40V +175°C N-CHANNEL ENHANCEMENT MODE MOSFET
PowerDI5060-8
Product Summary
BVDSS
Features
40V

ID
TC = +25°C
(Note 9)
RDS(ON) Max

100A
3.7mΩ @ VGS = 10V
Description and Applications
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)), yet maintain superior switching performance, making it






ideal for high-efficiency power management applications.
Rated to +175°C – Ideal For High Ambient Temperature
Environments
100% Unclamped Inductive Switching – Ensures More Reliable
And Robust End Application
Low RDS(ON) – Minimizes Power Losses
Low Qg – Minimizes Switching Losses
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
An Automotive-Compliant Part is Available Under Separate
Datasheet (DMTH4005SPSQ)

Engine Management Systems
Mechanical Data

Body Control Electronics

DC-DC Converters





®
Case: PowerDI 5060-8
Case Material: Molded Plastic, ―Green‖ Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Finish - Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.097 grams (Approximate)
PowerDI5060-8
S
D
S
D
S
D
G
D
Pin1
Top View
Bottom View
Internal Schematic
Top View
Pin Configuration
Ordering Information (Note 4)
Part Number
DMTH4005SPS-13
Notes:
Case
PowerDI5060-8
Packaging
2,500 / Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
D
D
D
D
= Manufacturer’s Marking
H4005SS = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 17 = 2017)
WW = Week (01 to 53)
H4005SS
YY WW
S
S
S
G
POWERDI is a registered trademark of Diodes Incorporated.
DMTH4005SPS
Document number: DS38150 Rev. 3 - 2
1 of 7
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September 2017
© Diodes Incorporated
DMTH4005SPS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
TA = +25°C
TA = +70°C
TC = +25°C
TC = +100°C
Continuous Drain Current (Note 5)
Continuous Drain Current (Notes 6 & 9)
Maximum Continuous Body Diode Forward Current (Note 6)
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Avalanche Current, L=0.6mH
Avalanche Energy, L=0.6mH
ID
Value
40
±20
20.9
17.5
Unit
V
V
ID
100
100
A
IS
IDM
IAS
EAS
100
320
21
132.3
A
A
A
mJ
Symbol
PD
RθJA
PD
RθJC
TJ, TSTG
Value
2.6
57
150
1
-55 to +175
Unit
W
°C/W
W
°C/W
°C
A
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
TA= +25°C
TC = +25°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Drain-Source Breakdown Voltage
BVDSS
40
—
V
VGS = 0V, ID = 1mA
Zero Gate Voltage Drain Current
IDSS
1
μA
VDS = 32V, VGS = 0V
Gate-Source Leakage
IGSS
—
—
—
±100
nA
VGS = ±20V, VDS = 0V
VDS = VGS, ID = 250μA
OFF CHARACTERISTICS (Note 7)
—
—
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(TH)
Static Drain-Source On-Resistance
RDS(ON)
Diode Forward Voltage
VSD
2
—
4
V
—
—
2.9
3.7
mΩ
VGS = 10V, ID = 50A
0.88
—
V
VGS = 0V, IS = 50A
3062
pF
VDS = 20V, VGS = 0V,
f = 1MHz
Ω
VDS = 0V, VGS = 0V, f = 1MHz
nC
VDD = 20V, ID = 50A,
VGS = 10V
ns
VDD = 20V, VGS = 10V,
ID = 50A, RG = 3Ω
DYNAMIC CHARACTERISTICS (Note 8)
tF
—
—
—
—
—
—
—
—
—
—
—
7.3
—
—
—
—
—
—
—
—
—
—
—
Body Diode Reverse Recovery Time
tRR
—
31.8
—
ns
Body Diode Reverse Recovery Charge
QRR
—
26.5
—
nC
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Gate Resistance
Rg
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
tD(ON)
Turn-On Rise Time
tR
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
tD(OFF)
902.2
179.2
0.67
49.1
10.3
13
8.7
6.8
18.6
IF = 50A, di/dt = 100A/μs
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.
6. Thermal resistance from junction to soldering point (on the exposed drain pad).
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
9. Package limited.
DMTH4005SPS
Document number: DS38150 Rev. 3 - 2
2 of 7
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September 2017
© Diodes Incorporated
DMTH4005SPS
30
100.0
VGS = 6.0V
80.0
VGS = 5.0V
25
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VDS = 6.0V
VGS = 10.0V
90.0
70.0
60.0
50.0
VGS = 4.5V
40.0
30.0
20.0
VGS = 3.8V
10.0
20
15
125℃
10
5
VGS = 4.0V
0
-55℃
0.5
1
1.5
2
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
2
3
2.5
3
3.5
4
4.5
VGS, GATE-SOURCE VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (mΩ)
5.00
4.50
VGS = 6.0V
4.00
3.50
3.00
VGS = 10.0V
2.50
2.00
0
5
Figure 2 Typical Transfer Characteristic
Figure 1 Typical Output Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (mΩ)
25℃
175℃
0
0.0
5
10
15
20
25
ID, DRAIN-SOURCE CURRENT (A)
30
20
16
12
ID = 50A
ID = 20A
8
4
0
2
Figure 3 Typical On-Resistance vs. Drain Current and
Gate Voltage
4
6
8
10
12
14
16
18
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Transfer Characteristic
20
2
0.006
VGS = 10V
175℃
0.005
150℃
125℃
0.004
85℃
0.003
25℃
0.002
-55℃
0.001
0
10
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
85℃
150℃
20
30 40 50 60 70 80 90 100
ID, DRAIN CURRENT (A)
Figure 5 Typical On-Resistance vs. Drain Current and
Temperature
DMTH4005SPS
Document number: DS38150 Rev. 3 - 2
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1.8
1.6
VGS = 10V, ID = 50A
1.4
1.2
VGS = 6V, ID = 50A
1
0.8
0.6
0.4
-50
-25
0
25
50
75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 6 On-Resistance Variation with Temperature
September 2017
© Diodes Incorporated
0.01
0.008
VGS = 6V, ID = 50A
0.006
0.004
VGS = 10V, ID = 50A
0.002
0
-50
-25
3.4
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
DMTH4005SPS
3.2
3
ID = 1mA
2.8
2.6
2.4
2.2
ID = 250μA
2
1.8
1.6
1.4
1.2
1
0
25
50
75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
-50
0
25
50
75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 8 Gate Threshold Variation vs. Temperature
Figure 7 On-Resistance Variation with Temperature
10000
100
f = 1MHz
90
C iss
VGS = 0V
CT , JUNCTION CAPACITANCE (pF)
IS, SOURCE CURRENT (A)
-25
80
70
60
50
40
TA = 125oC
30
20
TA = 150oC
10
175oC
TA =
TA = 85oC
TA = 25oC
TA = -55oC
0
1000
Crss
100
10
0
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Coss
1.5
0
5
10
15
20
25
30
35
V DS, DRAIN-SOURCE VOLTAGE (V)
Figure
Figure 11
10 Typical
Typical Junction
Junction Capacitance
Capacitance
40
Figure 9 Diode Forward Voltage vs. Current
1000
10
8
100
ID, DRAIN CURRENT (A)
VGS
, GATE-SOURCE
VGS
GATE
THRESHOLDVOLTAGE
VOLTAGE(V)
(V)
RDS(ON) LIMITED
VDS = 20V
I D = 50A
6
4
PW =1µs
PW =10µs
10
PW =1ms
1
2
0
PW =100µs
TJ(MAX)=175℃
TC=25℃
Single Pulse
DUT on infinite
heatsink
VGS=10V
PW =10ms
PW =100ms
PW =1s
0.1
0
10
20
30
40
Qg , TOTAL GATE CHARGE (nC)
Figure 11 Gate Charge
DMTH4005SPS
Document number: DS38150 Rev. 3 - 2
50
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0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12 SOA, Safe Operation Area
100
September 2017
© Diodes Incorporated
DMTH4005SPS
1
r(t), TRANSIENT THERMAL RESISTANCE
D=0.7
D=0.5
D=0.3
D=0.9
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
RθJC(t) = r(t) * RθJC
RθJC = 1℃/W
Duty Cycle, D = t1 / t2
D=0.005
D=Single Pulse
0.001
1E-06
1E-05
0.0001
0.001
0.01
0.1
t1, PULSE DURATION TIME (sec)
1
10
Figure 13. Transient Thermal Resistance
DMTH4005SPS
Document number: DS38150 Rev. 3 - 2
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September 2017
© Diodes Incorporated
DMTH4005SPS
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
D
Detail A
D1
0(4X)
c
A1
E1 E
e
01 (4X)
1
b (8X)
e/2
1
L
b2 (4X)
D3
A
K
D2
E3 E2
M
M1
Detail A
L1
G
b3 (4X)
PowerDI5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05
b
0.33
0.51
0.41
b2
0.200
0.350 0.273
b3
0.40
0.80
0.60
c
0.230
0.330 0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.70
4.10
3.90
D3
3.90
4.30
4.10
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E3
3.99
4.39
4.19
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51
L
0.51
0.71
0.61
L1
0.100
0.200 0.175
M
3.235
4.035 3.635
M1
1.00
1.40
1.21
θ
10º
12º
11º
θ1
6º
8º
7º
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
X4
Y2
X3
Y3
Y5
Y1
X2
Y4
X1
Y7
Y6
G1
C
X
DMTH4005SPS
Document number: DS38150 Rev. 3 - 2
G
Y(4x)
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Dimensions
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value (in mm)
1.270
0.660
0.820
0.610
4.100
0.755
4.420
5.610
1.270
0.600
1.020
0.295
1.825
3.810
0.180
6.610
September 2017
© Diodes Incorporated
DMTH4005SPS
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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website, harmless against all damages.
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final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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Copyright © 2017, Diodes Incorporated
www.diodes.com
DMTH4005SPS
Document number: DS38150 Rev. 3 - 2
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September 2017
© Diodes Incorporated
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