ON NLU1GU04CMUTCG Single unbuffered inverter Datasheet

NLU1GU04
Single Unbuffered Inverter
The NLU1GU04 MiniGatet is an advanced high−speed CMOS
unbuffered inverter in ultra−small footprint.
This device is well suited for use in oscillator, pulse−shaping and
high input impedance amplifier applications. For digital applications,
the NLU1GU04 is recommended.
The NLU1GU04 input and output structures provide protection
when voltages up to 7.0 V are applied, regardless of the supply
voltage.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
High Speed: tPD = 2.5 ns (Typ) @ VCC = 5.0 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
Power Down Protection Provided on inputs
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
Ultra−Small Packages
These are Pb−Free Devices
NC
1
6
1
5
2
KM
UDFN6
1.0 x 1.0
CASE 517BX
YM
UDFN6
1.45 x 1.0
CASE 517AQ
TM
1
1
VCC
K
M
IN A
UDFN6
1.2 x 1.0
CASE 517AA
= Device Marking
= Date Code
NC
ORDERING INFORMATION
GND
3
4
See detailed ordering and shipping information on page 4 of
this data sheet.
OUT Y
Figure 1. Pinout (Top View)
1
IN A
OUT Y
Figure 2. Logic Symbol
PIN ASSIGNMENT
1
NC
2
IN A
3
GND
4
OUT Y
A
Y
5
NC
6
VCC
L
H
H
L
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 5
FUNCTION TABLE
1
Publication Order Number:
NLU1GU04/D
NLU1GU04
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
DC Output Voltage
−0.5 to +7.0
V
VIN < GND
−20
mA
VOUT < GND
±20
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±12.5
mA
ICC
DC Supply Current Per Supply Pin
±25
mA
IGND
DC Ground Current per Ground Pin
±25
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
VESD
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen
Index: 28 to 34
ESD Withstand Voltage
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latchup Performance Above VCC and Below GND at 125 °C (Note 5)
> 2000
> 200
N/A
V
±500
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22−A114−A.
3. Tested to EIA / JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
0
5.5
V
Output Voltage
0
5.5
V
−55
+125
°C
0
0
100
20
ns/V
VOUT
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
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2
NLU1GU04
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VIH
Low−Level
Input
Voltage
VIL
VOH
VOL
Conditions
Low−Level
Output
Voltage
Min
1.65
0.85 x
VCC
0.80 x
VCC
2.3 to 5.5
Low−Level
Input
Voltage
High−Level
Output
Voltage
VCC (V)
Typ
Max
0.15 x
VCC
0.20 x
VCC
2.3 to 5.5
2.0
3.0
4.5
1.9
2.9
4.4
VIN = VIH or VIL
IOH = −4 mA
IOH = −8 mA
3.0
4.5
2.58
3.94
VIN = VIH or VIL
IOL = 50 mA
2.0
3.0
4.5
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
IIN
Input
Leakage
Current
0 v VIN v 5.5 V
ICC
Quiescent
Supply
Current
VIN = 5.5 V or
GND
Min
Max
Min
Max
0.85 x
VCC
0.80 x
VCC
1.65
VIN = VIH or VIL
IOH = −50 mA
TA = −555C to
+1255C
TA = +855C
TA = 25 5C
2.0
3.0
4.5
0
0
0
Unit
V
0.15 x
VCC
0.20 x
VCC
0.15 x
VCC
0.20 x
VCC
1.9
2.9
4.4
1.9
2.9
4.4
2.48
3.80
2.34
3.66
V
V
V
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
0 to 5.5
±0.1
±1.0
±1.0
mA
5.5
1.0
20
40
mA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
TA = 25 5C
TA = +855C
TA = −555C
to +1255C
Min
Min
Symbol
Parameter
VCC
(V)
Test
Condition
Typ
Max
Max
Unit
tPLH,
tPHL
Propagation Delay, Input A to
Output Y
3.0 to
3.6
CL = 15 pF
3.5
8.9
10.5
12
ns
CL = 50 pF
4.8
11.4
13
15.5
4.5 to
5.5
CL = 15 pF
2.5
5.5
6.5
8.0
CL = 50 pF
3.8
7.0
8.0
9.5
4
10
10
10
CIN
Input Capacitance
CPD
Power Dissipation
Capacitance (Note 6)
Min
5.0
22
Max
pF
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
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3
NLU1GU04
A or B
VCC
50%
GND
tPLH
Y
tPHL
50% VCC
Figure 3. Switching Waveforms
OUTPUT
INPUT
CL*
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for propagation delay tests.
Figure 4. Test Circuit
ORDERING INFORMATION
Package
Shipping†
NLU1GU04MUTCG
UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLU1GU04AMUTCG
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLU1GU04CMUTCG
UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU1GU04
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
DETAIL B
OPTIONAL
CONSTRUCTIONS
A
0.05 C
A1
SIDE VIEW
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
A2
6X
C
6X
SEATING
PLANE
0.30
PACKAGE
OUTLINE
L
1.24
3
DETAIL A
6X
0.53
4
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
e
1
6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
6X
0.50
PITCH
DIMENSIONS: MILLIMETERS
b
0.10 C A B
0.05 C
1
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
NLU1GU04
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
0.10 C
2X
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
0.05 C
SIDE VIEW
A1
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
5X
e
5X
0.48
L
6X
0.22
3
1
L1
1.18
6
4
BOTTOM VIEW
6X
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6
NLU1GU04
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
EDGE OF PACKAGE
PIN ONE
REFERENCE
2X
0.10 C
L1
ÉÉ
ÉÉ
E
DETAIL A
Bottom View
(Optional)
TOP VIEW
2X
EXPOSED Cu
0.10 C
(A3)
0.10 C
A1
A
10X
0.08 C
ÉÉÉ
ÉÉÉ
MOLD CMPD
5X
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
MOUNTING FOOTPRINT*
6X
C
A1
A3
DETAIL B
Side View
(Optional)
SEATING
PLANE
SIDE VIEW
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
6X
0.42
0.22
L
3
L2
6X
b
0.10 C A B
0.05 C
6
0.40
PITCH
4
e
NOTE 3
BOTTOM VIEW
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NLU1GU04/D
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