Material Content Data Sheet Sales Product Name ICE1HS01G MA# MA000711866 Package PG-DSO-8-41 Issued 27. May 2015 Weight* 81.15 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 3.020 3.72 0.008 0.01 0.034 0.04 415 0.673 0.83 8294 27.330 33.68 34.56 336780 345593 0.116 0.14 0.14 1432 1432 0.143 0.18 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.72 37218 37218 104 1758 4.613 5.68 42.800 52.75 58.61 527408 586009 0.814 1.00 1.00 10029 10029 0.090 0.11 0.11 1104 1104 0.302 0.37 1.209 1.49 56843 3723 1.86 14892 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 18615 1000000