Vishay GSOT15C-HT3 Two-line esd-protection in llp75 Datasheet

GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
Two-Line ESD-Protection in LLP75
Features
• Two-line ESD-protection device
• ESD-immunity acc. IEC 61000-4-2
± 30 kV contact discharge
e3
± 30 kV air discharge
• Space saving LLP package
• Lead (Pb)-free component
• Lead finish = "e3" = matte tin (Sn)
• Non-magnetic
• "Green" molding compound
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
3
2
1
20237
20514
1
Marking (example only)
XX
YY
Dot = Pin 1 marking
XX = Date code
YY = Type code (see table below)
21001
Ordering Information
Ordering code
Taped units per reel
(8 mm tape on 7" reel)
Minimum order quantity
GSOT03C-HT3
GSOT03C-HT3-GS08
3000
15000
GSOT04C-HT3
GSOT04C-HT3-GS08
3000
15000
GSOT05C-HT3
GSOT05C-HT3-GS08
3000
15000
GSOT08C-HT3
GSOT08C-HT3-GS08
3000
15000
GSOT12C-HT3
GSOT12C-HT3-GS08
3000
15000
GSOT15C-HT3
GSOT15C-HT3-GS08
3000
15000
GSOT24C-HT3
GSOT24C-HT3-GS08
3000
15000
GSOT36C-HT3
GSOT36C-HT3-GS08
3000
15000
Device name
Package Data
Device name
Package
name
Marking
code
Weight
Molding compound
flammability rating
GSOT03C-HT3
LLP75-3B
03
5.1 mg
UL 94 V-0
MSL level 1 (according J-STD-020) 260 °C/10 s at terminals
GSOT04C-HT3
LLP75-3B
04
5.1 mg
UL 94 V-0
MSL level 1 (according J-STD-020) 260 °C/10 s at terminals
GSOT05C-HT3
LLP75-3B
05
5.1 mg
UL 94 V-0
MSL level 1 (according J-STD-020) 260 °C/10 s at terminals
GSOT08C-HT3
LLP75-3B
08
5.1 mg
UL 94 V-0
MSL level 1 (according J-STD-020) 260 °C/10 s at terminals
GSOT12C-HT3
LLP75-3B
12
5.1 mg
UL 94 V-0
MSL level 1 (according J-STD-020) 260 °C/10 s at terminals
GSOT15C-HT3
LLP75-3B
15
5.1 mg
UL 94 V-0
MSL level 1 (according J-STD-020) 260 °C/10 s at terminals
GSOT24C-HT3
LLP75-3B
24
5.1 mg
UL 94 V-0
MSL level 1 (according J-STD-020) 260 °C/10 s at terminals
GSOT36C-HT3
LLP75-3B
36
5.1 mg
UL 94 V-0
MSL level 1 (according J-STD-020) 260 °C/10 s at terminals
Document Number 85825
Rev. 1.7, 21-Apr-08
Moisture sensitivity level
For technical support, please contact: [email protected]
Soldering conditions
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1
GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
Absolute Maximum Ratings
GSOT03C-HT3
Rating
Peak pulse current
Peak pulse power
ESD immunity
Operating temperature
Test condition
Symbol
Value
Unit
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
30
A
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
30
A
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
369
W
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
504
W
Contact discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Air discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Junction temperature
TJ
- 40 to + 125
°C
TSTG
- 55 to + 150
°C
Storage temperature
GSOT04C-HT3
Rating
Peak pulse current
Peak pulse power
ESD immunity
Operating temperature
Test condition
Symbol
Value
Unit
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
30
A
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
30
A
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
429
W
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
564
W
Contact discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Air discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Junction temperature
TJ
- 40 to + 125
°C
TSTG
- 55 to + 150
°C
Storage temperature
GSOT05C-HT3
Rating
Peak pulse current
Peak pulse power
ESD immunity
Operating temperature
Storage temperature
www.vishay.com
2
Test condition
Symbol
Value
Unit
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
30
A
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
30
A
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
480
W
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
612
W
Contact discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Air discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
TJ
- 40 to + 125
°C
TSTG
- 55 to + 150
°C
Junction temperature
For technical support, please contact: [email protected]
Document Number 85825
Rev. 1.7, 21-Apr-08
GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
GSOT08C-HT3
Rating
Peak pulse current
Peak pulse power
ESD immunity
Operating temperature
Test condition
Symbol
Value
Unit
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
18
A
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
18
A
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
345
W
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
400
W
Contact discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Air discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Junction temperature
TJ
- 40 to + 125
°C
TSTG
- 55 to + 150
°C
Storage temperature
GSOT12C-HT3
Rating
Peak pulse current
Peak pulse power
ESD immunity
Operating temperature
Test condition
Symbol
Value
Unit
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
12
A
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
12
A
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
312
W
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
337
W
Contact discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Air discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Junction temperature
TJ
- 40 to + 125
°C
TSTG
- 55 to + 150
°C
Storage temperature
GSOT15C-HT3
Rating
Peak pulse current
Peak pulse power
ESD immunity
Operating temperature
Storage temperature
Document Number 85825
Rev. 1.7, 21-Apr-08
Test condition
Symbol
Value
Unit
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
8
A
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
8
A
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
230
W
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
245
W
Contact discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Air discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Junction temperature
TJ
- 40 to + 125
°C
TSTG
- 55 to + 150
°C
For technical support, please contact: [email protected]
www.vishay.com
3
GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
GSOT24C-HT3
Rating
Peak pulse current
Peak pulse power
ESD immunity
Operating temperature
Test condition
Symbol
Value
Unit
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
5
A
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
5
A
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
235
W
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
240
W
Contact discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Air discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Junction temperature
TJ
- 40 to + 125
°C
TSTG
- 55 to + 150
°C
Storage temperature
GSOT36C-HT3
Rating
Peak pulse current
Peak pulse power
ESD immunity
Operating temperature
Storage temperature
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4
Test condition
Symbol
Value
Unit
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
3.5
A
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
IPPM
3.5
A
Pin 1 to 3 or pin 2 to 3
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
248
W
Pin 1 to 2 or pin 2 to 1; pin 3 not connected
Acc. IEC 61000-4-5, tP = 8/20 µs; single shot
PPP
252
W
Contact discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
Air discharge acc. IEC 61000-4-2; 10 pulses
VESD
± 30
kV
TJ
- 40 to + 125
°C
TSTG
- 55 to + 150
°C
Junction temperature
For technical support, please contact: [email protected]
Document Number 85825
Rev. 1.7, 21-Apr-08
GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
BiAs-Mode (2-line Bidirectional Asymmetrical protection mode)
With the GSOTxxC-HT3 two signal- or data-lines (L1, L2) can be protected against voltage transients. With
pin 3 connected to ground and pin 1 and pin 2 connected to a signal- or data-line which has to be protected.
As long as the voltage level on the data- or signal-line is between 0 V (ground level) and the specified Maximum
Reverse Working Voltage (VRWM) the protection diode between pin 2 and pin 3 and between pin 1 and pin 3
offer a high isolation to the ground line. The protection device behaves like an open switch.
As soon as any positive transient voltage signal exceeds the break through voltage level of the protection
diode, the diode becomes conductive and shorts the transient current to ground. Now the protection device
behaves like a closed switch. The Clamping Voltage (VC) is defined by the BReakthrough Voltage (VBR) level
plus the voltage drop at the series impedance (resistance and inductance) of the protection device.
Any negative transient signal will be clamped accordingly. The negative transient current is flowing in the
forward direction of the protection diode. The low Forward Voltage (VF) clamps the negative transient close to
the ground level.
Due to the different clamping levels in forward and reverse direction the GSOTxxC-HT3 clamping behaviour is
Bidirectional and Asymmetrical (BiAs).
L1
L2
1
2
3
20239
If a higher surge current or Peak Pulse current (IPP) is needed, both protection diodes in the GSOTxxC-HT3
can also be used in parallel in order to "double" the performance.
This offers: •
double surge power = double peak pulse current (2 x IPPM)
•
halve line inductance = reduced clamping voltage
•
halve line resistance = reduced clamping voltage
•
double Diode Capacitance (2 x CD)
•
double Reverse leakage current (2 x IR)
L1
1
2
3
20240
Document Number 85825
Rev. 1.7, 21-Apr-08
For technical support, please contact: [email protected]
www.vishay.com
5
GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
Electrical Characteristics
Ratings at 25 °C, ambient temperature unless otherwise specified
GSOT03C-HT3
BiAs mode (between pin 1 to 3 or pin 2 to 3)
Parameter
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
Reverse stand off voltage
at IR = 100 µA
VRWM
Reverse current
at VR = 3.3 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
Protection paths
Reverse clamping voltage
Forward clamping voltage
Capacitance
Min.
Typ.
Max.
Unit
2
lines
100
µA
3.3
4
V
4.6
V
at IPP = 1 A
VC
5.7
7.5
at IPP = IPPM = 30 A
VC
10
12.3
V
at IPP = 1 A
VF
1
1.2
V
600
pF
at IPP = IPPM = 30 A
VF
4.5
at VR = 0 V; f = 1 MHz
CD
420
at VR = 1.6 V; f = 1 MHz
CD
260
V
V
pF
GSOT04C-HT3
BiAs mode (between pin 1 to 3 or pin 2 to 3)
Parameter
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
at IR = 20 µA
VRWM
Reverse current
at VR = 4 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
at IPP = 1 A
VC
at IPP = IPPM = 30 A
at IPP = 1 A
Protection paths
Reverse stand off voltage
Reverse clamping voltage
Forward clamping voltage
Capacitance
Min.
Typ.
Max.
Unit
2
lines
4
V
20
µA
7.5
9
V
VC
11.2
14.3
V
VF
1
1.2
V
at IPP = IPPM = 30 A
VF
4.5
at VR = 0 V; f = 1 MHz
CD
310
at VR = 2 V; f = 1 MHz
CD
200
5
6.1
V
V
450
pF
pF
GSOT05C-HT3
BiAs mode (between pin 1 to 3 or pin 2 to 3)
Parameter
Protection paths
Reverse stand off voltage
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
at IR = 10 µA
VRWM
Min.
Typ.
Max.
Unit
2
lines
5
V
Reverse current
at VR = 5 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
at IPP = 1 A
VC
7
8.7
at IPP = IPPM = 30 A
VC
12
16
V
at IPP = 1 A
VF
1
1.2
V
at IPP = IPPM = 30 A
VF
4.5
at VR = 0 V; f = 1 MHz
CD
260
350
pF
at VR = 2.5 V; f = 1 MHz
CD
150
Reverse clamping voltage
Forward clamping voltage
Capacitance
www.vishay.com
6
10
6
For technical support, please contact: [email protected]
6.8
µA
V
V
V
pF
Document Number 85825
Rev. 1.7, 21-Apr-08
GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
GSOT08C-HT3
BiAs mode (between pin 1 to 3 or pin 2 to 3)
Parameter
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
Reverse stand off voltage
at IR = 5 µA
VRWM
Reverse current
at VR = 8 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
Protection paths
Reverse clamping voltage
Forward clamping voltage
Capacitance
Min.
Typ.
Max.
Unit
2
lines
5
µA
8
9
V
10
V
at IPP = 1 A
VC
10.7
13
V
at IPP = IPPM = 18 A
VC
15.2
19.2
V
at IPP = 1 A
VF
1
1.2
V
250
pF
at IPP = IPPM = 18 A
VF
3
at VR = 0 V; f = 1 MHz
CD
160
at VR = 4 V; f = 1 MHz
CD
80
V
pF
GSOT12C-HT3
BiAs mode (between pin 1 to 3 or pin 2 to 3)
Parameter
Protection paths
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
Min.
Typ.
Max.
Unit
2
lines
1
µA
Reverse stand off voltage
at IR = 1 µA
VRWM
Reverse current
at VR = 12 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
at IPP = 1 A
VC
15.4
18.7
V
at IPP = IPPM = 12 A
VC
21.2
26
V
at IPP = 1 A
VF
1
1.2
V
at IPP = IPPM = 12 A
VF
2.2
at VR = 0 V; f = 1 MHz
CD
115
150
pF
at VR = 6 V; f = 1 MHz
CD
50
Reverse clamping voltage
Forward clamping voltage
Capacitance
12
13.5
V
15
V
V
pF
GSOT15C-HT3
BiAs mode (between pin 1 to 3 or pin 2 to 3)
Parameter
Test conditions/remarks
Symbol
Min.
Typ.
Max.
Unit
2
lines
1
µA
Number of lines which can be protected
Nlines
Reverse stand off voltage
at IR = 1 µA
VRWM
Reverse current
at VR = 15 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
at IPP = 1 A
VC
19.4
23.5
V
at IPP = IPPM = 8 A
VC
24.8
28.8
V
1.2
V
Protection paths
Reverse clamping voltage
Forward clamping voltage
Capacitance
Document Number 85825
Rev. 1.7, 21-Apr-08
15
16.5
V
18
at IPP = 1 A
VF
1
at IPP = IPPM = 8 A
VF
1.8
at VR = 0 V; f = 1 MHz
CD
90
at VR = 7.5 V; f = 1 MHz
CD
35
For technical support, please contact: [email protected]
V
V
120
pF
pF
www.vishay.com
7
GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
GSOT24C-HT3
BiAs mode (between pin 1 to 3 or pin 2 to 3)
Parameter
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
Reverse stand off voltage
at IR = 1 µA
VRWM
Reverse current
at VR = 24 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
Protection paths
Reverse clamping voltage
Forward clamping voltage
Capacitance
Min.
Typ.
Max.
Unit
2
lines
1
µA
24
27
V
30
V
at IPP = 1 A
VC
34
41
at IPP = IPPM = 5 A
VC
41
47
V
at IPP = 1 A
VF
1
1.2
V
80
pF
at IPP = IPPM = 5 A
VF
1.4
at VR = 0 V; f = 1 MHz
CD
65
at VR = 12 V; f = 1 MHz
CD
20
V
V
pF
GSOT36C-HT3
BiAs mode (between pin 1 to 3 or pin 2 to 3)
Parameter
Protection paths
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
Min.
Typ.
Max.
Unit
2
lines
1
µA
Reverse stand off voltage
at IR = 1 µA
VRWM
Reverse current
at VR = 36 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
at IPP = 1 A
VC
49
60
V
at IPP = IPPM = 3.5 A
VC
59
71
V
at IPP = 1 A
VF
1
1.2
V
at IPP = IPPM = 3.5 A
VF
1.3
at VR = 0 V; f = 1 MHz
CD
52
65
pF
at VR = 18 V; f = 1 MHz
CD
12
Reverse clamping voltage
Forward clamping voltage
Capacitance
www.vishay.com
8
36
39
For technical support, please contact: [email protected]
V
43
V
V
pF
Document Number 85825
Rev. 1.7, 21-Apr-08
GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
BiSy-mode (1-line Bidirectional Symmetrical protection mode)
If a bipolar symmetrical protection device is needed the GSOTxxC-HT3 can also be used as a single line
protection device. Therefore pin 1 has to be connected to the signal- or data-line (L1) and pin 2 to ground
(or vice versa). pin 3 must not be connected.
Positive and negative voltage transients will be clamped in the same way. The clamping current through the
GSOTxxC-HS3 passes one diode in forward direction and the other one in reverse direction. The Clamping
Voltage (VC) is defined by the BReakthrough Voltage (VBR) level of one diode plus the forward voltage of the
other diode plus the voltage drop at the series impedances (resistances and inductances) of the protection
device.
Due to the same clamping levels in positive and negative direction the GSOTxxC-HT3 voltage clamping
behaviour is Bidirectional and Symmetrical (BiSy).
L1
1
3
2
20241
Electrical Characteristics
Ratings at 25 °C, ambient temperature unless otherwise specified
GSOT03C-HT3
BiSy mode (between pin 1 to 2 or pin 2 to 1; pin 3 not connected)
Parameter
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
Reverse stand off voltage
at IR = 100 µA
VRWM
Reverse current
at VR = 3.8 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
Protection paths
Clamping voltage
Capacitance
Min.
Typ.
Max.
Unit
1
lines
100
µA
3.8
4.5
V
5.3
V
at IPP = 1 A
VC
7
8.4
V
at IPP = IPPM = 30 A
VC
14
16.8
V
at VR = 0 V; f = 1 MHz
CD
210
300
pF
at VR = 1.6 V; f = 1 MHz
CD
190
pF
GSOT04C-HT3
BiSy mode (between pin 1 to 2 or pin 2 to 1; pin 3 not connected)
Parameter
Test conditions/remarks
Symbol
Min.
Typ.
Max.
Unit
1
lines
20
µA
Number of lines which can be protected
Nlines
Reverse stand off voltage
at IR = 20 µA
VRWM
Reverse current
at VR = 4.5 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
at IPP = 1 A
VC
7.5
9
V
at IPP = IPPM = 30 A
VC
15.7
18.8
V
at VR = 0 V; f = 1 MHz
CD
155
225
pF
at VR = 2 V; f = 1 MHz
CD
135
Protection paths
Clamping voltage
Capacitance
Document Number 85825
Rev. 1.7, 21-Apr-08
4.5
5.5
For technical support, please contact: [email protected]
V
6.8
V
pF
www.vishay.com
9
GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
GSOT05C-HT3
BiSy mode (between pin 1 to 2 or pin 2 to 1; pin 3 not connected)
Parameter
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
Reverse stand off voltage
at IR = 10 µA
VRWM
Reverse current
at VR = 5.5 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
Protection paths
Clamping voltage
Capacitance
Min.
Typ.
Max.
Unit
1
lines
10
µA
5.5
6.5
V
7.5
V
at IPP = 1 A
VC
8.1
9.7
at IPP = IPPM = 30 A
VC
17
20.4
V
at VR = 0 V; f = 1 MHz
CD
130
175
pF
at VR = 2.5 V; f = 1 MHz
CD
100
V
pF
GSOT08C-HT3
BiSy mode (between pin 1 to 2 or pin 2 to 1; pin 3 not connected)
Parameter
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
at IR = 5 µA
VRWM
Reverse current
at VR = 8.5 V
IR
Reverse break down voltage
at IR = 1 mA
VBR
at IPP = 1 A
VC
at IPP = IPPM = 18 A
Protection paths
Reverse stand off voltage
Clamping voltage
Capacitance
Min.
Typ.
Max.
Unit
1
lines
5
µA
11.7
14
V
VC
18.5
22.2
V
at VR = 0 V; f = 1 MHz
CD
80
125
pF
at VR = 4 V; f = 1 MHz
CD
60
8.5
9.5
V
10.7
V
pF
GSOT12C-HT3
BiSy mode (between pin 1 to 2 or pin 2 to 1; pin 3 not connected)
Parameter
Protection paths
Reverse stand off voltage
Reverse current
Reverse break down voltage
Clamping voltage
Capacitance
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
at IR = 1 µA
VRWM
Min.
Typ.
Max.
Unit
1
lines
12.5
V
at VR = 12.5 V
IR
at IR = 1 mA
VBR
at IPP = 1 A
VC
16.4
19.7
at IPP = IPPM = 12 A
VC
23.4
28.1
V
at VR = 0 V; f = 1 MHz
CD
58
75
pF
at VR = 6 V; f = 1 MHz
CD
36
1
13.5
15.7
µA
V
V
pF
GSOT15C-HT3
BiSy mode (between pin 1 to 2 or pin 2 to 1; pin 3 not connected)
Parameter
Protection paths
Reverse stand off voltage
Reverse current
Reverse break down voltage
Clamping voltage
Capacitance
www.vishay.com
10
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
at IR = 1 µA
VRWM
at VR = 15.5 V
IR
at IR = 1 mA
VBR
at IPP = 1 A
VC
at IPP = IPPM = 8 A
Min.
Typ.
Max.
Unit
1
lines
1
µA
20.4
24.5
V
VC
26.6
30.6
V
at VR = 0 V; f = 1 MHz
CD
45
60
pF
at VR = 7.5 V; f = 1 MHz
CD
25
15.5
17
For technical support, please contact: [email protected]
V
18.7
V
pF
Document Number 85825
Rev. 1.7, 21-Apr-08
GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
GSOT24C-HT3
BiSy mode (between pin 1 to 2 or pin 2 to 1; pin 3 not connected)
Parameter
Protection paths
Reverse stand off voltage
Reverse current
Reverse break down voltage
Clamping voltage
Capacitance
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
at IR = 1 µA
VRWM
at VR = 24.5 V
IR
at IR = 1 mA
VBR
Min.
Typ.
Max.
Unit
1
lines
1
µA
24.5
27.5
V
30.7
V
at IPP = 1 A
VC
34
41
at IPP = IPPM = 5 A
VC
40
48
V
at VR = 0 V; f = 1 MHz
CD
33
40
pF
at VR = 12 V; f = 1 MHz
CD
18
V
pF
GSOT36C-HT3
BiSy mode (between pin 1 to 2 or pin 2 to 1; pin 3 not connected)
Parameter
Protection paths
Reverse stand off voltage
Reverse current
Reverse break down voltage
Clamping voltage
Capacitance
Test conditions/remarks
Symbol
Number of lines which can be protected
Nlines
Min.
Typ.
Max.
Unit
at IR = 1 µA
VRWM
1
lines
at VR = 36.5 V
IR
1
µA
at IR = 1 mA
VBR
at IPP = 1 A
VC
50
60
at IPP = IPPM = 3.5 A
VC
60
72
V
at VR = 0 V; f = 1 MHz
CD
26
33
pF
at VR = 18 V; f = 1 MHz
CD
10
36.5
39.5
V
43.7
V
V
pF
Package Dimensions in millimeters (inches): LLP75-3B
18057
Document Number 85825
Rev. 1.7, 21-Apr-08
For technical support, please contact: [email protected]
www.vishay.com
11
GSOT03C-HT3 to GSOT36C-HT3
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively.
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA.
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or
unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages,
and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated
with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
www.vishay.com
12
For technical support, please contact: [email protected]
Document Number 85825
Rev. 1.7, 21-Apr-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
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