NCP148 450 mA, Ultra-Low Noise and High PSRR LDO Regulator for RF and Analog Circuits www.onsemi.com The NCP148 is a linear regulator capable of supplying 450 mA output current. Designed to meet the requirements of RF and analog circuits, the NCP148 device provides low noise, high PSRR, low quiescent current, and very good load/line transients. The NCP148 offers soft−start function with optimized slew rate control to use in camera module. The device is designed to work with a 1 mF input and a 1 mF output ceramic capacitor. It is available in ultra−small 0.35P, 0.65 mm x 0.65 mm Chip Scale Package (CSP). MARKING DIAGRAMS Features • • • • • • • • • • • • A1 X or XX = Specific Device Code M = Date Code Operating Input Voltage Range: 1.9 V to 5.5 V Available in Fixed Voltage Option: 1.8 V to 5.14 V Optimized Start−up Slew Rate for Camera Sensor ±2% Accuracy Over Load/Temperature Low Quiescent Current Typ. 55 mA Standby Current: Typ. 0.1 mA Very Low Dropout: 150 mV at 450 mA Ultra High PSRR: Typ. 98 dB at 20 mA, f = 1 kHz Ultra Low Noise: 10 mVRMS Stable with a 1 mF Small Case Size Ceramic Capacitors Available in WLCSP4 0.65 mm x 0.65 mm x 0.33 mm CASE 567JZ These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant PIN CONNECTIONS IN OUT A1 A2 B1 B2 EN GND (Top View) ORDERING INFORMATION Typical Applications • • • • X WLCSP4 CASE 567JZ See detailed ordering and shipping information on page 11 of this data sheet. Camera Modules Battery−powered Equipment Smartphones, Tablets Cameras, DVRs, STB and Camcorders VOUT VIN IN OUT NCP148 CIN 1 mF Ceramic EN COUT 1 mF Ceramic ON OFF GND Figure 1. Typical Application Schematics © Semiconductor Components Industries, LLC, 2017 June, 2017 − Rev. 0 1 Publication Order Number: NCP148/D NCP148 IN EN ENABLE THERMAL LOGIC SHUTDOWN BANDGAP MOSFET REFERENCE INTEGRATED DRIVER WITH SOFT−START CURRENT LIMIT OUT * ACTIVE DISCHARGE Version A only EN GND Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. Pin Name A1 IN A2 OUT B1 EN Description Input voltage supply pin Regulated output voltage. The output should be bypassed with small 1 mF ceramic capacitor. Chip enable: Applying VEN < 0.4 V disables the regulator, Pulling VEN > 1.2 V enables the LDO. B2 GND Common ground connection − EPAD Expose pad should be tied to ground plane for better power dissipation ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN −0.3 V to 6 V Output Voltage VOUT −0.3 to VIN + 0.3, max. 6 V V Chip Enable Input VCE −0.3 to VIN + 0.3, max. 6 V V Output Short Circuit Duration tSC unlimited s Maximum Junction Temperature TJ 150 °C Input Voltage (Note 1) TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Storage Temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per EIA/JESD22−A114 ESD Machine Model tested per EIA/JESD22−A115 Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Thermal Characteristics, CSP4 (Note 3) Thermal Resistance, Junction−to−Air Symbol Value Unit RqJA 108 °C/W 3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51−7 www.onsemi.com 2 NCP148 ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise noted. VEN = 1.2 V. Typical values are at TJ = +25°C (Note 4). Parameter Test Conditions Symbol Min VIN VIN = VOUT(NOM) + 1 V 0 mA ≤ IOUT ≤ 450 mA VOUT Line Regulation VOUT(NOM) + 1 V ≤ VIN ≤ 5.5 V LineReg 0.02 %/V Load Regulation IOUT = 1 mA to 450 mA LoadReg 0.001 %/mA Operating Input Voltage Output Voltage Accuracy Dropout Voltage (Note 5) IOUT = 450 mA Max Unit 1.9 5.5 V −2 +2 % VOUT(NOM) = 1.8 V VOUT(NOM) = 2.5 V VOUT(NOM) = 2.7 V VDO VOUT(NOM) = 2.8 V 300 450 190 315 180 300 175 290 mV Output Current Limit VOUT = 90% VOUT(NOM) ICL Short Circuit Current VOUT = 0 V ISC 690 Quiescent Current IOUT = 0 mA IQ 55 65 mA Shutdown Current VEN ≤ 0.4 V, VIN = 4.8 V IDIS 0.01 1 mA EN Input Voltage “H” VENH EN Input Voltage “L” VENL VEN = 4.8 V IEN 0.2 f = 100 Hz f = 1 kHz f = 10 kHz f = 100 kHz PSRR 91 98 82 48 dB IOUT = 1 mA IOUT = 250 mA VN 14 10 mVRMS Temperature rising TSDH 160 °C Temperature falling TSDL 140 °C VEN < 0.4 V, Version A only RDIS 280 W EN Pin Threshold Voltage EN Pull Down Current Power Supply Rejection Ratio Output Voltage Noise Thermal Shutdown Threshold Active output discharge resistance Line transient (Note 6) IOUT = 20 mA f = 10 Hz to 100 kHz VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V) in 30 ms, IOUT = 1 mA VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1 V) in 30 ms, IOUT = 1 mA Load transient (Note 6) IOUT = 1 mA to 450 mA in 10 ms IOUT = 450 mA to 1mA in 10 ms 450 Typ 700 mA 1.2 0.4 0.5 V mA −1 TranLINE mV +1 −40 TranLOAD +40 mV Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TA = 25°C. Low duty cycle pulse techniques are used during the testing to maintain the junction temperature as close to ambient as possible. 5. Dropout voltage is characterized when VOUT falls 100 mV below VOUT(NOM). 6. Guaranteed by design. www.onsemi.com 3 NCP148 TYPICAL CHARACTERISTICS 1.820 2.830 IOUT = 10 mA 1.810 1.805 IOUT = 450 mA 1.800 1.795 VIN = 2.8 V VOUT = 1.8 V CIN = 1 mF COUT = 1 mF 1.790 1.785 1.780 −40 −20 0 20 40 60 80 100 2.820 2.815 IOUT = 10 mA 2.810 IOUT = 450 mA 2.805 VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 2.800 2.795 2.790 −40 −20 140 120 0 20 40 60 80 100 120 140 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 3. Output Voltage vs. Temperature − VOUT = 1.8 V Figure 4. Output Voltage vs. Temperature − VOUT = 2.8 V REGLINE, LINE REGULATION (%/V) 0.010 REGLINE, LINE REGULATION (%/V) 0.010 VIN = 4.3 V VOUT = 3.3 V CIN = 1 mF COUT = 1 mF 0.009 0.009 0.008 0.008 0.007 0.007 0.006 0.006 0.005 0.005 0.004 0.004 0.003 0.003 VIN = 2.8 V VOUT = 1.8 V CIN = 1 mF COUT = 1 mF 0.002 0.001 0 −40 −20 0 20 40 60 80 100 0.002 0.001 0 −40 −20 140 120 0 20 40 60 80 100 120 140 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 5. Line Regulation vs. Temperature − VOUT = 1.8 V Figure 6. Line Regulation vs. Temperature − VOUT = 2.8 V 8 REGLOAD, LOAD REGULATION (mA/mA) REGLOAD, LOAD REGULATION (mA/mA) 2.825 VOUT, OUTPUT VOLTAGE (V) VOUT, OUTPUT VOLTAGE (V) 1.815 7 6 5 4 3 VIN = 2.8 V VOUT = 1.8 V CIN = 1 mF COUT = 1 mF 2 1 0 −40 −20 0 20 40 60 80 100 120 140 8 7 6 5 4 3 VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 2 1 0 −40 −20 0 20 40 60 80 100 120 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 7. Load Regulation vs. Temperature − VOUT = 1.8 V Figure 8. Load Regulation vs. Temperature − VOUT = 2.8 V www.onsemi.com 4 140 NCP148 TYPICAL CHARACTERISTICS 1.6 1.4 IGND, GROUND CURRENT (mA) IGND, GROUND CURRENT (mA) 1.6 TJ = 125°C 1.2 TJ = 25°C 1.0 0.8 TJ = −40°C 0.6 VIN = 2.8 V VOUT = 1.8 V CIN = 1 mF COUT = 1 mF 0.4 0.2 0.0 1.4 TJ = 125°C 1.2 TJ = 25°C 1.0 0.8 TJ = −40°C 0.6 VIN = 3.7 V VOUT = 2.7 V CIN = 1 mF COUT = 1 mF 0.4 0.2 0.0 0 50 100 150 200 250 300 350 400 450 0 50 TJ, JUNCTION TEMPERATURE (°C) VDROP, DROPOUT VOLTAGE (mV) TJ = 125°C TJ = 25°C 250 200 TJ = −40°C 150 100 50 300 350 400 450 VOUT = 3.3 V CIN = 1 mF COUT = 1 mF 210 180 TJ = 125°C TJ = 25°C 150 120 TJ = −40°C 90 60 30 0 0 0 50 100 150 200 250 300 350 400 0 450 50 100 IOUT, OUTPUT CURRENT (mA) 150 200 250 300 350 400 450 IOUT, OUTPUT CURRENT (mA) Figure 11. Dropout Voltage vs. Load Current − VOUT = 1.8 V Figure 12. Dropout Voltage vs. Load Current − VOUT = 2.8 V 240 400 VOUT = 1.8 V CIN = 1 mF COUT = 1 mF IOUT = 450 mA VDROP, DROPOUT VOLTAGE (mV) VDROP, DROPOUT VOLTAGE (mV) 250 240 VOUT = 1.8 V 350 CIN = 1 mF COUT = 1 mF 300 320 200 Figure 10. Ground Current vs. Load Current − VOUT = 2.7 V 400 360 150 TJ, JUNCTION TEMPERATURE (°C) Figure 9. Ground Current vs. Load Current − VOUT = 1.8 V VDROP, DROPOUT VOLTAGE (mV) 100 280 240 200 160 120 80 IOUT = 0 mA 40 0 −40 −20 0 20 40 60 80 100 120 210 180 150 120 90 IOUT = 0 mA 60 30 0 −40 −20 140 IOUT = 450 mA VOUT = 2.8V CIN = 1 mF COUT = 1 mF 0 20 40 60 80 100 120 140 TJ, JUNCTION TEMPERATURE (°C) Figure 13. Dropout Voltage vs. Temperature − VOUT = 1.8 V Figure 14. Dropout Voltage vs. Temperature − VOUT = 2.8 V www.onsemi.com 5 NCP148 TYPICAL CHARACTERISTICS ISC, SHORT CIRCUIT CURRENT (mA) 750 730 720 710 700 690 680 VIN = 3.8 V VOUT = 90% VOUT(nom) CIN = 1 mF COUT = 1 mF 670 660 VEN, ENABLE VOLTAGE THRESHOLD (V) 650 −40 −20 0 20 40 60 80 100 120 140 690 680 670 660 650 640 630 610 600 −40 0.9 0.45 0.8 0.7 OFF −> ON 0.6 ON −> OFF 0.5 0.4 0.3 VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 0.2 0.1 0 −40 −20 20 40 60 80 100 120 0 20 40 60 80 100 120 0.35 0.30 0.25 0.20 VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 0.15 0.10 0 −40 −20 140 140 0.40 0.05 0 20 40 60 80 100 120 140 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 17. Enable Threshold Voltage vs. Temperature Figure 18. Enable Current vs. Temperature 300 RDIS, DISCHARGE RESISTIVITY (W) 70 0 Figure 16. Short Circuit Current vs. Temperature 0.50 90 −20 Figure 15. Current Limit vs. Temperature 1.0 80 VIN = 3.8 V VOUT = 0 V (SHORT) CIN = 1 mF COUT = 1 mF 620 TJ, JUNCTION TEMPERATURE (°C) 100 IDIS, DISABLE CURRENT (nA) 700 TJ, JUNCTION TEMPERATURE (°C) IEN, ENABLE CURRENT (nA) ICL, CURRENT LIMIT (mA) 740 VIN = 2.8 V VOUT = 1.8 V CIN = 1 mF COUT = 1 mF 60 50 40 30 20 10 0 −40 −20 0 20 40 60 80 100 290 280 270 260 250 240 230 VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF COUT = 1 mF 220 210 200 −40 −20 120 140 0 20 40 60 80 100 120 140 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 19. Disable Current vs. Temperature Figure 20. Discharge Resistivity vs. Temperature www.onsemi.com 6 NCP148 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE NOISE (nV/√Hz) 10K IOUT = 450 mA 1K IOUT = 250 mA RMS Output Noise (mV) IOUT = 10 mA 100 10 IOUT 10 Hz − 100 kHz 100 Hz − 100 kHz 1 mA 14.62 14.10 10 mA 11.12 10.48 250 mA 10.37 9.82 450 mA 10.22 9.62 IOUT = 1 mA VIN = 2.8 V VOUT = 1.8 V CIN = 1 mF MLCC (1206) COUT = 1 mF MLCC (1206) 1 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) Figure 21. Output Voltage Noise Spectral Density − VOUT = 1.8 V OUTPUT VOLTAGE NOISE (nV/√Hz) 10K IOUT = 450 mA IOUT = 250 mA 1K RMS Output Noise (mV) IOUT = 10 mA IOUT 10 Hz − 100 kHz 100 Hz − 100 kHz 1 mA 16.90 15.79 10 mA 12.64 11.13 250 mA 11.96 10.64 450 mA 11.50 10.40 IOUT = 1 mA 100 10 1 VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF MLCC (1206) COUT = 1 mF MLCC (1206) 10 100 1K 10K 100K 1M FREQUENCY (kHz) Figure 22. Output Voltage Noise Spectral Density − VOUT = 2.8 V 120 120 IOUT = 20 mA 100 VIN = 2.3 V+100mVpp VOUT = 1.8 V COUT = 1 mF MLCC 1206 IOUT = 10 mA RR, RIPPLE REJECTION (dB) RR, RIPPLE REJECTION (dB) IOUT = 10 mA 80 60 IOUT = 100 mA 40 IOUT = 250 mA 20 IOUT = 450 mA 0 0.01 0.1 1 10 100 1000 10000 IOUT = 20 mA 100 VIN = 3.8 V+100mVpp VOUT = 2.8 V COUT = 1 mF MLCC 1206 80 60 IOUT = 100 mA 40 IOUT = 250 mA 20 IOUT = 450 mA 0 0.01 0.1 1 10 100 1000 10000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 23. PSRR for Various Output Currents, VOUT = 1.8 V Figure 24. PSRR for Various Output Currents, VOUT = 2.8 V www.onsemi.com 7 NCP148 TYPICAL CHARACTERISTICS 100 VIN Unstable Operation VOUT 1 V/div ESR (W) 10 1 Stable Operation 0.1 0 50 100 150 200 250 300 350 400 450 500 4 ms/div IOUT, OUTPUT CURRENT (mA) 500 mV/div Figure 26. Turn−on/off − slow rising VIN VIN = 3.7 V VOUT = 2.7 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) VOUT VEN 100 mA/div VEN IINPUT 500 mV/div 10 mA/div 500 mV/div 500 mV/div Figure 25. Stability vs. ESR VIN = 3.7 V VOUT = 2.7 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) VOUT IINPUT 100 ms/div 100 ms/div Figure 27. Enable Turn−on Response − COUT = 1 mF, IOUT = 10 mA Figure 28. Enable Turn−on Response − COUT = 1 mF, IOUT = 450 mA 500 mV/div 4.8 V VIN 2.8 V 10 mV/div 10 mV/div 500 mV/div 3.8 V VOUT VOUT = 1.8 V, IOUT = 10 mA CIN = 1 mF (MLCC), COUT = 1 mF (MLCC) 20 ms/div VIN 3.8 V VOUT VOUT = 2.8 V, IOUT = 10 mA CIN = 1 mF (MLCC), COUT = 1 mF (MLCC) 20 ms/div Figure 30. Line Transient Response − VOUT = 2.8 V Figure 29. Line Transient Response − VOUT = 1.8 V www.onsemi.com 8 NCP148 200 mA/div VOUT VIN = 2.8 V VOUT = 1.8 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) IOUT tFALL = 1 ms VOUT VIN = 2.8 V VOUT = 1.8 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) 20 ms/div Figure 31. Load Transient Response − 1 mA to 450 mA − VOUT = 1.8 V Figure 32. Load Transient Response − 450 mA to 1 mA − VOUT = 1.8 V 200 mA/div 2 ms/div 50 mV/div tRISE = 1 ms IOUT VOUT VIN = 3.7 V VOUT = 2.7 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) IOUT tFALL = 1 ms VOUT VIN = 3.7 V VOUT = 2.7 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) 5 ms/div 20 ms/div Figure 33. Load Transient Response − 1 mA to 450 mA − VOUT = 2.7 V Figure 34. Load Transient Response − 450 mA to 1 mA − VOUT = 2.7 V Short Circuit Event 200 mA/div 50 mV/div tRISE = 1 ms IOUT VIN = 5.5 V, VOUT = 3.3 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) 500 mV/div 50 mV/div 200 mA/div 50 mV/div 200 mA/div TYPICAL CHARACTERISTICS VEN IOUT Thermal Shutdown Overheating 1 V/div 1 V/div VOUT VOUT TSD cycling COUT = 4.7 mF COUT = 1 mF 10 ms/div VIN = 3.8 V VOUT = 2.8 V CIN = 1 mF (MLCC) 400 ms/div Figure 35. Short Circuit and Thermal Shutdown Figure 36. Enable Turn−Off (Active Discharge) www.onsemi.com 9 NCP148 APPLICATIONS INFORMATION General transient response or high frequency PSRR. It is not recommended to use tantalum capacitors on the output due to their large ESR. The equivalent series resistance of tantalum capacitors is also strongly dependent on the temperature, increasing at low temperature. The NCP148 is an ultra−low noise 450 mA low dropout regulator designed to meet the requirements of RF applications and high performance analog circuits. The NCP148 device provides very high PSRR and excellent dynamic response. In connection with low quiescent current this device is well suitable for battery powered application such as cell phones, tablets and other. The NCP148 is fully protected in case of current overload, output short circuit and overheating. Enable Operation The NCP148 uses the EN pin to enable/disable its device and to deactivate/activate the active discharge function. If the EN pin voltage is <0.4 V the device is guaranteed to be disabled. The pass transistor is turned−off so that there is virtually no current flow between the IN and OUT. The active discharge transistor is active so that the output voltage VOUT is pulled to GND through a 280 Ω resistor. In the disable state the device consumes as low as typ. 10 nA from the VIN. If the EN pin voltage >1.2 V the device is guaranteed to be enabled. The NCP148 regulates the output voltage and the active discharge transistor is turned−off. The EN pin has internal pull−down current source with typ. value of 200 nA which assures that the device is turned−off when the EN pin is not connected. In the case where the EN function isn’t required the EN should be tied directly to IN. After device is enabled by EN pin soft start feature ensure that maximal Vout slew rate will be slower than 30 mV/ms. The soft start function also protects powered device before possible damage by large inrush current. Input Capacitor Selection (CIN) Input capacitor connected as close as possible is necessary for ensure device stability. The X7R or X5R capacitor should be used for reliable performance over temperature range. The value of the input capacitor should be 1 mF or greater to ensure the best dynamic performance. This capacitor will provide a low impedance path for unwanted AC signals or noise modulated onto constant input voltage. There is no requirement for the ESR of the input capacitor but it is recommended to use ceramic capacitors for their low ESR and ESL. A good input capacitor will limit the influence of input trace inductance and source resistance during sudden load current changes. Output Decoupling (COUT) The NCP148 requires an output capacitor connected as close as possible to the output pin of the regulator. The recommended capacitor value is 1 mF and X7R or X5R dielectric due to its low capacitance variations over the specified temperature range. The NCP148 is designed to remain stable with minimum effective capacitance of 0.7 mF to account for changes with temperature, DC bias and package size. Especially for small package size capacitors such as 0201 the effective capacitance drops rapidly with the applied DC bias. Please refer Figure 37. Output Current Limit Output Current is internally limited within the IC to a typical 700 mA. The NCP148 will source this amount of current measured with a voltage drops on the 90% of the nominal VOUT. If the Output Voltage is directly shorted to ground (VOUT = 0 V), the short circuit protection will limit the output current to 690 mA (typ). The current limit and short circuit protection will work properly over whole temperature range and also input voltage range. There is no limitation for the short circuit duration. Thermal Shutdown When the die temperature exceeds the Thermal Shutdown threshold (TSD * 160°C typical), Thermal Shutdown event is detected and the device is disabled. The IC will remain in this state until the die temperature decreases below the Thermal Shutdown Reset threshold (TSDU − 140°C typical). Once the IC temperature falls below the 140°C the LDO is enabled again. The thermal shutdown feature provides the protection from a catastrophic device failure due to accidental overheating. This protection is not intended to be used as a substitute for proper heat sinking. Figure 37. Capacity vs DC Bias Voltage Power Dissipation There is no requirement for the minimum value of Equivalent Series Resistance (ESR) for the COUT but the maximum value of ESR should be less than 2 Ω. Larger output capacitors and lower ESR could improve the load As power dissipated in the NCP148 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad www.onsemi.com 10 NCP148 configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. The maximum power dissipation the NCP148 can handle is given by: ƪ125oC * T Aƫ P D [ V IN @ I GND ) I OUTǒV IN * V OUTǓ (eq. 2) (eq. 1) q JA 160 1.6 PD(MAX), TA = 25°C, 2 oz Cu 150 1.4 PD(MAX), TA = 25°C, 1 oz Cu 140 1.2 130 1.0 120 0.8 qJA, 1 oz Cu 110 0.6 0.4 100 qJA, 2 oz Cu 90 0.2 0 700 80 0 100 200 300 400 500 PD(MAX), MAXIMUM POWER DISSIPATION (W) qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W) P D(MAX) + The power dissipated by the NCP148 for given application conditions can be calculated from the following equations: 600 PCB COPPER AREA (mm2) Figure 38. qJA and PD (MAX) vs. Copper Area (CSP4) Reverse Current PCB Layout Recommendations The PMOS pass transistor has an inherent body diode which will be forward biased in the case that VOUT > VIN. Due to this fact in cases, where the extended reverse current condition can be anticipated the device may require additional external protection. To obtain good transient performance and good regulation characteristics place CIN and COUT capacitors close to the device pins and make the PCB traces wide. In order to minimize the solution size, use 0402 or 0201 capacitors with appropriate capacity. Larger copper area connected to the pins will also improve the device thermal resistance. The actual power dissipation can be calculated from the equation above (Equation 2). Expose pad can be tied to the GND pin for improvement power dissipation and lower device temperature. Power Supply Rejection Ratio The NCP148 features very high Power Supply Rejection ratio. If desired the PSRR at higher frequencies in the range 100 kHz – 10 MHz can be tuned by the selection of COUT capacitor and proper PCB layout. ORDERING INFORMATION Device Nominal Output Voltage NCP148AFCT180T2G NCP148AFCT250T2G NCP148AFCT255T2G 2.55 V Marking Rotation 1.8 V T 270° 2.5 V V 0° 4 180° NCP148AFCT260T2G 2.6 V NCP148AFCT270T2G NCP148AFCT280T2G Description 450 mA, Active Discharge V 90° 2.7 V Y 0° 2.8 V 6 0° www.onsemi.com 11 Package Shipping 567JZ 5000 / Tape & Reel NCP148 PACKAGE DIMENSIONS WLCSP4, 0.64x0.64 CASE 567JZ ISSUE A ÈÈ ÈÈ A E PIN A1 REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B D DIM A A1 A2 b D E e TOP VIEW A2 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C A1 NOTE 3 C SIDE VIEW MILLIMETERS MIN NOM MAX −−− 0.33 −−− 0.08 0.04 0.06 0.23 REF 0.195 0.210 0.225 0.610 0.640 0.670 0.610 0.640 0.670 0.35 BSC SEATING PLANE A1 4X e b 0.03 C A B PACKAGE OUTLINE e 4X 0.35 PITCH B 0.20 0.35 PITCH A 1 DIMENSIONS: MILLIMETERS 2 BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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