Chip Effcienct Fast Rectifiers Formosa MS EGFM101 THRU EGFM105 List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date DS-121514 2008/02/10 2010/05/10 Revision D Page. 7 Chip Effcienct Fast Rectifiers Formosa MS EGFM101 THRU EGFM105 1.0A Sufrace Mount Efficient Fast Rectifiers-50-600V Package outline Features SMA • Batch process design, excellent power dissipation offers • • • • • • better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. High current & surge capability. Low forward dropdown voltage Glass passivated chip junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen free parts, ex. EGFM101-H. 0.196(4.9) 0.180(4.5) 0.012(0.3) Typ. 0.106(2.7) 0.091(2.3) 0.068(1.7) 0.060(1.5) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AC / SMA • Terminals : Solder plated, solderable per 0.032(0.8) Typ. 0.032 (0.8) Typ. Dimensions in inches and (millimeters) MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.05 gram Maximum ratings and Electrical Characteristics (AT PARAMETER o T A=25 C unless otherwise noted) CONDITIONS Forward rectified current See Fig.2 Forward surge current 8.3ms single half sine-wave (JEDEC methode) MAX. UNIT IO 1.0 A I FSM 30 A Symbol TYP. MIN. O V R = V RRM T J = 25 C Reverse current Diode junction capacitance f=1MHz and applied 4V DC reverse voltage Storage temperature *1 V RRM (V) V RMS*2 (V) *3 VR (V) EGFM101 50 35 50 EGFM102 100 70 100 EGFM103 200 140 200 *4 VF (V) Operating temperature T J, ( OC) *5 t rr (ns) 25 400 280 400 1.25 EGFM105 600 420 600 1.75 pF 15 +175 -65 O C *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage 0.875 EGFM104 μA 100 CJ T STG SYMBOLS 5.0 IR O V R = V RRM T J = 125 C -55 to +150 *4 Maximum forward voltage@I F=1.0A *5 Maximum Reverse recovery time , note 1 Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date DS-121514 2008/02/10 2010/05/10 Revision D Page. 7 Rating and characteristic curves (EGFM101 THRU EGFM105) FIG.1-TYPICAL FORWARD CHARACTERISTICS FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) 10 INSTANTANEOUS FORWARD CURRENT,(A) EGFM101 - EGFM103 1 EGFM104 O TJ=25 C 0.1 1.2 1.0 0.8 0.6 P.C.B. Mounted on 0.2 " x 0.2 " (5 mm x 5 mm) Copper Pad Areas 0.4 0.2 0 0 25 EGFM105 50 75 100 125 150 175 LEAD TEMPERATURE ( °C) pulse width =300us 1% duty cycle 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTICS 50W NONINDUCTIVE 10W NONINDUCTIVE ( ) (+) D.U.T. 25Vdc (approx.) PULSE GENERATOR (NOTE 2) ( ) PEAK FORWAARD SURGE CURRENT,(A) FORWARD VOLTAGE,(V) 50 40 30 8.3ms Single Half TJ=25 C JEDEC method 10 0 1 5 (+) 1W NONINDUCTIVE Sine Wave 20 50 10 100 NUMBER OF CYCLES AT 60Hz OSCILLISCOPE (NOTE 1) NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. 2. Rise Time= 10ns max., Source Impedance= 50 ohms. FIG.5-TYPICAL JUNCTION CAPACITANCE 35 TJ=25 C f=1.0MHZ Vsig = 50mVp-p JUNCTION CAPACITANCE,(pF) trr | | | | | | | | +0.5A 0 -0.25A -1.0A 30 25 20 15 10 5 1cm SET TIME BASE FOR 10 / 20ns / cm 0 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date DS-121514 2008/02/10 2010/05/10 Revision D Page. 7 Chip Effcienct Fast Rectifiers Formosa MS EGFM101 THRU EGFM105 Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code EGFM101 EGFM102 EGFM103 EGFM104 EGFM105 E11 E12 E13 E14 E15 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMA 0.110 (2.80) 0.063 (1.60) 0.087 (2.20) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date DS-121514 2008/02/10 2010/05/10 Revision D Page. 7 Chip Effcienct Fast Rectifiers Formosa MS EGFM101 THRU EGFM105 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMA Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.80 5.00 1.90 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date DS-121514 2008/02/10 2010/05/10 Revision D Page. 7 Chip Effcienct Fast Rectifiers Formosa MS EGFM101 THRU EGFM105 Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) SMA 7" 2,000 4.0 20,000 183*155*183 178 382*356*392 160,000 16.0 SMA 13" 7,500 4.0 15,000 337*337*37 330 350*330*360 120,000 14.2 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) o 150 C o 200 C 60~120sec Tsmax to T L -Ramp-upRate o <3 C /sec Time maintained above: -Temperature(T L ) -Time(t L ) o 217 C 60~260sec o o 255 C- 0/ + 5 C Peak Temperature(T P ) o Time within 5 C of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 C /sec o o Time 25 C to Peak Temperature http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 <6minutes Page 6 Document ID Issued Date Revised Date DS-121514 2008/02/10 2010/05/10 Revision D Page. 7 Chip Effcienct Fast Rectifiers Formosa MS EGFM101 THRU EGFM105 High reliability test capabilities Item Test Conditions Reference O MIL-STD-750D METHOD-2031 O MIL-STD-202F METHOD-208 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16" ± 1/32" 2. Solderability at 245 ± 5 C for 5 sec. 3. High Temperature Reverse Bias V R=80% rate at T J=150 C for 168 hrs. 4. Forward Operation Life Rated average rectifier current at T A=25 C for 500hrs. MIL-STD-750D METHOD-1038 O MIL-STD-750D METHOD-1027 O O 5. Intermittent Operation Life 6. Pressure Cooker T A = 25 C, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 JESD22-A102 O 15P SIG at T A=121 C for 4 hrs. O MIL-STD-750D METHOD-1051 O 7. Temperature Cycling -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. 9. Humidity at T A=85 C , RH=85% for 1000hrs. 10. High Temperature Storage Life at 175 C for 1000 hrs. MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 O http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 MIL-STD-750D METHOD-1031 O Page 7 Document ID Issued Date Revised Date DS-121514 2008/02/10 2010/05/10 Revision D Page. 7