GG25L Gas gauge IC with alarm output Datasheet - production data Applications Wearable Fitness and healthcare Portable medical equipment Description The GG25L includes the hardware functions required to implement a low-cost gas gauge for battery monitoring. The GG25L uses current sensing, Coulomb counting and accurate measurements of the battery voltage to estimate the state-of-charge (SOC) of the battery. An internal temperature sensor simplifies implementation of temperature compensation. CSP (1.4 x 2.0 mm) Features OptimGaugeTM algorithm 0.25% accuracy battery voltage monitoring Coulomb counter and voltage-mode gas gauge operations Robust initial open-circuit-voltage (OCV) measurement at power up with debounce delay An alarm output signals a low SOC condition and can also indicate low battery voltage. The alarm threshold levels are programmable. The GG25L offers advanced features to ensure high performance gas gauging in all application conditions. Low battery level alarm output with programmable thresholds Internal temperature sensor Battery swap detection Low power: 45 µA in power-saving mode, 2 µA max in standby mode 1.4 x 2.0 mm 10-bump CSP package Table 1. Device summary Order code GG25LJ (1) GG25LAJ (2) Temperature range Package Packing -40 °C to +85 °C CSP-12 Tape and reel Marking O22 O23 1. 4.35 V battery option 2. 4.20 V battery option February 2014 This is information on a product in full production. DocID025995 Rev 1 1/28 www.st.com Contents GG25L Contents 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 4 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6.1 6.2 Battery monitoring functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6.1.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6.1.2 Battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6.1.3 Internal temperature monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.1.4 Current sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 GG25L gas gauge architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6.2.1 Coulomb counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6.2.2 Voltage gas gauge algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.2.3 Mixed mode gas gauge system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6.3 Low battery alarm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.4 Power-up and battery swap detection . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6.5 Improving accuracy of the initial OCV measurement with the advanced functions of BATD/CD and RSTIO pins . . . . . . . . . . . . . . . 17 6.5.1 7 BATD and RSTIO pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 I²C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.1 Read and write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.2 Register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.2.1 Register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.2.2 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2/28 DocID025995 Rev 1 GG25L Block diagram Figure 1. GG25L internal block diagram 9&& %$7'&' 567,2%$7' $/0 %DWWHU\GHWHFWLRQ DQGFRQWURO &RQWUROORJLF DQG VWDWHPDFKLQH 9 UHIHUHQFH +] WLPHEDVH 2VFLOODWRU 7HPSHUDWXUH VHQVRU $'FRQYHUWHU &RQWURO UHJLVWHUV 9,1 08; 1 Block diagram &* &* &* 6&/ 6'$ , & LQWHUIDFH 5$0DQG,'UHJLVWHUV *1' DocID025995 Rev 1 $06B9 3/28 28 Pin assignment 2 GG25L Pin assignment Table 2. GG25L pin description Pin n° CSP bump Pin name Type(1) 1 A1 ALM I/OD Alarm signal output, open drain, external pull-up with resistor 2 B1 SDA I/OD I²C serial data 3 C1 SCL I_D I²C serial clock 4 D1 GND Ground 5 D2 NC - 6 D3 CG I_A Current sensing input 7 C3 RSTIO I/OD Reset sense input & reset control output (open drain) 8 B2 BATD/CD I/OA Battery charge inhibit (active high output) Battery detection (input) 9 B3 VCC Supply 10 A3 VIN I_A Function Analog and digital ground NC Power supply Battery voltage sensing input 1. I = input, 0 = output, OD = open drain, A = analog, D = digital, NC = not connected 3 Absolute maximum ratings and operating conditions Table 3. Absolute maximum ratings Symbol VCCMAX VIO TSTG TJ ESD Parameter Maximum voltage on VCC pin Voltage on I/O pins Value 6 -0.3 to 6 Storage temperature -55 to 150 Maximum junction temperature Electrostatic discharge (HBM: human body model) 150 Unit V °C 2 kV Value Unit Table 4. Operating conditions Symbol VCC Operating supply voltage on VCC VMIN Minimum voltage on VCC for RAM content retention TOPER TPERF 4/28 Parameter Operating free air temperature range DocID025995 Rev 1 2.7 to 4.5 2.0 -40 to 85 -20 to 70 V °C GG25L 4 Electrical characteristics Electrical characteristics Table 5. Electrical characteristics (2.7 V < VCC < 4.5 V, -20C to 70C) Symbol Parameter Conditions Min Typ Max 45 60 Units Supply ICC Operating current consumption Average value over 4 s in power-saving voltage mode Average value over 4 s in mixed mode 100 ISTBY Current consumption in standby Standby mode, inputs = 0 V 2 IPDN Current consumption in power-down VCC < UVLOTH, inputs = 0 V 1 UVLOTH Undervoltage threshold (VCC decreasing) UVLOHYST Undervoltage threshold hysteresis POR Power-on reset threshold 2.5 (VCC decreasing) 2.6 2.7 µA V 100 mV 2.0 V Current sensing Vin_gg Input voltage range -40 IIN Input current for CG pin ADC_res AD converter granularity ADC_offset AD converter offset ADC_time AD conversion time ADC_acc AD converter gain accuracy at full scale (using external sense resistor) FOSC Internal time base frequency Osc_acc Internal time base accuracy Cur_res Current register LSB value +40 mV 500 nA 5.88 CG = 0 V -3 µV 3 500 25 °C ms 0.5 Over temperature range 1 32768 25 °C, VCC = 3.6 V % Hz 2 Over temperature and voltage ranges 2.5 5.88 DocID025995 Rev 1 LSB % µV 5/28 28 Electrical characteristics GG25L Table 5. Electrical characteristics (2.7 V < VCC < 4.5 V, -20C to 70C) (continued) Symbol Parameter Conditions Min Typ Max Units 4.5 V Battery voltage and temperature measurement Vin_adc Input voltage range VCC = 4.5 V LSB LSB value ADC_time AD conversion time Volt_acc 2.7 V < Vin < 4.5 V, Battery voltage measurement accuracy VCC = Vin 25 °C Voltage measurement Temperature measurement Over temperature range Temp_acc 0 Internal temperature sensor accuracy 2.20 mV 1 °C 250 ms -0.25 +0.25 -0.5 +0.5 -3 3 °C 0.35 V % Digital I/O pins (SCL, SDA, ALM, RSTIO) Vih Input logic high 1.2 Vil Input logic low Vol Output logic low (SDA, ALM, RSTIO) Iol = 4 mA 0.4 BATD/CD pin Vith Input threshold voltage Vihyst Input voltage hysteresis Voh Output logic high (charge inhibit mode enable) 6/28 1.46 1.61 1.76 0.1 Ioh = 3 mA DocID025995 Rev 1 V Vbat0.4 GG25L Electrical characteristics Table 6. I²C timing - VIO= 2.8 V, Tamb = -20 °C to 70 C (unless otherwise specified) Symbol Parameter Min Typ Max Unit 400 kHz Fscl SCL clock frequency thd,sta Hold time (repeated) START condition 0.6 tlow LOW period of the SCL clock 1.3 thigh HIGH period of the SCL clock 0.6 tsu,dat Setup time for repeated START condition 0.6 thd,dat Data hold time 0 tsu,dat Data setup time 100 tr Rise time of both SDA and SCL signals 20+ 0.1Cb tf Fall time of both SDA and SCL signals 20+ 0.1Cb tsu,sto Setup time for STOP condition 0.6 µs tbuf Bus free time between a STOP and START condition 1.3 µs Cb Capacitive load for each bus line 0 µs 0.9 ns 300 ns 300 ns 400 pF Figure 2. I²C timing diagram 9LK 6'$ WI 9LO WKGVWD WU WVXGDW WKLJK 6&/ WORZ WKGGDW WVXVWD *$3060' DocID025995 Rev 1 7/28 28 Application information 5 GG25L Application information Figure 3. Example of an application schematic using the GG25L in mixed mode Optional filter IO voltage VCC SCL SDA GG25L C1 VIN C2 BATD/CD ALM R1 Other detection circuit R2 Rid RSTIO GND Battery pack CG Rcg Table 7. External component list Name Value Tolerance Comments Rcg 5 to 50 mΩ 1% to 5% C1 1 µF C2 220 nF Battery voltage input filter (optional) R1 1 kΩ Battery voltage input filter (optional) R2 1 kΩ Battery detection function Current sense resistor (2% or better recommended) Supply decoupling capacitor Figure 4. Example of an application schematic using the GG25L without current sensing Optional filter IO voltage VCC SCL SDA GG25L VIN BATD/CD ALM RSTIO GND 8/28 R1 C1 CG DocID025995 Rev 1 C2 R2 Other detection circuit Rid Battery pack GG25L Application information Table 8. External component list Name Value C1 1 µF C2 220 nF R1 1 kΩ R2 1 kΩ Comments Supply decoupling capacitor Battery voltage input filter (optional) Battery detection function DocID025995 Rev 1 9/28 28 Functional description GG25L 6 Functional description 6.1 Battery monitoring functions 6.1.1 Operating modes The monitoring functions include the measurement of battery voltage, current, and temperature. A Coulomb counter is available to track the SOC when the battery is charging or discharging at a high rate. A sigma-delta A/D converter is used to measure the voltage, current, and temperature. The GG25L can operate in two different modes with different power consumption (see Table 9. Mode selection is made by the VMODE bit in register 0 (refer to Table 14 for register 0 definition). Table 9. GG25L operating modes VMODE Description 0 Mixed mode, Coulomb counter is active, voltage gas gauge runs in parallel 1 Voltage gas gauge with power saving Coulomb counter is not used. No current sensing. In mixed mode, current is measured continuously (except for a conversion cycle every 4 s and every 16 s seconds for measuring voltage and temperature respectively). This provides the highest accuracy from the gas gauge. In voltage mode with no current sensing, a voltage conversion is made every 4 s and a temperature conversion every 16 s. This mode provides the lowest power consumption. It is possible to switch between the two operating modes to get the best accuracy during active periods, and to save power during standby periods while still keeping track of the SOC information. 6.1.2 Battery voltage monitoring Battery voltage is measured by using one conversion cycle of the A/D converter every 4 s. The conversion cycle takes 213 = 8192 clock cycles. Using the 32768 Hz internal clock, the conversion cycle time is 250 ms. The voltage range is 0 to 4.5 V and resolution is 2.20 mV. Accuracy of the voltage measurement is ±0.5% over the temperature range. This allows accurate SOC information from the battery open-circuit voltage. The result is stored in the REG_VOLTAGE register (see Table 13). 10/28 DocID025995 Rev 1 GG25L 6.1.3 Functional description Internal temperature monitoring The chip temperature (close to the battery temperature) is measured using one conversion cycle of the A/D converter every 16 s. The conversion cycle takes 213 = 8192 clock cycles. Using the 32768 Hz internal clock, the conversion cycle time is 250 ms. Resolution is 1° C and range is -40 to +125 °C. The result is stored in the REG_TEMPERATURE register (see Table 13). 6.1.4 Current sensing Voltage drop across the sense resistor is integrated during a conversion period and input to the 14-bit sigma-delta A/D converter. Using the 32768 Hz internal clock, the conversion cycle time is 500 ms for a 14-bit resolution. The LSB value is 5.88 µV. The A/D converter output is in two’s complement format. When a conversion cycle is completed, the result is added to the Coulomb counter accumulator and the number of conversions is incremented in a 16-bit counter. The current register is updated only after the conversion closest to the voltage conversion (that is: once per 4-s measurement cycle). The result is stored in the REG_CURRENT register (see Table 13). DocID025995 Rev 1 11/28 28 Functional description GG25L 6.2 GG25L gas gauge architecture 6.2.1 Coulomb counter The Coulomb counter is used to track the SOC of the battery when the battery is charging or discharging at a high rate. Each current conversion result is accumulated (Coulomb counting) for the calculation of the relative SOC value based on the configuration register. The system controller can control the Coulomb counter and set and read the SOC register through the I²C control registers. Figure 5. Coulomb counter block diagram 16-bit counter REG_COUNTER register REG_CURRENT register EOC CG GND CC SOC calculator AD converter CC SOC register (internal) REG_CC_CNF register The REG_CC_CNF value depends on battery capacity and the current sense resistor. It scales the charge integrated by the sigma delta converter into a percentage value of the battery capacity. The default value is 395 (corresponding to a 10 mΩ sense resistor and 1957 mAh battery capacity). The Coulomb counter is inactive if the VMODE bit is set, this is the default state at poweron-reset (POR) or reset (VMODE bit = 1). Writing a value to the register REG_SOC (mixed mode SOC) forces the Coulomb counter gas gauge algorithm to restart from this new SOC value. REG_CC_CNF register is a 16-bit integer value and is calculated as shown in Equation 1: Equation 1 REG_CC_CNF = Rsense Cnom 49.556 Rsense is in mΩ and Cnom is in mAh. Example: Rsense =10 mΩ, Cnom = 1650 mAh, REG_CC_CNF = 333 12/28 DocID025995 Rev 1 GG25L 6.2.2 Functional description Voltage gas gauge algorithm No current sensing is needed for the voltage gas gauge. An internal algorithm precisely simulates the dynamic behavior of the battery and provides an estimation of the OCV. The battery SOC is related to the OCV by means of a high-precision reference OCV curve built into the GG25L. Any change in battery voltage causes the algorithm to track both the OCV and SOC values, taking into account the non-linear characteristics and time constants related to the chemical nature of the Li-Ion and Li-Po batteries. A single parameter fits the algorithm to a specific battery. The default value provides good results for most battery chemistries used in hand-held applications. Figure 6. Voltage gas gauge block diagram Voltage register VM configuration VIN AD converter OCV value Voltage mode (VM) algorithm Reference OCV curve To SOC management OCV adjustment registers Voltage gas gauge algorithm registers The REG_VM_CNF configuration register is used to configure the parameter used by the algorithm based on battery characteristic. The default value is 321. The REG_OCV register holds the estimated OCV value corresponding to the present battery state. The REG_OCVTAB registers are used to adjust the internal OCV table to a given battery type. The REG_VM_CNF register is a 12-bit integer value and is calculated from the averaged internal resistance and nominal capacity of the battery as shown in Equation 2: Equation 2 REG_VM_CNF = Ri Cnom 977.78 Ri is in mΩ and Cnom is in mAh. Example: Ri = 190 mΩ, Cnom =1650 mAh, REG_VM_CNF = 321 DocID025995 Rev 1 13/28 28 Functional description 6.2.3 GG25L Mixed mode gas gauge system The GG25L provides a mixed mode gas gauge using both a Coulomb counter (CC) and a voltage-mode (VM) algorithm to track the SOC of the battery in all conditions with optimum accuracy. The GG25L directly provides the SOC information. The Coulomb counter is mainly used when the battery is charging or discharging at a high rate. Each current conversion result is accumulated (Coulomb counting) for the calculation of the relative SOC value based on a configuration register. The voltage-mode algorithm is used when the application is in low power consumption state. The GG25L automatically uses the best method in any given application condition. However, when the application enters standby mode, the GG25L can be put in powersaving mode: only the voltage-mode gas gauge stays active, the Coulomb counter is stopped and power consumption is reduced. Figure 7. Mixed mode gas gauge block diagram Voltage mode gas gauge (VM) SOC management Coulomb counter (CC) REG_SOC register Alarm management Parameter tracking REG_VM_ADJ register REG_CC_ADJ register The combination of the CC and VM algorithms provides optimum accuracy under all application conditions. The voltage gas gauge cancels any long-term errors and prevents the SOC drift problem that is commonly found in Coulomb counter only solutions. Furthermore, the results of the two algorithms are continuously compared and adjustment factors are calculated. This enables the application to track the CC and VM algorithm parameters for long-term accuracy, automatically compensating for battery aging, application condition changes, and temperature effects. Five registers are dedicated to this monitoring: 14/28 REG_CC_ADJ and REG_VM_ADJ are continuously updated. They are signed, 16-bit, user-adjusted registers with LSB = 1/512 %. ACC_CC_ADJ and ACC_VM_ADJ are updated only when a method switch occurs. They are signed, 16-bit user adjusted accumulators with LSB = 1/512% RST_ACC_CC_ADJ and RST_ACC_VM_ADJ bits in the REG_MODE register are used to clear the associated counter. DocID025995 Rev 1 GG25L 6.3 Functional description Low battery alarm The ALM pin provides an alarm signal in case of a low battery condition. The output is an open drain and an external pull-up resistor is needed in the application. Writing the IO0DATA bit to 0 forces the ALM output low; writing the IO0DATA bit to 1 lets the ALM output reflect the battery condition. Reading the IO0DATA bit gives the state of the ALM pin. When the IO0DATA bit is 1, the ALM pin is driven low if either of the following two conditions is met: The battery SOC estimation from the mixed algorithm is less than the programmed threshold (if the alarm function is enabled by the ALM_ENA bit). The battery voltage is less than the programmed low voltage level (if the ALM_ENA bit is set). When a low-voltage or low-SOC condition is triggered, the GG25L drives the ALM pin low and sets the ALM_VOLT or ALM_SOC bit in REG_CTRL. The ALM pin remains low (even if the conditions disappear) until the software writes the ALM_VOLT and ALM_SOC bits to 0 to clear the interrupt. Clearing the ALM_VOLT or ALM_SOC while the corresponding low-voltage or low-SOC condition is still in progress does not generate another interrupt; this condition must disappear first and must be detected again before another interrupt (ALM pin driven low) is generated for this alarm. Another alarm condition, if not yet triggered, can still generate an interrupt. Usually, the low-SOC alarm occurs first to warn the application of a low battery condition, then if no action is taken and the battery discharges further, the low-voltage alarm signals a nearly-empty battery condition. At power-up, or when the GG25L is reset, the SOC and voltage alarms are enabled (ALM_ENA bit = 1). The ALM pin is high-impedance directly after POR and is driven low if the SOC and/or the voltage is below the default thresholds (1% SOC, 3.00 V voltage), after the first OCV measurement and SOC estimation. The REG_SOC_ALM register holds the relative SOC alarm level in 0.5 % units (0 to 100 %). Default value is 2 (i.e. 1% SOC). The REG_ALARM_VOLTAGE holds the low voltage threshold and can be programmed over the full scale voltage range with 17.60 (2.20 * 8) mV steps. The default value is 170 (3.00 V). DocID025995 Rev 1 15/28 28 Functional description 6.4 GG25L Power-up and battery swap detection When the GG25L is powered up at first battery insertion, an automatic battery voltage measurement cycle is made immediately after startup and debounce delay. This feature enables the system controller to get the SOC of a newly inserted battery based on the OCV measured just before the system actually starts. Figure 8. Timing diagram at power-up A battery swap is detected when the battery voltage drops below the undervoltage lockout (UVLO) for more than 1 s. The GG25L restarts when the voltage goes back above UVLO, in the same way as for a power-up sequence. Such filtering provides robust battery swap detection and prevents restarting in case of short voltage drops. This feature protects the application against high surge currents at low temperatures. Figure 9. Restart in case of battery swap <1s >1s VCC UVLO POR Short UVLO event < 1s No restart, No operation interuption Long battery disconnection events > 1s GG25L restarts GAMS2502141520SG Example: When BATD/CD is high (voltage above the 1.61 V threshold) for more than 1 s, a battery swap is detected. The GG25L restarts when the BATD/CD level returns below the threshold, in the same way as for a power-up sequence. Using the 1-s filter prevents false battery swap detection if short contact bouncing occurs at the battery terminals due to mechanical vibrations or shocks. 16/28 DocID025995 Rev 1 GG25L 6.5 Functional description Improving accuracy of the initial OCV measurement with the advanced functions of BATD/CD and RSTIO pins The advanced functions of the BATD/CD and RSTIO pins provide a way to ensure that the OCV measurement at power-up is not affected by the application startup or by the charger operation. This occurs as follows: The BATD/CD pin is driven high to VCC voltage which inhibits the charge function (assuming that the BATD/CD signal is connected to disable input of the charger circuit). The RSTIO pin senses the system reset state and if the system reset is active (that is RSTIO is low), the RSTIO is kept low until the end of the OCV measurement. Figure 10 describes the BATD/CD and RSTIO operation at power-up. Please refer to the block diagram of Figure 11 for the RSTI, RSTO, BATD_comp_out, and BATD_drive_high signals. At the end of the OCV measurement, the BATD/CD and RSTIO pin are released (high impedance), the application can start and the charger is enabled. Figure 10. BATD and RSTIO timing diagram at power-up delay SOC OCV calc. meas. Application can start, charge is enabled VCC UVLO POR 1.61V BATD_comp_out BATD_drive_high RSTI RST0 Voltage measurement Voltage register SOC register 6.5.1 BATD and RSTIO pins The GG25L provides platform synchronization signals to provide reliable SOC information in different cases. The BATD/CD pin senses the presence of the battery independently of the battery voltage and it controls the battery charger to inhibit the charge during the initial OCV measurement. The RSTIO pin can be used to delay the platform startup during the first OCV measurement at battery insertion. DocID025995 Rev 1 17/28 28 Functional description GG25L Figure 11. BATD and RSTIO VCC BATD_drive_high BATD/CD + - 1.61 V BATD_comp_out RSTIO RSTI RSTO The BATD/CD pin used as a battery detector is an analog I/O.The input detection threshold is typically 1.61 V. BATD/CD is also an output connected to VCC level when active. Otherwise, it is high impedance. The RSTIO signal is used to control the application system reset during the initial OCV measurement. The RSTIO pin is a standard I/O pin with open drain output. BATD/CD can be connected to the NTC sensor or to the identification resistor of the battery pack. The GG25L does not provide any biasing voltage or current for the battery detection. An external pull-up resistor or another device has to pull the BATD/CD pin high when the battery is removed. Figure 12. BATD/CD pin connection when used as battery detector GG25L GG25L Ru Other biasing and/or detection circuit (>1 M) Battery pack Battery pack BATD/CD BATD/CD 1K Rid BATD resistor biasing 18/28 DocID025995 Rev 1 1K Rid BATD biasing by external circuitry GG25L I²C interface 7 I²C interface 7.1 Read and write operations The I²C interface is used to control and read the current accumulator and registers. It is compatible with the Philips I²C Bus® (version 2.1). It is a slave serial interface with a serial data line (SDA) and a serial clock line (SCL). SCL: input clock used to shift data SDA: input/output bidirectional data transfers A filter rejects the potential spikes on the bus data line to preserve data integrity. The bidirectional data line supports transfers up to 400 Kbit/s (fast mode). The data are shifted to and from the chip on the SDA line, MSB first. The first bit must be high (START) followed by the 7-bit device address and the read/write control bit. Bits DevADDR0 to DevADDR2 are factory-programmable, the default device address value being 1110 000 (AddrID0 = AddrID1 = AddrID2 = 0). The GG25L then sends an acknowledge at the end of an 8-bit long sequence. The next eight bits correspond to the register address followed by another acknowledge. The data field is the last 8-bit long sequence sent, followed by a last acknowledge. Table 10. Device address format bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 1 1 1 0 DevADDR2 DevADDR1 DevADDR0 R/W Table 11. Register address format bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 RegADDR7 RegADDR6 RegADDR5 RegADDR4 RegADDR3 RegADDR2 RegADDR1 RegADDR0 Table 12. Register data format bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 DATA7 DATA6 DATA5 DATA4 DATA3 DATA2 DATA1 DATA0 DocID025995 Rev 1 19/28 28 I²C interface GG25L Figure 13. Read operation 6ODYH 0DVWHU 6WDUW 'HYLFHDGGU ELWV : $ 5HJDGGUHVV $ 5HVWDUW ELWV 'HYLFHDGGU ELWV 5 $ 5HJGDWD $ ELWV 6WDUWELW 6'$IDOOLQJZKHQ6&/ 6WRSELW 6'$ULVLQJZKHQ6&/ 5HVWDUWELW VWDUWDIWHUDVWDUW $FNQRZOHGJH 6'$IRUFHGORZGXULQJD6&/FORFN 5HJGDWD $ ELWV 5HJGDWD ELWV $GGUHVV Q $GGUHVV Q $ 6WRS *$3060' Figure 14. Write operation 6WDUW 'HYLFHDGGU ELWV : $ 5HJDGGUHVV ELWV $ 5HJGDWD ELWV $ 5HJGDWD $ ELWV $GGUHVV Q 6WDUWELW 6'$IDOOLQJZKHQ6&/ 6WRSELW 6'$ULVLQJZKHQ6&/ 5HVWDUWELW VWDUWDIWHUDVWDUW 5HJGDWD ELWV $ 6WRS $GGUHVV Q *$3060' 20/28 DocID025995 Rev 1 GG25L I²C interface 7.2 Register map 7.2.1 Register map The register space provides 28 control registers, 1 read-only register for device ID, 16 read/write RAM working registers reserved for the gas gauge algorithm, and 16 OCV adjustment registers. Mapping of all registers is shown in Table 13. Detailed descriptions of registers 0 (REG_MODE) and 1 (REG_CTRL) are shown in Table 14 and Table 15. All registers are reset to default values at power-on or reset, and the PORDET bit in register REG_CTRL is used to indicate the occurrence of a power-on reset. Table 13. Register map Name Control registers Address (decimal) Type POR Soft POR Description LSB 0 to 23 REG_MODE 0 R/W Mode register REG_CTRL 1 R/W Control and status register REG_SOC 2-3 R/W Gas gauge relative SOC REG_COUNTER 4-5 R 0x00 0x00 Number of conversions (2 bytes) REG_CURRENT 6-7 R 0x00 0x00 Battery current value (2 bytes) 5.88 µV REG_VOLTAGE 8-9 R 0x00 0x00 Battery voltage value (2 bytes) 2.2 mV REG_TEMPERATURE 10 R 0x00 0x00 Temperature data REG_CC_ADJ_HIGH 11 R/W 0x00 0x00 Coulomb counter adjustment factor REG_VM_ADJ_HIGH 12 R/W 0x00 0x00 Voltage mode adjustment factor REG_OCV 13-14 R/W 0x00 0x00 OCV register (2 bytes) REG_CC_CNF 15-16 R/W 395 395 Coulomb counter gas gauge configuration REG_VM_CNF 17-18 R/W 321 321 Voltage gas gauge algorithm parameter REG_ALARM_SOC 19 R/W 0x02 0x02 SOC alarm level (default = 1%) REG_ALARM_VOLTAGE 20 R/W 0xAA 0xAA Battery low voltage alarm level (default is 3 V) 17.6 mV REG_CURRENT_THRES 21 R/W 0x0A 0x0A Current threshold for the relaxation counter 47.04 µV REG_RELAX_COUNT 22 R 0x78 0x78 Relaxation counter REG_RELAX_MAX 23 R/W 0x78 0x78 Relaxation counter max value REG_ID 24 R 0x14 0x14 Part type ID = 14h DocID025995 Rev 1 1/512% 1 °C 1/2% 0.55 mV 1/2% 21/28 28 I²C interface GG25L Table 13. Register map (continued) Address (decimal) Type POR Soft POR Description REG_CC_ADJ_LOW 25 R/W 0x00 0x00 Coulomb counter adjustment factor REG_VM_ADJ_LOW 26 R/W 0x00 0x00 Voltage mode adjustment factor ACC_CC_ADJ 27-28 R/W 0x00 0x00 Coulomb Counter correction accumulator ACC_VM_ADJ 29-30 R/W 0x00 0x00 Voltage mode correction accumulator RAM registers 32 to 47 Name REG_RAM0 32 R/W ... ... REG_RAM15 47 R/W 48 to 63 R/W Random Unchanged LSB 1/512% Working register 0 for gas gauge ... Random Unchanged Working register 15 for gas gauge OCV adjustment registers REG_OCVTAB 22/28 0x00 0x00 DocID025995 Rev 1 OCV adjustment table (16 registers) 0.55 mV GG25L 7.2.2 I²C interface Register description Values held in consecutive registers (such as the charge value in the REG_SOC register pair) are stored with high bits in the first register and low bits in the second register. The registers must be read with a single I²C access to ensure data integrity. It is possible to read multiple values in one I²C access. All values must be consistent. The SOC data are coded in binary format and the LSB of the low byte is 1/512 %. The battery current is coded in 2’s complement format and the LSB value is 5.88 µV. The battery voltage is coded in 2’s complement format and the LSB value is 2.20 mV. The temperature is coded in 2’s complement format and the LSB value is 1°C. Table 14. REG_MODE - address 0 Name Position Type Def. VMODE 0 R/W 1 0: Mixed mode (Coulomb counter active) 1: Power saving voltage mode CLR_VM_ADJ 1 R/W 0 Write 1 to clear ACC_VM_ADJ and REG_VM_ADJ. Auto clear bit if GG_RUN = 1 CLR_CC_ADJ 2 R/W 0 Write 1 to clear ACC_CC_ADJ and REG_CC_ADJ Auto clear bit if GG_RUN = 1 ALM_ENA 3 R/W 1 Alarm function 0: Disabled 1: Enabled 0 0: Standby mode. Accumulator and counter registers are frozen, gas gauge and battery monitor functions are in standby. 1: Operating mode. 0 Forces the mixed mode relaxation timer to switch to the Coulomb counter mode. Write 1, self clear to 0 Relaxation counter = 0 0 Forces the mixed mode relaxation timer to switch to voltage gas gauge mode. Write 1, self clear to 0 Relaxation counter = Relax_max GG_RUN FORCE_CC FORCE_VM 4 5 6 7 R/W R/W R/W Description Unused DocID025995 Rev 1 23/28 28 I²C interface GG25L Table 15. REG_CTRL - address 1 Name IO0DATA Position Def. R X ALM pin status 0 = ALM input is low 1 = ALM input is high W 1 ALM pin output drive 0 = ALM is forced low 1 = ALM is driven by the alarm conditions 0 Description GG_RST 1 W 0 0: no effect 1: resets the conversion counter GG_RST is a self-clearing bit. GG_VM 2 R 0 Voltage mode active 0 = REG_SOC from Coulomb counter mode 1 = REG_SOC from Voltage mode BATFAIL 3 R/W 0 Battery removal or UVLO detection bit. Write 0 to clear (Write 1 is ignored) R 1 Power on reset (POR) detection bit 0 = no POR event occurred 1 = POR event occurred W 0 Soft reset 0 = release the soft-reset and clear the POR detection bit, 1 = assert the soft-reset and set the POR detection bit. This bit is self clearing. PORDET 4 ALM_SOC 5 R/W 0 Set with a low-SOC condition. Cleared by writing 0. ALM_VOLT 6 R/W 0 Set with a low-voltage condition. Cleared by writing 0. 7 24/28 Type Unused DocID025995 Rev 1 GG25L 8 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 15. Flip Chip CSP 1.40 x 2.04 mm package mechanical drawing ' I' H I( $VHHQRWH H ( ' & % $ %RWWRPYLHZ E & $ $ FFF $ * & ( ' 7RSYLHZ &63BBRSWLRQ+B9 1. The terminal A1 on the bump side is identified by a distinguishing feature - for instance, by a circular “clear area” typically 0.1 mm in diameter and/or a missing bump. 2. The terminal A1, on the back side, is identified by a distinguishing feature - for instance, by a circular “clear DocID025995 Rev 1 25/28 28 Package information GG25L area” typically 0.2 mm in diameter depending on the die size. Table 16. Flip Chip CSP 1.4 x 2.04 mm package mechanical data Dimensions Symbol Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.545 0.600 0.655 0.021 0.024 0.026 A1 0.165 0.200 0.235 0.006 0.008 0.009 A2 0.330 0.350 0.370 0.013 0.014 0.015 b 0.220 0.260 0.300 0.009 0.010 0.012 D 1.98 2.01 2.04 0.078 0.079 0.080 D1 E 1.20 1.34 E1 1.37 0.047 1.40 0.053 0.800 0.054 0.031 e 0.360 0.400 0.440 0.014 0.016 0.017 fD 0.395 0.405 0.415 0.016 0.016 0.016 fE 0.275 0.285 0.295 0.011 0.011 0.012 G ccc 0.050 0.002 0.050 Figure 16. Flip Chip CSP 1.4 x 2.04 mm footprint recommendation 26/28 0.055 DocID025995 Rev 1 0.002 GG25L 9 Revision history Revision history Table 17. Document revision history Date Revision 28-Feb-2014 1 Changes Initial release DocID025995 Rev 1 27/28 28 GG25L Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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