TI1 LMT84/LMT84-Q1 Sc70/to-92, analog temperature sensors with class-ab output Datasheet

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LMT86, LMT86-Q1
SNIS169C – MARCH 2013 – REVISED OCTOBER 2015
LMT86/LMT86-Q1 SC70/TO-92,
Analog Temperature Sensors with Class-AB Output
1 Features
3 Description
•
The LMT86/LMT86-Q1 are precision CMOS
integrated-circuit temperature sensors with an analog
output voltage that is linearly and inversely
proportional to temperature. Its features make it
suitable for many general temperature sensing
applications. It can operate down to 2.2V supply with
5.4 µA power consumption making it ideal for battery
powered devices. Package options including throughhole TO-92 package allows the LMT86 to be
mounted on-board, off-board, to a heat sink, or on
multiple unique locations in the same application. A
class-AB output structure gives the LMT86/LMT86Q1 strong output source and sink current capability
that can directly drive up to 1.1 nF capacitive loads.
This means it is well suited to drive an analog-todigital converter sample-and-hold input with its
transient load requirements. It has accuracy specified
in the operating range of −50°C to 150°C. The
accuracy, 3-lead package options, and other features
also make the LMT86/LMT86-Q1 an alternative to
thermistors.
1
•
•
•
•
•
•
•
•
•
LMT86-Q1 is AEC-Q100 Grade 0 qualified and is
Manufactured on an Automotive Grade Flow
Very Accurate ±0.25°C
Wide Temperature Range of −50°C to 150°C
Low 5.4 µA Quiescent Current
Sensor Gain of -10.9 mV/°C
Packages:
– Small SC70 Package
– Leaded TO-92
Output is Short-Circuit Protected
Push-Pull Output with ±50 µA Current Capability
Footprint Compatible with the Industry-Standard
LM20/19 and LM35 Temperature Sensor
Cost-effective Alternative to Thermistors
2 Applications
•
•
•
•
•
•
•
•
Automotive
Industrial
White Goods – Appliances
Battery Management
Disk Drives
Games
Wireless Transceivers
Cell phones
For devices with different average sensor gains and
comparable
accuracy
the
LMT84/LM84-Q1,
LMT85/LMT85-Q1 and LMT87/LMT87-Q1 (For more
details see Comparable Alternative Devices.)
Device Information (1)
PART NUMBER
LMT86
LMT86-Q1
(1)
PACKAGE
BODY SIZE (NOM)
SOT (5)
2.00 mm x 1.25 mm
TO-92 (3)
4.3 mm x 3.5 mm
SOT (5)
2.00 mm x 1.25 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
4 Full-Range Celsius Temperature Sensor (−50°C to 150°C)
Output Voltage vs Temperature
VDD (+2.2V to +5.5V)
3.0
LMT86
CBP
OUT
OUTPUT VOLTAGE (V)
2.5
VDD
2.0
1.5
1.0
0.5
GND
0.0
±50
0
50
100
150
TEMPERATURE (ƒC)
C001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMT86, LMT86-Q1
SNIS169C – MARCH 2013 – REVISED OCTOBER 2015
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Full-Range Celsius Temperature Sensor (−50°C
to 150°C) .................................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
5
5
5
5
6
7
7
8
Absolute Maximum Ratings .....................................
Handling Ratings - Commercial ................................
ESD Ratings - Automotive ........................................
Recommended Operating Ratings ...........................
Thermal Information ..................................................
Accuracy Characteristics .........................................
Electrical Characteristics .........................................
Typical Characteristics ..............................................
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 12
9
1
2
4
5
Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Applications ............................................... 14
10 Power Supply Recommendations ..................... 15
11 Layout................................................................... 15
11.1 Layout Guidelines ................................................. 15
11.2 Layout Example .................................................... 16
12 Device and Documentation Support ................. 17
12.1
12.2
12.3
12.4
12.5
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
17
17
17
17
17
13 Mechanical, Packaging, and Orderable
Information ........................................................... 17
5 Revision History
Changes from Revision B (May 2014) to Revision C
Page
•
Deleted all mentions of TO-126 package ............................................................................................................................... 1
•
Added TO-92 LPM pin configuration graphic ......................................................................................................................... 4
•
Changed Handling Ratings to ESD Ratings and moved Storage Temperature to Absolute Maximum Ratings table........... 5
•
Changed KV to V ................................................................................................................................................................... 5
•
Added layout recommendation for TO-92 LP and LPM packages....................................................................................... 16
Changes from Revision A (June 2013) to Revision B
Page
•
Changed data sheet flow and layout to conform with new TI standards. Added the following sections: Application
and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, Mechanical,
Packaging, and Orderable Information .................................................................................................................................. 1
•
Added TO92 and TO126 package information....................................................................................................................... 1
•
Changed from 450 °C/W to 275 °C/W. New specification is derived using TI's latest methodology. .................................... 6
•
Changed Temperature Accuracy VDD condition from 2.4V to 2.2V for range of 40°C to 150°C. .......................................... 7
•
Deleted Note: The input current is leakage only and is highest at high temperature. It is typically only 0.001 µA. The
1 µA limit is solely based on a testing limitation and does not reflect the actual performance of the part............................. 7
2
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Device Comparison Table (1)
ORDER NUMBER
PACKAGE
(2)
BODY SIZE (NOM)
MOUNTING TYPE
LMT86DCK
SOT (AKA
5
2.00 mm x 1.25 mm
Surface Mount
LMT86LP
TO-92 (AKA (2): LP)
3
4.3 mm x 3.5 mm
Through-hole; straight leads
LMT86LPM
TO-92 (AKA (2): LPM)
3
4.3 mm x 3.5 mm
Through-hole; formed leads
5
2.00 mm x 1.25 mm
Surface Mount
LMT86DCK-Q1
(1)
(2)
SOT (AKA
: SC70, DCK)
PIN
(2)
: SC70, DCK)
For all available packages and complete order numbers, see the orderable addendum at the end of the data sheet.
AKA = Also Known As
Comparable Alternative Devices
PART NUMBER
AVERAGE OUTPUT SENSOR GAIN
POWER SUPPLY RANGE
LMT84/LMT84-Q1
–5.5 mV/°C
1.5V to 5.5V
LMT85/LMT85-Q1
–8.2 mV/°C
1.8V to 5.5V
LMT86/LMT86-Q1
–10.9 mV/°C
2.2V to 5.5V
LMT87/LMT87-Q1
–13.6 mV/°C
2.7V to 5.5V
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6 Pin Configuration and Functions
3-Pin TO-92
LPM Package
5-Pin SOT (SC70)
DCK Package
(TOP VIEW)
1
5
GND
VDD
2
LMT86
GND
4
3
OUT
VDD
VDD
OUT
3-Pin TO-92
LP Package
GND
VDD
OUT
GND
Pin Functions
PIN
LABEL
DCK
NUMBER
LP
NUMBER
DESCRIPTION
LPC
NUMBER
TYPE
VDD
5
Power
GND
1
Ground
EQUIVALENT CIRCUIT
FUNCTION
Power Supply Voltage
Power Supply Ground
VDD
OUT
Analog
Output
3
See Pin
Diagrams
Outputs a voltage which is inversely
proportional to temperature
See Pin
Diagrams
GND
VDD
4
Power
Positive Supply Voltage
GND
2
Ground
Power Supply Ground, (direct
connection to the back side of the
die)
4
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7 Specifications
7.1 Absolute Maximum Ratings
(1) (2)
MIN
MAX
UNIT
Supply Voltage
–0.3
6
V
Voltage at Output Pin
–0.3
(VDD + 0.5)
V
-7
7
mA
Output Current
Input Current at any pin
(3)
-5
Maximum Junction Temperature (TJMAX)
Storage temperature range Tstg
(1)
(2)
(3)
-65
5
mA
150
°C
150
°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not specific performance limits. For specifications and test conditions, see the Electrical
Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the
device is not operated under the listed test conditions.
Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. Reflow temperature
profiles are different for lead-free and non-lead-free packages.
When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V), the current at that pin should be limited to 5 mA.
7.2 Handling Ratings - Commercial
VALUE
V(ESD)
(1)
(2)
(3)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins. (1)Applies for TO-92 package LMT86LP.
±2500
Human body model (HBM), per JESD22-A114, all pins. Applies
for SC70 package LMT86DCK.
±2500
Charged device model (CDM), per JEDEC specification JESD22C101, all pins. (2) Applies for all parts.
±1000
Machine model ESD stress voltage, per JEDEC specification
JESD22-A115. (3) Applies for SC70 package LMT86DCK and
LMT86DCK-Q1.
±250
UNIT
V
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
The machine model is a 200pF capacitor discharged directly into each pin.
7.3 ESD Ratings - Automotive
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per JESD22-A114, all
pins. (1) Applies for SC70 package LMT86DCK-Q1.
±2500
Charged-device model (CDM), per JEDEC
specification JESD22-C101, all pins. (2) Applies for
SC70 package LMT86DCK-Q1.
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.4 Recommended Operating Ratings
MIN
Specified temperature range
VDD
Supply voltage range
MAX
°C
−50 ≤ TA ≤ 150
°C
2.2
V
5.5
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UNIT
TMIN ≤ TA ≤ TMAX
5
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7.5 Thermal Information (1)
THERMAL METRIC
(2)
(3) (4)
LMT86
LMT86-Q1
LMT86
DCK
LP
5 PINS
3 PINS
275
167
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
84
80
RθJB
Junction-to-board thermal resistance
56
146
ψJT
Junction-to-top characterization parameter
1.2
35
ψJB
Junction-to-board characterization parameter
55
146
(1)
(2)
(3)
(4)
6
UNIT
°C/W
For information on self-heating and thermal response time see section Mounting and Thermal Conductivity.
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction to ambient thermal resistance (RθJA) under natural convection is obtained in a simulation on a JEDEC-standard, High K
board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are
included in the PCB, per JESD 51-5.
Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.
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7.6
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Accuracy Characteristics
These limits do not include DC load regulation. These stated accuracy limits are with reference to the values in Table 1.
PARAMETER
MIN (1)
CONDITIONS
TYP (2) MAX
-2.7
±0.4
2.7
°C
0°C to 40°C; VDD = 2.4 V to 5.5 V
-2.7
±0.7
2.7
°C
±0.3
–50°C to 0°C; VDD = 3.0 V to 5.5 V
-2.7
°C
±0.7
–50°C to 0°C; VDD = 3.6 V to 5.5 V
7.7
UNIT
40°C to 150°C; VDD = 2.2 V to 5.5 V
Temperature accuracy (3) 0°C to 70°C; VDD = 3.0 V to 5.5 V
(1)
(2)
(3)
(1)
2.7
°C
±0.25
°C
Limits are specified to TI's AOQL (Average Outgoing Quality Level).
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Accuracy is defined as the error between the measured and reference output voltages, tabulated in the Transfer Table at the specified
conditions of supply gain setting, voltage, and temperature (expressed in °C). Accuracy limits include line regulation within the specified
conditions. Accuracy limits do not include load regulation; they assume no dc load.
Electrical Characteristics
Unless otherwise noted, these specifications apply for +VDD = 2.2 V to 5.5 V. MIN and MAX limits apply for TA = TJ = TMIN to
TMAX , unless otherwise noted; typical values apply for TA = TJ = 25°C.
PARAMETER
Average sensor gain (output
transfer function slope)
Load regulation (3)
Line regulation
Supply current
CL
Output load capacitance
(5)
MIN
(1)
-30°C and 90°C used to calculate average
sensor gain
Source ≤ 50 μA, (VDD – VOUT) ≥ 200 mV
TYP
(2)
MAX
(1)
–10.9
-1
Sink ≤ 50 μA, VOUT ≥ 200 mV
UNIT
mV/°C
–0.22
0.26
(4)
IS
(1)
(2)
(3)
(4)
CONDITIONS
mV
1
mV
μV/V
200
TA = 30°C to 150°C, (VDD – VOUT) ≥ 100 mV
5.4
8.1
μA
TA = -50°C to 150°C, (VDD – VOUT) ≥ 100 mV
5.4
9
μA
1.9
ms
50
µA
1100
Power-on time (5)
CL= 0 pF to 1100 pF
Output drive
TA = TJ = 25°C
0.7
-50
pF
Limits are specific to TI's AOQL (Average Outgoing Quality Level).
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Source currents are flowing out of the LMT86 and LMT86-Q1. Sink currents are flowing into the LMT86 and LMT86-Q1.
Line regulation (DC) is calculated by subtracting the output voltage at the highest supply voltage from the output voltage at the lowest
supply voltage. The typical DC line regulation specification does not include the output voltage shift discussed in Output Voltage Shift.
Specified by design and characterization.
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7.8 Typical Characteristics
4
TEMPERATURE ERROR (ºC)
3
2
1
0
-1
-2
-3
-4
-50
-25
0
25
50
75
100 125 150
TEMPERATURE (ºC)
8
Figure 1. Temperature Error vs Temperature
Figure 2. Minimum Operating Temperature vs
Supply Voltage
Figure 3. Supply Current vs Temperature
Figure 4. Supply Current vs Supply Voltage
Figure 5. Load Regulation, Sourcing Current
Figure 6. Load Regulation, Sinking Current
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Typical Characteristics (continued)
Figure 7. Change in VOUT vs Overhead Voltage
Figure 8. Supply-Noise Gain vs Frequency
Figure 9. Output Voltage vs Supply Voltage
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8 Detailed Description
8.1 Overview
The LMT86/LMT86-Q1 is an analog output temperature sensor. The temperature sensing element is comprised
of a simple base emitter junction that is forward biased by a current source. The temperature sensing element is
then buffered by an amplifier and provided to the OUT pin. The amplifier has a simple push-pull output stage
thus providing a low impedance output source.
8.2 Functional Block Diagram
Full-Range Celsius Temperature Sensor (−50°C to 150°C).
VDD
OUT
Thermal Diodes
GND
8.3 Feature Description
8.3.1 LMT86 and LMT86-Q1 Transfer Function
The output voltage of the LMT86 and LMT86-Q1, across the complete operating temperature range is shown in
Table 1. This table is the reference from which the LMT86 and LMT86-Q1 accuracy specifications (listed in the
Accuracy Characteristics section) are determined. This table can be used, for example, in a host processor lookup table. A file containing this data is available for download at LMT86 product folder under Tools and Software
Models.
Table 1. LMT86 and LMT86-Q1 Transfer Table
10
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
-50
2616
-10
2207
30
1777
70
1335
110
883
-49
2607
-9
2197
31
1766
71
1324
111
872
-48
2598
-8
2186
32
1756
72
1313
112
860
-47
2589
-7
2175
33
1745
73
1301
113
849
-46
2580
-6
2164
34
1734
74
1290
114
837
-45
2571
-5
2154
35
1723
75
1279
115
826
-44
2562
-4
2143
36
1712
76
1268
116
814
-43
2553
-3
2132
37
1701
77
1257
117
803
-42
2543
-2
2122
38
1690
78
1245
118
791
-41
2533
-1
2111
39
1679
79
1234
119
780
-40
2522
0
2100
40
1668
80
1223
120
769
-39
2512
1
2089
41
1657
81
1212
121
757
-38
2501
2
2079
42
1646
82
1201
122
745
-37
2491
3
2068
43
1635
83
1189
123
734
-36
2481
4
2057
44
1624
84
1178
124
722
-35
2470
5
2047
45
1613
85
1167
125
711
-34
2460
6
2036
46
1602
86
1155
126
699
-33
2449
7
2025
47
1591
87
1144
127
688
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Feature Description (continued)
Table 1. LMT86 and LMT86-Q1 Transfer Table (continued)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
-32
2439
8
2014
48
1580
88
1133
128
676
-31
2429
9
2004
49
1569
89
1122
129
665
-30
2418
10
1993
50
1558
90
1110
130
653
-29
2408
11
1982
51
1547
91
1099
131
642
-28
2397
12
1971
52
1536
92
1088
132
630
-27
2387
13
1961
53
1525
93
1076
133
618
-26
2376
14
1950
54
1514
94
1065
134
607
-25
2366
15
1939
55
1503
95
1054
135
595
-24
2355
16
1928
56
1492
96
1042
136
584
-23
2345
17
1918
57
1481
97
1031
137
572
-22
2334
18
1907
58
1470
98
1020
138
560
-21
2324
19
1896
59
1459
99
1008
139
549
-20
2313
20
1885
60
1448
100
997
140
537
-19
2302
21
1874
61
1436
101
986
141
525
-18
2292
22
1864
62
1425
102
974
142
514
-17
2281
23
1853
63
1414
103
963
143
502
-16
2271
24
1842
64
1403
104
951
144
490
-15
2260
25
1831
65
1391
105
940
145
479
-14
2250
26
1820
66
1380
106
929
146
467
-13
2239
27
1810
67
1369
107
917
147
455
-12
2228
28
1799
68
1358
108
906
148
443
-11
2218
29
1788
69
1346
109
895
149
432
150
420
Although the LMT86 and LMT86-Q1 is very linear, its response does have a slight umbrella parabolic shape.
This shape is very accurately reflected in Table 1. The Transfer Table can be calculated by using the parabolic
equation.
mV
mV
ª
º ª
2º
VTEMP mV = 1777.3mV - «10.888
T - 30°C » - «0.00347 2 T - 30°C »
°C
¬
¼ ¬
°C
¼
(1)
The parabolic equation is an approximation of the transfer table and the accuracy of the equation degrades
slightly at the temperature range extremes. Equation 1 can be solved for T resulting in:
T
10 .888
10 .888
2
4 u 0.00347 u 1777 .3 VTEMP mV
2 u ( 0.00347 )
30
(2)
For an even less accurate linear transfer function approximation, a line can easily be calculated over the desired
temperature range from the Table using the two-point equation:
·
¹
V - V1 =
V2 - V1
T2 - T1
· u (T - T1)
¹
(3)
Where V is in mV, T is in °C, T1 and V1 are the coordinates of the lowest temperature, T2 and V2 are the
coordinates of the highest temperature.
For example, if we want to resolve this equation, over a temperature range of 20°C to 50°C, we would proceed
as follows:
1558 mV - 1885 mV·
u (T - 20oC)
50oC - 20oC
¹
·
¹
V - 1885 mV =
(4)
o
o
V - 1885 mV = (-10.9 mV / C) u (T - 20 C)
(5)
o
V = (-10.9 mV / C) u T + 2103 mV
(6)
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Using this method of linear approximation, the transfer function can be approximated for one or more
temperature ranges of interest.
8.4 Device Functional Modes
8.4.1 Mounting and Thermal Conductivity
The LMT86 and LMT86-Q1 can be applied easily in the same way as other integrated-circuit temperature
sensors. It can be glued or cemented to a surface.
To ensure good thermal conductivity, the backside of the LMT86 and LMT86-Q1 die is directly attached to the
GND pin (Pin 2). The temperatures of the lands and traces to the other leads of the LMT86 and LMT86-Q1 will
also affect the temperature reading.
Alternatively, the LMT86 and LMT86-Q1 can be mounted inside a sealed-end metal tube, and can then be
dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LMT86 and LMT86-Q1 and
accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is
especially true if the circuit may operate at cold temperatures where condensation can occur. If moisture creates
a short circuit from the output to ground or VDD, the output from the LMT86 and LMT86-Q1 will not be correct.
Printed-circuit coatings are often used to ensure that moisture cannot corrode the leads or circuit traces.
The thermal resistance junction to ambient (RθJA or θJA) is the parameter used to calculate the rise of a device
junction temperature due to its power dissipation. The equation used to calculate the rise in the LMT86 and
LMT86-Q1 die temperature is:
TJ = TA + TJA ª¬(VDDIS ) + (VDD - VO ) IL º¼
(7)
where TA is the ambient temperature, IS is the supply current, IL is the load current on the output, and VO is the
output voltage. For example, in an application where TA = 30°C, VDD = 5V, IS = 5.4 µA, VO = 1777 mV junction
temp 30.014°C self-heating error of 0.014°C. Since the LMT86 and LMT86-Q1's junction temperature is the
actual temperature being measured, care should be taken to minimize the load current that the LMT86 and
LMT86-Q1 is required to drive. Thermal Information (1) shows the thermal resistance of the LMT86 and LMT86Q1.
8.4.2 Output Noise Considerations
A push-pull output gives the LMT86 and LMT86-Q1 the ability to sink and source significant current. This is
beneficial when, for example, driving dynamic loads like an input stage on an analog-to-digital converter (ADC).
In these applications the source current is required to quickly charge the input capacitor of the ADC. The LMT86
and LMT86-Q1 is ideal for this and other applications which require strong source or sink current.
The LMT86 and LMT86-Q1's supply-noise gain (the ratio of the AC signal on VOUT to the AC signal on VDD) was
measured during bench tests. Its typical attenuation is shown in Figure 8 found in the Typical Characteristics
section. A load capacitor on the output can help to filter noise.
For operation in very noisy environments, some bypass capacitance should be present on the supply within
approximately 5 centimeters of the LMT86 and LMT86-Q1.
8.4.3 Capacitive Loads
The LMT86 and LMT86-Q1 handles capacitive loading well. In an extremely noisy environment, or when driving
a switched sampling input on an ADC, it may be necessary to add some filtering to minimize noise coupling.
Without any precautions, the LMT86 and LMT86-Q1 can drive a capacitive load less than or equal to 1100 pF as
shown in Figure 10. For capacitive loads greater than 1100 pF, a series resistor may be required on the output,
as shown in Figure 11.
(1)
12
For information on self-heating and thermal response time see section Mounting and Thermal Conductivity.
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SNIS169C – MARCH 2013 – REVISED OCTOBER 2015
Device Functional Modes (continued)
VDD
LMT86
OPTIONAL
BYPASS
CAPACITANCE
OUT
GND
CLOAD ” 1100 pF
Figure 10. LMT86 No Decoupling Required for Capacitive Loads Less than 1100 pF
VDD
RS
LMT86
OPTIONAL
BYPASS
CAPACITANCE
OUT
GND
CLOAD > 1100 pF
Figure 11. LMT86 with Series Resistor for Capacitive Loading Greater than 1100 pF
CLOAD
MINIMUM RS
1.1 nF to 99 nF
3 kΩ
100 nF to 999 nF
1.5 kΩ
1 μF
800 Ω
8.4.4 Output Voltage Shift
The LMT86 and LMT86-Q1 are very linear over temperature and supply voltage range. Due to the intrinsic
behavior of an NMOS/PMOS rail-to-rail buffer, a slight shift in the output can occur when the supply voltage is
ramped over the operating range of the device. The location of the shift is determined by the relative levels of
VDD and VOUT. The shift typically occurs when VDD- VOUT = 1 V.
This slight shift (a few millivolts) takes place over a wide change (approximately 200 mV) in VDD or VOUT. Since
the shift takes place over a wide temperature change of 5°C to 20°C, VOUT is always monotonic. The accuracy
specifications in the Accuracy Characteristics table already include this possible shift.
9 Application and Implementation
9.1 Application Information
The LMT86/LMT86-Q1 features make it suitable for many general temperature sensing applications. It can
operate down to 2.2V supply with 5.4 uA power consumption making it ideal for battery powered devices.
Package options including through-hole TO-92 package allow the LMT86 to be mounted on-board, off-board, to a
heat sink, or on multiple unique locations in the same application.
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9.2 Typical Applications
9.2.1 Connection to an ADC
Simplified Input Circuit of
SAR Analog-to-Digital Converter
Reset
+2.2V to +5.5V
Input
Pin
LMT86
VDD
CBP
RMUX
RSS
Sample
OUT
GND
CMUX
CFILTER
CSAMPLE
Figure 12. Suggested Connection to a Sampling Analog-to-Digital Converter Input Stage
9.2.1.1 Design Requirements
Most CMOS ADCs found in microcontrollers and ASICs have a sampled data comparator input structure. When
the ADC charges the sampling cap, it requires instantaneous charge from the output of the analog source such
as the LMT86 and LMT86-Q1 temperature sensor and many op amps. This requirement is easily accommodated
by the addition of a capacitor, CFILTER.
9.2.1.2 Detailed Design Procedure
The size of CFILTER depends on the size of the sampling capacitor and the sampling frequency. Since not all
ADCs have identical input stages, the charge requirements will vary. This general ADC application is shown as
an example only.
9.2.1.3 Application Curves
3.0
OUTPUT VOLTAGE (V)
2.5
2.0
1.5
1.0
0.5
0.0
±50
0
50
100
150
TEMPERATURE (ƒC)
C001
Figure 13. Analog Output Transfer Function
9.2.2 Conserving Power Dissipation with Shutdown
VDD
SHUTDOWN
VOUT
LMT86
Any logic
device output
Figure 14. Conserving Power Dissipation with Shutdown
9.2.2.1 Design Requirements
Since the power consumption of the LMT86 is less than 9 µA it can simply be powered directly from any logic
gate output, thus not requiring a specific shutdown pin. The device can even be powered directly from a micro
controller GPIO. In this way it can easily be turned off for cases such as battery powered systems where power
savings is critical.
14
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Typical Applications (continued)
9.2.2.2 Detailed Design Procedure
Simply connect the VDD pin of the LMT86 directly to the logic shutdown signal from a microcontroller.
9.2.2.3 Application Curves
Time: 500 µsec/div; Top Trace: VDD 1 V/div;
Bottom Trace: OUT 1 V/div
Figure 15. Output Turn-on Response Time without a
Capacitive Load and VDD=3.3V
Time: 500 µsec/div; Top Trace: VDD 1 V/div;
Bottom Trace: OUT 1 V/div
Figure 16. Output Turn-on Response Time with a 1.1 nF
Capacitive Load and VDD=3.3V
Time: 500 µsec/div; Top Trace: VDD 2 V/div;
Bottom Trace: OUT 1 V/div
Figure 17. Output Turn-on Response Time without a
Capacitive Load and VDD=5V
Time: 500 µsec/div; Top Trace: VDD 2 V/div;
Bottom Trace: OUT 1 V/div
Figure 18. Output Turn-on Response Time with 1.1 nF
Capacitive Load and VDD=5V
10 Power Supply Recommendations
The LMT86's low supply current and supply range of 2.2V to 5.5V allow the device to easily be powered from
many sources.
Power supply bypassing is optional and is mainly dependent on the noise on the power supply used. In noisy
systems it may be necessary to add bypass capacitors to lower the noise that is coupled to the LMT86's output.
11 Layout
11.1 Layout Guidelines
The LMT86 is extremely simple to layout. If a power supply bypass capacitor is used it should be connected as
shown in the Layout Example.
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11.2 Layout Example
VIA to ground plane
VIA to power plane
GND
VDD
GND
0.01µ F
OUT
VDD
Figure 19. SC70 Package Recommended Layout
GND
OUT
VDD
Figure 20. TO-92 LP Package Recommended Layout
GND
OUT
VDD
Figure 21. TO-92 LPM Package Recommended Layout
16
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SNIS169C – MARCH 2013 – REVISED OCTOBER 2015
12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
LMT86
Click here
Click here
Click here
Click here
Click here
LMT86-Q1
Click here
Click here
Click here
Click here
Click here
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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17
PACKAGE OPTION ADDENDUM
www.ti.com
25-May-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMT86DCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BSA
LMT86DCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BSA
LMT86LP
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-50 to 150
LMT86
LMT86LPG
PREVIEW
TO-92
LPG
3
1000
TBD
Call TI
Call TI
-50 to 150
LMT86LPGM
PREVIEW
TO-92
LPG
3
3000
TBD
Call TI
Call TI
-50 to 150
LMT86LPM
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
CU SN
N / A for Pkg Type
-50 to 150
LMT86
LMT86QDCKRQ1
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BTA
LMT86QDCKTQ1
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-50 to 150
BTA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-May-2017
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMT86, LMT86-Q1 :
• Catalog: LMT86
• Automotive: LMT86-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Jul-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
LMT86DCKR
SC70
DCK
5
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT86DCKT
SC70
DCK
5
250
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT86QDCKRQ1
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMT86QDCKTQ1
SC70
DCK
5
250
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Jul-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMT86DCKR
SC70
DCK
5
3000
210.0
185.0
35.0
LMT86DCKT
SC70
DCK
5
250
210.0
185.0
35.0
LMT86QDCKRQ1
SC70
DCK
5
3000
210.0
185.0
35.0
LMT86QDCKTQ1
SC70
DCK
5
250
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
LPG0003A
TO-92 - 5.05 mm max height
SCALE 1.300
TO-92
4.1
3.9
3.25
3.05
3X
0.55
0.40
5.05
MAX
3
1
3X (0.8)
3X
15.5
15.1
3X
0.48
0.35
3X
2X 1.27 0.05
0.51
0.36
2.64
2.44
2.68
2.28
1.62
1.42
2X (45 )
1
(0.5425)
2
3
0.86
0.66
4221343/B 09/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
LPG0003A
TO-92 - 5.05 mm max height
TO-92
0.05 MAX
ALL AROUND
TYP
FULL R
TYP
METAL
TYP
(1.07)
3X ( 0.75) VIA
2X
METAL
(1.7)
2X (1.7)
2
1
2X
SOLDER MASK
OPENING
3
2X (1.07)
(R0.05) TYP
(1.27)
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:20X
4221343/B 09/2016
www.ti.com
PACKAGE OUTLINE
LP0003A
TO-92 - 5.34 mm max height
SCALE 1.200
SCALE 1.200
TO-92
5.21
4.44
EJECTOR PIN
OPTIONAL
5.34
4.32
(1.5) TYP
SEATING
PLANE
(2.54)
NOTE 3
2X
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
2X
2.6 0.2
3X
12.7 MIN
3X
3X
0.55
0.38
0.43
0.35
2X 1.27 0.13
FORMED LEAD OPTION
STRAIGHT LEAD OPTION
OTHER DIMENSIONS IDENTICAL
TO STRAIGHT LEAD OPTION
3X
2.67
2.03
4.19
3.17
3
2
1
3.43 MIN
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
www.ti.com
EXAMPLE BOARD LAYOUT
LP0003A
TO-92 - 5.34 mm max height
TO-92
0.05 MAX
ALL AROUND
TYP
FULL R
TYP
METAL
TYP
(1.07)
3X ( 0.85) HOLE
2X
METAL
(1.5)
2X (1.5)
2
1
(R0.05) TYP
3
2X (1.07)
(1.27)
SOLDER MASK
OPENING
2X
SOLDER MASK
OPENING
(2.54)
LAND PATTERN EXAMPLE
STRAIGHT LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
0.05 MAX
ALL AROUND
TYP
( 1.4)
2X ( 1.4)
METAL
3X ( 0.9) HOLE
METAL
(R0.05) TYP
2
1
(2.6)
SOLDER MASK
OPENING
3
2X
SOLDER MASK
OPENING
(5.2)
LAND PATTERN EXAMPLE
FORMED LEAD OPTION
NON-SOLDER MASK DEFINED
SCALE:15X
4215214/B 04/2017
www.ti.com
TAPE SPECIFICATIONS
LP0003A
TO-92 - 5.34 mm max height
TO-92
13.7
11.7
32
23
(2.5) TYP
0.5 MIN
16.5
15.5
11.0
8.5
9.75
8.50
19.0
17.5
6.75
5.95
2.9
TYP
2.4
3.7-4.3 TYP
13.0
12.4
FOR FORMED LEAD OPTION PACKAGE
4215214/B 04/2017
www.ti.com
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DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
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