TI1 LM5026SDX/NOPB Active clamp current mode pwm controller Datasheet

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LM5026
SNVS363E – AUGUST 2005 – REVISED NOVEMBER 2015
LM5026 Active Clamp Current Mode PWM Controller
1 Features
3 Description
•
•
•
•
•
The LM5026 PWM controller contains all of the
features necessary to implement power converters
utilizing the active clamp and reset technique with
current-mode control. With the active clamp
technique, higher efficiencies and greater power
densities can be realized compared to conventional
catch winding or RDC clamp and reset techniques.
Two control outputs are provided, the main power
switch control (OUT_A) and the active clamp switch
control (OUT_B). The device can be configured to
control either a P-Channel or N-Channel clamp
switch. The main gate driver features a compound
configuration, consisting of both MOS and Bipolar
devices, providing superior gate drive characteristics.
The LM5026 can be configured to operate with bias
voltages over a wide input range of 8 V to 100 V.
Additional features include programmable maximum
duty cycle, line undervoltage lockout, cycle-by-cycle
current limit, hiccup mode fault operation with
adjustable timeout delay, PWM slope compensation,
soft-start,
1-MHz
capable
oscillator
with
synchronization input and output capability, precision
reference, and thermal shutdown.
1
•
•
•
•
•
•
•
•
Current-Mode Control
Internal 100-V Start-Up Bias Regulator
3-A Compound Main Gate Driver
High Bandwidth Optocoupler Interface
Programmable Line Undervoltage Lockout (UVLO)
With Adjustable Hysteresis
Versatile Dual Mode Overcurrent Protection With
Hiccup Delay Timer
Programmable Overlap or Deadtime between the
Main and Active Clamp Outputs
Programmable Maximum Duty Cycle Clamp
Programmable Soft-Start
Leading Edge Blanking
Resistor Programmed 1-MHz Capable Oscillator
Oscillator Sync I/O Capability
Precision 5-V Reference
2 Applications
•
•
•
Server Power Supplies
48-V Telecom Power Supplies
High Efficiency DC–DC Power Supplies
Device Information(1)
PART NUMBER
LM5026
PACKAGE
BODY SIZE (NOM)
WSON (16)
5.00 mm × 5.00 mm
TSSOP (16)
4.40 mm × 5.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Circuit
VIN
36 - 78V
VOUT
3.3V
T1
CS
VCC
CS
LM5026
VIN
UVLO
OUT_A
TIME
RES
RT
OUT_B
ERROR
AMP and
ISOLATION
REF
COMP
SYNC
DCL
SS
PGND AGND
SYNC I/O
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM5026
SNVS363E – AUGUST 2005 – REVISED NOVEMBER 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
5
5
8
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 19
8
Application and Implementation ........................ 20
8.1 Application Information............................................ 20
8.2 Typical Application ................................................. 25
9 Power Supply Recommendations...................... 29
10 Layout................................................................... 29
10.1 Layout Guidelines ................................................. 29
10.2 Layout Example .................................................... 30
11 Device and Documentation Support ................. 31
11.1
11.2
11.3
11.4
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
31
31
31
31
12 Mechanical, Packaging, and Orderable
Information ........................................................... 31
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (April 2013) to Revision E
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
Changes from Revision C (April 2013) to Revision D
•
2
Page
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 25
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5 Pin Configuration and Functions
PW Package
16-Pin TSSOP
Top View
NHQ Package
16-Pin WSON
Top View
VIN
1
16
DCL
UVLO
2
15
SYNC
16 DCL
VIN 1
UVLO 2
15 SYNC
CS 3
CS
3
14
RT
RES
4
13
COMP
TIME
5
12
SS
REF
6
11
AGND
VCC
7
10
PGND
OUT_A
8
9
OUT_B
14 RT
RES 4
EP
TIME 5
13 COMP
12 SS
REF 6
11 AGND
VCC 7
10 PGND
9 OUT_B
OUT_A 8
Pin Functions
PIN
NO.
NAME
TYPE (1)
DESCRIPTION
1
VIN
I
Input voltage source. Input to the start-up regulator. Operating input range is 13 V to 100 V
with transient capability to 105 V. For power sources outside of this range, the LM5026 can
be biased directly at VCC by an external regulator.
2
UVLO
I
Line undervoltage lockout. An external voltage divider from the power source sets the
shutdown and standby comparator levels. When UVLO reaches the 0.4-V threshold the VCC
and REF regulators are enabled. At the 1.25-V threshold the SS pin is released and the
device enters the active mode.
3
CS
I
Current Sense input for current mode control and current limit. If CS exceeds 0.5 V, the
output pulse will be terminated, entering cycle-by-cycle current limit. An internal switch holds
CS low for 100 nS after OUT_A switches high to blank leading edge transients.
I
Restart Timer. If cycle-by-cycle current limit is reached during any cycle, a 10-µA current is
sourced to the RES pin capacitor. If the RES capacitor voltage reaches 2.5 V, the soft-start
capacitor will be fully discharged and then released with a pullup current of 1 µA. After the
first output pulse at OUT_A (when SS = 1.4 V), the SS pin charging current will revert back
to 50 µA.
4
RES
5
TIME
I
Gate drive overlap or deadtime control. An external resistor (RSET) sets either the overlap
time or deadtime for the active clamp output. An RSET resistor connected between TIME
and AGND produces in-phase OUT_A and OUT_B pulses with overlap. An RSET resistor
connected between TIME and REF produces out-of-phase OUT_A and OUT_B pulses with
deadtime.
6
REF
O
Output of 5-V reference. Maximum output current is 10 mA. Locally decouple with a 0.1-µF
capacitor.
7
VCC
P
Output of the high voltage start-up regulator. The VCC voltage is regulated to 7.6 V. If an
auxiliary winding raises the voltage on this pin above the regulation setpoint, the internal
start-up regulator will shutdown, thus reducing the IC power dissipation.
8
OUT_A
O
Main output driver. Output of the main switch PWM gate driver. Capable of 3-A peak sink
current.
9
OUT_B
O
Active clamp output driver. Output of the active clamp switch gate driver. Capable of 0.5-A
peak source and sink current.
10
PGND
G
Power ground. Connect directly to analog cround.
11
AGND
G
Analog return. Connect directly to power cround.
12
SS
I
Soft-start. An external capacitor and an internal 50-µA current source set the soft-start ramp.
The SS current source is reduced to 1 µA following a restart event. The soft-stop discharge
current is 50 µA.
I
Input to the pulse width modulator. The external optocoupler connected to the COMP pin
sources current into an internal NPN current mirror. The PWM duty cycle is maximum with
zero input current, while 1 mA reduces the duty cycle to zero. The current mirror improves
the frequency response by reducing the ac voltage across the optocoupler detector.
13
(1)
COMP
P = Power, G = Ground, I = Input, O = Output, I/O = Input/Output
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Pin Functions (continued)
PIN
NO.
NAME
TYPE (1)
DESCRIPTION
Oscillator frequency control. Normally biased at 2 V. The total external resistance connected
between RT and AGND sets the internal oscillator frequency.
14
RT
I
15
SYNC
I/O
16
DCL
I
Maximum duty cycle control. An external resistor divider connected from RT to AGND sets
the maximum output duty cycle for OUT_A.
EP
Exposed Pad
(WSON
Package
Only)
G
Exposed Pad, underside of WSON package. Connect to system ground plane for reduced
thermal resistance.
Oscillator synchronization input/output. The internal oscillator can be synchronized to an
external clock with an external pulldown device. Multiple LM5026 devices can be
synchronized together by connection of their SYNC pins.
6 Specifications
6.1 Absolute Maximum Ratings
See
(1) (2)
.
MIN
MAX
UNIT
VIN to GND
–0.3
105
V
VCC to GND
–0.3
16
V
CS to GND
–0.3
1
V
10
mA
7
V
150
°C
150
°C
COMP input current
All other inputs to GND
–0.3
Junction temperature
Storage temperature, Tstg
(1)
(2)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
(3)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (3)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
VIN voltage
MIN
MAX
UNIT
13
100
V
External voltage applied to VCC
8
15
V
Operating junction temperature
–40
125
°C
(1)
4
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.
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6.4 Thermal Information
LM5026
THERMAL METRIC (1)
NHQ (WSON)
PW (TSSOP)
16 PINS
16 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
29.9
98.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
25.8
27.6
°C/W
RθJB
Junction-to-board thermal resistance
9.2
44.1
°C/W
ψJT
Junction-to-top characterization parameter
0.2
1.2
°C/W
ψJB
Junction-to-board characterization parameter
9.5
43.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
2.3
—
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
Specification typical values are for TJ = 25°C unless otherwise noted. VIN = 48 V, VCC = 10 V, RT = 30.0 kΩ, Rset = 34.8 kΩ
unless otherwise stated. Minimum and maximum specifications apply over full operating junction temperature range. (1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
START-UP REGULATOR
TJ = 25°C
VCC Reg
VCC regulation
No Load
VCC current limit
See
Start-up regulator
leakage (external VCC
supply)
VIN = 100 V
over full operating junction
temperature range
7.6
7.3
TJ = 25°C
I-VIN
(2)
over full operating junction
temperature range
V
25
mA
20
TJ = 25°C
165
over full operating junction
temperature range
500
TJ = 25°C
Shutdown current (Iin) UVLO = 0 V
7.9
µA
350
over full operating junction
temperature range
450
µA
VCC SUPPLY
VCC Reg –
120 mV
VCC undervoltage
lockout voltage
(positive going Vcc)
TJ = 25°C
VCC undervoltage
hysteresis
TJ = 25°C
VCC supply current
(ICC)
Cgate = 0, UVLO = 1.3 V, over full operating junction
temperature range
over full operating junction temperature range
V
VCC Reg – 220
mV
1.5
over full operating junction temperature range
1
2
4.2
V
mA
REFERENCE SUPPLY
TJ = 25°C
VREF
Ref voltage
IREF = 0 mA
Ref voltage regulation
IREF = 0 to 10 mA
over full operating junction
temperature range
5
4.85
TJ = 25°C
Ref current limit
5.15
25
over full operating junction
temperature range
50
TJ = 25°C
20
over full operating junction temperature range
V
mV
mA
10
UVLO SHUTDOWN/STANDBY
Undervoltage
shutdown threshold
(1)
(2)
TJ = 25°C
0.4
over full operating junction temperature range
0.3
0.5
V
Minimum and maximum limits are 100% production tested at 25ºC. Limits over the operating temperature range are specified through
correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL). All
electrical characteristics having room temperature limits are tested during production with TA = TJ = 25°C. All hot and cold limits are
specified by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
Device thermal limitations may limit usable range.
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Electrical Characteristics (continued)
Specification typical values are for TJ = 25°C unless otherwise noted. VIN = 48 V, VCC = 10 V, RT = 30.0 kΩ, Rset = 34.8 kΩ
unless otherwise stated. Minimum and maximum specifications apply over full operating junction temperature range.(1)
PARAMETER
TEST CONDITIONS
MIN
Undervoltage
shutdown hysteresis
TYP
MAX
0.1
Undervoltage standby
threshold
TJ = 25°C
Undervoltage sandby
hysteresis current
source
TJ = 25°C
V
1.25
over full operating junction temperature range
1.21
UNIT
1.29
V
20
over full operating junction temperature range
16
24
µA
CURRENT LIMIT
Cycle-by-cycle
threshold voltage
ILIM delay-to-output
Leading edge
blanking time
CS sink impedance
(clocked)
TJ = 25°C
0.5
over full operating junction temperature range
0.45
CS step from 0 to 0.6 V Time to onset of OUT transition
(90%) Cgate=0
40
TJ = 25°C
70
TJ = 25°C
V
ns
100
over full operating junction temperature range
ICS = 10 mA
0.55
130
ns
30
over full operating junction
temperature range
65
Ω
OVERCURRENT RESTART
Restart threshold
Fault-charging current
Discharging current
TJ = 25°C
2.55
over full operating junction temperature range
2.4
TJ = 25°C
2.7
10
over full operating junction temperature range
7.5
TJ = 25°C
12.5
10
over full operating junction temperature range
7.5
12.5
V
µA
µA
SOFT-START
Soft-start current
source
Soft-stop current sink
Soft-start current
source following a
restart event
TJ = 25°C
50
over full operating junction temperature range
38
TJ = 25°C
58
50
over full operating junction temperature range
38
TJ = 25°C
58
µA
1
over full operating junction temperature range
0.6
1.3
OSCILLATOR
TJ = 25°C
Frequency1
RT = 30 kΩ
Frequency2
RT = 10 kΩ
over full operating junction
temperature range
200
180
TJ = 25°C
over full operating junction
temperature range
520
Can sync up to 5 like controllers minimum
Sync threshold
(falling)
Sync pulse width
minimum
over full operating junction temperature range
kHz
590
SYNC source current
SYNC sink
impedance
220
660
kHz
200
µA
100
Ω
1.4
V
15
ns
PWM COMPARATOR
6
Delay-to-output
CS stepped, time to onset of OUT_A transition low
Mimimum duty cycle
ICOMP = 1 mA, over full operating junction temperature range
Maximum duty cycle
limit 1
UVLO = 1.3 V, COMP = open, VDCL = 2.5 V
80%
Maximum duty cycle
limit 2
UVLO = 1.3 V, COMP = open, VDCL = VRT × 0.875
70%
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40
ns
0%
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Electrical Characteristics (continued)
Specification typical values are for TJ = 25°C unless otherwise noted. VIN = 48 V, VCC = 10 V, RT = 30.0 kΩ, Rset = 34.8 kΩ
unless otherwise stated. Minimum and maximum specifications apply over full operating junction temperature range.(1)
PARAMETER
Maximum duty cycle
limit 3
TEST CONDITIONS
MIN
UVLO = 2.92 V, COMP = open, VDCL = 2.5 V
Small signal impedance
Slope compensation
amplitude
Delta increase at PWM
comparator to CS
TJ = 25°C
over full operating junction
temperature range
MAX
UNIT
40%
SS to PWM offset
COMP input
impedance
TYP
1.4
V
1700
Ω
90
75
115
mV
OUTPUT SECTION
TJ = 25°C
5
OUT_A high
saturation
MOS Device at
IOUT = –10 mA,
OUTPUT_A peak
current sink
Bipolar Device at VCC/2
OUT_A low saturation
MOS Device at
IOUT = 10 mA,
OUTPUT_A rise time
Cgate = 2.2 nF
20
ns
OUTPUT_A fall time
Cgate = 2.2 nF
15
ns
OUT_B high
saturation
IOUT = –10 mA
over full operating junction
temperature range
10
3
TJ = 25°C
A
6
over full operating junction
temperature range
9
TJ = 25°C
Ω
10
over full operating junction
temperature range
20
TJ = 25°C
OUT_B low saturation IOUT = 10 mA
Ω
Ω
10
over full operating junction
temperature range
20
Ω
OUTPUT_B rise time
Cgate = 470 pF
15
ns
OUTPUT_B fall time
Cgate = 470 pF
15
ns
OUTPUT TIMING CONTROL
RSET = 34.8 kΩ connected
to GND, 50% to 50%
transitions
TJ = 25°C
Overlap time
RSET = 30 kΩ connected to
REF, 50% to 50%
transitions
TJ = 25°C
Deadtime
over full operating junction
temperature range
over full operating junction
temperature range
100
70
130
ns
100
70
130
ns
THERMAL SHUTDOWN
TSD
Thermal shutdown
temp.
150
Thermal shutdown
hysteresis
165
°C
25
°C
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6.6 Typical Characteristics
10
16
14
VIN
8
12
VCC (V)
VCC (V)
10
8
VCC
6
6
4
4
2
2
0
0
2
4
6
8
10
12
14
16
0
5
10
VIN (V)
20
25
30
Figure 2. VCC vs ICC
1.4
54
SOFT-START & STOP CURRENT (PA)
6
5
4
3
2
1
0
0
5
10
15
35
ICC (mA)
Figure 1. VCC Regulator Start-Up Characteristics, VCC vs VIN
VREF (V)
15
20
25
1.3
52
SOFT-STOP
1.2
50
SOFT-START
1.1
48
1.0
46
RESTART
44
0.9
42
0.8
40
-50 -25
RESTART CURRENT (PA)
0
0.7
0
25
50
75
100 125 150
TEMPERATURE (oC)
IREF (mA)
Figure 4. Soft-Start, Soft-Stop and Restart Current vs
Temperature
Figure 3. VREF vs IREF
OSCILLATOR FREQUENCY (kHz)
210
208
206
204
202
200
198
196
194
192
190
-50
0
50
100
150
TEMPERATURE (oC)
Figure 5. Oscillator Frequency vs RT
8
Figure 6. Oscillator Frequency vs Temperature
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Typical Characteristics (continued)
120
400
115
350
110
300
OVERLAP TIME (ns)
OVERLAP TIME (ns)
RSET to AGND
250
200
150
105
100
95
100
90
50
85
RSET = 34.8 k:
80
-50
0
0
20
40
80
60
100
120
-25
0
25
50
75
100 125 150
TEMPERATURE (oC)
RSET (k:)
Figure 7. Overlap Time vs RSET
Figure 8. Overlap Time vs Temperature
120
400
115
350
RSET to REF
110
DEAD TIME (ns)
DEADTIME (ns)
300
250
200
150
105
100
95
100
90
50
85
0
RSET = 30.0 k:
0
20
40
60
80
100
80
-50
120
RSET (k:)
0
25
50
75
100 125 150
o
TEMPERATURE ( C)
Figure 9. Deadtime vs RSET
Figure 10. Deadtime vs Temperature
100
100
90
90
DCL = 2.5V
UVLO = 1.26V
80
MAX DUTY CYCLE (%)
80
MAX DUTY CYCLE (%)
-25
70
60
50
40
30
70
60
50
40
30
20
20
10
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
UVLO (V)
DCL (V)
Figure 11. Max Duty Cycle vs UVLO
Figure 12. Max Duty Cycle vs DCL
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Typical Characteristics (continued)
800
-40°C
COMP CURRENT (PA)
700
25°C
85°C
600
125°C
500
400
300
-0.10
0.00
0.10
0.20
0.30
0.40 0.50
INVERTING INPUT TO PWM COMPARATOR (V)
Figure 13. COMP Current vs INV PWM Comparator Voltage
10
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7 Detailed Description
7.1 Overview
The LM5026 PWM controller contains all of the features necessary to implement power converters utilizing the
active clamp reset technique with current mode control. With the active clamp reset, higher efficiencies and
greater power densities can be realized compared to conventional catch winding or RDC clamp reset techniques.
The LM5026 provides two control outputs, the main power switch control (OUT_A) and the active clamp switch
control (OUT_B). The device can be configured to drive either a P-Channel or N-Channel clamp switch. The
main switch gate driver features a compound configuration consisting of both MOS and bipolar devices, which
provide superior gate drive characteristics. The LM5026 can be configured to operate with bias voltages over a
wide input range from 8 V to 100 V. Additional features include programmable maximum duty cycle, line
undervoltage lockout, cycle-by-cycle current limit, hiccup mode fault protection with adjustable delays, PWM
slope compensation, soft-start, a 1-MHz capable oscillator with synchronization input and output capability,
precision reference, and thermal shutdown.
7.2 Functional Block Diagram
7.6V BIAS
REGULATOR
VIN
VCC
VCC
UVLO
STANDBY
REF
5V
REFERENCE
UVLO
1.25V
LOGIC
HYSTERESIS (20 PA)
SHUTDOWN
VCC
THERMAL
LIMIT
0.4V/0.3V
OUT_A
DRIVER
RT
CLK
OSCILLATOR
AND
DUTY CYCLE
LIMITER
SYNC
DEADTIME
OR
OVERLAP
CONTROL
DCL
S
SLOPE COMP
RAMP
5V
Q
TIME
VCC
R
45 PA
0
5k
OUT_B
DRIVER
COMP
2R
1.4V
R
PGND
PWM
1:1
AGND
SS
CURRENT
LIMIT
2k
CS
5V
CURRENT
LIMITING
(10 PA)
0.5V
OUT_A + LEB
CURRENT LIMIT
RESTART
TIMER
&
SS CONTROL
5V
5V
SS
RESTART
DELAY
(1 PA)
SOFT-START
(50 PA)
SS
RES
NOT
CURRENT
LIMITING
(10 PA)
SOFT-STOP
(50 PA)
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7.3 Feature Description
7.3.1 High Voltage Start-Up Regulator
The LM5026 contains an internal high voltage start-up regulator that allows the input pin (VIN) to be connected
directly to a nominal 48-V DC line voltage. The regulator output (VCC) is internally current limited to 20 mA.
When power is applied and the UVLO pin potential is greater than 0.4 V, the regulator is enabled and sources
current into an external capacitor connected to the VCC pin. The recommended capacitance range for the VCC
regulator is 0.1 µF to 100 µF. The VCC regulator provides power to the internal voltage reference, PWM
controller and gate drivers. The controller outputs are enabled when the voltage on the VCC pin reaches the
regulation point of 7.6 V, the internal voltage reference (REF) reaches its regulation point of 5 V and the UVLO
voltage is greater than 1.25 V. In typical applications, an auxiliary transformer winding is connected through a
diode to the VCC pin. This winding must raise the VCC voltage above 8 V to shut off the internal start-up
regulator. Powering VCC from an auxiliary winding improves efficiency while reducing the controller’s power
dissipation.
The external VCC capacitor must be sized such that the current delivered from the capacitor and the VCC
regulator will maintain a VCC voltage greater than 6.2 V during the initial start-up. During a fault mode when the
converter auxiliary winding is inactive, external current draw on the VCC line should be limited such that the
power dissipated in the start-up regulator does not exceed the maximum power dissipation of the IC package. An
external start-up or bias regulator can be used to power the LM5026 instead of the internal start-up regulator by
connecting the VCC and the VIN pins together and connecting an external bias supply to these two pins.
7.3.2 Line Undervoltage Detector
The LM5026 contains a dual level undervoltage lockout (UVLO) circuit. When the UVLO pin voltage is below 0.4
V, the controller is in a low current shutdown mode. When the UVLO pin voltage is greater than 0.4 V but less
than 1.25 V, the controller is in standby mode. In standby mode the VCC and REF bias regulators are active
while the controller outputs are disabled. When the VCC and REF outputs exceed the VCC and REF
undervoltage thresholds and the UVLO pin voltage is greater than 1.25 V, the outputs are enabled and normal
operation begins. An external set-point voltage divider from VIN to GND can be used to set the operational range
of the converter. The divider must be designed such that the voltage at the UVLO pin will be greater than 1.25 V
when VIN is in the desired operating range. UVLO hysteresis is accomplished with an internal 20-µA current
source that is switched on or off into the impedance of the set-point divider. When the UVLO threshold is
exceeded, the current source is activated to instantly raise the voltage at the UVLO pin. When the UVLO pin
voltage falls below the 1.25-V threshold, the current source is turned off causing the voltage at the UVLO pin to
fall. The hysteresis of the 0.4-V shutdown comparator is fixed at 100 mV.
The UVLO pin can also be used to implement various remote enable and disable functions. Pulling the UVLO pin
below the 0.4-V threshold totally disables the controller. Pulling the UVLO pin to a potential between 1.25 and 0.4
V places the controller in standby with the VCC and REF regulators operating. Turning off a converter by forcing
the UVLO pin to the standby condition provides a controlled soft-stop. The controller outputs are not directly
disabled in standby mode, rather the soft-start capacitor is discharged with a 50-µA sink current. Discharging the
soft-start capacitor gradually reduces the PWM duty cycle to zero, providing a slow controlled discharge of the
power converter output filter. This controlled discharge can help prevent uncontrolled behavior of self-driven
synchronous rectifiers during turnoff.
7.3.3 PWM Outputs
The relative phase of the main switch gate driver OUT_A and active clamp gate driver OUT_B can be configured
for multiple applications. For active clamp configurations utilizing a ground referenced P-Channel clamp switch,
the two outputs should be in phase, with the active clamp output overlapping the main output. For active clamp
configurations utilizing a high-side N-Channel switch, the active clamp output should be out of phase with main
output and there should be a dead time between the two gate drive pulses. A distinguishing feature of the
LM5026 is the ability to accurately configure either deadtime (both off) or overlap time (both on) of the gate driver
outputs. The overlap / deadtime magnitude is controlled by the resistor value (RSET) connected to the TIME pin
of the controller. The opposite end of the resistor can be connected to either REF for deadtime control or to
AGND for overlap control. The internal configuration detector senses the direction of current flow in the TIME pin
resistor and configures the phase relationship of the main and active clamp outputs.
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Feature Description (continued)
OUT_A
K1 * RSET
P-Channel Active Clamp
(RSET to GND)
K1 * RSET
OUT_B
OUT_A
N-Channel Active Clamp
(RSET to REF)
K2 * RSET
K2 * RSET
OUT_B
Figure 14. PWM Output Phasing / Timing
The rising edge overlap or deadtime and the falling edge overlap or deadtime are identical and are independent
of operating frequency or duty cycle. The magnitude of the overlap/deadtime can be calculated in Equation 1 and
Equation 2:
Overlap Time = 2.8 × RSET + 2
where
•
•
RSET in kΩ
overlap is in ns
(1)
.
Deadtime = 2.9 × RSET + 14
where
•
•
RSET in kΩ
deadtime is in ns
(2)
7.3.4 Gate Driver Outputs
The LM5026 provides two-gate driver outputs, the main power switch control (OUT_A) and the active clamp
switch control (OUT_B). The main gate driver features a compound configuration, consisting of both MOS and
bipolar devices, which provide superior gate drive characteristics. The bipolar device provides most of the drive
current capability and sinks a relatively constant current, which is ideal for driving large-power MOSFETs. As the
switching event nears conclusion and the bipolar device saturates, the internal MOS device provides a low
impedance to compete the switching event.
During turnoff at the Miller plateau region, typically between 2 V to 4 V, the voltage differential between the
output and PGND is small and the current source characteristic of the bipolar device is beneficial to reduce the
transition time. During turnon, the resistive characteristics of a purely MOS gate driver is adequate since the
supply to output voltage differential is fairly large in the Miller region.
LM5026
VCC
PWM
OUT_A
PGND
Figure 15. Compound Gate Driver
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Feature Description (continued)
7.3.5 PWM Comparator/Slope Compensation
The PWM comparator modulates the pulse width of the controller output by comparing the current sense ramp
signal to the loop error signal. This comparator is optimized for speed in order to achieve minimum controllable
duty cycles. The loop error signal is input into the controller in the form of a control current into the COMP pin.
The COMP pin control current is internally mirrored by a matched pair of NPN transistors which sink current
through a 5-kΩ resistor connected to the 5-V reference. The resulting error signal passes through a 1.4-V level
shift and a gain reducing 3:1 resistor divider before being applied to the pulse width modulator.
The optocoupler detector can be connected between the REF pin and the COMP pin. Because the COMP pin is
controlled by a current input, the potential difference across the optocoupler detector is nearly constant. The
bandwidth limiting phase delay which is normally introduced by the significant capacitance of the optocoupler is
greatly reduced. Greater system loop bandwidth can be realized, since the bandwidth-limiting pole associated
with the optocoupler is now at a much higher frequency. The PWM comparator polarity is configured such that
with no current into the COMP pin, the controller produces the maximum duty cycle at the main gate driver
output.
REF
CURRENT SENSE RAMP
5V
+
5k
_
1.4V
COMP
PWM
COMPARATOR
2R
LM431
FB
Potential across Optocoupler detector is
constant
R
1:1
SOFT-START
LM5026
Figure 16. Optocoupler to LM5026 COMP Interface
For duty cycles greater than 50 percent, current mode control circuits are subject to sub-harmonic oscillation. By
adding an additional fixed slope voltage ramp signal (slope compensation) to the current sense signal, this
oscillation can be avoided. The LM5026 integrates this slope compensation by summing a current ramp
generated by the oscillator with the current sense signal. The PWM comparator ramp signal is a combination of
the current waveform at the CS pin, and an internally generated slope compensation ramp derived from the
oscillator. The internal ramp has an amplitude of 0 to 45 µA which is sourced into an internal 2-kΩ resistor, plus
the external impedance at the CS pin. Additional slope compensation may be added by increasing the source
impedance of the current sense signal.
7.3.6 Maximum Duty Cycle Clamp
Controlling the maximum duty cycle of an active clamp reset PWM controller is necessary to limit the voltage
stress on the main and active clamp MOSFETs. The relationship between the maximum drain-source voltage of
the MOSFETs and the maximum PWM duty cycle is provided by Equation 3:
VIN
Vds(max) =
1 - D(max)
(3)
The main output (OUT_A) duty cycle is normally controlled by the control current sourced into the COMP pin
from the external feedback circuit. When the feedback demands maximum output from the converter, the duty
cycle will be limited by one of two circuits within the LM5026: the user programmable duty cycle clamp and the
voltage-dependent duty cycle limiter, which varies inversely with the input line voltage.
Programmable Duty Cycle Clamp – The maximum allowed duty cycle can be programmed by setting a voltage at
the DCL pin to a value less than 2 V. The recommended method to set the DCL pin voltage is with a resistor
divider connected from the RT pin to AGND. The voltage at the RT pin is internally regulated to 2 V, while the
current sourced from the RT pin sets the oscillator frequency. The maximum duty can be programmed, according
to Equation 4:
RT 2
Programmable Duty Cycle Clamp = 80% ´
(4)
RT 1 + RT 2
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Feature Description (continued)
RT
OSCILLATOR
FREQUENCY
INVERSELY
PROPORTIONAL
TO: RT1 + RT2
RT1
DCL
MAX DUTY CYCLE
CLAMP SET TO:
80% x
RT2
RT1 + RT2
RT2
LM5026
AGND
Figure 17. Programming Oscillator Frequency and Maximum Duty Cycle Clamp
Line Voltage Duty Cycle Limiter - The maximum duty cycle for the main output driver is also limited by the
voltage at the UVLO pin, which is normally proportional to VIN. The controller outputs are disabled until the
UVLO pin voltage exceeds 1.25 V. At the minimum operating voltage (when UVLO = 1.25 V) the maximum duty
cycle starts at the duty cycle clamp level programmed by the DCL pin voltage (80% or less). As the line voltage
increases, the maximum duty cycle decreases linearly with increasing UVLO voltage, as shown in Figure 18.
Ultimately the duty cycle of the main output is controlled to the least of the following three variables: the duty
cycle controlled by the PWM comparator, the programmable maximum duty cycle clamp, or the line voltage
dependent duty cycle limiter.
MAXIMUM DUTY CYCLE (%)
100
Programmable
Duty Cycle Clamp
80
Line Voltage
Duty Cycle Limiter
60
40
20
1.25V
0
0
1.0
2.0
3.0
4.0
5.0
UVLO PIN VOLTAGE (V)
Figure 18. Maximum Duty Cycle vs UVLO Voltage
7.3.7 Soft-Start / Soft-Stop
The soft-start circuit allows the regulator to gradually reach a steady-state operating point, thereby reducing startup stresses and current surges. Upon turnon, the SS pin capacitor is discharged by an internal switch. When the
UVLO, VCC and REF pins reach their operating thresholds, the SS capacitor is released and charged with a 50µA current source. The PWM comparator control voltage is clamped to the SS pin voltage. When the PWM input
reaches 1.4 V, output pulses commence with slowly increasing duty cycle. The voltage at the SS pin eventually
increases to 5 V, while the voltage at the PWM comparator increases to the value required for regulation
determined by the voltage feedback loop.
If the UVLO pin voltage falls below the 1.25-V standby threshold but above the 0.4-V shutdown threshold, the 50µA SS pin source current is disabled and a 50-µA sink current discharges the soft-start capacitor. As the SS
voltage falls and clamps the PWM comparator input, the PWM duty cycle will gradually fall to zero. This soft-stop
feature produces a gradual reduction of the power converter output voltage. This gradual discharge of the output
filter prevents oscillations in the self-driven synchronous rectifiers on the secondary side of the converter during
turnoff.
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Feature Description (continued)
7.3.8 Current Sense and Current Limit
The CS input provides a control ramp for the pulse width modulator and current limit detection for overload
protection. If the sensed voltage at the CS comparator exceeds 0.5 V, the present cycle is terminated (cycle-bycycle current limit mode).
A small RC filter, located near the controller, is recommended for the CS input pin. An internal FET connected to
the CS input discharges the current sense filter capacitor at the conclusion of every cycle to improve dynamic
performance. This same FET remains on for an additional 100 nS at the start of each main switch cycle to
attenuate the leading edge spike in the current sense signal.
The CS comparator is very fast and may respond to short duration noise pulses. Layout considerations are
critical for the current sense filter and sense resistor. The capacitor associated with the CS filter must be placed
very close to the device and connected directly to the pins of the LM5026 (CS and AGND pins). If a current
sense transformer is used, both leads of the transformer secondary should be routed to the filter network, which
should be located close to the IC. If a sense resistor located in the source of the main switch MOSFET is used
for current sensing, a low inductance type of resistor is required. When designing with a current sense resistor,
all of the noise-sensitive, low-power ground connections should be connected together near the AGND pin and a
single connection should be made to the power ground (sense resistor ground point).
7.3.9 Overload Protection Timer
The LM5026 provides a current limit restart timer to disable the outputs and force a delayed restart (hiccup
mode) if a current limit condition is repeatedly sensed. The number of cycle-by-cycle current limit events required
to trigger the restart is programmable by means of an external capacitor at the RES pin. During each PWM cycle
the LM5026 either sources or sinks current from the RES pin capacitor. If no current limit is detected during a
cycle, a 10-µA discharge current sink is enabled to hold the RES pin at ground. If a current limit is detected, the
10-µA sink current is disabled and a 10-µA current source causes the voltage at RES pin to gradually increase.
In the event of an extended overload condition, the LM5026 protects the converter with cycle-by-cycle current
limiting while the voltage at RES pin increases. If the RES voltage reaches the 2.5-V threshold, the following
restart sequence occurs (see Figure 19):
• The RES capacitor and SS capacitors are fully discharged.
• The soft-start current source is reduced from 50 µA to 1 µA
• The SS capacitor voltage slowly increases. When the SS voltage reaches 1.4 V, the PWM comparator will
produce the first output pulse. After the first pulse occurs, the SS source current reverts to the normal 50 µA
level. The SS voltage increases at its normal rate gradually increasing the duty cycle of the output drivers
• If the overload condition persists after restart, cycle-by-cycle current limiting will cause the voltage on the RES
capacitor to increase again, repeating the hiccup mode sequence.
• If the overload condition no longer exists after restart, the RES pin will be held at ground by the 10-µA current
sink and normal operation resumes.
The overload timer function is very versatile and can be configured for the following modes of protection:
1. Cycle-by-cycle only: The hiccup mode can be completely disabled by connecting the RES pin to AGND. In
this configuration, the cycle-by-cycle protection will limit the output current indefinitely and no hiccup
sequences will occur.
2. Hiccup only: The timer can be configured for immediate activation of a hiccup sequence upon detection of
an overload by leaving the RES pin open circuit.
3. Delayed Hiccup: The most common configuration as previously described, is a programmed interval of
cycle-by-cycle limiting before initiating a hiccup mode restart. The advantage of this configuration is shortterm overload conditions will not cause a hiccup mode restart, however during extended overload conditions
the average dissipation of the power converter will be very low.
4. Externally Controlled Hiccup: The RES pin can also be used as an input. By externally driving the pin to a
level greater than the 2.5-V hiccup threshold, the controller will be forced into the delayed restart sequence.
If the RES pin is used as an input, the driving source should be current limited to less than 5 mA. For
example, the external trigger for a delayed restart sequence could come an overtemperature protection
circuit.
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Feature Description (continued)
2.5V
Current Limit
Detected
RES
0V
5.0V
50 PA
SS
1 PA
# 1.4V
OUTA
t1
t2
t3
Figure 19. Hiccup Overload Restart Timing
7.3.10 Oscillator and Sync Capability
The LM5026 oscillator frequency is set by the external resistance connected between the RT pin and ground
(AGND). To set a desired oscillator frequency (F) the necessary value of total RT resistance can be calculated
from Equation 5:
1
RT =
F ´ 167 ´ 10-12
(5)
The RT resistor(s) should be located very close to the device and connected directly to the pins of the IC (RT and
AGND).
The SYNC pin can be used to synchronize the internal oscillator to an external clock. An open drain output is the
recommended interface between the external clock to the LM5026 SYNC pin as illustrated in Figure 20. The
clock pulse width must be greater than 15 ns. The external clock frequency must be a higher than the free
running frequency set by the RT resistance.
LM5026
SYNC
AGND
Figure 20. Sync from External Clock
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Feature Description (continued)
LM5026
SYNC
LM5026
SYNC
UP TO 5 TOTAL
DEVICES
Figure 21. Sync from Multiple Devices
Multiple LM5026 devices can be synchronized together simply by connecting the devices SYNC pins together as
shown in Figure 21. Take care to ensure the ground potential differences between devices are minimized. In this
configuration all of the devices will be synchronized to the highest frequency device. The internal block diagram
of the oscillator and synchronization circuit is shown in Figure 22. The SYNC I/O pin is a CMOS buffer with
pullup current limited to 200 µA. If an external device forces the SYNC pin low before the internal oscillator ramp
completes its charging cycle, the ramp will be reset and another cycle begins. If the SYNC pins of multiple
LM5026 devices are connected together, the first SYNC pin that pulls low will reset the oscillator RAMP of all
other devices. All controllers will operate in phase when synchronized using the SYNC I/O feature. Up to five
LM5026 devices can be synchronized using this technique.
SYNC
200P
I = f (RT)
2V
Q
S
Q
R
CLK
DEADTIME
ONE-SHOT
Figure 22. Oscillator Sync I/O Block Diagram
7.3.11 Thermal Protection
Internal Thermal Shutdown circuitry is provided to protect the integrated circuit in the event the maximum junction
temperature is exceeded. When activated, typically at 165°C, the controller is forced into a low power standby
state with the output drivers and the bias regulator disabled. The device will restart after the thermal hysteresis
(typically 25°C). During thermal shutdown, the soft-start capacitor is fully discharged and the controller follows a
normal start-up sequence after the junction temperature falls to the operating level.
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7.4 Device Functional Modes
The LM5026 has five functional modes. Figure 23 shows the mode transition diagram.
• UVLO mode
• Soft-start mode
• Normal operation mode
• Hiccup mode
• Thermal shutdown mode
UVLO
Soft Start
Hiccup
Normal Operation
Thermal Shut Down
Figure 23. Mode Transition Diagram
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Line Input (VIN)
The LM5026 contains an internal high voltage start-up regulator that allows the input pin (VIN) to be connected
directly to a nominal 48-V line voltage. The voltage applied to the VIN pin can vary in the range of 13 to 100 V
with transient capability to 105 V. When power is applied and the UVLO pin potential is greater than 0.4 V, the
VCC regulator is enabled and sources current into an external capacitor connected to the VCC pin. When the
voltage on the VCC pin reaches the regulation point of 7.7 V, the internal voltage reference (REF) is enabled.
The reference regulation set-point is 5 V. The controller outputs are enabled when the UVLO pin potential is
greater than 1.25 V. In typical applications, an auxiliary transformer winding is connected through a diode to the
VCC pin. This winding must raise the VCC voltage above 8 V to shut off the internal start-up regulator. TI
recommends a filtering circuit shown in Figure 24 be used to suppress transients, which may occur at the input
supply, in particular when VIN is operated close to the maximum operating rating.
VPWR
50
VIN
0.1 PF
LM5026
Figure 24. Input Transient Protection
8.1.2 For Application > 100 V
For applications where the system input voltage exceed 100 V or IC power dissipation is a concern, the LM5026
can be powered from an external start-up regulator as shown in Figure 25. In this configuration, the VIN and the
VCC pins should be connected together, which allows the LM5026 to be operated below 13 V. The voltage at the
VCC pin must be greater than 8 V yet not exceed 15 V. An auxiliary winding can be used to reduce the
dissipation in the external regulator once the power converter is active.
VPWR
9V
0.1
VIN
8V - 15V (from
aux winding)
VCC
C1
LM5026
Figure 25. Start-Up Regulator for VPWR >100 V
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Application Information (continued)
8.1.3 Undervoltage Lockout (UVLO)
When the UVLO pin voltage is below 0.4 V, the controller is in a low current shutdown mode. When the UVLO
pin voltage is greater than 0.4 V but less than 1.25 V, the controller is in standby mode. When the UVLO pin
voltage is greater than 1.25 V, the controller is fully enabled. Typically, two external resistors program the
minimum operational voltage for the power converter as shown in Figure 26. When UVLO pin voltage is above
the 1.25-V threshold, an internal 20-μA current source is enabled to raise the voltage at the UVLO pin, thus
providing threshold hysteresis. Resistance values for R1 and R2 can be determined from Equation 6 and
Equation 7:
V
R1 = HYS
20 mA
where
•
VHYS is the desired UVLO hysteresis at VPWR
(6)
.
1.25 ´ R1
VPWR - 1.25
R2 =
where
•
VPWR is the desired turnon voltage
(7)
For example, if the LM5026 is to be enabled when VPWR reaches 33 V, and disabled when VPWR is decreased to
30 V, R1 calculates to 150 kΩ, and R2 calculates to 5.9 kΩ. The voltage at the UVLO pin should not exceed 6 V
at any time. Be sure to check both the power and voltage rating for the selected R1 resistor.
Remote configuration of the controller’s operational modes can be accomplished with open drain device(s)
connected to the UVLO pin as shown in Figure 27.
VPWR
LM5026
20 PA
R1
UVLO
Enable Output
Drivers
Enable VCC & VREF
Regulators
1.25V
R2
0.4V
Figure 26. Basic UVLO Configuration
VPWR
LM5026
20 PA
R1
UVLO
Enable
1.25V
OFF
R2
STANDBY
Standby
0.4V
Figure 27. Remote Standby and Disable Control
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Application Information (continued)
8.1.4 Oscillator (RT, SYNC)
Oscillator (RT, SYNC) The oscillator frequency is generally selected in conjunction with the design of the system
magnetic components along with the volume and efficiency goals for a given power converter design. The total
RT resistance at the RT pin sets the oscillator frequency. The RT resistors should be one of the first components
placed and connected when designing the PCB. Direct, short connections to each side of the RT resistors (RT,
DCL and AGND pins) are recommended .
The SYNC pin can be used to synchronize the internal oscillator to an external clock. An open-drain output is the
recommended interface from the external clock to the SYNC pin. The clock pulse width should be greater than
15 ns. The external clock must be a higher frequency than the free-running frequency set by the RT resistor.
Multiple LM5026 devices can be synchronized together simply by connecting the devices SYNC pins together.
Take care to ensure the ground potential differences between devices are minimized. In this configuration all of
the devices will be synchronized to the highest frequency device.
8.1.5 Voltage Feedback (COMP)
The COMP pin is designed to accept the voltage loop feedback error signal from the regulated output through an
error amplifier and (typically) an optocoupler. In a typical configuration, VOUT is compared to a precision
reference voltage by the error amplifier. The output of the amplifier drives the optocoupler, which in turn drives
the COMP pin. The parasitic capacitance of the optocoupler often limits the achievable loop bandwidth for a
given power converter. The optocoupler LED and detector junction capacitance produce a low-frequency pole in
the voltage regulation loop. The LM5026 current controlled optocoupler interface (COMP) previously described,
greatly increases the pole frequency associated with the optocoupler.
8.1.6 Current Sense (CS)
The CS pin receives an input signal representative of the transformer primary current, either from a current sense
transformer (Figure 28) or from a resistor in series with the source of the primary switch (Figure 29). In both
cases the sensed current creates a ramping voltage across R1, while the RF/CF filter suppresses noise and
transients. R1, RF and CF should be as physically close to the LM5026 as possible, and the ground connection
from the current sense transformer, or R1, should be a dedicated track to the AGND pin. The current-sense
components must provide > 0.5 V at the CS pin when an overcurrent condition exists.
Current
Sense
Power
Transformer
VPWR
VIN
RF
CS
LM5026
CF
R1
AGND
Q1
OUTA
Q2
OUTB
Figure 28. Current Sense Using a Current-Sense Transformer
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Application Information (continued)
Power
Transformer
VPWR
VIN
Q1
LM5026
Q2
OUTA
RF
CS
CF
R1
AGND
OUTB
Figure 29. Current Sense Using a Source-Sense Resistor (R1)
8.1.7 Hiccup Mode Current Limit Restart (RES)
The basic operation of the hiccup mode current limit restart is described in the functional description. The delay
time to restart is programmed with the selection of the RES pin capacitor CRES as shown in Figure 19. In the
case of continuous cycle-by-cycle current limit detection at the CS pin, the time required for CRES to reach the
2.5-V hiccup mode threshold is calculated by Equation 8 :
C
´ 2.5
t1 = RES
= 2.5 ´ 105 ´ CRES
10mA
(8)
For example, if CRES = 0.01 µF, the time t1 is approximately 2.5 ms.
The cool down time, t2 is set by the soft-start capacitor (CSS) and the internal 1-µA SS current source, and is
equal to Equation 9:
C ´ 1.4V
t 2 = SS
= 1.4 ´ 106 ´ CSS
1 mA
(9)
If CSS = 0.01 µF, t2 is approximately 14 ms.
The soft-start time t3 is set by the internal 50-µA current source, and is equal to Equation 10:
C ´ 3.5V
t 3 = SS
= 7 ´ 104 ´ CSS
50 mA
(10)
The time t2 provides a periodic cool-down time for the power converter in the event of a sustained overload or
short circuit. This results in lower average input current and lower power dissipated within the power
components. It is recommended that the ratio of t2/(t1 + t3) be in the range of 5 to 10 to make good use of this
feature. If the application requires no delay from the first detection of a current limit condition to the onset of the
hiccup mode (t1 = 0), the RES pin can be left open (no external capacitor). If it is desired to disable the hiccup
mode current limit operation, the RES pin should be connected to ground (AGND).
8.1.8 Soft-Start (SS)
An internal current source and an external soft-start capacitor determines the time required for the output duty
cycle to increase from zero to its final value for regulation. The minimum acceptable time is dependent on the
output capacitance and the response of the feedback loop. If the soft-start time is too quick, the output could
overshoot its intended voltage before the feedback loop can regulate the PWM controller. After power is applied
and the controller is fully enabled, the voltage at the SS pin ramps up as CSS is charged by an internal 50-µA
current source. The voltage at the output of the COMP pin current mirror is clamped to the same potential as the
SS pin by a voltage buffer with a sink-only output stage. When the SS voltage reaches approximately 1.4 V,
PWM pulses appear at the driver output with very low duty cycle. The PWM duty cycle gradually increases as the
voltage at the SS pin charges to approximately 5.0 V.
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Application Information (continued)
8.1.9 Voltage-Dependent Maximum Duty Cycle
As the input source VPWR increases the voltage at the UVLO pin increases proportionately. To limit the Volt ×
Seconds applied to the transformer, the maximum allowed PWM duty cycle decreases as the UVLO voltage
increases. If it is desired to increase the slope of the voltage limited duty cycle characteristic, two possible
configurations are shown in Figure 30. After the LM5026 is enabled, the zener diode causes the UVLO pin
voltage to increase more rapidly with increasing input voltage (VPWR). The voltage dependent maximum duty
cycle clamp varies with the UVLO pin voltage according to Equation 11:
Voltage-Dependent Duty Cycle (%) = 107 - 21.8 X UVLO
(11)
VPWR
R1A
LM5026
20 PA
R1B
UVLO
Z1
1.25V
R2
Max. Duty
Cycle Limiter
VPWR
Z1
LM5026
20 PA
R1
UVLO
1.25V
R2
Max. Duty
Cycle Limiter
Figure 30. Altering the Slope of Duty Cycle vs VPWR
8.1.9.1 Programmable Maximum Duty Cycle Clamp (DCL)
When the UVLO pin is biased at 1.25 V (minimum operating level), the maximum duty cycle of OUT_A is limited
by the duty cycle of the internal clock signal. The duty cycle of the internal clock can be adjusted by
programming a voltage set at the DCL pin. The default maximum duty cycle (80%) can be selected by
connecting the DCL pin to the RT pin. The DCL pin should not be left open. A small decoupling capacitor located
close to the DCL pin is recommended.
The oscillator frequency set resistance (RT) must be determined first before programming the maximum duty
cycle. Following the selection of the total RT resistance, the ratio of the RT resistors can be designed to set the
desired maximum duty cycle. As the UVLO pin voltage increases from 1.25 V, the maximum duty cycle is
reduced by the voltage dependent duty cycle limiter previously as described and shown in Figure 18.
24
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8.2 Typical Application
The following schematic shows an example of an LM5026 controlled 100-W active clamp forward power
converter. The input voltage range (VPWR) is 36 V to 78 V, and the output voltage is 3.3 V. The output current
capability is 30 Amps. Current sense transformer T2 provides information to the CS pin for current mode control
and current limit protection. The error amplifiers and reference U3 and U4 provide voltage feedback through
optocoupler U2. Synchronous rectifiers Q3-Q6 minimize rectification losses in the secondary. An auxiliary
winding on inductor L2 provides power to the LM5026 VCC pin when the output is in regulation. The input
voltage UVLO levels are approximately 34 V for increasing VPWR, and ≈32 V for decreasing VPWR. The circuit can
be shut down by forcing the ON/OFF input (J2) below 1.25 V. An external synchronizing frequency can be
applied to the SYNC input (J11) or like converters can be self-synchronized by connections of (J3). The regulator
output is current limited at approximately 32 A.
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Figure 31. Application Circuit: Input 36 V to 78 V, Output 3.3 V, 30 A
26
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8.2.1 Design Requirements
The design requirements of this application are as follows:
• Input range: 36 V to 78 V
• Output voltage: 3.3 V
• Output current: 0 to 30 A
• Measured efficiency: 90% at 30 A, 92.5% at 15 A
• Frequency of operation: 230 kHz
• Board size: 2.3 × 2.4 × 0.5 inches
• Load Regulation: 1%
• Line Regulation: 0.1%
• Line UVLO, Hiccup Current Limit
8.2.2 Detailed Design Procedure
8.2.2.1 Determine VIN Configuration
First, determine the input voltage range of the application. If the maximum input voltage is less than 100 V, use
VIN pin connection in Figure 24. If the maximum input voltage exceeds 100 V, use the configuration shown in
Figure 25.
8.2.2.2 Determine UVLO Configuration
As described in Undervoltage Lockout (UVLO), two external resistors program the minimum operational voltage
for the power converter. Use Equation 6 and Equation 7 to calculate the resistor values. If remote standby and
disable control is needed, use the configuration in Figure 27.
8.2.2.3 Configure Operating Frequency
If internal oscillator is used, use Equation 5 to determine the RT resistor value. If external clock is used, use the
configuration in Figure 20.
8.2.2.4 Configure Hiccup Mode and Soft Start
The delay time to restart is programmed with the selection of the RES pin capacitor. Soft-start time is
programmed by the capacitor on SS pin. Refer to Hiccup Mode Current Limit Restart (RES) and Equation 8,
Equation 9, and Equation 10 to determine the capacitor values.
8.2.2.5 Determine Deadtime and Maximum Duty Cycle
The PWM output phasing the timing is shown in Figure 14. Use Equation 1 and Equation 2 to determine the
deadtime programming resistor value. Maximum duty cycle clamp is determined by DCL pin voltage. Use
Equation 4 and Figure 17 to determine RT1 and RT2 values.
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8.2.3 Application Curves
1
Input Voltage = 48VDC
Output Current = 5 A to 25 A
Trace 1: Output Voltage V/div = 0.5 V
Trace 2: Output Current, A/div = 5 V
Horizontal Resolution = 1 ms/div
Input Voltage = 48VDC
Output Current = 5 A
Trace 1: Output Voltage V/div = 1 V
Horizontal Resolution = 1 ms/div
Figure 32. Output Voltage
Figure 33. Transient Response
1
1
Input Voltage = 48VDC
Output Current = 30 A
Bandwidth Limit = 25 MHz
Trace 1: Output Voltage V/div = 50 mV
Horizontal Resolution = 2 µs/div
Input Voltage = 38VDC
Output Current = 25 A
Trace 1: Q1 Drain Voltage V/div = 20 V
Horizontal Resolution = 1 µs/div
Figure 34. Typical Output Ripple
Figure 35. Drain Voltage of Q1
1
2
1
Input Voltage = 78VDC
Output Current = 25 A
Trace 1: Q1 Drain Voltage V/div = 20 V
Horizontal Resolution = 1 µs/div
Input Voltage = 48VDC
Output Current = 5 A
Synchronous Rectifier, Q3 Gate V/div = 5 V Trance 1
Synchronous Rectifier, Q3 Gate V/div = 5 V Trance 2
Synchronous Rectifier, Q5 Gate V/div = 5 V
Horizontal Resolution = 1 µs/div
Figure 37. Gate Voltages
Figure 36. Drain Voltage of Q1
28
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9 Power Supply Recommendations
VCC pin is the power supply for the device. There should be a 0.1-µF to 100-μF capacitor directly from VCC to
ground. REF pin should be bypassed to ground as close as possible to the device using a 0.1-μF capacitor.
10 Layout
10.1 Layout Guidelines
The LM5026 current-sense and PWM comparators are very fast, and respond to short duration noise pulses. The
components at the CS, COMP, SS, DCL, UVLO, TIME, SYNC and the RT pins should be as physically close as
possible to the IC, thereby minimizing noise pick-up on the PCB tracks.
Layout considerations are critical for the current-sense filter. If a current-sense transformer is used, both leads of
the transformer secondary should be routed to the sense filter components and to the IC pins. The ground side
of each transformer should be connected through a dedicated PCB track to the AGND pin, rather than through
the ground plane.
If the current-sense circuit employs a sense resistor in the drive transistor source, low inductance resistor should
be used. In this case, all the noise-sensitive, low-current ground tracks should be connected in common near the
IC, and then a single connection made to the power ground (sense resistor ground point). The gate drive outputs
of the LM5026 should have short direct paths to the power MOSFETs in order to minimize inductance in the PCB
traces.
The two ground pins (AGND, PGND) must be connected together with a short direct connection to avoid jitter
due to relative ground bounce.
If the internal dissipation of the LM5026 produces high junction temperatures during normal operation, the use of
multiple vias under the IC to a ground place can help conduct heat away from the IC. Judicious positioning of the
PCB within the end product, along with use of any available air flow (forced or natural convection) can help
reduce the junction temperatures.
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10.2 Layout Example
REF decoupling
capacitor
Connect the exposed
thermal pad to the
system ground plane
VCC decoupling
capacitor
Short AGND and PGND
together as close as
possible to the pins
Figure 38. Layout Example
30
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11 Device and Documentation Support
11.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
14-Aug-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM5026MT
NRND
TSSOP
PW
16
92
TBD
Call TI
Call TI
-40 to 125
LM5026
MT
LM5026MT/NOPB
ACTIVE
TSSOP
PW
16
92
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
LM5026
MT
LM5026MTX/NOPB
ACTIVE
TSSOP
PW
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
LM5026
MT
LM5026SD/NOPB
ACTIVE
WSON
NHQ
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
5026SD
LM5026SDX/NOPB
ACTIVE
WSON
NHQ
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
5026SD
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
14-Aug-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Nov-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM5026MTX/NOPB
TSSOP
PW
16
2500
330.0
12.4
6.95
5.6
1.6
8.0
12.0
Q1
LM5026SD/NOPB
WSON
NHQ
16
1000
178.0
12.4
5.3
5.3
1.3
8.0
12.0
Q1
LM5026SDX/NOPB
WSON
NHQ
16
4500
330.0
12.4
5.3
5.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Nov-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM5026MTX/NOPB
LM5026SD/NOPB
TSSOP
PW
16
2500
367.0
367.0
35.0
WSON
NHQ
16
1000
210.0
185.0
35.0
LM5026SDX/NOPB
WSON
NHQ
16
4500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NHQ0016A
SDA16A (Rev A)
www.ti.com
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