Material Content Data Sheet Sales Product Name TLE7279-2G V50 MA# MA000970642 Package PG-DSO-14-30 Issued 28. August 2013 Weight* 143.09 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 2.362 1.65 0.015 0.01 0.060 0.04 422 1.207 0.84 8435 49.007 34.25 35.14 342492 351454 0.302 0.21 0.21 2112 2112 0.173 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.65 16506 16506 105 1211 7.969 5.57 78.479 54.85 60.54 548459 605363 1.226 0.86 0.86 8569 8569 1.030 0.72 0.72 7197 7197 0.277 0.19 0.982 0.69 55693 1936 0.88 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 6863 8799 1000000