HP ASMC-PHB9-TX9S5 Envisium power plcc-4 surface mount led Datasheet

ASMC-PxB9-Txxxx
Envisium Power PLCC-4
Surface Mount LED
Data Sheet
Envisium
Envisium is the premier class of
mid-Power LEDs from Agilent
and Lumileds utilizing the very
best solid-state lighting
technologies from these two
industry leaders. Envisium LEDs
offer unparalleled performance,
engineering and design flexibility.
For the very first time, customers
have options for mid-power LEDs.
The Envisium Power PLCC-4 SMT
LEDs are designed for higher
reliability, better performance,
and operate under a wide range of
environmental conditions. The
performance characteristics of
these new mid-power LEDs make
them uniquely suitable for use in
harsh conditions such as in
automotive applications, and in
electronics signs and signals.
Description
The Envisium Power PLCC-4 SMT
LED is an extension of Agilent’s
PLCC-4 SMT LEDs. The package
can be driven at high current due
to its superior package design.
The product is able to dissipate
the heat more efficiently
compared to the conventional
PLCC-2 SMT LEDs. These LEDs
produce higher light output with
better flux performance compared
to the conventional PLCC-4 SMT
LEDs.
To facilitate easy pick and place
assembly, the LEDs are packed in
EIA-compliant tape and reel.
Every reel is shipped in single
intensity and color bin (except for
red), to provide close uniformity.
These LEDs are compatible with
the IR solder reflow process. Due
to the high reliability feature of
these products, they also can be
mounted using through-the-wave
soldering process.
The Envisium Power PLCC-4 SMT
LED is available in 3 colors, red,
red-orange and amber.
Features
• Industry standard PLCC-4 (Plastic
Leaded Chip Carrier)
• High reliability LED package
• Mid-Power intensity brightness with
optimum flux performance using TS
AlInGaP dice technologies
• Available in Red, Red Orange and
Amber colors
• High optical efficiency
• Higher ambient temperature at the
same current possible compared to
PLCC-2
• Super wide viewing angle at 120°
• Available in 8 mm carrier tape on 7inch reel
• Compatible with both IR and TTW
soldering process
Applications
• Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Navigation and audio system
– Push button backlighting
• Exterior automotive
– Turn signals
– Side repeaters
– CHMSL
– Rear combination lamp
– Puddle light
• Electronic signs and signals
– Channel lettering
– Contour lighting
– Indoor variable message sign
• Office automation, home appliances,
industrial equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
Package Dimensions
2.8 ± 0.2
1.9 ± 0.2
2.2 ± 0.2
A
0.8 ± 0.1
0.1 TYP.
C
3.2 ± 0.2
3.5 ± 0.2
0.8 ± 0.3
C
C
0.5 ± 0.1
0.7 ± 0.1
CATHODE MARKING
NOTE: ALL DIMENSIONS IN mm.
Device Selection Guide
Color
Red
Red Orange
Amber
Part Number
ASMC-PRB9-TV005
ASMC-PHB9-TW005
ASMC-PAB9-TV005
Total Flux FV
(mlm)[2,3]
Intensity
Bin
Min. IV
(mcd)
Max. IV
(mcd)
Typ.
V1
630.00
1000.00
2600.00
V2
790.00
1260.00
3300.00
W1
1000.00
1600.00
-
W1
1000.00
1600.00
4300.00
W2
1200.00
2020.00
5000.00
X1
1580.00
2500.00
-
V1
630.00
1000.00
3000.00
V2
790.00
1260.00
3800.00
W1
1000.00
1600.00
-
Test
Current
(mA)
Dice
Technology
50
AlInGaP
50
AlInGaP
50
AlInGaP
Notes:
1. The luminous intensity, IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. FV is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
3. Flux tested at mono pulse conditions.
2
Part Numbering System
ASMC - PX 1 B9 - TX 2 X 3 X 4 X 5
Packaging Option
Color Bin Selection
Intensity Bin Limit
Intensity Bin Selection
LED Chip Color
Absolute Maximum Ratings (TA = 25°C)
Parameters
DC Forward
ASMC-PxB9-Txxxx
Current[1]
70 mA[3,4]
Peak Forward Current[2]
200 mA
Power Dissipation
240 mW
Reverse Voltage
5V
Junction Temperature
125°C
Operating Temperature
-40°C to +100°C
Storage Temperature
-40°C to +100°C
Notes:
1. Derate linearly as shown in figure 4.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
Optical Characteristics (TA = 25°C)
Peak
Wavelength
lPEAK (nm)
Dominant
Wavelength
lD[1] (nm)
Viewing
Angle 2q1/2[2]
(Degrees)
Luminous
Efficacy hV[3]
(lm/W)
Luminous
Intensity/
Total Flux
IV (mcd)/
FV[4,5] (lm)
Color
Part Number
Dice
Technology
Typ.
Typ.
Typ.
Typ.
Typ.
Red
ASMC-PRB9-Txxx5
AlInGaP
639.0
630.0
120
155
0.30
Red Orange
ASMC-PHB9-Txxx5
AlInGaP
623.0
617.0
120
263
0.29
Amber
ASMC-PAB9-Txxx5
AlInGaP
594.0
592.0
120
500
0.26
Notes:
1. The dominant wavelength, lD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = IV/hV, where IV is the luminous intensity in candelas and hV is the
luminous efficacy in lumens/watt.
4. FV is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
5. Flux tested at mono pulse conditions.
Electrical Characteristics (TA = 25°C)
Forward Voltage VF (Volts) @ IF = 50 mA
Reverse Voltage VR @ 100 µA
Part Number
Typ.
Max.
Min.
ASMC-PxB9-Txxx5
2.8
3.4
5
3
1.0
RED ORANGE
0.9
AMBER
RELATIVE INTENSITY
0.8
RED
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
380
430
530
480
630
580
680
730
780
WAVELENGTH – nm
1.4
70
1.2
60
50
40
30
20
10
0
1.0
0.8
0.6
0.4
0.2
0
0
1
2
3
4
80
MAXIMUM FORWARD CURRENT – mA
80
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 50 mA)
FORWARD CURRENT – mA
Figure 1. Relative intensity vs. wavelength.
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75
DC FORWARD CURRENT – mA
FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
Figure 3. Relative intensity vs. forward current.
1.0
0.9
RELATIVE INTENSITY
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-70
-50
-30
-10
10
ANGLE – DEGREES
Figure 5. Radiation pattern.
4
30
50
70
90
70
60
50
40
30
20
10
0
0
20
40
60
80
100
120
AMBIENT TEMPERATURE – °C
Figure 4. Maximum forward current vs. ambient
temperature. Derated based on TJMAX = 125°C,
RqJA = 300°C/W.
20 SEC. MAX.
TEMPERATURE
240°C MAX.
3°C/SEC. MAX.
100-150°C
183°C
–6°C/SEC.
MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
60-150 SEC.
TIME
Figure 6a. Recommended Sn-Pb reflow soldering profile.
10 to 20 SEC.
255 °C
217 °C
+5 °C
-0 °C
TEMPERATURE
3 °C/SEC. MAX.
125 °C ± 25 °C
6 °C/SEC. MAX.
MAX. 120 SEC.
60 to 150 SEC.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 6b. Recommended Pb-free reflow soldering profile.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
TEMPERATURE – °C
BOTTOM SIDE
OF PC BOARD
200
TOP SIDE OF
PC BOARD
150
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
FLUXING
100
50
30
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
60
70
TIME – SECONDS
Figure 7. Recommended wave soldering profile.
5
80
90
100
4.05
SOLDER-RESIST
3.8
3.4
4.05
PAD
CLEARANCE
1.1
8.5
4.05
0.5
0.2
8.5
PAD CLEARANCE
Figure 8. Recommended soldering pad pattern.
TRAILER
200 mm MIN. FOR ∅180 REEL.
200 mm MIN. FOR ∅330 REEL.
COMPONENT
LEADER
480 mm MIN. FOR ∅180 REEL.
960 mm MIN. FOR ∅330 REEL.
C
A
USER FEED DIRECTION
Figure 9. Tape leader and trailer dimensions.
6
4 ± 0.1
∅1.5 +0.1/-0
2 ± 0.05
3.6 ± 0.1
1.75 ± 0.1
B
5.5 ± 0.05
A
A
C
C
C
A
12 +0.3/-0.1
3.8 ± 0.1
∅1 +0.1/-0
8 ± 0.1
B
0.229 ± 0.01
VIEW B-B
3.45 ± 0.1
VIEW A-A
ALL DIMENSIONS ARE IN MILLIMEERS (mm).
Figure 10. Tape dimensions.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 11. Reeling orientation.
7
Intensity Bin Select (X2X3)
Individual reel will contain parts
from one half bin only
Color Bin Select (X4)
Individual reel will contain parts
from one full bin only.
Color Bin Limits
Amber/
Yellow
Min. (nm)
Max. (nm)
X2
X4
1
582.0
584.5
Min IV Bin
X3
0
Full Distribution
2
584.5
587.0
A
1 and 2 only
3
587.0
589.5
B
2 and 3 only
4
589.5
592.0
0
Full Distribution
C
3 and 4 only
5
592.0
594.5
3
3 half bins starting from X61
D
4 and 5 only
6
594.5
597.0
4
4 half bins starting from X61
E
5 and 6 only
5
5 half bins starting from X61
G
1, 2 and 3 only
7
3 half bins starting from X62
H
2, 3 and 4 only
8
4 half bins starting from X62
Red
Orange
Min. (nm)
Max. (nm)
J
3, 4 and 5 only
9
5 half bins starting from X62
1
611.0
616.0
K
4, 5 and 6 only
2
616.0
620.0
M
1, 2, 3 and 4 only
Intensity Bin Limits & Typical Flux
N
2, 3, 4 and 5 only
Bin ID
Min. (mcd)
Max. (mcd)
P
3, 4, 5 and 6 only
Red
Min. (nm)
Max. (nm)
V1
715.00
900.00
R
1, 2, 3, 4, and 5 only
Full Distribution
V2
900.00
1125.00
S
2, 3, 4, 5 and 6 only
Tolerance of each bin limit = ± 1 nm.
W1
1125.00
1400.00
W2
1400.00
1800.00
X1
1800.00
2240.00
Packaging Option (X5)
X2
2240.00
2850.00
Option
Test Current
Package Type
Reel Size
5
50 mA
Top Mount
7 inch
Tolerance of each bin limit = ±12%.
8
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
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Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
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Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
January 30, 2005
5989-2308EN
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