BD9361GUL Datasheet Power LSI series for Digital Camera and Digital Video Camera 6ch Internal Power MOSFET System Switching Regulator + 1ch LDO BD9361GUL ●Function block diagram ●Outline 6-Channel Switching Regulator Controller for Digital Camera that contains an internal FET, and 1-Channel LDO. It is optimal power supply composition for Digital Camera or Digital Video Camera which carries CMOS sensor. It contributes to mounting area reduction, because CH1～CH4 have built-in feedback resister and WL-CSP of compact package is adopted. FET Step UP DC/DC1 Motor 5.0V (typ.) FET FET FET Buck-boost DC/DC2 System/Analog 3.3V (typ.) FET ●Features FET 1) 2.5V minimum input operating, and Supplies power for the internal circuit by step-up converter(CH1). 2) CH1 step-up converter, CH2 cross converter, CH3,4 step-down converter CH5 step-down converter controllable output voltage by external resister.CH6 boost converter for LED, 3) All channels contain internal Power MOSFET and compensation. 4) Operating frequency of 2.0 MHz (CH3,4,5) and 1.0MHz （CH1,2,6）. 5) Includes Over Voltage Protection (OVP) for CH1, 2, 6. 6) Includes LDO controllable output voltage by serial communication. 7) Contains sequence control circuit for CH1～3. It is possible to select sequence CH1⇒CH3⇒CH4⇒CH2 and CH1⇒CH4⇒CH3⇒CH2 by SEQ_CTL pin CH1, 2, 3, 4. CH5, 6, and LDO are possible to turn ON/OFF by serial communication. 8) Built-In discharge switch (CH2,3,4) and contains off sequence control circuit for CH1～4 with inverted start-up sequence. 9) Included cut off output voltage circuit during over current (timer latch type). 10) Include back-gate control for CH1 with soft start function Step Down DC/DC3 FET Step Down DC/DC4 FET Step Down DC/DC5 FET LDO FET Step UP DC/DC6 （Constant Current control) FET Core 1.1V (typ.) FET Memory 1.8V/1.5V(typ.) FET CMOS sensor/etc. 1.8V (typ.) FET CMOS sensor/etc. 2.8V (typ.) Load switch LED Back light I2C Interface Fig1. Function block diagram ●package WLCSP package（3.14mm×3.14mm 0.5mm pitch） ●Use For Digital Camera, Digital Video Camera ●PIN Assignments (TOP VIEW) ●Key Specifications ・Input voltage accuracy : ・Output voltage CH1 output voltage: CH2 output voltage: CH3 output voltage: CH4 output voltage (VOSEL4=H): CH4 output voltage (VOSEL4=L): CH5 reference voltage: CH6 reference voltage: LDO output voltage: ・Load current CH1 load current: CH2 load current: CH3 load current: CH4 load current: CH5 load current: CH6 load current: LDO load current: ・Frequency(CH3,4,5): ・Frequency (CH1,2,6): 2.5V～5.5V 5.0V±1.5%(typ.) 3.3V±1.5% (typ.) 1.1V±1.5% (typ.) 1.8V±1.5% (typ.) 1.5V±1.5% (typ.) 0.8V±1.25% (typ.) 0.4V±5.0% (typ.) 2.8V±1.5% (typ.) 1.0A (max) 800mA (max) 1.5A (max) 800mA (max) 500mA (max) 50mA (max) 200mA (max) 2.0MHz(typ.) 1.0MHz(typ.) Fig2. PIN Assignments ○Products：Silicon monolithic IC ○This product is not designed for normal operation with in a radioactive Status of this document The Japanese version of this document is the official specification. Please use the translation version of this document as a reference to expedite understanding of the official version. If these are any uncertainty in translation version of this document, official version takes priority. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 1 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Block Diagram ●Pin description GND(E4) VCCOUT(E5) Vo1 (D5) 1MHz ＋ 2 line Serial I/F Back gate control CH1 Step up Current mode control － DAC ERROR AMP Vo2 (D4) CH2 Cross Converter control － ＋ ERROR AMP － ＋ ＋ ERROR AMP DAC 2 line Serial I/F ＋ ERROR AMP ＋ PGND3 (A1) HX4 (D1) LX4 (E1) ERROR AMP A5 LX5 (F2) PGND45 (F1) VINREG (F4) LDO REGOUT (F5) ERROR AMP 1MHz DAC A4 HX5 (F3) SCP COMP LX6 (B1) CH6 Step up Current mode control － ＋ E6,A2,E1,F2,B1 D5,D4,D3,E2 2MHz CH5 Step down Current mode control － DAC 2 line Serial I/F LX3 (A2) SCP COMP － ＋ A3,D1,F3 B6 － VREF HX3 (A3) 2MHz CH4 Step down Current mode control － ＋ D6 SCP COMP － ＋ LX21(B6) LX22 (A5) 2MHz CH3 Step down Current mode control － Vo4 (E2) HX2BAT (C6) VOUT2 (A4) － ＋ C5 PGND2 (A6) SCP COMP Vo3 (D3) DAC 2 line Serial I/F E5 E4 F6,A6,A1,F1,C1 OVP COMP 1MHz DAC LX1 (E6) － 6.35V 2 line Serial I/F HX1 (D6) PGND1 (F6) VCCOUT ＋ INV5 (E3) No. ERROR AMP 2 line Serial I/F PGND6 (C1) E3,D2 F4 F5 C3 C2 C4 B4 B3 VOUT6 (C3) 28V － ＋ B5 SCP COMP LED (C2) LED SW control INV6 (D2) B2 SCP COUNTER Description IC Power Supply Input in part of controller Please connect to HX1 terminal. VCCOUT Please connect 10uF ceramic capacitor to this terminal. Power Supply Input for serial signal. VDD Please connect 1uF ceramic capacitor to this terminal. GND Ground terminal PGND1,2,3,45,6 Ground for Internal FET Terminal for output voltage of CH1 (step-up). HX1 Please connect to VCCOUT terminal. The power supply to switching regulator is inputted into this terminal. This terminal Hx2BAT,HX3,4,5 supplies power to output stage of switching regulator and control circuit. Terminal for Connecting Inductor. Please Lx1,3,4,5,6 refer to the 13 page for recommended value. VOUT2 CH2 DC/DC Output Terminal for Connecting Inductor Lx21 For CH2 Input Terminal for Connecting Inductor Lx22 For CH2 Output Output voltage Feed-back pin Please connect each channel’s output to Vo1,2,3,4 Vo1 ～ Vo4 terminals, because CH1 ～ CH4 have built-in feedback resister. Error Amp Inverted Input INV5,6 Please refer to the 21 page for the calculation method of feedback resister. VINREG LDO Input terminal REGOUT LDO Output terminal VOUT6 CH6 DC/DC OVP monitor terminal LED Terminal for connecting LED Cathode ON/OFF switch STB1234 H: operating over 1.5V SCL 2 Line serial clock Input Pin SDA 2 Line serial data Input Pin CH4 initial Output voltage control pin (HX2BAT:1.8V,GND:1.5V) VOSEL4 Please regularly connect this terminal to HX2BAT or GND. Sequence control terminal HX2BAT:CH1→CH3→CH4→CH2 SEQ_CTL GND: CH1→CH4→CH3→CH2 Please regularly connect this terminal to HX2BAT or GND. VDD(C5) Serial I/F SCL(B4) SEQ_CTL(B2) STB1234 (C4) ON/OFF LOGIC ALL CH DRIVER STOP SDA(B3) SCP COMPOUT 1～6 Symbol Fig3. Block diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 2 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Absolute maximum ratings（Ta＝25℃） Item Maximum applied power Supply voltage Maximum applied input voltage Maximum Output current Power Dissipation Operating Temperature Storage Temperature Junction Temperature Symbol HX2BAT, VCCOUT VHx1～5, VINREG VLx6 IomaxHx1, Lx1 IomaxHx2BAT IomaxHx3 IomaxHx4,5 IomaxLx6 REGOUT Pd Topr Tstg Tjmax Limit Unit －0.3～7 V －0.3～7 －0.3～7 －0.3～30 ±2.8 ±2.5 ±2.0 ±1.0 ±1.0 300 1.25 (*1) －25～+85 －55～+150 +150 V V V A A A A A mA W ℃ ℃ ℃ *1 Should be derated by 10.0mW/℃ at Ta=25℃ or more. When mounted on a glass epoxy PCB of 50mm×50 mm×1.74 mm ●Operating condition Item HX2BAT voltage (Power supply voltage) VDD voltage (serial traffic power supply voltage) Control input voltage SCL input frequency range LDO terminal connection capacity MIN Limit TYP MAX HX2BAT 2.5 - 5.5 V VDD 1.5 - 3.6 V Vin Fscl CoLDO 0 1.0 2.2 VDD 400 - V KHz uF Symbol Unit ●Protective functions Item SCP OCP OVP condition CH1 Boost synchronous rectification ○ ○ ○ CH2 Cross synchronous rectification ○ ○ ○ CH3 Buck synchronous rectification ○ ○ × SCP: Vo monitor CH4 Buck synchronous rectification ○ ○ × SCP: Vo monitor CH5 Buck synchronous rectification ○ ○ × SCP: Error amp output (internal node) monitor CH6 Boost back light × ○ ○ OVP: VOUT6 monitor Stop when shorted output OVP: HX1 monitor SCP: Vo monitor OVP:VOUT2 monitor ●Over current protective part Item Symbol Limit MIN TYP MAX Unit CH1 LX1 OCP detecting current IOCP1 2.8 － － A CH2 HX2BAT OCP detecting current IOCP2 2.5 － － A CH3 HX3 OCP detecting current IOCP3 2.0 － － A CH4 HX4 OCP detecting current IOCP4 1.2 － － A CH5 LX5 OCP detecting current IOCP5 1.2 － － A CH6 Lx6 OCP detecting current IOCP7 1.2 － － A www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 3 condition TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Electrical characteristics （Unless specified, Ta=25℃, VCCOUT=5.0V, HX, HX2BAT,REGIN=3.6V, STB1234=3.0V, ALL DCDC, LOD ON） Item Symbol Limit MIN 【 Low-voltage input malfunction prevention circuit 】 Detecting voltage Vstd1B (HX2BAT) Release voltage (HX2BAT) Vstd2B 2.0 Hysteresis width ⊿VstdB 50 Detecting voltage Vstd1V (VCCOUT) Release voltage (VCCOUT) Vstd2V 2.3 Hysteresis width ⊿VstdV 100 【Short Circuit Protection】 SCP detect time Tscp 16 Timer start threshold voltage Vscp2 1.31 Timer start threshold voltage Vscp3 0.42 Timer start threshold voltage Vscp4 0.69 Timer start threshold voltage Vscp5 0.28 【OVP】 CH1 OVP Threshold VOVP1 5.75 CH2 OVP Threshold VOVP2 5.75 CH6 OVP Threshold VOVP6 26.5 【Output Voltage】 CH1 Output voltage range RVO1 4.80 Unit condition TYP MAX 2.1 2.2 V HX2BAT monitor 2.2 100 2.4 200 V mV HX2BAT monitor 2.3 2.4 V VCCOUT monitor 2.5 200 2.7 300 V mV VCCOUT monitor 21 1.68 0.54 0.89 0.36 26 2.04 0.66 1.08 0.44 ms % % % V 6.35 6.35 28 6.95 6.95 29.5 V V V HX1 monitor VOUT2 monitor VOUT6 monitor - 5.30 V 100mV step CH1 Output voltage(default) VO1d 4.925 5.000 5.075 V CH1 Output Voltage accuracy VO1o -2.0 - 2.0 % CH2 Output voltage range RVO2 2.80 - 3.35 V CH2 Output voltage(default) VO2dL 3.250 3.300 3.350 V CH2 Output voltage(default) VO2o -2.0 - 2.0 % CH2 Output Voltage accuracy RVO3 0.900 - 1.250 V CH3 Output voltage range VO3d 1.083 1.100 1.117 V Vo2 monitor Vo3 monitor Vo4 monitor INV5 monitor 50mV step 25mV step CH3 Output voltage(default) VO3o -2.0 - 2.0 % CH3 Output Voltage accuracy RVO4 1.775 - 1.850 V 25mV step CH4 Output voltage range VO4dH 1.773 1.800 1.827 V VOSEL4=H CH4 Output voltage(default) VO4AdL 1.477 1.500 1.523 V VOSEL4=L CH4 Output voltage(default) VO4o -2.0 - 2.0 % CH4 Output Voltage accuracy RVo6 12.5 - 400 mV Vo6 380 400 420 mV IINV5,6 VINV5 0.790 0 0.800 50 0.810 nA V CH6 Output voltage range 【 Error Amp 】 Input Bias current INV5 Threshold 12.5mV step INV5,6 ○This product is not designed for normal operation within a radioactive environment. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 4 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Electrical characteristics （Unless specified, Ta=25℃, VCCOUT=5.0V, HX, HX2BAT,REGIN=3.6V, STB1234=3.0V, ALL DCDC, LOD ON） Item 【Oscillating circuit】 Frequency CH3,4 Frequency CH1,2,5-7 Max duty 1（step-up） Max duty CH2 Lx21 Max dutyCH2 Lx22 Max duty 3, 4,5（step-down） 【Soft Start】 CH1 Soft Start Time CH2,5 Soft Start Time CH3,4 Soft Start Time CH6 Duty Restriction time 【OFF detect comparator】 CH2 OFF Threshold CH3 OFF Threshold CH4 OFF Threshold Symbol Limit Unit MIN TYP MAX fosc1 fosc2 Dmax1 Dmax21 Dmax22 Dmax34 1.6 0.8 86 86 - 2.0 1.0 92 92 - 2.4 1.2 96 100 96 100 MHz MHz % % % % Tss1 Tss2,5 Tss3,4 TDTC 1.8 2.4 1.2 5.0 3.0 4.2 2.1 8.2 5.4 6.0 3.0 11.8 msec msec msec msec VOFF2 VOFF3 VOFF4 - 0.420 0.135 0.220 0.560 0.180 0.295 V V V condition Vo2 monitor Vo3 monitor Vo4 monitor ○This product is not designed for normal operation within a radioactive environment. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 5 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Electrical characteristics （Unless specified, Ta=25℃, VCCOUT=5.0V, HX, HX2BAT,REGIN=3.6V, STB1234=3.0V, ALL DCDC, LOD ON） MIN Limit TYP MAX RON1P RON1N RON21P RON21N RON22P RON22N RON3P RON3N RON45P RON45N RON45P RON45N RON6N RLED - 80 60 120 120 150 120 150 110 150 120 200 150 500 2.0 150 120 180 180 230 180 230 170 230 180 300 230 750 3.0 mΩ mΩ mΩ mΩ mΩ mΩ mΩ mΩ mΩ mΩ mΩ mΩ mΩ Ω RDSW2 RDSW3 RDSW4 RDSW5 - 100 100 100 100 200 200 200 200 Ω Ω Ω Ω VSTBH1 VSTBL1 RSTB1 1.5 -0.3 250 400 5.5 0.3 700 V V kΩ VCTLH HX2B AT-0.3 - HX2B AT+0.3 V VCTLL 0 - 0.3 V VLDO1 1.5 - 3.3 V LDOACC 2.758 2.800 2.842 V Line regulation VDL - 2 20 mV Load regulation VDLo - 10 80 mV RR 40 50 - dB ILMAX ISHORT LDODCR 220 20 0.5 350 70 1 700 150 1.5 mA mA kΩ VCCOUT terminal ISTB1 - 0 5 µA Hｘ terminal ISTB2 - 0 5 µA Lx terminal VINREG ISTB3 ISTB4 - 0 0 5 5 µA µA IST - 300 600 µA HX2VAT=3.6V Icc2 - 5.0 9.7 mA CH1～6 Switching OFF LDO ON Item Symbol 【Output Driver】 CH1 Highside SW ON Resistance CH1 Lowside SW ON Resistance CH2 Lx21 Highside SW ON resistance CH2 Lx21 Lowside SWON resistance CH2 Lx22 High side SW ON resistance CH2 Lx22 Low side SW ON resistance CH3 High side SW ON Resistance CH3 Low side SW ON Resistance CH4 High side SW ON Resistance CH4 Low side SW ON Resistance CH5 High side SW ON Resistance CH5 Low side SW ON Resistance CH6 NMOS SW ON resistance LED PIN SW ON resistance 【Discharge switch】 CH2 discharge SW ON resistance CH3 discharge SW ON resistance CH4 discharge SW ON resistance CH5 discharge SW ON resistance 【STB1234】 Active STB Control Voltage Non Active Pull Down Resistance 【SEQ_CTL, VOSEL4】 SEQ_CTL H level VOSEL4 L level Control Voltage 【LDO】 Output voltage Output voltage accuracy PSRR Over current protect Output short current Discharge resister 【Circuit Current】 Stand-by Current Circuit Current when start-up （HX2BAT current when voltage supplied for the terminal） Circuit Current （VCCOUT current when voltage supplied for the terminal） Unit condition Hx1=5V VCCOUT=5.0V Hx2BAT=3.6V VCCOUT=5.0V VOUT2=3.3V VCCOUT=5.0V Hx3=3.6V , VCCOUT=5V VCCOUT=5.0V Hx4=3.6V, VCCOUT=5V VCCOUT=5.0V Hx4=3.6V, VCCOUT=5V VCCOUT=5.0V VCCOUT=5.0V VCCOUT=5.0V VCCOUT=5.0V VCCOUT=5.0V VCCOUT=5.0V VCCOUT=5.0V Vo=1.5V,1.8V,2.7V ,2.8V , 2.9V 3.0V,3.1V,3.3V VINREG=REGOUT+1.0V to 5.5V Iout=10uA Io=0.01mA to 100mA VR=-20dBv f=1KHz Io=10mA Vo=REGOUT*0.8 Vo=0V Step-down Cross- converter Step-up ○This product is not designed for normal operation within a radioactive environment. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 6 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Specification for serial control Electrical characteristics （Unless specified, Ta=25℃, VDD=3.3V） Item Symbol Limit MIN TYP MAX Unit condition SCL、SDA H level input voltage VINH VDD*0.7 - VDD+0.3 V L level input voltage VINL -0.3 - VDD*0.3 V H level input current IINH -10 - 10 µA L level input current IINL -10 - 10 µA Input voltage＝0.1×VDD L level output voltage (SDA) VOL - - 0.4 V IIN=3.0mA Bus capacitance Cb - - 400 pF TYP MAX MIN Input voltage＝0.9×VDD AC timing characteristics （Unless specified, Ta=25℃, VDD=3.3V） Item Symbol FAST-MODE* MIN STANDARD-MODE* TYP MAX Unit SCL frequency fSCL - - 400 - - 100 kHz HIGH period of the SCL clock fHIGH 0.6 - - 4 - - uS LOW period of the SCL clock fLOW 1.3 - - 4.7 - - uS SDA/SCL rise time tR - - 0.3 - - 1 uS SDA/SCL fall rime tF - - 0.3 - - 1 uS Start condition hold time tHD：STA 0.6 - - 4 - - uS Start condition set-up time tSU：STA 0.6 - - 4.7 - - uS Data hold time tHD：DAT 0 - 0.9 0 - 3.45 uS Data set-up time tSU：DAT 100 - - 250 - - nS Set-up time for stop condition Bus free time between a STOP and START condition Noise cancel time ｔSU：STO 0.6 - - 4 - - uS ｔBUF 1.3 - - 4.7 - - uS ｔ1 0 - 50 0 - 50 nS FAST-MODE and STANDARD-MODE are sectioned by clock speed. STANDARD-MODE clock speed is 100lHz, and FAST-MODE clock speed is 400 kHz. These clock speed are assumed maximum frequency, it is possible to use clock speed 100 kHz on FAST-MODE. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 7 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Serial data timing Fig4. Serial data timing SCL tSU:STA tSU:STO tHD:STA SDA STOP BIT START BIT Fig5. Start bit, stop bit timing diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 8 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Serial I/F, Read/Write function 1. Writing protocol A register address is transferred by the next 1 byte that transferred the slave address and the write-in command. The 3rd byte writes data in the internal register written in by the 2nd byte, and after 4th byte or, the increment of register address is carried out automatically. However, when a register address turns into the last address, it is set to 00h by the next transmission. After the transmission end, the increment of the address is carried out. *1 S X X X X X X X 0 A A7 A6 A5 A4 A3 A2 A1 A0 A D7 D6 D5 D4 D3 D2 D1 D0 A slave address register address *1 D7 D6 D5 D4 D3 D2 D1 D0 A P DATA DATA register address increment R/W=0(write) register address increment A=acknowledge(SDA LOW) A=not acknowledge(SDA HIGH) S=START condition P=STOP condition *1: Write Timing from master to slave from slave to master 2. Multiple reading protocols After specifying an internal address, it reads by repeated START condition and changing the data transfer direction. The data of the address that carried out the increment is read after it. If an address turns into the last address, the next byte will read out 00h. After the transmission end, the increment of the address is carried out. S X X X X X X X 0 A A7 A6 A5 A4 A3 A2 A1 A0 A Sr X X X X X X X 1 A slave address register address slave address R/W=0(write) R/W=1(read) D7 D6 D5 D4D3D2 D1D0 A DATA D7D6 D5D4D3D2D1 D0 A P DATA register address increment register address increment A=acknowledge(SDA LOW) A=not acknowledge(SDA HIGH) S=START condition P=STOP condition Sr=repeated START condition from master to slave from slave to master ※As for reading protocol and multiple reading protocols, please do A(not acknowledge) after doing the final reading operation. It stops with read when ending by A (acknowledge), and SDA stops in the state of Low when the reading data of that time is 0. However, this state returns usually when SCL is moved, data is read, and A (not acknowledge) is done. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 9 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Application circuit VCCOUT GND ●Recommended maximum load CH1 Vo (V) Vin (V) Io_max (mA) Boost 2.5 1000 L=2.2uH 3.0 1000 （TOKO:DE4518C） （YUDEN:NR4018T） 3.6 1000 C=20uF 4.2 1000 (MURATA: GRM31CB31E106KA75L) 2.5 800 L=3.3uH 3.0 800 （TOKO:DE3518） （YUDEN:NR3015T） 3.6 800 C=10uF 4.2 800 (MURATA: GRM31CB31E106KA75L) 1.8 1500 L=2.2uH 2.5 1500 （TOKO:DE2815） （YUDEN:NR3015T） 3.6 1500 C=10uF 4.2 1500 (MURATA: GRM31CB31E106KA75L) 1.8 800 L=2.2uH 2.5 800 （TOKO:DE2815） （YUDEN:NR3015T） 3.6 800 C=10uF 4.2 800 (MURATA: GRM31CB31E106KA75L) 2.5 500 5.0 CH2 Cross 3.3 CH3 Buck 1.1 CH4 Buck 1.8 CH5 Buck 1.8 CH6 VOSEL4 VDD SCL SDA STB1234 SEQ_CTL CH6 LDO Fig6. Applied circuit diagram Boost 3.6 500 4.2 500 5.0 500 2.5 50 condition (Recommended parts) L=2.2uH （TOKO:DE2815） （YUDEN:NR3015T） C=10uF (MURATA: GRM31CB31E106KA75L) R1=300ｋΩ,R2=240kΩ L=10uH (worth 3.0 50 3 light 4.2 50 （TOKO:DE2815） （YUDEN:NR3015T） C=4.7uF (MURATA: GRM21BB31E475KA75L) LED) 5.0 50 Diode (RB551V-30) Boost 1.8 30 L=10uH （TOKO:DE2815） （YUDEN:NR3015T） C=4.7uF (MURATA: GRM21BB31E475KA75L) (worth 2.5 30 6 light 3.6 30 LED) 4.2 30 2.8 3.3 200 C=2.2uF 3.6 200 (MURATA: GRM21BB31E225KA75L) 4.2 200 5.5 200 Diode (RB551V-30) ○ Operation notes ・we are confident that the above applied circuit diagram should be recommended, but please thoroughly confirm its characteristics when using it. In addition, when using it with the external circuit’s constant changed, please make a decision that allows a sufficient margin in light of the fluctuations of external components and ROHM’s IC in terms of not only static characteristic but also transient characteristic. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 10 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Efficiency data (1) CH1 STEP UP 5.0V Efficiency‐Io CH2 Cross converter 3.3V Io‐Efficiency 100 100 95 90 85 80 Efficiency [%] Efficiency [%] 90 70 VBAT=4.2V 60 VBAT=3.6V 50 80 75 VBAT=4.2V 70 VBAT=3.6V 65 VBAT=3.0V 60 VBAT=2.8V VBAT=2.5V 55 VBAT=2.5V 40 50 10 100 1000 10 100 1000 Io [mA] Io[mA] Fig7. CH1 5.0V voltage boost efficiency－Io Inductor : 2.2uH (YUDEN: NR4018T) Fig8. CH2 3.3V Cross converter efficiency－Io Inductor : 3.3uH (YUDEN: NR3015T) CH3 Step Down 1.15V Io‐Efficiency CH4 Step Down 1.8V Io‐Efficiency 100 100 95 90 90 85 Efficiency[%] Efficiency [%] 80 70 60 VBAT=4.2V 50 VBAT=3.6V VBAT=2.8V 40 VBAT=2.5V 30 80 75 70 VBAT=4.2V 65 VBAT=3.6V 60 VBAT=2.8V 55 VBAT=2.5V 50 10 100 1000 10 10000 Io [mA] Fig9. CH3 1.15V Step-down efficiency－Io Inductor : 2.2uH (YUDEN: NR3015T) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 100 1000 Io[mA] Fig10. CH4 1.8V Step-down efficiency－Io Inductor : 2.2uH (YUDEN: NR3015T) 11 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Efficiency data (2) CH5 Step Down 1.2V Io‐Efficiency CH6 Backlight (5LED) Io‐Efficiency 100 100 95 90 90 85 Efficiency[%] Efficiency [%] 80 70 VBAT=5.5V VBAT=4.2V 60 VBAT=3.6V VBAT=2.8V 50 VBAT=2.5V 40 10 100 80 75 70 65 Io=30mA 60 Io=20mA 55 Io=10mA 50 1000 2.000 Io[mA] 3.000 4.000 5.000 VBAT [V] Fig11. CH5 1.2V Step-down efficiency－Io Inductor : 2.2uH (YUDEN: NR3015T) Fig12. CH6 5 LED efficiency－Input voltage Inductor : 10uH (YUDEN: NR3015T) IVCCOUT-VBAT (application) 11.20 10.97 11.06 10.87 11 IVCCOUT[mA] 10.29 10.21 10.15 10.02 9 8.64 8.66 8.62 8.52 CH1～4_ON 7 CH1～5_ON All_CH_ON 5 2 2.5 3 3.5 4 4.5 VBAT [V] Fig13. VCCOUT Input current － Input voltage (Recommended application) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 12 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Start up and OFF sequence wave form(1) CH1 Step up ５V (2.0V/div) CH1 Step up ５V (2.0V/div) CH2 Cross Converter 3.3V (2.0V/div) CH2 Cross Converter 3.3V (2.0V/div) CH3 Step down1.1V (2.0V/div) CH3 Step down1.1V (2.0V/div) CH4 Step down1.8V CH4 Step down1.8V (2.0V/div) (2.0V/div) 2.0ms/div Fig14. CH1～4 Start up wave form （SEQ_ CTL=H） 2.0ms/div Fig15. CH1～4 wave form of OFF sequence （SEQ_ CTL=H） CH1 Step up ５V (2.0V/div) CH1 Step up ５V (2.0V/div) CH2 Cross Converter 3.3V (2.0V/div) CH2 Cross Converter 3.3V (2.0V/div) CH3 Step down1.1V (2.0V/div) CH3 Step down1.1V (2.0V/div) CH4 Step down1.8V CH4 Step down1.8V (2.0V/div) (2.0V/div) 2.0ms/div Fig16. CH1～4 Start up wave form （SEQ_ CTL=L） www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 2.0ms/div Fig17. CH1～4 wave form of OFF sequence （SEQ_ CTL=L） 13 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Start up and OFF sequence wave form(2) SDA (2.0V/div) SDA (2.0V/div) CH5 Step down 1.8V (1.0V/div) CH5 Step down 1.8V (1.0V/div) LDO 2.8V (2.0V/div) LDO 2.8V (2.0V/div) 2.0ms/div 2.0ms/div Fig18. CH5, LDO Start up wave form Fig19. CH5, LDO wave form of OFF sequence SDA(2.0V/div) SDA (2.0V/div) CH6 Backlight 4LED (5.0V/div) CH6 Backlight 4LED (5.0V/div) 1.0ms/div 1.0ms/div Fig20. CH6 Start up wave form www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 Fig21. CH6 wave form of OFF sequence 14 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Temperature characteristic Ta-CH5 base voltage Frequency temperature characteristic 3 1 difference from 25℃[%] 2.8 Frequency [MHz] 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 0.5 0 -0.5 -1 1 -25 0 25 50 75 -25 100 25 50 75 100 temp [℃] temp [℃] Fig22. Frequency－Temp（2MHz） www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 0 Fig23. CH5 Base voltage－Temp 15 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Timing chart (1) SEQ_CTL=H (HX2BAT) SEQ_CTL=H (HX2BAT) STB1234 STB1234 Disscharge by 100Ω SW Vo2 OFF threthold Tss3 Vo1 Disscharge by 100Ω SW Vo4 Tss1 Vo3 OFF threthold Tss4 Disscharge by 100Ω SW Vo3 OFF threthold Vo4 Tss2 Vo1 Disscharge by load current Vo2 SEQ_CTL=L (GND) SEQ_CTL=L (GND) STB1234 STB1234 Vo2 Disscharge by 100Ω SW OFF threthold Tss4 Vo1 Disscharge by 100Ω SW Vo3 Tss1 Vo4 OFF threthold Tss3 Disscharge by 100Ω SW Vo4 OFF threthold Vo3 Vo1 Tss2 Disscharge by load current Vo2 CH5 Serial input EN5 Serial input EN5 OFF Disscharge by 100Ω SW Tss5 Vo5 （降圧） Vo5 （降圧） CH5 OFF CH6 Serial input EN6 Serial input EN6 ERROR AMP output voltage is clamped during soft start OFF TDTC DTC 6( Internal node of IC ） DTC6 Error amp output ( Internal node of IC ） CH6 OFF Output voltage correspond to duty of input pulse VO6 Disscharge by load current VO6 Tss1 : typ 3.0msec Tss3 : typ 2.1msec Tss2 : typ 4.2msec Tss4 : typ 2.1msec Tss5 : typ 4.2msec TDTC： typ 8.2msec Fig24.CH1～CH6 Start up and OFF Sequence www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 16 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●SLAVE address SLAVE address 29h (010 1001) ●Resister map Attention ¾ ¾ ¾ ¾ “W” is resister bit to write. “R” is resister bit to read. “R/W” is resister bit to read or write. “－” is resister bit not to use. R/W D7 D6 D5 D4 D3 D2 D1 D0 Initial value SFTRST W - - - - - - - SFT RST 00h 01h ENCNT R/W - - - - CH1 PFM EN LDO EN6 EN5 08h 02h VCNT12 R/W 03h VCNT34 R/W Addr ess Address 00h 04h name VCNT6L R/W DO ※※h Æ See resister map VCNT2[3:0] - VCNT4[2:0] LDOCNT[2:0] VCNT1[3:0] 64h VCNT3[3:0] ※8h VCNT6[4:0] 60h Function Input to reset software ON/OFF for each CH Adjustment to CH1, CH2 output voltage Adjustment to CH3, CH4 output voltage Adjustment to INV6, LDO output voltage Resister reset condition ： (Resister reset mean all resister turn into initial value) ① In the operation of HX2BAT UVLO or VCCOUT UVLO. ② Initialized after OFF sequence of CH1～4. Logic reset condition ： Logic reset mean all resister and internal logic circuit (soft start circuit etc.) are initialized in disregard of sequence with the following condition directly. ① In the operation of HX2BAT UVLO or VCCOUT UVLO. ② Initialized CH1～4 output voltage are OFF with OFF sequence. Please input “0” to “-“ resister. Empty resisters are used to test mode resister. Please transmit “0” to “-“ resister to avoid test mode while data is transmitted. If address “00h” get “01” data, it occur logic reset directly, address “00h” is initialized, and start-up sequence is beginning. Don’t use this mode, if you don’t need. ●Resister Map 1 Address 00h Address 01h Address name R/W SFT W RST D0: SFTRST Address name R/W ENCN R/W T D0: EN5 D2: ENLDO D7 D6 D5 D4 D3 D2 D1 D0 Initial value Data content - - - - - - - SFT RST 00h Input to reset software D1 D0 Initial value Data content software reset ‘0’: Reset cancel (Initial) ‘1’: reset Æ Reset automatically by 1 shot pulse. D7 D6 D5 D4 D3 - - - - CH1P FM CH5 ON/OFF signal ‘0’: CH5 OFF (initial value) ‘1’: CH5 ON LDO ON/OFF signal ‘0’: LDO OFF (initial value) ‘1’: LDO ON www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 D2 ENLD EN6 O D1: EN6 ON/OFF for each CH CH6 ON/OFF signal ‘0’: CH6 OFF (initial value） ‘1’: CH6 ON EN5 08h D3: CH1PFM CH1 PFM mode switch signal ‘0’: CH1 synchronous mode ‘1’: CH1 reverse current detect mode (initial value) 17 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Resister Map 2 Address Address name R/W 02h VCNT12 R/W 03h VCNT34 R/W VCNT6 04h LDO D7 D6 D5 D4 D3 D2 VCNT2[3:0] - R/W VCNT4[2:0] LDOCNT[2:0] D1 D0 Initial Value VCNT1[3:0] 64h VCNT3[3:0] ※8h VCNT6[4:0] 60h Function Adjustment to CH1,CH2 output voltage Adjustment to CH3, CH4 output voltage Adjustment to INV6,LDO output voltage Output voltage [V] Data D4 D3 D2 D1 D0 VCNT1 [D3～D0] VCNT2 [D3～D0] 0 0 0 0 0 4.800 2.800 0 0 0 0 1 4.800 2.800 0 0 0 1 0 4.800 2.850 0 0 0 1 1 4.900 0 0 1 0 0 5.000 0 0 1 0 1 0 0 1 1 0 0 1 0 1 0 0 1 0 1 0 0 VCNT3 [D3～D0] VCNT4 [D2～D0] VCNT6 [D4～D0] LDOCNT [D2～D0] 0.900 1.475 0.4000 1.500 0.925 1.500（*1） 0.3875 1.800 0.950 1.525 0.3750 2.700 2.900 0.975 1.550 0.3625 2.800 3.200 1.000 1.775 0.3500 2.900 5.100 3.250 1.025 1.800（*2） 0.3375 3.000 0 5.200 3.300 1.050 1.825 0.3250 3.100 1 1 5.300 3.350 1.075 1.850 0.3125 3.300 0 0 5.300 3.350 1.100 - 0.3000 - 0 0 1 5.300 3.350 1.125 - 0.2875 - 0 1 0 5.300 3.350 1.150 - 0.2750 - 1 0 1 1 5.300 3.350 1.175 - 0.2625 - 1 1 0 0 5.300 3.350 1.200 - 0.2500 - 0 1 1 0 1 5.300 3.350 1.225 - 0.2375 - 0 1 1 1 0 5.300 3.350 1.250 - 0.2250 - 0 1 1 1 1 5.300 3.350 1.250 - 0.2125 - 1 0 0 0 0 - - - - 0.2000 - 1 0 0 0 1 - - - - 0.1875 - 1 0 0 1 0 - - - - 0.1750 - 1 0 0 1 1 - - - - 0.1625 - 1 0 1 0 0 - - - - 0.1500 - 1 0 1 0 1 - - - - 0.1375 - 1 0 1 1 0 - - - - 0.1250 - 1 0 1 1 1 - - - - 0.1125 - 1 1 0 0 0 - - - - 0.1000 - 1 1 0 0 1 - - - - 0.0875 - 1 1 0 1 0 - - - - 0.0750 - 1 1 0 1 1 - - - - 0.0625 - 1 1 1 0 0 - - - - 0.0500 - 1 1 1 0 1 - - - - 0.0375 - 1 1 1 1 0 - - - - 0.0250 - 1 1 1 (*2) VOSEL4 = H - - - - 0.0125 - 1 1 (*1) VOSEL4 = L → Initial value. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 18 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Setting method of IC peripheral components (1) Design of feedback resistor constant VOUT6 VOUT5 ERROR AMP R1 INV R2 INV6 VREF 0.8V Vo= (R1+R2) R2 R3 VREF 12.5,mV~400mV CH6 output current CH5 output voltage ×0.8 [V] ・・・ (1) ERROR AMP6 Io= INV6 [A] ・・・ (2) R3 Fig25. Feedback resistor setting method (a)CH5 setting The reference voltage of CH5’s ERROR AMP is 0.8V inside IC. Please refer to Formula (1) for determining the output voltage. This IC has phase compensation. R1 and R2 are recommended as more than 100kΩ. (b)CH6 setting LED current is decided (2) formula. Please decide R3 value for LED current range. It is possible to control Dimming by only serial I/F. (2) Points for attention in terms of PCB layout of base-plate ○For a switching regulator, in principle a large current transiently flows through the route of power supply – coil – output capacitor. Ensure that the wiring impedance is lowered as much as possible by making the pattern as wide as possible and the layout as short as possible. ○Interference of power supply noise with feedback terminals (Vo, INV) may cause the output voltage to oscillate. Ensure that the power supply noise’s interference is avoided by making the wiring between feedback resistor and feedback terminal as short as possible. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 19 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Block explanation 1. SCP, Timer Latch It is a timer latch type of short-circuit protection circuit. For CH6, the error AMP output voltage is monitored, and detected when the feedback voltage deviates from control, for CH1～5, it is detected when the voltage of INV terminal becomes lower than 60%, and in 21ms the latch circuit operates and the outputs of all the channels are fixed at OFF. In order to reset the latch circuit, please turn off all the STB terminals before turning them on once again or turning power supply on once again. 2. U.V.L.O It is a circuit to prevent malfunction at low voltage. It is to prevent malfunction of internal circuit at the time of rising or dropping to a lower value of power supply voltage. If the voltage of VCCOUT terminal becomes lower than 2.3V, or the voltage of HX2BAT terminal becomes lower than 2.1V, then the output of each DC/DC converter is reset to OFF, and SCP’s timer latch & soft start circuit are reset. In order to cancel UVLO of VCCOUT, it is necessary to set VCCOUT more than 2.5V. And in order to cancel UVLO of HX2BAT, it is necessary to set HX2BAT more than 2.2V. 3. OSC It is an oscillation circuit the frequency of which is fixed by a built-in CR. The operating frequencies of CH3, 4, 5 are set at 2MHz, and the operating frequencies of CH1, 2, 6 are set at 1MHz. 4. ERRAMP 1～6 It is an error amplifier to detect output signal and output PWM control signal. The reference voltages of ERRAMP (Error Amplifier) of CH1～4 are internally set at 0.6V, and the reference Voltages of ERRAMP (Error Amplifier) of CH5 are set at 0.8V and the reference voltages of ERRAMP (Error Amplifier) of CH6 are set at 0.4V. In addition, each CH incorporates a built-in element for phase compensation. 5. Current mode control block CH1, 3～6 adopt the PWM method based on current mode. For a current- mode DC/DC converter, FET at the main side of synchronous rectification is turned on when detecting the clock edge, and turned off by detecting the peak current by means of the current comparator. 6. Cross Control DUTY controller for CH2 cross converter. It have PWM comparator that compare 1MHz SLOPE and ERROR AMP output and logic circuit for control 4 FET ON/OFF switching.. LX21 MAX ON DUTY is 100%, LX21 MAX ON DUTY is 92%. 7. Back gate Control PchFET backgate selector controller in CH1. PchFET have body Di between backgate and source,drain ordinary. This circuit intercept CH1 step up output voltage by cutting body Di line at STB OFF and control soft start .CH1 softstart output voltage from 0V like a slope. 8. Nch DRIVER , Pch DRIVER Internal Nch, Pch FET driver CMOS inverter type output circuit. 9. ON/OFF LOGIC It is the voltage applied to STB terminal and can control the ON/OFF of CH1～CH4. If the voltage more than 1.5V is applied, then it becomes ON, but if open or 0V is applied, then it becomes off, furthermore, it all the channels are turned off, then the whole IC will be in standby state. In addition, STB1234 terminals contain respectively a built-in pull-down resistor of about 400kΩ. 10. SOFT START It is a circuit to apply the soft start to the output voltage of DC/DC converter and prevent the rush current at the start-up. Soft start time varies with the channels. a. b. c. d. CH1 CH3,4 CH2,5 CH6 ・・・ ・・・ ・・・ ・・・ reach the target voltage in 3.0ms. reach the target voltage in 2.1ms. reach the target voltage in 4.2ms. reach the target voltage in 8.2ms. 11. OVP COMP6 In CH6, When LED is OPEN, INV6 become L and output voltage increase suddenly. If this condition continue,Lx6 voltage increase and exceed break down voltage. CH6 have Over voltage protection (OVP).When VOUT6 pin is inputted over 28Vtyp,OVP stop CH6 function..OVP latch CH6 function and reset by All STB=L www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 20 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●PIN equivalent circuit VOUT6 （CH6 OVP monitor terminal） INV5,INV6 (Error amplifier’s inversion input) STB1234 (operating when CH1～4 ON/OFF switch is High) Vo1 （CH1 Output voltage Feed-back pin） Vo3 （CH3 Output voltage Feed-back pin） Vo2 （CH2 Output voltage Feed-back pin） VCCOUT Vo2 274.09kΩ 60.91kΩ Hx1,2BAT,3,45,VOUT2 (Pch FET source terminal) Lx1,21,22,3,4,5(Nch,Pch FET drain terminal) PGND1,2,345 (output stage earthing terminal) Vo4 （CH4 Output voltage Feed-back pin） Hx,VOUT2 Lx VCCOUT PGND Fig26. PIN equivalent circuit (1) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 21 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL INV7（CH7 Error amplifier’s inversion input） LED（LED cathode connection terminal） Lx6 (Nch FET drain terminal) PGND6 (output stage earthing terminal) Hx1,2BAT(Pch FET source terminal) Lx1,21(Nch,Pch FET drain terminal) PGND1,2 (output stage earthing terminal) VOSEL4（CH4 initial Output voltage control pin） SEQ_CTL（Sequence control terminal） REGOUT （LDO output terminal） SCL （2 Line serial clock Input Pin） VDD SCL SDA （2 Line serial data Input Pin） VDD SDA Fig.27 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 PIN equivalent circuit (2) 22 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Usage Notes 1.） Absolute Maximum Ratings Although the quality of this product has been tightly controlled, deterioration or even destruction may occur if the absolute maximum ratings, such as for applied pressure and operational temperature range, are exceeded. open mode destruction conditions. Furthermore, we are unable to assume short or If special modes which exceed the absolute maximum ratings are expected, physical safely precautions such as fuses should be considered. 2.） GND Potential The potential of the GND pin should be at the minimum potential during all operation status In addition, please try to do not become electric potential below GND for the terminal other than NON5 including the transient phenomenon in practice. Please do not go down below 0.3V for the NON5 terminal with transient phenomenon and the like when you use. 3.） Heat Design Heat design should consider tolerance dissipation (Pd) during actual use and margins which should be set with plenty of room. 4.） Short-circuiting Between Terminals and Incorrect Mounting When attaching to the printed substrate, pay special attention to the direction and proper placement of the IC. If the IC is attached incorrectly, it may be destroyed. Destruction can also occur when there is a short, which can be caused by foreign objects entering between outputs or an output and the power GND. 5.） Operation in Strong Magnetic Fields Exercise caution when operating in strong magnet fields, as errors can occur. 6.） About common impedance Please do sufficient consideration for the wiring of power source and GND with the measures such as lowering common impedance, making ripple as small as possible (making the wiring as thick and short as possible, dropping ripple from L.C) and the like. 7.）STB terminal voltage When you set each channel to standby, set STB terminal voltage as less than 0.3V, and when you set each channel to active, set STB terminal voltage as more than 1.5V. Use capacitor less than 0.01uF, when you connect STB terminal to capacitor. It becomes a cause of malfunction. 8.) Heat Protection Circuit (TSD circuit) This IC has a built-in Temperature Protection Circuit (TSD circuit). The temperature protection circuit (TSD circuit) is only to cut off the IC from thermal runaway, and has not been designed to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation in mind. 9.) Rush current at the time of power supply injection. An IC which has plural power supplies, or CMOS IC could have momentary rush current at the time of power supply injection. Please take care about power supply coupling capacity and width of power Supply and GND pattern wiring. 10.) Influence by strong light When large amount of light like strobe is come in，IC can act under wrong operation. Please make light removal system and check operations adequately. 11.) IC Terminal Input This IC is a monolithic IC, and between each element there is a P+ isolation and P substrate for element separation. There is a P-N junction formed between this P-layer and each element’s N-layer, which makes up various parasitic elements. For example, when resistance and transistor are connected with a terminal as in figure 36: 〇 When GND>(terminal A) at the resistance, or GND>(terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode. 〇 Also, when GND>(terminal B) at the transistor, a parasitic NPN transistor operates by the N-layer of other elements close to the aforementioned parasitic diode. With the IC’s configuration, the production of parasitic elements by the relationships of the electrical potentials is inevitable. The operation of the parasitic elements can also interfere with the circuit operation, leading to malfunction and even destruction. Therefore, uses which cause the parasitic elements to operate, such as applying voltage to the input terminal which is lower than the GND(P-substrate), should be avoided. Transistor (NPN) （ Terminal B） B E C ～ Resistor P＋ N P N P＋ P＋ N Ｎ P N P＋ Parasitic element （ Terminal A） N P-board Parasitic element P-board GND N ～ ～ （ Terminal A） GND Parasitic element GND Fig. 28 Simplified structure of a Bipolar IC www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 23 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 BD9361GUL ●Thermal Derating Curves When mounted on a glass epoxy PCB of 50mm×50 mm×1.74 mm Should be derated by 10.0mW/ ℃ at Ta=25℃ or more. Heat design should consider tolerance dissipation (Pd) during actual use and margins which should be set with plenty of room. Fig.29 Power dissipation ●Ordering Information B D 9 3 6 1 G U L - E2 Package GUL: VCSP50L3 Packaging and forming specification E2: Embossed tape and reel ●Package and Marking Diagram 0.1±0.05 BD9361 0.55MAX Lot No. 3.14±0.05 1PIN MARK S 0.06 S 36-φ0.25±0.05 0.05 AB A F E D C B A (φ0.15)INDEX POST B P=0.5×5 0.32±0.05 3.14±0.05 12 3 4 5 6 0.32±0.05 Fig.30 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 P=0.5×5 Package and Marking Diagram 24 TSZ02201-0Q2Q0A400010-1-2 2011.12.22 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.