ON NSVRB751S40T1G Schottky barrier diode Datasheet

RB751S40
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
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Features
•
•
•
•
•
•
Extremely Fast Switching Speed
Extremely Low Forward Voltage − 0.28 V (Typ) @ IF = 1.0 mAdc
Low Reverse Current
Lead−Free Plating
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
40 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
1
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VRM
40
V
Reverse Voltage
VR
30
V
Forward Continuous Current (DC)
IF
30
mA
IFSM
500
mA
Peak Reverse Voltage
Peak Forward Surge Current
2
ANODE
SOD−523
CASE 502
STYLE 1
MARKING DIAGRAM
5E MG
G
ESD Rating: Class 1C per Human Body Model
Class A per Machine Model
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
(Note 1) TA = 25°C
Derate above 25°C
PD
200
mW
1.57
mW/°C
635
°C/W
Thermal Resistance,
Junction−to−Ambient
RqJA
Junction and Storage
Temperature Range
TJ, Tstg
1
5E = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
RB751S40T1G
SOD−523
(Pb−Free)
3000 / Tape &
Reel
NSVRB751S40T1G
SOD−523
(Pb−Free)
3000 / Tape &
Reel
RB751S40T5G
SOD−523
(Pb−Free)
8000 / Tape &
Reel
°C
−55 to +150
2
1. FR−5 Minimum Pad.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 6
1
Publication Order Number:
RB751S40T1/D
RB751S40
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
V(BR)R
30
−
−
V
Total Capacitance
(VR = 1.0 V, f = 1.0 MHz)
CT
−
2.0
2.5
pF
Reverse Leakage
(VR = 30 V)
IR
−
300
500
nAdc
Forward Voltage
(IF = 1.0 mAdc)
VF
−
0.28
0.37
Vdc
Characteristic
Reverse Breakdown Voltage
(IR = 10 mA)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1000
IR , REVERSE CURRENT (μA)
1.0
150°C
TA = 150°C
100
125°C
10
85°C
1.0
0.1
25°C
0.01
125°C
85°C
25°C
-40°C
-55°C
0.3
0.4
0.001
0.1
0
0.05
0.1
0.15
0.2
0.25
0.35
0.45
0.5
5
0
10
15
20
25
VR, REVERSE VOLTAGE (VOLTS)
VF, FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
2.5
2.0
1.5
1.0
0.5
0
0
2.0
4.0
30
Figure 2. Reverse Current versus Reverse
Voltage
3.0
C T, CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
10
6.0
8.0
10
12
14
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
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2
16
18
35
RB751S40
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
2X
b
0.08
1
M
2
X Y
DIM
A
b
c
D
E
HE
L
L2
TOP VIEW
A
c
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
HE
SIDE VIEW
2X
RECOMMENDED
SOLDERING FOOTPRINT*
L
2X
1.80
0.48
2X
0.40
2X
L2
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
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and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
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Sales Representative
RB751S40T1/D
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