Material Content Data Sheet Sales Product Name IPD30N03S4L-09 MA# MA000476390 Package PG-TO252-3-11 Issued 29. August 2013 Weight* 389.69 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 0.783 0.20 0.140 0.04 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.20 2010 2010 359 0.042 0.01 139.706 35.84 35.89 358501 108 358968 1.251 0.32 0.32 3211 3211 1.483 0.38 3805 25.948 6.66 120.843 31.01 38.05 310097 380487 3.740 0.96 0.96 9597 9597 0.091 0.02 0.000 0.00 0.026 0.01 0.021 0.01 1.008 0.26 0.028 0.01 0.095 0.02 94.488 24.25 66585 233 0.02 1 54 0.28 2587 2. 3. 243 24.28 242468 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2709 73 Important Remarks: 1. 234 68 242784 1000000