TI1 LP5990TMX-3.0/NOPB Lp5990 micropower 200ma cmos low dropout voltage regulator Datasheet

LP5990
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SNVS438B – APRIL 2007 – REVISED DECEMBER 2007
LP5990 Micropower 200mA CMOS Low Dropout Voltage Regulator
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FEATURES
DESCRIPTION
•
•
•
The LP5990 regulator is designed to meet the
requirements of portable, battery-powered systems
providing an accurate output voltage, low noise and
low quiescent current.
1
2
•
•
•
•
•
•
•
•
•
•
Operation from 2.2V to 5.5V Input
±1% Accuracy Over Temp Range
Output Voltage from 0.8V to 3.6V in 50mV
Increments
30 μA Quiescent Current (Enabled)
10nA Quiescent Current (Disabled)
160mV Dropout at 200mA Load
60 μVRMSOutput Voltage Noise
60 μs Start-Up Time
500μs Shut-Down Time
PSRR 55 dB at 10 kHz
Stable with 0402 1.0µF Ceramic Capacitors
Logic Controlled Enable
Thermal–Overload and Short–Circuit
Protection
The LP5990 will provide a 1.8V output from a low
input voltage of 2.2V and can provide 200mA to an
external load.
When switched into shutdown mode via a logic signal
at the enable pin, the power consumption is reduced
to virtually
zero.
Fast shut-down is achieved by the push pull
architecture.
The LP5990 is designed to be stable with space
saving 0402 ceramic capacitors as small as 1µF, this
gives an overall solution size of < 2.5mm 2.
Performance is specified for a -40°C to 125°C
junction temperature range.
APPLICATIONS
•
•
Cellular Phones
Hand–Held Information Appliances
The device is available in DSBGA Package (0.4mm
pitch)
and
is
available
with
1.2V,1.3V,1.8V,2.8V,3.0V,3.3V and 3.6V outputs.
Lower voltage options down to 0.8V are available on
request. For all other output voltage options please
contact your local TI sales office.
PACKAGE
•
4-Bump DSBGA, 0.4 mm Pitch 866 µm x 917
µm (Lead Free)
TYPICAL APPLICATION CIRCUIT
VIN
VIN
1.0 µF
CIN
VOUT
VOUT
LP5990
1.0 µF
COUT
VEN
VEN
Capacitor Case
Size = 0402
GND
GND
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
LP5990
SNVS438B – APRIL 2007 – REVISED DECEMBER 2007
www.ti.com
CONNECTION DIAGRAMS
Figure 1. 4-Bump Thin DSBGA Package, 0.4mm pitch
Package Number YFQ0004CEA
VIN
VEN
VEN
VIN
B2
A2
A2
B2
B1
A1
GND
A1
GND
VOUT
VOUT
Bottom View
B1
Top View
The actual physical placement of the package marking will vary from part to part.
PIN DESCRIPTIONS
Pin No.
Symbol
Name and Function
DSBGA
VEN
Enable input; disables the regulator when ≤ 0.35V. Enables the regulator when ≥ 1.0V.
A1
GND
Common ground.
B1
VOUT
Output voltage. A 1.0 μF Low ESR capacitor should be connected to this Pin. Connect
this output to the load circuit.
B2
VIN
A2
Input voltage supply. A 1.0 µF capacitor should be connected at this input.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1) (2) (3)
VIN Pin: Input Voltage
-0.3 to 6.0V
VOUT Pin: Output Voltage
-0.3 to (VIN + 0.3V) to 6.0V (max)
VEN Pin: Enable Input Voltage
Continuous Power Dissipation
-0.3 to 6.0V (max)
(4)
Internally Limited
Junction Temperature (TJMAX)
150°C
Storage Temperature Range
-65 to 150°C
Maximum Lead Temperature (Soldering, 10 sec.)
ESD Rating
(5)
260°C
Human Body Model
Machine Model
(1)
(2)
(3)
(4)
(5)
2
2 kV
200V
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits
and associated test conditions, see the Electrical Characteristics tables.
All voltages are with respect to the potential at the GND pin.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Internal thermal shutdown circuitry protects the device from permanent damage.
The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
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OPERATING RATINGS
(1) (2)
,
VIN: Input Voltage Range
2.2V to 5.5V
VEN: Enable Voltage Range
Recommended Load Current
0 to 5.5V (max)
(3)
0 to 200 mA
Junction Temperature Range (TJ)
Ambient Temperature Range (TA)
(1)
-40°C to +125°C
(3)
-40°C to +85°C
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits
and associated test conditions, see the Electrical Characteristics tables.
All voltages are with respect to the potential at the GND pin.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). See applications section.
(2)
(3)
THERMAL PROPERTIES
Junction to Ambient Thermal Resistance θJA (1)
JEDEC Board (DSBGA)
(2)
100.6°C/W
4L Cellphone Board (DSBGA)
(1)
174.8°C/W
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
Detailed description of the board can be found in JESD51-7
(2)
ELECTRICAL CHARACTERISTICS
Limits in standard typeface are for TA = 25°C. Limits in boldface type apply over the full operating junction temperature range
(-40°C ≤ TJ ≤ +125°C). Unless otherwise noted, specifications apply to the LP5990 Typical Application Circuit (pg. 1) with: VIN
= VOUT (NOM) + 1.0V, or 2.2V, whichever is higher. VEN = 1.0V, CIN = COUT = 1.0 μF, IOUT = 1.0 mA. (1), (2)
Symbol
Parameter
Conditions
Min
Typ
VIN
Input Voltage
ΔVOUT
Output Voltage Tolerance
VIN = (VOUT(NOM) + 1.0V) to 5.5V
Line Regulation
VIN = (VOUT(NOM) + 1.0V) to 5.5V, IOUT = 1
mA
1
Load Regulation
IOUT = 1 mA to 200 mA
5
ILOAD
Load Current
See
(3)
Quiescent Current
V
−1
1
%
VEN = 1.0V, IOUT = 0 mA
0.01
Dropout Voltage (5)
IOUT = 200 mA
160
ISC
Short Circuit Current Limit
See (6)
600
Output Noise Voltage
TSHUTDOWN
(7)
Thermal Shutdown
mV
(7)
75
35
VEN = <0.35V (Disabled)
VDO
Power Supply Rejection Ratio
15
mA
30
VEN = 1.0V, IOUT = 200 mA
en
mV
200
(4)
PSRR
Units
5.5
0
Maximum Output Current
IQ
Max
2.2
µA
250
mV
mA
f = 10 kHz, IOUT = 200 mA
55
dB
BW = 10 Hz to 100
kHz, VIN = 4.2V, IOUT =
1 mA
V OUT = 1.8V
60
μVRMS
V OUT = 2.8V
85
Temperature
160
Hysteresis
20
°C
Enable Input Thresholds
VIL
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Low Input Threshold (VEN)
VIN = 2.2V to 5.5V
0.35
V
All voltages are with respect to the potential at the GND pin.
Min and Max limits are specified by design, test, or statistical analysis. Typical numbers are not specified, but do represent the most
likely norm.
The device maintains a stable, regulated output voltage without a load current.
Quiescent current is defined here as the difference in current between the input voltage source and the load at VOUT.
Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its
nominal value. This parameter only applies to output voltages above 2.8V.
Short Circuit Current is measured with VOUT pulled to 0V.
This specification is ensured by design.
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ELECTRICAL CHARACTERISTICS (continued)
Limits in standard typeface are for TA = 25°C. Limits in boldface type apply over the full operating junction temperature range
(-40°C ≤ TJ ≤ +125°C). Unless otherwise noted, specifications apply to the LP5990 Typical Application Circuit (pg. 1) with: VIN
= VOUT (NOM) + 1.0V, or 2.2V, whichever is higher. VEN = 1.0V, CIN = COUT = 1.0 μF, IOUT = 1.0 mA. (1), (2)
Symbol
Parameter
Conditions
VIH
High Input Threshold (VEN)
IEN
Input Current at VEN Pin
(8)
Min
Typ
Max
VEN = 5.5V and VIN = 5.5V
2
5
VEN = 0.0V and VIN = 5.5V
0.001
VIN = 2.2V to 5.5V
1.0
Units
V
μA
Transient Characteristics
ΔVOUT
Line Transient
Load Transient
(7)
(7)
Trise = Tfall = 30μs. ΔVIN = 600 mV
4
IOUT = 1 mA to 200 mA in 1 μs
–50
IOUT = 200 mA to 1 mA in 1 μs
50
mV
mV
TON
Turn on Time
To 98% of VOUT(NOM)
60
μs
TOFF
Turn off Time from Enable
100mV of V OUT(NOM)I OUT= 0mA
500
μs
(8)
There is a 3 MΩ resistor between VEN and ground on the device.
OUTPUT & INPUT CAPACITOR, RECOMMENDED SPECIFICATIONS (1)
Symbol
Parameter
CIN
Input Capacitance
COUT
Output Capacitance
ESR
Output/Input Capacitance
(1)
4
Conditions
Min
Nom
Capacitance for stability
0.3
1.0
0.3
1.0
5
Max
Units
µF
10
500
mΩ
The minimum capacitance should be greater than 0.3 µF over the full range of operating conditions. The capacitor tolerance should be
30% or better over the full temperature range. The full range of operating conditions for the capacitor in the application should be
considered during device selection to ensure this minimum capacitance specification is met. X7R capacitors are recommended however
capacitor types X5R, Y5V and Z5U may be used with consideration of the application and conditions.
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TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise specified,CIN = COUT = 1.0µF, VIN = VOUT(NOM) + 1.0V, VEN = 1.0V, IOUT = 1mA , T A = 25°C.
Output Voltage Change vs Temperature
Ground Current vs Load Current
Figure 2.
Figure 3.
Ground Current vs V IN.I LOAD= 1mA
Ground Current vs VIN. I LOAD = 200mA
Figure 4.
Figure 5.
Dropout Voltage
Load Transient Response VOUT = 2.8V
Figure 6.
Figure 7.
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SNVS438B – APRIL 2007 – REVISED DECEMBER 2007
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified,CIN = COUT = 1.0µF, VIN = VOUT(NOM) + 1.0V, VEN = 1.0V, IOUT = 1mA , T A = 25°C.
6
Load Transient Response. VOUT = 2.8V
Short Circuit Current
Figure 8.
Figure 9.
Line Transient Response
Line Transient Response
Figure 10.
Figure 11.
Start-up Time
Shutdown Characteristics
Figure 12.
Figure 13.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified,CIN = COUT = 1.0µF, VIN = VOUT(NOM) + 1.0V, VEN = 1.0V, IOUT = 1mA , T A = 25°C.
Power Supply Rejection ratio
Output Noise Density
Figure 14.
Figure 15.
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LP5990
SNVS438B – APRIL 2007 – REVISED DECEMBER 2007
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APPLICATION HINTS
POWER DISSIPATION AND DEVICE OPERATION
The permissible power dissipation for any package is a measure of the capability of the device to pass heat from
the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus the power
dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces
between the die and ambient air. As stated in Note 3 of the Operating Ratings table, the allowable power
dissipation for the device in a given package can be calculated using the equation:
(TJMAX - TA)
PD =
TJA
The actual power dissipation across the device can be represented by the following equation:
PD = (VIN – VOUT) x IOUT
This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage
drop across the device, and the continuous current capability of the device. These two equations should be used
to determine the optimum operating conditions for the device in the application.
EXTERNAL CAPACITORS
Like any low-dropout regulator, the LP5990 requires external capacitors for regulator stability. The LP5990 is
specifically designed for portable applications requiring minimum board space and smallest components. These
capacitors must be correctly selected for good performance.
INPUT CAPACITOR
An input capacitor is required for stability. The input capacitor should be at least equal to or greater than the
output capacitor. It is recommended that a 1.0 µF capacitor be connected between the LP5990 input pin and
ground.
This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean
analogue ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
Important: To ensure stable operation it is essential that good PCB practices are employed to minimize ground
impedance and keep input inductance low. If these conditions cannot be met, or if long leads are to be used to
connect the battery or other power source to the LP5990, then it is recommended to increase the input capacitor
to at least 2.2µF. Also, tantalum capacitors can suffer catastrophic failures due to surge current when connected
to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at
the input, it must be ensured by the manufacturer to have a surge current rating sufficient for the application.
There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and
temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain
0.3 μF over the entire operating temperature range.
OUTPUT CAPACITOR
The LP5990 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor
(dielectric types X5R or X7R) 1.0 μF, and with ESR between 5 mΩ to 500 mΩ, is suitable in the LP5990
application circuit.
Other ceramic capacitors such as Y5V and Z5U are less suitable owing to their inferior temperature
characteristics. (See section in Capacitor Characteristics).
For this device the output capacitor should be connected between the VOUT pin and a good ground connection
and should be mounted within 1 cm of the device.
It may also be possible to use tantalum or film capacitors at the device output, VOUT, but these are not as
attractive for reasons of size and cost (see the section Capacitor Characteristics).
The output capacitor must meet the requirement for the minimum value of capacitance (0.3μF) and have an ESR
value that is within the range 5 mΩ to 500 mΩ for stability.
8
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CAPACITOR CHARACTERISTICS
The LP5990 is designed to work with ceramic capacitors on the input and output to take advantage of the
benefits they offer. For capacitance values in the range of 1.0 μF to 4.7 μF, ceramic capacitors are the smallest,
least expensive and have the lowest ESR values, thus making them best for eliminating high frequency noise.
The ESR of a typical 1.0 μF ceramic capacitor is in the range of 20 mΩ to 40 mΩ, which easily meets the ESR
requirement for stability for the LP5990
For both input and output capacitors careful interpretation of the capacitor specification is required to ensure
correct device operation. The capacitor value can change greatly depending on the conditions of operation and
capacitor type.
In particular the output capacitor selection should take account of all the capacitor parameters to ensure that the
specification is met within the application.Capacitance value can vary with DC bias conditions as well as
temperature and frequency of operation. Capacitor values will also show some decrease over time due to aging.
The capacitor parameters are also dependant on particular case size with smaller sizes giving poorer
performance figures in general. As an example Figure 16 shows a typical graph showing a comparison of
capacitor case sizes in a Capacitance versus DC Bias plot. As shown in the graph, as a result of the DC Bias
condition, the capacitance value may drop below the minimum capacitance value given in the recommended
capacitor table (0.3µF in this case). Note that the graph shows the capacitance out of spec for the 0402 case
size capacitor at higher bias voltages. It is therefore recommend that the capacitor manufacturer's specifications
for the nominal value capacitor are consulted for all conditions as some capacitors may not be suited in the
application.
The temperature performance of ceramic capacitors varies by type and manufacturer. Most large value ceramic
capacitors (≥2.2 µF) are manufactured with Z5U or Y5V temperature characteristics, which results in the
capacitance dropping by more than 50% as the temperature goes from 25°C to 85°C.
A better choice for temperature coefficient in a ceramic capacitor is X7R. This type of capacitor is the most stable
and holds the capacitance within ±15% over the temperature range. Tantalum capacitors are less desirable than
ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance
and voltage ratings in the 0.47 μF to 4.7 μF range.
CAP VALUE (% OF NOM. 1 µF)
Another important consideration is that tantalum capacitors have higher ESR values than equivalent size
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the
stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic
capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about
2:1 as the temperature goes from 25°C down to −40°C, so some guard band must be allowed.
0603, 10V, X5R
100%
80%
60%
0402, 6.3V, X5R
40%
20%
_0
1.0
3.0
_
DC Bias (V)
2.0_
4.0
_
5.0
_
Figure 16.
NO-LOAD STABILITY
The LP5990 will remain stable and in regulation with no external load.
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ENABLE CONTROL
The LP5990 may be switched ON or OFF by a logic input at the ENABLE pin, VEN . A high voltage at this pin will
turn the device on. When the enable pin is low, the regulator output is off and the device typically consumes 3
nA. If the application does not require the shutdown feature, the VEN pin should be tied to VIN to keep the
regulator output permanently on.
The signal source used to drive the VEN input must be able to swing above and below the specified turn-on/off
voltage thresholds listed in the Electrical Characteristics section under VIL and VIH.
DSBGA MOUNTING
The DSBGA package requires specific mounting techniques, which are detailed in TI Application Note AN-1112
(SNVA009).
For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the
DSBGA device.
DSBGA LIGHT SENSITIVITY
Exposing the DSBGA device to direct light may cause incorrect operation of the device. Light sources such as
halogen lamps can affect electrical performance if they are situated in proximity to the device.
Light with wavelengths in the red and infra-red part of the spectrum have the most detrimental effect thus the
fluorescent lighting used inside most buildings has very little effect on performance.
10
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
(3)
(4)
LP5990TM-1.2/NOPB
ACTIVE
DSBGA
YFQ
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TM-1.3/NOPB
ACTIVE
DSBGA
YFQ
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TM-1.8/NOPB
ACTIVE
DSBGA
YFQ
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TM-2.8/NOPB
ACTIVE
DSBGA
YFQ
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TM-3.0/NOPB
ACTIVE
DSBGA
YFQ
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TM-3.3/NOPB
ACTIVE
DSBGA
YFQ
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TM-3.6/NOPB
ACTIVE
DSBGA
YFQ
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TMX-1.2/NOPB
ACTIVE
DSBGA
YFQ
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TMX-1.3/NOPB
ACTIVE
DSBGA
YFQ
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TMX-1.8/NOPB
ACTIVE
DSBGA
YFQ
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TMX-2.8/NOPB
ACTIVE
DSBGA
YFQ
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TMX-3.0/NOPB
ACTIVE
DSBGA
YFQ
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TMX-3.3/NOPB
ACTIVE
DSBGA
YFQ
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP5990TMX-3.6/NOPB
ACTIVE
DSBGA
YFQ
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
Top-Side Markings
Samples
PACKAGE OPTION ADDENDUM
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11-Apr-2013
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
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Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LP5990TM-1.2/NOPB
DSBGA
YFQ
4
250
178.0
8.4
LP5990TM-1.3/NOPB
DSBGA
YFQ
4
250
178.0
LP5990TM-1.8/NOPB
DSBGA
YFQ
4
250
178.0
LP5990TM-2.8/NOPB
DSBGA
YFQ
4
250
LP5990TM-3.0/NOPB
DSBGA
YFQ
4
LP5990TM-3.3/NOPB
DSBGA
YFQ
LP5990TM-3.6/NOPB
DSBGA
YFQ
LP5990TMX-1.2/NOPB
DSBGA
LP5990TMX-1.3/NOPB
LP5990TMX-1.8/NOPB
0.92
0.99
0.7
4.0
8.0
Q1
8.4
0.92
0.99
0.7
4.0
8.0
Q1
8.4
0.92
0.99
0.7
4.0
8.0
Q1
178.0
8.4
0.92
0.99
0.7
4.0
8.0
Q1
250
178.0
8.4
0.92
0.99
0.7
4.0
8.0
Q1
4
250
178.0
8.4
0.92
0.99
0.7
4.0
8.0
Q1
4
250
178.0
8.4
0.92
0.99
0.7
4.0
8.0
Q1
YFQ
4
3000
178.0
8.4
0.92
0.99
0.7
4.0
8.0
Q1
DSBGA
YFQ
4
3000
178.0
8.4
0.92
0.99
0.7
4.0
8.0
Q1
DSBGA
YFQ
4
3000
178.0
8.4
0.92
0.99
0.7
4.0
8.0
Q1
LP5990TMX-2.8/NOPB
DSBGA
YFQ
4
3000
178.0
8.4
0.92
0.99
0.7
4.0
8.0
Q1
LP5990TMX-3.0/NOPB
DSBGA
YFQ
4
3000
178.0
8.4
0.92
0.99
0.7
4.0
8.0
Q1
LP5990TMX-3.3/NOPB
DSBGA
YFQ
4
3000
178.0
8.4
0.92
0.99
0.7
4.0
8.0
Q1
LP5990TMX-3.6/NOPB
DSBGA
YFQ
4
3000
178.0
8.4
0.92
0.99
0.7
4.0
8.0
Q1
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP5990TM-1.2/NOPB
DSBGA
YFQ
4
250
210.0
185.0
35.0
LP5990TM-1.3/NOPB
DSBGA
YFQ
4
250
210.0
185.0
35.0
LP5990TM-1.8/NOPB
DSBGA
YFQ
4
250
210.0
185.0
35.0
LP5990TM-2.8/NOPB
DSBGA
YFQ
4
250
210.0
185.0
35.0
LP5990TM-3.0/NOPB
DSBGA
YFQ
4
250
210.0
185.0
35.0
LP5990TM-3.3/NOPB
DSBGA
YFQ
4
250
210.0
185.0
35.0
LP5990TM-3.6/NOPB
DSBGA
YFQ
4
250
210.0
185.0
35.0
LP5990TMX-1.2/NOPB
DSBGA
YFQ
4
3000
210.0
185.0
35.0
LP5990TMX-1.3/NOPB
DSBGA
YFQ
4
3000
210.0
185.0
35.0
LP5990TMX-1.8/NOPB
DSBGA
YFQ
4
3000
210.0
185.0
35.0
LP5990TMX-2.8/NOPB
DSBGA
YFQ
4
3000
210.0
185.0
35.0
LP5990TMX-3.0/NOPB
DSBGA
YFQ
4
3000
210.0
185.0
35.0
LP5990TMX-3.3/NOPB
DSBGA
YFQ
4
3000
210.0
185.0
35.0
LP5990TMX-3.6/NOPB
DSBGA
YFQ
4
3000
210.0
185.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
YFQ0004xxx
D
0.600±0.075
E
TMD04XXX (Rev A)
D: Max = 0.936 mm, Min =0.876 mm
E: Max = 0.902 mm, Min =0.842 mm
4215073/A
NOTES:
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
www.ti.com
12/12
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