Material Content Data Sheet Sales Product Name TLE4961-3K MA# MA000935468 Package PG-SC59-3-5 Issued 29. August 2013 Weight* 13.84 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon silicon titanium chromium copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 0.350 2.52 0.001 0.01 0.005 0.04 380 0.016 0.11 1139 5.236 37.82 37.98 378229 379824 0.028 0.20 0.20 2000 2000 0.077 0.55 1.648 11.90 5.940 42.93 55.38 429107 553686 0.255 1.84 1.84 18439 18439 0.158 1.14 1.14 11380 11380 0.023 0.16 wire encapsulation leadfinish plating glue *deviation 0.108 0.78 Sum [%] Average Mass [ppm] Sum [ppm] 2.52 25249 25249 76 5537 119042 1649 0.94 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7773 9422 1000000