Material Content Data Sheet Sales Product Name ESD202-B1-CSP01005 E6327 MA# MA001262604 Package SG-WLL-2-2 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip pad inorganic material inorganic material noble metal noble metal non noble metal < 10% silicon phosphorus gold palladium nickel 7440-21-3 7723-14-0 7440-57-5 7440-05-3 7440-02-0 *deviation 18. May 2015 0.04 mg Weight [mg] Average Mass [%] Sum [%] Average Mass [ppm] Sum [ppm] 92.40 923936 923936 0.039 92.40 0.000 0.13 1339 0.000 0.14 1410 0.000 0.88 0.003 6.45 8788 7.60 64527 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 76064 1000000