MLX90809 Relative Pressure Sensor Features and Benefits Application Examples High accuracy relative pressure sensor (+/1.5%FSO) Ratiometric Analog Output or digital SENT output Fully integrated IC: MEMS, analog front end circuitry, 16 bit microcontroller, analog back end circuitry, voltage regulators Large automotive temperature range (-40°C to 150°C) Automotive qualified and automotive diagnostic features (clamping levels, broken track diagnostics, multiple internal fault diagnostics) Factory calibrated and/or fully programmable through the connector for customized calibration curves Back side exposed relative pressure sensor for higher resistance to common automotive media Assembled in a robust easy to seal package Automotive applications Vacuum measurement Clogged filter detection Seat lumbar cushion sensor Industrial applications Vacuum sensor Process monitoring Fluid pressure (low pressure/high accuracy) Consumer/Home appliance applications Filter monitoring Dispensing/metering systems White goods Ordering Information Part No. MLX90809 MLX90809 MLX90809 Temperature Code L (-40°C to 150°C) L (-40°C to 150°C) L (-40°C to 150°C) Option code legend: Rev 002 390109080901 Package Code XG XG XG Option Code EAD-000 EAD-003 EAD-100 Packing Form Code RE RE RE EAD-000 = 0.05 to -1.05 bar relative pressure / 0.5 to 4.5 V analog output EAD-003 = 0 to 1 bar relative pressure / 0.5 to 4.5 V analog output EAD-100 = 0.05 to -1.2 bar relative pressure / 193 to 3896 LSB SENT output Page 1 of 11 Data Sheet Oct/14 MLX90809 Relative Pressure Sensor 1 Functional Diagram 2 General Description Broken wire detection Test Temperature sensor Piezoresistive sensing element OPA Micro controller M U X ADC 16 bits Analog driver Gain & Offset temperature compensation Pressure Linearization DAC Analog Output Gain 12 bits Programmable filter Diagnostics Logic Diagnostic signals Vext Analog & Digital Regulator and POR DSP Gain & Offset compensation Overvoltage & reverse voltage protection Rom FW EE PROM SENT driver Ram Slew rate control SENT Output Ground The MLX90809 is a packaged, factory calibrated, integrated relative pressure sensor delivering a ratiometric analog or digital (using the SENT protocol) signal. Use of an optimized architecture and a high density CMOS technology imparts the 90809 with best in class automotive EMC performance. A DSP based architecture using a 16bit microcontroller provides outstanding performance. A smart package and die assembly concept suits applications with stringent automotive temperature and stress conditions needing small drift over life. 3 Glossary of Terms Bar: Pressure unit (1bar = 100kPa) ADC: Analog to Digital Converter DAC: Digital to Analog Converter DSP: Digital Signal Processor EMC: Electro Magnetic Compatibility SENT: Single Edge Nibble Transmission FSO: Full Span Output 4 Absolute Maximum Ratings Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximumrated conditions for extended periods may affect device reliability. Parameter Remarks Value Supply Voltage (overvoltage) Remark 1 18 Reverse Voltage Protection Remark 2 -14 Positive output voltage Remark 1 18 Reverse output voltage Remark 1 -0.5 Operating Temperature Range -40 to 150 Storage Temperature Range -40 to 150 Burst pressure (Room Temperature) 5 (AEC Q100 002) Table 1: Absolute maximum ratings Units V V V V C C Bar Remark 1: No time limit or temperature limit for these over voltage conditions. Remark 2: Reverse Voltage Protection at -14V at 150C for maximum 1 hour. At Room Temperature that condition can apply for maximum 24 hours. Rev 002 390109080901 Page 2 of 11 Data Sheet Oct/14 MLX90809 Relative Pressure Sensor 5 Pin Definitions and Descriptions ZZZZZZZZZZ ZZZZZZZZZZ Symbol VVVVV-vvv YYWW YYWW Function / Description Device used- design revision YY Year of assembly WW Calendar week of assembly ZZZZZZZZZZ Wafer lot number MLXVVVVV-vvv MLXVVVVV-vvv Figure 1: Package marking and pin out (Top view: left; Bottom view: right) Pin number 1 2 3 4 5 6 7 8 Description SENT output SENT output Supply Input Test pin Not connected Ground Analog output Analog output Pin number 16 15 14 13 12 11 10 9 Description SENT output SENT output Supply Input Test pin Not connected Ground Analog output Analog output Table 2: Pin out definitions and descriptions Only one of the application pins needs to be connected: one of the Supply Input pins (3 or 14), one of the Ground pins (6 or 11) and one of the selected (either analog (7,8,9,10) or SENT(1,2,15,16)) output pins. See section 9 for the detailed information on the application pins connections. Symbol VVVVV-vvv Function / Description Device used- design revision YY Year of assembly WW Calendar week of assembly ZZZZZZZZZZ Wafer lot number Table 3: Package label definition Rev 002 390109080901 Page 3 of 11 Data Sheet Oct/14 MLX90809 Relative Pressure Sensor 6 General Electrical Specifications ° ° DC Operating Parameters TA = -40 C to 150 C, VDD = 5V (unless otherwise specified). Parameter Nominal supply voltage Nominal supply current Load resistance Capacitive load Diagnostic limits Clamping levels Analog saturation output level Symbol Vdd Idd Rload Cload Diag low Diag high Diag high Clamp low Clamp high Remarks Min 4.5 No output load connected Pull up or Pull down 4.7 2.2 Pull up > 4.7kOhm Pull down>4.7kOhm Pull down>10kOhm Programmable range with 8 bit resolution for the low clamping level, 9 for the high (for the default programmed levels see section 8), +/-10mV accuracy on the programmed clamping level 96 98 0 50 Vsat high Vsat low Typ 5 7 Max 5.5 8 25 100 Units V mA kOhm nF %Vdd %Vdd %Vdd %Vdd %Vdd 97 %Vdd 470 2 2 %Vdd Power up time Time from reaching minimum allowed supply voltage of 4.5V till having the output within specification 5.5 msec Response time Time needed for the output to react to a pressure change from 10% to 90% of its final value (pressure change corresponding to maximum a 4V output change). Using default filter settings SSF = 1, PFLT = 0. 1 msec Programmable pressure spans (Positive pressure on package top side, see remark 3, 5) The pressure spans defined correspond to an analog output span of 4V or to the 12 bit pressure information on the SENT output 0.5 1 bar Relative Programmable pressure spans (vacuum on package top side, see remark 3,5) The pressure spans defined correspond to an analog output span of 4V or to the 12 bit pressure information on the SENT output Remark 4 -0.5 bar Relative Overall accuracy Taking into account the drifts over temperature and over life 1.5 %FSO 0.2 %Vdd Ratiometricity error Output noise analog output BW limited to 50kHz. Using default filter settings SSF = 1, PFLT = 0. 2 mVrms Output noise SENT output BW limited to 50kHz. Using default filter settings SSF = 1, PFLT = 0. 1.8 LSBrms Table 4: Electrical specifications Remark 3: The top side of the package is defined as the side with the small hole and readable marking. Remark 4: There are no limitations on the vacuum level that the MLX90809 can measure. Remark 5: The pressure span is defined as being equal to UPL-LPL (upper pressure limit minus lower pressure limit like described for the default calibrated curve in paragraph 8). The atmospheric pressure should always belong to the programmed transfer function. Rev 002 390109080901 Page 4 of 11 Data Sheet Oct/14 MLX90809 Relative Pressure Sensor 7 Detailed General Description The pressure sensing element consists of a square diaphragm realized in the silicon chip by backside etching. The diaphragm reacts to a pressure difference between the top and bottom side of the diaphragm. The internal strain increases, in particular at the border of the diaphragm. Here, the piezo-resistive elements have been implanted into the silicon diaphragm, which act as a transducer. The electronics front end amplifies the signal from the bridge, performs a coarse offset compensation and an ADC conversion. The DSP performs the compensations over temperature. Furthermore, the digital circuit provides some filtering, the possibility to linearize the pressure signal and also implements the clamping function. The analog back end consists of a 12 bit DAC and an output driver. This chip delivers an analog output proportional to the pressure or a SENT output compliant with SAE J2716 spec dated January 2010. A broken wire detection block allows actively driving the output to one of the rails in case of a broken supply or ground connection. Extensive protection of the supply lines allows the MLX90809 to handle extreme overvoltage conditions and is immune to severe external disturbances. Several diagnostic functions (overvoltage, under-voltage, overpressure, under pressure detections) have been implemented on the 90809 and can be enabled by programming EEPROM settings. Figure 2 describes MLX90809 block diagram. Broken wire detection Test Temperature sensor Piezoresistive sensing element OPA Micro controller M U X ADC 16 bits Analog driver Gain & Offset temperature compensation Pressure Linearization DAC Analog Output Gain 12 bits Programmable filter Diagnostics Logic Diagnostic signals Vext Analog & Digital Regulator and POR DSP Gain & Offset compensation Overvoltage & reverse voltage protection Rom FW EE PROM SENT driver Ram Slew rate control SENT Output Ground Figure 2: MLX90809 block diagram Rev 002 390109080901 Page 5 of 11 Data Sheet Oct/14 MLX90809 Relative Pressure Sensor 8 Programmed Settings The MLX90809 is calibrated at the final manufacturing test step. During the calibration, settings are stored in the on chip (16x32bit) EEPROM to define the pressure transfer curve as well as the output clamping levels. Together with the transfer functions, the IC filter values are set. The default programmed filter settings lead to the noise level and response times described in paragraph 6. The transfer functions calibrated in the different MLX90809LXG-EAD-xxx products with its corresponding performance level maintained over the full temperature range and over life is described for each specific option code below. The MLX90809 can be programmed for pressure spans like those described in paragraph 6 with the atmospheric pressure always inside of the application range. Contact Melexis for information on the expected accuracy for other ranges or transfer functions than the default programmed ones. Melexis can support customers delivering parts calibrated with other settings or can support customers by delivering the necessary programming hardware, software and documentation to be able to program the transfer function on the customers manufacturing line. To learn how to use the Melexis hardware and software to program the MLX90809 read the application note “MLX90809 PTC04 Software Description”. 8.1 MLX90809LXG-EAD-000 ° ° DC Operating Parameters TA = -40 C to 150 C, VDD = 5V. Parameter Symbol Remarks Transfer curve: Figure 3 Pressure 1 P1 Pressure 2 P2 Output 1 O1 Output 2 O2 Parameter Symbol Remarks Low clamping level LCL High clamping level HCL Overall accuracy expressed as output value Output accuracy εo Overall accuracy expressed as pressure value Pressure accuracy εp Min 0.49 4.49 -60 -16.5 Value 0.05 -1.05 0.5 4.5 Typ Max 0.5 0.51 4.5 4.51 60 16.5 Unit Bar Bar V V Unit V V mV mBar Min 0.49 4.49 -60 -15 Value 0 1 0.5 4.5 Typ Max 0.5 0.51 4.5 4.51 60 15 Unit Bar Bar V V Unit V V mV mBar 8.2 MLX90809LXG-EAD-003 ° ° DC Operating Parameters TA = -40 C to 150 C, VDD = 5V. Parameter Symbol Remarks Transfer curve: Figure 4 Pressure 1 P1 Pressure 2 P2 Output 1 O1 Output 2 O2 Parameter Symbol Remarks Low clamping level LCL High clamping level HCL Overall accuracy expressed as output value Output accuracy εo Overall accuracy expressed as pressure value Pressure accuracy εp Rev 002 390109080901 Page 6 of 11 Data Sheet Oct/14 MLX90809 Relative Pressure Sensor 8.3 MLX90809LXG-EAD-100 ° ° DC Operating Parameters TA = -40 C to 150 C, VDD = 5V. Parameter Symbol Remarks Transfer curve: Figure 3 Pressure 1 P1 Pressure 2 P2 Output 1 O1 Output 2 O2 Low clamping level LCL High clamping level HCL Parameter Symbol Remarks Overall accuracy expressed as output value Output accuracy εo Overall accuracy expressed as pressure value Pressure accuracy εp Min -60 -20 Value 0.05 -1.20 193 3896 1 4088 Typ Max 60 20 Unit Bar Bar LSB LSB LSB LSB Unit LSB mBar Output HCL O2 εo εp LCL Relative Pressure in Bars O1 P2 P1 Figure 3: Transfer function negative pressure curve Output HCL O2 εo εp LCL Relative Pressure in Bars O1 P1 P2 Figure 4: Transfer function positive pressure curve Rev 002 390109080901 Page 7 of 11 Data Sheet Oct/14 MLX90809 Relative Pressure Sensor 9 Application Information The MLX90809 only needs 2 capacitors in the application, a 47nF decoupling capacitor on the supply line and a 47nF load on the analog output pin. When the SENT output is used a 2.2nF capacitor is recommended. MLX90809 in analog mode Vdd 47nF Gnd 47nF AnaOut Figure 4: MLX90809 application schematic in analog mode When using the analog output, Melexis recommends shorting one of the SENT output pins and the test pin to GND. MLX90809 in SENT mode SENTOut 2.2nF Vdd 47nF Gnd Figure 5: MLX90809 application schematic in SENT mode When using the SENT output Melexis recommends shorting one of the analog output pins and the test pin to GND. Read the application note “System Integration Guidelines” for manufacturing handling as well as sealing recommendations. Rev 002 390109080901 Page 8 of 11 Data Sheet Oct/14 MLX90809 Relative Pressure Sensor 10 Standard information regarding manufacturability of Melexis products with different soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2) Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) EN60749-20 Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD’s (Through Hole Devices) EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx 11 ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. Rev 002 390109080901 Page 9 of 11 Data Sheet Oct/14 MLX90809 Relative Pressure Sensor 12 Package Information Figure 6: MLX90809 package drawing Table in mm min max A 2.28 2.45 A1 -0.025 0.075 A2 2.34 REF D 10.19 10.33 D1 7.7 8.1 D2 3.7 4.1 E 7.45 7.59 E1 4.8 5.2 B 0.326 0.486 L 0.74 0.99 G1 1.5 1.7 G2 0.56 0.96 E2 1.9 2.3 A: total package thickness (body thickness + stand off) A1: package stand off Table in mm min max α o 0 o 8 c 0.2 0.33 H 10.11 10.51 e 1.27 BSC Table 5: Detailed package dimensions Rev 002 390109080901 Page 10 of 11 Data Sheet Oct/14 MLX90809 Relative Pressure Sensor 13 Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2014 Melexis NV. All rights reserved. For the latest version of this document, go to our website at www.melexis.com Europe, Africa, Asia: America: Phone: +32 1367 0495 E-mail: [email protected] Phone: +1 248 306 5400 E-mail: [email protected] ISO/TS 16949 and ISO14001 Certified Rev 002 390109080901 Page 11 of 11 Data Sheet Oct/14