TI OPA4377 5mhz, low-noise,single, dual, quad cmos operational amplifier Datasheet

OPA377
OPA2377
OPA4377
SBOS504B – FEBRUARY 2010 – REVISED JANUARY 2011
www.ti.com
5MHz, Low-Noise,
Single, Dual, Quad CMOS Operational Amplifiers
Check for Samples: OPA377, OPA2377, OPA4377
FEATURES
DESCRIPTION
•
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•
•
•
•
•
•
•
The OPA377 family of operational amplifiers are
wide-bandwidth CMOS amplifiers that provide very
low noise, low input bias current, and low offset
voltage while operating on a low quiescent current of
0.76mA (typ).
1
2
GAIN BANDWIDTH PRODUCT: 5.5MHz
LOW NOISE: 7.5nV/√Hz at 1kHz
OFFSET VOLTAGE: 1mV (max)
INPUT BIAS CURRENT: 0.2pA
RAIL-TO-RAIL OUTPUT
UNITY-GAIN STABLE
EMI INPUT FILTERING
QUIESCENT CURRENT: 0.76mA/ch
SUPPLY VOLTAGE: 2.2V to 5.5V
SMALL PACKAGES:
SC70, SOT23, and MSOP
The OPA377 op amps are optimized for low-voltage,
single-supply
applications.
The
exceptional
combination of ac and dc performance make them
ideal for a wide range of applications, including small
signal conditioning, audio, and active filters. In
addition, these parts have a wide supply range with
excellent PSRR, making them attractive for
applications that run directly from batteries without
regulation.
APPLICATIONS
•
•
•
•
•
The OPA377 is available in the SC70-5, SOT23-5,
and SO-8 packages. The dual OPA2377 is offered in
the SO-8 and MSOP-8, and the quad OPA4377 in the
TSSOP-14 packages. All versions are specified for
operation from –40°C to +125°C.
PHOTODIODE PREAMP
PIEZOELECTRIC SENSOR PREAMP
SENSOR SIGNAL CONDITIONING
AUDIO EQUIPMENT
ACTIVE FILTERS
CF
INPUT BIAS CURRENT vs TEMPERATURE
1000
RF
VS
OPA377
VB
VOUT
Input Bias Current (pA)
900
800
700
600
500
400
300
200
100
0
-50
Photodiode Preamplifier
-25
0
25
50
75
100
125
150
Temperature (°C)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
© 2010–2011, Texas Instruments Incorporated
OPA377
OPA2377
OPA4377
SBOS504B – FEBRUARY 2010 – REVISED JANUARY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATING (1)
Over operating free-air temperature range, unless otherwise noted.
Signal Input Terminals
OPA377, OPA2377, OPA4377
UNIT
+7
V
(V–) – 0.5 to (V+) + 0.5
V
±10
mA
VS = (V+) – (V–)
Supply Voltage
Voltage (2)
Current
(2)
Output Short-Circuit (3)
Continuous
Operating Temperature
TA
–40 to +150
°C
Storage Temperature
TA
–65 to +150
°C
Junction Temperature
TJ
+150
°C
Human Body Model
4000
V
Charged Device Model
1000
V
Machine Model
200
V
ESD Rating
(1)
(2)
(3)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current limited to 10mA or less.
Short-circuit to ground, one amplifier per package.
PACKAGE INFORMATION (1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
SC70-5
DCK
OP377A
OPA377
SOT23-5
DBV
OP377A
SO-8
D
OP377A
O2377A
SO-8
D
MSOP-8
DGK
OTAQ
TSSOP-14
PW
O4377A
OPA2377
OPA4377
(1)
2
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
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ELECTRICAL CHARACTERISTICS: VS = +2.2V to +5.5V
Boldface limits apply over the specified temperature range: TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
OPA377, OPA2377, OPA4377
PARAMETERS
CONDITIONS
MIN
TYP
MAX
UNIT
OFFSET VOLTAGE
Input Offset Voltage
VOS
vs Temperature
dVOS/dT
vs Power Supply
PSRR
Over Temperature
VS = +5V
0.25
1
mV
–40°C to +125°C
0.32
2
mV/°C
VS = +2.2V to +5.5V, VCM < (V+) – 1.3V
5
28
mV/V
VS = +2.2V to +5.5V, VCM < (V+) – 1.3V
5
mV/V
0.5
µV/V
Channel Separation, dc (dual, quad)
INPUT BIAS CURRENT
Input Bias Current
±0.2
IB
Over Temperature
Input Offset Current
±10
pA
See Typical Characteristics
pA
±0.2
pA
IOS
±10
NOISE
Input Voltage Noise,
en
f = 0.1Hz to 10Hz
0.8
mVPP
Input Voltage Noise Density
en
f = 1kHz
7.5
nV/√Hz
in
f = 1kHz
2
fA/√Hz
Input Current Noise
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
VCM
Common-Mode Rejection Ratio
CMRR
(V–) – 0.1
(V–) < VCM < (V+) – 1.3 V
70
(V+) + 0.1
V
90
dB
Differential
6.5
pF
Common-Mode
13
pF
134
dB
126
dB
INPUT CAPACITANCE
OPEN-LOOP GAIN
Open-Loop Voltage Gain
AOL
50mV < VO < (V+) – 50mV, RL = 10kΩ
112
100mV < VO < (V+) – 100mV, RL = 2kΩ
FREQUENCY RESPONSE
VS = 5.5V
Gain-Bandwidth Product
GBW
Slew Rate
SR
5.5
MHz
G = +1
2
V/ms
Settling Time 0.1%
tS
2V Step , G = +1
1.6
ms
Settling Time 0.01%
tS
2V Step , G = +1
2
ms
VIN × Gain > VS
0.33
ms
VO = 1VRMS, G = +1, f = 1kHz, RL = 10kΩ
0.00027
%
RL = 10kΩ
10
Overload Recovery Time
THD + Noise
THD+N
OUTPUT
Voltage Output Swing from Rail
Over Temperature
Short-Circuit Current
Capacitive Load Drive
Open-Loop Output Impedance
RL = 10kΩ
ISC
20
mV
40
mV
+30/–50
CLOAD
mA
See Typical Characteristics
RO
Ω
150
POWER SUPPLY
Specified Voltage Range
VS
Quiescent Current per amplifier
IQ
2.2
IO = 0, VS = +5.5V
0.76
Over Temperature
5.5
V
1.05
mA
1.2
mA
TEMPERATURE RANGE
–40
Specified Range
Thermal Resistance
°C
+125
°C/W
qJA
SC70-5
250
°C/W
SOT23-5
200
°C/W
MSOP-8, SO-8, TSSOP-14
150
°C/W
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OPA2377
OPA4377
SBOS504B – FEBRUARY 2010 – REVISED JANUARY 2011
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PIN CONFIGURATIONS
OPA377
SOT23-5
(TOP VIEW)
OUT
1
V-
2
+IN
3
OPA377
SO-8
(TOP VIEW)
5
4
V+
NC
-IN
(1)
1
1
V-
2
-IN
3
NC
7
V+
(1)
-IN
2
+IN
3
6
OUT
V-
4
5
NC
OPA377
SC70-5
(TOP VIEW)
+IN
+
8
(1)
OPA2377
SO-8, MSOP-8
(TOP VIEW)
5
4
V+
OUT
OUT A
1
8
V+
-IN A
2
7
OUT B
+IN A
3
6
-IN B
V-
4
5
+IN B
OPA4377
TSSOP-14
(TOP VIEW)
OUT A
1
14
OUT D
-IN A
2
13
-IN D
+IN A
3
12
+IN D
V+
4
11
V-
+IN B
5
10
+IN C
-IN B
6
9
-IN C
OUT B
7
8
OUT C
(1) NC denotes no internal connection.
(2) Connect thermal die to V–.
4
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SBOS504B – FEBRUARY 2010 – REVISED JANUARY 2011
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TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
POWER-SUPPLY AND COMMON-MODE
REJECTION RATIO vs FREQUENCY
0
140
-20
120
-40
Gain
100
-60
Phase
80
-80
60
-100
40
-120
20
-140
0
-160
-20
0.1
1
10
100
120
1k
10k
100k
1M
Power-Supply Rejection Ratio (dB)
160
Phase Margin (°)
Open-Loop Gain (dB)
OPEN-LOOP GAIN/PHASE vs FREQUENCY
V(+) Power-Supply Rejection Ratio
100
80
Common-Mode
Rejection Ratio
60
40
V(-) Power-Supply Rejection Ratio
20
0
-180
10M
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
Figure 1.
Figure 2.
OPEN-LOOP GAIN AND POWER-SUPPLY
REJECTION RATIO vs TEMPERATURE
0.1Hz to 10Hz
INPUT VOLTAGE NOISE
Open-Loop Gain (RL = 10kW)
140
120
500nV/div
Open-Loop Gain and PSRR (dB)
160
Power-Supply Rejection Ratio
(VS = 2.2V to 5.5V)
100
80
-50
0
-25
25
75
50
100
125
1s/div
150
Temperature (°C)
Figure 3.
Figure 4.
INPUT VOLTAGE NOISE SPECTRAL DENSITY
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
1
Total Harmonic Distortion + Noise (%)
Voltage Noise (nV/ÖHz)
100
10
1
VS = 5V, VCM = 2V, VOUT = 1VRMS
0.1
0.01
Gain = 10V/V
0.001
Gain = 1V/V
0.0001
1
10
100
1k
10k
100k
10
100
Frequency (Hz)
Figure 5.
1k
10k
100k
Frequency (Hz)
Figure 6.
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OPA4377
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
COMMON-MODE REJECTION RATIO
vs TEMPERATURE
QUIESCENT CURRENT
vs TEMPERATURE
1000
100
900
Quiescent Current (mA)
Common-Mode Rejection Ratio (dB)
110
90
80
70
800
700
600
60
50
500
-50
-25
0
25
50
75
100
125
150
-50
-25
0
Temperature (°C)
25
50
75
100
125
150
125
150
Temperature (°C)
Figure 7.
Figure 8.
QUIESCENT AND SHORT-CIRCUIT CURRENT
vs SUPPLY VOLTAGE
SHORT-CIRCUIT CURRENT
vs TEMPERATURE
75
50
1000
VS = ±2.75V
Quiescent Current (mA)
ISC+
30
800
IQ
700
20
10
600
0
500
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Short-Circuit Current (mA)
40
900
Short-Circuit Current (mA)
50
ISC+
25
0
-25
ISC-
-50
-75
-100
-50
5.5
-25
0
25
50
75
100
Temperature (°C)
Supply Voltage (V)
Figure 9.
Figure 10.
INPUT BIAS CURRENT vs TEMPERATURE
OUTPUT VOLTAGE vs OUTPUT CURRENT
3
1000
VS = ±2.75
2
800
Output Voltage (V)
Input Bias Current (pA)
900
700
600
500
400
300
200
1
+150°C
+125°C
+25°C
-40°C
0
-1
-2
100
-3
0
-50
-25
0
25
50
75
100
125
150
0
10
20
Temperature (°C)
Figure 11.
6
30
40
50
60
70
80
Output Current (mA)
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
6
VS = 5.5V
VS = 5V
Population
Output Voltage (VPP)
5
4
3
VS = 2.5V
2
1
-1000
-900
-800
-700
-600
-500
-400
-300
-200
-100
0
100
200
300
400
500
600
700
800
900
1000
0
1k
10k
10M
Frequency (Hz)
Offset Voltage (mV)
Figure 13.
Figure 14.
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE
SMALL-SIGNAL PULSE RESPONSE
50
G = +1
RL = 10kW
CL = 50pF
G = +1V/V
40
50mV/div
Small-Signal Overshoot (%)
1M
100k
30
20
10
0
10
100
1k
Time (400ns/div)
Load Capacitance (pF)
Figure 15.
Figure 16.
LARGE-SIGNAL PULSE RESPONSE
SETTLING TIME vs CLOSED-LOOP GAIN
100
1V/div
Settling Time (ms)
G = +1
RL = 2kW
CL = 50pF
10
0.01%
1
0.1%
0.1
Time (2ms/div)
1
10
100
Closed-Loop Gain (V/V)
Figure 17.
Figure 18.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +5V, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.
CHANNEL SEPARATION vs FREQUENCY
OPEN-LOOP OUTPUT RESISTANCE vs FREQUENCY
140
Open-Loop Output Resistance (W)
1k
Channel Separation (dB)
120
100
80
60
40
20
0
100
10
400mA Load
2mA Load
1
0.1
10
100
1k
10k
100k
1M
10M
100M
10
100
Frequency (Hz)
Figure 19.
8
1k
10k
100k
1M
10M
Frequency (Hz)
Figure 20.
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APPLICATION INFORMATION
OPERATING CHARACTERISTICS
R2
10kW
The OPA377 family of amplifiers has parameters that
are fully specified from 2.2V to 5.5V (±1.1V to
±2.75V). Many of the specifications apply from –40°C
to +125°C. Parameters that can exhibit significant
variance with regard to operating voltage or
temperature are presented in the Typical
Characteristics.
+5V
C1
100nF
R1
1kW
GENERAL LAYOUT GUIDELINES
For best operational performance of the device, good
printed circuit board (PCB) layout practices are
required. Low-loss, 0.1mF bypass capacitors must be
connected between each supply pin and ground,
placed as close to the device as possible. A single
bypass capacitor from V+ to ground is applicable to
single-supply applications.
VOUT
OPA377
VIN
VCM = 2.5V
BASIC AMPLIFIER CONFIGURATIONS
The OPA377 family is unity-gain stable. It does not
exhibit output phase inversion when the input is
overdriven. A typical single-supply connection is
shown in Figure 21. The OPA377 is configured as a
basic inverting amplifier with a gain of –10V/V. This
single-supply connection has an output centered on
the common-mode voltage, VCM. For the circuit
shown, this voltage is 2.5V, but may be any value
within the common-mode input voltage range.
Figure 21. Basic Single-Supply Connection
COMMON-MODE VOLTAGE RANGE
The input common-mode voltage range of the
OPA377 series extends 100mV beyond the supply
rails. The offset voltage of the amplifier is low, from
approximately (V–) to (V+) – 1V, as shown in
Figure 22. The offset voltage increases as
common-mode
voltage
exceeds
(V+)
–1V.
Common-mode rejection is specified from (V–) to
(V+) – 1.3V.
Input Offset Voltage (mV)
3
2
1
0
-1
-2
-V
-3
-0.5 0
+V
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input Common-Mode Voltage (V)
Figure 22. Offset and Common-Mode Voltage
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INPUT AND ESD PROTECTION
CAPACITIVE LOAD AND STABILITY
The OPA377 family incorporates internal electrostatic
discharge (ESD) protection circuits on all pins. In the
case of input and output pins, this protection primarily
consists of current steering diodes connected
between the input and power-supply pins. These ESD
protection diodes also provide in-circuit, input
overdrive protection, as long as the current is limited
to 10mA as stated in the Absolute Maximum Ratings.
Figure 23 shows how a series input resistor may be
added to the driven input to limit the input current.
The added resistor contributes thermal noise at the
amplifier input and its value should be kept to a
minimum in noise-sensitive applications.
The OPA377 series of amplifiers may be used in
applications where driving a capacitive load is
required. As with all op amps, there may be specific
instances where the OPAx377 can become unstable,
leading to oscillation. The particular op amp circuit
configuration, layout, gain, and output loading are
some of the factors to consider when establishing
whether an amplifier will be stable in operation. An op
amp in the unity-gain (+1V/V) buffer configuration and
driving a capacitive load exhibits a greater tendency
to be unstable than an amplifier operated at a higher
noise gain. The capacitive load, in conjunction with
the op amp output resistance, creates a pole within
the feedback loop that degrades the phase margin.
The degradation of the phase margin increases as
the capacitive loading increases.
V+
IOVERLOAD
10mA max
OPA377
VOUT
VIN
5kW
Figure 23. Input Current Protection
EMI SUSCEPTIBILITY AND INPUT FILTERING
Operational amplifiers vary in susceptibility to
electromagnetic interference (EMI). If conducted EMI
enters the operational amplifier, the dc offset
observed at the amplifier output may shift from the
nominal value while the EMI is present. This shift is a
result of signal rectification associated with the
internal semiconductor junctions. While all amplifier
pin functions can be affected by EMI, the input pins
are likely to be the most susceptible. The OPA377
operational amplifier family incorporates an internal
input low-pass filter that reduces the amplifier
response to EMI. Both common-mode and differential
mode filtering are provided by the input filter. The
filter is designed for a cutoff frequency of
approximately 75MHz (–3dB), with a roll-off of 20dB
per decade.
The OPAx377 in a unity-gain configuration can
directly drive up to 250pF pure capacitive load.
Increasing the gain enhances the ability of the
amplifier to drive greater capacitive loads; see the
typical characteristic plot, Small-Signal Overshoot vs
Capacitive Load. In unity-gain configurations,
capacitive load drive can be improved by inserting a
small (10Ω to 20Ω) resistor, RS, in series with the
output, as shown in Figure 24. This resistor
significantly reduces ringing while maintaining dc
performance for purely capacitive loads. However, if
there is a resistive load in parallel with the capacitive
load, a voltage divider is created, introducing a gain
error at the output and slightly reducing the output
swing. The error introduced is proportional to the ratio
RS/RL, and is generally negligible at low output
current levels.
V+
RS
VOUT
OPA377
VIN
10W to
20W
RL
CL
Figure 24. Improving Capacitive Load Drive
10
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ACTIVE FILTERING
The OPA377 series is well-suited for filter
applications requiring a wide bandwidth, fast slew
rate, low-noise, single-supply operational amplifier.
Figure 25 shows a 50kHz, 2nd-order, low-pass filter.
The components have been selected to provide a
maximally-flat Butterworth response. Beyond the
cutoff frequency, roll-off is –40dB/dec. The
Butterworth response is ideal for applications
requiring predictable gain characteristics such as the
anti-aliasing filter used ahead of an analog-to-digital
converter (ADC).
DRIVING AN ANALOG-TO-DIGITAL
CONVERTER
The low noise and wide gain bandwidth of the
OPA377 family make it an ideal driver for ADCs.
Figure 26 illustrates the OPA377 driving an
ADS8327, 16-bit, 250kSPS converter. The amplifier is
connected as a unity-gain, noninverting buffer.
+5V
C1
0.1mF
+5V
(1)
R1
100W
R3
5.49kW
+IN
OPA377
(1)
C3
C2
150pF
1.2nF
VIN
-IN
ADS8327
Low Power
16-Bit
500kSPS
REF IN
+5V
V+
R1
5.49kW
R2
12.4kW
REF5040
4.096V
OPA377
VIN
C1
1nF
VOUT
C4
100nF
(1) Suggested value; may require adjustment based on specific
application.
(2) Initial calibration recommended.
Figure 26. Driving an ADS8327(2)
(V+)/2
Figure 25. Second-Order Butterworth 50kHz
Low-Pass Filter
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REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (October 2010) to Revision B
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Changed document status to production data ...................................................................................................................... 1
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Deleted cross-reference to note 2 and shading from DCK package in Package Information table ..................................... 2
•
Updated Figure 22 ................................................................................................................................................................ 9
Changes from Original (February 2010) to Revision A
Page
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Deleted DFN from list of packages in final Features bullet .................................................................................................. 1
•
Deleted DFN package from Description section ................................................................................................................... 1
•
Updated Input Bias Current vs Temperature plot ................................................................................................................. 1
•
Deleted cross-reference to note 2 and shading from all packages except SC70-5 in Package Information table .............. 2
•
Deleted DFN-8 package from Package Information table .................................................................................................... 2
•
Deleted Temperature Range, DFN-8 parameter from Electrical Characteristics table ........................................................ 3
•
Deleted DFN-8 pin configuration .......................................................................................................................................... 4
•
Updated Figure 11 ................................................................................................................................................................ 6
12
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Product Folder Link(s): OPA377 OPA2377 OPA4377
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
OPA2377AID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
O2377A
OPA2377AIDGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
OTAQ
OPA2377AIDGKT
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
OTAQ
OPA2377AIDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
O2377A
OPA377AID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OP377A
OPA377AIDBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
PAG
OPA377AIDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
PAG
OPA377AIDCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
PAF
OPA377AIDCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
PAF
OPA377AIDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OP377A
OPA4377AIPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OP4377A
OPA4377AIPWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
OP4377A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
OPA2377AIDGKR
VSSOP
DGK
8
OPA2377AIDGKT
VSSOP
DGK
OPA2377AIDR
SOIC
D
OPA377AIDBVR
SOT-23
OPA377AIDBVR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
8
250
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
DBV
5
3000
180.0
8.4
3.23
3.17
1.37
4.0
8.0
Q3
SOT-23
DBV
5
3000
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
OPA377AIDBVT
SOT-23
DBV
5
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
OPA377AIDBVT
SOT-23
DBV
5
250
180.0
8.4
3.23
3.17
1.37
4.0
8.0
Q3
OPA377AIDCKR
SC70
DCK
5
3000
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
OPA377AIDCKT
SC70
DCK
5
250
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
OPA377AIDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA4377AIPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA2377AIDGKR
VSSOP
DGK
8
2500
366.0
364.0
50.0
OPA2377AIDGKT
VSSOP
DGK
8
250
366.0
364.0
50.0
OPA2377AIDR
SOIC
D
8
2500
367.0
367.0
35.0
OPA377AIDBVR
SOT-23
DBV
5
3000
223.0
270.0
35.0
OPA377AIDBVR
SOT-23
DBV
5
3000
195.0
200.0
45.0
OPA377AIDBVT
SOT-23
DBV
5
250
195.0
200.0
45.0
OPA377AIDBVT
SOT-23
DBV
5
250
223.0
270.0
35.0
OPA377AIDCKR
SC70
DCK
5
3000
195.0
200.0
45.0
OPA377AIDCKT
SC70
DCK
5
250
195.0
200.0
45.0
OPA377AIDR
SOIC
D
8
2500
367.0
367.0
35.0
OPA4377AIPWR
TSSOP
PW
14
2000
367.0
367.0
35.0
Pack Materials-Page 2
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