Material Content Data Sheet Sales Product Name SPP80P06P H MA# MA000669312 Package PG-TO220-3-1 Issued 29. August 2013 Weight* 2035.41 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus antimony silver tin iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-36-0 7440-22-4 7440-31-5 7439-89-6 7723-14-0 7440-50-8 11.978 0.59 0.816 0.04 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.59 5885 5885 401 0.245 0.01 815.335 40.05 40.10 400576 120 401097 7.094 0.35 0.35 3485 3485 5.826 0.29 2862 110.699 5.44 466.100 22.90 28.63 228996 286245 21.462 1.05 1.05 10545 10545 0.244 0.01 0.001 0.00 0.537 0.03 1.343 0.07 3.493 0.17 0.590 0.03 0.177 0.01 589.466 28.96 54387 120 0.01 0 660 0.27 1716 2. 3. 87 29.00 289606 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2640 290 Important Remarks: 1. 120 264 289983 1000000