ASB ASW126 3.3 v gain block amplifier mmic Datasheet

ASW126
ASW126 Data Sheet
3.3 V Gain Block Amplifier MMIC over DC~3500 MHz
1. Product Overview
1.1
General Description
ASW126, 3.3 V internally matched gain block amplifier MMIC, has excellent input and output return loss,
and high linearity over a wide range of frequency DC~3500 MHz, being suitable for use in both receiver
and transmitter of telecommunication systems up to 3.5 GHz. The amplifier is available in a SOT363
package and passes through the stringent 100% DC & RF test via an automated test handler.
1.2
Features
 20.1 dB Gain at 900 MHz
 17 dBm P1dB at 900 MHz
 31 dBm Output IP3 at 900 MHz
 3.7 dB NF at 900 MHz
 MTTF > 100 Years
 Minimum External Matching Components
 Single Supply: +3.3 V
1.3
Applications
 Base Station Infrastructure
 Repeater
 Telecommunication System
1.4
Package Profile & RoHS Compliance
SOT363, 2.1x2.0 mm2, surface mount
1/11
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RoHS-compliant
April 2017
ASW126
2. Summary on Product Performances
2.1
Typical Performance
Supply voltage = +3.3 V, TA = +25 C, ZO = 50 
Parameter
Typical
Unit
Frequency
150
500
900
1750
2000
2400
2700
3500
MHz
Gain
24.7
22.6
20.1
15.5
14.4
12.9
11.8
9.6
dB
S11
-22
-16
-20
-20
-19
-16
-14
-13
dB
S22
-11
-10
-11
-11
-12
-13
-15
-14
dB
Noise Figure
3.6
3.8
3.7
3.8
3.9
4.1
4.2
4.3
dB
IP31)
28.0
30.0
31.0
32.0
33.5
33.5
33.0
33.5
dBm
Output P1dB
16.0
16.5
17.0
17.0
17.5
17.5
18.0
17.5
dBm
Current
37
mA
Device Voltage
+3.3
V
Output
1) OIP3 is measured with two tones at the output power of +0 dBm/tone separated by 1 MHz.
2.2
Product Specification
Supply voltage = +3.3 V, TA = +25 C, ZO = 50 
Parameter
Min
Typ
Frequency
Unit
900
MHz
Gain
19.1
20.1
dB
S11
-17
-20
dB
S22
-9
-11
dB
Noise Figure
3.7
4.0
dB
Output IP3
29
31
dBm
Output P1dB
16
17
dBm
Current
30
37
Device Voltage
2.3
2/11
Max
44
mA
+3.3
V
Pin Configuration
Pin
Description
1, 2, 4, 5
Ground
3
RF_IN
6
RF_OUT & Bias
ASB Inc.
Simplified Outline
1
2
3
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6
5
4
April 2017
ASW126
2.4
Absolute Maximum Ratings
Parameters
Max. Ratings
Operation Case Temperature
-40 to 85 C
Storage Temperature
-40 to 150 C
Device Voltage
+4 V
Operation Junction Temperature
+150 C
Input RF Power (CW, 50  matched)
+24 dBm
2.5
Thermal Resistance
Symbol
Description
Typ
Unit
Rth
Thermal resistance from junction to lead
220
C/W
2.6
ESD Classification & Moisture Sensitivity Level
ESD Classification
HBM
Class 1B
Voltage Level: 500 ~ 1000 V
MM
Class A
Voltage Level: <200 V
CAUTION: Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can
be damaged by static electricity. Proper ESD control techniques should be used when
handling these devices.
Moisture Sensitivity Level
MSL 3 at 260 C reflow
(Intentionally Blanked)
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3. Application: 500 ~ 3500 MHz (Vsupply = +3.3 V)
3.1
Application Circuit & Evaluation Board
Vdevice = +3.3 V
C4
C3
L1
C2
RF OUT
C1
RF IN
ASW126
PCB Information
Material
FR4
Thickness (mm)
0.8
Size (mm)
40x40
EB No.
EB-363-A2
Bill of Material
4/11
Symbol
Value
Size
Description
Manufacturer
ASW126
-
-
MMIC Amplifier
ASB
C1, C2
1 nF
0603
DC blocking capacitor
Murata
C3
100 pF
0603
Bypass capacitor
Murata
C4
1 F
0603
Decoupling capacitor
Murata
L1
47 nH
0603
RF choke inductor
Murata
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ASW126
3.2
Performance Table
Supply voltage = +3.3 V, TA = +25 C, ZO = 50 
Parameter
Typical
Unit
Frequency
500
900
1750
2000
2400
2700
3500
MHz
Gain
22.6
20.1
15.5
14.4
12.9
11.8
9.6
dB
S11
-16
-20
-20
-19
-16
-14
-13
dB
S22
-10
-11
-11
-12
-13
-15
-14
dB
Noise Figure
3.8
3.7
3.8
3.9
4.1
4.2
4.3
dB
Output IP31)
30.0
31.0
32.0
33.5
33.5
33.0
33.5
dBm
Output P1dB
16.5
17.0
17.0
17.5
17.5
18.0
17.5
dBm
Current
37
mA
Device Voltage
+3.3
V
1) OIP3 is measured with two tones at the output power of +0 dBm/tone separated by 1 MHz.
40
30
20
10
0
-10
-20
-30
-40
-50
-60
0
5/11
10
9
S21
8
7
6
S22
5
S11
4
S12
3
2
K
1
0
500 1000 1500 2000 2500 3000 3500
Frequency (MHz)
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Stability Factor, K
Plot of S-parameter & Stability Factor
S-parameters (dB)
3.3
April 2017
ASW126
3.4
Plots of Noise Figure and Performances with Temperature
30
7
-40 °C
6
25
Gain (dB)
NF (dB)
5
NF
4
3
+85 °C
20
15
10
2
5
1
0
0
0
500
1000
1500 2000 2500
Frequency (MHz)
3000
0
3500
0
0
-10
-10
S22 (dB)
S11 (dB)
+25 °C
-40 °C
1000 1500 2000 2500
Frequency (MHz)
3000
3500
1000 1500 2000 2500
Frequency (MHz)
3000
3500
-40 °C
-20
-20
500
+25 °C
+25 °C
+85 °C
+85 °C
-30
-30
0
500
1000 1500 2000 2500
Frequency (MHz)
3000
0
3500
50
30
45
25
40
20
500
Gain (dB)
Current (mA)
Frequency = 900 MHz
35
30
10
25
5
0
20
-60
6/11
15
-40
-20
0
20
40
Temperature (°C)
60
80
ASB Inc.
100
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-40
-20
0
20
40
Temperature (°C)
60
80
100
April 2017
ASW126
22
7
Frequency = 900 MHz
6
Frequency = 900 MHz
20
P1dB (dBm)
NF (dB)
5
4
3
18
16
2
14
1
12
0
-60
-40
-20
0
20
40
Temperature (°C)
60
80
100
-60
-40
-20
0
20
40
Temperature (°C)
60
80
100
50
Output IP3 (dBm)
Frequency = 900 MHz
40
30
-40 °C
20
+25 °C
10
+85 °C
0
-2
7/11
0
2
4
6
8
Output tone power (dBm)
10
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ASW126
4. Application: 50 ~ 500 MHz (IF, Vsupply = +3.3 V)
4.1
Application Circuit & Evaluation Board
Vdevice = +3.3 V
C4
C3
L1
C2
RF OUT
C1
RF IN
ASW126
PCB Information
Material
FR4
Thickness (mm)
0.8
Size (mm)
40x40
EB No.
EB-363-A2
Bill of Material
8/11
Symbol
Value
Size
Description
Manufacturer
ASW126
-
-
MMIC Amplifier
ASB
C1, C2
1 nF
0603
DC blocking capacitor
Murata
C3
100 pF
0603
Bypass capacitor
Murata
C4
1 F
0603
Decoupling capacitor
Murata
L1
680 nH
0603
RF choke inductor
Samsung
ASB Inc.
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ASW126
4.2
Performance Table
Supply voltage = +3.3 V, TA = +25 C, ZO = 50 
Parameter
Typical
Unit
Frequency
70
150
300
450
MHz
Gain
24.8
24.5
24.0
23.0
dB
S11
-20
-21
-23
-23
dB
S22
-11
-11
-11
-11
dB
Noise Figure
3.6
3.5
3.7
3.7
dB
Output IP31)
27.5
27.5
29.5
28.5
dBm
Output P1dB
16.0
16.0
16.5
16.5
dBm
Current
37
mA
Device Voltage
+3.3
V
1) OIP3 is measured with two tones at the output power of +0 dBm/tone separated by 1 MHz.
40
30
20
10
0
-10
-20
-30
-40
-50
-60
S21
S22
S11
S12
K
10
9
8
7
6
5
4
3
2
1
0
Stability Factor, K
Plot of S-parameter & Stability Factor
S-parameters (dB)
4.3
50 100 150 200 250 300 350 400 450 500
Frequency (MHz)
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5. Package Outline (SOT363, 2.1x2.0x1.0 mm)
Symbols
W126
A
A1
A2
b
C
D
F
E1
e
e1
L
Dimensions (In mm)
MIN
NOM
0.900
1.000
0.025
0.062
0.875
0.937
0.200
0.300
0.100
0.125
1.900
2.000
1.150
1.250
2.000
2.100
0.65BSC
1.30BSC
0.425REF
MAX
1.10
0.10
1.00
0.40
0.15
2.10
1.35
2.20
6. Surface Mount Recommendation (In mm)
1.48
NOTE
0.30
1. The number and size of ground via holes in a
circuit board are critical for thermal and RF
grounding considerations.
0.25
0.30
1.23
2. Recommend is that the ground via holes be
placed on the bottom of the ground leads and
exposed pad of the device for better RF and
thermal performance, as shown in the drawing at
the left side.
10/11
0.50
1.75
0.40
1.33
0.42
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ASW126
7. Recommended Soldering Reflow Profile
260 C
20~40 sec
Ramp-up
(3 C/sec)
Ramp-down
(6 C/sec)
200 C
150 C
60~180 sec
(End of Datasheet)
Copyright 2014-2017 ASB Inc. All rights reserved. Datasheet subject to change without notice. ASB
assumes no responsibility for any errors which may appear in this datasheet. No part of the datasheet
may be copied or reproduced in any form or by any means without the prior written consent of ASB.
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