Material Content Data Sheet Sales Product Name TLE4269G MA# MA000969910 Package PG-DSO-8-16 Issued 28. August 2013 Weight* 83.59 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 2.966 3.55 0.009 0.01 0.036 0.04 429 0.717 0.86 8580 29.121 34.84 35.75 348377 357493 0.401 0.48 0.48 4799 4799 0.095 0.11 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.55 35478 35478 107 1140 4.383 5.24 43.160 51.63 56.98 516322 569892 0.814 0.97 0.97 9736 9736 0.650 0.78 0.78 7779 7779 0.273 0.33 0.966 1.16 52430 3261 1.49 11562 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 14823 1000000