BCD AP2820BMMTR-G1 High-side power distribution switch with enable and flag Datasheet

Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
General Description
Features
The AP2820 is an integrated high-side power switch
that consists of N-Channel MOSFET, charge pump,
over current & temperature and other related protection
circuits. The switch’s low RDS(ON), 60mΩ, is designed
to meet USB voltage drop requirements. The IC
includes soft-start to limit inrush current, over-current
protection, load short protection with fold-back, and
thermal shutdown to avoid switch failure during hot
plug-in. Under voltage lockout (UVLO) function is
used to ensure the device remain off unless there is a
valid input voltage present. A FLAG output is
available to indicate fault conditions to the local USB
controller.
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The AP2820 is available in standard packages of
SOIC-8 and MSOP-8.
Applications
•
•
•
•
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USB Power Management
USB Bus/Self Powered Hubs
Hot-plug Power Supplies
Battery-charger Circuits
Notebooks, Motherboard PCs
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SOIC-8
AP2820
Low MOSFET on Resistance: 60mΩ
Compliant to USB Specifications
Available 2 Versions of Load Ability:
Guarantee 2.0A Continuous Load for A/B/C/D
Version
Guarantee 2.5A Continuous Load for E/F/G/H
Version
Logic Level Enable Pin: Available with
Active-high or Active-low Version
Operating Voltage Range: 2.7V to 5.5V
Low Supply Current:
75μA (Typ.) (For A/B/C/D versions)
80μA (Typ.) (For E/F/G/H versions)
Low Shutdown Current: 1.0μA (Max)
Under-voltage Lockout
Soft Start-up
Over-current Protection
Over Temperature Protection
Load Short Protection with Fold-back
No Reverse Current When Power Off
Deglitched FLAG Output with Open Drain
With Output Shutdown Pull-low Resistor for
A/C/E/G Versions
UL Approved (File No. E339337)
Nemko CB Scheme IEC60950-1, Ref. Certif
No. NO62093
MSOP-8
Figure 1. Package Types of AP2820
Jul. 2012
Rev 1. 7
BCD Semiconductor Manufacturing Limited
1
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Pin Configuration
M/MM Package
(SOIC-8/MSOP-8)
Figure 2. Pin Configuration of AP2820 (Top View)
Pin Descriptions
Pin Number
Pin Name
1
GND
Ground
2, 3
VIN
Supply input pin
Chip enable control input, active low or high
4
5
6, 7, 8
Jul. 2012
Function
VOUT
Fault flag pin, output with open drain, need a pull-up resistor
in application, active low to indicate OCP or OTP
Switch output voltage
Rev 1. 7
BCD Semiconductor Manufacturing Limited
2
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Functional Block Diagram
Figure 3. Functional Block Diagram of AP2820
Jul. 2012
Rev 1. 7
BCD Semiconductor Manufacturing Limited
3
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Ordering Information
AP2820
-
Circuit Type
G1: Green
TR: Tape & Reel
Blank: Tube
Condition
For Continuous 2.0A Versions
A: Active High with Auto Discharge
B: Active High without Auto Discharge
C: Active Low with Auto Discharge
D: Active Low without Auto Discharge
For Continuous 2.5A Versions
E: Active High with Auto Discharge
F: Active High without Auto Discharge
G: Active Low with Auto Discharge
H: Active Low without Auto Discharge
Package
Temperature
Range
-40 to 85°C
-40 to 85°C
SOIC-8
-40 to 85°C
-40 to 85°C
Jul. 2012
Package
M: SOIC-8
MM: MSOP-8
Condition
Active High
with Auto Discharge
(Continuous 2.0A)
Part Number
Marking ID
Packing
Type
AP2820AM-G1
2820AM-G1
Tube
AP2820AMTR-G1
2820AM-G1
Tape & Reel
Active High
AP2820BM-G1
without Auto Discharge
(Continuous 2.0A) AP2820BMTR-G1
2820BM-G1
Tube
2820BM-G1
Tape & Reel
AP2820CM-G1
2820CM-G1
Tube
AP2820CMTR-G1
2820CM-G1
Tape & Reel
Active Low
AP2820DM-G1
without Auto Discharge
(Continuous 2.0A) AP2820DMTR-G1
2820DM-G1
Tube
2820DM-G1
Tape & Reel
AP2820EM-G1
2820EM-G1
Tube
AP2820EMTR-G1
2820EM-G1
Tape & Reel
Active High
AP2820FM-G1
without Auto Discharge
AP2820FMTR-G1
(Continuous 2.5A)
2820FM-G1
Tube
2820FM-G1
Tape & Reel
AP2820GM-G1
2820GM-G1
Tube
AP2820GMTR-G1
2820GM-G1
Tape & Reel
Active Low
AP2820HM-G1
without Auto Discharge
AP2820HMTR-G1
(Continuous 2.5A)
2820HM-G1
Tube
2820HM-G1
Tape & Reel
Active Low
with Auto Discharge
(Continuous 2.0A)
Active High
with Auto Discharge
(Continuous 2.5A)
Active Low
with Auto Discharge
(Continuous 2.5A)
Rev 1. 7
BCD Semiconductor Manufacturing Limited
4
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Ordering Information (Continued)
Package
Temperature
Range
-40 to 85°C
-40 to 85°C
MSOP-8
-40 to 85°C
-40 to 85°C
Condition
Part Number
Active High
AP2820AMM-G1
with Auto Discharge
(Continuous 2.0A) AP2820AMMTR-G1
Marking ID
Packing
Type
2820AMM-G1
Tube
2820AMM-G1
Tape & Reel
2820BMM-G1
Tube
2820BMM-G1
Tape & Reel
2820CMM-G1
Tube
2820CMM-G1
Tape & Reel
2820DMM-G1
Tube
2820DMM-G1
Tape & Reel
2820EMM-G1
Tube
2820EMM-G1
Tape & Reel
Active High
AP2820FMM-G1
without Auto Discharge
(Continuous 2.5A) AP2820FMMTR-G1
2820FMM-G1
Tube
2820FMM-G1
Tape & Reel
Active Low
AP2820GMM-G1
with Auto Discharge
(Continuous 2.5A) AP2820GMMTR-G1
2820GMM-G1
Tube
2820GMM-G1
Tape & Reel
2820HMM-G1
Tube
2820HMM-G1
Tape & Reel
Active High
AP2820BMM-G1
without Auto Discharge
(Continuous 2.0A) AP2820BMMTR-G1
Active Low
AP2820CMM-G1
with Auto Discharge
(Continuous 2.0A) AP2820CMMTR-G1
Active Low
AP2820DMM-G1
without Auto Discharge
(Continuous 2.0A) AP2820DMMTR-G1
Active High
AP2820EMM-G1
with Auto Discharge
(Continuous 2.5A) AP2820EMMTR-G1
Active Low
AP2820HMM-G1
without Auto Discharge
(Continuous 2.5A) AP2820HMMTR-G1
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant
and green.
Jul. 2012
Rev 1. 7
BCD Semiconductor Manufacturing Limited
5
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Value
Unit
VIN
6.0
V
Power Supply Voltage
Operating Junction Temperature
Range
Storage Temperature Range
TJ
150
ºC
TSTG
-65 to 150
ºC
Lead Temperature (Soldering, 10sec)
TLEAD
260
ºC
Thermal Resistance Junction to
Ambient
θJA
SOIC-8
135
MSOP-8
150
o
C/W
CDM (Charge Device Model)
1000
V
ESD (Human Body Model)
2000
V
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute
Maximum Ratings” for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter
Supply Voltage
Operating Ambient
Range
Jul. 2012
Temperature
Symbol
Min
Max
Unit
VIN
2.7
5.5
V
TA
-40
85
°C
Rev 1. 7
BCD Semiconductor Manufacturing Limited
6
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Electrical Characteristics
For A/B/C/D Versions
(VIN=5.0V, CIN=2.2μF, COUT=1.0μF, Typical TA=25°C, Bold typeface applies over -40°C≤TA≤85°C ranges, unless otherwise
specified)
Parameter
Symbol
Input Voltage Range
VIN
Switch On Resistance
RDS(ON)
Condition
Min
Typ Max Unit
2.7
5.5
V
60
80
mΩ
2.7
3.2
A
75
105
μA
VIN=5V, IOUT=2.0A
Current Limit
ILIMIT
VOUT=4.0V
Supply Current
ISUPPLY
VIN=5V, No Load
Fold-back Short Current
ISHORT
VOUT=0
1.18
Chip Disable, Shutdown Mode
0.1
Shutdown Supply Current
ISHUTDOWN
2.2
A
1
μA
Enable High Input Threshold
VENH
1.6
5.5
V
Enable Low Input Threshold
VENL
0
1.0
V
Force 0V to 5V at EN Pin
-1.0
1.0
μA
VIN Increasing from 0V
2.2
2.7
V
Enable Pin Input Current
Under
Voltage
Threshold Voltage
Lockout
IEN
VUVLO
Under Voltage Hysteresis
VUVLOHY
Reverse Current
IREVERSE
Output Pull Low Resistance
after Shutdown
RDISCHARGE
0.2
0.1
1.0
μA
AP2820A, AP2820C Only
100
200
Ω
tON
FLAG Pin Delay Time
tDFLG
From Enable Active to 90% of
Output
From
Over
Current
Fault
Condition to Flag Active
FLAG Pin Low Voltage
VFLG
ISINK=5mA
Thermal
Temperature
Shutdown
Thermal Shutdown Hysteresis
Jul. 2012
ILEAKAGE
V
Chip Disable, VOUT>VIN
Output Turn-on Time
FLAG Pin Leakage Current
2.5
μs
500
5
10
15
ms
35
70
mV
1.0
μA
FLAG Disable, Force 5.0V
TOTSD
150
°C
THYOTSD
30
°C
Rev 1. 7
BCD Semiconductor Manufacturing Limited
7
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Electrical Characteristics (Continued)
For E/F/G/H Versions
(VIN=5.0V, CIN=2.2μF, COUT=1.0μF, Typical TA=25°C, Bold typeface applies over -40°C≤TA≤85°C ranges, unless otherwise
specified)
Parameter
Symbol
Input Voltage Range
VIN
Switch On Resistance
RDS(ON)
Condition
Min
Typ Max Unit
2.7
5.5
V
60
80
mΩ
3.4
4.2
A
80
110
μA
VIN=5V, IOUT=2.5A
Current Limit
ILIMIT
VOUT=4.0V
Supply Current
ISUPPLY
VIN=5V, No Load
Fold-back Short Current
ISHORT
VOUT=0
1.18
Chip Disable, Shutdown Mode
0.1
Shutdown Supply Current
ISHUTDOWN
2.8
A
1
μA
Enable High Input Threshold
VENH
1.6
5.5
V
Enable Low Input Threshold
VENL
0
1.0
V
Force 0V to 5V at EN Pin
-1.0
1.0
μA
VIN Increasing from 0V
2.2
2.7
V
Enable Pin Input Current
Under
Voltage
Threshold Voltage
Lockout
IEN
VUVLO
Under Voltage Hysteresis
VUVLOHY
Reverse Current
IREVERSE
Output Pull Low Resistance
after Shutdown
RDISCHARGE
0.2
0.1
1.0
μA
AP2820E, AP2820G Only
100
200
Ω
tON
FLAG Pin Delay Time
tDFLG
From Enable Active to 90% of
Output
From
Over
Current
Fault
Condition to Flag Active
FLAG Pin Low Voltage
VFLG
ISINK=5mA
Thermal
Temperature
Shutdown
Thermal Shutdown Hysteresis
Jul. 2012
ILEAKAGE
V
Chip Disable, VOUT>VIN
Output Turn-on Time
FLAG Pin Leakage Current
2.5
μs
500
5
10
15
ms
35
70
mV
1.0
μA
FLAG Disable, Force 5.0V
TOTSD
150
o
C
THYOTSD
30
o
C
Rev 1. 7
BCD Semiconductor Manufacturing Limited
8
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Typical Performance Characteristics
100
100
VIN=5V
Enable Active
No Load
90
90
80
Supply Current (μA)
Supply Current (μA)
80
70
60
50
40
30
70
VIN=5V
Enable Active
No Load
60
50
40
30
20
20
10
10
For AP2820E/F/G/H Versions
For AP2820A/B/C/D Versions
0
-40.0
-20.0
0.0
20.0
40.0
60.0
0
-40.0
80.0
-20.0
0.0
20.0
40.0
Figure 4. Supply Current vs. Ambient Temperature
80.0
Figure 5. Supply Current vs. Ambient Temperature
100
3.0
O
VIN=5V
Enable Active
TA=25 C
Enable Active
90
80
2.8
70
Current Limit (A)
Supply Current (μA)
60.0
O
Ambient Temperature ( C)
O
Ambient Temperature ( C)
60
O
TA=-40 C
50
O
TA=25 C
40
O
TA=85 C
30
2.6
O
TA=25 C
2.4
20
2.2
10
0
For AP2820A/B/C/D Versions
For AP2820A/B/C/D Versions
-10
2.0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
3.0
5.5
Supply Voltage (V)
4.0
4.5
5.0
5.5
Supply Voltage (V)
Figure 6. Supply Current vs. Supply Voltage
Jul. 2012
3.5
Figure 7. Current Limit vs. Supply Voltage
Rev 1. 7
BCD Semiconductor Manufacturing Limited
9
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Typical Performance Characteristics (Continued)
3.2
VIN=5V
Enable Active
3.1
3.0
VIN=5V
Enable Active
3.4
3.2
2.8
Current Limit (A)
Current Limit (A)
2.9
2.7
2.6
2.5
2.4
3.0
2.8
2.3
2.2
2.0
-40.0
2.6
For AP2820A/B/C/D Versions
2.1
-20.0
0.0
20.0
40.0
60.0
-40.0
80.0
For AP2820E/F/G/H Versions
-20.0
60.0
80.0
100
VIN=5V
Enable Active
80
70
60
VIN=5V
Enable Active
90
Switch On Resistance (mΩ)
90
Switch On Resistance (mΩ)
40.0
Figure 9. Current Limit vs. Ambient Temperature
100
IOUT=2.0A
50
40
30
20
80
70
60
IOUT=2.5A
50
40
30
20
10
10
For AP2820E/F/G/H Versions
For AP2820A/B/C/D Versions
-20.0
0.0
20.0
40.0
60.0
0
-40.0
80.0
-20.0
0.0
20.0
40.0
60.0
80.0
O
O
Jul. 2012
20.0
O
Figure 8. Current Limit vs. Ambient Temperature
0
-40.0
0.0
Ambient Temperature ( C)
O
Ambient Temperature ( C)
Ambient Temperature ( C)
Ambient Temperature ( C)
Figure 10. Switch On Resistance
vs. Ambient Temperature
Figure 11. Switch On Resistance
vs. Ambient Temperature
Rev 1. 7
BCD Semiconductor Manufacturing Limited
10
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Typical Performance Characteristics (Continued)
IOUT=2.0A
Enable Active
90
Switch On Resistance (mΩ)
Under Voltage Lockout Threshold Voltage (V)
100
80
70
O
TA=25 C
60
50
40
30
3.0
3.5
4.0
4.5
5.0
5.5
2.70
Enable Active
2.65
2.60
2.55
VIN Rising
2.50
2.45
2.40
VIN Falling
2.35
2.30
2.25
2.20
-40.0
-20.0
Flag Delay Time during Over Current (mS)
Flag Delay Time during Over Current (mS)
VIN=5V
14
Enable Active
13
12
11
10
9
8
7
6
0.0
20.0
40.0
60.0
80.0
60.0
80.0
VIN=5V
14
Enable Active
O
TA=25 C
12
10
8
6
3.0
3.5
4.0
4.5
5.0
5.5
Supply Voltage (V)
O
Ambient Temperature ( C)
Figure 14. Flag Delay Time during Over Current
vs. Ambient Temperature
Jul. 2012
40.0
Figure 13. UVLO Voltage vs. Ambient Temperature
15
-20.0
20.0
O
Figure 12. Switch On Resistance vs. Supply Voltage
5
-40.0
0.0
Ambient Temperature ( C)
Supply Voltage (V)
Figure 15. Flag Delay Time during Over Current
vs. Supply Voltage
Rev 1. 7
BCD Semiconductor Manufacturing Limited
11
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Typical Performance Characteristics (Continued)
1.5
1.30
Output Short to GND Current (A)
1.26
Output Short to GND Current (A)
VIN=5V
Enable Active
1.28
1.24
1.22
1.20
1.18
1.16
1.14
1.12
1.10
1.08
1.06
1.04
VIN=5V
Enable Active
1.4
1.3
1.2
1.1
1.02
1.0
-40.0
1.00
3.0
3.5
4.0
4.5
5.0
-20.0
20.0
40.0
60.0
80.0
Ambient Temperature ( C)
Figure 16. Output Short to GND Current
vs. Supply Voltage
Figure 17. Output Short to GND Current
vs. Ambient Temperature
1.7
1.6
O
VIN=5V
TA=25 C
1.6
Enable Threshold Voltage (V)
1.5
Enable Threshold Voltage (V)
0.0
O
Supply Voltage (V)
1.4
VEN_H
1.3
1.2
VEN_L
1.1
1.5
1.4
VEN_H
1.3
1.2
1.1
VEN_L
1.0
0.9
0.8
1.0
-40.0
0.7
-20.0
0.0
20.0
40.0
60.0
80.0
3.0
O
Ambient Temperature ( C)
4.0
4.5
5.0
5.5
Supply Voltage (V)
Figure 18. Enable Threshold Voltage
vs. Ambient Temperature
Jul. 2012
3.5
Figure 19. Enable Threshold Voltage
vs. Supply Voltage
Rev 1. 7
BCD Semiconductor Manufacturing Limited
12
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Typical Performance Characteristics (Continued)
VEN
5V/div
VEN
5V/div
IINRUSH
1A/div
IINRUSH
20mA/div
VOUT
1V/div
VOUT
1V/div
Time 500μs/div
Time 500μs/div
Figure 21. Output Turn On and Rise Time
(CIN=1.0μF, COUT=1.0μF, RL=3.3Ω)
Figure 20. Output Turn On and Rise Time
(CIN=1.0μF, COUT=1.0μF, No Load)
VEN
5V/div
VEN
5V/div
COUT=470μF
COUT=100μF
COUT=220μF
VOUT
1V/div
VOUT C =22μF
OUT
1V/div
IINRUSH
1A/div
COUT=1μF
Time 5ms/div
Time 500μs/div
Figure 22. Output Turn On and Rise Time
(CIN=1.0μF, COUT=220μF, No Load)
Jul. 2012
Figure 23. Output Turn Off and Fall Time
(VIN=5V, CIN=1.0μF, No Load)
Rev 1. 7
BCD Semiconductor Manufacturing Limited
13
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Typical Performance Characteristics (Continued)
VEN
5V/div
VEN
5V/div
VOUT
1V/div
IOUT
1A/div
VOUT
1V/div
IOUT
1A/div
Time 500μs/div
Time 20ms/div
Figure 25. Output Short to GND Current
(VIN=5V, CIN=1.0μF)
Figure 24. Output Turn Off and Fall Time
(VIN=5V, CIN=1.0μF, COUT=470μF, RL=3.3Ω)
VFLAG
1V/div
VFLAG
1V/div
IOUT
1A/div
IOUT
1A/div
VOUT
1V/div
VOUT
1V/div
Time 5ms/div
Time 5ms/div
Figure 26. FLAG Response during Over Current
Jul. 2012
Figure 27. FLAG Response during
Over Temperature (TA=125oC)
Rev 1. 7
BCD Semiconductor Manufacturing Limited
14
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Typical Application
Note 2: 2.2μF input capacitor is enough in most application cases.
If the VOUT is short to ground frequently during usage, large size input capacitor is necessary, recommend
22μF.
Figure 28. Typical Application of AP2820
Jul. 2012
Rev 1. 7
BCD Semiconductor Manufacturing Limited
15
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Mechanical Dimensions
Unit: mm(inch)
R0.150(0.006)
SOIC-8
Jul. 2012
Rev 1. 7
BCD Semiconductor Manufacturing Limited
16
Advance Datasheet
High-side Power Distribution Switch with Enable and Flag
AP2820
Mechanical Dimensions (Continued)
2.900(0.114)
3.100(0.122)
0.200(0.008)
0.000(0.000)
4.700(0.185)
5.100(0.201)
Jul. 2012
Unit: mm(inch)
0.410(0.016)
0.650(0.026)
MSOP-8
Rev 1. 7
BCD Semiconductor Manufacturing Limited
17
BCD Semiconductor Manufacturing Limited
http://www.bcdsemi.com
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NOTICE
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BCD
Semiconductor Manufacturing
Manufacturing Limited
Limited reserves
reserves the
the right
right to
to make
make changes
changes without
without further
further notice
notice to
to any
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products or
or specifispecifications herein.
cations
herein. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
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for use
use of
of any
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purpose, nor
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Semiconductor Manufacturing
Manufacturing Limited
Limited assume
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arising out
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Semiconductor Manufacturing Limited
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No.
1600, Zi
Xing Road,
Shanghai ZiZhu
Science-basedLimited
Industrial Park, 200241, China
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Tel:
Fax: +86-21-24162277
800,+86-21-24162266,
Yi Shan Road, Shanghai
200233, China
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
REGIONAL SALES OFFICE
Shenzhen OfficeSALES OFFICE
REGIONAL
- Wafer
FabSemiconductor Manufacturing Limited
BCD
Shanghai
SIM-BCD
Semiconductor Manufacturing Co., Ltd.
- IC Design
Group
800 Yi
Shan Road,
Shanghai
200233,
China Corporation
Advanced
Analog
Circuits
(Shanghai)
Tel: +86-21-6485
1491,YiFax:
0008200233, China
8F, Zone B, 900,
Shan+86-21-5450
Road, Shanghai
Tel: +86-21-6495 9539, Fax: +86-21-6485 9673
Taiwan Office
Shanghai
Semiconductor Manufacturing Co., Ltd., Shenzhen Office
BCD Taiwan
Semiconductor
Shenzhen SIM-BCD
Office
Office (Taiwan) Company Limited
Unit
A Room
1203, Skyworth
Bldg., Gaoxin
Ave.1.S., Nanshan
Shenzhen,
4F, 298-1,
Guang Road,(Taiwan)
Nei-Hu District,
Taipei,
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Co., Ltd.District,
Shenzhen
Office
BCDRui
Semiconductor
Company
Limited
China
Taiwan
Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,
Tel:
+86-755-8826
Tel: +886-2-2656
2808
Room
E, 5F, Noble 7951
Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China
Taiwan
Fax:
+86-755-88267951
7865
Fax: +886-2-2656
28062808
Tel: +86-755-8826
Tel: +886-2-2656
Fax: +86-755-8826 7865
Fax: +886-2-2656 2806
USA Office
BCD Office
Semiconductor Corp.
USA
30920Semiconductor
Huntwood Ave.Corporation
Hayward,
BCD
CA 94544,
USA Ave. Hayward,
30920
Huntwood
Tel :94544,
+1-510-324-2988
CA
U.S.A
Fax:: +1-510-324-2988
+1-510-324-2788
Tel
Fax: +1-510-324-2788
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