Diodes DMP2003UPS 20v p-channel enhancement mode mosfet Datasheet

DMP2003UPS
Green
20V P-CHANNEL ENHANCEMENT MODE MOSFET
PowerDI5060-8
Product Summary
Features
BVDSS
RDS(ON)
ID
TC = +25°C
2.2mΩ @ VGS = -10V
-150A
-20V
2.55mΩ @ VGS = -4.5V
-120A
4.0mΩ @ VGS = -2.5V
-90A



Thermally Efficient Package-Cooler Running Applications
High Conversion Efficiency
Low RDS(ON) – Minimizes On State Losses



<1.1mm Package Profile – Ideal for Thin Applications
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Description
This new generation MOSFET is designed to minimize RDS(ON) and
Mechanical Data
®
yet maintain superior switching performance. This device is ideal for
use in notebook battery power management and load switch.

Case: PowerDI 5060-8

Applications


Case Material: Molded Plastic, ―Green‖ Molding Compound;
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Finish - Matte Tin Annealed over Copper Leadframe;
Solderable per MIL-STD-202, Method 208
Weight: 0.097 grams (Approximate)

Switch

PowerDI5060-8
D
S
D
S
D
S
D
G
D
Pin1
G
S
Bottom View
Top View
Top View
Pin Configuration
Internal Schematic
Ordering Information (Note 4)
Part Number
DMP2003UPS-13
Notes:
Case
PowerDI5060-8
Packaging
2,500 / Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
PowerDI5060-8
D
D
D
D
=Manufacturer’s Marking
P2003US = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 17 = 2017)
WW = Week Code (01 to 53)
P2003US
YY WW
S
S
S
G
PowerDI is a registered trademark of Diodes Incorporated.
DMP2003UPS
Document number: DS39597 Rev. 2 - 2
1 of 7
www.diodes.com
October 2017
© Diodes Incorporated
DMP2003UPS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
TC = +25°C
TC = +70°C
Continuous Drain Current, VGS = -10V (Note 7)
ID
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 7)
Pulsed Body Diode Forward Current (10μs Pulse, Duty Cycle = 1%)
Avalanche Current, L = 0.1mH (Note 8)
Avalanche Energy, L = 0.1mH (Note 8)
IDM
IS
ISM
IAS
EAS
Value
-20
±12
-150
-120
-350
-120
-350
-32
67
Unit
V
V
Value
1.4
90
2.7
46
80
1.5
-55 to +150
Unit
W
°C/W
W
°C/W
W
°C/W
°C
A
A
A
A
A
mJ
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
Steady State
Steady State
Symbol
PD
RJA
PD
RJA
PD
RJC
TJ, TSTG
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-20
—
—
—
—
—
—
-1
±100
V
µA
nA
VGS = 0V, ID = -250µA
VDS = -16V, VGS = 0V
VGS = 12V, VDS = 0V
VGS(TH)
RDS(ON)
-1.4
2.2
2.55
4.0
-1.1
mΩ
VSD
—
1.7
1.9
2.5
-0.6
V
Static Drain-Source On-Resistance
-0.5
—
—
—
—
VDS = VGS, ID = -250µA
VGS = -10V, ID = -25A
VGS = -4.5V, ID = -20A
VGS = -2.5V, ID = -15A
VGS = 0V, IS = -5A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
—
8352
1406
599
13.2
79
177
14.3
19.8
7.8
4.9
377
189
49
39
—
—
—
—
—
—
—
—
—
—
—
—
—
—
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
ns
nC
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = -4.5V)
Total Gate Charge (VGS = -10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
V
Test Condition
VDS = -10V, VGS = 0V
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = -10V, ID = -20A
VDD = -10V, VGEN = -4.5V,
RGEN = 1Ω, ID = -10A
IF = -10A, di/dt = 100A/µs
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Thermal resistance from junction to soldering point (on the exposed drain pad).
8. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C.
9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to product testing.
DMP2003UPS
Document number: DS39597 Rev. 2 - 2
2 of 7
www.diodes.com
October 2017
© Diodes Incorporated
DMP2003UPS
30
50.0
VGS = -10V
VGS = -4.5V
VGS = -4.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
40.0
VGS = -3.5V
30.0
VDS= -5V
25
VGS = -3.0V
VGS = -2.0V
VGS = -2.5V
20.0
VGS = -1.8V
10.0
VGS = -1.3V
VGS = -1.5V
20
15
10
5
0
TJ=-55℃
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
0
2
0.5
1
1.5
2
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1.Typical Output Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
TJ= 25℃
TJ= 125℃
0
0.0
0.004
0.0035
0.003
VGS = -2.5V
0.0025
VGS = -4.5V
0.002
0.0015
VGS = -10V
0.001
0.0005
0
0
5
10
15
20
25
30
35
40
45
2.5
0.01
ID = -15A
0.009
ID = -20A
0.008
ID = -25A
0.007
0.006
0.005
0.004
0.003
0.002
0.001
0
0
50
2
4
6
8
10
VGS, GATE-SOURCE VOLTAGE (V)
ID, DRAIN-SOURCE CURRENT (A)
12
Figure 4. Typical Transfer Characteristic
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
1.9
0.004
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
TJ= 85℃
TJ= 150℃
VGS= -10V
0.003
TJ= 125℃
TJ= 150℃
0.002
TJ= 85℃
TJ= 25℃
0.001
TJ= -55℃
0
0
5
10
15
20
ID, DRAIN CURRENT (A)
25
30
Document number: DS39597 Rev. 2 - 2
VGS = -10V, ID = -25A
1.5
VGS = -4.5V, ID = -20A
1.3
1.1
VGS = -2.5V, ID = -15A
0.9
0.7
0.5
-50
-25
0
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Junction
Temperature
Figure 5. Typical On-Resistance vs. Drain Current
and Junction Temperature
DMP2003UPS
1.7
3 of 7
www.diodes.com
October 2017
© Diodes Incorporated
0.005
1.2
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
DMP2003UPS
0.004
VGS = -2.5V, ID = -15A
0.003
0.002
VGS = -10V, ID = -25A
0.001
VGS = -4.5V, ID = -20A
1
0.8
ID = -1mA
0.6
0.2
0
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Junction
Temperature
30
100000
f=1MHz
CT, JUNCTION CAPACITANCE (pF)
VGS = 0V
25
IS, SOURCE CURRENT (A)
20
15
10
TJ= 85℃
TJ= 150℃
TJ= 25℃
5
TJ= 125℃
TJ= -55℃
Ciss
10000
Coss
1000
Crss
100
0
0
0
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
2
4
6
8 10 12 14 16 18
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
20
1000
10
RDS(ON) LIMITED
9
PW =1µs
ID, DRAIN CURRENT (A)
8
7
VGS (V)
ID = -250μA
0.4
6
5
VDS = -10V, ID = -20A
4
3
100
PW =10µs
PW =100µs
PW =1ms
10
2
1
1
0
0
20
40
60
80 100 120 140 160 180 200
Qg (nC)
Figure 11. Gate Charge
DMP2003UPS
Document number: DS39597 Rev. 2 - 2
TJ(MAX)=150℃
PW =10ms
TC=25℃
Single Pulse
PW =100ms
DUT on infinite
PW =1s
heatsink
VGS= -10V
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
100
Figure 12. SOA, Safe Operation Area
4 of 7
www.diodes.com
October 2017
© Diodes Incorporated
DMP2003UPS
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.9
D=0.5
D=0.7
D=0.3
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
RθJC(t) = r(t) * RθJC
RθJC= 1.5℃/W
Duty Cycle, D = t1 / t2
D=0.005
D=Single Pulse
0.001
1E-06
1E-05
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
DMP2003UPS
Document number: DS39597 Rev. 2 - 2
5 of 7
www.diodes.com
October 2017
© Diodes Incorporated
DMP2003UPS
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
D
D1
Detail A
O (4X)
c
A1
E1 E
e
O (4X)
1
b (8X)
e/2
1
L
b2 (4X)
D3
A
K
D2
E3 E2
b3 (4X)
M
M1
Detail A
PowerDI5060-8
Dim Min
Max Typ
A
0.90 1.10 1.00
A1
0.00 0.05

b
0.33 0.51 0.41
b2 0.200 0.350 0.273
b3
0.40 0.80 0.60
c
0.230 0.330 0.277
D
5.15 BSC
D1
4.70 5.10 4.90
D2
3.70 4.10 3.90
D3
3.90 4.30 4.10
E
6.15 BSC
E1
5.60 6.00 5.80
E2
3.28 3.68 3.48
E3
3.99 4.39 4.19
e
1.27 BSC
G
0.51 0.71 0.61
K
0.51


L
0.51 0.71 0.61
L1 0.100 0.200 0.175
M
3.235 4.035 3.635
M1
1.00 1.40 1.21
Θ
10°
12°
11°
Θ1
6°
8°
7°
All Dimensions in mm
L1
G
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
X4
Y2
X3
Y3
Y5
Y1
X2
Y4
X1
Y7
Y6
G1
C
X
DMP2003UPS
Document number: DS39597 Rev. 2 - 2
G
Y(4x)
6 of 7
www.diodes.com
Dimensions
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value (in mm)
1.270
0.660
0.820
0.610
4.100
0.755
4.420
5.610
1.270
0.600
1.020
0.295
1.825
3.810
0.180
6.610
October 2017
© Diodes Incorporated
DMP2003UPS
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2017, Diodes Incorporated
www.diodes.com
DMP2003UPS
Document number: DS39597 Rev. 2 - 2
7 of 7
www.diodes.com
October 2017
© Diodes Incorporated