STMicroelectronics BTA26-400BRG 25 a standard and snubberless triac Datasheet

BTA24, BTB24, BTA25
BTA26, BTB26, T25
25 A standard and Snubberless™ triacs
Features
A2
■
High current triac
Low thermal resistance with clip bonding
■ High commutation (4 quadrant) or very high
commutation (3 quadrant) capability
■ BTA series UL1557 certified (File ref: 81734)
■ Packages are RoHS (2002/95/EC) compliant
■
G
A1
A2
A1
A2
G
A1
A2
G
TO-220AB Insulated
(BTA24)
Applications
Applications include the ON/OFF function in
applications such as static relays, heating
regulation, induction motor starting circuits, etc.,
or for phase control operation in light dimmers,
motor speed controllers, and silmilar.
TO-220AB
(BTB24)
A1
A2
G
A1
A2
The snubberless versions (BTA/BTB...W and T25
series) are especially recommended for use on
inductive loads, due to their high commutation
performances. The BTA series provides an
insulated tab (rated at 2500 VRMS).
RD91
(BTA25)
G
TOP3 Insulated
(BTA26)
A2
A2
A1 A2
Description
A1
G
A2
Available either in through-hole or surface-mount
packages, the BTA24, BTB24, BTA25, BTA26,
BTB26 and T25 triac series is suitable for general
purpose mains power AC switching.
Table 1.
D2PAK
G
TOP3
(BTB26)
(T25)
Device summary
Symbol
Parameter
BTA24(1)
BTB24
BTA25(1)
BTA26(1)
BTB26
T25
Unit
25
25
25
25
25
25
A
600
600 / 800
V
IT(RMS)
RMS on-state
current
VDRM/VRRM
Repetitive peak
off-state voltage
IGT (Snubberless)
Triggering gate
current
35 / 50
35 / 50
50
35 / 50
-
35
mA
IGT (Standard)
Triggering gate
current
-
50
50
50
50
-
mA
600 / 800 600 / 800 600 / 800 600(2) / 800
1. Insulated packages
2. 600 V version available only with IGT = 50 mA (Snubberless and Standard)
TM: Snubberless is a trademark of STMicroelectronics
July 2007
Rev 10
1/12
www.st.com
12
Characteristics
BTA24, BTB24, BTA25, BTA26, BTB26, T25
1
Characteristics
Table 2.
Absolute maximum ratings
Symbol
Parameter
D2
ITSM
I²t
dI/dt
VDSM/VRSM
IGM
PG(AV)
Tstg
Tj
RD91 Ins/
TOP3 Ins.
Tc = 100° C
TO-220AB Ins.
Tc = 75° C
Non repetitive surge peak on-state
current (full cycle, Tj initial = 25° C)
F = 50 Hz
t = 20 ms
250
F = 60 Hz
t = 16.7 ms
260
I²t Value for fusing
tp = 10 ms
Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns
F = 120 Hz
Non repetitive surge peak off-state
voltage
Peak gate current
RMS on-state current (full sine wave)
A
340
A²s
Tj = 125° C
50
A/µs
tp = 10 ms
Tj = 25° C
VDRM/VRRM
+ 100
V
tp = 20 µs
Tj = 125° C
4
A
Tj = 125° C
1
W
- 40 to + 150
- 40 to + 125
°C
Average gate power dissipation
Electrical characteristics (Tj = 25° C, unless otherwise specified), Snubberless and
logic level (3 quadrants) T25, BTA/BTB24...W, BTA25...W, BTA26...W
T25
IGT(1)
VGT
Test Conditions
VD = 12 V RL = 33 Ω
VGD
VD = VDRM RL = 3.3 kΩ
Tj = 125° C
IH(2)
IT = 500 mA
IL
IG = 1.2 IGT
dV/dt (2)
(2)
BTA/BTB
Quadrant
Unit
T2535
CW
BW
35
35
50
I - II - III
MAX.
I - II - III
MAX.
1.3
V
I - II - III
MIN.
0.2
V
MAX.
I - III
50
50
75
70
70
80
80
80
100
MAX.
II
mA
mA
mA
VD = 67 %VDRM gate open
Tj = 125° C
MIN.
500
500
1000
V/µs
Without snubber
Tj = 125° C
MIN.
13
13
22
A/ms
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.
2/12
A
Tc = 100° C
Symbol
(dI/dt)c
25
PAK /
TO-220AB
Storage junction temperature range
Operating junction temperature range
Table 3.
Unit
Tc = 105° C
TOP3
IT(RMS)
Value
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Table 4.
Characteristics
Electrical characteristics (Tj = 25° C, unless otherwise specified),
standard (4 quadrants), BTB24...B, BTA25...B, BTA26...B, BTB26...B
Symbol
Test Conditions
Quadrant
Value
I - II - III
IGT (1)
VD = 12 V
50
MAX.
RL = 33 Ω
IV
VGT
VGD
VD = VDRM RL = 3.3 kΩ Tj = 125° C
IH(2))
IT = 500 mA
IL
IG = 1.2 IGT
(dV/dt)c
(2)
mA
100
ALL
MAX.
1.3
V
ALL
MIN.
0.2
V
MAX.
80
mA
I - III - IV
dV/dt(2)
Unit
70
MAX.
II
mA
160
VD = 67 %VDRM gate open
Tj = 125° C
MIN.
500
V/µs
(dI/dt)c = 13.3 A/ms
Tj = 125° C
MIN.
10
V/µs
Value
Unit
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.
Table 5.
Static characteristics
Symbol
VTM (1)
Test Conditions
Tj = 25° C
MAX.
1.55
V
Threshold voltage
Tj = 125° C
MAX.
0.85
V
Rd (1)
Dynamic resistance
Tj = 125° C
MAX.
16
mΩ
IDRM
IRRM
5
µA
VDRM = VRRM
3
mA
Vt0
(1)
ITM = 35 A
tp = 380 µs
Tj = 25° C
MAX.
Tj = 125° C
1. for both polarities of A2 referenced to A1.
Table 6.
Thermal resistance
Symbol
Rth(j-c)
Parameter
TOP 3
0.6
D2PAK / TO-220AB
0.8
RD91 Insulated / TOP3 Insulated
0.9
TO-220AB Insulated
1.7
Junction to case (AC)
S = 1 cm
Junction to ambient
Unit
° C/W
(1)
Rth(j-a)
Value
²
2
D PAK
45
TOP3 / TOP3 Insulated
50
TO-220AB / TO-220AB Insulated
60
° C/W
1. S = Copper surface under tab.
3/12
Characteristics
Figure 1.
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Maximum power dissipation versus Figure 2.
RMS on-state current (full cycle)
P(W)
IT(RMS)(A)
30
30
RMS on-state current versus case
temperature (full cycle)
BTB26
25
25
BTA24
20
20
15
15
10
10
5
BTB24 / T25xx /
BTA25 / BTA26
5
IT(RMS)(A)
TC(°C)
0
0
0
5
10
15
20
25
0
25
D2PAK RMS on-state current versus Figure 4.
ambient temperature (printed
circuit board FR4, copper
thickness: 35µm) (full cycle)
Figure 3.
IT(RMS)(A)
50
75
100
125
Relative variation of thermal
impedance versus pulse
duration
K=[Zth/Rth]
4.0
1E+0
D2PAK
(S=1cm2)
3.5
Zth(j-c)
3.0
Zth(j-a)
BTA / BTB24 / T25
1E-1
2.5
2.0
1.5
1E-2
Zth(j-a)
BTA26
1.0
0.5
tp(s)
Tamb(°C)
1E-3
0.0
0
25
Figure 5.
50
75
100
1E-3
125
On-state characteristics
(maximum values)
Figure 6.
ITM(A)
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
Surge peak on-state current
versus number of cycles
ITSM(A)
300
300
Tj max.
Vto = 0.85V
Rd = 16 mΩ
100
Tj = Tj max.
250
t=20ms
One cycle
200
Non repetitive
Tj initial=25°C
150
10
Repetitive
TC=75°C
Tj = 25°C.
100
50
1
0.5
4/12
Number of cycles
VTM(V)
1.0
1.5
2.0
2.5
0
3.0
3.5
4.0
4.5
1
10
100
1000
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Figure 7.
Characteristics
Non-repetitive surge peak on-state Figure 8.
current for a sinusoidal pulse with
width tp < 10 ms and corresponding
value of I2t
Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
ITSM(A), I2t (A2s)
2.5
3000
Tj initial=25°C
dI/dt limitation:
50A/µs
2.0
IGT
1000
1.5
ITSM
IH & IL
1.0
I2t
0.5
Tj(°C)
tp(ms)
0.0
100
0.01
0.10
Figure 9.
1.00
-40
10.00
Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
-20
0
20
40
60
80
100
120
140
Figure 10. Relative variation of critical rate of
decrease of main current versus Tj
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
6
2.4
2.2
5
2.0
1.8
4
1.6
T2535/CW/BW
1.4
3
B
1.2
2
1.0
0.8
1
0.6
(dV/dt)c (V/µs)
Tj(°C)
0.4
0
0.1
1.0
10.0
100.0
0
25
50
75
100
125
Figure 11. D2PAK thermal resistance junction to
ambient versus copper surface under
tab (printed circuit board FR4, copper
thickness: 35 µm)
Rth(j-a)(°C/W)
80
70
D2PAK
60
50
40
30
20
10
S(cm²)
0
0
4
8
12
16
20
24
28
32
36
40
5/12
Ordering information scheme
2
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Ordering information scheme
Figure 12. BTA and BTB series
BT A 24 - 600 BW RG
Triac series
Insulation
A = insulated
B = non insulated
Current
24 = 25 A in TO-220AB
25 = 25 A in RD91
26 = 25 A in TOP3
Voltage
600 = 600 V
800 = 800 V
Sensitivity and type
B = 50 mA Standard
BW = 50 mA Snubberless
CW = 35 mA Snubberless
Packing mode
RG = Tube
Figure 13. T25 series
T 25 35 - 600 G (-TR)
Triac series
Current
25 = 25 A
Sensitivity
35 = 35 mA
Voltage
600 = 600 V
800 = 800 V
Package
G = D2PAK
Packing mode
Blank = Tube
-TR = Tape and Reel
6/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25
3
Package information
Package information
●
Epoxy meets UL94,V0
●
Cooling method: C
●
Recommended torque value: 0.4 - 0.5 Nm (TO-220AB), 0.9 - 1.2 Nm (TOP3 and RD91)
●
Maximum torque value for BTB24 is 0.5 Nm
Table 7.
D2PAK dimensions
DIMENSIONS
REF.
Millimeters
Min.
A
E
C2
L2
D
L
L3
A1
B2
R
C
Typ.
Inches
Max.
Min.
Typ.
Max.
A
4.30
4.60
0.169
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.25
C
0.45
0.60
0.017
0.024
C2
1.21
1.36
0.047
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.28 0.393
0.405
G
4.88
5.28
0.192
0.208
L
15.00
15.85 0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
1.40
0.048 0.055
B
G
A2
2mm min.
FLAT ZONE
V2
R
V2
0.40
0°
0.016
8°
0°
8°
Figure 14. D2PAK footprint dimensions (in millimeters)
16.90
10.30
5.08
1.30
8.90
3.70
7/12
Package information
Table 8.
BTA24, BTB24, BTA25, BTA26, BTB26, T25
RD91 dimensions
DIMENSIONS
REF.
Millimeters
Min.
A
A2
L2
L1
A1
B2
Min.
40.00
29.90
30.30
Max.
1.575
1.177
1.193
A2
22.00
0.867
B
27.00
1.063
B1
C
B1
C2
C1
A1
N1
N2
B
F
E3
I
A
8/12
Max.
Inches
13.50
16.50
0.531
0.650
B2
24.00
0.945
C
14.00
0.551
C1
3.50
0.138
C2
1.95
3.00
0.077
0.118
E3
0.70
0.90
0.027
0.035
F
4.00
4.50
0.157
0.177
I
11.20
13.60
0.441
0.535
L1
3.10
3.50
0.122
0.138
L2
1.70
1.90
0.067
0.075
N1
33°
43°
33°
43°
N2
28°
38°
28°
38°
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Table 9.
Package information
TOP3 (insulated and non_insulated) dimensions
DIMENSIONS
REF.
Millimeters
Min.
H
R
A
B
ØL
Typ.
Inches
Max.
Min.
Typ.
Max.
A
4.4
4.6
0.173
0.181
B
1.45
1.55 0.057
0.061
C
14.35
15.60 0.565
0.614
D
0.5
0.7
0.020
0.028
E
2.7
2.9
0.106
0.114
F
15.8
16.5 0.622
0.650
G
20.4
21.1 0.815
0.831
H
15.1
15.5 0.594
0.610
J
5.4
5.65 0.213
0.222
K
3.4
3.65 0.134
0.144
ØL
4.08
4.17 0.161
0.164
P
1.20
1.40 0.047
0.055
K
F
P
G
C
J
J
D
E
R
4.60
0.181
9/12
Package information
Table 10.
BTA24, BTB24, BTA25, BTA26, BTB26, T25
TO-220AB (insulated and non-insulated) dimensions
DIMENSIONS
REF.
Millimeters
Min.
A
15.20
a1
C
B
ØI
b2
Typ.
Max.
Inches
Min.
Typ.
15.90 0.598
3.75
Max.
0.625
0.147
a2
13.00
14.00 0.511
0.551
B
10.00
10.40 0.393
0.409
b1
0.61
0.88
0.024
0.034
b2
1.23
1.32
0.048
0.051
C
4.40
4.60
0.173
0.181
c1
0.49
0.70
0.019
0.027
c2
2.40
2.72
0.094
0.107
e
2.40
2.70
0.094
0.106
F
6.20
6.60
0.244
0.259
ØI
3.75
3.85
0.147
0.151
I4
15.80 16.40 16.80 0.622 0.646 0.661
L
2.65
2.95
0.104
0.116
l2
1.14
1.70
0.044
0.066
l3
1.14
1.70
0.044
0.066
L
F
A
I4
l3
c2
a1
l2
a2
M
b1
c1
e
M
2.60
0.102
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
10/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25
4
Ordering information
Ordering information
Table 11.
Ordering information
Ordering type
Marking
Package
Weight
BTA/BTB24-xxxyzRG
BTA/BTB24 xxxyz
TO-220AB
2.3 g
50
Tube
BTA25-xxxyz
BTA25xxxyz
RD91
20 g
25
Bulk
BTA26-xxxyRG
BTA26xxxyz
TOP3 Ins.
4.5 g
30
Tube
BTB26-600BRG
BTB26600B
TOP3
4.5 g
30
Tube
T2535-xxxG
T2535 xxxG
D2PAK
50
Tube
1.5 g
1000
Tape and reel
T2535-xxxG-TR
T2535 xxxG
Base qty Delivery mode
Note: xxx = voltage, y = sensitivity, z = type
5
Revision history
Table 12.
Revision history
Date
Revision
Oct-2002
6A
13-Feb-2006
7
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
31-May-2006
8
Reformatted to current standard. Tc in figure 3 changed to Tamb
31-Jul-2006
9
Typing error corrected on page 1 (BTB124 instead of BTB24)
10
Added BTB26-600BRG. Restructured cover page and section 2:
Ordering information scheme on page 6 to simplify product selection.
Thermal resistance values updated in Table 6 and Figure 2. Graphic
for I2t updated in Figure 7.
05-Jul-2007
Description of changes
Previous update.
11/12
BTA24, BTB24, BTA25, BTA26, BTB26, T25
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
12/12
Similar pages