DS14C238 www.ti.com SNLS084C – MAY 1999 – REVISED APRIL 2013 DS14C238 Single Supply TIA/EIA-232 4 x 4 Driver/Receiver Check for Samples: DS14C238 FEATURES DESCRIPTION • • • • • • • • The DS14C238 is a four driver, four receiver device which conforms to the TIA/EIA-232-E standard and CCITT V.28 recommendations. This device eliminates ±12V supplies by employing an internal DC-DC converter to generate the necessary output levels from a single +5V supply. Driver slew rate control and receiver noise filtering have also been internalized to eliminate the need for external slew rate control and noise filtering capacitors. 1 2 Conforms to TIA/EIA-232-E and CCITT V.28 Internal DC-DC Converter Operates with Single +5V Supply Low Power Requirement—ICC 10 mA max Internal Driver Slew Rate Control Receiver Noise Filtering Operates Above 120 kbits/sec Direct Replacement for MAX238 Connection Diagram Figure 1. Top View See Package Number DW0024B 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated DS14C238 SNLS084C – MAY 1999 – REVISED APRIL 2013 www.ti.com Functional Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14C238 DS14C238 www.ti.com SNLS084C – MAY 1999 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) −0.3V to +6V Supply Voltage (VCC) (VCC −0.3V) to +15V V+ Pin +0.3V to −15V V− Pin −0.3V to (VCC +0.3V) Driver Input Voltage (V+ +0.3V) to (V− −0.3V) Driver Output Voltage Receiver Input Voltage ±30V −0.3V to (VCC +0.3V) Receiver Output Voltage Junction Temperature +150°C Maximum Package Power Dissipation @ +25°C (3) DW Package 1400 mW −65°C to +150°C Storage Temp. Range Lead Temp. (Soldering, 4 Seconds) +260°C Short Circuit Duration (DOUT) Continuous ≥ 2.0 kV ESD Rating (HBM, 1.5 kΩ, 100 pF) (1) (2) (3) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be verified. They are not meant to imply that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Ratings apply to ambient temperature at +25°C. Above this temperature derate: DW package 13.5 mW/°C. Recommended Operating Conditions Supply Voltage, VCC Operating Free Air Temp. (TA) DS14C238 Min Max 4.5 5.5 Units V 0 +70 °C Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14C238 3 DS14C238 SNLS084C – MAY 1999 – REVISED APRIL 2013 www.ti.com Electrical Characteristics (1) Over recommended operating conditions, unless otherwise specified. Symbol Parameter Conditions Min Typ (2) Max Units DEVICE CHARACTERISTICS V+ Positive Power Supply RL = 3 kΩ, C1–C4 = 1.0 μF, DIN = 0.8V 9.0 V− Negative Power Supply RL = 3 kΩ, C1–C4 = 1.0 μF, DIN = 2.0V −8.0 ICC Supply Current (VCC) No Load 7.0 V V 10 mA DRIVER CHARACTERISTICS VIH High Level Input Voltage 2.0 VCC V VIL Low Level Input Voltage GND 0.8 V IIH High Level Input Current VIN ≥ 2.0V −10 +10 μA IIL Low Level Input Current VIN ≤ 0.8V −10 +10 μA VOH High Level Output Voltage RL = 3 kΩ 5.0 VOL Low Level Output Voltage IOS+ Output High Short Circuit Current VO = 0V, VIN = 0.8V IOS− Output Low Short Circuit Current VO = 0V, VIN = 2.0V 5.0 RO Output Resistance −2V ≤ VO ≤ +2V, VCC = GND = 0V 300 7.4 V −6.3 −5.0 V −15 −5.0 mA 12 30 mA (3) −3 0 Ω RECEIVER CHARACTERISTICS VTH Input High Threshold Voltage VTL Input Low Threshold Voltage 0.8 1.5 VHY Hysteresis 0.2 0.4 1.0 V RIN Input Resistance 3.0 4.5 7.0 kΩ IIN Input Current 2.14 3.8 5.0 mA VOH VOL (1) (2) (3) 4 High Level Output Voltage Low Level Output Voltage 1.9 VIN = +15V 2.4 V V VIN = +3V 0.43 0.6 +1.0 mA VIN = −3V −1.0 −0.6 −0.43 mA VIN = −15V −5.0 −3.8 −2.14 mA VIN = −3V, IO = −3.2 mA 3.5 4.5 VIN = −3V, IO = −20 μA 4.0 4.9 VIN = +3V, IO = +2.0 mA 0.25 V V 0.4 V Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified. All typicals are given for VCC = 5.0V and TA = +25°C. IOS+ and IOS− values are for one output at a time. If more than one output is shorted simultaneously, the device power dissipation may be exceeded. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14C238 DS14C238 www.ti.com SNLS084C – MAY 1999 – REVISED APRIL 2013 Switching Characteristics (1) Over recommended operating conditions, unless otherwise specified. Symbol Parameter Conditions Min Typ (2) Max Units DRIVER CHARACTERISTICS tPLH Propagation Delay LOW to HIGH RL = 3 kΩ 0.7 4.0 μs tPHL Propagation Delay HIGH to LOW CL = 50 pF 0.6 4.0 μs tsk Skew |tPLH–tPHL | (Figure 2, Figure 3) 0.1 1.0 μs SR1 Output Slew Rate RL = 3kΩ to 7 kΩ, CL = 50 pF 4.0 15 30 V/μs SR2 Output Slew Rate RL = 3 kΩ, CL = 2500 pF 3.0 5.0 V/μs RECEIVER CHARACTERISTICS tPLH Propagation Delay LOW to HIGH Input Pulse Width > 10 μs 2.0 6.5 μs tPHL Propagation Delay HIGH to LOW CL = 50 pF 2.8 6.5 μs tSK Skew | tPLH–tPHL | (Figure 4, Figure 5) 0.8 2.0 μs tNW Noise Pulse Width Rejected (Figure 4, Figure 5) 2.5 1.0 μs (1) (2) Receiver AC input waveform for test purposes: tr = tf = 200 ns, VIH = 3V, VIL = −3V, f = 64 kHz (128 kbits/sec). Driver AC input waveform for test purposes: tr = tf ≤ 10 ns, VIH = 3V, VIL = 0V, f = 64 kHz (128 kbits/sec). All typicals are given for VCC = 5.0V and TA = +25°C. Parameter Measurement Information Figure 2. Driver Load Circuit Figure 3. Driver Switching Waveform Figure 4. Receiver Load Circuit Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14C238 5 DS14C238 SNLS084C – MAY 1999 – REVISED APRIL 2013 www.ti.com Figure 5. Receiver Propagation Delays and Noise Rejection PIN DESCRIPTIONS VCC (pin 9)— Power supply pin for the device, +5V (±10%). V+ (pin 11)—Positive supply for TIA/EIA-232-E drivers. Recommended external capacitor: C4 = 1.0 μF (6.3V). This supply is not intended to be loaded externally. V− (pin 15)—Negative supply for TIA/EIA-232-E drivers. Recommended external capacitor: C3 = 1.0 μF (16V). This supply is not intended to be loaded externally. C1+, C1− (pins 10 and 12)— External capacitor connection pins. Recommended capacitor – 1.0 μF (6.3V). C2+, C2− (pins 13 and 14)— External Capacitor connection pins. Recommended capacitor – 1.0 μF (16V). DIN 1–4 (pins 5, 18, 19, and 21)— Driver input pins are TTL/CMOS compatible. Inputs of unused drivers may be left open, an internal pullup resistor (500 kΩ minimum, typically 5 MΩ) pulls input to VCC. Output will be LOW for open inputs. DOUT 1–4 (pins 2, 1, 24, and 20)— Driver output pins conform to TIA/EIA-232-E levels. RIN1 1–4 (pins 3, 7, 23, and 16)— Receiver input pins accept TIA/EIA-232-E input voltages (±15V). Receivers feature a noise filter and specified hysteresis of 200 mV. Unused receiver input pins may be left open. Internal input resistor (5 kΩ) pulls input LOW, providing a failsafe HIGH output. ROUT 1–4 (pins 4, 6, 22, and 17)— Receiver output pins are TTL/CMOS compatible. Receiver output HIGH voltage is specified for both CMOS and TTL load conditions. GND (pin 8)—Ground Pin. 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14C238 DS14C238 www.ti.com SNLS084C – MAY 1999 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14C238 7 PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) DS14C238WMX/NOPB LIFEBUY Package Type Package Pins Package Drawing Qty SOIC DW 24 1000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR Op Temp (°C) Device Marking (4/5) 0 to 70 DS14C238WM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 16-Oct-2015 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS14C238WMX/NOPB Package Package Pins Type Drawing SOIC DW 24 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 24.4 Pack Materials-Page 1 10.8 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 15.9 3.2 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS14C238WMX/NOPB SOIC DW 24 1000 367.0 367.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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