Material Content Data Sheet Sales Product Name IPD50N04S3-09 MA# MA000461960 Package PG-TO252-3-11 Issued 29. August 2013 Weight* 390.69 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 1.791 0.46 0.140 0.04 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.46 4585 4585 358 0.042 0.01 139.706 35.74 35.79 357590 107 358055 1.991 0.51 0.51 5097 5097 1.466 0.38 3753 25.659 6.57 119.499 30.59 37.54 305867 375297 3.740 0.96 0.96 9573 9573 0.091 0.02 0.000 0.00 0.049 0.01 0.039 0.01 1.863 0.48 0.028 0.01 0.095 0.02 94.488 24.19 65677 232 0.02 1 100 0.50 4769 2. 3. 242 24.22 241851 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4994 73 Important Remarks: 1. 233 125 242166 1000000