Microchip MCP1642DT-ADJI/MC 1.8a input current switch, 1 mhz low-voltage start-up synchronous boost regulator Datasheet

MCP1642B/D
1.8A Input Current Switch, 1 MHz Low-Voltage Start-Up
Synchronous Boost Regulator
Features
General Description
• Up to 96% Typical Efficiency
• 1.8A Typical Peak Input Current Limit:
- IOUT > 175 mA @ 1.2V VIN, 3.3V VOUT
- IOUT > 600 mA @ 2.4V VIN, 3.3V VOUT
- IOUT > 800 mA @ 3.3V VIN, 5.0V VOUT
- IOUT > 1A @ VIN > 3.6V, 5.0V VOUT
• Low Start-Up Voltage: 0.65V, typical 3.3V VOUT
@ 1 mA
• Low Operating Input Voltage: 0.35V, typical 3.3V
VOUT @ 1 mA
• Output Voltage Range:
- Reference Voltage, VFB = 1.21V
- 1.8V to 5.5V for the adjustable device option
- 1.8V, 3.0V, 3.3V and 5.0V for fixed VOUT
options
• Maximum Input Voltage  VOUT < 5.5V
• PWM Operation: 1 MHz
- Low Noise, Anti-Ringing Control
• Power Good Open-Drain Output
• Internal Synchronous Rectifier
• Internal Compensation
• Inrush Current Limiting and Internal Soft-Start
• Selectable, Logic-Controlled Shutdown States:
- True Load Disconnect Option (MCP1642B)
- Input-to-Output Bypass Option (MCP1642D)
• Shutdown Current (All States): 1 µA
• Overtemperature Protection
• Available Packages:
- 8-Lead MSOP
- 8-Lead 2x3 DFN
The
MCP1642B/D
devices
are
compact,
high-efficiency, fixed-frequency, synchronous step-up
DC-DC converters. This family of devices provides an
easy-to-use power supply solution for applications
powered by either one-cell, two-cell, or three-cell
alkaline, Ultimate Lithium, NiCd, NiMH, one-cell Li-Ion
or Li-Polymer batteries.
Low-voltage technology allows the regulator to start-up
without high inrush current or output voltage overshoot
from a low voltage input. High efficiency is
accomplished by integrating the low-resistance
N-Channel Boost switch and synchronous P-Channel
switch. All compensation and protection circuitry are
integrated to minimize the number of external
components. An open-drain Power Good output is
provided to indicate when the output voltage is within
10% of regulation and facilitates the interface with an
MCU. For standby applications, MCP1642B provides a
“true output disconnect” from input to output while in
shutdown (EN = GND). An additional device option
(MCP1642D) is available and connects “input to output
bypass” while in shutdown. Both options consume less
than 1 µA of input current.
For the adjustable (ADJ) device options, the output
voltage is set by a small external resistor divider. Fixed
VOUT device options do not require external divider
resistors. Two package options, 8-lead MSOP and 8lead 2x3 DFN, are available.
Applications
• One, Two and Three-Cell Alkaline, Lithium
Ultimate and NiMH/NiCd Portable Products
• Single-Cell Li-Ion to 5V Converters
• PIC® MCU Power
• USB Emergency Backup Charger from Batteries
• Personal Medical Products
• Wireless Sensors
• Hand-Held Instruments
• GPS Receivers
• +3.3V to +5.0V Distributed Power Supply
Package Types
MCP1642B/D-xx
MSOP
MCP1642B/D-xx
2x3 DFN*
EN 1
8 VIN
NC 2
7 SGND
NC 2
PG 3
6 PGND
PG 3
VOUT 4
VOUT 4
5 SW
MCP1642B/D-ADJ
MSOP
EN 1
8 VIN
VFB 2
7 SGND
VFB 2
PG 3
6 PGND
PG 3
VOUT 4
5 SW
EP
9
7 SGND
6 PGND
5 SW
MCP1642B/D-ADJ
2x3 DFN*
EN 1
VOUT 4
8 VIN
8 VIN
EN 1
EP
9
7 SGND
6 PGND
5 SW
* Includes Exposed Thermal Pad (EP); see Table 3-1.
 2014 Microchip Technology Inc.
DS20005253A-page 1
MCP1642B/D
Typical Application
L1
4.7 µH
VOUT
3.3V
CIN
4.7...10 µF
VIN= 0.9 to 1.6V
VIN
+
SW
VOUT
COUT
4.7...10 µF
ALKALINE
MCP1642B-33
NC
PG
EN
-
GND
ON
OFF
L
4.7 µH
VOUT
CIN
4.7...10 µF
5.0V
SW
VOUT
VIN
VIN= 1.8 to 3.2V
MCP1642D-ADJ
VFB
ALKALINE
+
RTOP
976 k
RBOT
309 k
EN
-
COUT
4.7...10 µF
RPG
1 M
ON
ALKALINE
+
OFF
®
From PIC MCU I/O
GND
PG
To PIC MCU I/O
-
100
90
VIN = 1.2V, VOUT = 3.3V
Efficiency (%)
80
70
VIN = 2.5V, VOUT = 5.0V
60
50
40
30
20
10
0
1
10
100
1000
IOUT (mA)
DS20005253A-page 2
 2014 Microchip Technology Inc.
MCP1642B/D
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational sections of this
specification is not intended. Exposure to maximum
rating conditions for extended periods may affect
device reliability.
Absolute Maximum Ratings †
EN, FB, VIN, VSW, VOUT – GND .......................... +6.5V
EN, FB ......<maximum of VOUT or VIN > (GND – 0.3V)
Output Short-Circuit Current ...................... Continuous
Output Current Bypass Mode........................... 800 mA
Power Dissipation ............................ Internally Limited
Storage Temperature ..........................-65°C to +150°C
Ambient Temp. with Power Applied.......-40°C to +85°C
Operating Junction Temperature.........-40°C to +125°C
ESD Protection On All Pins:
HBM........................................................ 4 kV
MM......................................................... 300V
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,
IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Minimum Start-Up Voltage
VIN
—
0.65
0.8
V
Note 1
—
0.9
1.8
V
MCP1642B/D-50, Note 1
Minimum Input Voltage
After Start-Up
VIN
—
0.35
—
V
Note 1, Note 5
—
0.5
—
V
Note 1, Note 5, MCP1642B/D-50
Output Voltage Adjust.
Range
(MCP1642B/D-ADJ)
VOUT
1.8
—
5.5
V
VOUT  VIN (MCP1642B/D-ADJ);
Note 2
Output Voltage
(MCP1642B/D-XX)
VOUT
—
1.8
—
V
VIN < 1.8V, MCP1642B/D-18,
Note 2
—
3.0
—
V
VIN < 3.0V, MCP1642B/D-30,
Note 2
—
3.3
—
V
VIN < 3.3V, MCP1642B/D-33,
Note 2
—
5.0
—
V
VIN < 5.0V, MCP1642B/D-50,
Note 2
—
175
—
mA
1.2V VIN, 1.8V VOUT, Note 5
—
300
—
mA
1.5V VIN, 3.3V VOUT, Note 5
—
800
—
mA
3.3V VIN, 5.0V VOUT, Note 5
Input Characteristics
Maximum Output Current
IOUT
Feedback Voltage
VFB
1.173
1.21
1.247
V
Feedback Input
Bias Current
IVFB
—
1.0
—
nA
Note 1:
2:
3:
4:
5:
Note 5
Resistive load, 1 mA.
For VIN > VOUT, VOUT will not remain in regulation.
IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V
output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent
current can be estimated by: (IQPWM * (VOUT/VIN)).
220 resistive load, 3.3V VOUT (15 mA).
Determined by characterization, not production tested.
 2014 Microchip Technology Inc.
DS20005253A-page 3
MCP1642B/D
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,
IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Quiescent Current –
PWM Mode
IQPWM
—
400
500
µA
Measured at VOUT, EN = VIN,
IOUT = 0 mA, Note 3
Quiescent Current –
Shutdown
IQSHDN
—
1
—
µA
VOUT = EN = GND, IOUT = 0 mA
includes N-Channel and
P-Channel Switch Leakage
NMOS Switch Leakage
INLK
—
0.5
—
µA
VIN = VSW = 5V,
VOUT = 5.5V,
VEN = VFB = GND
PMOS Switch Leakage
IPLK
—
0.2
—
µA
VIN = VSW = GND,
VOUT = 5.5V
NMOS Switch
ON Resistance
RDS(ON)N
—
0.15
—

VIN = 3.3V, ISW = 250 mA, Note 5
PMOS Switch
ON Resistance
RDS(ON)P
—
0.3
—

VIN = 3.3V, ISW = 250 mA, Note 5
IN(MAX)
—
1.8
—
A
Note 5
NMOS Peak
Switch Current Limit
Accuracy
Line Regulation
Load Regulation
Note 1:
2:
3:
4:
5:
Conditions
VFB%
-3
—
3
%
MCP1642B/D-ADJ, VIN = 1.2V
VOUT%
-3
—
3
%
MCP1642B/D-18, VIN = 1.2V
-3
—
3
%
MCP1642B/D-30, VIN = 1.2V
-3
—
3
%
MCP1642B/D-33, VIN = 1.2V
-3
—
3
%
VFB/VFB)
/VIN|
-0.5
0.01
0.5
%/V
MCP1642B/D-ADJ,
VIN = 1.5V to 3.0V, IOUT = 25 mA
MCP1642B/D-50, VIN = 2.5V
VOUT/VOUT)
/VIN|
-0.5
0.05
0.5
%/V
MCP1642B/D-18,
VIN = 1.0V to 1.5V, IOUT = 25 mA
-0.5
0.01
0.5
%/V
MCP1642B/D-30,
VIN = 1.5V to 2.5V, IOUT = 25 mA
-0.5
0.01
0.5
%/V
MCP1642B/D-33,
VIN = 1.5V to 3.0V, IOUT = 25 mA
-0.5
0.01
0.5
%/V
MCP1642B/D-50,
VIN = 2.5V to 4.2V, IOUT = 25 mA
VFB/VFB|
-1.5
0.05
1.5
%
IOUT = 25 mA to 150 mA,
VIN = 1.5V
VOUT/VOUT|
-1.5
0.1
1.5
%
MCP1642B/D-18, VIN = 1.5V,
IOUT = 25 mA to 75 mA
-1.5
0.1
1.5
%
MCP1642B/D-30, VIN = 1.5V,
IOUT = 25 mA to 125 mA
-1.5
0.1
1.5
%
MCP1642B/D-33, VIN = 1.5V,
IOUT = 25 mA to 150 mA
—
0.5
—
%
MCP1642B/D-50, VIN = 3.0V,
IOUT = 25 mA to 500 mA, Note 5
Resistive load, 1 mA.
For VIN > VOUT, VOUT will not remain in regulation.
IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V
output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent
current can be estimated by: (IQPWM * (VOUT/VIN)).
220 resistive load, 3.3V VOUT (15 mA).
Determined by characterization, not production tested.
DS20005253A-page 4
 2014 Microchip Technology Inc.
MCP1642B/D
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,
IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Maximum Duty Cycle
DCMAX
—
90
—
%
Switching Frequency
fSW
0.85
1.0
1.15
MHz
EN Input Logic High
VIH
75
—
—
% of VIN IOUT = 1 mA,
for MCP1642B/D-50 VIN = 2.5V
EN Input Logic Low
VIL
—
—
20
% of VIN IOUT = 1 mA,
for MCP1642B/D-50 VIN = 2.5V
EN Input Leakage Current
Conditions
Note 5
Note 5, IOUT = 65 mA,
for MCP1642B/D-50 VIN = 2.5V
IENLK
—
0.1
—
µA
VEN = 1.2V
Power Good Threshold
PGTHF
—
90
—
%
VFB Falling, Note 5
Power Good Hysteresis
PGHYS
—
3
—
%
Note 5
Power Good Output Low
PGLOW
—
0.4
—
V
ISINK = 5 mA, VFB = 0V, Note 5
PGDELAY
—
600
—
µs
Note 5
Power Good Output
Response
Power Good Output Delay
PGRES
—
250
—
µs
Note 5
Power Good Input Voltage
Operating Range
VPG_VIN
0.9
—
5.5
V
ISINK = 5 mA, VFB = 0V, Note 5
Power Good
Leakage Current
PGLEAK
—
0.01
—
µA
VPG = 5.5V,
VOUT in Regulation, Note 5
Soft Start Time
tSS
—
550
—
µs
Thermal Shutdown
Die Temperature
TSD
—
150
—
C
EN Low to High,
90% of VOUT, Note 4, Note 5
Note 5
TSDHYS
—
35
—
C
Note 5
Die Temperature
Hysteresis
Note 1:
2:
3:
4:
5:
Resistive load, 1 mA.
For VIN > VOUT, VOUT will not remain in regulation.
IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V
output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent
current can be estimated by: (IQPWM * (VOUT/VIN)).
220 resistive load, 3.3V VOUT (15 mA).
Determined by characterization, not production tested.
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,
IOUT = 15 mA, TA = +25°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Operating Ambient Temperature
Range
TA
-40
—
+85
°C
Storage Temperature Range
TA
-65
—
+150
°C
Maximum Junction Temperature
TJ
—
—
+150
°C
Thermal Resistance, 8L-MSOP
JA
—
211
—
°C/W
Thermal Resistance, 8L-2x3 DFN
JA
—
68
—
°C/W
Conditions
Temperature Ranges
Steady State
Transient
Package Thermal Resistances
 2014 Microchip Technology Inc.
DS20005253A-page 5
MCP1642B/D
NOTES:
DS20005253A-page 6
 2014 Microchip Technology Inc.
MCP1642B/D
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA,
TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package).
100
500
80
450
Efficiency (%)
IQ PWM Mode (µA)
475
425
VOUT = 5.0V
400
375
VOUT = 3.3V
VIN = 1.6V
70
VIN = 1.2V
60
50
40
30
350
VOUT = 2.0V
20
325
10
300
0
-40
-25
-10
5
20
35
50
65
Ambient Temperature (°C)
FIGURE 2-1:
Temperature.
80
VOUT IQPWM vs. Ambient
0.1
100
IOUT = 50 mA
VIN = 1.8V
90
3.312
Efficiency (%)
3.310
3.308
3.306
10
IOUT (mA)
100
1000
2.0V VOUT Mode Efficiency
VOUT = 3.3V
VIN = 2.5V
80
VIN = 1.2V
1
FIGURE 2-4:
vs. IOUT.
3.314
VOUT (V)
VOUT = 2.0V
90
VIN = 1.2V
VIN = 1.2V
70
60
50
40
30
20
10
3.304
-40
-25
-10
5
20
35
50
65
Ambient Temperature (°C)
3.3V VOUT vs. Ambient
FIGURE 2-2:
Temperature.
0
80
0.1
90
IOUT = 50 mA
5.000
VIN = 2.5V
4.995
4.990
4.985
100
1000
VOUT = 5.0V
80
Efficiency (%)
VOUT (V)
5.005
10
IOUT (mA)
3.3V VOUT Mode Efficiency
FIGURE 2-5:
vs. IOUT.
100
5.010
1
VIN = 3.6V
70
VIN = 2.5V
60
50
40
30
20
VIN = 1.8V
10
4.980
-40
FIGURE 2-3:
Temperature.
-25
-10
5
20 35 50 65
Ambient Temperature (°C)
80
5.0V VOUT vs. Ambient
 2014 Microchip Technology Inc.
0
0.1
FIGURE 2-6:
vs. IOUT.
1
10
IOUT (mA)
100
1000
5.0V VOUT Mode Efficiency
DS20005253A-page 7
MCP1642B/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA,
TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package).
1.50
1400
VOUT = 5.0V
1200
1.30
VOUT = 3.3V
1.10
VIN (V)
IOUT (mA)
1000
VOUT = 5.0V
800
600
VOUT = 2.0V
Start-up
0.70
400
Shutdown
0.50
TA = +25°C
TA = +85°C
200
0.30
0
0.8
1.2
1.6
FIGURE 2-7:
2
2.4 2.8
VIN (V)
3.2
3.6
4
0
4.4
Maximum IOUT vs. VIN.
20
80
100
Switching Frequency (kHz)
1004
IOUT = 15 mA
3.302
TA = 25°C
3.300
3.298
3.296
TA = 85°C
3.294
TA = -40°C
3.292
VOUT = 3.3V
1000
996
992
988
3.290
0.8
1
1.2 1.4 1.6 1.8
2
2.2 2.4 2.6 2.8
-40
3
-25
-10
5
20
35
50
65
Ambient Temperature (°C)
VIN (V)
FIGURE 2-8:
4.5
VOUT = 3.3V
0.65
80
fSW vs. Ambient
FIGURE 2-11:
Temperature.
3.3V VOUT vs. VIN.
0.70
VOUT = 5.0V
4
Start-up
3.5
0.60
0.55
VIN (V)
VIN (V)
40
60
IOUT (mA)
FIGURE 2-10:
5.0V VOUT Minimum
Start-Up and Shutdown VIN into Resistive Load
vs. IOUT.
3.304
VOUT (V)
0.90
0.50
Shutdown
0.45
3
VOUT = 3.3V
2.5
VOUT = 2.0V
2
1.5
0.40
1
0.35
0.5
0.30
0
0
20
40
60
IOUT (mA)
80
100
FIGURE 2-9:
3.3V VOUT Minimum
Start-Up and Shutdown VIN into Resistive Load
vs. IOUT.
DS20005253A-page 8
0
5
10
15
IOUT (mA)
20
25
FIGURE 2-12:
PWM Pulse-Skipping Mode
Threshold vs. IOUT.
 2014 Microchip Technology Inc.
MCP1642B/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA,
TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package).
IIN (mA)
100
VOUT
20 mV/div
AC coupled
IOUT = 100 mA
10
VOUT = 5.0V
VOUT = 3.3V
1
VSW
2V/div
VOUT = 2.0V
0.1
0.8
1.2
1.6
2
FIGURE 2-13:
Current vs. VIN.
2.4 2.8
VIN (V)
3.2
3.6
4
4.4
1 µs/div
Average of No Load Input
2.5
Switch Resistance (:)
IL
200 mA/div
FIGURE 2-16:
MCP1642B/D High Load
PWM Mode Waveforms.
0.25
2
IOUT = 15 mA
0.2
N - Channel
1.5
0.15
1
0.1
VOUT
1V/div
P - Channel
0.5
VIN
1V/div
0.05
0
0
1
1.4
1.8
2.2 2.6
3
3.4
> VIN or VOUT
3.8
VEN
1V/div
4.2
FIGURE 2-14:
N-Channel and P-Channel
RDSON vs. > of VIN or VOUT.
200 µs/div
FIGURE 2-17:
3.3V Start-Up After Enable.
IOUT = 1 mA
VOUT
20 mV/div
AC coupled
I OUT = 15 mA
VOUT
2V/div
VSW
1V/div
IL
100 mA/div
VIN
1V/div
IL
200 mA/div
200 µs/div
1 µs/div
FIGURE 2-15:
MCP1642B/D 3.3V VOUT
Light Load PWM Mode Waveforms.
 2014 Microchip Technology Inc.
FIGURE 2-18:
VIN = VENABLE.
3.3V Start-Up When
DS20005253A-page 9
MCP1642B/D
Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA,
TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package).
VOUT
100 mV/div
AC coupled
IOUT
100 mA/div
Step from 20 mA to 150 mA
400 µs/div
FIGURE 2-19:
MCP1642B 3.3V VOUT Load
Transient Waveforms.
VOUT
100 mV/div
AC coupled
VIN
1V/div
Step from 1.2V to 2.4V
400 µs/div
FIGURE 2-20:
Waveforms.
DS20005253A-page 10
3.3V VOUT Line Transient
 2014 Microchip Technology Inc.
MCP1642B/D
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MCP1642B/D-XX MCP1642B/D-ADJ
MSOP, 2x3 DFN
MSOP, 2x3 DFN
3.1
1
1
Symbol
Description
EN
Enable pin. Logic high enables operation. Do not allow this pin
to float.
2
—
NC
Not Connected.
—
2
VFB
Reference Voltage pin. Connect VFB to an external resistor
divider to set the output voltage (for fixed VOUT options, this pin
is not connected).
3
3
PG
Open-Drain Power Good pin. Indicates when the output voltage
is within regulation.
4
4
VOUT
5
5
SW
6
6
PGND
Power Ground reference.
7
7
SGND
Signal Ground reference.
8
8
VIN
Input supply voltage. Local bypass capacitor required.
9
9
EP
Exposed Thermal Pad (2x3 DFN only).
Boost Converter Output.
Boost and Rectifier Switch input. Connect boost inductor
between SW and VIN.
Enable Pin (EN)
The EN pin is a logic-level input used to enable or
disable device switching and lower quiescent current
while disabled. A logic high (>75% of VIN) will enable
the regulator output. A logic low (<20% of VIN) will
ensure that the regulator is disabled.
3.2
Feedback Voltage Pin (VFB)
The VFB pin is used to provide output voltage regulation
by using a resistor divider for the ADJ device option.
The typical feedback voltage will be 1.21V, with the
output voltage in regulation.
3.3
Power Good Pin (PG)
The Power Good pin is an open-drain output which can
be tied to VOUT using a pull-up resistor. It turns low
when VOUT drops below 10% of its nominal value.
3.4
Output Voltage Pin (VOUT)
3.6
Power Ground Pin (PGND)
The power ground pin is used as a return for the
high-current N-Channel switch. The PGND and SGND
pins are connected externally.
3.7
Signal Ground Pin (SGND)
The signal ground pin is used as a return for the
integrated VREF and error amplifier. The SGND and
power ground (PGND) pins are connected externally.
3.8
Power Supply Input Voltage Pin
(VIN)
Connect the input voltage source to VIN. The input
source should be decoupled to GND with a 4.7 µF
minimum capacitor.
3.9
Exposed Thermal Pad (EP)
There is no internal electrical connection between the
Exposed Thermal Pad (EP) and the SGND and PGND
pins. They must be connected to the same electric
potential on the Printed Circuit Board (PCB).
The output voltage pin connects the integrated
P-Channel MOSFET to the output capacitor. The FB
voltage divider is also connected to the VOUT pin for
voltage regulation for the “ADJ” option.
3.5
Switch Node Pin (SW)
Connect the inductor from the input voltage to the SW
pin. The SW pin carries inductor current and can be as
high as 1.8A peak. The integrated N-Channel switch
drain and integrated P-Channel switch source are
internally connected at the SW node.
 2014 Microchip Technology Inc.
DS20005253A-page 11
MCP1642B/D
NOTES:
DS20005253A-page 12
 2014 Microchip Technology Inc.
MCP1642B/D
4.0
DETAILED DESCRIPTION
4.1.3
4.1
Device Option Overview
For the MCP1642B/D ADJ option, the output voltage is
adjustable with a resistor divider over a 1.8V minimum
to 5.5V maximum range. The middle point of the
resistor divider connects to the VFB pin. High-value
resistors are recommended to minimize quiescent
current to keep efficiency high at light loads. The
reference voltage is VFB = 1.21V.
The MCP1642B/D family of devices is capable of low
start-up voltage and delivers high efficiency over a wide
load range for single-cell, two-cell, three-cell alkaline,
Ultimate Lithium, NiMH, NiCd and single-cell Li-Ion
battery inputs. A high level of integration lowers total
system cost, eases implementation and reduces board
area.
4.1.4
ADJUSTABLE OUTPUT VOLTAGE
OPTION
FIXED OUTPUT VOLTAGE OPTION
The devices feature low start-up voltage, fixed and
adjustable output voltage, PWM mode operation,
integrated synchronous switch, internal compensation,
low noise anti-ringing control, inrush current limit and
soft start.
For the fixed output voltage option of the MCP1642B/D
devices, the VFB pin is not connected. There is an
internal feedback divider which minimizes quiescent
current to keep efficiency high at light loads.
There are two shutdown options for the MCP1642B/D
family:
The fixed set values are: 1.8V, 3.0V, 3.3V and 5.0V.
• True Output Disconnect mode (MCP1642B)
• Input-to-Output Bypass mode (MCP1642D)
4.1.1
TRUE OUTPUT DISCONNECT
MODE OPTION
The MCP1642B device incorporates a true output
disconnect feature. With the EN pin pulled low, the
output of the MCP1642B is isolated or disconnected
from the input by turning off the integrated P-Channel
switch and removing the switch bulk diode connection.
This removes the DC path that is typical in boost
converters, which allows the output to be disconnected
from the input. During this mode, less than 1 µA of
current is consumed from the input (battery). True
output disconnect does not discharge the output.
4.1.2
The value of the internal divider is 815 k typical.
TABLE 4-1:
PART NUMBER SELECTION
BY SHUTDOWN OPTION
Part Number
True Output Input-to-Output
Disconnect
Bypass
MCP1642B-ADJ
(or -18; 30; 33; 50)
X
—
MCP1642D-ADJ
(or -18; 30; 33; 50)
—
X
INPUT-TO-OUTPUT BYPASS MODE
OPTION
The
MCP1642D
device
incorporates
the
Input-to-Output Bypass shutdown option. With the EN
input pulled low, the output is connected to the input
using the internal P-Channel MOSFET. In this mode,
the current drawn from the input (battery) is less than
1 µA with no load. The Input-to-Output Bypass mode is
used when the input voltage is high enough for the load
to operate (e.g. PIC MCU operating in sleep mode).
When a higher regulated output voltage and load
current are necessary, the EN pin must be pulled high,
enabling the boost converter.
 2014 Microchip Technology Inc.
DS20005253A-page 13
MCP1642B/D
4.2
Functional Description
The
MCP1642B/D
devices
are
compact,
high-efficiency, fixed-frequency, step-up DC-DC
converters that provide an easy-to-use power supply
solution for applications powered by either one-cell,
two-cell, or three-cell alkaline, Ultimate Lithium, NiCd,
or NiMH, or one-cell Li-Ion or Li-Polymer batteries.
Figure 4-1 depicts the functional block diagram of the
MCP1642B/D devices.
VOUT
VIN
Internal
Bias
IZERO
Direction
Control
Soft-Start
SW
EN
Gate Drive
and
Shutdown
Control
Logic
0V
OCREF
ILIMIT
ISENSE
PGND
Oscillator
Slope
Compensation
S
SGND
*
VOUT
PWM
Logic
EA
1.21V
VFB (NC)
0.9 x VREF
VFB
PG
* Available in Fixed Output option
Section 4.2.4 “Fixed Output Voltage”.
FIGURE 4-1:
DS20005253A-page 14
only.
See
MCP1642B/D Block Diagram.
 2014 Microchip Technology Inc.
MCP1642B/D
4.2.1
LOW-VOLTAGE START-UP
The MCP1642B/D devices are capable of starting from
a low input voltage. Start-up voltage is typically 0.65V
for a 3.3V output and 1 mA resistive load.
When enabled, the internal start-up logic turns the
rectifying P-Channel switch on until the output
capacitor is charged to a value close to the input
voltage. During this period, the rectifying switch is
current-limited at approximately 125 mA, which limits
the start-up under heavy resistive load condition. After
charging the output capacitor to the input voltage, the
device starts switching. A ring oscillator is only used
until the main RC oscillator has enough bias and is
ready. The device runs open-loop until the output rises
enough to start the RC oscillator. During this time, the
boost switch current is limited to 50% of its nominal
value. Once the output voltage reaches a high value,
normal closed-loop PWM operation is initiated.
Then, during the end sequence of the start-up, the
MCP1642B/D devices charge an internal capacitor with
a very weak current source. The voltage on this
capacitor, in turn, slowly ramps the current limit of the
boost switch to its nominal value (1.8A typical). The
soft-start capacitor is completely discharged in the
event of a commanded shutdown or a thermal
shutdown.
There is no undervoltage lockout feature for the
MCP1642B/D devices. The devices will start up at the
lowest possible voltage and run down to the lowest
possible voltage. For typical battery applications,
deeply discharged batteries may result in
"motor-boating" (emission of a low-frequency tone).
4.2.2
PWM MODE OPERATION
In normal PWM operation, the MCP1642B/D devices
operate as fixed-frequency, synchronous boost
converters. The switching frequency is internally
maintained with a precision oscillator typically set to
1 MHz. At light loads, the MCP1642B/D devices begin
to skip pulses. Figure 2-12 represents the input voltage
versus load current for the pulse-skipping threshold in
PWM mode. By operating in PWM-only mode, the output ripple remains low and the frequency is constant.
Operating in fixed PWM mode results in low efficiency
during light load operation but has low output ripple and
noise for the supplied load.
Lossless current sensing converts the peak current
signal to a voltage to sum with the internal slope
compensation. This summed signal is compared to the
voltage error amplifier output to provide a peak current
control command for the PWM signal. The slope
compensation is adaptive to the input and output
voltage. Therefore, the converter provides the proper
amount of slope compensation to ensure stability, but is
not excessive, which causes a loss of phase margin.
The peak current limit is set to 1.8A typical.
 2014 Microchip Technology Inc.
4.2.3
ADJUSTABLE OUTPUT VOLTAGE
The MCP1642B/D-ADJ output voltage is adjustable
with a resistor divider over a 1.8V minimum to 5.5V
maximum
range.
High-value
resistors
are
recommended to minimize quiescent current to keep
efficiency high at light loads.
4.2.4
FIXED OUTPUT VOLTAGE
MCP1642B/D-XX has the feedback divider included.
Four output values are available: 1.8V, 3.0V, 3.3V and
5.0V. For this option, pin 2 remains unconnected.
The value of the internal divider is 815 k typical.
4.2.5
MAXIMUM OUTPUT VOLTAGE
The maximum output current of the devices is
dependent upon the input and output voltage. For
example, to ensure a 200 mA load current for
VOUT = 3.3V, a typical value of 1.3V input voltage is
necessary. If an application is powered by one Li-Ion
battery (VIN from 3.0V to 4.2V), the typical load current
the MCP1642B/D devices can deliver is close to
800 mA at 5.0V output (see Figure 2-7).
4.2.6
ENABLE PIN
The enable pin is used to turn the boost converter on
and off. The enable threshold voltage varies with input
voltage. To enable the boost converter, the EN voltage
level must be greater than 75% of the VIN voltage. To
disable the boost converter, the EN voltage must be
less than 20% of the VIN voltage.
4.2.7
POWER GOOD OUTPUT PIN
The MCP1642B/D devices have an internal
comparator which is triggered when VOUT reaches 90%
of regulation. An open-drain transistor allows
interfacing with an MCU. It can sink up to a few mA
from the power line at which the pull-up resistor is
connected. See the DC Characteristics table for
details.
4.2.8
INTERNAL BIAS
The MCP1642B/D devices get their start-up bias from
VIN. Once the output exceeds the input, bias comes
from the output. Therefore, once started, operation is
completely independent of VIN. Operation is only
limited by the output power level and the input source
series resistance. When started, the output will remain
in regulation down to 0.35V typical with 1 mA output
current for low source impedance inputs.
DS20005253A-page 15
MCP1642B/D
4.2.9
INTERNAL COMPENSATION
The error amplifier, with its associated compensation
network, completes the closed-loop system by
comparing the output voltage to a reference at the
input of the error amplifier, and feeding the amplified
and inverted signal to the control input of the inner
current loop. The compensation network provides
phase leads and lags at appropriate frequencies to
cancel excessive phase lags and leads of the power
circuit. All necessary compensation components and
slope compensation are integrated.
4.2.10
SHORT-CIRCUIT PROTECTION
Unlike most boost converters, the MCP1642B/D
devices allow their output to be shorted during normal
operation.
The
internal
current
limit
and
overtemperature protection limit excessive stress and
protect the device during periods of short circuit,
overcurrent and overtemperature. While operating in
the Input-to-Output Bypass mode, the P-Channel
current limit is inhibited to minimize quiescent current.
4.2.11
LOW NOISE OPERATION
The MCP1642B/D devices integrate a low-noise
anti-ring switch that damps the oscillations typically
observed at the switch node of a boost converter when
operating in the Discontinuous Inductor Current mode.
This removes the high-frequency radiated noise.
4.2.12
OVERTEMPERATURE
PROTECTION
Overtemperature protection circuitry is integrated into
the MCP1642B/D devices. This circuitry monitors the
device junction temperature and shuts the device off if
the junction temperature exceeds the typical +150°C
threshold. If this threshold is exceeded, the device will
automatically restart when the junction temperature
drops by 35°C. The soft start is reset during an
overtemperature condition.
DS20005253A-page 16
 2014 Microchip Technology Inc.
MCP1642B/D
5.0
APPLICATION INFORMATION
5.1
Typical Applications
The MCP1642B/D synchronous boost regulators operate over a wide input and output voltage range. The
power efficiency is high for several decades of load
range. Output current capability increases with the
input voltage and decreases with the increasing output
voltage. The maximum output current is based on the
N-Channel peak current limit. Typical characterization
curves in this data sheet are presented to display the
typical output current capability.
Overshoots and undershoots on pulsed load
applications are reduced by adding a zero in the
compensation loop. A small capacitance (for example,
27 or 33 pF) in parallel with an upper feedback resistor
will reduce output spikes. This small capacitance also
attenuates the low-frequency component on the output
ripple that might appear when the device supplies light
loads (ranging from 75 to 150 mA) and on condition
that (VOUT – VIN) < 0.6V (see the application example
in Figure 6-1).
5.2.1
VIN > VOUT SITUATION
To calculate the resistor divider values for the
MCP1642B/D, the following equation can be used.
Where RTOP is connected to VOUT, RBOT is connected
to GND and both are connected to the VFB input pin:
For VIN > VOUT, the output voltage will not remain in
regulation. VIN > VOUT is an unusual situation for a
boost converter, and there is a common issue when
two alkaline cells (2 x 1.6V typical) are used to boost to
3.0V output. A minimum headroom of approximately
200 to 300 mV between VOUT and VIN must be
ensured, unless a low frequency higher than the PWM
output ripple on VOUT is expected. This ripple and its
frequency are VIN dependent.
EQUATION 5-1:
5.3
5.2
Adjustable Output Voltage
Calculations
R TOP
V OUT
= R BOT   ------------- – 1
 V FB

EXAMPLE 1:
VOUT = 3.3V
VFB
= 1.21V
RBOT = 309 k
RTOP = 533.7 k (standard value = 536 k)
EXAMPLE 2:
VOUT = 5.0V
VFB
= 1.21V
RBOT = 309 k
RTOP = 967.9 k (standard value = 976 k)
There are some potential issues with higher-value
resistors. For small surface-mount resistors,
environment contamination can create leakage paths
that significantly change the resistive divider ratio,
which in turn affects the output voltage. The FB input
leakage current can also impact the divider and change
the output voltage tolerance.
For boost converters, the removal of the feedback
resistors during operation must be avoided. In this
case, the output voltage will increase above the absolute maximum output limits of the MCP1642B/D and
damage the device (for additional information, see
Application Note AN1337).
 2014 Microchip Technology Inc.
Power Good Output
The Power Good output is meant to provide a method
that gives information about the output state of the
device. The Power Good comparator is triggered when
VOUT reaches approximately 90% of regulation (on the
falling edge).
The PG pin is an open-drain output, which should be
connected to VOUT through an external pull-up resistor.
It is recommended to use a high-value resistor (to sink
µA from output) in order to use less power while
interfacing with an I/O PIC MCU port.
The Power Good block is internally supplied by the
maximum between the input and output voltage, and
the minimum voltage necessary is 0.9V. This is
important for applications in which the Power Good pin
is pulled-up to an external supply. If the output voltage
is less than 0.9V (e.g., due to an overcurrent situation
or an output short circuit, and also if the device is in
Shutdown - EN = GND), the input voltage has to be
high enough to drive the Power Good circuitry.
Power Good delay time is measured between the time
when VOUT starts to regulate and the time when there
is a response from Power Good output. Power Good
response time is measured between the time when
VOUT goes out of regulation with a 10% drop, and the
time when Power Good output gets to a low level. Both
Power Good delay time and Power Good response
time are specified in the DC Characteristics table.
Additionally, there are no blanking time or delays; there
is only a 3% hysteresis of the Power Good comparator.
Due to the dynamic response, MCU must interpret
longer transients.
DS20005253A-page 17
MCP1642B/D
When VOUT resumes to a value higher than 93%, the
PG pin switches to high level.
600 µs (typ.)
250 µs (typ.)
VOUT
PG DELAY
PG RESPONSE
PG
Where:
dV
=
Ripple voltage
dt
=
ON time of the N-Channel switch
(DC x 1/FSW)
Table 5-1 contains the recommended range for the
input and output capacitor value.
Power Good Timing Diagram.
Input Capacitor Selection
The boost input current is smoothed by the boost
inductor, reducing the amount of filtering necessary at
the input. Some capacitance is recommended to
provide decoupling from the source. Low ESR X5R or
X7R are well suited, since they have a low temperature
coefficient and small size. For light-load applications,
4.7 µF of capacitance is sufficient at the input. For
high-power applications that have high source
impedance or long leads which connect the battery to
the input, 10 µF of capacitance is recommended.
Additional input capacitance can be added to provide a
stable input voltage.
Table 5-1 contains the recommended range for the
input capacitor value.
5.5
dV
IOUT = C OUT   -------
 dt 
TABLE 5-1:
FIGURE 5-1:
5.4
EQUATION 5-2:
Output Capacitor Selection
The output capacitor helps provide a stable output
voltage during sudden load transients and reduces the
output voltage ripple. As with the input capacitor, X5R
and X7R ceramic capacitors are well suited for this
application. Using other capacitor types (aluminum or
tantalum) with large ESR has impact on the converter's
efficiency (see AN1337) and maximum output power.
The MCP1642B/D devices are internally compensated,
so output capacitance range is limited. See Table 5-1
for the recommended output capacitor range.
An output capacitance higher than 10 µF adds a better
load step response and high-frequency noise
attenuation, especially while stepping from light current
loads to heavy current loads. In addition, 2 x 10 µF
output capacitors ensure a better recovery of the output
after a short period of overloading.
While the N-Channel switch is on, the output current is
supplied by the output capacitor COUT. The amount of
output capacitance and equivalent series resistance
will have a significant effect on the output ripple
voltage. While COUT provides load current, a voltage
drop also appears across its internal ESR that results
in ripple voltage.
DS20005253A-page 18
CAPACITOR VALUE RANGE
CIN
COUT
Minimum
4.7 µF
10 µF
Maximum
—
100 µF
5.6
Inductor Selection
The MCP1642B/D devices are designed to be used
with small surface-mount inductors; the inductance
value can range from 2.2 µH to 6.8 µH. An inductance
value of 4.7 µH is recommended to achieve a good
balance between the inductor size, the converter load
transient response and the minimized noise.
TABLE 5-2:
MCP1642B/D
RECOMMENDED INDUCTORS
Part Number
Value
DCR
(µH)  (typ.)
ISAT
(A)
Size
WxLxH (mm)
Coilcraft
LPS4018-472
4.7
0.125
1.9
4.1x4.1x1.8
XFL4020-472
4.7
0.057
2.7
4.2x4.2x2.1
LPS5030-472
4.7
0.083
2
5x5x3
LPS6225-472
4.7
0.065
3.2
6.2x6.2x2.5
MSS6132-472
4.7
0.043
2.84
6.1x6.1x3.2
Würth Elektronik
744025004 Type WE-TPC
4.7
0.1
1.7
2.8x2.8x2.8
744042004 WE-TPC
4.7
0.07
1.65
4.8x4.8x1.8
744052005 WE-TPC
5
0.047
1.8
5.8x5.8x1.8
7447785004 WE-PD
4.7
0.06
2.5
6.2x5.9x3.3
B82462A2472M000
4.7
0.084
2.00
6.0x6.0x2.5
B82462G4472M
4.7
0.04
1.8
6.3x6.3x3.0
TDK/EPCOS
Several parameters are used to select the correct
inductor: maximum rated current, saturation current
and copper resistance (ESR). For boost converters, the
inductor current can be much higher than the output
current. The lower the inductor ESR, the higher the
efficiency of the converter: a common trade-off in size
versus efficiency.
The saturation current typically specifies a point at
which the inductance has rolled off a percentage of the
rated value. This can range from a 20% to 40%
reduction in inductance. As inductance rolls off, the
inductor ripple current increases, as does the peak
switch current. It is important to keep the inductance
from rolling off too much, causing switch current to
reach the peak limit.
 2014 Microchip Technology Inc.
MCP1642B/D
5.7
Thermal Calculations
The MCP1642B/D devices are available in two different
packages (MSOP-8 and 2 x 3 DFN-8). By calculating
the power dissipation and applying the package
thermal resistance (JA), the junction temperature is
estimated. The maximum continuous junction
temperature rating for the MCP1642B/D family of
devices is +125°C.
To quickly estimate the internal power dissipation for
the switching boost regulator, an empirical calculation
using measured efficiency can be used. Given the
measured efficiency, the internal power dissipation is
estimated by Equation 5-3.
EQUATION 5-3:
V OUT  I OUT
 ------------------------------- –  VOUT  I OUT  = P Dis
 Efficiency 
The difference between the first term, input power, and
the second term, power delivered, is the power dissipation of the MCP1642B/D devices. This is an estimate
assuming that most of the power lost is internal to the
MCP1642B/D and not CIN, COUT and the inductor.
There is some percentage of power lost in the boost
inductor, with very little loss in the input and output
capacitors. For a more accurate estimation of internal
power dissipation, subtract the IINRMS2 x LESR power
dissipation.
5.8
PCB Layout Information
Good printed circuit board layout techniques are
important to any switching circuitry, and switching
power supplies are no different. When wiring the
switching high-current paths, short and wide traces
should be used. Therefore, it is important that the input
and output capacitors be placed as close as possible to
the MCP1642B/D to minimize the loop area.
The feedback resistors and feedback signal should be
routed away from the switching node and the switching
current loop. When possible, ground planes and traces
should be used to help shield the feedback signal and
minimize noise and magnetic interference.
+VIN
L
CIN
GND
MCP1642
COUT
1
RTOP
RBOT
+VOUT
Via To Bottom
Plane
Enable
FIGURE 5-2:
Power Good
MCP1642B/D Recommended Layout, Applicable to Both Packages.
 2014 Microchip Technology Inc.
DS20005253A-page 19
MCP1642B/D
6.0
TYPICAL APPLICATION CIRCUITS
L
4.7 µH
VOUT
VIN
5.0V @ min. 500 mA
SW
3.3V to 4.2V
VOUT
VIN
LI-ION
+
MCP1642B-ADJ
CIN
10 µF
EN
FIGURE 6-1:
VFB
PGND
CC
27 pF
COUT
10 µF
RBOT
309 k
PG
-
RTOP
976 k
SGND
Portable USB Powered by Li-Ion.
L
4.7 µH
VIN
1.8V to 3.6V
SW
VOUT
5.0V @ min. 500 mA
VOUT
VIN
+
CIN
10 µF
COUT
10 µF
MCP1642B-50
EN
PG
NC
PGND SGND
+
28.7
Service Estimate (hours)
30.0
-
® AA
Energizer®
MAX®
AA
Energizer® MAX
Energizer®
UltimateLithium
LithiumAA
AA
Energizer® Ultimate
25.0
20.0
15.0
12.7
10.0
5.8
5.0
1.8
0.3
0.0
50 mA
250 mA
2.3
500 mA
Constant Output Current with 5V DC VOUT
Note:
Service estimates apply to using two Energizer® MAX® AA or Energizer® Ultimate Lithium AA
batteries as the power source. Note that, if PG or feedback divider network is used, some
additional input drain current should be included, but there will be negligible effects on the service
estimates at these three load currents.
FIGURE 6-2:
Portable USB Powered by Two Energizer® MAX® AA or Energizer® Ultimate Lithium
AA Batteries with the 5.0V Fixed Option of the MCP1642B.
DS20005253A-page 20
 2014 Microchip Technology Inc.
MCP1642B/D
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
8-Lead DFN (2x3x0.9 mm)
Example
Part Number
Code
MCP1642B-18I/MC
AJY
MCP1642BT-18I/MC
AJY
MCP1642B-30I/MC
AJU
MCP1642BT-30I/MC
AJU
MCP1642B-33I/MC
AJQ
MCP1642BT-33I/MC
AJQ
MCP1642B-50I/MC
AJL
MCP1642BT-50I/MC
AJL
MCP1642B-ADJI/MC
AKC
MCP1642BT-ADJI/MC
AKC
MCP1642D-18I/MC
AKA
MCP1642DT-18I/MC
AKA
MCP1642D-30I/MC
AJW
MCP1642DT-30I/MC
AJW
MCP1642D-33I/MC
AJS
MCP1642DT-33I/MC
AJS
MCP1642D-50I/MC
AJN
MCP1642DT-50I/MC
AJN
MCP1642D-ADJI/MC
AKE
MCP1642DT-ADJI/MC
AKE
8-Lead MSOP (3x3 mm)
AJY
348
25
Example
42B50I
348256
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2014 Microchip Technology Inc.
DS20005253A-page 21
MCP1642B/D
'
!""#$%&
)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
e
D
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
NOTE 1
2
1
1
2
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
8QLWV
'LPHQVLRQ/LPLWV
1XPEHURI3LQV
0,//,0(7(56
0,1
1
120
0$;
3LWFK
H
2YHUDOO+HLJKW
$
6WDQGRII
$
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$
5()
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'
%6&
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'
±
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±
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/
&RQWDFWWR([SRVHG3DG
.
±
±
&RQWDFW:LGWK
%6&
%6&
'
3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD
3DFNDJHPD\KDYHRQHRUPRUHH[SRVHGWLHEDUVDWHQGV
3DFNDJHLVVDZVLQJXODWHG
'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0
%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV
5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\
0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &&
DS20005253A-page 22
 2014 Microchip Technology Inc.
MCP1642B/D
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2014 Microchip Technology Inc.
DS20005253A-page 23
MCP1642B/D
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005253A-page 24
 2014 Microchip Technology Inc.
MCP1642B/D
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2014 Microchip Technology Inc.
DS20005253A-page 25
MCP1642B/D
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005253A-page 26
 2014 Microchip Technology Inc.
MCP1642B/D
APPENDIX A:
REVISION HISTORY
Revision A (December 2014)
• Original Release of this Document.
 2014 Microchip Technology Inc.
DS20005253A-page 27
MCP1642B/D
NOTES:
DS20005253A-page 28
 2014 Microchip Technology Inc.
MCP1642B/D
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
[X](1)
Tape
and Reel
X
X
/XX
Output
Voltage
Temperature
Range
Package
Examples:
a)
b)
Device:
MCP1642B:
1A, 1 MHz Low Voltage Start-up Synchronous
Boost Regulator With True Disconnect Output
MCP1642D: 1A, 1 MHz Low Voltage Start-up Synchronous
Boost Regulator With Input to Output Bypass
c)
d)
Output Voltage:
18
30
33
50
ADJ
=
=
=
=
=
1.8V
3.0V
3.3V
5.0V
Adjustable Output Voltage
e)
f)
Temperature
Range:
I
=
Package:
MC
=
MS
=
-40C to +85C (Industrial)
g)
Plastic Dual Flat, No Lead – 2x3x0.9 mm Body
(DFN)
Plastic Micro Small Outline (MSOP)
h)
a)
b)
c)
d)
e)
f)
g)
h)
MCP1642B-18I/MC:
Industrial temperature,
8LD 2x3 DFN package
MCP1642BT-18I/MC: Tape and Reel,
Industrial temperature,
8LD 2x3 DFN package
MCP1642B-ADJI/MC: Industrial temperature,
8LD 2x3 DFN package
MCP1642BT-ADJI/MC: Tape and Reel,
Industrial temperature,
8LD 2x3 DFN package
MCP1642B-18I/MS:
Industrial temperature,
8LD MSOP package
MCP1642BT-18I/MS: Tape and Reel,
Industrial temperature,
8LD MSOP package
MCP1642B-ADJI/MS: Industrial temperature,
8LD MSOP package
MCP1642BT-ADJI/MS: Tape and Reel,
Industrial temperature,
8LD MSOP package
MCP1642D-18I/MC:
Industrial temperature,
8LD 2x3 DFN package
MCP1642DT-18I/MC: Tape and Reel,
Industrial temperature,
8LD 2x3 DFN package
MCP1642D-ADJI/MC: Industrial temperature,
8LD 2x3 DFN package
MCP1642DT-ADJI/MC: Tape and Reel,
Industrial temperature,
8LD 2x3 DFN package
MCP1642D-18I/MS:
Industrial temperature,
8LD MSOP package
MCP1642DT-18I/MS: Tape and Reel,
Industrial temperature,
8LD MSOP package
MCP1642D-ADJI/MS: Industrial temperature,
8LD MSOP package
MCP1642DT-ADJI/MS: Tape and Reel,
Industrial temperature,
8LD 2x3 MSOP package
Note 1:
 2014 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
DS20005253A-page 29
MCP1642B/D
NOTES:
DS20005253A-page 30
 2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2014, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63276-905-3
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2014 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005253A-page 31
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
DS20005253A-page 32
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/25/14
 2014 Microchip Technology Inc.
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