Spec. No. : C211SP Issued Date : 2017.11.08 Revised Date : Page No. : 1/7 CYStech Electronics Corp. Switching Control Diode DISN0165SP Features High current capability Smoothly soft reverse recovery time (trr) Low profile surface mounted package in order to minimize board space Pb-free lead plating and halogen-free package Mechanical data Case : TO-277 Molded plastic Epoxy : UL94-V0 rated flame retardant Terminals : Plated terminals, solderable per MIL-STD-202 method 208 Weight : approx. 0.093 gram Symbol Outline TO-277 DISN0165SP Cathode Cathode 2 2 3 1 Not Connected Anode Not Connected 3 1 Anode Ordering Information Device DISN0165SP-65-TD-G Package TO-277 (Pb-free lead plating and halogen-free package) Shipping 5000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, TD : 5000 pcs / tape & reel, 13” reel Product rank, zero for no rank products Product name DISN0165SP Preliminary CYStek Product Specification Spec. No. : C211SP Issued Date : 2017.11.08 Revised Date : Page No. : 2/7 CYStech Electronics Corp. Absolute Maximum Ratings (TA=25℃, unless otherwise noted) Parameters Conditions Symbol Value Units Repetitive peak reverse voltage VRRM 650 V RMS voltage VRMS 455 V VR 650 V IF(AV) 1 A IFRM 1.57 A IFSM 14 A trr 1 μs Tstg -55~+150 C Tj -55~+150 C Continuous reverse voltage Forward rectified current Repetitive Peak Forward Current Forward surge current Maximum reverse recovery time Single phase half wave, 60Hz @TJ=25°C Single phase half wave, 60Hz @TJ=25°C 8.3ms single half sine-wave superimposed on rated load (JEDEC method) IF=1A, dIF/dt=100A/μs Storage temperature range Operating junction temperature range Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Thermal Resistance, Junction-to-ambient, max Thermal Resistance, Junction-to-ambient, max Power Dissipation @ TC=25°C Power Dissipation @ TA=25°C Power Dissipation @ TA=25°C Power Dissipation @ TA=25°C Symbol Rth,j-c Value 12.5 39 75 169 10 3.2 1.7 0.74 (Note 1 ) (Note 2 ) Rth,j-a (Note 3) (Note 1 ) PD (Note 2 ) (Note 3 ) Unit C/W W Note: 1. Device mounted on FR-4 PCB, single sided 2 oz. copper, pad dimension 50mm×50mm. 2. Device mounted on FR-4 PCB, single sided 1 oz. copper, pad dimension 25mm×25mm. 3. Device mounted on FR-4 PCB, single sided 1 oz. copper, minimum recommended pad dimension. Characteristics (TA=25C, unless otherwise noted) Characteristic Symbol Condition Continuous reverse voltage VR IR=100μA Forward Voltage VF 1 VF 2 IF=100mA IF=500mA VR=540V VR=540V, TA=125C VR=1V, f=1MHz Reverse Leakage Current IR Junction Capacitance CJ DISN0165SP Preliminary Min. Typ Max. Unit 650 - - V - 7 1.1 1.2 100 10 - V nA μA pF CYStek Product Specification Spec. No. : C211SP Issued Date : 2017.11.08 Revised Date : Page No. : 3/7 CYStech Electronics Corp. Typical Characteristics Power Derating Curve Power Derating Curve 3.5 12 See Note1 on page 2 10 See Note 2 on page 2 2.5 2 Power Dissipation(W) Power Dissipation(W) 3 See Note 3 on page 2 1.5 1 8 6 4 2 0.5 0 0 0 25 50 75 100 125 150 Ambient Temperature---TA(℃) 175 0 25 50 75 100 125 150 175 Case Temperature---TC ℃) Reverse Leakage Current vs Reverse Voltage Forward Current vs Forward Voltage 1000 10000 Reverse Leakage Current---I R (nA) Instantaneous Forward Current---IF(mA) 125℃ 1000 125℃ -40°C 100 25°C 75°C 10 100 75℃ 10 25℃ 1 -40°C 0.1 Pulse width=300μs 1 0.01 0 0.4 0.8 1.2 1.6 2 2.4 2.8 Forward Voltage---VF(V) 0 100 200 300 400 500 Reverse Voltage---VR (V) 600 700 Junction Capacitance vs Reverse Voltage Junction Capacitance---C J(pF) 100 10 Tj=25℃, f=1.0MHz 1 0.1 1 10 100 Reverse Voltage---VR(V) DISN0165SP Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211SP Issued Date : 2017.11.08 Revised Date : Page No. : 4/7 Recommended Soldering Footprint DISN0165SP Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211SP Issued Date : 2017.11.08 Revised Date : Page No. : 5/7 Reel Dimension Carrier Tape Dimension DISN0165SP Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211SP Issued Date : 2017.11.08 Revised Date : Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3C/second max. 3C/second max. 100C 150C 60-120 seconds 150C 200C 60-180 seconds 183C 60-150 seconds 240 +0/-5 C 217C 60-150 seconds 260 +0/-5 C 10-30 seconds 20-40 seconds 6C/second max. 6 minutes max. 6C/second max. 8 minutes max. Note :1. All temperatures refer to topside of the package, measured on the package body surface. 2.For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care should be taken to match the coefficients of thermal expansion between components and PCB. If they are not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the assembly cools. DISN0165SP Preliminary CYStek Product Specification CYStech Electronics Corp. Spec. No. : C211SP Issued Date : 2017.11.08 Revised Date : Page No. : 7/7 TO-277 Dimension Marking: Cathode DISN 0165 Anode □□ Cathode Date Code TO-277 Plastic Surface Mounted Package CYStek Package Code: SP Millimeters Min. Max. 1.05 1.15 0.80 0.99 1.70 1.88 0.15 0.35 0.20 0.33 4.00 4.30 3.90 4.05 DIM A b1 b2 b3 C D D1 Inches Min. Max. 0.041 0.045 0.031 0.039 0.067 0.074 0.006 0.014 0.008 0.013 0.157 0.169 0.154 0.159 DIM D2 E E1 E2 E3 e L Millimeters Min. Max. 2.95 3.15 6.40 6.60 5.30 5.45 3.45 3.65 4.20 4.60 1.84 TYP 0.75 0.95 Inches Min. Max. 0.116 0.124 0.252 0.260 0.209 0.215 0.136 0.144 0.165 0.181 0.072 TYP 0.030 0.037 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : Lead : Pure tin plated. Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. DISN0165SP Preliminary CYStek Product Specification