ON NSBC123JDP6T5G Dual npn bias resistor transistor Datasheet

MUN5235DW1,
NSBC123JDXV6,
NSBC123JDP6
Dual NPN Bias Resistor
Transistors
R1 = 2.2 kW, R2 = 47 kW
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NPN Transistors with Monolithic Bias
Resistor Network
This series of digital transistors is designed to replace a single
device and its external resistor bias network. The Bias Resistor
Transistor (BRT) contains a single transistor with a monolithic bias
network consisting of two resistors; a series base resistor and a
base-emitter resistor. The BRT eliminates these individual
components by integrating them into a single device. The use of a BRT
can reduce both system cost and board space.
Features
•
•
•
•
•
PIN CONNECTIONS
(3)
(2)
R1
R2
Q1
Q2
R2
(4)
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
S and NSV Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC-Q101 Qualified and PPAP Capable
These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
Compliant
(1)
R1
(5)
(6)
MARKING DIAGRAMS
6
SOT−363
CASE 419B
7M M G
G
1
MAXIMUM RATINGS
(TA = 25°C, common for Q1 and Q2, unless otherwise noted)
Rating
Symbol
Max
Unit
Collector-Base Voltage
VCBO
50
Vdc
Collector-Emitter Voltage
VCEO
50
Vdc
IC
100
mAdc
Input Forward Voltage
VIN(fwd)
12
Vdc
Input Reverse Voltage
VIN(rev)
5
Vdc
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
SOT−963
CASE 527AD
7M/D
M
G
1
MG
G
= Specific Device Code
= Date Code*
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping†
MUN5235DW1T1G,
SMUN5235DW1T1G
SOT−363
3,000 / Tape & Reel
SMUN5235DW1T3G
SOT−363
10,000 / Tape & Reel
NSBC123JDXV6T1G
SOT−563
4,000 / Tape & Reel
NSBC123JDXV6T5G
SOT−563
8,000 / Tape & Reel
NSBC123JDP6T5G
SOT−963
8,000 / Tape & Reel
Device
1
7M M G
G
D
Collector Current − Continuous
SOT−563
CASE 463A
*Date Code orientation may vary depending
upon manufacturing location.
†For information on tape and reel specifications, including part orientation and
tape sizes, please refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
February, 2014 − Rev. 1
1
Publication Order Number:
DTC123JD/D
MUN5235DW1, NSBC123JDXV6, NSBC123JDP6
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
187
256
1.5
2.0
mW
MUN5235DW1 (SOT−363) ONE JUNCTION HEATED
Total Device Dissipation
TA = 25°C
(Note 1)
(Note 2)
(Note 1)
(Note 2)
Derate above 25°C
Thermal Resistance,
Junction to Ambient
(Note 1)
(Note 2)
PD
RqJA
mW/°C
670
490
°C/W
250
385
2.0
3.0
mW
MUN5235DW1 (SOT−363) BOTH JUNCTION HEATED (Note 3)
Total Device Dissipation
TA = 25°C
(Note 1)
(Note 2)
(Note 1)
(Note 2)
Derate above 25°C
Thermal Resistance,
Junction to Ambient
(Note 1)
(Note 2)
Thermal Resistance,
Junction to Lead
(Note 1)
(Note 2)
Junction and Storage Temperature Range
PD
RqJA
RqJL
TJ, Tstg
493
325
188
208
mW/°C
°C/W
°C/W
−55 to +150
°C
357
2.9
mW
mW/°C
NSBC123JDXV6 (SOT−563) ONE JUNCTION HEATED
Total Device Dissipation
TA = 25°C
Derate above 25°C
(Note 1)
(Note 1)
Thermal Resistance,
Junction to Ambient
(Note 1)
PD
RqJA
350
°C/W
NSBC123JDXV6 (SOT−563) BOTH JUNCTION HEATED (Note 3)
Total Device Dissipation
TA = 25°C
Derate above 25°C
(Note 1)
(Note 1)
Thermal Resistance,
Junction to Ambient
(Note 1)
Junction and Storage Temperature Range
PD
RqJA
TJ, Tstg
500
4.0
250
mW
mW/°C
°C/W
−55 to +150
°C
231
269
1.9
2.2
MW
NSBC123JDP6 (SOT−963) ONE JUNCTION HEATED
Total Device Dissipation
TA = 25°C
(Note 4)
(Note 5)
(Note 4)
(Note 5)
Derate above 25°C
Thermal Resistance,
Junction to Ambient
(Note 4)
(Note 5)
PD
RqJA
540
464
mW/°C
°C/W
NSBC123JDP6 (SOT−963) BOTH JUNCTION HEATED (Note 3)
Total Device Dissipation
TA = 25°C
(Note 4)
(Note 5)
(Note 4)
(Note 5)
Derate above 25°C
Thermal Resistance,
Junction to Ambient
(Note 4)
(Note 5)
Junction and Storage Temperature Range
1.
2.
3.
4.
5.
PD
RqJA
TJ, Tstg
FR−4 @ Minimum Pad.
FR−4 @ 1.0 × 1.0 Inch Pad.
Both junction heated values assume total power is sum of two equally powered channels.
FR−4 @ 100 mm2, 1 oz. copper traces, still air.
FR−4 @ 500 mm2, 1 oz. copper traces, still air.
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2
339
408
2.7
3.3
369
306
−55 to +150
MW
mW/°C
°C/W
°C
MUN5235DW1, NSBC123JDXV6, NSBC123JDP6
ELECTRICAL CHARACTERISTICS (TA = 25°C, common for Q1 and Q2, unless otherwise noted)
Symbol
Characteristic
Min
Typ
Max
−
−
100
−
−
500
−
−
0.2
50
−
−
50
−
−
80
140
−
−
−
0.25
−
0.6
−
−
0.8
−
−
−
0.2
4.9
−
−
Unit
OFF CHARACTERISTICS
Collector-Base Cutoff Current
(VCB = 50 V, IE = 0)
ICBO
Collector-Emitter Cutoff Current
(VCE = 50 V, IB = 0)
ICEO
Emitter-Base Cutoff Current
(VEB = 6.0 V, IC = 0)
IEBO
Collector-Base Breakdown Voltage
(IC = 10 mA, IE = 0)
V(BR)CBO
Collector-Emitter Breakdown Voltage (Note 6)
(IC = 2.0 mA, IB = 0)
V(BR)CEO
nAdc
nAdc
mAdc
Vdc
Vdc
ON CHARACTERISTICS
hFE
DC Current Gain (Note 6)
(IC = 5.0 mA, VCE = 10 V)
Collector-Emitter Saturation Voltage (Note 6)
(IC = 10 mA, IB = 1.0 mA)
VCE(sat)
Input Voltage (Off)
(VCE = 5.0 V, IC = 100 mA)
Vi(off)
Input Voltage (On)
(VCE = 0.2 V, IC = 5.0 mA)
Vi(on)
Output Voltage (On)
(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kW)
VOL
Output Voltage (Off)
(VCC = 5.0 V, VB = 0.5 V, RL = 1.0 kW)
VOH
Input Resistor
R1
1.5
2.2
2.9
Resistor Ratio
R1/R2
0.038
0.047
0.056
V
Vdc
Vdc
Vdc
Vdc
kW
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Pulsed Condition: Pulse Width = 300 ms, Duty Cycle ≤ 2%.
PD, POWER DISSIPATION (mW)
400
350
300
250
200
(1) SOT−363; 1.0 × 1.0 Inch Pad
(2) SOT−563; Minimum Pad
(3) SOT−963; 100 mm2, 1 oz. Copper Trace
(1) (2) (3)
150
100
50
0
−50
−25
0
25
50
75
100
125
150
AMBIENT TEMPERATURE (°C)
Figure 1. Derating Curve
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3
MUN5235DW1, NSBC123JDXV6, NSBC123JDP6
1000
1
VCE = 10 V
IC/IB = 10
75°C
hFE, DC CURRENT GAIN
VCE(sat), COLLECTOR−EMITTER VOLTAGE (V)
TYPICAL CHARACTERISTICS
MUN5235DW1, NSBC123JDXV6
75°C
0.1
−25°C
25°C
0.01
0.001
0
10
20
40
30
IC, COLLECTOR CURRENT (mA)
100
1
10
IC, COLLECTOR CURRENT (mA)
Figure 2. VCE(sat) vs. IC
100
2.4
2
1.6
1.2
0.8
0.4
0
0
10
20
30
40
10
75°C
1
TA = −25°C
0.1
0.01
0.001
50
25°C
VO = 5 V
VR, REVERSE BIAS VOLTAGE (VOLTS)
3
4
5
6
7
Vin, INPUT VOLTAGE (V)
Figure 4. Output Capacitance
Figure 5. Output Current vs. Input Voltage
0
1
2
10
Vin, INPUT VOLTAGE (V)
Cob, CAPACITANCE (pF)
IC, COLLECTOR CURRENT (mA)
f = 10 kHz
IE = 0 A
TA = 25°C
2.8
100
Figure 3. DC Current Gain
3.6
3.2
25°C
10
1
50
TA = −25°C
75°C
1
25°C
TA = −25°C
VO = 0.2 V
0.1
0
40
10
20
30
IC, COLLECTOR CURRENT (mA)
Figure 6. Input Voltage vs. Output Current
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4
50
8
9
10
MUN5235DW1, NSBC123JDXV6, NSBC123JDP6
1000
1
VCE = 10 V
IC/IB = 10
hFE, DC CURRENT GAIN
VCE(sat), COLLECTOR−EMITTER VOLTAGE (V)
TYPICAL CHARACTERISTICS
NSBC123JDP6
25°C
150°C
0.1
−55°C
0.01
0
10
20
40
30
IC, COLLECTOR CURRENT (mA)
100
−55°C
10
1
50
1
10
IC, COLLECTOR CURRENT (mA)
Figure 7. VCE(sat) vs. IC
100
2
IC, COLLECTOR CURRENT (mA)
f = 10 kHz
IE = 0 A
TA = 25°C
1.6
1.2
0.8
0.4
0
10
20
30
40
VR, REVERSE BIAS VOLTAGE (V)
150°C
10
25°C
0.1
0.01
0.001
50
−55°C
1
VO = 5 V
0
Figure 9. Output Capacitance
0.5
1
1.5
2
Vin, INPUT VOLTAGE (V)
10
25°C
−55°C
1
150°C
VO = 0.2 V
0.1
0
2.5
Figure 10. Output Current vs. Input Voltage
100
Vin, INPUT VOLTAGE (V)
Cob, CAPACITANCE (pF)
100
Figure 8. DC Current Gain
2.4
0
150°C
25°C
40
10
20
30
IC, COLLECTOR CURRENT (mA)
Figure 11. Input Voltage vs. Output Current
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5
50
3
MUN5235DW1, NSBC123JDXV6, NSBC123JDP6
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
2X
aaa H D
D
A
D
6
5
GAGE
PLANE
4
2
L
L2
E1
E
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
H
DETAIL A
3
aaa C
2X
bbb H D
2X 3 TIPS
e
B
6X
ddd
TOP VIEW
A2
A
6X
ccc C
A1
SIDE VIEW
DIM
A
A1
A2
b
C
D
E
E1
e
L
L2
aaa
bbb
ccc
ddd
b
C
M
C A-B D
DETAIL A
SEATING
PLANE
END VIEW
c
MILLIMETERS
MIN
NOM MAX
−−−
−−−
1.10
0.00
−−−
0.10
0.70
0.90
1.00
0.15
0.20
0.25
0.08
0.15
0.22
1.80
2.00
2.20
2.00
2.10
2.20
1.15
1.25
1.35
0.65 BSC
0.26
0.36
0.46
0.15 BSC
0.15
0.30
0.10
0.10
RECOMMENDED
SOLDERING FOOTPRINT*
6X
6X
0.30
0.66
2.50
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
INCHES
NOM MAX
−−− 0.043
−−− 0.004
0.035 0.039
0.008 0.010
0.006 0.009
0.078 0.086
0.082 0.086
0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.006 BSC
0.006
0.012
0.004
0.004
MIN
−−−
0.000
0.027
0.006
0.003
0.070
0.078
0.045
MUN5235DW1, NSBC123JDXV6, NSBC123JDP6
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A
ISSUE F
D
−X−
6
5
1
e
2
A
4
E
−Y−
3
b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
L
DIM
A
b
C
D
E
e
L
HE
HE
C
5 PL
6
0.08 (0.003)
M
X Y
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
MUN5235DW1, NSBC123JDXV6, NSBC123JDP6
PACKAGE DIMENSIONS
SOT−963
CASE 527AD
ISSUE E
D
X
Y
6
5
4
1
2
3
HE
E
e
6X
6X
BOTTOM VIEW
DIM
A
b
C
D
E
e
HE
L
L2
C
SIDE VIEW
TOP VIEW
6X L2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
L
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.19 REF
0.05
0.10
0.15
b
0.08 X Y
RECOMMENDED
MOUNTING FOOTPRINT*
6X
6X
0.35
0.20
PACKAGE
OUTLINE
1.20
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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