Material Content Data Sheet Sales Product Name BSO110N03MS G MA# MA000466282 Package PG-DSO-8-39 Issued 29. August 2013 Weight* 83.37 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 0.614 0.74 0.010 0.01 0.041 0.05 491 0.820 0.98 9830 33.276 39.91 40.95 399131 409575 0.235 0.28 0.28 2823 2823 0.236 0.28 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.74 7362 7362 123 2832 7.319 8.78 39.663 47.57 56.63 475739 566356 0.814 0.98 0.98 9762 9762 0.073 0.09 0.09 871 871 0.041 0.05 0.230 0.28 87785 488 0.33 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2763 3251 1000000