Holtek BH66F2660 Body fat measurment flash mcu Datasheet

Body Fat Measurment Flash MCU
BH66F2650/BH66F2660
Revision: V1.10
Date: ����������������
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Table of Contents
Features................................................................................................................. 7
CPU Features...............................................................................................................................7
Peripheral Features.......................................................................................................................7
General Description.............................................................................................. 8
Selection Table...................................................................................................... 9
Block Diagram....................................................................................................... 9
Pin Assignment................................................................................................... 10
Pin Description................................................................................................... 11
Absolute Maximum Ratings............................................................................... 15
D.C. Characteristics............................................................................................ 15
Operating Voltage Characteristics...............................................................................................15
Standby Current Characteristics.................................................................................................16
Operating Current Characteristics...............................................................................................17
A.C. Characteristics............................................................................................ 18
High Speed Internal Oscillator – HIRC – Frequency Accuracy...................................................18
Low Speed Internal Oscillator Characteristics – LIRC................................................................18
Operating Frequency Characteristic Curves...............................................................................19
System Start Up Time Characteristics........................................................................................19
Input/Output Characteristics............................................................................. 20
Memory Characteristics..................................................................................... 22
LVD/LVR Electrical Characteristics................................................................... 22
24-bit A/D Converter Electrical Characteristics............................................... 23
12-bit D/A Converter Electrical Characteristics............................................... 24
Operational Amplifier Electrical Characteristics (Body Fat Circuit).............. 24
Power-on Reset Characteristics........................................................................ 25
System Architecture........................................................................................... 25
Clocking and Pipelining...............................................................................................................25
Program Counter.........................................................................................................................26
Stack...........................................................................................................................................27
Arithmetic and Logic Unit – ALU.................................................................................................27
Flash Program Memory...................................................................................... 28
Structure......................................................................................................................................28
Special Vectors...........................................................................................................................28
Look-up Table..............................................................................................................................29
Table Program Example..............................................................................................................29
In Circuit Programming – ICP.....................................................................................................30
On-Chip Debug Support – OCDS...............................................................................................31
In Application Programming – IAP..............................................................................................31
Rev. 1.10
2
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
RAM Data Memory.............................................................................................. 40
Structure......................................................................................................................................40
Data Memory Addressing............................................................................................................41
General Purpose Data Memory..................................................................................................41
Special Purpose Data Memory...................................................................................................41
Special Function Register Description............................................................. 44
Indirect Addressing Registers – IAR0, IAR1, IAR2.....................................................................44
Memory Pointers – MP0, MP1L, MP1H, MP2L, MP2H...............................................................44
Program Memory Bank Pointer – PBP........................................................................................46
Accumulator – ACC ....................................................................................................................46
Program Counter Low Register – PCL .......................................................................................46
Look-up Table Registers – TBLP, TBHP, TBLH ..........................................................................46
Status Register – STATUS .........................................................................................................47
EEPROM Data Memory....................................................................................... 49
EEPROM Data Memory Structure..............................................................................................49
EEPROM Registers....................................................................................................................49
Reading Data from the EEPROM...............................................................................................51
Writing Data to the EEPROM......................................................................................................51
Write Protection...........................................................................................................................51
EEPROM Interrupt......................................................................................................................51
Programming Considerations......................................................................................................52
Oscillators........................................................................................................... 53
Oscillator Overview ....................................................................................................................53
System Clock Configurations .....................................................................................................53
External High Speed Crystal Oscillator − HXT............................................................................54
Internal RC Oscillator − HIRC.....................................................................................................55
External 32.768kHz Crystal Oscillator − LXT..............................................................................55
Internal 32kHz Oscillator − LIRC.................................................................................................56
Operating Modes and System Clocks.............................................................. 56
System Clocks............................................................................................................................56
System Operation Modes............................................................................................................57
Control Registers........................................................................................................................58
Operating Mode Switching..........................................................................................................61
Standby Current Considerations.................................................................................................65
Wake-up......................................................................................................................................65
Watchdog Timer.................................................................................................. 66
Watchdog Timer Clock Source....................................................................................................66
Watchdog Timer Control Register...............................................................................................66
Watchdog Timer Operation.........................................................................................................67
Reset and Initialisation....................................................................................... 68
Reset Functions..........................................................................................................................68
Reset Initial Conditions ..............................................................................................................72
Rev. 1.10
3
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Input/Output Ports.............................................................................................. 76
Pull-high Resistors......................................................................................................................76
Port A Wake-up...........................................................................................................................77
I/O Port Control Registers...........................................................................................................77
I/O Port Source Current Control..................................................................................................78
Pin-shared Functions..................................................................................................................79
I/O Pin Structures........................................................................................................................83
Programming Considerations .....................................................................................................84
Timer Modules – TM........................................................................................... 84
Introduction.................................................................................................................................84
TM Operation..............................................................................................................................85
TM Clock Source.........................................................................................................................85
TM Interrupts...............................................................................................................................85
TM External Pins.........................................................................................................................85
TM Input/Output Pin Selection....................................................................................................86
Programming Considerations......................................................................................................87
Standard Type TM – STM................................................................................... 88
Standard TM Operation...............................................................................................................88
Standard Type TM Register Description.....................................................................................89
Standard Type TM Operation Modes..........................................................................................93
Periodic Type TM – PTM................................................................................... 103
Periodic TM Operation..............................................................................................................103
Periodic Type TM Register Description.....................................................................................103
Periodic Type TM Operating Modes .........................................................................................108
Analog to Digital Converter – ADC.................................................................. 117
A/D Overview............................................................................................................................ 117
Internal Power Supply .............................................................................................................. 117
A/D Data Rate Definition........................................................................................................... 118
A/D Converter Register Description.......................................................................................... 119
A/D Operation...........................................................................................................................127
Summary of A/D Conversion Steps...........................................................................................128
Programming Considerations....................................................................................................129
A/D Transfer Function...............................................................................................................129
A/D Converted Data..................................................................................................................130
A/D Converted Data to Voltage.................................................................................................131
A/D Programming Example.......................................................................................................131
Temperature Sensor..................................................................................................................132
Serial Interface Module – SIM.......................................................................... 132
SPI Interface.............................................................................................................................132
I2C Interface..............................................................................................................................139
Serial Peripheral Interface – SPIA................................................................... 148
SPIA Interface Operation..........................................................................................................148
SPIA Registers..........................................................................................................................150
Rev. 1.10
4
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
SPIA Communication................................................................................................................152
SPIA Bus Enable/Disable..........................................................................................................155
SPIA Operation.........................................................................................................................155
Error Detection..........................................................................................................................156
UART Interface.................................................................................................. 157
UART External Pin Interfacing..................................................................................................157
UART Data Transfer Scheme...................................................................................................157
UART Status and Control Registers.........................................................................................158
Baud Rate Generator................................................................................................................163
UART Setup and Control..........................................................................................................165
UART Transmitter.....................................................................................................................166
UART Receiver.........................................................................................................................167
Managing Receiver Errors........................................................................................................169
UART Module Interrupt Structure..............................................................................................170
UART Power Down and Wake-up.............................................................................................172
Body Fat Measurement Function.................................................................... 173
Sine Wave Generator................................................................................................................173
Body Fat Measurement Registers.............................................................................................176
Interrupts........................................................................................................... 180
Interrupt Registers.....................................................................................................................180
Interrupt Operation....................................................................................................................185
External Interrupt.......................................................................................................................186
LVD Interrupt.............................................................................................................................187
EEPROM Interrupt....................................................................................................................187
A/D Converter Interrupt.............................................................................................................187
Multi-function Interrupts.............................................................................................................187
Serial Interface Module Interrupt...............................................................................................188
SPIA Interrupt............................................................................................................................188
UART Interrupt..........................................................................................................................188
Time Base Interrupts.................................................................................................................188
Timer Module Interrupts............................................................................................................190
Interrupt Wake-up Function.......................................................................................................190
Programming Considerations....................................................................................................191
Low Voltage Detector – LVD............................................................................ 192
LVD Register.............................................................................................................................192
LVD Operation...........................................................................................................................193
16-bit Multiplication Division Unit – MDU....................................................... 194
MDU registers...........................................................................................................................194
Multiplication Division Unit Operation........................................................................................195
Application Circuits.......................................................................................... 197
Instruction Set................................................................................................... 199
Introduction...............................................................................................................................199
Instruction Timing......................................................................................................................199
Rev. 1.10
5
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Moving and Transferring Data...................................................................................................199
Arithmetic Operations................................................................................................................199
Logical and Rotate Operation...................................................................................................200
Branches and Control Transfer.................................................................................................200
Bit Operations...........................................................................................................................200
Table Read Operations.............................................................................................................200
Other Operations.......................................................................................................................200
Instruction Set Summary................................................................................. 201
Table Conventions.....................................................................................................................201
Extended Instruction Set...........................................................................................................203
Instruction Definition........................................................................................ 205
Extended Instruction Definition.................................................................................................214
Package Information........................................................................................ 221
48-pin LQFP (7mm×7mm) Outline Dimensions........................................................................222
Rev. 1.10
6
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Features
CPU Features
• Operating Voltage
♦♦ fSYS=4MHz: 2.2V~5.5V
♦♦ fSYS=8MHz: 2.2V~5.5V
♦♦ fSYS=12MHz: 2.7V~5.5V
♦♦ fSYS=16MHz: 3.3V~5.5V
• Up to 0.25μs instruction cycle with 16MHz system clock at VDD=5V
• Power down and wake-up functions to reduce power consumption
• Four Oscillators:
♦♦ High Speed Internal RC – HIRC
♦♦ External 32.768kHz Crystal – LXT
♦♦ High Speed External Crystal – HXT
♦♦ Internal 32kHz RC – LIRC
• Multi-mode operation: FAST, SLOW, IDLE and SLEEP
• Fully integrated internal 4MHz, 8MHz or 12MHz oscillator requires no external components
• All instructions executed in 1~3 instruction cycles
• Table read instructions
• 115 powerful instructions
• 8-level subroutine nesting
• Bit manipulation instruction
Peripheral Features
• Flash Program Memory: 8K×16 ~ 16K×16
• RAM Data Memory: 256×8 ~ 1024×8
• True EEPROM Memory: 64×8 ~ 256×8
• Watchdog Timer function
• In Application Programming – IAP
• Up to 28 bidirectional I/O lines
• 2 differential or 4 single-end channels 24-bit resolution Delta Sigma A/D converter
• Two pin-shared external interrupts
• Multiple Timer Modules for time measure, input capture, compare match output, PWM output or
single pulse output function
• Serial Interface Module with Dual SPI and I2C interfaces – SIM
• Single Serial Peripheral Interface – SPIA
• UART Interface for full duplex asynchronous communication
• Dual Time-Base functions for generation of fixed time interrupt signals
• Low Voltage Reset function – LVR
• Low Voltage Detect function – LVD
• Body Fat Circuit
• 16-bit Multiplication Division Unit
• Package type: 48-pin LQFP
Rev. 1.10
7
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
General Description
This series of devices are specifically designed for eight-electrode AC Body Fat Scale applications.
Measuring body fat uses a technique whereby an AC current flowing through the human body is
measured and then used to calculate a body fat value. The specialised circuits to do this are a weight
measurement circuit and a fat measurement circuit. The weight measurement circuit uses an external load
cell to output a signal, which after amplification by an operational amplifier, and then conversion using an
A/D converter, reads the corresponding value as the calculated weight. The fat measurement circuit
uses an AC signal via an electrode slice to flow through human body. After amplification by an internal
operational amplifier, and then conversion by an A/D converter, the measured value is one representing
body impedance, which is used to calculate the corresponding body fat value.
This series of devices are Flash Memory I/O type 8-bit high performance RISC architecture
microcontroller which includes a multi-channel 24-bit Delta Sigma A/D converter, designed for
applications that interface directly to analog signals and which require a low noise and high accuracy
analog-to-digital converter. Offering users the convenience of Flash Memory multi-programming
features, the devices also includes a wide range of functions and features. Other memory includes an
area of RAM Data Memory as well as an area of true EEPROM memory for storage of non-volatile
data such as serial numbers, calibration data etc.
Analog features include a multi-channel 24-bit Delta Sigma A/D converter, PGA and LDO and other
circuitry specifically designed for Body Fat Scale applications. Multiple and extremely flexible
Timer Modules provide timing, pulse generation and PWM generation functions. Communication
with the outside world is provided by including fully integrated SPI, I2C and UART interface
functions, popular interfaces which provide designers with a means of easy communication with
external peripheral hardware. Protective features such as an internal Watchdog Timer, Low Voltage
Reset and Low Voltage Detector coupled with excellent noise immunity and ESD protection ensure
that reliable operation is maintained in hostile electrical environments.
A full choice of external, internal and high and low oscillators functions are provided including two
fully integrated system oscillators which require no external components for their implementation.
The ability to operate and switch dynamically between a range of operating modes using different
clock sources gives users the ability to optimise microcontroller operation and minimise power
consumption.
The devices also include a multiplication/division unit. The inclusion of flexible I/O programming
features, Time-Base functions along with many other features ensure that only a minimum of
external components is required for application implementation, resulting in reduced component
costs and reductions in circuit board areas.
Rev. 1.10
8
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Selection Table
Most features are common to both devices. The main features distinguishing them are Memory
capacity. The following table summarises the main features of each device.
Part No.
VDD
ROM
BH66F2650
2.2V~5.5V
8K×16
BH66F2660
2.2V~5.5V
16K×16
EEPROM
I/O
Ext.Int.
A/D
Converter
256×8
64×8
28
2
24-bit×4
1024×8
256×8
28
2
24-bit×4
RAM
Part No.
Timer Module
Interface
MDU
Time Base
Stack
Package
BH66F2650
10-bit PTM×3
16-bit STM×1
SIM/UART/SPIA
√
2
8
48LQFP
BH66F2660
10-bit PTM×3
16-bit STM×1
SIM/UART/SPIA
√
2
8
48LQFP
Block Diagram
Watchdog
Time�
Flash/EEPROM
P�og�amming Ci�c�it��
EEPROM
Data
Memo��
Low
Voltage
Detect
Flash
P�og�am
Memo��
IAP
Inte�nal
HIRC/LIRC
Oscillato�s
Low
Voltage
Reset
RAM Data
Memo��
Time
Base
�-bit
RISC
MCU
Co�e
Exte�nal
HXT/LXT
Oscillato�s
Reset
Ci�c�it
Inte���pt
Cont�olle�
Bod� Fat
Ci�c�it
��-bit
Delta Sigma
A/D Conve�te�
I/O
Rev. 1.10
UART
SPIA
SPI/I�C
M�ltiplication/
Division
Unit
Time�
Mod�les
9
LDO/PGA
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Pin Assignment
PB1/INT1/STPB
PB0/SCK/SCL
PA7/SDI/SDA/PTCK�
PA6/RX/SDIA/STCK
PA5/TX/SCKA/STP/STPI
PA�/OSC1/SCSA/PTP�/PTP�I
PA3/OSC�/SDOA/PTP1/PTP1I
PA1/INT0/LVDIN/PTP0B/STCK
VSS
PA0/XT1/PTP0/PTP0I/OCDSDA/ICPDA
PA2/XT2/PTCK0/OCDSCK/ICPCK
VDD/VIN
�� �7 �6 �5 �� �3 �� �1 �0 39 3� 37
36
1
35
�
3�
3
33
�
5
3�
BH66F2650/BH66V2650
31
6
BH66F2660/BH66V2660
7
30
48
LQFP-A
�9
�
��
9
�7
10
�6
11
�5
1�
13 1� 15 16 17 1� 19 �0 �1 �� �3 ��
VOREG/VREFP
AVSS/VREFN
VCM
AN0
AN1
AN2
AN3
RFC
CP0N
TO
HVR
HIR
48 47 46 45 44 43 42 41 40 39 38 37
36
1
35
2
34
3
33
4
5
32
BH66F2650-8/BH66V2650-8
31
6
BH66F2660-8/BH66V2660-8
7
30
48
LQFP-B
29
8
28
9
27
10
26
11
25
12
13 14 15 16 17 18 19 20 21 22 23 24
PC0/PTP1/PTP1I
PC1/PTCK1
PC�/PTP�/PTP�I
PC3/PTCK�
PD0
PD1
PB3/SDO/SDIA/RX
PC5/SDOA/TX
PB�/SCS/SCKA
PC�/SCSA
PD2/RX
PD3/TX
PC6
PC7
PB�
PB5
PB6
PB7
SIN
RF
FVL
FIL
RF1
RF�
VOREG/VREFP
AVSS/VREFN
VCM
AN0
AN1
AN�
AN3
RFC
CP0N
TO
FVR
FIR
PB1/INT1/STPB
PB0/SCK/SCL
PA7/SDI/SDA/PTCK2
PA6/RX/SDIA/STCK
PA5/TX/SCKA/STP/STPI
PA4/OSC1/SCSA/PTP2/PTP2I
PA3/OSC2/SDOA/PTP1/PTP1I
PA1/INT0/LVDIN/PTP0B/STCK
VSS
PA0/XT1/PTP0/PTP0I/OCDSDA/ICPDA
PA2/XT2/PTCK0/OCDSCK/ICPCK
VDD/VIN
PC0/PTP1/PTP1I
PC1/PTCK1
PC2/PTP2/PTP2I
PC3/PTCK2
PD0
PD1
PB3/SDO/SDIA/RX
PC5/SDOA/TX
PB2/SCS/SCKA
PC4/SCSA
PD2/RX
PD3/TX
PC6
PC7
SIN
RF
HIL
HVL
FVL
FIL
RF1
RF2
FIR
FVR
Note: 1. If the pin-shared pin functions have multiple outputs, the desired pin-shared function is determined by the
corresponding software control bits.
2. The OCDSDA and OCDSCK pins are supplied as dedicated OCDS pins and as such only available for
the BH66V2650/BH66V2660 devices which are the OCDS EV chip for the BH66F2650/BH66F2660
devices.
Rev. 1.10
10
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Pin Description
Pin Name
PA0/XT1/PTP0/PTP0I/
OCDSDA/ICPDA
PA1/INT0/LVDIN/
PTP0B/STCK
PA2/XT2/PTCK0/
OCDSCK/ICPCK
PA3/OSC2/SDOA/
PTP1/PTP1I
PA4/OSC1/SCSA/
PTP2/PTP2I
PA5/TX/SCKA/STP/
STPI
Rev. 1.10
Function
OPT
I/T
O/T
PA0
PAWU
PAPU
PAS0
ST
CMOS
—
Descriptions
General purpose I/O.
Register enabled pull-up and wake-up.
XT1
PAS0
LXT
PTP0
PAS0
—
LXT input pin
PTP0I
PAS0
ST
OCDSDA
—
ST
CMOS OCDS address/data line, for EV chip only
ICPDA
—
ST
CMOS ICP address/data line
PA1
PAWU
PAPU
PAS0
ST
CMOS
INT0
PAS0
INTEG
INTC0
ST
—
External interrupt 0
—
LVD input
CMOS PTM0 output
—
LVDIN
PAS0
AN
PTP0B
PAS0
—
STCK
PAS0
IFS0
ST
—
PA2
PAWU
PAPU
PAS0
ST
CMOS
PTM0 capture input
General purpose I/O.
Register enabled pull-up and wake-up.
CMOS PTM0 inverting output
STM clock input
General purpose I/O.
Register enabled pull-up and wake-up.
XT2
PAS0
—
LXT
PTCK0
PAS0
ST
—
PTM0 clock input
OCDSCK
—
ST
—
OCDS clock input, for EV chip only
ICPCK
—
ST
—
ICP clock line
PA3
PAWU
PAPU
PAS0
ST
CMOS
HXT
LXT output pin
General purpose I/O.
Register enabled pull-up and wake-up.
OSC2
PAS0
—
SDOA
PAS0
—
CMOS SPIA serial data output
PTP1
PAS0
—
CMOS PTM1 output
PTP1I
PAS0
IFS0
ST
—
PA4
PAWU
PAPU
PAS1
ST
CMOS
OSC1
PAS1
HXT
—
SCSA
PAS1
IFS1
ST
CMOS SPIA slave select pin
PTP2
PAS1
—
CMOS PTM2 output
PTP2I
PAS1
IFS0
ST
—
PA5
PAWU
PAPU
PAS1
ST
CMOS
TX
PAS1
—
CMOS UART TX serial data output pin
SCKA
PAS1
IFS1
ST
STP
PAS1
—
STPI
PAS1
ST
—
HXT output pin
PTM1 capture input
General purpose I/O.
Register enabled pull-up and wake-up.
HXT input pin
PTM2 capture input
General purpose I/O.
Register enabled pull-up and wake-up.
SPIA serial clock input
CMOS STM output
—
11
STM capture input
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Pin Name
PA6/RX/SDIA/STCK
PA7/SDI/SDA/PTCK2
PB0/SCK/SCL
PB1/INT1/STPB
PB2/SCS/SCKA
PB3/SDO/SDIA/RX
PB4~PB7
PC0/PTP1/PTP1I
PC1/PTCK1
PC2/PTP2/PTP2I
Rev. 1.10
Function
OPT
I/T
O/T
PA6
PAWU
PAPU
PAS1
ST
CMOS
RX
PAS1
IFS1
ST
—
UART RX serial data input pin
SDIA
PAS1
IFS1
ST
—
SPIA serial data input
STCK
PAS1
IFS0
ST
—
STM clock input
PA7
PAWU
PAPU
PAS1
ST
CMOS
—
Descriptions
General purpose I/O.
Register enabled pull-up and wake-up.
General purpose I/O.
Register enabled pull-up and wake-up.
SDI
PAS1
ST
SDA
PAS1
ST
SPI (SIM) serial data input
PTCK2
PAS1
IFS0
ST
—
PB0
PBPU
PBS0
ST
CMOS
SCK
PBS0
ST
CMOS SPI (SIM) serial clock
SCL
PBS0
ST
NMOS I2C (SIM) clock line
PB1
PBPU
PBS0
ST
CMOS
INT1
PBS0
INTEG
INTC0
ST
—
STPB
PBS0
—
CMOS STM inverting output
PB2
PBPU
PBS0
ST
CMOS
SCS
PBS0
ST
CMOS SPI (SIM) slave chip select
SCKA
PBS0
IFS1
ST
CMOS SPIA serial clock input
PB3
PBPU
PBS0
ST
CMOS
SDO
PBS0
—
CMOS SPI (SIM) serial data output
SDIA
PBS0
IFS1
ST
—
SPIA serial data input
RX
PBS0
IFS1
ST
—
UART RX serial data input pin
PBn
PBPU
ST
CMOS
General purpose I/O.
Register enabled pull-high.
PC0
PCPU
PCS0
ST
CMOS
General purpose I/O.
Register enabled pull-high.
PTP1
PCS0
—
CMOS PTM1 output
PTP1I
PCS0
IFS0
ST
—
PC1
PCPU
ST
CMOS
PTCK1
—
ST
—
PC2
PCPU
PCS0
ST
CMOS
PTP2
PCS0
—
CMOS PTM2 output
PTP2I
PCS0
IFS0
ST
NMOS I2C (SIM) data line
—
12
PTM2 clock input
General purpose I/O.
Register enabled pull-high.
General purpose I/O.
Register enabled pull-high.
External interrupt 1
General purpose I/O.
Register enabled pull-high.
General purpose I/O.
Register enabled pull-high.
PTM1 capture input
General purpose I/O.
Register enabled pull-high.
PTM1 clock input
General purpose I/O.
Register enabled pull-high.
PTM2 capture input
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Pin Name
Function
I/T
O/T
Descriptions
General purpose I/O.
CMOS
Register enabled pull-high.
PCPU
ST
PTCK2
—
ST
—
PC4
PCPU
PCS1
ST
CMOS
SCSA
PCS1
IFS1
ST
CMOS SPIA slave select pin
PC5
PCPU
PCS1
ST
CMOS
SDOA
PAS0
PCS1
—
CMOS SPIA serial data output
TX
PCS1
—
CMOS UART TX serial data output pin
PC6~ PC7
PCn
PCPU
ST
CMOS
General purpose I/O.
Register enabled pull-high.
PD0~ PD1
PDn
PDPU
ST
CMOS
General purpose I/O.
Register enabled pull-high.
PD2
PDPU
PDS0
ST
CMOS
General purpose I/O.
Register enabled pull-high.
RX
PDS0
IFS1
ST
—
PD3
PDPU
PDS0
ST
CMOS
TX
PDS0
—
CMOS UART TX serial data output pin
VOREG
—
VREFP
PC3/PTCK2
PC3
OPT
PC4/SCSA
PC5/SDOA/TX
PD2/RX
PD3/TX
PTM2 clock input
General purpose I/O.
Register enabled pull-high.
General purpose I/O.
Register enabled pull-high.
UART RX serial data input pin
General purpose I/O.
Register enabled pull-high.
A/D Converter
VOREG/VREFP
AVSS/VREFN
AN0 ~ AN3
VCM
PWR
—
LDO output pin
PWR
—
Positive power supply for VCM,
A/D converter, PGA
—
AN
—
External positive reference input of A/D converter
AVSS
—
PWR
—
Negative power supply for VCM,
A/D converter, PGA
VREFN
—
AN
—
External negative reference input of A/D converter
ANn
—
AN
—
A/D input pin
AN
—
External input voltage for A/D converter common mode
—
AN
A/D converter Common mode voltage output
VCM
—
Body Fat Circuit
RFC
RFC
—
AN
—
A/D converter analog input
CP0N
—
AN
—
Peak detector input
TO
—
—
AN
Operational amplifier output
HVR
—
AN
AN
Right hand channel 1
HIR
HIR
—
AN
AN
Right hand channel 2
FVR
FVR
—
AN
AN
Right foot channel 1
FIR
FIR
—
AN
AN
Right foot channel 2
RF2
RF2
—
AN
AN
Reference 2 impedance channel
RF1
RF1
—
AN
AN
Reference 1 impedance channel
FIL
FIL
—
AN
AN
Left foot channel 2
FVL
FVL
—
AN
AN
Left foot channel 1
HVL
HVL
—
AN
AN
Left hand channel 1
HIL
HIL
—
AN
AN
Left hand channel 2
RF
RF
—
AN
AN
Reference 1/2 impedance channel
SIN
SIN
—
—
AN
Sine wave output
CP0N
TO
HVR
Rev. 1.10
13
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Pin Name
Function
OPT
I/T
O/T
Descriptions
VDD
—
PWR
—
Positive power supply
VIN
—
PWR
—
LDO input pin
VSS
—
PWR
—
Negative power supply.
Power
VDD/VIN
VSS
Legend: I/T: Input type;
OPT: Optional by register option;
ST: Schmitt Trigger input;
NMOS: NMOS output;
HXT: High frequency crystal oscillator;
LXT: Low frequency crystal oscillator
O/T: Output type
PWR: Power
CMOS: CMOS output
AN: Analog signal
Absolute Maximum Ratings
Supply Voltage.......................................................................................................VSS-0.3V~VSS+6.0V
Input Voltage...................................................................................................... VSS-0.3V to VDD+0.3V
Storage Temperature...................................................................................................... -50°C to 125°C
Operating Temperature.................................................................................................... -40°C to 85°C
IOH Total....................................................................................................................................... -80mA
IOL Total........................................................................................................................................ 80mA
Total Power Dissipation............................................................................................................ 500mW
Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute
Maximum Ratings” may cause substantial damage to the devices. Functional operation of
these devices at other conditions beyond those listed in the specification is not implied and
prolonged exposure to extreme conditions may affect device reliability.
D.C. Characteristics
For data in the following tables, note that factors such as oscillator type, operating voltage, operating
frequency, pin load conditions, temperature and program instruction type, etc., can all exert an
influence on the measured values.
Operating Voltage Characteristics
Ta=-40°C ~ 85°C
Symbol
Parameter
Min.
Typ.
Max.
fSYS=4MHz
2.2
—
5.5
fSYS=8MHz
2.2
—
5.5
fSYS=12MHz
2.7
—
5.5
fSYS=16MHz
3.3
—
5.5
fSYS=4MHz
2.2
—
5.5
fSYS=8MHz
2.2
—
5.5
fSYS=12MHz
2.7
—
5.5
Operating Voltage – LXT
fSYS=32.768kHz
2.2
—
5.5
V
Operating Voltage – LIRC
fSYS=32kHz
2.2
—
5.5
V
Operating Voltage – HXT
VDD
Operating Voltage – HIRC
Rev. 1.10
Test Conditions
14
Unit
V
V
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Standby Current Characteristics
Ta=25°C
Symbol
Standby Mode
Test Conditions
Min.
Typ.
Max.
—
0.2
0.6
0.7
—
0.2
0.8
1.0
—
0.5
1.0
1.2
—
1.2
2.4
2.9
—
1.5
3.0
3.6
5V
—
3.0
5.0
6.0
2.2V
—
2.4
4.0
4.8
—
3.0
5.0
6.0
—
5.0
10
12
—
2.4
4.0
4.8
—
3.0
5.0
6.0
—
5.0
10
12
—
0.17
0.24
0.26
—
0.25
0.35
0.385
—
0.48
0.67
0.70
—
0.32
0.45
0.48
—
0.47
0.66
0.70
—
0.91
1.27
1.30
—
0.60
0.84
0.87
—
0.68
0.95
1.00
5V
—
1.33
1.86
1.90
2.2V
—
0.17
0.24
0.26
—
0.25
0.35
0.385
—
0.48
0.67
0.70
—
0.32
0.45
0.48
—
0.47
0.66
0.70
—
0.91
1.27
1.30
—
0.60
0.84
0.87
—
0.68
0.95
1.00
—
1.33
1.86
1.90
—
1.10
1.60
1.90
—
1.80
2.50
2.60
VDD
Conditions
2.2V
3V
SLEEP Mode
WDT off
5V
2.2V
3V
IDLE0 Mode – LIRC
3V
WDT on
fSUB on
5V
2.2V
IDLE0 Mode – LXT
3V
fSUB on
5V
2.2V
3V
fSUB on, fSYS=4MHz
5V
ISTB
2.2V
IDLE1 Mode – HIRC
3V
fSUB on, fSYS =8MHz
5V
2.7V
3V
3V
fSUB on, fSYS=12MHz
fSUB on, fSYS =4MHz
5V
2.2V
3V
IDLE1 Mode – HXT
Max.
fSUB on, fSYS=8MHz
5V
2.7V
3V
fSUB on, fSYS=12MHz
5V
3.3V
5V
fSUB on, fSYS=16MHz
85°C
Unit
μA
μA
μA
μA
mA
mA
mA
mA
mA
mA
mA
Notes: When using the characteristic table data, the following notes should be taken into consideration:
1. Any digital inputs are setup in a non-floating condition.
2. All measurements are taken under conditions of no load and with all peripherals in an off state.
3. There are no DC current paths.
4. All Standby Current values are taken after a HALT instruction execution thus stopping all instruction
execution.
Rev. 1.10
15
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Operating Current Characteristics
Ta=25°C
Symbol
Operating Mode
Test Conditions
Typ.
Max.
—
8
16
—
10
20
5V
—
30
50
2.2V
—
8
16
—
10
20
—
30
50
—
0.3
0.5
—
0.4
0.6
—
0.8
1.2
—
0.6
1.0
—
0.8
1.2
5V
—
1.6
2.4
2.7V
—
1.0
1.4
—
1.2
1.8
—
2.4
3.6
—
0.4
0.6
—
0.5
0.75
5V
—
1.0
1.5
2.2V
—
0.8
1.2
—
1.0
1.5
—
2.0
3.0
—
1.2
2.2
—
1.5
2.75
—
3.0
4.5
—
3.2
4.8
—
4.0
6.0
VDD
Conditions
2.2V
SLOW Mode – LIRC
SLOW Mode – LXT
3V
3V
fSYS = 32kHz
fSYS = 32768Hz
5V
2.2V
3V
fSYS = 4MHz
5V
2.2V
FAST Mode – HIRC
IDD
3V
3V
fSYS = 8MHz
fSYS = 12MHz
5V
2.2V
3V
3V
FAST Mode – HXT
fSYS = 4MHz
fSYS = 8MHz
5V
2.7V
3V
fSYS = 12MHz
5V
3.3V
5V
fSYS = 16MHz
Min.
Unit
μA
μA
mA
mA
mA
mA
mA
mA
mA
Notes: When using the characteristic table data, the following notes should be taken into consideration:
1. Any digital inputs are setup in a non-floating condition.
2. All measurements are taken under conditions of no load and with all peripherals in an off state.
3. There are no DC current paths.
4. All Operating Current values are measured using a continuous NOP instruction program loop.
Rev. 1.10
16
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
A.C. Characteristics
For data in the following tables, note that factors such as oscillator type, operating voltage, operating
frequency and temperature etc., can all exert an influence on the measured values.
High Speed Internal Oscillator – HIRC – Frequency Accuracy
During the program writing operation the writer will trim the HIRC oscillator at a user selected
HIRC frequency and user selected voltage of either 3V or 5V.
Symbol
Parameter
4MHz Writer Trimmed HIRC
Frequency
8MHz Writer Trimmed HIRC
Frequency
fHIRC
12MHz Writer Trimmed HIRC
Frequency
Test Conditions
VDD
Temp.
3V/5V
2.2V~5.5V
3V/5V
2.2V~5.5V
5V
2.7V~5.5V
Min
Typ
Max
+1%
25°C
-1%
4
-40°C ~ 85°C
-2%
4
+2%
25°C
-2.5%
4
+2.5%
-40°C ~ 85°C
-3%
4
+3%
+1%
25°C
-1%
8
-40°C ~ 85°C
-2%
8
+2%
25°C
-2.5%
8
+2.5%
-40°C ~ 85°C
-3%
8
-3%
25°C
-1%
12
+1%
-40°C ~ 85°C
-2%
12
+2%
25°C
-2.5%
12
+2.5%
-40°C ~ 85°C
-3%
12
+3%
Unit
MHz
MHz
MHz
Notes: 1. The 3V/5V values for VDD are provided as these are the two selectable fixed voltages at which the HIRC
frequency is trimmed by the writer.
2. The row below the 3V/5V trim voltage row is provided to show the values for the full VDD range operating
voltage. It is recommended that the trim voltage is fixed at 3V for application voltage ranges from 2.2V
to 3.6V and fixed at 5V for application voltage ranges from 3.3V to 5.5V.
3. The minimum and maximum tolerance values provided in the table are only for the frequency at which
the writer trims the HIRC oscillator. After trimming at this chosen specific frequency any change in
HIRC oscillator frequency using the oscillator register control bits by the application program will give a
frequency tolerance to within ±20%.
Low Speed Internal Oscillator Characteristics – LIRC
Ta=25°C, unless otherwise specified
Symbol
fLIRC
Rev. 1.10
Parameter
LIRC Frequency
Test Conditions
VDD
Min.
Typ.
25°C
-5%
32
+5%
-40°C~85°C
-10%
32
+10%
Temp.
2.2V~5.5V
17
Max.
Unit
kHz
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Operating Frequency Characteristic Curves
System Operating Frequency
16MHz
1�MHz
�MHz
~
~
~
~
�MHz
�.�V
�.7V
3.3V
5.5V
Operating Voltage
System Start Up Time Characteristics
Ta=-40°C~85°C
Symbol
Parameter
System Start-up Time
Wake-up from condition
where fSYS is off
tSST
tRSTD
tSRESET
Test Conditions
Min.
Typ.
Max.
— fSYS = fH ~ fH/64, fH = fHXT
—
128
—
tHXT
— fSYS = fH ~ fH/64, fH = fHIRC
—
16
—
tHIRC
— fSYS = fSUB = fLXT
—
1024
—
tLXT
VDD
Conditions
Unit
— fSYS = fSUB = fLIRC
—
2
—
tLIRC
System Start-up Time
Wake-up from condition
where fSYS is on
fSYS = fH ~ fH/64,
—
fH = fHXT or fHIRC
—
2
—
tH
— fSYS = fSUB = fLXT or fLIRC
—
2
—
tSUB
System Speed Switch Time
FAST to SLOW Mode or
SLOW to FAST Mode
— fHXT switches from off → on
—
1024
—
tHXT
— fHIRC switches from off → on
—
16
—
tHIRC
— fLXT switches from off → on
—
1024
—
tLXT
42
48
54
ms
System Reset Delay Time
Reset source from Power-on reset or
LVR hardware reset
— RRPOR=5V/ms
System Reset Delay Time
LVRC/WDTC/RSTC software reset
—
—
System Reset Delay Time
Reset source from WDT overflow
—
—
14
16
18
ms
Minimum Software Reset Width to Reset —
—
45
90
120
μs
Notes: 1.For the System Start-up time values, whether fSYS is on or off depends upon the mode type and the chosen
fSYS system oscillator. Details are provided in the System Operating Modes section.
2. The time units, shown by the symbols tHXT, tHIRC etc. are the inverse of the corresponding frequency values
as provided in the frequency tables. For example tHIRC = 1/fHIRC, tSYS = 1/fSYS etc.
3. If the LIRC is used as the system clock and if it is off when in the SLEEP Mode, then an additional LIRC
start up time, tSTART, as provided in the LIRC frequency table, must be added to the tSST time in the table
above.
4. The System Speed Switch Time is effectively the time taken for the newly activated oscillator to start up.
Rev. 1.10
18
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Input/Output Characteristics
Ta=25°C
Symbol
Parameter
VIL
Input Low Voltage for I/O Ports
VIH
Input High Voltage for I/O Ports
IOL
Sink Current for I/O Ports
IOH
VOL
Rev. 1.10
Test Conditions
VDD
5V
—
—
5V
—
—
3V
5V
VOL=0.1VDD
Min.
Typ.
Max.
0
—
1.5
0
—
0.2VDD
3.5
—
5.0
0.8VDD
—
VDD
16
32
—
32
65
—
3V
VOH = 0.9VDD,
SLEDCn[m+1, m] = 00B
(n = 0,1; m = 0 or 2 or 4 or 6)
-0.7
-1.5
—
5V
VOH = 0.9VDD,
SLEDCn[m+1, m] = 00B
(n = 0,1; m = 0 or 2 or 4 or 6)
-1.5
-2.9
—
3V
VOH = 0.9VDD,
SLEDCn[m+1, m] = 01B
(n = 0,1;m = 0 or 2 or 4 or 6)
-1.3
-2.5
—
5V
VOH = 0.9VDD,
SLEDCn[m+1, m] = 01B
(n = 0,1; m = 0 or 2 or 4 or 6)
-2.5
-5.1
—
3V
VOH = 0.9VDD,
SLEDCn[m+1, m] = 10B
(n = 0,1; m = 0 or 2 or 4 or 6)
-1.8
-3.6
—
5V
VOH = 0.9VDD,
SLEDCn[m+1, m] = 10B
(n = 0,1;m = 0 or 2 or 4 or 6)
-3.6
-7.3
—
3V
VOH = 0.9VDD,
SLEDCn[m+1, m] = 11B
(n = 0,1; m = 0 or 2 or 4 or 6)
-4
-8
—
5V
VOH = 0.9VDD,
SLEDCn[m+1, m] = 11B
(n = 0,1;m = 0 or 2 or 4 or 6)
-8
-16
—
3V
IOL = 16mA
—
—
0.3
5V
IOL = 32mA
—
—
0.5
Source Current for I/O Ports
Output Low Voltage for I/O Ports
Conditions
19
Unit
V
V
mA
mA
V
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Symbol
VOH
Parameter
Test Conditions
Min.
Typ.
Max.
IOH = -0.7mA,
SLEDCn[m+1, m] = 00B
(n = 0,1; m = 0 or 2 or 4 or 6)
2.7
—
—
5V
IOH = -1.5mA,
SLEDCn[m+1, m] = 00B
(n = 0,1;m = 0 or 2 or 4 or 6)
4.5
—
—
3V
IOH = -1.3mA,
SLEDCn[m+1, m] = 01B
(n = 0,1; m = 0 or 2 or 4 or 6)
2.7
—
—
5V
IOH = -2.5mA,
SLEDCn[m+1, m] = 01B
(n = 0,1; m = 0 or 2 or 4 or 6)
4.5
—
—
3V
IOH = -1.8mA,
SLEDCn[m+1, m] = 10B
(n = 0,1; m = 0 or 2 or 4 or 6)
2.7
—
—
5V
IOH = -3.6mA,
SLEDCn[m+1, m] = 10B
(n = 0,1; m = 0 or 2 or 4 or 6)
4.5
—
—
3V
IOH = -4mA,
SLEDCn[m+1, m] = 11B
(n = 0,1; m = 0 or 2 or 4 or 6)
2.7
—
—
5V
IOH = -8mA,
SLEDCn[m+1, m] = 11B
(n = 0,1; m = 0 or 2 or 4 or 6)
4.5
—
—
20
60
100
10
30
50
—
—
±1
μA
VDD
Conditions
3V
Output High Voltage for I/O Ports
3V
—
Unit
V
RPH
Pull-High Resistance for I/O Ports (Note)
ILEAK
Input Leakage Current
tTPI
STPI, PTPnI Input Pin Minimum Pulse
Width
—
—
0.3
—
—
μs
tTCK
STCK, PTCKn Input Pin Minimum
Pulse Width
—
—
0.3
—
—
μs
tINT
External Interrupt Minimum Pulse
Width
—
—
10
—
—
μs
5V
3V/5V VIN = VDD or VIN = VSS
kΩ
Note: The RPH internal pull high resistance value is calculated by connecting to ground and enabling the input pin
with a pull-high resistor and then measuring the input sink current at the specified supply voltage level.
Dividing the voltage by this measured current provides the RPH value.
Memory Characteristics
Ta=-40°C~85°C
Symbol
VRW
Parameter
VDD for Read / Write
Test Conditions
Min.
Typ.
Max.
Unit
—
VDDmin
—
VDDmax
V
2.2
2.5
2.8
ms
VDD
Conditions
—
Program Flash / Data EEPROM Memory
tDEW
Erase / Write Cycle Time
—
—
IDDPGM
Programming / Erase Current on VDD
—
—
—
—
5.0
mA
EP
Cell Endurance
—
—
100K
—
—
E/W
tRETD
ROM Data Retention Time
—
—
40
—
Year
1.0
—
—
V
Ta = 25°C
RAM Data Memory
VDR
Rev. 1.10
RAM Data Retention Voltage
—
20
—
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
LVD/LVR Electrical Characteristics
Ta=25°C
Symbol
VDD
VLVR
VLVD
Test Conditions
Parameter
Operating Voltage
Low Voltage Reset Voltage
Low Voltage Detection Voltage
ILVRLVDBG Operating Current
tLVDS
LVDO Stable Time
VDD
Conditions
—
—
Min.
Typ.
Max.
Unit
V
2.2
—
5.5
— LVR enable, voltage select 2.10V
-5%
2.1
+5%
— LVR enable, voltage select 2.55V
-5%
2.55
+5%
— LVR enable, voltage select 3.15V
-5%
3.15
+5%
— LVR enable, voltage select 3.80V
-5%
3.8
+5%
— LVD enable, voltage select 1.04V
-10%
1.04
+10%
— LVD enable, voltage select 2.20V
-5%
2.2
+5%
— LVD enable, voltage select 2.40V
-5%
2.4
+5%
— LVD enable, voltage select 2.70V
-5%
2.7
+5%
— LVD enable, voltage select 3.00V
-5%
3.0
+5%
— LVD enable, voltage select 3.30V
-5%
3.3
+5%
— LVD enable, voltage select 3.60V
-5%
3.6
+5%
— LVD enable, voltage select 4.00V
-5%
4.0
+5%
3V LVD enable, LVR enable, VBGEN=0
—
—
18
5V LVD enable, LVR enable, VBGEN=0
—
20
25
3V LVD enable, LVR enable, VBGEN=1
—
—
150
5V LVD enable, LVR enable, VBGEN=1
—
25
30
For LVR enable, VBGEN=0,
—
LVD off → on
—
—
15
For LVR disable, VBGEN=0,
LVD off → on
—
—
150
—
V
V
μA
μs
tLVR
Minimum Low Voltage Width to
Reset
—
—
120
240
480
μs
tLVD
Minimum Low Voltage Width to
Interrupt
—
—
60
120
240
μs
ILVR
Additional Current for LVR Enable — LVD disable, VBGEN=0
—
—
24
μA
ILVD
Additional Current for LVD Enable — LVR disable, VBGEN=0
—
—
24
μA
24-bit A/D Converter Electrical Characteristics
LDO + VCM Test conditions: MCU HALT, other function disable;
VDD=VIN, Ta=25°C
Symbol
VIN
IQ
VOUT_LDO
ΔVLOAD
Rev. 1.10
Parameter
LDO Input Voltage
LDO Quiescent Current
Test Conditions
VDD
—
—
—
LDOVS[1:0]=00B, VIN =3.6V,
No load
—
LDOVS[1:0]=00B, VIN=3.6V,
ILOAD=0.1mA
—
LDOVS[1:0]=01B, VIN=3.6V,
ILOAD=0.1mA
LDO Output Voltage
LDO Load Regulation(Note 1)
Conditions
—
LDOVS[1:0]=10B, VIN=3.6V,
ILOAD=0.1mA
—
LDOVS[1:0]=11B, VIN=3.6V,
ILOAD=0.1mA
—
LDOVS[1:0]=00B, VIN=VOUT_LDO+0.2V,
0mA ≤ ILOAD ≤ 10mA
21
Min.
Typ.
Max.
Unit
2.6
—
5.5
V
—
400
520
μA
+ 5%
V
0.21
%/mA
2.4
2.6
-5%
2.9
3.3
—
0.105
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Symbol
VDROP_LDO
TCLDO
Parameter
Test Conditions
VDD
ΔVLINE_LDO LDO Line Regulation
VOUT_VCM
VCM Output Voltage
TCVCM
VCM Temperature
Coefficient
Min.
Typ.
Max.
Unit
—
LDOVS[1:0]=00B, VIN=3.6V,
ILOAD=10mA, ∆VOUT_LDO=2%
—
—
220
—
LDOVS[1:0]=01B, VIN=3.6V,
ILOAD=10mA, ∆VOUT_LDO=2%
—
—
200
—
LDOVS[1:0]=10B, VIN=3.6V,
ILOAD=10mA, ∆VOUT_LDO=2%
—
—
180
—
LDOVS[1:0]=11B, VIN=3.6V,
ILOAD=10mA, ∆VOUT_LDO=2%
—
—
160
—
Ta=-40°C~85°C, LDOVS[1:0]=00B,
VIN=3.6V, ILOAD=100μA
—
—
0.48
mV/°C
LDOVS[1:0]=00B, 2.6V ≤ VIN ≤ 5.5V,
ILOAD=100μA
—
—
0.7
%/V
LDOVS[1:0]=00B, 2.6V ≤ VIN ≤ 3.6V,
ILOAD=100μA
—
—
0.2
%/V
LDO Dropout Voltage(Note2)
LDO Temperature
Coefficient
Conditions
—
mV
—
VOREG=3.3V, No load
-5%
1.25
+ 5%
V
—
Ta=-40°C~85°C, VOREG=3.3V,
ILOAD=10μA
—
—
0.24
mV/°C
ΔVLINE_VCM VCM Line Regulation
—
2.4V ≤ VOREG ≤ 3.3V, No load
—
—
0.3
%/V
tVCMS
VCM Turn on Stable Time
—
VOREG=3.3V, No load
—
—
10
ms
IOH
Source Current for VCM
Output Pin
—
VOREG=3.3V, ∆VOUT_VCM=-2%
1
—
—
mA
IOL
Sink Current for VCM
Output Pin
—
VOREG=3.3V, ∆VOUT_VCM=+2%
1
—
—
mA
A/D Converter & A/D Converter Internal Reference Voltage (Delta Sigma A/D Converter)
VOREG
Supply Voltage for VCM,
A/D converter, PGA, OPA
IADC
Additional Current for A/D
Converter Enable
—
LDOEN=0
2.4
—
3.3
—
LDOEN=1
2.4
—
3.3
—
VCM enable, VRBUFP=1 and
VRBUFN=1
—
750
900
—
VCM enable, VRBUFP=0 and
VRBUFN=0
—
600
750
MCU enters SLEEP mode, No Load
—
—
1
μA
—
—
24
Bit
—
±50
±200
ppm
IADSTB
Standby Current
—
NR
Resolution
—
—
V
μA
INL
Integral Non-linearity
—
VOREG=3.3V, VREF=1.25V,
∆SI=±450mV, PGA gain=1
NFB
Noise Free Bits
—
PGA gain=128, Data rate=10Hz
—
15.4
—
Bit
ENOB
Effective Number of Bits
—
PGA gain=128, Data rate=10Hz
—
18.1
—
Bit
fADCK
A/D Converter
Clock Frequency
—
40
409.6
440
kHz
fADO
A/D Converter
Output Data Rate
VREFP
VREFN
—
—
fMCLK=4MHz, FLMS[2:0]=000B
4
—
521
—
fMCLK=4MHz, FLMS[2:0]=010B
10
—
1302
VREFN
+ 0.8
—
VOREG
V
0
—
VREFP
- 0.8
V
0.80
—
1.75
V
0.4
—
VOREG
- 0.95
V
-VREF
/Gain
—
+VREF
/Gain
V
—
External Reference Input
Voltage
VREF
VREFS=1, VRBUFP=0, VRBUFN=0
—
—
VGS[1:0]=00B, VREF=VREFP−VREFN
Hz
PGA
VCM_PGA
Common Mode Voltage
Range
—
ΔDI
Differential Input Voltage
Range
—
Rev. 1.10
—
Gain=PGS × AGS
22
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Symbol
Parameter
Test Conditions
VDD
Conditions
—
Ta=-40°C~85°C, VREF=1.25V,
VGS[1:0]=00B (Gain=1), VRBUFP=0,
VRBUFN=0
Min.
Typ.
Max.
Unit
—
175
—
μV/°C
Temperature Sensor
TCTS
Temperature Sensor
Temperature Coefficient
Note: 1. Load regulation is measured at a constant junction temperature, using pulse testing with a low ON time
and is guaranteed up to the maximum power dissipation. Power dissipation is determined by the input/
output differential voltage and the output current. Guaranteed maximum power dissipation will not be
available over the full input/output range. The maximum allowable power dissipation at any ambient
temperature is PD=(TJ(MAX)-Ta)/θJA.
2. Dropout voltage is defined as the input voltage minus the output voltage that produces a 2% change in the
output voltage from the value at appointed VIN.
12-bit D/A Converter Electrical Characteristics
Ta=25°C
Symbol
Parameter
Test Conditions
VDD
Conditions
Min.
Typ.
Max.
Unit
VDACO
Output Voltage Range
—
—
VSS
—
VREF
V
VREF
Reference Voltage
—
—
1.05
—
VDD
V
IDAC
Additional Current for D/A
Converter Enable
—
VREF=5V
—
—
450
μA
DNL
Differential Non-linearity
—
2.4V ≤ VDD ≤ 5.5V
—
—
±4
LSB
INL
Integral Non-linearity
—
2.4V ≤ VDD ≤ 5.5V
—
—
±8
LSB
Operational Amplifier Electrical Characteristics (Body Fat Circuit)
Ta=25°C
Symbol
Parameter
Test Conditions
VDD
Conditions
—
Min.
Typ.
Max.
Unit
2.4
—
5.5
V
VDD
Supply Voltage
—
ICC
Supply Current Per Signal Amplifier
5V
Io=0A
150
360
500
μA
OP0, OP1, OP2
SR
Slew Rate at Unity Gain
3V
RL=100kΩ, CL=100pF
7.5
—
—
V/μs
GBW
Gain Bandwidth Product
3V
RL=100kΩ, CL=100pF
—
—
2
MHz
Rev. 1.10
23
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Power-on Reset Characteristics
Ta=25°C
Symbol
Test Conditions
Parameter
VDD
Conditions
Min.
Typ.
Max.
Unit
VPOR
VDD Start Voltage to Ensure Power-on Reset
—
—
—
—
100
mV
RRPOR
VDD Rising Rate to Ensure Power-on Reset
—
—
0.035
—
—
V/ms
tPOR
Minimum Time for VDD Stays at VPOR to
Ensure Power-on Reset
—
—
1
—
—
ms
VDD
tPOR
RRPOR
VPOR
Time
System Architecture
A key factor in the high-performance features of the range of microcontrollers is attributed to their
internal system architecture. This series of devices take advantage of the usual features found within
RISC microcontrollers providing increased speed of operation and enhanced performance. The
pipelining scheme is implemented in such a way that instruction fetching and instruction execution
are overlapped, hence instructions are effectively executed in one or two cycles for most of the
standard or extended instructions respectively. The exceptions to this are branch or call instructions
which need one more cycle. An 8-bit wide ALU is used in practically all instruction set operations,
which carries out arithmetic operations, logic operations, rotation, increment, decrement, branch
decisions, etc. The internal data path is simplified by moving data through the Accumulator and
the ALU. Certain internal registers are implemented in the Data Memory and can be directly
or indirectly addressed. The simple addressing methods of these registers along with additional
architectural features ensure that a minimum of external components is required to provide a
functional I/O or A/D control system with maximum reliability and flexibility. This makes the
devices suitable for low-cost, high-volume production for controller applications.
Clocking and Pipelining
The main system clock, derived from either a HXT, LXT, HIRC or LIRC oscillator is subdivided
into four internally generated non-overlapping clocks, T1~T4. The Program Counter is incremented
at the beginning of the T1 clock during which time a new instruction is fetched. The remaining
T2~T4 clocks carry out the decoding and execution functions. In this way, one T1~T4 clock
cycle forms one instruction cycle. Although the fetching and execution of instructions takes place
in consecutive instruction cycles, the pipelining structure of the microcontroller ensures that
instructions are effectively executed in one instruction cycle. The exception to this are instructions
where the contents of the Program Counter are changed, such as subroutine calls or jumps, in which
case the instruction will take one more instruction cycle to execute.
Rev. 1.10
24
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
fSYS
(S�stem Clock)
Phase Clock T1
Phase Clock T�
Phase Clock T3
Phase Clock T�
P�og�am Co�nte�
Pipelining
PC
PC+1
PC+�
Fetch Inst. (PC)
Exec�te Inst. (PC-1)
Fetch Inst. (PC+1)
Exec�te Inst. (PC)
Fetch Inst. (PC+�)
Exec�te Inst. (PC+1)
System Clocking and Pipelining
For instructions involving branches, such as jump or call instructions, two machine cycles are
required to complete instruction execution. An extra cycle is required as the program takes one
cycle to first obtain the actual jump or call address and then another cycle to actually execute the
branch. The requirement for this extra cycle should be taken into account by programmers in timing
sensitive applications.
1
MOV A�[1�H]
�
CALL DELAY
3
CPL [1�H]
�
:
5
:
6 DELAY: NOP
Fetch Inst. 1
Exec�te Inst. 1
Fetch Inst. �
Exec�te Inst. �
Fetch Inst. 3
Fl�sh Pipeline
Fetch Inst. 6
Exec�te Inst. 6
Fetch Inst. 7
Instruction Fetching
Program Counter
During program execution, the Program Counter is used to keep track of the address of the next
instruction to be executed. It is automatically incremented by one each time an instruction is ex­
ecuted except for instructions, such as “JMP” or “CALL” that demands a jump to a non-consecutive
Program Memory address. Only the lower 8 bits, known as the Program Counter Low Register, are
directly addressable by the application program.
When executing instructions requiring jumps to non-consecutive addresses such as a jump
instruction, a subroutine call, interrupt or reset, etc., the microcontroller manages program control
by loading the required address into the Program Counter. For conditional skip instructions, once
the condition has been met, the next instruction, which has already been fetched during the present
instruction execution, is discarded and a dummy cycle takes its place while the correct instruction is
obtained.
Device
Program Counter
Program Counter High Byte
PCL Register
BH66F2650
PC12~PC8
PCL7~PCL0
BH66F2660
PBP0, PC12~PC8
PCL7~PCL0
Program Counter
Rev. 1.10
25
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
The lower byte of the Program Counter, known as the Program Counter Low register or PCL, is
available for program control and is a readable and writeable register. By transferring data directly
into this register, a short program jump can be executed directly. However, as only this low byte
is available for manipulation, the jumps are limited to the present page of memory, that is 256
locations. When such program jumps are executed it should also be noted that a dummy cycle
will be inserted. Manipulating the PCL register may cause program branching, so an extra cycle is
needed to pre-fetch.
Stack
This is a special part of the memory which is used to save the contents of the Program Counter only.
The stack is organized into 8 levels and is neither part of the data nor part of the program space,
and is neither readable nor writeable. The activated level is indexed by the Stack Pointer, and is
neither readable nor writeable. At a subroutine call or interrupt acknowledge signal, the contents of
the Program Counter are pushed onto the stack. At the end of a subroutine or an interrupt routine,
signaled by a return instruction, RET or RETI, the Program Counter is restored to its previous value
from the stack. After a device reset, the Stack Pointer will point to the top of the stack.
P�og�am Co�nte�
Top of Stack
Stack Level 1
Stack Level �
Stack
Pointe�
Stack Level 3
:
:
:
Bottom of Stack
P�og�am Memo��
Stack Level �
If the stack is full and an enabled interrupt takes place, the interrupt request flag will be recorded
but the acknowledge signal will be inhibited. When the Stack Pointer is decremented, by RET or
RETI, the interrupt will be serviced. This feature prevents stack overflow allowing the programmer
to use the structure more easily. However, when the stack is full, a CALL subroutine instruction can
still be executed which will result in a stack overflow. Precautions should be taken to avoid such
cases which might cause unpredictable program branching. If the stack is overflow, the first Program
Counter save in the stack will be lost.
Arithmetic and Logic Unit – ALU
The arithmetic-logic unit or ALU is a critical area of the microcontroller that carries out arithmetic
and logic operations of the instruction set. Connected to the main microcontroller data bus, the ALU
receives related instruction codes and performs the required arithmetic or logical operations after
which the result will be placed in the specified register. As these ALU calculation or operations may
result in carry, borrow or other status changes, the status register will be correspondingly updated to
reflect these changes. The ALU supports the following functions:
• Arithmetic operations:
ADD, ADDM, ADC, ADCM, SUB, SUBM, SBC, SBCM, DAA
LADD, LADDM, LADC, LADCM, LSUB, LSUBM, LSBC, LSBCM, LDAA
• Logic operations:
AND, OR, XOR, ANDM, ORM, XORM, CPL, CPLA
LAND, LANDM, LOR, LORM, LXOR, LXORM, LCPL, LCPLA
Rev. 1.10
26
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
• Rotation:
RRA, RR, RRCA, RRC, RLA, RL, RLCA, RLC,
LRRA, LRR, LRRCA, LRRC, LRLA, LRL, LRLCA, LRLC
• Increment and Decrement:
INCA, INC, DECA, DEC, LINCA, LINC, LDECA, LDEC
• Branch decision:
JMP, SZ, SZA, SNZ, SIZ, SDZ, SIZA, SDZA, CALL, RET, RETI,
LSNZ, LSZ, LSZA, LSIZ, LSIZA, LSDZ, LSDZA
Flash Program Memory
The Program Memory is the location where the user code or program is stored. For the BH66F2650/
BH66F2660 devices the Program Memory is Flash type, which means it can be programmed and
re-programmed a large number of times, allowing the user the convenience of code modification
on the same device. By using the appropriate programming tools, the Flash devices offer users the
flexibility to conveniently debug and develop their applications while also offering a means of field
programming and updating.
Structure
The Program Memory has a capacity of 8K×16 ~ 16K×16 bits. The Program Memory is addressed
by the Program Counter and also contains data, table information and interrupt entries. Table data,
which can be setup in any location within the Program Memory, is addressed by a separate table
pointer register.
Device
Capacity
Banks
BH66F2650
8K×16
—
BH66F2660
16K×16
0~1
BH66F2650
BH66F2660
Reset
Reset
Inte���pt
Vecto�
Inte���pt
Vecto�
0000H
000�H
0030H
16 bits
1FFFH
16 bits
�000H
Bank 1
3FFFH
Program Memory Structure
Special Vectors
Within the Program Memory, certain locations are reserved for the reset and interrupts. The location
000H is reserved for use by the device reset for program initialisation. After a device reset is
initiated, the program will jump to this location and begin execution.
Rev. 1.10
27
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Look-up Table
Any location within the Program Memory can be defined as a look-up table where programmers can
store fixed data. To use the look-up table, the table pointer must first be setup by placing the address
of the look up data to be retrieved in the table pointer register, TBLP and TBHP. These registers
define the total address of the look-up table.
After setting up the table pointer, the table data can be retrieved from the Program Memory using the
corresponding table read instruction such as “TABRD [m]” or “TABRDL [m]” respectively when
the memory [m] is located in sector 0. If the memory [m] is located in other sectors, the data can be
retrieved from the program memory using the corresponding extended table read instruction such as
“LTABRD [m]” or “LTABRDL [m]” respectively. When the instruction is executed, the lower order
table byte from the Program Memory will be transferred to the user defined Data Memory register [m]
as specified in the instruction. The higher order table data byte from the Program Memory will be
transferred to the TBLH special register.
The accompanying diagram illustrates the addressing data flow of the look-up table.
P�og�am Memo��
TBLP Registe�
Add�ess
Last Page o�
TBHP Registe�
Data
16 bits
Registe� TBLH
Use� Selected
Registe�
High B�te
Low B�te
Table Program Example
The following example shows how the table pointer and table data is defined and retrieved from the
microcontroller. This example uses raw table data located in the Program Memory which is stored
there using the ORG statement. The value at this ORG statement is “1F00H” which refers to the
start address of the last page within the 8K Program Memory of the BH66F2650 device. The table
pointer low byte register is setup here to have an initial value of “06H”. This will ensure that the
first data read from the data table will be at the Program Memory address “1F06H” or 6 locations
after the start of the last page. Note that the value for the table pointer is referenced to the address
specified by TBLP and TBHP if the “TABRD [m]” or “LTABRD [m]” instruction is being used. The
high byte of the table data which in this case is equal to “0” will be transferred to the TBLH register
automatically when the “TABRD [m]” or “LTABRD [m]” instruction is executed.
Because the TBLH register is a read/write register and can be restored, care should be taken
to ensure its protection if both the main routine and Interrupt Service Routine use table read
instructions. If using the table read instructions, the Interrupt Service Routines may change the
value of the TBLH and subsequently cause errors if used again by the main routine. As a rule it is
recommended that simultaneous use of the table read instructions should be avoided. However, in
situations where simultaneous use cannot be avoided, the interrupts should be disabled prior to the
execution of any main routine table-read instructions. Note that all table related instructions require
two instruction cycles to complete their operation.
Rev. 1.10
28
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Table Read Program Example
tempreg1 db ? ; temporary register #1
tempreg2 db ? ; temporary register #2
:
:
mov a,06h ; initialise low table pointer - note that this address is referenced
mov tblp,a ; to the last page or the page that tbhp pointed
mov a,1Fh ; initialise high table pointer
mov tbhp,a
:
:
tabrd tempreg1 ; transfers value in table referenced by table pointer data at program
; memory address “1F06H” transferred to tempreg1 and TBLH
dec tblp ; reduce value of table pointer by one
tabrd tempreg2 ; transfers value in table referenced by table pointer
; data at program memory address “1F05H” transferred to
; tempreg2 and TBLH in this example the data “1AH” is
; transferred to tempreg1 and data “0FH” to register tempreg2
:
:
org 1F00h ; sets initial address of program memory
dc 00Ah, 00Bh, 00Ch, 00Dh, 00Eh, 00Fh, 01Ah, 01Bh
:
:
In Circuit Programming – ICP
The provision of Flash type Program Memory provides the user with a means of convenient and easy
upgrades and modifications to their programs on the same device. As an additional convenience,
a means of programming the microcontroller in-circuit has provided using a 4-pin interface. This
provides manufacturers with the possibility of manufacturing their circuit boards complete with a
programmed or un-programmed microcontroller, and then programming or upgrading the program
at a later stage. This enables product manufacturers to easily keep their manufactured products
supplied with the latest program releases without removal and re-insertion of the device.
The Flash MCU to Writer Programming Pin correspondence table is as follows:
Writer Pins
MCU Programming Pins
ICPDA
PA0
Programming Serial Data/Address
Pin Description
ICPCK
PA2
Programming Clock
VDD
VDD
Power Supply
VSS
VSS
Ground
The Program Memory and EEPROM data Memory can both be programmed serially in-circuit using
this 4-wire interface. Data is downloaded and uploaded serially on a single pin with an additional
line for the clock. Two additional lines are required for the power supply. The technical details
regarding the in-circuit programming of the device are beyond the scope of this document and will
be supplied in supplementary literature.
During the programming process, taking control of the ICPDA and ICPCK pins for data and clock
programming purposes. The user must there take care to ensure that no other outputs are connected
to these two pins.
Rev. 1.10
29
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
W�ite� Connecto�
Signals
MCU P�og�amming
Pins
W�ite�_VDD
VDD
ICPDA
PA0
ICPCK
PA�
W�ite�_VSS
VSS
*
*
To othe� Ci�c�it
Note: * may be resistor or capacitor. The resistance of * must be greater than 1kΩ or the capacitance
of * must be less than 1nF.
On-Chip Debug Support – OCDS
There is an EV chip named BH66V2650/BH66V2660 which is used to emulate the real MCU device
named BH66F2650/BH66F2660. This EV chip device also provides an “On-Chip Debug” function
to debug the device during the development process. The EV chip and the actual MCU device are
almost functionally compatible except for the “On-Chip Debug” function. Users can use the EV chip
device to emulate the real chip device behavior by connecting the OCDSDA and OCDSCK pins
to the HT-IDE development tools. The OCDSDA pin is the OCDS Data/Address input/output pin
while the OCDSCK pin is the OCDS clock input pin. When users use the EV chip for debugging,
other functions which are shared with the OCDSDA and OCDSCK pins in the actual MCU device
will have no effect in the EV chip. However, the two OCDS pins which are pin-shared with the ICP
programming pins are still used as the Flash Memory programming pins for ICP. For a more detailed
OCDS description, refer to the corresponding document.
e-Link Pins
EV Chip Pins
OCDSDA
OCDSDA
On-chip Debug Support Data/Address input/output
Pin Description
OCDSCK
OCDSCK
On-chip Debug Support Clock input
VDD
VDD
Power Supply
VSS
VSS
Ground
In Application Programming – IAP
The devices offer IAP function to update data or application program to Fash ROM. Users can define
any ROM location for IAP, but there are some features which user must notice in using IAP function.
IAP Features
Rev. 1.10
BH66F2650 Configurations BH66F2660 Configurations
Erase Page
32 words / page
64 words / page
Writing Word
32 words / time
64 words / time
Reading Word
1 word / time
1 word / time
30
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
In Application Programming Control Registers
The Address registers, FARL and FARH, the Data registers, FD0L/FD0H, FD1L/FD1H, FD2L/FD2H
and FD3L/FD3H, and the Control registers, FC0, FC1 and FC2, are the corresponding Flash access
registers located in Data Memory sector 1 for IAP. If using the indirect addressing method to access
the FC0, FC1 and FC2 registers, all read and write operations to the registers must be performed
using the Indirect Addressing Register, IAR1 or IAR2, and the Memory Pointer pair, MP1L/MP1H
or MP2L/MP2H. Because the FC0, FC1 and FC2 control registers are located at the address of
43H~45H in Data Memory sector 1, the desired value ranged from 43H to 45H must first be written
into the MP1L or MP2L Memory Pointer low byte and the value “01H” must also be written into the
MP1H or MP2H Memory Pointer high byte.
Register Name
FC0
Bit
7
6
5
4
3
CFWEN FMOD2 FMOD1 FMOD0 FWPEN
2
1
0
FWT
FRDEN
FRD
FC1
D7
D6
D5
D4
D3
D2
D1
D0
FC2
—
—
—
—
—
—
—
CLWB
FARL
A7
A6
A5
A4
A3
A2
A1
A0
FARH (BH66F2650)
—
—
—
A12
A11
A10
A9
A8
FARH (BH66F2660)
—
—
A13
A12
A11
A10
A9
A8
FD0L
D7
D6
D5
D4
D3
D2
D1
D0
FD0H
D15
D14
D13
D12
D11
D10
D9
D8
FD1L
D7
D6
D5
D4
D3
D2
D1
D0
FD1H
D15
D14
D13
D12
D11
D10
D9
D8
FD2L
D7
D6
D5
D4
D3
D2
D1
D0
FD2H
D15
D14
D13
D12
D11
D10
D9
D8
FD3L
D7
D6
D5
D4
D3
D2
D1
D0
FD3H
D15
D14
D13
D12
D11
D10
D9
D8
IAP Registers List
• FC0 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
CFWEN
FMOD2
FMOD1
FMOD0
FWPEN
FWT
FRDEN
FRD
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7
CFWEN: Flash Memory Write Enable Control
0: Flash memory write function is disabled
1: Flash memory write function has been successfully enabled
When this bit is cleared to “0” by application program, the Flash memory write
function is disabled. Note that writing a “1” into this bit results in no action. This bit is
used to indicate that the Flash memory write function status. When this bit is set to “1”
by hardware, it means that the Flash memory write function is enabled successfully.
Otherwise, the Flash memory write function is disabled as the bit content is “0”.
Bit 6~4
FMOD2~FMOD0: Mode Selection
000: Write program memory
001: Page erase program memory
010: Reserved
011: Read program memory
100: Reserved
101: Reserved
110: FWEN mode – Flash memory Write function Enable mode
111: Reserved
31
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Bit 3
FWPEN: Flash Memory Write Procedure Enable Control
0: Disable
1: Enable
When this bit is set to “1” and the FMOD field is set to “110”, the IAP controller will
execute the “Flash memory write function enable” procedure. Once the Flash memory
write function is successfully enabled, it is not necessary to set the FWPEN bit any
more.
Bit 2
FWT: Flash Memory Write Initiate Control
0: Do not initiate Flash memory write or Flash memory write process is completed
1: Initiate Flash memory write process
This bit is set by software and cleared by hardware when the Flash memory write
process is completed.
Bit 1
FRDEN: Flash Memory Read Enable Control
0: Flash memory read disable
1: Flash memory read enable
Bit 0
FRD: Flash Memory Read Initiate Control
0: Do not initiate Flash memory read or Flash memory read process is completed
1: Initiate Flash memory read process
This bit is set by software and cleared by hardware when the Flash memory read
process is completed.
• FC1 Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
D7~D0: Whole Chip Reset Pattern
When user writes a specific value of “55H” to this register, it will generate a reset
signal to reset whole chip.
• FC2 Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
—
—
—
CLWB
R/W
—
—
—
—
—
—
—
R/W
POR
—
—
—
—
—
—
—
0
Bit 7~1
Unimplemented, read as "0".
Bit 0
CLWB: Flash Memory Write Buffer Clear Control
0: Do not initiate Write Buffer Clear process or Write Buffer Clear process is
completed
1: Initiate Write Buffer Clear process
This bit is set by software and cleared by hardware when the Write Buffer Clear
process is completed.
• FARL Register
Bit
7
6
5
4
3
2
1
0
Name
A7
A6
A5
A4
A3
A2
A1
A0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
Rev. 1.10
Flash Memory Address bit 7~bit 0
32
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
• FARH Register – BH66F2650
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
A12
A11
A10
A9
A8
R/W
—
—
—
R/W
R/W
R/W
R/W
R/W
POR
—
—
—
0
0
0
0
0
Bit 7~5
Unimplemented, read as “0”
Bit 4~0
Flash Memory Address bit 12~bit 8
• FARH Register – BH66F2660
Bit
7
6
5
4
3
2
1
0
Name
—
—
A13
A12
A11
A10
A9
A8
R/W
—
—
R/W
R/W
R/W
R/W
R/W
R/W
POR
—
—
0
0
0
0
0
0
Bit 7~6
Unimplemented, read as “0”
Bit 5~0
Flash Memory Address bit 13~bit 8
• FD0L Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
The first Flash Memory Data bit 7~bit 0
• FD0H Register
Bit
7
6
5
4
3
2
1
0
Name
D15
D14
D13
D12
D11
D10
D9
D8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
The first Flash Memory Data bit 15~bit 8
• FD1L Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
The second Flash Memory Data bit 7~bit 0
• FD1H Register
Bit
7
6
5
4
3
2
1
0
Name
D15
D14
D13
D12
D11
D10
D9
D8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
Rev. 1.10
The second Flash Memory Data bit 15~bit 8
33
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
• FD2L Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
The third Flash Memory Data bit 7~bit 0
• FD2H Register
Bit
7
6
5
4
3
2
1
0
Name
D15
D14
D13
D12
D11
D10
D9
D8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
The third Flash Memory Data bit 15~bit 8
• FD3L Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
The fourth Flash Memory Data bit 7~bit 0
• FD3H Register
Bit
7
6
5
4
3
2
1
0
Name
D15
D14
D13
D12
D11
D10
D9
D8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
The fourth Flash Memory Data bit 15~bit 8
Flash Memory Write Function Enable Procedure
In order to allow users to change the Flash memory data through the IAP control registers, users
must first enable the Flash memory write operation by the following procedure:
1. Write “110” into the FMOD2~FMOD0 bits to select the FWEN mode.
2. Set the FWPEN bit to “1”. The step 1 and step 2 can be executed simultaneously.
3. The pattern data with a sequence of 00H, 04H, 0DH, 09H, C3H and 40H must be written into the
FD1L, FD1H, FD2L, FD2H, FD3L and FD3H registers respectively.
4. A counter with a time-out period of 300μs will be activated to allow users writing the correct
pattern data into the FD1L/FD1H~FD3L/FD3H register pairs. The counter clock is derived from
LIRC oscillator.
5. If the counter overflows or the pattern data is incorrect, the Flash memory write operation will
not be enabled and users must again repeat the above procedure. Then the FWPEN bit will
automatically be cleared to “0” by hardware.
6. If the pattern data is correct before the counter overflows, the Flash memory write operation will
be enabled and the FWPEN bit will automatically be cleared to “0” by hardware. The CFWEN
bit will also be set to “1” by hardware to indicate that the Flash memory write operation is
successfully enabled.
7. Once the Flash memory write operation is enabled, the user can change the Flash ROM data
through the Flash control register.
8. To disable the Flash memory write operation, the user can clear the CFWEN bit to “0”.
Rev. 1.10
34
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Is co�nte�
ove�flow ?
Flash Memo��
W�ite F�nction
Enable P�oced��e
No
Yes
FWPEN=0
Set FMOD [�:0] =110 & FWPEN=1
Select FWEN mode & Sta�t Flash w�ite
Ha�dwa�e activate a co�nte�
Is patte�n
co��ect ?
W�tie the following patte�n to Flash Data �egiste�s
FD1L= 00h � FD1H = 0�h
FD�L= 0Dh � FD�H = 09h
FD3L= C3h � FD3H = �0h
No
Yes
CFWEN = 1
CFWEN=0
S�ccess
Failed
END
Flash Memory Write Function Enable Procedure
Rev. 1.10
35
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Flash Memory Read/Write Procedure
After the Flash memory write function is successfully enabled through the preceding IAP procedure,
users must first erase the corresponding Flash memory page and then initiate the Flash memory write
operation. For the BH66F2650/BH66F2660 devices the number of the page erase operation are 32
words and 64 words per page respectively, the available page erase address is specified by FARH
register and the content of FARL [7:5] and FARL[7:6]bit field respectively.
Erase Page
0
1
2
3
4
5
6
7
8
9
:
:
126
127
128
129
:
:
254
255
FARH
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0000
0000 0001
0000 0001
:
:
0000 1111
0000 1111
0001 0000
0001 0000
:
:
0001 1111
0001 1111
FARL [7:5]
000
001
010
011
100
101
110
111
000
001
:
:
110
111
000
001
:
:
110
111
FARL [4:0]
x xxxx
x xxxx
x xxxx
x xxxx
x xxxx
x xxxx
x xxxx
x xxxx
x xxxx
x xxxx
:
:
x xxxx
x xxxx
x xxxx
x xxxx
:
:
x xxxx
x xxxx
“x”: don’t care
BH66F2650 Erase Page Number and Selection
Erase Page
FARH
FARL [7:6]
FARL [5:0]
0
0000 0000
00
xx xxxx
1
0000 0000
01
xx xxxx
2
0000 0000
10
xx xxxx
3
0000 0000
11
xx xxxx
4
0000 0001
00
xx xxxx
5
0000 0001
01
xx xxxx
:
:
:
:
:
:
:
:
126
0001 1111
10
xx xxxx
127
0001 1111
11
xx xxxx
128
0010 0000
00
xx xxxx
129
0010 0000
01
xx xxxx
:
:
:
:
:
:
:
:
254
0011 1111
10
xx xxxx
255
0011 1111
11
xx xxxx
“x”: don’t care
BH66F2660 Erase Page Number and Selection
Rev. 1.10
36
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Read
Flash Memo��
Set FMOD [�:0]=011
& FRDEN=1
Set Flash Add�ess �egiste�s
FARH=xxh� FARL=xxh
Set FRD=1
No
FRD=0 ?
Yes
Read data val�e:
FD0L=xxh� FD0H=xxh
Read Finish ?
No
Yes
Clea� FRDEN bit
END
Read Flash Memory Procedure
Rev. 1.10
37
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
W�ite
Flash Memo��
Flash Memo�� W�ite F�nction Enable
P�oced��e
Set Page E�ase add�ess: FARH/FARL
Set FMOD [�:0]=001 & FWT=1
Select “Page E�ase mode”
& Initiate w�ite ope�ation
No
FWT=0 ?
Yes
Set FMOD [�:0]=000
Select “W�ite Flash Mode”
Set W�ite sta�ting add�ess: FARH/FARL
W�ite data to data �egiste�: FD0L/FD0H
Yes
No
Page data
W�ite finish
Set FWT=1
Yes
No
FWT=0 ?
W�ite Finish ?
No
Yes
Clea� CFWEN=0
END
Write Flash Memory Procedure
Note: When the FWT or FRD bit is set to “1”, the MCU is stopped.
Rev. 1.10
38
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
RAM Data Memory
The Data Memory is a volatile area of 8-bit wide RAM internal memory and is the location where
temporary information is stored.
Categorised into three types, the first of these is an area of RAM where special function registers are
located. These registers have fixed locations and are necessary for correct operation of the devices.
Many of these registers can be read from and written to directly under program control, however,
some remain protected from user manipulation. The second area of Data Memory is reserved for
general purpose use. All locations within this area are read and write accessible under program
control. The third area is used for the Sine Pattern function. The addresses of the Sine Pattern
Memory area overlop those in the Special Purpose Data Memory area.
Structure
The Data Memory is subdivided into several sectors, all of which are implemented in 8-bit wide
RAM. Each of the Data Memory Sector is categorized into three types, the special Purpose Data
Memory and the General Purpose Data Memory. While the 00H~3FH of Sector 3 is Sine Pattern
Memory.
The start address of the Data Memory for the devices is the address 00H. Switching between the
different Data Memory sectors is achieved by setting the Memory Pointers to the correct value.
Device
Special Purpose
Data Memory
Sine Pattern
Data Memory
Available Sectors
Capacity
0: 00H~7FH
1: 20H~5AH
BH66F2650
64×8
0: 00H~7FH
1: 20H~5AH
BH66F2660
64×8
General Purpose
Data Memory
Address
3: 00H~3FH
3: 00H~3FH
Capacity
Address
256×8
0: 80H~FFH
1: 80H~FFH
1024×8
0: 80H~FFH
1: 80H~FFH
:
6: 80H~FFH
7: 80H~FFH
00H
�0H
Special P��pose
Data Memo��
Secto� 1
00H
Secto� 3
Sine Patte�n Memo��
3FH
5AH
7FH
�0H
Gene�al P��pose
Data Memo��
FFH
Secto� 0
Secto� N
Note: For the BH66F2650, N=1; For the BH66F2660, N=7
Data Memory Structure
Rev. 1.10
39
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Data Memory Addressing
For these devices that support the extended instructions, there is no Bank Pointer for Data Memory
addressing. For Data Memory the desired Sector is pointed by the MP1H or MP2H register and the
certain Data Memory address in the selected sector is specified by the MP1L or MP2L register when
using indirect addressing access.
Direct Addressing can be used in all sectors using the corresponding instruction which can address
all available data memory space. For the accessed data memory which is located in any data
memory sectors except sector 0, the extended instructions can be used to access the data memory
instead of using the indirect addressing access. The main difference between standard instructions
and extended instructions is that the data memory address “m” in the extended instructions has 9 or
11 valid bits depending on which device is selected, the high byte indicates a sector and the low byte
indicates a specific address.
General Purpose Data Memory
All microcontroller programs require an area of read/write memory where temporary data can be
stored and retrieved for use later. It is this area of RAM memory that is known as General Purpose
Data Memory. This area of Data Memory is fully accessible by the user programing for both reading
and writing operations. By using the bit operation instructions individual bits can be set or reset
under program control giving the user a large range of flexibility for bit manipulation in the Data
Memory.
Special Purpose Data Memory
This area of Data Memory is where registers, necessary for the correct operation of the
microcontroller, are stored. Most of the registers are both readable and writeable but some are
protected and are readable only, the details of which are located under the relevant Special Function
Register section. Note that for locations that are unused, any read instruction to these addresses will
return the value “00H”.
Rev. 1.10
40
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
00H
01H
0�H
03H
0�H
05H
06H
07H
0�H
09H
0AH
0BH
0CH
0DH
0EH
0FH
10H
11H
1�H
13H
1�H
15H
16H
17H
1�H
19H
1AH
1BH
1CH
1DH
1EH
1FH
�0H
�1H
��H
�3H
��H
�5H
�6H
�7H
��H
�9H
�AH
�BH
�CH
�DH
�EH
�FH
30H
31H
3�H
33H
3�H
35H
36H
37H
3�H
39H
3AH
3BH
3CH
3DH
3EH
3FH
Secto� 0
IAR0
MP0
IAR1
MP1L
MP1H
ACC
PCL
TBLP
TBLH
TBHP
STATUS
IAR�
MP�L
MP�H
RSTFC
SCC
HIRCC
HXTC
LXTC
PA
PAC
PAPU
PAWU
RSTC
LVRC
LVDC
MFI0
MFI1
MFI�
WDTC
INTEG
INTC0
INTC1
INTC�
INTC3
PB
PBC
PBPU
PC
PCC
PCPU
PSCR
TB0C
TB1C
USR
UCR1
UCR�
TXR_RXR
BRG
SIMC0
SIMC1
SIMD
SIMA/SIMC�
SIMTOC
Secto� 1
�0H
�1H
��H
�3H
��H
�5H
�6H
�7H
��H
�9H
�AH
�BH
�CH
�DH
�EH
�FH
50H
51H
5�H
53H
5�H
55H
56H
57H
5�H
59H
5AH
5BH
5CH
5DH
5EH
5FH
60H
61H
6�H
63H
6�H
65H
66H
67H
6�H
69H
6AH
6BH
6CH
6DH
6EH
6FH
70H
71H
7�H
73H
7�H
75H
76H
77H
7�H
79H
7AH
7BH
7CH
7DH
7EH
7FH
PTM1C0
PTM1C1
PTM1DL
PTM1DH
PTM1AL
PTM1AH
PTM1RPL
PTM1RPH
PTM�C0
PTM�C1
PTM�DL
PTM�DH
PTM�AL
PTM�AH
PTM�RPL
PTM�RPH
SPIAC0
SPIAC1
SPIAD
Secto� 0
EEA
EED
STMC0
STMC1
STMDL
STMDH
STMAL
STMAH
STMRP
PTM0C0
PTM0C1
PTM0DL
PTM0DH
PTM0AL
PTM0AH
PTM0RPL
PTM0RPH
MDUWR0
MDUWR1
MDUWR�
MDUWR3
MDUWR�
MDUWR5
MDUWCTRL
Secto� 1
EEC
FC0
FC1
FC�
FARL
FARH
FD0L
FD0H
FD1L
FD1H
FD�L
FD�H
FD3L
FD3H
IFS0
IFS1
PAS0
PAS1
PBS0
PDS0
PCS0
PCS1
SLEDC0
SLEDC1
ADCS
ADCR0
ADCR1
PWRC
PGAC0
PGAC1
PGACS
ADRL
ADRM
ADRH
DSDAH
DSDAL
DSDACC
SGC
SGN
SGDNR
OPAC
SWC0
SWC1
SWC�
DACO
FTRC
PD
PDC
PDPU
: Un�sed� �ead as 00H
: Rese�ved� cannot be changed
Special Purpose Data Memory Structure – BH66F2650
Rev. 1.10
41
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
00H
01H
0�H
03H
0�H
05H
06H
07H
0�H
09H
0AH
0BH
0CH
0DH
0EH
0FH
10H
11H
1�H
13H
1�H
15H
16H
17H
1�H
19H
1AH
1BH
1CH
1DH
1EH
1FH
�0H
�1H
��H
�3H
��H
�5H
�6H
�7H
��H
�9H
�AH
�BH
�CH
�DH
�EH
�FH
30H
31H
3�H
33H
3�H
35H
36H
37H
3�H
39H
3AH
3BH
3CH
3DH
3EH
3FH
Secto� 0
IAR0
MP0
IAR1
MP1L
MP1H
ACC
PCL
TBLP
TBLH
TBHP
STATUS
PBP
IAR�
MP�L
MP�H
RSTFC
SCC
HIRCC
HXTC
LXTC
PA
PAC
PAPU
PAWU
RSTC
LVRC
LVDC
MFI0
MFI1
MFI�
WDTC
INTEG
INTC0
INTC1
INTC�
INTC3
PB
PBC
PBPU
PC
PCC
PCPU
PSCR
TB0C
TB1C
USR
UCR1
UCR�
TXR_RXR
BRG
SIMC0
SIMC1
SIMD
SIMA/SIMC�
SIMTOC
Secto� 1
�0H
�1H
��H
�3H
��H
�5H
�6H
�7H
��H
�9H
�AH
�BH
�CH
�DH
�EH
�FH
50H
51H
5�H
53H
5�H
55H
56H
57H
5�H
59H
5AH
5BH
5CH
5DH
5EH
5FH
60H
61H
6�H
63H
6�H
65H
66H
67H
6�H
69H
6AH
6BH
6CH
6DH
6EH
6FH
70H
71H
7�H
73H
7�H
75H
76H
77H
7�H
79H
7AH
7BH
7CH
7DH
7EH
7FH
PTM1C0
PTM1C1
PTM1DL
PTM1DH
PTM1AL
PTM1AH
PTM1RPL
PTM1RPH
PTM�C0
PTM�C1
PTM�DL
PTM�DH
PTM�AL
PTM�AH
PTM�RPL
PTM�RPH
SPIAC0
SPIAC1
SPIAD
Secto� 0
EEA
EED
STMC0
STMC1
STMDL
STMDH
STMAL
STMAH
STMRP
PTM0C0
PTM0C1
PTM0DL
PTM0DH
PTM0AL
PTM0AH
PTM0RPL
PTM0RPH
MDUWR0
MDUWR1
MDUWR�
MDUWR3
MDUWR�
MDUWR5
MDUWCTRL
Secto� 1
EEC
FC0
FC1
FC�
FARL
FARH
FD0L
FD0H
FD1L
FD1H
FD�L
FD�H
FD3L
FD3H
IFS0
IFS1
PAS0
PAS1
PBS0
PDS0
PCS0
PCS1
SLEDC0
SLEDC1
ADCS
ADCR0
ADCR1
PWRC
PGAC0
PGAC1
PGACS
ADRL
ADRM
ADRH
DSDAH
DSDAL
DSDACC
SGC
SGN
SGDNR
OPAC
SWC0
SWC1
SWC�
DACO
FTRC
PD
PDC
PDPU
: Un�sed� �ead as 00H
: Rese�ved� cannot be changed
Special Purpose Data Memory Structure – BH66F2660
Rev. 1.10
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January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Special Function Register Description
Most of the Special Function Register details will be described in the relevant functional sections,
however several registers require a separate description in this section.
Indirect Addressing Registers – IAR0, IAR1, IAR2
The Indirect Addressing Registers, IAR0, IAR1 and IAR2, although having their locations in normal
RAM register space, do not actually physically exist as normal registers. The method of indirect
addressing for RAM data manipulation uses these Indirect Addressing Registers and Memory
Pointers, in contrast to direct memory addressing, where the actual memory address is specified.
Actions on the IAR0, IAR1 and IAR2 registers will result in no actual read or write operation to
these registers but rather to the memory location specified by their corresponding Memory Pointers,
MP0, MP1L/MP1H or MP2L/MP2H. Acting as a pair, IAR0 and MP0 can together access data only
from Sector 0 while the IAR1 register together with the MP1L/MP1H register pair and IAR2 register
together with the MP2L/MP2H register pair can access data from any Data Memory Sector. As
the Indirect Addressing Registers are not physically implemented, reading the Indirect Addressing
Registers will return a result of “00H” and writing to the registers will result in no operation.
Memory Pointers – MP0, MP1L, MP1H, MP2L, MP2H
Five Memory Pointers, known as MP0, MP1L, MP1H, MP2L, MP2H, are provided. These Memory
Pointers are physically implemented in the Data Memory and can be manipulated in the same way
as normal registers providing a convenient way with which to address and track data. When any
operation to the relevant Indirect Addressing Registers is carried out, the actual address that the
microcontroller is directed to is the address specified by the related Memory Pointer. MP0, together
with Indirect Addressing Register, IAR0, are used to access data from Sector 0, while MP1L/MP1H
together with IAR1 and MP2L/MP2H together with IAR2 are used to access data from all sectors
according to the corresponding MP1H or MP2H register. Direct Addressing can be used in all
sectors using the corresponding instruction which can address all available data memory space.
The following example shows how to clear a section of four Data Memory locations already defined
as locations adres1 to adres4.
Indirect Addressing Program Example 1
data .section ´data´
adres1 db ?
adres2 db ?
adres3 db ?
adres4 db ?
block
db ?
code .section at 0 ´code´
org 00h
start:
mov a, 04h; setup size of block
mov block, a
mov a, offset adres1
; Accumulator loaded with first RAM address
mov mp0, a
; setup memory pointer with first RAM address
loop:
clr IAR0
; clear the data at address defined by MP0
inc mp0; increment memory pointer
sdz block; check if last memory location has been cleared
jmp loop
continue:
Rev. 1.10
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January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Indirect Addressing Program Example 2
data .section ´data´
adres1 db ?
adres2 db ?
adres3 db ?
adres4 db ?
block
db ?
code .section at 0 ´code´
org 00h
start:
mov a, 04h; setup size of block
mov block, a
mov a, 01h; setup the memory sector
mov mp1h, a
mov a, offset adres1
; Accumulator loaded with first RAM address
mov mp1l, a
; setup memory pointer with first RAM address
loop:
clr IAR1
; clear the data at address defined by MP1L
inc mp1l
; increment memory pointer MP1L
sdz block ; check if last memory location has been cleared
jmp loop
continue:
The important point to note here is that in the example shown above, no reference is made to specific
Data Memory addresses.
Direct Addressing Program Example using extended instructions
data .section ´data´
temp db ?
code .section at 0 ´code´
org 00h
start:
lmov a, [m] ; move [m] data to acc
lsub a, [m+1] ; compare [m] and [m+1] data
snz c; [m]>[m+1]?
jmp continue; no
lmov a, [m] ; yes, exchange [m] and [m+1] data
mov temp, a
lmov a, [m+1]
lmov [m], a
mov a, temp
lmov [m+1], a
continue:
Note: here “m” is a data memory address located in any data memory sectors. For example,
m=1F0H, it indicates address 0F0H in Sector 1.
Rev. 1.10
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January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Program Memory Bank Pointer – PBP
For the BH66F2660 device the Program Memory is divided into several banks. Selecting the
required Program Memory area is achieved using the Program Memory Bank Pointer, PBP. The PBP
register should be properly configured before the device executes the “Branch” operation using the
“JMP” or “CALL” instruction. After that a jump to a non-consecutive Program Memory address
which is located in a certain bank selected by the program memory bank pointer bits will occur.
PBP Register – BH66F2660
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
—
—
—
PBP0
R/W
—
—
—
—
—
—
—
R/W
POR
—
—
—
—
—
—
—
0
Bit 7~1
Unimplemented, read as “0”
Bit 0
PBP0: Select Program Memory Banks
0: Bank 0
1: Bank 1
Accumulator – ACC
The Accumulator is central to the operation of any microcontroller and is closely related with
operations carried out by the ALU. The Accumulator is the place where all intermediate results
from the ALU are stored. Without the Accumulator it would be necessary to write the result of
each calculation or logical operation such as addition, subtraction, shift, etc., to the Data Memory
resulting in higher programming and timing overheads. Data transfer operations usually involve
the temporary storage function of the Accumulator; for example, when transferring data between
one user-defined register and another, it is necessary to do this by passing the data through the
Accumulator as no direct transfer between two registers is permitted.
Program Counter Low Register – PCL
To provide additional program control functions, the low byte of the Program Counter is made
accessible to programmers by locating it within the Special Purpose area of the Data Memory. By
manipulating this register, direct jumps to other program locations are easily implemented. Loading
a value directly into this PCL register will cause a jump to the specified Program Memory location,
however, as the register is only 8-bit wide, only jumps within the current Program Memory page are
permitted. When such operations are used, note that a dummy cycle will be inserted.
Look-up Table Registers – TBLP, TBHP, TBLH
These three special function registers are used to control operation of the look-up table which is
stored in the Program Memory. TBLP and TBHP are the table pointers and indicate the location
where the table data is located. Their value must be setup before any table read commands are
executed. Their value can be changed, for example using the “INC” or “DEC” instructions, allowing
for easy table data pointing and reading. TBLH is the location where the high order byte of the table
data is stored after a table read data instruction has been executed. Note that the lower order table
data byte is transferred to a user defined location.
Rev. 1.10
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January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Status Register – STATUS
This 8-bit register contains the SC flag, CZ flag, zero flag (Z), carry flag (C), auxiliary carry flag (AC),
overflow flag (OV), power down flag (PDF), and watchdog time-out flag (TO). These arithmetic/
logical operation and system management flags are used to record the status and operation of the
microcontroller.
With the exception of the TO and PDF flags, bits in the status register can be altered by instructions
like most other registers. Any data written into the status register will not change the TO or PDF flag.
In addition, operations related to the status register may give different results due to the different
instruction operations. The TO flag can be affected only by a system power-up, a WDT time-out or
by executing the “CLR WDT” or “HALT” instruction. The PDF flag is affected only by executing
the “HALT” or “CLR WDT” instruction or during a system power-up.
The Z, OV, AC, C, SC and CZ flags generally reflect the status of the latest operations.
• C is set if an operation results in a carry during an addition operation or if a borrow does not take
place during a subtraction operation; otherwise C is cleared. C is also affected by a rotate through
carry instruction.
• AC is set if an operation results in a carry out of the low nibbles in addition, or no borrow from
the high nibble into the low nibble in subtraction; otherwise AC is cleared.
• Z is set if the result of an arithmetic or logical operation is zero; otherwise Z is cleared.
• OV is set if an operation results in a carry into the highest-order bit but not a carry out of the
highest-order bit, or vice versa; otherwise OV is cleared.
• PDF is cleared by a system power-up or executing the “CLR WDT” instruction. PDF is set by
executing the “HALT” instruction.
• TO is cleared by a system power-up or executing the “CLR WDT” or “HALT” instruction. TO is
set by a WDT time-out.
• CZ is the operational result of different flags for different instructions. Refer to register
definitions for more details.
• SC is the result of the “XOR” operation which is performed by the OV flag and the MSB of the
current instruction operation result.
In addition, on entering an interrupt sequence or executing a subroutine call, the status register will
not be pushed onto the stack automatically. If the contents of the status registers are important and if
the subroutine can corrupt the status register, precautions must be taken to correctly save it.
Rev. 1.10
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January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
STATUS Register
Bit
7
6
5
4
3
2
1
0
Name
SC
CZ
TO
PDF
OV
Z
AC
C
R/W
R/W
R/W
R
R
R/W
R/W
R/W
R/W
POR
x
x
0
0
x
x
x
x
“x” unknown
Rev. 1.10
Bit 7
SC: XOR Operation Result - performed by the OV flag and the MSB of the instruction
operation result.
Bit 6
CZ: Operational Result of Different Flags for Different Instructions.
For SUB/SUBM/LSUB/LSUBM instructions, the CZ flag is equal to the Z flag.
For SBC/SBCM/LSBC/LSBCM instructions, the CZ flag is the “AND” operation
result which is performed by the previous operation CZ flag and current operation zero
flag.
For other instructions, the CZ flag will not be affected.
Bit 5
TO: Watchdog Time-Out Flag
0: After power up or executing the “CLR WDT” or “HALT” instruction
1: A watchdog time-out occurred.
Bit 4
PDF: Power Down Flag
0: After power up or executing the “CLR WDT” instruction
1: By executing the “HALT” instruction
Bit 3
OV: Overflow Flag
0: No overflow
1: An operation results in a carry into the highest-order bit but not a carry out of the
highest-order bit or vice versa.
Bit 2
Z: Zero Flag
0: The result of an arithmetic or logical operation is not zero
1: The result of an arithmetic or logical operation is zero
Bit 1
AC: Auxiliary flag
0: No auxiliary carry
1: An operation results in a carry out of the low nibbles in addition, or no borrow
from the high nibble into the low nibble in subtraction
Bit 0
C: Carry Flag
0: No carry-out
1: An operation results in a carry during an addition operation or if a borrow does
not take place during a subtraction operation
C is also affected by a rotate through carry instruction.
47
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
EEPROM Data Memory
These devices contain an area of internal EEPROM Data Memory. EEPROM, which stands for
Electrically Erasable Programmable Read Only Memory, is by its nature a non-volatile form
of re-programmable memory, with data retention even when its power supply is removed. By
incorporating this kind of data memory, a whole new host of application possibilities are made
available to the designer. The availability of EEPROM storage allows information such as product
identification numbers, calibration values, specific user data, system setup data or other product
information to be stored directly within the product microcontroller. The process of reading and
writing data to the EEPROM memory has been reduced to a very trivial affair.
EEPROM Data Memory Structure
The EEPROM Data Memory capacity is 64×8 ~ 256×8 bits for these devices. Unlike the Program
Memory and RAM Data Memory, the EEPROM Data Memory is not directly mapped into memory
space and is therefore not directly addressable in the same way as the other types of memory. Read
and Write operations to the EEPROM are carried out in single byte operations using an address and
a data register in Sector 0 and a single control register in Sector 1.
EEPROM Registers
Three registers control the overall operation of the internal EEPROM Data Memory. These are the
address register, EEA, the data register, EED and a single control register, EEC. As both the EEA
and EED registers are located in Sector 0, they can be directly accessed in the same was as any
other Special Function Register. The EEC register however, being located in Sector 1, can be read
from or written to indirectly using the MP1L/MP1H or MP2L/MP2H Memory Pointer and Indirect
Addressing Register, IAR1/IAR2. Because the EEC control register is located at address 40H in
Sector 1, the MP1L or MP2L Memory Pointer must first be set to the value 40H and the MP1H or
MP2H Memory Pointer high byte set to the value, 01H, before any operations on the EEC register
are executed.
Register Name
EEA (BH66F2650)
Bit
7
6
5
4
3
2
1
0
—
—
EEA5
EEA4
EEA3
EEA2
EEA1
EEA0
EEA (BH66F2660)
EEA7
EEA6
EEA5
EEA4
EEA3
EEA2
EEA1
EEA0
EED
EED7
EED6
EED5
EED4
EED3
EED2
EED1
EED0
EEC
—
—
—
—
WREN
WR
RDEN
RD
EEPROM Register List
• EEA Register – BH66F2650
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
—
—
EEA5
EEA4
EEA3
EEA2
EEA1
EEA0
R/W
—
—
R/W
R/W
R/W
R/W
R/W
R/W
POR
—
—
0
0
0
0
0
0
Bit 7~6
Unimplemented, read as “0”
Bit 5~0
EEA5~EEA0: Data EEPROM Address
Data EEPROM address bit 5~bit 0
48
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
• EEA Register – BH66F2660
Bit
7
6
5
4
3
2
1
0
Name
EEA7
EEA6
EEA5
EEA4
EEA3
EEA2
EEA1
EEA0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
EEA7~EEA0: Data EEPROM Address
Data EEPROM address bit 7~bit 0
• EED Register
Bit
7
6
5
4
3
2
1
0
Name
EED7
EED6
EED5
EED4
EED3
EED2
EED1
EED0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
EED7~EED0: Data EEPROM Data
Data EEPROM data bit 7~bit 0
• EEC Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
WREN
WR
RDEN
RD
R/W
—
—
—
—
R/W
R/W
R/W
R/W
POR
—
—
—
—
0
0
0
0
Bit 7~4 Unimplemented, read as “0”
Bit 3 WREN: Data EEPROM Write Enable
0: Disable
1: Enable
This is the Data EEPROM Write Enable Bit which must be set high before Data
EEPROM write operations are carried out. Clearing this bit to “0” will inhibit Data
EEPROM write operations.
Bit 2 WR: EEPROM Write Control
0: Write cycle has finished
1: Activate a write cycle
This is the Data EEPROM Write Control Bit and when set high by the application
program will activate a write cycle. This bit will be automatically reset to “0” by the
hardware after the write cycle has finished. Setting this bit high will have no effect if
the WREN has not first been set high.
Bit 1 RDEN: Data EEPROM Read Enable
0: Disable
1: Enable
This is the Data EEPROM Read Enable Bit which must be set high before Data
EEPROM read operations are carried out. Clearing this bit to “0” will inhibit Data
EEPROM read operations.
Bit 0 RD: EEPROM Read Control
0: Read cycle has finished
1: Activate a read cycle
This is the Data EEPROM Read Control Bit and when set high by the application
program will activate a read cycle. This bit will be automatically reset to “0” by the
hardware after the read cycle has finished. Setting this bit high will have no effect if
the RDEN has not first been set high.
Note: The WREN, WR, RDEN and RD cannot be set high at the same time in one instruction. The
WR and RD cannot be set high at the same time.
Rev. 1.10
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January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Reading Data from the EEPROM
To read data from the EEPROM, the read enable bit, RDEN, in the EEC register must first be set
high to enable the read function. The EEPROM address of the data to be read must then be placed
in the EEA register. If the RD bit in the EEC register is now set high, a read cycle will be initiated.
Setting the RD bit high will not initiate a read operation if the RDEN bit has not been set. When
the read cycle terminates, the RD bit will be automatically cleared to “0”, after which the data can
be read from the EED register. The data will remain in the EED register until another read or write
operation is executed. The application program can poll the RD bit to determine when the data is
valid for reading.
Writing Data to the EEPROM
The EEPROM address of the data to be written must first be placed in the EEA register and the data
placed in the EED register. To write data to the EEPROM, the write enable bit, WREN, in the EEC
register must first be set high to enable the write function. After this, the WR bit in the EEC register
must be immediately set high to initiate a write cycle. These two instructions must be executed
consecutively. The global interrupt bit EMI should also first be cleared before implementing any
write operations, and then set again after the write cycle has started. Note that setting the WR bit
high will not initiate a write cycle if the WREN bit has not been set. As the EEPROM write cycle is
controlled using an internal timer whose operation is asynchronous to microcontroller system clock,
a certain time will elapse before the data will have been written into the EEPROM. Detecting when
the write cycle has finished can be implemented either by polling the WR bit in the EEC register or
by using the EEPROM interrupt. When the write cycle terminates, the WR bit will be automatically
cleared to “0” by the microcontroller, informing the user that the data has been written to the
EEPROM. The application program can therefore poll the WR bit to determine when the write cycle
has ended.
Write Protection
Protection against inadvertent write operation is provided in several ways. After the device is
powered-on the Write Enable bit in the control register will be cleared preventing any write
operations. Also at power-on the Memory Pointer high byte register, MP1H or MP2H, will be reset
to “0”, which means that Data Memory Sector 0 will be selected. As the EEPROM control register
is located in Sector 1, this adds a further measure of protection against spurious write operations.
During normal program operation, ensuring that the Write Enable bit in the control register is
cleared will safeguard against incorrect write operations.
EEPROM Interrupt
The EEPROM write interrupt is generated when an EEPROM write cycle has ended. The EEPROM
interrupt must first be enabled by setting the DEE bit in the relevant interrupt register. However as
the EEPROM is contained within a Multi-function Interrupt, the associated multi-function interrupt
enable bit must also be set. When an EEPROM write cycle ends, the DEF request flag and its
associated multi-function interrupt request flag will both be set. If the global, EEPROM and Multifunction interrupts are enabled and the stack is not full, a jump to the associated Multi-function
Interrupt vector will take place. When the interrupt is serviced only the Multi-function interrupt flag
will be automatically reset, the EEPROM interrupt flag must be manually reset by the application
program. More details can be obtained in the Interrupt section.
Rev. 1.10
50
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Programming Considerations
Care must be taken that data is not inadvertently written to the EEPROM. Protection can be
enhanced by ensuring that the Write Enable bit is normally cleared to “0” when not writing. Also
the Memory Pointer high byte register, MP1H or MP2H, could be normally cleared to “0” as this
would inhibit access to Sector 1 where the EEPROM control register exist. Although certainly not
necessary, consideration might be given in the application program to the checking of the validity of
new write data by a simple read back process.
When writing data the WR bit must be set high immediately after the WREN bit has been set high,
to ensure the write cycle executes correctly. The global interrupt bit EMI should also be cleared
before a write cycle is executed and then re-enabled after the write cycle starts. Note that the device
should not enter the IDLE or SLEEP mode until the EEPROM read or write operation is totally
complete. Otherwise, the EEPROM read or write operation will fail.
Programming Examples
• Reading Data from the EEPROM − Polling Method
MOV A, EEPROM_ADRES
; user defined address
MOV EEA, A
MOV A, 40H
; setup memory pointer MP1L
MOV MP1L, A
; MP1L points to EEC register
MOV A, 01H
; setup memory pointer MP1H
MOV MP1H, A
SET IAR1.1
; set RDEN bit, enable read operations
SET IAR1.0
; start Read Cycle - set RD bit
BACK:
SZ IAR1.0
; check for read cycle end
JMP BACK
CLR IAR1
; disable EEPROM read/write
CLR MP1H
MOV A, EED
; move read data to register
MOV READ_DATA, A
• Writing Data to the EEPROM − Polling Method
MOV A, EEPROM_ADRES
; user defined address
MOV EEA, A
MOV A, EEPROM_DATA
; user defined data
MOV EED, A
MOV A, 040H
; setup memory pointer MP1L
MOV MP1L, A
; MP1L points to EEC register
MOV A, 01H
; setup memory pointer MP1H
MOV MP1H, A
CLR EMI
SET IAR1.3
; set WREN bit, enable write operations
SET IAR1.2
; start Write Cycle - set WR bit – executed immediately
; after set WREN bit
SET EMI
BACK:
SZ IAR1.2
; check for write cycle end
JMP BACK
CLR IAR1
; disable EEPROM read/write
CLR MP1H
Rev. 1.10
51
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Oscillators
Various oscillator options offer the user a wide range of functions according to their various
application requirements. The flexible features of the oscillator functions ensure that the best
optimisation can be achieved in terms of speed and power saving. Oscillator selections and operation
are selected through relevant control registers.
Oscillator Overview
In addition to being the source of the main system clock the oscillators also provide clock sources
for the Watchdog Timer and Time Base Interrupts. External oscillators requiring some external
components as well as fully integrated internal oscillators, requiring no external components, are
provided to form a wide range of both fast and slow system oscillators. All oscillator options are
selected through the registers. The higher frequency oscillators provide higher performance but
carry with it the disadvantage of higher power requirements, while the opposite is of course true for
the lower frequency oscillators. With the capability of dynamically switching between fast and slow
system clock, these devices have the flexibility to optimize the performance/power ratio, a feature
especially important in power sensitive portable applications.
Name
Freq.
Pins
External Crystal
Type
HXT
4, 8, 12, 16MHz
OSC1/OSC2
Internal High Speed RC
HIRC
4, 8, 12MHz
—
External Low Speed Crystal
LXT
32.768kHz
XT1/XT2
Internal Low Speed RC
LIRC
32kHz
—
System Clock Configurations
There are four methods of generating the system clock, two high speed oscillators and two low speed
oscillators. The high speed oscillators are the external crystal/ceramic oscillator and the internal
4/8/12MHz RC oscillator. The two low speed oscillators are the internal 32kHz RC oscillator and
the external 32.768kHz crystal oscillator. Selecting whether the low or high speed oscillator is used
as the system oscillator is implemented using the CKS2~CKS0 bits in the SCC register and as the
system clock can be dynamically selected.
The actual source clock used for the low speed oscillators is chosen via the FSS bit in the SCC
register while for the high speed oscillator the source clock is selected by the FHS bit in the SCC
register. The frequency of the slow speed or high speed system clock is determined using the
CKS2~CKS0 bits in the SCC register. Note that two oscillator selections must be made namely one
high speed and one low speed system oscillators. It is not possible to choose a no-oscillator selection
for either the high or low speed oscillator.
Rev. 1.10
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January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
High Speed
Oscillato�s
fH
FHS
fH/�
fH/�
HXTEN
HIRCEN
HXT
fH/�
IDLE0
SLEEP
HIRC
P�escale�
fH/16
fSYS
fH/3�
fH/6�
FSS
Low Speed
Oscillato�s
LXTEN
LXT
LIRC
fLIRC
CKS�~CKS0
fSUB
IDLE�
SLEEP
fSUB
fLIRC
System Clock Configurations
External High Speed Crystal Oscillator − HXT
The simple connection of a crystal across OSC1 and OSC2 will create the necessary phase shift and
feedback for oscillation. However, for some crystals and most resonator types, to ensure oscillation
and accurate frequency generation, it is necessary to add two small value external capacitors, C1 and
C2. The exact values of C1 and C2 should be selected in consultation with the crystal or resonator
manufacturer’s specification.
For oscillator stability and to minimise the effects of noise and crosstalk, it is important to ensure
that the crystal and any associated resistors and capacitors along with interconnecting lines are all
located as close to the MCU as possible.
C1
Internal
Oscillator
Circuit
OSC1
RP
RF
To inte�nal
ci�c�its
OSC�
C�
Note: 1. RP is no�mall� not �eq�i�ed. C1 and C� a�e �eq�i�ed.
�. Altho�gh not shown OSC1/OSC� pins have a pa�asitic
capacitance of a�o�nd 7pF.
Crystal/Resonator Oscillator – HXT
HXT Oscillator C1 and C2 Values
Crystal Frequency
C1
C2
12MHz
0pF
0pF
8MHz
0pF
0pF
4MHz
0pF
0pF
1MHz
100pF
100pF
Note: C1 and C2 values are for guidance only.
Crystal Recommended Capacitor Values
Rev. 1.10
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Body Fat Measurment Flash MCU
Internal RC Oscillator − HIRC
The internal RC oscillator is a fully integrated system oscillator requiring no external components.
The internal RC oscillator has a fixed frequency of 4/8/12MHz. Device trimming during the
manufacturing process and the inclusion of internal frequency compensation circuits are used to
ensure that the influence of the power supply voltage, temperature and process variations on the
oscillation frequency are minimised. Note that if this internal system clock option is selected, as it
requires no external pins for its operation, I/O pins are free for use as normal I/O pins.
External 32.768kHz Crystal Oscillator − LXT
The external 32.768kHz crystal system oscillator is one of the low frequency oscillator choices, which
is selected via a software control bit, FSS. This clock source has a fixed frequency of 32.768kHz and
requires a 32.768kHz crystal to be connected between pins XT1 and XT2. The external resistor and
capacitor components connected to the 32.768kHz crystal are necessary to provide oscillation. For
applications where precise frequencies are essential, these components may be required to provide
frequency compensation due to different crystal manufacturing tolerances. After the LXT oscillator
is enabled by setting the LXTEN bit to “1”, there is a time delay associated with the LXT oscillator
waiting for it to start-up.
When the microcontroller enters the SLEEP or IDLE Mode, the system clock is switched off to stop
microcontroller activity and to conserve power. However, in many microcontroller applications
it may be necessary to keep the internal timers operational even when the microcontroller is in
the SLEEP or IDLE Mode. To do this, another clock, independent of the system clock, must be
provided.
However, for some crystals, to ensure oscillation and accurate frequency generation, it is necessary
to add two small value external capacitors, C1 and C2. The exact values of C1 and C2 should be
selected in consultation with the crystal or resonator manufacturer’s specification. The external
parallel feedback resistor, RP, and the pull high resistor, RU, are required.
The pin-shared software control bits determine if the XT1/XT2 pins are used for the LXT oscillator
or as I/O or other pin-shared functional pins.
• If the LXT oscillator is not used for any clock source, the XT1/XT2 pins can be used as normal
I/O or other pin-shared functional pins.
• If the LXT oscillator is used for any clock source, the 32.768kHz crystal should be connected to
the XT1/XT2 pins.
For oscillator stability and to minimise the effects of noise and crosstalk, it is important to ensure
that the crystal and any associated resistors and capacitors along with interconnecting lines are all
located as close to the MCU as possible.
VDD
C1
3�.76�
kHz
XT1
RP
Inte�nal RC
Oscillato�
RU
XT2
C�
Internal
Oscillator
Circuit
To inte�nal
ci�c�its
Note: 1. RP� RU� C1 and C� a�e �eq�i�ed.
2. Although not shown XT1/XT� pins have a pa�asitic
capacitance of a�o�nd 7pF.
External LXT Oscillator
Rev. 1.10
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Body Fat Measurment Flash MCU
LXT Oscillator C1 and C2 Values
Crystal Frequency
C1
C2
32.768kHz
10pF
10pF
Note: 1. C1 and C2 values are for guidance only.
2. RP=5M~10MΩ is recommended.
3. RU=10MΩ is recommended.
32.768kHz Crystal Recommended Capacitor Values
Internal 32kHz Oscillator − LIRC
The internal 32kHz system oscillator is one of the low frequency oscillator choices, which is
selected via a software control bit, FSS. It is a fully integrated RC oscillator with a typical frequency
of 32kHz at 5V, requiring no external components for its implementation. Device trimming during
the manufacturing process and the inclusion of internal frequency compensation circuits are used
to ensure that the influence of the power supply voltage, temperature and process variations on the
oscillation frequency are minimised.
Operating Modes and System Clocks
Present day applications require that their microcontrollers have high performance but often still
demand that they consume as little power as possible, conflicting requirements that are especially
true in battery powered portable applications. The fast clocks required for high performance will
by their nature increase current consumption and of course vice versa, lower speed clocks reduce
current consumption. As both high and low speed clock sources are provided the means to switch
between them dynamically, the user can optimise the operation of their microcontroller to achieve
the best performance/power ratio.
System Clocks
These devices have different clock sources for both the CPU and peripheral function operation. By
providing the user with a wide range of clock selections using register programming, a clock system
can be configured to obtain maximum application performance.
The main system clock, can come from either a high frequency, fH, or low frequency, fSUB, source,
and is selected using the CKS2~CKS0 bits in the SCC register. The high speed system clock is
sourced from an HXT or HIRC oscillator. The low speed system clock source can be sourced
from the internal clock fSUB. If fSUB is selected then it can be sourced by either the LXT or LIRC
oscillators, selected via configuring the FSS bit in the SCC register. The other choice, which is a
divided version of the high speed system oscillator has a range of fH/2~fH/64.
Rev. 1.10
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BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
fH
FHS
High Speed
Oscillato�s
fH/�
fH/�
HXT
HXTEN
HIRCEN
fH/�
IDLE0
SLEEP
HIRC
fSYS
fH/3�
fH/6�
LXT
LIRC
fH/16
FSS
Low Speed
Oscillato�s
LXTEN
P�escale�
fLIRC
CKS�~CKS0
fSUB
IDLE�
SLEEP
fSUB
fSYS
fLIRC
fPSC
fSYS/�
WDT
P�escale�
Time Bases
fSUB
fLIRC
LVR
TB1[�:0] TB0[�:0]
CLKSEL[1:0]
Device Clock Configurations
Note: When the system clock source fSYS is switched to fSUB from fH, the high speed oscillator can be
stopped to conserve the power or continue to oscillate to provide the clock source, fH~fH/64,
for peripheral circuit to use, which is determined by configuring the corresponding high speed
oscillator enable control bit.
System Operation Modes
There are six different modes of operation for the microcontroller, each one with its own
special characteristics and which can be chosen according to the specific performance and
power requirements of the application. There are two modes allowing normal operation of the
microcontroller, the FAST Mode and SLOW Mode. The remaining four modes, the SLEEP, IDLE0,
IDLE1 and IDLE2 Mode are used when the microcontroller CPU is switched off to conserve power.
Operation
Mode
FAST
CPU
On
Register Setting
FHIDEN
FSIDEN
CKS2~CKS0
x
x
000~110
SLOW
On
x
x
IDLE0
Off
0
1
IDLE1
Off
1
1
IDLE2
Off
1
0
SLEEP
Off
0
0
111
fSYS
fH
fH~fH/64
On
fSUB
000~110
Off
111
On
xxx
On
000~110
On
111
Off
xxx
Off
fSUB
fLIRC
On
On
On
On
Off
On
On
On
On
On
On
Off
On
Off
Off
On/Off
(1)
On/Off
(2)
“x” don’t care
Note: 1. The fH clock will be switched on or off by configuring the corresponding oscillator enable
bit in the SLOW mode.
2. The fLIRC clock can be switched on or off which is controlled by the WDT function being
enabled or disabled.
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FAST Mode
As the name suggests this is one of the main operating modes where the microcontroller has all of
its functions operational and where the system clock is provided by one of the high speed oscillators.
This mode operates allowing the microcontroller to operate normally with a clock source will come
from one of the high speed oscillators, either the HXT or HIRC oscillators. The high speed oscillator
will however first be divided by a ratio ranging from 1 to 64, the actual ratio being selected by
the CKS2~CKS0 bits in the SCC register. Although a high speed oscillator is used, running the
microcontroller at a divided clock ratio reduces the operating current.
SLOW Mode
This is also a mode where the microcontroller operates normally although now with a slower speed
clock source. The clock source used will be from fSUB. The fSUB clock is derived from either the
LIRC or LXT oscillator.
SLEEP Mode
The SLEEP Mode is entered when an HALT instruction is executed and when the FHIDEN and
FSIDEN bit are low. In the SLEEP mode the CPU will be stopped. However the fLIRC clock can still
continue to operate if the WDT function is enabled.
IDLE0 Mode
The IDLE0 Mode is entered when an HALT instruction is executed and when the FHIDEN bit in
the SCC register is low and the FSIDEN bit in the SCC register is high. In the IDLE0 Mode the
CPU will be switched off but the low speed oscillator will be turned on to drive some peripheral
functions.
IDLE1 Mode
The IDLE1 Mode is entered when an HALT instruction is executed and when the FHIDEN bit in the
SCC register is high and the FSIDEN bit in the SCC register is high. In the IDLE1 Mode the CPU
will be switched off but both the high and low speed oscillators will be turned on to provide a clock
source to keep some peripheral functions operational.
IDLE2 Mode
The IDLE2 Mode is entered when an HALT instruction is executed and when the FHIDEN bit in the
SCC register is high and the FSIDEN bit in the SCC register is low. In the IDLE2 Mode the CPU
will be switched off but the high speed oscillator will be turned on to provide a clock source to keep
some peripheral functions operational.
Control Registers
The registers, SCC, HIRCC, HXTC and LXTC, are used for the overall control of the system clock
within these devices.
Bit
Register
Name
7
6
5
4
3
2
1
0
SCC
CKS2
CKS1
CKS0
—
FHS
FSS
FHIDEN
FSIDEN
HIRCC
—
—
—
—
HIRC1
HIRC0
HIRCF
HIRCEN
HXTC
—
—
—
—
—
HXTM
HXTF
HXTEN
LXTC
—
—
—
—
—
—
LXTF
LXTEN
System Operating Mode Control Registers List
Rev. 1.10
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SCC Register
Bit
7
6
5
4
3
2
1
0
Name
CKS2
CKS1
CKS0
—
FHS
FSS
FHIDEN
FSIDEN
R/W
R/W
R/W
R/W
—
R/W
R/W
R/W
R/W
POR
0
0
0
—
0
0
0
0
Bit 7~5
Rev. 1.10
CKS2~CKS0: System Clock Selection
000: fH
001: fH/2
010: fH/4
011: fH/8
100: fH/16
101: fH/32
110: fH/64
111: fSUB
These three bits are used to select which clock is used as the system clock source. In
addition to the system clock source directly derived from fH or fSUB, a divided version
of the high speed system oscillator can also be chosen as the system clock source.
Bit 4
Unimplemented, read as “0”
Bit 3
FHS: High Frequency Clock Selection
0: HIRC
1: HXT
Bit 2
FSS: Low Frequency Clock Selection
0: LIRC
1: LXT
Bit 1
FHIDEN: High Frequency Oscillator Control when CPU is Switched Off
0: Disable
1: Enable
This bit is used to control whether the high speed oscillator is activated or stopped
when the CPU is switched off by executing an “HALT” instruction.
Bit 0
FSIDEN: Low Frequency Oscillator Control when CPU is Switched Off
0: Disable
1: Enable
This bit is used to control whether the low speed oscillator is activated or stopped
when the CPU is switched off by executing an “HALT” instruction. The LIRC
oscillator is controlled by this bit together with the WDT function enable control when
the LIRC is selected to be the low speed oscillator clock source or the WDT function
is enabled respectively. If this bit is cleared to “0” but the WDT function is enabled,
the LIRC oscillator will also be enabled.
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HIRCC Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
HIRC1
HIRC0
HIRCF
HIRCEN
R/W
—
—
—
—
R/W
R/W
R
R/W
POR
—
—
—
—
0
0
0
1
Bit 7~4
Unimplemented, read as “0”
Bit 3~2
HIRC1~HIRC0: HIRC Frequency Selection
00: 4MHz
01: 8MHz
10: 12MHz
11: 4MHz
When the HIRC oscillator is enabled or the HIRC frequency selection is changed
by application program, the clock frequency will automatically be changed after the
HIRCF flag is set to “1”.
Bit 1
HIRCF: HIRC Oscillator Stable Flag
0: HIRC unstable
1: HIRC stable
This bit is used to indicate whether the HIRC oscillator is stable or not. When the
HIRCEN bit is set to “1” to enable the HIRC oscillator or the HIRC frequency
selection is changed by application program, the HIRCF bit will first be cleared to “0”
and then set to “1” after the HIRC oscillator is stable.
Bit 0
HIRCEN: HIRC Oscillator Enable Control
0: Disable
1: Enable
HXTC Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
—
HXTM
HXTF
HXTEN
R/W
—
—
—
—
—
R/W
R
R/W
POR
—
—
—
—
—
0
0
0
Bit 7~3
Unimplemented, read as “0”
Bit 2
HXTM: HXT Mode Selection
0: HXT frequency ≤ 10MHz
1: HXT frequency >10MHz
This bit is used to select the HXT oscillator operating mode. Note that this bit must be
properly configured before the HXT is enabled. When the HXTEN bit is set to “1” to
enable the HXT oscillator, it is invalid to change the value of this bit.
Bit 1
HXTF: HXT Oscillator Stable Flag
0: HXT unstable
1: HXT stable
This bit is used to indicate whether the HXT oscillator is stable or not. When the
HXTEN bit is set to “1” to enable the HXT oscillator, the HXTF bit will first be
cleared to “0” and then set to “1” after the HXT oscillator is stable.
Bit 0
HXTEN: HXT Oscillator Enable Control
0: Disable
1: Enable
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LXTC Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
—
—
LXTF
LXTEN
R/W
—
—
—
—
—
—
R
R/W
POR
—
—
—
—
—
—
0
0
Bit 7~2
Unimplemented, read as “0”
Bit 1
LXTF: LXT Oscillator Stable Flag
0: LXT unstable
1: LXT stable
This bit is used to indicate whether the LXT oscillator is stable or not. When the
LXTEN bit is set to “1” to enable the LXT oscillator, the LXTF bit will first be cleared
to “0” and then set to “1” after the LXT oscillator is stable.
Bit 0
LXTEN: LXT Oscillator Enable Control
0: Disable
1: Enable
Operating Mode Switching
The device can switch between operating modes dynamically allowing the user to select the best
performance/power ratio for the present task in hand. In this way microcontroller operations that
do not require high performance can be executed using slower clocks thus requiring less operating
current and prolonging battery life in portable applications.
In simple terms, Mode Switching between the FAST Mode and SLOW Mode is executed using the
CKS2~CKS0 bits in the SCC register while Mode Switching from the FAST/SLOW Modes to the
SLEEP/IDLE Modes is executed via the HALT instruction. When an HALT instruction is executed,
whether the device enters the IDLE Mode or the SLEEP Mode is determined by the condition of the
FHIDEN and FSIDEN bits in the SCC register.
FAST
fSYS=fH~fH/6�
fH on
CPU ��n
fSYS on
fSUB on
SLOW
fSYS=fSUB
fSUB on
CPU ��n
fSYS on
fH on/off
SLEEP
HALT inst��ction exec�ted
CPU stop
FHIDEN=0
FSIDEN=0
fH off
fSUB off
IDLE0
HALT inst��ction exec�ted
CPU stop
FHIDEN=0
FSIDEN=1
fH off
fSUB on
IDLE2
HALT inst��ction exec�ted
CPU stop
FHIDEN=1
FSIDEN=0
fH on
fSUB off
Rev. 1.10
60
IDLE1
HALT inst��ction exec�ted
CPU stop
FHIDEN=1
FSIDEN=1
fH on
fSUB on
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
FAST Mode to SLOW Mode Switching
When running in the FAST Mode, which uses the high speed system oscillator, and therefore
consumes more power, the system clock can switch to run in the SLOW Mode by set the
CKS2~CKS0 bits to “111” in the SCC register. This will then use the low speed system oscillator
which will consume less power. Users may decide to do this for certain operations which do not
require high performance and can subsequently reduce power consumption.
The SLOW Mode is sourced from the LXT or LIRC oscillator determined by the FSS bit in the SCC
register and therefore requires this oscillator to be stable before full mode switching occurs.
FAST Mode
CKS�~CKS0 = 111
SLOW Mode
FHIDEN=0� FSIDEN=0
HALT inst��ction is exec�ted
SLEEP Mode
FHIDEN=0� FSIDEN=1
HALT inst��ction is exec�ted
IDLE0 Mode
FHIDEN=1� FSIDEN=1
HALT inst��ction is exec�ted
IDLE1 Mode
FHIDEN=1� FSIDEN=0
HALT inst��ction is exec�ted
IDLE2 Mode
Rev. 1.10
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SLOW Mode to FAST Mode Switching
In SLOW mode the system clock is derived from fSUB. When system clock is switched back to the
FAST mode from fSUB, the CKS2 ~ CKS0 bits should be set to “000” ~ “110” and then the system
clock will respectively be switched to fH ~ fH/64.
However, if fH is not used in SLOW mode and thus switched off, it will take some time to reoscillate and stabilise when switching to the FAST mode from the SLOW Mode. This is monitored
using the HXTF bit in the HXTC register or the HIRCF bit in the HIRCC register. The time duration
required for the high speed system oscillator stabilization is specified in the the System Start Up Time
Characteristics.
SLOW Mode
CKS�~CKS0 = 000~110
FAST Mode
FHIDEN=0� FSIDEN=0
HALT inst��ction is exec�ted
SLEEP Mode
FHIDEN=0� FSIDEN=1
HALT inst��ction is exec�ted
IDLE0 Mode
FHIDEN=1� FSIDEN=1
HALT inst��ction is exec�ted
IDLE1 Mode
FHIDEN=1� FSIDEN=0
HALT inst��ction is exec�ted
IDLE2 Mode
Entering the SLEEP Mode
There is only one way for these devices to enter the SLEEP Mode and that is to execute the “HALT”
instruction in the application program with both the FHIDEN and FSIDEN bits in the SCC register
equal to “0”. In this mode all the clocks and functions will be switched off except the WDT function.
When this instruction is executed under the conditions described above, the following will occur:
• The system clock will be stopped and the application program will stop at the “HALT”
instruction.
• The Data Memory contents and registers will maintain their present condition.
• The I/O ports will maintain their present conditions.
• In the status register, the Power Down flag PDF will be set, and WDT timeout flag TO will be
cleared.
• The WDT will be cleared and resume counting if the WDT function is enabled. If the WDT
function is disabled, the WDT will be cleared and stopped.
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Body Fat Measurment Flash MCU
Entering the IDLE0 Mode
There is only one way for these devices to enter the IDLE0 Mode and that is to execute the “HALT”
instruction in the application program with the FHIDEN bit in the SCC register equal to “0” and the
FSIDEN bit in the SCC register equal to “1”. When this instruction is executed under the conditions
described above, the following will occur:
• The fH clock will be stopped and the application program will stop at the “HALT” instruction, but
the fSUB clock will be on.
• The Data Memory contents and registers will maintain their present condition.
• The I/O ports will maintain their present conditions.
• In the status register, the Power Down flag PDF will be set, and WDT timeout flag TO will be
cleared.
• The WDT will be cleared and resume counting if the WDT function is enabled. If the WDT
function is disabled, the WDT will be cleared and stopped.
Entering the IDLE1 Mode
There is only one way for these devices to enter the IDLE0 Mode and that is to execute the “HALT”
instruction in the application program with both the FHIDEN and FSIDEN bits in the SCC register
equal to “1”. When this instruction is executed under the conditions described above, the following
will occur:
• The fH and fSUB clocks will be on but the application program will stop at the “HALT” instruction.
• The Data Memory contents and registers will maintain their present condition.
• The I/O ports will maintain their present conditions.
• In the status register, the Power Down flag PDF will be set, and WDT timeout flag TO will be
cleared.
• The WDT will be cleared and resume counting if the WDT function is enabled. If the WDT
function is disabled, the WDT will be cleared and stopped.
Entering the IDLE2 Mode
There is only one way for these devices to enter the IDLE2 Mode and that is to execute the “HALT”
instruction in the application program with the FHIDEN bit in the SCC register equal to “1” and the
FSIDEN bit in the SCC register equal to “0”. When this instruction is executed under the conditions
described above, the following will occur:
• The fH clock will be on but the fSUB clock will be off and the application program will stop at the
“HALT” instruction.
• The Data Memory contents and registers will maintain their present condition.
• The I/O ports will maintain their present conditions.
• In the status register, the Power Down flag PDF will be set, and WDT timeout flag TO will be
cleared.
• The WDT will be cleared and resume counting if the WDT function is enabled. If the WDT
function is disabled, the WDT will be cleared and stopped.
Rev. 1.10
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Body Fat Measurment Flash MCU
Standby Current Considerations
As the main reason for entering the SLEEP or IDLE Mode is to keep the current consumption of
these devices to as low a value as possible, perhaps only in the order of several micro-amps except
in the IDLE1 and IDLE2 Mode, there are other considerations which must also be taken into account
by the circuit designer if the power consumption is to be minimised. Special attention must be made
to the I/O pins on these devices. All high-impedance input pins must be connected to either a fixed
high or low level as any floating input pins could create internal oscillations and result in increased
current consumption. This also applies to the devices which have different package types, as there
may be unbonbed pins. These must either be setup as outputs or if setup as inputs must have pullhigh resistors connected.
Care must also be taken with the loads, which are connected to I/O pins, which are setup as outputs.
These should be placed in a condition in which minimum current is drawn or connected only to
external circuits that do not draw current, such as other CMOS inputs. Also note that additional
standby current will also be required if the LXT or LIRC oscillator has enabled.
In the IDLE1 and IDLE 2 Mode the high speed oscillator is on, if the peripheral function clock
source is derived from the high speed oscillator, the additional standby current will also be perhaps
in the order of several hundred micro-amps.
Wake-up
To minimise power consumption the device can enter the SLEEP or any IDLE Mode, where the
CPU will be switched off. However, when the device is woken up again, it will take a considerable
time for the original system oscillator to restart, stablise and allow normal operation to resume.
After the system enters the SLEEP or IDLE Mode, it can be woken up from one of various sources
listed as follows:
• An external falling edge on Port A
• A system interrupt
• A WDT overflow
When the device executes the “HALT” instruction, the PDF flag will be set to “1”. The PDF flag will
be cleared to “0 if the device experiences a system power-up or executes the clear Watchdog Timer
instruction. If the system is woken up by a WDT overflow, a Watchdog Timer reset will be initiated
and the TO flag will be set to “1”. The TO flag is set if a WDT time-out occurs and causes a wakeup that only resets the Program Counter and Stack Pointer, other flags remain in their original status.
Each pin on Port A can be setup using the PAWU register to permit a negative transition on the pin
to wake up the system. When a Port A pin wake-up occurs, the program will resume execution at
the instruction following the “HALT” instruction. If the system is woken up by an interrupt, then
two possible situations may occur. The first is where the related interrupt is disabled or the interrupt
is enabled but the stack is full, in which case the program will resume execution at the instruction
following the “HALT” instruction. In this situation, the interrupt which woke up the device will not
be immediately serviced, but will rather be serviced later when the related interrupt is finally enabled
or when a stack level becomes free. The other situation is where the related interrupt is enabled and
the stack is not full, in which case the regular interrupt response takes place. If an interrupt request
flag is set high before entering the SLEEP or IDLE Mode, the wake-up function of the related
interrupt will be disabled.
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Watchdog Timer
The Watchdog Timer is provided to prevent program malfunctions or sequences from jumping to
unknown locations, due to certain uncontrollable external events such as electrical noise.
Watchdog Timer Clock Source
The Watchdog Timer clock source is provided by the internal clock, fLIRC, which is in turn supplied
by the LIRC oscillator. The Watchdog Timer source clock is then subdivided by a ratio of 28 to 218 to
give longer timeouts, the actual value being chosen using the WS2~WS0 bits in the WDTC register.
The LIRC internal oscillator has an approximate frequency of 32kHz and this specified internal
clock period can vary with VDD, temperature and process variations.
Watchdog Timer Control Register
A single register, WDTC, controls the required timeout period as well as the enable/disable and reset
MCU operation.
WDTC Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
WE4
WE3
WE2
WE1
WE0
WS2
WS1
WS0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
1
0
1
0
0
1
1
Bit 7~3
WE4~WE0: WDT Function Software Control
10101: Disable
01010: Enable
Others: Reset MCU
When these bits are changed by the environmental noise or software setting to reset
the microcontroller, the reset operation will be activated after a delay time, tSRESET, and
the WRF bit in the RSTFC register will be set high.
Bit 2~0
WS2~WS0: WDT Time-out Period Selection
000: 28/fLIRC
001: 210/fLIRC
010: 212/fLIRC
011: 214/fLIRC
100: 215/fLIRC
101: 216/fLIRC
110: 217/fLIRC
111: 218/fLIRC
These three bits determine the division ratio of the watchdog timer source clock,
which in turn determines the time-out period.
65
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
RSTFC Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
RSTF
LVRF
LRF
WRF
R/W
—
—
—
—
R/W
R/W
R/W
R/W
POR
—
—
—
—
0
x
0
0
“x” unknown
Bit 7~4
Unimplemented, read as “0”
Bit 3
RSTF: Reset Control Register Software Reset Flag
0: Not occurred
1: Occurred
This bit is set to “1” by the RSTC control register software reset and cleared by the
application program. Note that this bit can only be cleared to “0” by the application
program.
Bit 2
LVRF: LVR Function Reset Flag
Described elsewhere.
Bit 1
LRF: LVR Control Register Software Reset Flag
Described elsewhere.
Bit 0
WRF: WDT Control Register Software Reset Flag
0: Not occur
1: Occurred
This bit is set high by the WDT Control register software reset and cleared by the
application program. Note that this bit can only be cleared to zero by the application
program.
Watchdog Timer Operation
The Watchdog Timer operates by providing a device reset when its timer overflows. This means
that in the application program and during normal operation the user has to strategically clear the
Watchdog Timer before it overflows to prevent the Watchdog Timer from executing a reset. This is
done using the clear watchdog instructions. If the program malfunctions for whatever reason, jumps
to an unknown location, or enters an endless loop, these clear instructions will not be executed in the
correct manner, in which case the Watchdog Timer will overflow and reset the device. There are five
bits, WE4~WE0, in the WDTC register to offer the enable/disable control and reset control of the
Watchdog Timer. The WDT function will be disabled when the WE4~WE0 bits are set to a value of
10101B while the WDT function will be enabled if the WE4~WE0 bits are equal to 01010B. If the
WE4~WE0 bits are set to any other values, other than 01010B and 10101B, it will reset the device
after a delay time, tSRESET. After power on these bits will have a value of 01010B.
WE4~WE0 Bits
WDT Function
10101B
Disable
01010B
Enable
Any other values
Reset MCU
Watchdog Timer Enable/Disable Control
Under normal program operation, a Watchdog Timer time-out will initialise a device reset and set
the status bit TO. However, if the system is in the SLEEP or IDLE Mode, when a Watchdog Timer
time-out occurs, the TO bit in the status register will be set and only the Program Counter and Stack
Pointer will be reset. Three methods can be adopted to clear the contents of the Watchdog Timer.
The first is a WDT reset, which means a certain value except 01010B and 10101B written into the
WE4~WE0 bit filed, the second is using the Watchdog Timer software clear instruction and the third
is via a HALT instruction.
Rev. 1.10
66
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
There is only one method of using software instruction to clear the Watchdog Timer. That is to use
the single “CLR WDT” instruction to clear the WDT.
The maximum time out period is when the 218 division ratio is selected. As an example, with a
32kHz LIRC oscillator as its source clock, this will give a maximum watchdog period of around 8
seconds for the 218 division ratio, and a minimum timeout of 8ms for the 28 division ration.
WDTC Registe�
WE�~WE0 bits
Reset MCU
CLR
“CLR WDT” Inst��ction
“HALT” Inst��ction
LIRC
fLIRC
�-stage Divide�
fLIRC/��
WDT P�escale�
WS�~WS0
8-to-1 MUX
WDT Time-o�t
Watchdog Timer
Reset and Initialisation
A reset function is a fundamental part of any microcontroller ensuring that the device can be set to
some predetermined condition irrespective of outside parameters. The most important reset condition
is after power is first applied to the microcontroller. In this case, internal circuitry will ensure that
the microcontroller, after a short delay, will be in a well-defined state and ready to execute the first
program instruction. After this power-on reset, certain important internal registers will be set to
defined states before the program commences. One of these registers is the Program Counter, which
will be reset to “0” forcing the microcontroller to begin program execution from the lowest Program
Memory address.
Another type of reset is when the Watchdog Timer overflows and resets. All types of reset operations
result in different register conditions being setup. Another reset exists in the form of a Low Voltage
Reset, LVR, where a full reset, is implemented in situations where the power supply voltage falls
below a certain threshold.
Reset Functions
There are several ways in which a microcontroller reset can occur, through events occurring
internally.
Power-on Reset
The most fundamental and unavoidable reset is the one that occurs after power is first applied to
the microcontroller. As well as ensuring that the Program Memory begins execution from the first
memory address, a power-on reset also ensures that certain other registers are preset to known
conditions. All the I/O port and port control registers will power up in a high condition ensuring that
all I/O ports will be first set to inputs.
VDD
Powe�-on Reset
tRSTD
SST Time-o�t
Power-On Reset Timing Chart
Rev. 1.10
67
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Internal Reset Control
There is an internal reset control register, RSTC, which is used to provide a reset when the device
operates abnormally due to the environmental noise interference. If the content of the RSTC register
is set to any value other than 01010101B or 10101010B, it will reset the device after a delay time,
tSRESET. After power on the register will have a value of 01010101B.
RSTC7~RSTC0 Bits
Reset Function
01010101B
No operation
10101010B
No operation
Any other value
Reset MCU
Internal Reset Function Control
• RSTC Register
Bit
7
6
5
4
3
2
1
0
Name
RSTC7
RSTC6
RSTC5
RSTC4
RSTC3
RSTC2
RSTC1
RSTC0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
1
0
1
0
1
0
1
Bit 7~0
RSTC7~RSTC0: Reset Function Control
01010101: No operation
10101010: No operation
Other values: Reset MCU
If these bits are changed due to adverse environmental conditions, the microcontroller
will be reset. The reset operation will be activated after a delay time, tSRESET and the
RSTF bit in the RSTFC register will be set to “1”.
• RSTFC Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
RSTF
LVRF
LRF
WRF
R/W
—
—
—
—
R/W
R/W
R/W
R/W
POR
—
—
—
—
0
x
0
0
“x” unknown
Rev. 1.10
Bit 7~4
Unimplemented, read as “0”
Bit 3
RSTF: Reset Control Register Software Reset Flag
0: Not occurred
1: Occurred
This bit is set to “1” by the RSTC control register software reset and cleared by the
application program. Note that this bit can only be cleared to “0” by the application
program.
Bit 2
LVRF: LVR Function Reset Flag
Described elsewhere.
Bit 1
LRF: LVR Control Register Software Reset Flag
Described elsewhere.
Bit 0
WRF: WDT Control Register Software Reset Flag
Described elsewhere.
68
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
In Application Programing Reset
The devices contain the IAP function. So there exists an IAP reset, which is caused by writing data
55H to FC1 register.
Low Voltage Reset – LVR
The microcontrollers contain a low voltage reset circuit in order to monitor the supply voltage of the
device. The LVR function is always enabled with a specific LVR voltage VLVR. If the supply voltage
of the device drops to within a range of 0.9V~VLVR such as might occur when changing the battery,
the LVR will automatically reset the device internally and the LVRF bit in the RSTFC register will
also be set high. For a valid LVR signal, a low supply voltage, i.e., a voltage in the range between
0.9V~VLVR must exist for a time greater than that specified by tLVR in the LVD/LVR characteristics. If
the low supply voltage state does not exceed this value, the LVR will ignore the low supply voltage
and will not perform a reset function. The actual VLVR value can be selected by the LVS7~LVS0
bits in the LVRC register. If the LVS7~LVS0 bits are changed to some certain values by the
environmental noise or software setting, the LVR will reset the device after a delay time, tSRESET.
When this happens, the LRF bit in the RSTFC register will be set high. After power on the register
will have the value of 01010101B. Note that the LVR function will be automatically disabled when
the device enters the power down mode.
LVR
tRSTD + tSST
Inte�nal Reset
Low Voltage Reset Timing Chart
• LVRC Register
Bit
7
6
5
4
3
2
1
0
Name
LVS7
LVS6
LVS5
LVS4
LVS3
LVS2
LVS1
LVS0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
1
0
1
0
1
0
1
Bit 7~0
Rev. 1.10
LVS7~LVS0: LVR Voltage Select
01010101: 2.1V
00110011: 2.55V
10011001: 3.15V
10101010: 3.8V
Other values: MCU reset (register is reset to POR value)
When an actual low voltage condition occurs, as specified by one of the four defined
LVR voltage values above, an MCU reset will be generated. The reset operation
will be activated after the low voltage condition keeps more than a tLVR time. In this
situation the register contents will remain the same after such a reset occurs.
Any register value, other than the four defined LVR values above, will also result in
the generation of an MCU reset. The reset operation will be activated after a delay
time, tSRESET. However in this situation the register contents will be reset to the POR
value.
69
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
• RSTFC Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
RSTF
LVRF
LRF
WRF
R/W
—
—
—
—
R/W
R/W
R/W
R/W
POR
—
—
—
—
0
x
0
0
“x” unknown
Bit 7~4
Unimplemented, read as “0”
Bit 3
RSTF: Reset Control Register Software Reset Flag
Described elsewhere.
Bit 2
LVRF: LVR Function Reset Flag
0: Not occur
1: Occurred
This bit is set high when a specific Low Voltage Reset situation condition occurs. This
bit can only be cleared to “0” by the application program.
Bit 1
LRF: LVR Control Register Software Reset Flag
0: Not occur
1: Occurred
This bit is set high if the LVRC register contains any non-defined LVR voltage register
values. This in effect acts like a software-reset function. This bit can only be cleared to
“0” by the application program.
Bit 0
WRF: WDT Control register software reset flag
Described elsewhere.
Watchdog Time-out Reset during Normal Operation
The Watchdog time-out Reset during normal operation is the same as LVR reset except that the
Watchdog time-out flag TO will be set high.
WDT Time-o�t
tRSTD + tSST
Inte�nal Reset
WDT Time-out Reset during Normal Operation Timing Chart
Watchdog Time-out Reset during SLEEP or IDLE Mode
The Watchdog time-out Reset during SLEEP or IDLE Mode is a little different from other kinds
of reset. Most of the conditions remain unchanged except that the Program Counter and the Stack
Pointer will be cleared to “0” and the TO flag will be set high. Refer to the System Start Up Time
Characteristics for tSST details.
WDT Time-o�t
tSST
Inte�nal Reset
WDT Time-out Reset during SLEEP or IDLE Mode Timing Chart
Rev. 1.10
70
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Reset Initial Conditions
The different types of reset described affect the reset flags in different ways. These flags, known
as PDF and TO are located in the status register and are controlled by various microcontroller
operations, such as the SLEEP or IDLE Mode function or Watchdog Timer. The reset flags are
shown in the table:
TO
PDF
0
0
Power-on reset
Reset Conditions
u
u
LVR reset during FAST or SLOW Mode operation
1
u
WDT time-out reset during FAST or SLOW Mode operation
1
1
WDT time-out reset during IDLE or SLEEP Mode operation
“u” stands for unchanged
The following table indicates the way in which the various components of the microcontroller are
affected after a power-on reset occurs.
Item
Condition after Reset
Program Counter
Reset to zero
Interrupts
All interrupts will be disabled
WDT, Time Bases
Clear after reset, WDT begins counting
Timer Modules
Timer Modules will be turned off
Input/Output Ports
I/O ports will be setup as inputs
Stack Pointer
Stack Pointer will point to the top of the stack
The different kinds of resets all affect the internal registers of the microcontroller in different ways.
To ensure reliable continuation of normal program execution after a reset occurs, it is important to
know what condition the microcontroller is in after a particular reset occurs. The following table
describes how each type of reset affects each of the microcontroller internal registers.
BH66F2650
BH66F2660
Reset
(Power On)
IAR0
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
MP0
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
IAR1
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
MP1L
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
MP1H
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
ACC
●
●
xxxx xxxx
uuuu uuuu
uuuu uuuu
uuuu uuuu
PCL
●
●
0000 0000
0000 0000
0000 0000
0000 0000
TBLP
●
●
xxxx xxxx
uuuu uuuu
uuuu uuuu
uuuu uuuu
TBLH
●
●
xxxx xxxx
uuuu uuuu
uuuu uuuu
uuuu uuuu
TBHP
●
—
---x xxxx
- - - u uuuu
- - - u uuuu
- - - u uuuu
TBHP
—
●
--xx xxxx
- - uu uuuu
- - uu uuuu
- - uu uuuu
STATUS
●
●
xx00 xxxx
uuuu uuuu
x x 1 u uuuu
uu 11 uuuu
PBP
—
●
---- ---0
---- ---0
---- ---0
---- ---u
IAR2
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
MP2L
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
MP2H
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
RSTFC
●
●
---- 0x00
- - - - u 1 uu
- - - - uuuu
- - - - uuuu
SCC
●
●
000- 0000
000- 0000
000- 0000
uuu - uuuu
HIRCC
●
●
---- 0001
---- 0001
---- 0001
- - - - uuuu
Register
Name
Rev. 1.10
LVR Reset
WDT Time-out
(Normal Operation) (Normal Operation)
71
WDT Time-out
(IDLE/SLEEP)
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
BH66F2650
BH66F2660
Reset
(Power On)
HXTC
●
●
---- -000
---- -000
---- -000
- - - - - uuu
LXTC
●
●
---- --00
---- --00
---- --00
- - - - - - uu
PA
●
●
1111 1111
1111 1111
1111 1111
uuuu uuuu
PAC
●
●
1111 1111
1111 1111
1111 1111
uuuu uuuu
PAPU
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PAWU
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
RSTC
●
●
0101 0101
0101 0101
0101 0101
uuuu uuuu
LVRC
●
●
0101 0101
0101 0101
0101 0101
uuuu uuuu
LVDC
●
●
--00 0000
--00 0000
--00 0000
- - uu uuuu
MFI0
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
MFI1
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
MFI2
●
●
--00 --00
--00 --00
--00 --00
- - uu - - uu
WDTC
●
●
0 1 0 1 0 0 11
0 1 0 1 0 0 11
0 1 0 1 0 0 11
uuuu uuuu
INTEG
●
●
---- 0000
---- 0000
---- 0000
- - - - uuuu
INTC0
●
●
-000 0000
-000 0000
-000 0000
- uuu uuuu
INTC1
●
●
-000 -000
-000 -000
-000 -000
- uuu - uuu
INTC2
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
INTC3
●
●
---0 ---0
---0 ---0
---0 ---0
---u ---u
PB
●
●
1111 1111
1111 1111
1111 1111
uuuu uuuu
PBC
●
●
1111 1111
1111 1111
1111 1111
uuuu uuuu
PBPU
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PC
●
●
1111 1111
1111 1111
1111 1111
uuuu uuuu
PCC
●
●
1111 1111
1111 1111
1111 1111
uuuu uuuu
PCPU
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PSCR
●
●
---- --00
---- --00
---- --00
- - - - - - uu
TB0C
●
●
0--- -000
0--- -000
0--- -000
u - - - - uuu
TB1C
●
●
0--- -000
0--- -000
0--- -000
u - - - - uuu
USR
●
●
0 0 0 0 1 0 11
0 0 0 0 1 0 11
0 0 0 0 1 0 11
uuuu uuuu
UCR1
●
●
0000 00x0
0000 00x0
0000 00x0
uuuu uuuu
UCR2
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
TXR_RXR
●
●
xxxx xxxx
xxxx xxxx
xxxx xxxx
uuuu uuuu
BRG
●
●
xxxx xxxx
xxxx xxxx
xxxx xxxx
uuuu uuuu
SIMC0
●
●
111 - 0 0 0 0
111 - 0 0 0 0
111 - 0 0 0 0
uuu - uuuu
SIMC1
●
●
1000 0001
1000 0001
1000 0001
uuuu uuuu
SIMD
●
●
xxxx xxxx
xxxx xxxx
xxxx xxxx
uuuu uuuu
SIMA
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
SIMC2
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
SIMTOC
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
SPIC0
●
●
111 - - - 0 0
111 - - - 0 0
111 - - - 0 0
uuu - - - uu
SPIC1
●
●
--00 0000
--00 0000
--00 0000
- - uu uuuu
SPID
●
●
xxxx xxxx
xxxx xxxx
xxxx xxxx
uuuu uuuu
EEA
●
—
--00 0000
--00 0000
--00 0000
- - uu uuuu
EEA
—
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
EED
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
STMC0
●
●
0000 0---
0000 0---
0000 0---
uuuu u - - -
STMC1
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
Register
Name
Rev. 1.10
LVR Reset
WDT Time-out
(Normal Operation) (Normal Operation)
72
WDT Time-out
(IDLE/SLEEP)
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
BH66F2650
BH66F2660
Reset
(Power On)
STMDL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
STMDH
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
STMAL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
STMAH
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
STMRP
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM0C0
●
●
0000 0---
0000 0---
0000 0---
uuuu u - - -
PTM0C1
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM0DL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM0DH
●
●
---- --00
---- --00
---- --00
- - - - - - uu
PTM0AL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM0AH
●
●
---- --00
---- --00
---- --00
- - - - - - uu
PTM0RPL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM0RPH
●
●
---- --00
---- --00
---- --00
- - - - - - uu
MDUWR0
●
●
xxxx xxxx
0000 0000
0000 0000
uuuu uuuu
MDUWR1
●
●
xxxx xxxx
0000 0000
0000 0000
uuuu uuuu
MDUWR2
●
●
xxxx xxxx
0000 0000
0000 0000
uuuu uuuu
MDUWR3
●
●
xxxx xxxx
0000 0000
0000 0000
uuuu uuuu
MDUWR4
●
●
xxxx xxxx
0000 0000
0000 0000
uuuu uuuu
MDUWR5
●
●
xxxx xxxx
0000 0000
0000 0000
uuuu uuuu
MDUWCTRL
●
●
00-- ----
00-- ----
00-- ----
uu - - - - - -
ADCS
●
●
---0 0000
---0 0000
---0 0000
- - - u uuuu
ADCR0
●
●
0010 00-0
0010 00-0
0010 00-0
uuuu uu - u
ADCR1
●
●
0000 000-
0000 000-
0000 000-
uuuu uuu -
PWRC
●
●
0--- -000
0--- -000
0--- -000
u - - - - uuu
PGAC0
●
●
-000 0000
-000 0000
-000 0000
- uuu uuuu
PGAC1
●
●
-000 000-
-000 000-
-000 000-
- uuu uuu -
PGACS
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
ADRL
●
●
xxxx xxxx
xxxx xxxx
xxxx xxxx
uuuu uuuu
ADRM
●
●
xxxx xxxx
xxxx xxxx
xxxx xxxx
uuuu uuuu
ADRH
●
●
xxxx xxxx
xxxx xxxx
xxxx xxxx
uuuu uuuu
DSDAH
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
DSDAL
●
●
---- 0000
---- 0000
---- 0000
- - - - uuuu
DSDACC
●
●
000- ----
000- ----
000- ----
uuu - - - - -
SGC
●
●
0000 ----
0000 ----
0000 ----
uuuu - - - -
SGN
●
●
--00 0000
--00 0000
--00 0000
- - uu uuuu
SGDNR
●
●
---0 0000
---0 0000
---0 0000
- - - u uuuu
OPAC
●
●
0--- 0000
0--- 0000
0--- 0000
u - - - uuuu
SWC0
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
SWC1
●
●
-000 0000
-000 0000
-000 0000
- uuu uuuu
SWC2
●
●
-000 000-
-000 000-
-000 000-
- uuu uuu -
DACO
●
●
--00 0000
--00 0000
--00 0000
- - uu uuuu
FTRC
●
●
0--0 --00
0--0 --00
0--0 --00
u - - u - - uu
PD
●
●
- - - - 1111
- - - - 1111
- - - - 1111
- - - - uuuu
PDC
●
●
- - - - 1111
- - - - 1111
- - - - 1111
- - - - uuuu
PDPU
●
●
---- 0000
---- 0000
---- 0000
- - - - uuuu
Register
Name
Rev. 1.10
LVR Reset
WDT Time-out
(Normal Operation) (Normal Operation)
73
WDT Time-out
(IDLE/SLEEP)
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
BH66F2650
BH66F2660
Reset
(Power On)
PTM1C0
●
●
0000 0---
0000 0---
0000 0---
uuuu u - - -
PTM1C1
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM1DL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM1DH
●
●
---- --00
---- --00
---- --00
- - - - - - uu
PTM1AL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM1AH
●
●
---- --00
---- --00
---- --00
- - - - - - uu
PTM1RPL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM1RPH
●
●
---- --00
---- --00
---- --00
- - - - - - uu
PTM2C0
●
●
0000 0---
0000 0---
0000 0---
uuuu u - - -
PTM2C1
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM2DL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM2DH
●
●
---- --00
---- --00
---- --00
- - - - - - uu
PTM2AL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM2AH
●
●
---- --00
---- --00
---- --00
- - - - - - uu
PTM2RPL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PTM2RPH
●
●
---- --00
---- --00
---- --00
- - - - - - uu
EEC
●
●
---- 0000
---- 0000
---- 0000
- - - - uuuu
FC0
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
FC1
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
FC2
●
●
---- ---0
---- ---0
---- ---0
---- ---u
FARL
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
FARH
●
—
---0 0000
---0 0000
---0 0000
- - - u uuuu
FARH
—
●
--00 0000
--00 0000
--00 0000
- - uu uuuu
FD0L
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
FD0H
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
FD1L
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
FD1H
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
FD2L
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
FD2H
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
FD3L
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
FD3H
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
IFS0
●
●
00-- 0--0
00-- 0--0
00-- 0--0
uu - - u - - u
IFS1
●
●
-000 --00
-000 --00
-000 --00
- uuu - - uu
PAS0
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PAS1
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PBS0
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
PDS0
●
●
0000 ----
0000 ----
0000 ----
uuuu - - - -
PCS0
●
●
--00 --00
--00 --00
--00 --00
- - uu - - uu
PCS1
●
●
---- 0000
---- 0000
---- 0000
- - - - uuuu
SLEDC0
●
●
0000 0000
0000 0000
0000 0000
uuuu uuuu
SLEDC1
●
●
--00 0000
--00 0000
--00 0000
- - uu uuuu
Register
Name
LVR Reset
WDT Time-out
(Normal Operation) (Normal Operation)
WDT Time-out
(IDLE/SLEEP)
Note: “u” stands for unchanged
“x” stands for unknown
“-” stands for unimplemented
Rev. 1.10
74
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Input/Output Ports
The microcontrollers offer considerable flexibility on their I/O ports. With the input or output
designation of every pin fully under user program control, pull-high selections for all ports and
wake-up selections on certain pins, the user is provided with an I/O structure to meet the needs of a
wide range of application possibilities.
These devices provide bidirectional input/output lines labeled with port names PA~PD. These I/O
ports are mapped to the RAM Data Memory with specific addresses as shown in the Special Purpose
Data Memory table. All of these I/O ports can be used for input and output operations. For input
operation, these ports are non-latching, which means the inputs must be ready at the T2 rising edge
of instruction “MOV A, [m]”, where m denotes the port address. For output operation, all the data is
latched and remains unchanged until the output latch is rewritten.
Register
Name
PA
PAC
PAPU
PAWU
PB
PBC
PBPU
PC
PCC
PCPU
PD
PDC
PDPU
7
PA7
PAC7
PAPU7
PAWU7
PB7
PBC7
PBPU7
PC7
PCC7
PCPU7
—
—
—
6
PA6
PAC5
PAPU4
PAWU6
PB6
PBC6
PBPU6
PC6
PCC6
PCPU6
—
—
—
5
PA5
PAC5
PAPU5
PAWU5
PB5
PBC5
PBPU5
PC5
PCC5
PCPU5
—
—
—
4
PA4
PAC4
PAPU4
PAWU4
PB4
PBC4
PBPU4
PC4
PCC4
PCPU4
—
—
—
Bit
3
PA3
PAC3
PAPU3
PAWU3
PB3
PBC3
PBPU3
PC3
PCC3
PCPU3
PD3
PDC3
PDPU3
2
PA2
PAC2
PAPU2
PAWU2
PB2
PBC2
PBPU2
PC2
PCC2
PCPU2
PD2
PDC2
PDPU2
1
PA1
PAC1
PAPU1
PAWU1
PB1
PBC1
PBPU1
PC1
PCC1
PCPU1
PD1
PDC1
PDPU1
0
PA0
PAC0
PAPU0
PAWU0
PB0
PBC0
PBPU0
PC0
PCC0
PCPU0
PD0
PDC0
PDPU0
“—” unimplemented
I/O Logic Function Registers List
Pull-high Resistors
Many product applications require pull-high resistors for their switch inputs usually requiring the
use of an external resistor. To eliminate the need for these external resistors, all I/O pins, when
configured as an input have the capability of being connected to an internal pull-high resistor. These
pull-high resistors are selected using registers PAPU~PDPU, and are implemented using weak
PMOS transistors.
Note that the pull-high resistor can be controlled by the relevant pull-high control register only when
the pin-shared functional pin is selected as a digital input or NMOS output. Otherwise, the pull-high
resistors cannot be enabled.
PxPU Register
Bit
7
6
5
4
3
2
1
0
Name
PxPU7
PxPU4
PxPU5
PxPU4
PxPU3
PxPU2
PxPU1
PxPU0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
PxPUn: I/O Port x Pin Pull-high Function Control
0: Disable
1: Enable
The PxPUn bit is used to control the pin pull-high function. Here the “x” can be A, B, C and
D. However, the actual available bits for each I/O port may be different.
Rev. 1.10
75
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Port A Wake-up
The HALT instruction forces the microcontroller into the SLEEP or IDLE Mode which preserves
power, a feature that is important for battery and other low-power applications. Various methods
exist to wake-up the microcontroller, one of which is to change the logic condition on one of the Port
A pins from high to low. This function is especially suitable for applications that can be woken up
via external switches. Each pin on Port A can be selected individually to have this wake-up feature
using the PAWU register.
Note that the wake-up function can be controlled by the wake-up control registers only when the
pin-shared functional pin is selected as general purpose input/output and the MCU enters the Power
down mode.
PAWU Register
Bit
7
6
5
4
3
2
1
0
Name
PAWU7
PAWU6
PAWU5
PAWU4
PAWU3
PAWU2
PAWU1
PAWU0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
PAWUn: Port A Pin Wake-up Control
0: Disable
1: Enable
I/O Port Control Registers
Each I/O port has its own control register known as PAC~PDC, to control the input/output
configuration. With this control register, each CMOS output or input can be reconfigured
dynamically under software control. Each pin of the I/O ports is directly mapped to a bit in its
associated port control register. For the I/O pin to function as an input, the corresponding bit of the
control register must be written as a “1”. This will then allow the logic state of the input pin to be
directly read by instructions. When the corresponding bit of the control register is written as a “0”,
the I/O pin will be setup as a CMOS output. If the pin is currently setup as an output, instructions
can still be used to read the output register. However, it should be noted that the program will in fact
only read the status of the output data latch and not the actual logic status of the output pin.
PxC Register
Bit
7
6
5
4
3
2
1
0
Name
PxC7
PxC5
PxC5
PxC4
PxC3
PxC2
PxC1
PxC0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
1
1
1
1
1
1
1
1
PxCn: I/O Port x Pin Type Selection
0: Output
1: Input
The PxCn bit is used to control the pin type selection. Here the “x” can be A, B, C and D.
However, the actual available bits for each I/O port may be different.
Rev. 1.10
76
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
I/O Port Source Current Control
The devices support different source current driving capability for each I/O port. With the
corresponding selection registers, SLEDC0 and SLEDC1, each I/O port can support four levels of
the source current driving capability. Users should refer to the Input/Output Characteristics section
to select the desired source current for different applications.
SLEDC0 Register
Bit
Name
7
6
5
4
3
2
1
0
SLEDC07 SLEDC06 SLEDC05 SLEDC04 SLEDC03 SLEDC02 SLEDC01 SLEDC00
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
1
0
Bit 7~6
Bit 5~4
Bit 3~2
Bit 1~0
SLEDC07~SLEDC06: PB7~PB4 Source Current Selection
00: Source current=Level 0 (min.)
01: Source current=Level 1
10: Source current=Level 2
11: Source current=Level 3 (max.)
SLEDC05~SLEDC04: PB3~PB0 Source Current Selection
00: Source current=Level 0 (min.)
01: Source current=Level 1
10: Source current=Level 2
11: Source current=Level 3 (max.)
SLEDC03~SLEDC02: PA7~PA4 Source Current Selection
00: Source current=Level 0 (min.)
01: Source current=Level 1
10: Source current=Level 2
11: Source current=Level 3 (max.)
SLEDC01~SLEDC00: PA3~PA0 Source Current Selection
00: Source current=Level 0 (min.)
01: Source current=Level 1
10: Source current=Level 2
11: Source current=Level 3 (max.)
SLEDC1 Register
Bit
7
6
Name
—
—
R/W
—
—
R/W
R/W
R/W
R/W
R/W
R/W
POR
—
—
0
0
0
0
0
0
Bit 7~6
Bit 5~4
Bit 3~2
Bit 1~0
Rev. 1.10
5
4
3
2
SLEDC15 SLEDC14 SLEDC13 SLEDC12 SLEDC11 SLEDC10
Unimplemented, read as “0”
SLEDC15~SLEDC14: PD3~PD0 Source Current Selection
00: Source current=Level 0 (min.)
01: Source current=Level 1
10: Source current=Level 2
11: Source current=Level 3 (max.)
SLEDC13~SLEDC12: PC7~PC4 Source Current Selection
00: Source current=Level 0 (min.)
01: Source current=Level 1
10: Source current=Level 2
11: Source current=Level 3 (max.)
SLEDC11~SLEDC10: PC3~PC0 Source Current Selection
00: Source current=Level 0 (min.)
01: Source current=Level 1
10: Source current=Level 2
11: Source current=Level 3 (max.)
77
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Pin-shared Functions
The flexibility of the microcontroller range is greatly enhanced by the use of pins that have more
than one function. Limited numbers of pins can force serious design constraints on designers but by
supplying pins with multi-functions, many of these difficulties can be overcome. For these pins, the
desired function of the multi-function I/O pins is selected by a series of registers via the application
program control.
Pin-shared Function Selection Registers
The limited number of supplied pins in a package can impose restrictions on the amount of functions
a certain device can contain. However by allowing the same pins to share several different functions
and providing a means of function selection, a wide range of different functions can be incorporated
into even relatively small package sizes. The devices include Port “x” output function Selection
register “n”, labeled as PxSn, and Input Function Selection register “n”, labeled as IFSn, which can
select the desired functions of the multi-function pin-shared pins.
When the pin-shared input function is selected to be used, the corresponding input and output
functions selection should be properly managed. For example, if the I2C SDA line is used, the
corresponding output pin-shared function should be configured as the SDI/SDA function by
configuring the PxSn register and the SDA signal intput should be properly selected using the
IFSn register. However, if the external interrupt function is selected to be used, the relevant output
pin-shared function should be selected as an I/O function and the interrupt input signal should be
selected.
The most important point to note is to make sure that the desired pin-shared function is properly
selected and also deselected. For most pin-shared functions, to select the desired pin-shared function,
the pin-shared function should first be correctly selected using the corresponding pin-shared control
register. After that the corresponding peripheral functional setting should be configured and then the
peripheral function can be enabled. However, a special point must be noted for some digital input
pins, such as INTn, xTCKn, xTPnI, etc, which share the same pin-shared control configuration with
their corresponding general purpose I/O functions when setting the relevant pin-shared control bit
fields. To select these pin functions, in addition to the necessary pin-shared control and peripheral
functional setup aforementioned, they must also be setup as an input by setting the corresponding bit
in the I/O port control register. To correctly deselect the pin-shared function, the peripheral function
should first be disabled and then the corresponding pin-shared function control register can be
modified to select other pin-shared functions.
Bit
Register
Name
7
6
5
4
3
2
1
0
IFS0
PTP2IPS
PTP1IPS
—
—
PTCK2PS
—
—
STCKPS
IFS1
—
SCSAPS
SDIAPS
SCKAPS
—
—
RXPS1
RXPS0
PAS0
PAS07
PAS06
PAS05
PAS04
PAS03
PAS02
PAS01
PAS00
PAS1
PAS17
PAS16
PAS15
PAS14
PAS13
PAS12
PAS11
PAS10
PBS0
PBS07
PBS06
PBS05
PBS04
PBS03
PBS02
PBS01
PBS00
PCS0
—
—
PCS05
PCS04
—
—
PCS01
PCS00
PCS1
—
—
—
—
PCS13
PCS12
PCS11
PCS10
PDS0
PDS07
PDS06
PDS05
PDS04
—
—
—
—
Pin-shared Function Selection Registers List
Rev. 1.10
78
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
• PAS0 Register
Bit
7
6
5
4
3
2
1
0
Name
PAS07
PAS06
PAS05
PAS04
PAS03
PAS02
PAS01
PAS00
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~6
PAS07~PAS06: PA3 Pin-Shared Function Selection
00: PA3/PTP1I
01: PTP1
10: SDOA
11: OSC2
Bit 5~4
PAS05~PAS04: PA2 Pin-Shared Function Selection
00: PA2/PTCK0
01: PA2/PTCK0
10: PA2/PTCK0
11: XT2
Bit 3~2
PAS03~PAS02: PA1 Pin-Shared Function Selection
00: PA1/INT0/STCK
01: PA1/INT0/STCK
10: LVDIN
11: PTP0B
Bit 1~0
PAS01~PAS00: PA0 Pin-Shared Function Selection
00: PA0/PTP0I
01: PA0/PTP0I
10: PTP0
11: XT1
• PAS1 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
PAS17
PAS16
PAS15
PAS14
PAS13
PAS12
PAS11
PAS10
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~6
PAS17~PAS16: PA7 Pin-Shared Function Selection
00: PA7/PTCK2
01: PA7/PTCK2
10: PA7/PTCK2
11: SDI/SDA
Bit 5~4
PAS15~PAS14: PA6 Pin-Shared Function Selection
00: PA6/STCK
01: SDIA
10: PA6/STCK
11: RX
Bit 3~2
PAS13~PAS12: PA5 Pin-Shared Function Selection
00: PA5/STPI
01: STP
10: SCKA
11: TX
Bit 1~0
PAS11~PAS10: PA4 Pin-Shared Function Selection
00: PA4/PTP2I
01: PTP2
10: SCSA
11: OSC1
79
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
• PBS0 Register
Bit
7
6
5
4
3
2
1
0
Name
PBS07
PBS06
PBS05
PBS04
PBS03
PBS02
PBS01
PBS00
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~6
PBS07~PBS06: PB3 Pin-Shared Function Selection
00: PB3
01: RX
10: SDIA
11: SDO
Bit 5~4
PBS05~PBS04: PB2 Pin-Shared Function Selection
00: PB2
01: PB2
10: SCS
11: SCKA
Bit 3~2
PBS03~PBS02: PB1 Pin-Shared Function Selection
00: PB1/INT1
01: PB1/INT1
10: STPB
11: PB1/INT1
Bit 1~0
PBS01~PBS00: PB0 Pin-Shared Function Selection
00: PB0
01: PB0
10: SCK/SCL
11: PB0
• PCS0 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
—
—
PCS05
PCS04
—
—
PCS01
PCS00
R/W
—
—
R/W
R/W
—
—
R/W
R/W
POR
—
—
0
0
—
—
0
0
Bit 7~6
Unimplemented, read as “0”
Bit 5~4
PCS05~PCS04: PC2 Pin-Shared Function Selection
00: PC2/PTP2I
01: PTP2
10: PC2/PTP2I
11: PC2/PTP2I
Bit 3~2
Unimplemented, read as “0”
Bit 1~0
PCS01~PCS00: PC0 Pin-Shared Function Selection
00: PC0/PTP1I
01: PC0/PTP1I
10: PTP1
11: PC0/PTP1I
80
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
• PCS1 Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
PCS13
PCS12
PCS11
PCS10
R/W
—
—
—
—
R/W
R/W
R/W
R/W
POR
—
—
—
—
0
0
0
0
Bit 7~4
Unimplemented, read as “0”
Bit 3~2
PCS13~PCS12: PC5 Pin-Shared Function Selection
00: PC5
01: PC5
10: TX
11: SDOA
Bit 1~0
PCS11~PCS10: PC4 Pin-Shared Function Selection
00: PC4
01: PC4
10: PC4
11: SCSA
• PDS0 Register
Bit
7
6
5
4
3
2
1
0
Name
PDS07
PDS06
PDS05
PDS04
—
—
—
—
R/W
R/W
R/W
R/W
R/W
—
—
—
—
POR
0
0
0
0
—
—
—
—
Bit 7~6
PDS07~PDS06: PD3 Pin-Shared Function Selection
00: PD3
01: PD3
10: TX
11: PD3
Bit 5~4
PDS05~PDS04: PD2 Pin-Shared Function Selection
00: PD2
01: PD2
10: RX
11: PD2
Bit 3~0
Unimplemented, read as “0”
• IFS0 Register
Bit
Name
Rev. 1.10
7
6
PTP2IPS PTP1IPS
5
4
3
2
1
0
—
—
PTCK2PS
—
—
STCKPS
R/W
R/W
R/W
—
—
R/W
—
—
R/W
POR
0
0
—
—
0
—
—
0
Bit 7
PTP2IPS: PTP2I Input Source Pin Selection
0: PTP2I on PA4
1: PTP2I on PC2
Bit 6
PTP1IPS: PTP1I Input Source Pin Selection
0: PTP1I on PA3
1: PTP1I on PC0
Bit 5~4
Unimplemented, read as “0”
Bit 3
PTCK2PS: PTCK2 Input Source Pin Selection
0: PTCK2 on PC3
1: PTCK2 on PA7
Bit 2~1
Unimplemented, read as “0”
81
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Bit 0
STCKPS: STCK Input Source Pin Selection
0: STCK on PA1
1: STCK on PA6
• IFS1 Register
Bit
7
6
5
4
3
2
1
0
Name
—
SCSAPS
SDIAPS
SCKAPS
—
—
RXPS1
RXPS0
R/W
—
R/W
R/W
R/W
—
—
R/W
R/W
POR
—
0
0
0
—
—
0
0
Bit 7
Unimplemented, read as “0”
Bit 6
SCSAPS: SCSA Input Source Pin Selection
0: SCSA on PA4
1: SCSA on PC4
Bit 5
SDIAPS: SDIA Input Source Pin Selection
0: SDIA on PA6
1: SDIA on PB3
Bit 4
SCKAPS: SCKA Input Source Pin Selection
0: SCKA on PA5
1: SCKA on PB2
Bit 3~2
Unimplemented, read as “0”
Bit 1~0
RXPS1~RXPS0: RX Input Source Pin Selection
00: RX on PA6
01: RX on PB3
10: RX on PD2
11: RX on PD2
I/O Pin Structures
The accompanying diagram illustrates the internal structures of the I/O logic function. As the exact
logical construction of the I/O pin will differ from this diagram, it is supplied as a guide only to
assist with the functional understanding of the logic function I/O pins. The wide range of pin-shared
structures does not permit all types to be shown.
VDD
Cont�ol Bit
Data B�s
W�ite Cont�ol Registe�
Chip Reset
Read Cont�ol Registe�
D
Weak
P�ll-�p
CK Q
S
I/O pin
Data Bit
D
W�ite Data Registe�
Q
P�ll-high
Registe�
Select
Q
CK Q
S
Read Data Registe�
S�stem Wake-�p
M
U
X
wake-�p Select
PA onl�
Logic Function Input/Output Structure
Rev. 1.10
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Programming Considerations
Within the user program, one of the things first to consider is port initialisation. After a reset, all
of the I/O data and port control registers will be set to high. This means that all I/O pins will be
defaulted to an input state, the level of which depends on the other connected circuitry and whether
pull-high selections have been chosen. If the port control registers are then programmed to setup
some pins as outputs, these output pins will have an initial high output value unless the associated
port data registers are first programmed. Selecting which pins are inputs and which are outputs can
be achieved byte-wide by loading the correct values into the appropriate port control register or
by programming individual bits in the port control register using the “SET [m].i” and “CLR [m].i”
instructions. Note that when using these bit control instructions, a read-modify-write operation takes
place. The microcontroller must first read in the data on the entire port, modify it to the required new
bit values and then rewrite this data back to the output ports.
Port A has the additional capability of providing wake-up functions. When the device is in the
SLEEP or IDLE Mode, various methods are available to wake the device up. One of these is a high
to low transition of any of the Port A pins. Single or multiple pins on Port A can be setup to have this
function.
Timer Modules – TM
One of the most fundamental functions in any microcontroller devices is the ability to control and
measure time. To implement time related functions each device includes several Timer Modules,
generally abbreviated to the name TM. The TMs are multi-purpose timing units and serve to provide
operations such as Timer/Counter, Input Capture, Compare Match Output and Single Pulse Output
as well as being the functional unit for the generation of PWM signals. Each of the TMs has two
interrupts. The addition of input and output pins for each TM ensures that users are provided with
timing units with a wide and flexible range of features.
The common features of the different TM types are described here with more detailed information
provided in the individual Standard and Periodic TM sections.
Introduction
Each device contains four TMs and each individual TM can be categorised as a certain type, namely
Standard Type TM or Periodic Type TM. Although similar in nature, the different TM types vary
in their feature complexity. The common features to all of the Standard and Periodic Type TMs
will be described in this section and the detailed operation regarding each of the TM types will be
described in separate sections. The main features and differences between the three types of TMs are
summarised in the accompanying table.
STM
PTM
Timer/Counter
TM Function
√
√
Input Capture
√
√
Compare Match Output
√
√
PWM Channels
1
1
Single Pulse Output
PWM Alignment
PWM Adjustment Period & Duty
1
1
Edge
Edge
Duty or Period
Duty or Period
TM Function Summary
Rev. 1.10
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Device
BH66F2650
BH66F2660
STM
PTM
16-bit STM
10-bit PTM0
10-bit PTM1
10-bit PTM2
TM Name/Type Reference
TM Operation
The different types of TM offer a diverse range of functions, from simple timing operations to PWM
signal generation. The key to understanding how the TM operates is to see it in terms of a free
running count-up counter whose value is then compared with the value of pre-programmed internal
comparators. When the free running count-up counter has the same value as the pre-programmed
comparator, known as a compare match situation, a TM interrupt signal will be generated which
can clear the counter and perhaps also change the condition of the TM output pin. The internal TM
counter is driven by a user selectable clock source, which can be an internal clock or an external pin.
TM Clock Source
The clock source which drives the main counter in each TM can originate from various sources.
The selection of the required clock source is implemented using the STCK2~STCK0 and
PTnCK2~PTnCK0 bits in the STM and PTMn control registers, where “n” stands for the specific
TM serial number. The clock source can be a ratio of the system clock, fSYS, or the internal high
clock, fH, the fSUB clock source or the external STCK and PTCKn pin. The STCK and PTCKn pin
clock source is used to allow an external signal to drive the TM as an external clock source for event
counting.
TM Interrupts
The Standard or Periodic type TM has two internal interrupt, one for each of the internal comparator
A or comparator P, which generate a TM interrupt when a compare match condition occurs. When a
TM interrupt is generated, it can be used to clear the counter and also to change the state of the TM
output pin.
TM External Pins
Each of the TMs, irrespective of what type, has two TM input pins, with the label STCK, PTCKn
and STPI, PTPnI respectively. The STM, PTMn input pin, STCK, PTCKn, is essentially a clock
source for the STM, PTMn and is selected using the STCK2~STCK0 or PTnCK2~PTnCK0 bits
in the STMC0 or PTMnC0 register. This external TM input pin allows an external clock source to
drive the internal TM. The STCK, PTCKn input pin can be chosen to have either a rising or falling
active edge. The STCK and PTCKn pins are also used as the external trigger input pin in single
pulse output mode for the STM and PTMn respectively.
The other STM, PTMn input pin, STPI, PTPnI, is the capture input whose active edge can be a rising
edge, a falling edge or both rising and falling edges and the active edge transition type is selected
using the STIO1~STIO0, PTnIO1~PTnIO0 bits in the STMC1, PTMnC1 register respectively. There
is another capture input, PTCKn, for PTMn capture input mode, which can be used as the external
trigger input source except the PTPnI pin.
The TMs each have one or more output pins. The STPB, PTP0B is the inverted signal of the STP,
PTP0 output. The TM output pins can be selected using the corresponding pin-shared function
selection bits described in the Pin-shared Function section. When the TM is in the Compare Match
Output Mode, these pins can be controlled by the TM to switch to a high or low level or to toggle
when a compare match situation occurs. The external STP, PTPn or STPB, PTP0B output pin is also
Rev. 1.10
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the pin where the TM generates the PWM output waveform. As the TM output pins are pin-shared
with other functions, the TM output function must first be setup using relevant pin-shared function
selection register.
STM
PTMn
Input
Output
Input
Output
STCK, STPI
STP, STPB
PTCK0, PTP0I,
PTCK1, PTP1I
PTCK2, PTP2I
PTP0B, PTP0,
PTP1, PTP2
TM External Pins
TM Input/Output Pin Selection
Selecting to have a TM input/output or whether to retain its other shared function is implemented
using the relevant pin-shared function selection registers, with the corresponding selection bits in
each pin-shared function register corresponding to a TM input/output pin. Configuring the selection
bits correctly will setup the corresponding pin as a TM input/output. The details of the pin-shared
function selection are described in the pin-shared function section.
STCK
CCR capt��e inp�t
STPI
STM
CCR o�tp�t
STP
STPB
STM Function Pin Control Block Diagram
PTCKn
CCR capt��e inp�t
PTPnI
PTMn
CCR o�tp�t
PTPn
PTPnB
PTM Function Pin Control Block Diagram – n=0
PTCKn
CCR capt��e inp�t
PTPnI
PTMn
CCR o�tp�t
PTPn
PTM Function Pin Control Block Diagram – n=1 or 2
Rev. 1.10
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Programming Considerations
The TM Counter Registers and the Capture/Compare CCRA and CCRP registers, all have a low
and high byte structure. The high bytes can be directly accessed, but as the low bytes can only be
accessed via an internal 8-bit buffer, reading or writing to these register pairs must be carried out in
a specific way. The important point to note is that data transfer to and from the 8-bit buffer and its
related low byte only takes place when a write or read operation to its corresponding high byte is
executed.
As the CCRA and CCRP registers are implemented in the way shown in the following diagram and
accessing these register pairs is carried out in a specific way as described above, it is recommended
to use the “MOV” instruction to access the CCRA and CCRP low byte registers, named STMAL,
PTMnAL and PTMnRPL, using the following access procedures. Accessing the CCRA or CCRP
low byte registers without following these access procedures will result in unpredictable values.
PTMn Co�nte� Registe� (Read onl�)
PTMnDL
�-bit B�ffe�
STM Co�nte� Registe� (Read onl�)
STMDL
STMDH
PTMnAL
�-bit B�ffe�
STMAL
PTMnDH
PTMnAH
PTMn CCRA Registe� (Read/W�ite)
STMAH
PTMnRPL
STM CCRA Registe� (Read/W�ite)
Data B�s
PTMnRPH
PTMn CCRP Registe� (Read/W�ite)
Data B�s
The following steps show the read and write procedures:
• Writing Data to CCRA or CCRP
♦♦
Step 1. Write data to Low Byte STMAL, PTMnAL or PTMnRPL
––note that here data is only written to the 8-bit buffer.
♦♦
Step 2. Write data to High Byte STMAH, PTMnAH or PTMnRPH
––here data is written directly to the high byte registers and simultaneously data is latched
from the 8-bit buffer to the Low Byte registers.
• Reading Data from the Counter Registers and CCRA or CCRP
Rev. 1.10
♦♦
Step 1. Read data from the High Byte STMDH, PTMnDH, STMAH, PTMnAH or PTMnRPH
––here data is read directly from the High Byte registers and simultaneously data is latched
from the Low Byte register into the 8-bit buffer.
♦♦
Step 2. Read data from the Low Byte STMDL, PTMnDL, STMAL, PTMnAL or PTMnRPL
––this step reads data from the 8-bit buffer.
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Standard Type TM – STM
The Standard Type TM contains five operating modes, which are Compare Match Output, Timer/
Event Counter, Capture Input, Single Pulse Output and PWM Output modes. The Standard TM can
also be controlled with two external input pins and can drive two external output pins.
STM Core
STM Input Pin
STM Output Pin
16-bit STM
STCK, STPI
STP, STPB
CCRP
�-bit Compa�ato� P
fSYS/�
000
fSYS
001
fH/16
010
fH/6�
011
fSUB
100
fSUB
101
110
STCK
Pin Cont�ol
16-bit Co�nt-�p Co�nte�
STON
STPAU
Co�nte� Clea�
0
1
STCCLR
b0~b15
111
16-bit Compa�ato� A
IFSn
STMPF Inte���pt
STOC
b�~b15
STCK�~STCK0
PxSn
Compa�ato� P Match
Compa�ato� A Match
O�tp�t
Cont�ol
Pola�it�
Cont�ol
Pin
Cont�ol
STM1� STM0
STIO1� STIO0
STPOL
PxSn
STP
STPB
STMAF Inte���pt
STIO1� STIO0
CCRA
Edge Detecto�
Pin Cont�ol
STPI
PxSn
Standard Type TM Block Diagram
Standard TM Operation
The size of Standard TM is 16-bit wide and its core is a 16-bit count-up counter which is driven by
a user selectable internal or external clock source. There are also two internal comparators with the
names, Comparator A and Comparator P. These comparators will compare the value in the counter
with CCRP and CCRA registers. The CCRP comparator is 8-bit wide whose value is compared
with the highest 8 bits in the counter while the CCRA is the sixteen bits and therefore compares all
counter bits.
The only way of changing the value of the 16-bit counter using the application program, is to
clear the counter by changing the STON bit from low to high. The counter will also be cleared
automatically by a counter overflow or a compare match with one of its associated comparators.
When these conditions occur, a STM interrupt signal will also usually be generated. The Standard
Type TM can operate in a number of different operational modes, can be driven by different clock
sources including an input pin and can also control an output pin. All operating setup conditions are
selected using relevant internal registers.
Rev. 1.10
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Standard Type TM Register Description
Overall operation of the Standard TM is controlled using a series of registers. A read only register
pair exists to store the internal counter 16-bit value, while a read/write register pair exists to store
the internal 16-bit CCRA value. The STMRP register is used to store the 8-bit CCRP bits. The
remaining two registers are control registers which setup the different operating and control modes.
Register
Name
Bit
7
6
5
4
3
2
1
0
STMC0
STPAU
STCK2
STCK1
STCK0
STON
—
—
—
STMC1
STM1
STM0
STIO1
STIO0
STOC
STPOL
STDPX
STCCLR
STMDL
D7
D6
D5
D4
D3
D2
D1
D0
STMDH
D15
D14
D13
D12
D11
D10
D9
D8
STMAL
D7
D6
D5
D4
D3
D2
D1
D0
STMAH
D15
D14
D13
D12
D11
D10
D9
D8
STMRP
D7
D6
D5
D4
D3
D2
D1
D0
16-bit Standard TM Registers List
STMDL Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R
R
R
R
R
R
R
R
POR
0
0
0
0
0
0
0
0
Bit 7~0
D7~D0: STM Counter Low Byte Register bit 7~bit 0
STM 16-bit Counter bit 7~bit 0
STMDH Register
Bit
7
6
5
4
3
2
1
0
Name
D15
D14
D13
D12
D11
D10
D9
D8
R/W
R
R
R
R
R
R
R
R
POR
0
0
0
0
0
0
0
0
Bit 7~0
D15~D8: STM Counter High Byte Register bit 7~bit 0
STM 16-bit Counter bit 15~bit 8
STMAL Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
Rev. 1.10
D7~D0: STM CCRA Low Byte Register bit 7~bit 0
STM 16-bit CCRA bit 7~bit 0
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STMAH Register
Bit
7
6
5
4
3
2
1
0
Name
D15
D14
D13
D12
D11
D10
D9
D8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
D15~D8: STM CCRA High Byte Register bit 7~bit 0
STM 16-bit CCRA bit 15~bit 8
STMC0 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
STPAU
STCK2
STCK1
STCK0
STON
—
—
—
R/W
R/W
R/W
R/W
R/W
R/W
—
—
—
POR
0
0
0
0
0
—
—
—
Bit 7
STPAU: STM Counter Pause Control
0: Run
1: Pause
The counter can be paused by setting this bit high. Clearing the bit to “0” restores
normal counter operation. When in a Pause condition the STM will remain powered
up and continue to consume power. The counter will retain its residual value when
this bit changes from low to high and resume counting from this value when the bit
changes to a low value again.
Bit 6~4
STCK2~STCK0: Select STM Counter Clock
000: fSYS/4
001: fSYS
010: fH/16
011: fH/64
100: fSUB
101: fSUB
110: STCK rising edge clock
111: STCK falling edge clock
These three bits are used to select the clock source for the STM. The external pin clock
source can be chosen to be active on the rising or falling edge. The clock source fSYS is
the system clock, while fH and fSUB are other internal clocks, the details of which can
be found in the oscillator section.
Bit 3
STON: STM Counter On/Off Control
0: Off
1: On
This bit controls the overall on/off function of the STM. Setting the bit high enables
the counter to run while clearing the bit disables the STM. Clearing this bit to zero
will stop the counter from counting and turn off the STM which will reduce its power
consumption. When the bit changes state from low to high the internal counter value
will be reset to zero, however when the bit changes from high to low, the internal
counter will retain its residual value until the bit returns high again. If the STM is in
the Compare Match Output Mode or the PWM Output Mode or Single Pulse Output
Mode then the STM output pin will be reset to its initial condition, as specified by the
STOC bit, when the STON bit changes from low to high.
Bit 2~0
Unimplemented, read as “0”
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STMC1 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
STM1
STM0
STIO1
STIO0
STOC
STPOL
STDPX
STCCLR
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~6
STM1~STM0: Select STM Operating Mode
00: Compare Match Output Mode
01: Capture Input Mode
10: PWM Mode or Single Pulse Output Mode
11: Timer/Counter Mode
These bits setup the required operating mode for the STM. To ensure reliable operation
the STM should be switched off before any changes are made to the STM1 and STM0
bits. In the Timer/Counter Mode, the STM output pin state is undefined.
Bit 5~4
STIO1~STIO0: Select STM External Pin (STP or STPI) Function
Compare Match Output Mode
00: No change
01: Output low
10: Output high
11: Toggle output
PWM Output Mode/Single Pulse Output Mode
00: PWM output inactive state
01: PWM output active state
10: PWM output
11: Single Pulse Output
Capture Input Mode
00: Input capture at rising edge of STPI
01: Input capture at falling edge of STPI
10: Input capture at rising/falling edge of STPI
11: Input capture disabled
Timer/Counter Mode
Unused
These two bits are used to determine how the STM output pin changes state when a
certain condition is reached. The function that these bits select depends upon in which
mode the STM is running.
In the Compare Match Output Mode, the STIO1 and STIO0 bits determine how the
STM output pin changes state when a compare match occurs from the Comparator
A. The TM output pin can be setup to switch high, switch low or to toggle its present
state when a compare match occurs from the Comparator A. When the bits are both
“0”, then no change will take place on the output. The initial value of the STM output
pin should be setup using the STOC bit in the STMC1 register. Note that the output
level requested by the STIO1 and STIO0 bits must be different from the initial value
setup using the STOC bit otherwise no change will occur on the STM output pin when
a compare match occurs. After the STM output pin changes state, it can be reset to its
initial level by changing the level of the STON bit from low to high.
In the PWM Mode, the STIO1 and STIO0 bits determine how the STM output pin
changes state when a certain compare match condition occurs. The PWM output
function is modified by changing these two bits. It is necessary to only change the
values of the STIO1 and STIO0 bits only after the STM has been switched off.
Unpredictable PWM outputs will occur if the STIO1 and STIO0 bits are changed
when the STM is running.
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Bit 3
STOC: STM STP Output Control
Compare Match Output Mode
0: Initial low
1: Initial high
PWM Output Mode/Single Pulse Output Mode
0: Active low
1: Active high
This is the output control bit for the STM output pin. Its operation depends upon
whether STM is being used in the Compare Match Output Mode or in the PWM
Output Mode/Single Pulse Output Mode. It has no effect if the STM is in the Timer/
Counter Mode. In the Compare Match Output Mode it determines the logic level of
the STM output pin before a compare match occurs. In the PWM Output Mode/Single
Pulse Output Mode it determines if the PWM signal is active high or active low.
Bit 2
STPOL: STM STP Output Polarity Control
0: Non-inverted
1: Inverted
This bit controls the polarity of the STP output pin. When the bit is set high the STM
output pin will be inverted and not inverted when the bit is “0”. It has no effect if the
STM is in the Timer/Counter Mode.
Bit 1
STDPX: STM PWM Duty/Period Control
0: CCRP – period; CCRA – duty
1: CCRP – duty; CCRA – period
This bit determines which of the CCRA and CCRP registers are used for period and
duty control of the PWM waveform.
Bit 0
STCCLR: STM Counter Clear Condition Selection
0: Comparator P match
1: Comparator A match
This bit is used to select the method which clears the counter. Remember that the
Standard TM contains two comparators, Comparator A and Comparator P, either of
which can be selected to clear the internal counter. With the STCCLR bit set high,
the counter will be cleared when a compare match occurs from the Comparator A.
When the bit is low, the counter will be cleared when a compare match occurs from
the Comparator P or with a counter overflow. A counter overflow clearing method can
only be implemented if the CCRP bits are all cleared to “0”. The STCCLR bit is not
used in the PWM Output, Single Pulse Output or Capture Input Mode.
STMRP Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
Rev. 1.10
D7~D0: STM CCRP 8-bit Register, Compared with the STM Counter bit 15~bit 8
Comparator P match period
0: 65536 STM clocks
1~255: (1~255) × 256 STM clocks
These eight bits are used to setup the value on the internal CCRP 8-bit register, which
are then compared with the internal counter's highest eight bits. The result of this
comparison can be selected to clear the internal counter if the STCCLR bit is set to “0”.
Setting the STCCLR bit to “0” ensures that a compare match with the CCRP values
will reset the internal counter. As the CCRP bits are only compared with the highest
eight counter bits, the compare values exist in 256 clock cycle multiples. Clearing all
eight bits to “0” is in effect allowing the counter to overflow at its maximum value.
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Standard Type TM Operation Modes
The Standard Type TM can operate in one of five operating modes, Compare Match Output Mode,
PWM Output Mode, Single Pulse Output Mode, Capture Input Mode or Timer/Counter Mode. The
operating mode is selected using the STM1 and STM0 bits in the STMC1 register.
Compare Match Output Mode
To select this mode, bits STM1 and STM0 in the STMC1 register, should be set to “00” respectively.
In this mode once the counter is enabled and running it can be cleared by three methods. These are
a counter overflow, a compare match from Comparator A and a compare match from Comparator P.
When the STCCLR bit is low, there are two ways in which the counter can be cleared. One is when
a compare match from Comparator P, the other is when the CCRP bits are all “0” which allows the
counter to overflow. Here both STMAF and STMPF interrupt request flags for Comparator A and
Comparator P respectively, will both be generated.
If the STCCLR bit in the STMC1 register is high then the counter will be cleared when a compare
match occurs from Comparator A. However, here only the STMAF interrupt request flag will be
generated even if the value of the CCRP bits is less than that of the CCRA registers. Therefore when
STCCLR is high no STMPF interrupt request flag will be generated. In the Compare Match Output
Mode, the CCRA can not be set to “0”.
As the name of the mode suggests, after a comparison is made, the STM output pin, will change
state. The STM output pin condition however only changes state when a STMAF interrupt request
flag is generated after a compare match occurs from Comparator A. The STMPF interrupt request
flag, generated from a compare match occurs from Comparator P, will have no effect on the STM
output pin. The way in which the STM output pin changes state are determined by the condition of
the STIO1 and STIO0 bits in the STMC1 register. The STM output pin can be selected using the
STIO1 and STIO0 bits to go high, to go low or to toggle from its present condition when a compare
match occurs from Comparator A. The initial condition of the STM output pin, which is setup after
the STON bit changes from low to high, is setup using the STOC bit. Note that if the STIO1 and
STIO0 bits are “0” then no pin change will take place.
Rev. 1.10
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Co�nte� ove�flow
Co�nte� Val�e
CCRP=0
0xFFFF
STCCLR = 0; STM [1:0] = 00
CCRP > 0
Co�nte� clea�ed b� CCRP val�e
CCRP > 0
Co�nte�
Resta�t
Res�me
CCRP
Pa�se
CCRA
Stop
Time
STON
STPAU
STPOL
CCRP Int. flag
STMPF
CCRA Int. flag
STMAF
STM
O/P Pin
O�tp�t pin set to
initial Level Low if
STOC=0
O�tp�t not affected b�
STMAF flag. Remains High
�ntil �eset b� STON bit
O�tp�t Toggle
with STMAF flag
He�e STIO [1:0] = 11
Toggle O�tp�t select
Note STIO [1:0] = 10
Active High O�tp�t select
O�tp�t Inve�ts
O�tp�t Pin when STPOL is high
Reset to Initial val�e
O�tp�t cont�olled b�
othe� pin-sha�ed f�nction
Compare Match Output Mode – STCCLR=0
Note: 1. With STCCLR=0 a Comparator P match will clear the counter
2. The STM output pin is controlled only by the STMAF flag
3. The output pin is reset to itsinitial state by a STON bit rising edge
Rev. 1.10
93
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Co�nte� Val�e
STCCLR = 1; STM [1:0] = 00
CCRA = 0
Co�nte� ove�flow
CCRA > 0 Co�nte� clea�ed b� CCRA val�e
0xFFFF
CCRA=0
Res�me
CCRA
Pa�se
Stop
Co�nte� Resta�t
CCRP
Time
STON
STPAU
STPOL
No STMAF flag
gene�ated on
CCRA ove�flow
CCRA Int. flag
STMAF
CCRP Int. flag
STMPF
STM
O/P Pin
STMPF not
gene�ated
O�tp�t pin set to
initial Level Low if
STOC=0
O�tp�t does
not change
O�tp�t not affected b�
STMAF flag. Remains High
�ntil �eset b� STON bit
O�tp�t Toggle
with STMAF flag
He�e STIO [1:0] = 11
Toggle O�tp�t select
Note STIO [1:0] = 10
Active High O�tp�t select
O�tp�t Inve�ts
when STPOL is high
O�tp�t Pin
Reset to Initial val�e
O�tp�t cont�olled b�
othe� pin-sha�ed f�nction
Compare Match Output Mode – STCCLR=1
Note: 1. With STCCLR=1 a Comparator A match will clear the counter
2. The STM output pin is controlled only by the STMAF flag
3. The output pin is reset to its initial state by a STON bit rising edge
4. A STMPF flag is not generated when STCCLR=1
Rev. 1.10
94
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Timer/Counter Mode
To select this mode, bits STM1 and STM0 in the STMC1 register should be set to “11” respectively.
The Timer/Counter Mode operates in an identical way to the Compare Match Output Mode
generating the same interrupt flags. The exception is that in the Timer/Counter Mode the STM
output pin is not used. Therefore the above description and Timing Diagrams for the Compare
Match Output Mode can be used to understand its function. As the STM output pin is not used in
this mode, the pin can be used as a normal I/O pin or other pin-shared function.
PWM Output Mode
To select this mode, bits STM1 and STM0 in the STMC1 register should be set to “10” respectively
and also the STIO1 and STIO0 bits should be set to “10” respectively. The PWM function within
the STM is useful for applications which require functions such as motor control, heating control,
illumination control etc. By providing a signal of fixed frequency but of varying duty cycle on the
STM output pin, a square wave AC waveform can be generated with varying equivalent DC RMS
values.
As both the period and duty cycle of the PWM waveform can be controlled, the choice of generated
waveform is extremely flexible. In the PWM mode, the STCCLR bit has no effect as the PWM
period. Both of the CCRA and CCRP registers are used to generate the PWM waveform, one register
is used to clear the internal counter and thus control the PWM waveform frequency, while the other
one is used to control the duty cycle. Which register is used to control either frequency or duty cycle
is determined using the STDPX bit in the STMC1 register. The PWM waveform frequency and duty
cycle can therefore be controlled by the values in the CCRA and CCRP registers.
An interrupt flag, one for each of the CCRA and CCRP, will be generated when a compare match
occurs from either Comparator A or Comparator P. The STOC bit in the STMC1 register is used to
select the required polarity of the PWM waveform while the two STIO1 and STIO0 bits are used to
enable the PWM output or to force the STM output pin to a fixed high or low level. The STPOL bit
is used to reverse the polarity of the PWM output waveform.
• 16-bit STM, PWM Output Mode, Edge-aligned Mode, STDPX=0
CCRP
1~255
0
Period
CCRP×256
65536
Duty
CCRA
If fSYS = 16MHz, TM clock source is fSYS/4, CCRP = 2 and CCRA = 128,
The STM PWM output frequency = (fSYS/4) / (2×256) = fSYS / 2048 = 7.8125 kHz,
duty = 128 / (2×256) = 25%.
If the Duty value defined by the CCRA register is equal to or greater than the Period value, then the
PWM output duty is 100%.
• 16-bit STM, PWM Output Mode, Edge-aligned Mode, STDPX=1
CCRP
1~255
Period
0
CCRA
Duty
CCRP×256
65536
The PWM output period is determined by the CCRA register value together with the TM clock
while the PWM duty cycle is defined by the CCRP register value except when the CCRP value is
equal to “0”.
Rev. 1.10
95
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Co�nte� Val�e
STDPX = 0; STM [1:0] = 10
Co�nte� clea�ed b�
CCRP
Co�nte� Reset when
STON �et��ns high
CCRP
Pa�se
Res�me
Co�nte� Stop if
STON bit low
CCRA
Time
STON
STPAU
STPOL
CCRA Int. flag
STMAF
CCRP Int. flag
STMPF
STM O/P Pin
(STOC=1)
STM O/P Pin
(STOC=0)
PWM D�t� C�cle
set b� CCRA
PWM Pe�iod
set b� CCRP
PWM �es�mes
ope�ation
O�tp�t cont�olled b�
othe� pin-sha�ed f�nction O�tp�t Inve�ts
when STPOL = 1
PWM Output Mode – STDPX=0
Note: 1. Here STDPX=0 – Counter cleared by CCRP
2. A counter clear sets the PWM Period
3. The internal PWM function continues running even when STIO [1:0]=00 or 01
4. The STCCLR bit has no influence on PWM operation
Rev. 1.10
96
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Co�nte� Val�e
STDPX = 1; STM [1:0] = 10
Co�nte� clea�ed b�
CCRA
Co�nte� Reset when
STON �et��ns high
CCRA
Pa�se
Res�me
Co�nte� Stop if
STON bit low
CCRP
Time
STON
STPAU
STPOL
CCRP Int.
flag STMPF
CCRA Int.
flag STMAF
STM O/P Pin
(STOC=1)
STM O/P Pin
(STOC=0)
PWM �es�mes
ope�ation
O�tp�t cont�olled b�
O�tp�t Inve�ts
othe� pin-sha�ed f�nction
when STPOL = 1
PWM Pe�iod set b� CCRA
PWM D�t� C�cle
set b� CCRP
PWM Output Mode – STDPX=1
Note: 1. Here STDPX=1 – Counter cleared by CCRA
2. A counter clear sets the PWM Period
3. The internal PWM function continues even when STIO [1:0]=00 or 01
4. The STCCLR bit has no influence on PWM operation
Rev. 1.10
97
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Single Pulse Output Mode
To select this mode, bits STM1 and STM0 in the STMC1 register should be set to “10” respectively
and also the STIO1 and STIO0 bits should be set to “11” respectively. The Single Pulse Output
Mode, as the name suggests, will generate a single shot pulse on the STM output pin.
The trigger for the pulse output leading edge is a low to high transition of the STON bit, which can
be implemented using the application program. However in the Single Pulse Mode, the STON bit
can also be made to automatically change from low to high using the external STCK pin, which will
in turn initiate the Single Pulse output. When the STON bit transitions to a high level, the counter
will start running and the pulse leading edge will be generated. The STON bit should remain high
when the pulse is in its active state. The generated pulse trailing edge will be generated when the
STON bit is cleared to “0”, which can be implemented using the application program or when a
compare match occurs from Comparator A.
However a compare match from Comparator A will also automatically clear the STON bit and
thus generate the Single Pulse output trailing edge. In this way the CCRA value can be used to
control the pulse width. A compare match from Comparator A will also generate a STM interrupt.
The counter can only be reset back to “0” when the STON bit changes from low to high when the
counter restarts. In the Single Pulse Mode CCRP is not used. The STCCLR and STDPX bits are not
used in this Mode.
CCRA
Leading Edge
CCRA
T�ailing Edge
STON bit
0→1
STON bit
1→0
S/W Command SET "STON"
o�
STCK Pin T�ansition
S/W Command CLR "STON"
o�
CCRA Compa�e Match
STP O�tp�t Pin
P�lse Width = CCRA Val�e
Single Pulse Generation
Rev. 1.10
98
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Body Fat Measurment Flash MCU
Co�nte� Val�e
STM [1:0] = 10 ; STIO [1:0] = 11
Co�nte� stopped b�
CCRA
Co�nte� Reset when
STON �et��ns high
CCRA
Pa�se
Co�nte� Stops
b� softwa�e
Res�me
CCRP
Time
STON
Softwa�e
T�igge�
Clea�ed b�
CCRA match
A�to. set b�
STCK pin
STCK pin
Softwa�e
T�igge�
Softwa�e
Softwa�e T�igge�
Clea�
Softwa�e
T�igge�
STCK pin
T�igge�
STPAU
STPOL
No CCRP
Inte���pts
gene�ated
CCRP Int.
Flag STMPF
CCRA Int.
Flag STMAF
STM O/P Pin
(STOC=1)
STM O/P Pin
(STOC=0)
O�tp�t Inve�ts
when STPOL = 1
P�lse Width
set b� CCRA
Single Pulse Mode
Note: 1. Counter stopped by CCRA
2. CCRP is not used
3. The pulse triggered by the STCK pin or by setting the STON bit high
4. A STCK pin active edge will automatically set the STON bit high.
5. In the Single Pulse Mode, STIO [1:0] must be set to “11” and can not be changed.
Rev. 1.10
99
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Body Fat Measurment Flash MCU
Capture Input Mode
To select this mode bits STM1 and STM0 in the STMC1 register should be set to “01” respectively.
This mode enables external signals to capture and store the present value of the internal counter
and can therefore be used for applications such as pulse width measurements. The external signal
is supplied on the STPI pin, whose active edge can be a rising edge, a falling edge or both rising
and falling edges; the active edge transition type is selected using the STIO1 and STIO0 bits in
the STMC1 register. The counter is started when the STON bit changes from low to high which is
initiated using the application program.
When the required edge transition appears on the STPI pin the present value in the counter will be
latched into the CCRA registers and a STM interrupt generated. Irrespective of what events occur
on the STPI pin the counter will continue to free run until the STON bit changes from high to low.
When a CCRP compare match occurs the counter will reset back to zero; in this way the CCRP
value can be used to control the maximum counter value. When a CCRP compare match occurs
from Comparator P, a STM interrupt will also be generated. Counting the number of overflow
interrupt signals from the CCRP can be a useful method in measuring long pulse widths. The STIO1
and STIO0 bits can select the active trigger edge on the STPI pin to be a rising edge, falling edge or
both edge types. If the STIO1 and STIO0 bits are both set high, then no capture operation will take
place irrespective of what happens on the STPI pin, however it must be noted that the counter will
continue to run. The STCCLR and STDPX bits are not used in this Mode.
Rev. 1.10
100
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BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Co�nte� Val�e
STM [1:0] = 01
Co�nte� clea�ed b�
CCRP
Co�nte� Co�nte�
Stop
Reset
CCRP
YY
Pa�se
Res�me
XX
Time
STON
STPAU
Active
edge
Active
edge
Active
edge
STM capt��e
pin STPI
CCRA Int.
Flag STMAF
CCRP Int. Flag
STMPF
CCRA
Val�e
STIO [1:0]
Val�e
XX
00 – Rising edge
YY
01 – Falling edge
XX
10 – Both edges
YY
11 – Disable Capt��e
Capture Input Mode
Note: 1. STM [1:0]=01 and active edge set by the STIO [1:0] bits
2. A STM Capture input pin active edge transfers the counter value to CCRA
3. STCCLR bit not used
4. No output function − STOC and STPOL bits are not used
5. CCRP determines the counter value and the counter has a maximum count value when CCRP is equal to “0”.
Rev. 1.10
101
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BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Periodic Type TM – PTM
The Periodic Type TM contains five operating modes, which are Compare Match Output, Timer/
Event Counter, Capture Input, Single Pulse Output and PWM Output modes. The Periodic TM can
be controlled with two external input pins and can drive one or two external output pins.
CCRP
fSYS/�
000
fSYS
001
fH/16
010
fH/6�
011
fSUB
100
fSUB
101
10-bit Compa�ato� P
10-bit Co�nt-�p Co�nte�
PTnON
PTnPAU
Co�nte� Clea�
0
1
PTnCCLR
b0~b9
111
10-bit Compa�ato� A
PTnCK�~PTnCK0
PxSn
PTMnPF Inte���pt
PTnOC
b0~b9
110
Pin Cont�ol
PTCKn
Compa�ato� P Match
O�tp�t
Cont�ol
PTnM1� PTnM0 PTnPOL
PTnIO1� PTnIO0
Compa�ato� A Match
IFSn
CCRA
Pola�it�
Cont�ol
PTPn
Pin
Cont�ol
PTPnB
PxSn
PTMnAF Inte���pt
PTnIO1� PTnIO0
PTnCAPTS
Edge Detecto�
0
1
PxSn
IFSn
Pin Cont�ol
PTPnI
Note: The PTPnB pin only exists when n=0.
Periodic Type TM Block Diagram (n=0, 1 or 2)
Periodic TM Operation
The Periodic Type TM core is a 10-bit count-up counter which is driven by a user selectable internal
or external clock source. There are also two internal comparators with the names, Comparator A
and Comparator P. These comparators will compare the value in the counter with CCRP and CCRA
registers. The CCRP comparator is 10-bit wide.
The only way of changing the value of the 10-bit counter using the application program, is to
clear the counter by changing the PTnON bit from low to high. The counter will also be cleared
automatically by a counter overflow or a compare match with one of its associated comparators.
When these conditions occur, a PTMn interrupt signal will also usually be generated. The Periodic
Type TM can operate in a number of different operational modes, can be driven by different clock
sources including an input pin and can also control more than one output pin. All operating setup
conditions are selected using relevant internal registers.
Periodic Type TM Register Description
Overall operation of the Periodic Type TM is controlled using a series of registers. A read only
register pair exists to store the internal counter 10-bit value, while two read/write register pairs exist
to store the internal 10-bit CCRA value and CCRP value. The remaining two registers are control
registers which setup the different operating and control modes.
Register
Name
Bit
7
6
5
4
3
PTMnC0
PTnPAU PTnCK2 PTnCK1 PTnCK0 PTnON
PTMnC1
PTnM1
PTnM0
PTnIO1
PTnIO0
PTMnDL
D7
D6
D5
D4
2
1
0
—
—
—
PTnOC PTnPOL PTnCAPTS
D3
PTnCCLR
D2
D1
D0
PTMnDH
—
—
—
—
—
—
D9
D8
PTMnAL
D7
D6
D5
D4
D3
D2
D1
D0
PTMnAH
—
—
—
—
—
—
D9
D8
PTMnRPL
D7
D6
D5
D4
D3
D2
D1
D0
PTMnRPH
—
—
—
—
—
—
D9
D8
10-bit Periodic TM Register List (n=0, 1 or 2)
Rev. 1.10
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January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
PTMnC0 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
PTnPAU
PTnCK2
PTnCK1
PTnCK0
PTnON
—
—
—
R/W
R/W
R/W
R/W
R/W
R/W
—
—
—
POR
0
0
0
0
0
—
—
—
Bit 7
PTnPAU: PTMn Counter Pause Control
0: Run
1: Pause
The counter can be paused by setting this bit high. Clearing the bit to zero restores
normal counter operation. When in a Pause condition the PTMn will remain powered
up and continue to consume power. The counter will retain its residual value when
this bit changes from low to high and resume counting from this value when the bit
changes to a low value again.
Bit 6~4
PTnCK2~PTnCK0: Select PTMn Counter Clock
000: fSYS/4
001: fSYS
010: fH/16
011: fH/64
100: fSUB
101: fSUB
110: PTCKn rising edge clock
111: PTCKn falling edge clock
These three bits are used to select the clock source for the PTMn. The external pin
clock source can be chosen to be active on the rising or falling edge. The clock source
fSYS is the system clock, while fH and fSUB are other internal clocks, the details of which
can be found in the oscillator section.
Bit 3
PTnON: PTMn Counter On/Off Control
0: Off
1: On
This bit controls the overall on/off function of the PTMn. Setting the bit high enables
the counter to run, clearing the bit disables the PTMn. Clearing this bit to zero will
stop the counter from counting and turn off the PTMn which will reduce its power
consumption. When the bit changes state from low to high the internal counter value
will be reset to zero, however when the bit changes from high to low, the internal
counter will retain its residual value until the bit returns high again.
If the PTMn is in the Compare Match Output Mode, PWM output Mode or Single
Pulse Output Mode then the PTMn output pin will be reset to its initial condition, as
specified by the PTnOC bit, when the PTnON bit changes from low to high.
Bit 2~0
Unimplemented, read as “0”
103
January 04, 2018
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Body Fat Measurment Flash MCU
PTMnC1 Register
Rev. 1.10
Bit
7
6
5
4
3
Name
PTnM1
PTnM0
PTnIO1
PTnIO0
PTnOC
2
1
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
PTnPOL PTnCAPTS PTnCCLR
Bit 7~6
PTnM1~PTnM0: Select PTMn Operating Mode
00: Compare Match Output Mode
01: Capture Input Mode
10: PWM Mode or Single Pulse Output Mode
11: Timer/Counter Mode
These bits setup the required operating mode for the PTMn. To ensure reliable
operation the PTMn should be switched off before any changes are made to the
PTnM1 and PTnM0 bits. In the Timer/Counter Mode, the PTMn output pin state is
undefined.
Bit 5~4
PTnIO1~PTnIO0: Select PTMn External Pin (PTPn or PTPnI/PTCKn) Function
Compare Match Output Mode
00: No change
01: Output low
10: Output high
11: Toggle output
PWM Output Mode/Single Pulse Output Mode
00: PWM Output inactive state
01: PWM Output active state
10: PWM output
11: Single pulse output
Capture Input Mode
00: Input capture at rising edge of PTPnI or PTCKn
01: Input capture at falling edge of PTPnI or PTCKn
10: Input capture at falling/rising edge of PTPnI or PTCKn
11: Input capture disabled
Timer/Counter Mode
Unused
These two bits are used to determine how the PTMn output pin changes state when a
certain condition is reached. The function that these bits select depends upon in which
mode the PTMn is running.
In the Compare Match Output Mode, the PTnIO1 and PTnIO0 bits determine how the
PTMn output pin changes state when a compare match occurs from the Comparator A.
The PTMn output pin can be setup to switch high, switch low or to toggle its present
state when a compare match occurs from the Comparator A. When the bits are both
zero, then no change will take place on the output. The initial value of the PTMn
output pin should be setup using the PTnOC bit in the PTMnC1 register. Note that
the output level requested by the PTnIO1 and PTnIO0 bits must be different from the
initial value setup using the PTnOC bit otherwise no change will occur on the PTMn
output pin when a compare match occurs. After the PTMn output pin changes state,
it can be reset to its initial level by changing the level of the PTnON bit from low to
high.
In the PWM Output Mode, the PTnIO1 and PTnIO0 bits determine how the PTMn
output pin changes state when a certain compare match condition occurs. The PWM
output function is modified by changing these two bits. It is necessary to only change
the values of the PTnIO1 and PTnIO0 bits only after the TM has been switched off.
Unpredictable PWM outputs will occur if the PTnIO1 and PTnIO0 bits are changed
when the PTMn is running.
104
January 04, 2018
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Bit 3
PTnOC: PTMn PTPn Output Control bit
Compare Match Output Mode
0: Initial low
1: Initial high
PWM Output Mode/Single Pulse Output Mode
0: Active low
1: Active high
This is the output control bit for the PTMn output pin. Its operation depends upon
whether PTMn is being used in the Compare Match Output Mode or in the PWM
Mode/Single Pulse Output Mode. It has no effect if the PTMn is in the Timer/Counter
Mode. In the Compare Match Output Mode it determines the logic level of the PTMn
output pin before a compare match occurs. In the PWM Mode it determines if the
PWM signal is active high or active low.
Bit 2
PTnPOL: PTMn PTPn Output Polarity Control
0: Non-invert
1: Invert
This bit controls the polarity of the PTPn output pin. When the bit is set high the
PTMn output pin will be inverted and not inverted when the bit is zero. It has no effect
if the PTMn is in the Timer/Counter Mode.
Bit 1
PTnCAPTS: PTMn Capture Trigger Source Selection
0: From PTPnI pin
1: From PTCKn pin
Bit 0
PTnCCLR: Select PTMn Counter Clear Condition
0: PTMn Comparator P match
1: PTMn Comparator A match
This bit is used to select the method which clears the counter. Remember that the
Periodic TM contains two comparators, Comparator A and Comparator P, either of
which can be selected to clear the internal counter. With the PTnCCLR bit set high,
the counter will be cleared when a compare match occurs from the Comparator A.
When the bit is low, the counter will be cleared when a compare match occurs from
the Comparator P or with a counter overflow. A counter overflow clearing method can
only be implemented if the CCRP bits are all cleared to zero. The PTnCCLR bit is not
used in the PWM Output Mode, Single Pulse Output or Capture Input Mode.
PTMnDL Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R
R
R
R
R
R
R
R
POR
0
0
0
0
0
0
0
0
Bit 7~0
D7~D0: PTMn Counter Low Byte Register bit 7~bit 0
PTMn 10-bit Counter bit 7~bit 0
PTMnDH Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
—
—
D9
D8
R/W
—
—
—
—
—
—
R
R
POR
—
—
—
—
—
—
0
0
Bit 7~2
Unimplemented, read as “0”
Bit 1~0
D9~D8: PTMn Counter High Byte Register bit 1~bit 0
PTMn 10-bit Counter bit 9~bit 8
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January 04, 2018
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PTMnAL Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
D7~D0: PTMn CCRA Low Byte Register bit 7~bit 0
PTMn 10-bit CCRA bit 7~bit 0
PTMnAH Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
—
—
D9
D8
R/W
—
—
—
—
—
—
R/W
R/W
POR
—
—
—
—
—
—
0
0
Bit 7~2
Unimplemented, read as “0”
Bit 1~0
D9~D8: PTMn CCRA High Byte Register bit 1~bit 0
PTMn 10-bit CCRA bit 9~bit 8
PTMnRPL Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
D7~D0: PTMn CCRP Low Byte Register bit 7~bit 0
PTMn 10-bit CCRP bit 7~bit 0
PTMnRPH Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
—
—
D9
D8
R/W
—
—
—
—
—
—
R/W
R/W
POR
—
—
—
—
—
—
0
0
Bit 7~2
Unimplemented, read as “0”
Bit 1~0
D9~D8: PTMn CCRP High Byte Register bit 1~bit 0
PTMn 10-bit CCRP bit 9~bit 8
106
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Periodic Type TM Operating Modes
The Periodic Type TM can operate in one of five operating modes, Compare Match Output Mode,
PWM Output Mode, Single Pulse Output Mode, Capture Input Mode or Timer/Counter Mode. The
operating mode is selected using the PTnM1 and PTnM0 bits in the PTMnC1 register.
Compare Output Mode
To select this mode, bits PTnM1 and PTnM0 in the PTMnC1 register, should be set to “00”
respectively. In this mode once the counter is enabled and running it can be cleared by three
methods. These are a counter overflow, a compare match from Comparator A and a compare match
from Comparator P. When the PTnCCLR bit is low, there are two ways in which the counter can be
cleared. One is when a compare match from Comparator P, the other is when the CCRP bits are all
zero which allows the counter to overflow. Here both PTMnAF and PTMnPF interrupt request flags
for Comparator A and Comparator P respectively, will both be generated.
If the PTnCCLR bit in the PTMnC1 register is high then the counter will be cleared when a compare
match occurs from Comparator A. However, here only the PTMnAF interrupt request flag will
be generated even if the value of the CCRP bits is less than that of the CCRA registers. Therefore
when PTnCCLR is high no PTMnPF interrupt request flag will be generated. In the Compare Match
Output Mode, the CCRA can not be cleared to “0”.
If the CCRA bits are all zero, the counter will overflow when its reaches its maximum 10-bit, 3FF
Hex, value, however here the PTMnAF interrupt request flag will not be generated.
As the name of the mode suggests, after a comparison is made, the PTMn output pin, will change
state. The PTMn output pin condition however only changes state when a PTMnAF interrupt request
flag is generated after a compare match occurs from Comparator A. The PTMnPF interrupt request
flag, generated from a compare match occurs from Comparator P, will have no effect on the PTMn
output pin. The way in which the PTMn output pin changes state are determined by the condition of
the PTnIO1 and PTnIO0 bits in the PTMnC1 register. The PTMn output pin can be selected using
the PTnIO1 and PTnIO0 bits to go high, to go low or to toggle from its present condition when a
compare match occurs from Comparator A. The initial condition of the PTMn output pin, which is
setup after the PTnON bit changes from low to high, is setup using the PTnOC bit. Note that if the
PTnIO1 and PTnIO0 bits are zero then no pin change will take place.
Rev. 1.10
107
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Co�nte� ove�flow
Co�nte� Val�e
0x3FF
PTnCCLR = 0; PTnM [1:0] = 00
CCRP > 0
Co�nte� clea�ed b� CCRP val�e
CCRP=0
CCRP > 0
Co�nte�
Resta�t
Res�me
CCRP
Pa�se
CCRA
Stop
Time
PTnON
PTnPAU
PTnPOL
CCRP Int. Flag
PTMnPF
CCRA Int. Flag
PTMnAF
PTMn O/P Pin
O�tp�t pin set to
initial Level Low if
PTnOC=0
O�tp�t not affected b�
PTMnAF flag. Remains High
�ntil �eset b� PTnON bit
O�tp�t Toggle
with PTMnAF flag
He�e PTnIO [1:0] = 11
Toggle O�tp�t select
Note PTnIO [1:0] = 10
Active High O�tp�t select
O�tp�t Inve�ts when
PTnPOL is high
O�tp�t Pin
Reset to Initial val�e
O�tp�t cont�olled b� othe�
pin-sha�ed f�nction
Compare Match Output Mode – PTnCCLR=0 (n=0, 1 or 2)
Note: 1. With PTnCCLR=0 a Comparator P match will clear the counter
2. The PTMn output pin is controlled only by the PTMnAF flag
3. The output pin is reset to its initial state by a PTnON bit rising edge
Rev. 1.10
108
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Co�nte� Val�e
PTnCCLR = 1; PTnM [1:0] = 00
CCRA = 0
Co�nte� ove�flow
CCRA > 0 Co�nte� clea�ed b� CCRA val�e
0x3FF
CCRA=0
Res�me
CCRA
Pa�se
Stop
Co�nte� Resta�t
CCRP
Time
PTnON
PTnPAU
PTnPOL
No PTMnAF flag
gene�ated on
CCRA ove�flow
CCRA Int.
Flag PTMnAF
CCRP Int.
Flag PTMnPF
PTMn O/P
Pin
PTMnPF not
gene�ated
O�tp�t pin set to
initial Level Low if
PTnOC=0
O�tp�t does
not change
O�tp�t Toggle
with PTMnAF flag
He�e PTnIO [1:0] = 11
Toggle O�tp�t select
O�tp�t not affected b�
PTMnAF flag. Remains High
�ntil �eset b� PTnON bit
Note PTnIO [1:0] = 10
Active High O�tp�t select
O�tp�t Inve�ts
when PTnPOL is high
O�tp�t Pin
Reset to Initial val�e
O�tp�t cont�olled b�
othe� pin-sha�ed f�nction
Compare Match Output Mode – PTnCCLR=1 (n=0, 1 or 2)
Note: 1. With PTnCCLR=1 a Comparator A match will clear the counter
2. The PTMn output pin is controlled only by the PTMnAF flag
3. The output pin is reset to its initial state by a PTnON bit rising edge
4. A PTMnPF flag is not generated when PTnCCLR=1
Rev. 1.10
109
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Timer/Counter Mode
To select this mode, bits PTnM1 and PTnM0 in the PTMnC1 register should be set to “11”
respectively. The Timer/Counter Mode operates in an identical way to the Compare Match Output
Mode generating the same interrupt flags. The exception is that in the Timer/Counter Mode the
PTMn output pin is not used. Therefore the above description and Timing Diagrams for the Compare
Match Output Mode can be used to understand its function. As the PTMn output pin is not used in
this mode, the pin can be used as a normal I/O pin or other pin-shared function.
PWM Output Mode
To select this mode, bits PTnM1 and PTnM0 in the PTMnC1 register should be set to “10”
respectively. The PWM function within the PTMn is useful for applications which require functions
such as motor control, heating control, illumination control etc. By providing a signal of fixed
frequency but of varying duty cycle on the PTMn output pin, a square wave AC waveform can be
generated with varying equivalent DC RMS values.
As both the period and duty cycle of the PWM waveform can be controlled, the choice of generated
waveform is extremely flexible. In the PWM Output Mode, the PTnCCLR bit has no effect on the
PWM operation. Both of the CCRA and CCRP registers are used to generate the PWM waveform,
one register is used to clear the internal counter and thus control the PWM waveform frequency,
while the other one is used to control the duty cycle. The PWM waveform frequency and duty cycle
can therefore be controlled by the values in the CCRA and CCRP registers.
An interrupt flag, one for each of the CCRA and CCRP, will be generated when a compare match
occurs from either Comparator A or Comparator P. The PTnOC bit in the PTMnC1 register is used
to select the required polarity of the PWM waveform while the two PTnIO1 and PTnIO0 bits are
used to enable the PWM output or to force the PTMn output pin to a fixed high or low level. The
PTnPOL bit is used to reverse the polarity of the PWM output waveform.
• 10-bit PTMn, PWM Output Mode, Edge-aligned Mode
CCRP
1~1023
0
Period
1~1023
1024
Duty
CCRA
If fSYS=12MHz, PTMn clock source select fSYS/4, CCRP=512 and CCRA=128,
The PTMn PWM output frequency=(fSYS/4)/512=fSYS/2048=5.8594kHz, duty=128/512=25%.
If the Duty value defined by the CCRA register is equal to or greater than the Period value, then the
PWM output duty is 100%.
Rev. 1.10
110
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Co�nte� Val�e
PTnM [1:0] = 10
Co�nte� clea�ed b�
CCRP
Co�nte� Reset when
PTnON �et��ns high
CCRP
Pa�se
Res�me
Co�nte� Stop if
PTnON bit low
CCRA
Time
PTnON
PTnPAU
PTnPOL
CCRA Int. Flag
PTMnAF
CCRP Int. Flag
PTMnPF
PTMn O/P Pin
(PTnOC=1)
PTMn O/P Pin
(PTnOC=0)
PWM D�t� C�cle
set b� CCRA
PWM �es�mes
ope�ation
O�tp�t cont�olled b�
othe� pin-sha�ed f�nction
PWM Pe�iod set b� CCRP
O�tp�t Inve�ts
When PTnPOL = 1
PWM Output Mode (n=0, 1 or 2)
Note: 1. Counter cleared by CCRP
2. A counter clear sets the PWM Period
3. The internal PWM function continues running even when PTnIO[1:0]=00 or 01
4. The PTnCCLR bit has no influence on PWM operation
Rev. 1.10
111
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Single Pulse Output Mode
To select this mode, bits PTnM1 and PTnM0 in the PTMnC1 register should be set to “10”
respectively and also the PTnIO1 and PTnIO0 bits should be set to “11” respectively. The Single
Pulse Output Mode, as the name suggests, will generate a single shot pulse on the PTMn output pin.
The trigger for the pulse output leading edge is a low to high transition of the PTnON bit, which
can be implemented using the application program. However in the Single Pulse Mode, the PTnON
bit can also be made to automatically change from low to high using the external PTCKn pin,
which will in turn initiate the Single Pulse output. When the PTnON bit transitions to a high level,
the counter will start running and the pulse leading edge will be generated. The PTnON bit should
remain high when the pulse is in its active state. The generated pulse trailing edge will be generated
when the PTnON bit is cleared to “0”, which can be implemented using the application program or
when a compare match occurs from Comparator A.
However a compare match from Comparator A will also automatically clear the PTnON bit and
thus generate the Single Pulse output trailing edge. In this way the CCRA value can be used to
control the pulse width. A compare match from Comparator A will also generate a PTMn interrupt.
The counter can only be reset back to “0” when the PTnON bit changes from low to high when the
counter restarts. In the Single Pulse Output Mode CCRP is not used. The PTnCCLR bit is not used
in this Mode.
CCRA
Leading Edge
CCRA
Trailing Edge
PTnON bit
0→1
PTnON bit
1→0
S/W Command SET "PTnON"
or
PTCKn Pin Transition
S/W Command CLR "PTnON"
or
CCRA Compare Match
PTPn Output Pin
Pulse Width = CCRA Value
Single Pulse Generation (n=0, 1 or 2)
Rev. 1.10
112
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Co�nte� Val�e
PTnM [1:0] = 10 ; PTnIO [1:0] = 11
Co�nte� stopped b�
CCRA
Co�nte� Reset when
PTnON �et��ns high
CCRA
Pa�se
Co�nte� Stops b�
softwa�e
Res�me
CCRP
Time
PTnON
Softwa�e
T�igge�
A�to. set b�
PTCKn pin
Clea�ed b�
CCRA match
Softwa�e
T�igge�
Softwa�e
T�igge�
Softwa�e
Clea�
Softwa�e
T�igge�
PTCKn pin
PTCKn pin
T�igge�
PTnPAU
PTnPOL
No CCRP Inte���pts
gene�ated
CCRP Int. Flag
PTMnPF
CCRA Int. Flag
PTMnAF
PTMn O/P Pin
(PTnOC=1)
PTMn O/P Pin
(PTnOC=0)
O�tp�t Inve�ts
when PTnPOL = 1
P�lse Width
set b� CCRA
Single Pulse Output Mode (n=0, 1 or 2)
Note: 1. Counter stopped by CCRA
2. CCRP is not used
3. The pulse is triggered by the PTCKn pin or by setting the PTnON bit high
4. A PTCKn pin active edge will automatically set the PTnON bit high
5. In the Single Pulse Output Mode, PTnIO[1:0] must be set to “11” and cannot be changed.
Rev. 1.10
113
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Capture Input Mode
To select this mode bits PTnM1 and PTnM0 in the PTMnC1 register should be set to “01”
respectively. This mode enables external signals to capture and store the present value of the internal
counter and can therefore be used for applications such as pulse width measurements. The external
signal is supplied on the PTPnI or PTCKn pin which is selected using the PTnCAPTS bit in the
PTMnC1 register. The input pin active edge can be either a rising edge, a falling edge or both rising
and falling edges; the active edge transition type is selected using the PTnIO1 and PTnIO0 bits in
the PTMnC1 register. The counter is started when the PTnON bit changes from low to high which is
initiated using the application program.
When the required edge transition appears on the PTPnI or PTCKn pin the present value in the
counter will be latched into the CCRA registers and a PTMn interrupt generated. Irrespective
of what events occur on the PTPnI or PTCKn pin, the counter will continue to free run until the
PTnON bit changes from high to low. When a CCRP compare match occurs the counter will reset
back to “0”; in this way the CCRP value can be used to control the maximum counter value. When a
CCRP compare match occurs from Comparator P, a PTMn interrupt will also be generated. Counting
the number of overflow interrupt signals from the CCRP can be a useful method in measuring
long pulse widths. The PTnIO1 and PTnIO0 bits can select the active trigger edge on the PTPnI or
PTCKn pin to be a rising edge, falling edge or both edge types. If the PTnIO1 and PTnIO0 bits are
both set high, then no capture operation will take place irrespective of what happens on the PTPnI or
PTCKn pin, however it must be noted that the counter will continue to run.
As the PTPnI or PTCKn pin is pin shared with other functions, care must be taken if the PTMn is in
the Capture Input Mode. This is because if the pin is setup as an output, then any transitions on this
pin may cause an input capture operation to be executed. The PTnCCLR, PTnOC and PTnPOL bits
are not used in this Mode.
Rev. 1.10
114
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Co�nte� Val�e
PTnM[1:0] = 01
Co�nte� clea�ed b�
CCRP
Co�nte�
Stop
Co�nte�
Reset
CCRP
Res�me
YY
Pa�se
XX
Time
PTnON
PTnPAU
Active
edge
Active
edge
Active edge
PTMn Capt��e Pin
PTPnI o� PTCKn
CCRA Int.
Flag PTMnAF
CCRP Int.
Flag PTMnPF
CCRA Val�e
PTnIO [1:0] Val�e
XX
00 - Rising edge
YY
01 - Falling edge
XX
10 - Both edges
YY
11 - Disable Capt��e
Capture Input Mode (n=0, 1 or 2)
Note: 1. PTnM[1:0]=01 and active edge set by the PTnIO[1:0] bits
2. A PTMn Capture input pin active edge transfers the counter value to CCRA
3. PTnCCLR bit not used
4. No output function – PTnOC and PTnPOL bits are not used
5. CCRP determines the counter value and the counter has a maximum count value when CCRP is equal to “0”.
Rev. 1.10
115
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Analog to Digital Converter – ADC
The need to interface to real world analog signals is a common requirement for many electronic
systems. However, to properly process these signals by a microcontroller, they must first be
converted into digital signals by A/D converters. By integrating the A/D conversion electronic
circuitry into the microcontroller, the need for external components is reduced significantly with the
corresponding follow-on benefits of lower costs and reduced component space requirements.
A/D Overview
Each device contains a high accuracy multi-channel 24-bit Delta Sigma Analog-to-Digital Converter
which can directly interface to external analog signals, such as that from sensors or other control
signals and convert these signals directly into a 24-bit digital value.
In addition, the PGA gain control, A/D converter gain control and A/D converter reference gain
control determine the amplification gain for A/D converter input signal. The designer can select
the best gain combination for the desired amplification applied to the input signal. The following
block diagram illustrates the A/D converter basic operational function. The A/D converter input
channel can be arranged as four single-ended A/D input channels or two differential input channels.
The input signal can be amplified by PGA before entering the 24-bit Delta Sigma A/D converter.
The Delta Sigma A/D converter modulator will output one bit converted data to SINC filter which
can transform the converted one-bit data to 24 bits and store them into the specific data registers.
Additionally, the devices also provide a temperature sensor to compensate the A/D converter
deviation caused by the temperature. With high accuracy and performance, the devices are very
suitable for the Weight Scale related products.
Internal Power Supply
Each device contains an LDO and VCM for the regulated power supply. The accompanying block
diagram illustrates the basic functional operation. The internal LDO can provide the fixed voltage
for PGA, A/D converter or the external components; as well the VCM can be used as the reference
voltage for A/D converter module. There are four LDO voltage levels, 2.4V, 2.6V, 2.9V or 3.3V,
decided by LDOVS1~LDOVS0 bits in the PWRC register, as well the VCM voltage is fixed at 1.25V.
The LDO and VCM functions can be controlled by the LDOEN bit and can be powered off to reduce
the power consumption. If the VCM is disabled, the VCM output pin is floating.
LDO
VIN
LDOEN
�.�V
�.6V
�.9V
3.3V
LDOBPS
VOREG
(S�ppl� voltage fo�
A/D conve�te� & PGA)
LDOVS[1:0]
VCM
ADOFF
1.�5V
VCM
(Common mode voltage fo�
A/D conve�te� & D/A conve�te�)
Internal Power Supply Block Diagram
Rev. 1.10
116
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Register bits
Output Voltage
ADOFF
LDOEN
Bandgap
VOREG
VCM
1
1
0
Off
Disable
Disable
1
On
Enable
Enable
0
0
On
Disable
Enable
0
1
On
Enable
Enable
Power Control Table
PWRC Register
Bit
7
6
5
4
3
2
1
0
Name
LDOEN
—
—
—
—
LDOBPS
LDOVS1
LDOVS0
R/W
R/W
—
—
—
—
R/W
R/W
R/W
POR
0
—
—
—
—
0
0
0
Bit 7
LDOEN: LDO function control bit
0: Disable
1: Enable
If the LDO is disabled, there will be no power consumption and LDO output will be in
a low level by a weakly pull-low resistor.
Bit 6~3
Unimplemented, read as “0”
Bit 2
LDOBPS: LDO Bypass function control bit
0: Disable
1: Enable
Bit 1~0
LDOVS1~LDOVS0: LDO output voltage selection
00: 2.4V
01: 2.6V
10: 2.9V
11: 3.3V
A/D Data Rate Definition
The Delta Sigma A/D converter data rate can be calculated using the following equation:
Data Rate 
fADCK
fMCLK /N
fMCLK


CHOP  OSR CHOP  OSR N  CHOP  OSR
fADCK: A/D clock input, derived from fMCLK/N
fMCLK: A/D clock source, derived from fSYS or fSYS/2/(ADCK+1) using the ADCK bit field.
N: a constant divided factor that can be equal to 30 or 12 determined by the FLMS bit field.
CHOP: Sampling data amount doubling function control and can be equal to 2 or 1 determined by
the FLMS bit field.
OSR: Oversampling rate determined by the ADOR field.
For example,if a data rate of 8Hz is desired,an fMCLK clock source with a frequency of 4MHz
A/D converter can be selected. Then set the FLMS field to “000” to obtain an “N” equal to 30 and
“CHOP” equal to 2. Finally, set the ADOR field to “001” to select an oversampling rate equal to
8192. Therefore, the Data Rate = 4MHz / (30 × 2 × 8192) = 8Hz.
Note that the A/D converter has a notch rejection function for an AC power supply with a frequency
of 50Hz or 60Hz when the data rate is equal to 10Hz.
Rev. 1.10
117
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
ADCK[4:0]
CHSP[3:0]
AN0
AN2
RFC
VCM
VTSOP
PGAGN=x1, x2, x4, x8,
x16, x32, x64, x128
INX
DI−
AN1
AN3
IN2
VCM
VTSON
ADOFF
ADSLP
ADRST
fADCK
SINC Filter
24
VREFGN = x1, x1/2, x1/4
INX[1:0]
REFP
VGS[1:0]
ADOR[2:0]
VRBUFP
A/D Converter
Interrupt
ADRH
ADRM
ADRL
ADCDL
REFN
PGS[2:0]
VIN VCM VOREG
ADOFF
EOC
24-bit ∆-Σ
A/D Converter
VCM
PGAON
CHSN[3:0]
DCSET[2:0]
ADGN = x1, x2, x4, x8
PGAOP
PGA
DI+
INIS
AGS[1:0]
ADOFF
IN1
fMCLK
Divider
fSYS
FLMS[2:0]
VRBUFN
DSDACVRS[1:0]
VREFS
VRP
0
VDACO
12-bit
D/A Converter
DSDAC[11:0]
VCM
1
VRN
0
VREFP
1
AVSS
VREFN
DSDACEN
A/D Converter Structure
A/D Converter Register Description
Overall operation of the A/D converter is controlled by using 13 registers. Three read only registers
exist to store the A/D converter data 24-bit value. A control register named as PWRC is used to control
the required bias and supply voltages for PGA and A/D converter and is described in the “Internal
Power Supply” section. Three registers are D/A converter control registers. The remaining 6 registers
are control registers which set up the gain selections and control functions of the A/D converter.
Register
Name
Bit
7
6
5
4
PGAC0
—
VGS1
VGS0
AGS1
PGAC1
—
INIS
INX1
INX0
PGACS
CHSN3
CHSN2
CHSN1
CHSN0
3
2
1
0
AGS0
PGS2
PGS1
PGS0
DCSET2 DCSET1 DCSET0
CHSP3
—
CHSP2
CHSP1
CHSP0
D0
ADRL
D7
D6
D5
D4
D3
D2
D1
ADRM
D15
D14
D13
D12
D11
D10
D9
D8
ADRH
D23
D22
D21
D20
D19
D18
D17
D16
ADCR0
ADRST
ADSLP
ADOFF
ADOR2
ADOR1
ADOR0
—
VREFS
ADCR1
FLMS2
FLMS1
FLMS0
VRBUFN
VRBUFP
ADCDL
EOC
—
—
—
—
ADCK4
ADCK3
ADCK2
ADCK1
ADCK0
DSDAH
D11
D10
D9
D8
D7
D6
D5
D4
DSDAL
—
—
—
—
D3
D2
D1
D0
DSDACEN
DSDACVRS1
DSDACVRS0
—
—
—
—
—
ADCS
DSDACC
A/D Converter Register List
Rev. 1.10
118
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Programmable Gain Amplifier – PGA
There are three registers related to the programmable gain control, PGAC0, PGAC1 and PGACS.
The PGAC0 resister is used to select the PGA gain, A/D converter gain and the A/D converter
reference gain. As well, the PGAC1 register is used to define the input connection and differential
input offset voltage adjustment control. In addition, The PGACS register is used to select the
input ends for the PGA. Therefore, the input channels have to be determined by the CHSP[3:0]
and CHSN[3:0] bits to determine which analog channel input pins, temperature detector inputs or
internal power supply are actually connected to the internal differential A/D converter.
PGAC0 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
—
VGS1
VGS0
AGS1
AGS0
PGS2
PGS1
PGS0
R/W
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
—
0
0
0
0
0
0
0
Bit 7
Unimplemented, read as “0”
Bit 6~5
VGS1~VGS0: REFP/REFN Differential Reference Voltage Gain Selection
00: VREFGN=1
01: VREFGN=1/2
10: VREFGN=1/4
11: Reserved
Bit 4~3
AGS1~AGS0: A/D Converter PGAOP/PGAON Differential Input Signal Gain
Selection
00: ADGN=1
01: ADGN=2
10: ADGN=4
11: ADGN=8
Bit 2~0
PGS2~PGS0: PGA DI+/DI- Differential Channel Input Gain Selection
000: PGAGN=1
001: PGAGN=2
010: PGAGN=4
011: PGAGN=8
100: PGAGN=16
101: PGAGN=32
110: PGAGN=64
111: PGAGN=128
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PGAC1 Register
Bit
7
6
5
4
3
2
1
0
Name
—
INIS
INX1
INX0
DCSET2
DCSET1
DCSET0
—
R/W
—
R/W
R/W
R/W
R/W
R/W
R/W
—
POR
—
0
0
0
0
0
0
—
Bit 7
Unimplemented, read as “0”
Bit 6
INIS: The Selected Input Ends, IN1 and IN2 Internal Connection Control Bit
0: Not connected
1: Connected
Bit 5~4
INX1, INX0: The Selected Input Ends, IN1/IN2 and the PGA Differential Input Ends,
DI+/DI- Connection Control Bits
INX[1,0]=00
Rev. 1.10
INX[1,0]=01
INX[1,0]=10
INX[1,0]=11
IN1
DI+
IN1
DI+
IN1
DI+
IN1
DI+
IN�
DI-
IN�
DI-
IN�
DI-
IN�
DI-
Bit 3~1
DCSET2~DCSET0: Differential Input Signal PGAOP/PGAON Offset Selection
000: DCSET = +0V
001: DCSET = +0.25×ΔVR_I
010: DCSET = +0.5×ΔVR_I
011: DCSET = +0.75×ΔVR_I
100: DCSET = +0V
101: DCSET = -0.25×ΔVR_I
110: DCSET = -0.5×ΔVR_I
111: DCSET = -0.75×ΔVR_I
The voltage, ΔVR_I, is the differential reference voltage which is amplified by specific
gain selection based on the selected inputs.
Bit 0
Unimplemented, read as “0”
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PGACS Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
CHSN3
CHSN2
CHSN1
CHSN0
CHSP3
CHSP2
CHSP1
CHSP0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~4
CHSN3~CHSN0: Negative Input End IN2 Selection
0000: AN1
0001: AN3
0010: Reserved
0011: Reserved
0100: Reserved
0101: VDACO
0110: VCM
0111: Temperature sensor output – VTSON
1xxx: Reserved
These bits are used to select the negative input, IN2. If the IN2 input is selected as
a single end input, the VCM voltage must be selected as the positive input on IN1 for
single end input applications. It is recommended that when the VTSON signal is selected
as the negative input, the VTSOP signal should be selected as the positive input for
proper operations.
Bit 3~0
CHSP3~CHSP0: Positive Input End IN1Selection
0000: AN0
0001: AN2
0010: Reserved
0011: Reserved
0100: Reserved
0101: VDACO
0110: VCM
0111: Temperature sensor output – VTSOP
1xxx: RFC
These bits are used to select the positive input, IN1. If the IN1 input is selected as a
single end input, the VCM voltage must be selected as the negative input on IN2 for
single end input applications. It is recommended that when the VTSOP signal is selected
as the positive input, the VTSON signal should be selected as the negative input for
proper operations
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D/A Converter Registers – DSDAH, DSDAL, DSDACC
There are three registers related to the D/A converter output control.
• DSDAH Register
Bit
7
6
5
4
3
2
1
0
Name
D11
D10
D9
D8
D7
D6
D5
D4
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~0
D11~D4: D/A Converter Output Control Code, Only for 12 bits D/A Converter
• DSDAL Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
D3
D2
D1
D0
R/W
—
—
—
—
R/W
R/W
R/W
R/W
POR
—
—
—
—
0
0
0
0
Bit 7~4
Unimplemented, read as “0”
Bit 3~0
D3~D0: D/A Converter Output Control Code
Note: writing this register only writes to shadow buffer, and until write DSDAH
register will also copy the shadow buffer data to DSDAL register.
• DSDACC Register
Bit
Name
Rev. 1.10
7
6
5
DSDACEN DSDACVRS1 DSDACVRS0
4
3
2
1
0
—
—
—
—
—
R/W
R/W
R/W
R/W
—
—
—
—
—
POR
0
0
0
—
—
—
—
—
Bit 7
DSDACEN: D/A Converter Enable or Disable Control Bit
0: Disable
1: Enable
Bit 6~5
DSDACVRS1~DSDACVRS0: D/A Converter Reference Voltage Selection
00: D/A converter reference voltage comes from VOREG
01: D/A converter reference voltage comes from VIN
1x: D/A converter reference voltage comes from VCM
Bit 4~0
Unimplemented, read as “0”
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A/D Converter Data Registers – ADRL, ADRM, ADRH
Each device contains an internal 24-bit Delta Sigma A/D Converter, it requires three data registers
to store the converted value. These are a high byte register, known as ADRH, a middle byte register,
known as ADRM, and a low byte register, known as ADRL. After the conversion process takes
place, these registers can be directly read by the microcontroller to obtain the digitised conversion
value. D0~D23 are the A/D conversion result data bits.
• ADRL Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R
R
R
R
R
R
R
R
POR
x
x
x
x
x
x
x
x
“x” unknown
Bit 7~0
D7~D0: A/D Conversion Data Register bit 7~bit 0
• ADRM Register
Bit
7
6
5
4
3
2
1
0
Name
D15
D14
D13
D12
D11
D10
D9
D8
R/W
R
R
R
R
R
R
R
R
POR
x
x
x
x
x
x
x
x
“x” unknown
Bit 7~0
D15~D8: A/D Conversion Data Register bit 15~bit 8
• ADRH Register
Bit
7
6
5
4
3
2
1
0
Name
D23
D22
D21
D20
D19
D18
D17
D16
R/W
R
R
R
R
R
R
R
R
POR
x
x
x
x
x
x
x
x
“x” unknown
Bit 7~0
Rev. 1.10
D23~D16: A/D Conversion Data Register bit 23~bit 16
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A/D Converter Control Registers − ADCR0, ADCR1, ADCS
To control the function and operation of the A/D converter, three control registers known as ADCR0,
ADCR1 and ADCS are provided. These 8-bit registers define functions such as the selection of
which reference source is used for the internal A/D converter, the A/D converter clock source, the
A/D converter output data rate as well as controlling the power-up function and monitoring the A/D
converter end of conversion status.
• ADCR0 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
ADRST
ADSLP
ADOFF
ADOR2
ADOR1
ADOR0
—
VREFS
R/W
R/W
R/W
R/W
R/W
R/W
R/W
—
R/W
POR
0
0
1
0
0
0
—
0
Bit 7
ADRST: A/D Converter Software Reset Control bit.
0: Disable
1: Enable
This bit is used to reset the A/D converter internal digital SINC filter. This bit is set
low for A/D normal operations. However, if set high, the internal digital SINC filter
will be reset and the current A/D converted data will be aborted. A new A/D data
conversion process will not be initiated until this bit is set low again.
Bit 6
ADSLP: A/D Converter Sleep Mode Control bit
0: Normal mode
1: Sleep mode
This bit is used to determine whether the A/D converter enters the sleep mode or
not when the A/D converter is powered on by setting the ADOFF bit low. When the
A/D converter is powered on and the ADSLP bit is low, the A/D converter will operate
normally. However, the A/D converter will enter the sleep mode if the ADSLP bit is
set high as the A/D converter has been powered on. The whole A/D converter circuit
will be switched off except the PGA and internal Bandgap circuit to reduce the power
consumption and VCM start-up stable time.
Bit 5
ADOFF: A/D Converter Module Power On/Off Control bit
0: Power on
1: Power off
This bit controls the power of the A/D converter module. This bit should be cleared
to “0” to enable the A/D converter. If the bit is set high then the A/D converter will
be switched off reducing the device power consumption. As the A/D converter will
consume a limited amount of power, even when not executing a conversion, this may
be an important consideration in power sensitive battery powered applications.
It is recommended to set the ADOFF bit high before the device enters the IDLE/
SLEEP mode for saving power. Setting the ADOFF bit high will power down the A/D
converter module regardless of the ADSLP and ADRST bit settings.
Bit 4~2
ADOR2~ADOR0: A/D Conversion Oversampling Rate Selection
000: Oversampling rate OSR=16384
001: Oversampling rate OSR=8192
010: Oversampling rate OSR=4096
011: Oversampling rate OSR=2048
100: Oversampling rate OSR=1024
101: Oversampling rate OSR=512
110: Oversampling rate OSR=256
111: Oversampling rate OSR=128
Bit 1
Unimplemented, read as “0”
Bit 0
VREFS: A/D Converter Reference Voltage Pair Selection
0: Internal reference voltage pair – VCM & AVSS
1: External reference voltage pair – VREFP & VREFN
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• ADCR1 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
FLMS2
FLMS1
FLMS0
VRBUFN
VRBUFP
ADCDL
EOC
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
—
POR
0
0
0
0
0
0
0
—
Bit 7~5
FLMS2~FLMS0: A/D Converter Clock Divided Ratio Selection and Sampled Data
Doubling Function (CHOP) Enable Control
000: CHOP=2, fADCK = fMCLK / 30
010: CHOP=2, fADCK = fMCLK / 12
Others: Reserved
When the CHOP bit is equal to 2, it means that the sampled data amount will be
doubled for the normal conversion mode.
Bit 4
VRBUFN: A/D Converter Negative Reference Voltage Input (VRN) Buffer Control
0: Disable input buffer and enable bypass function
1: Enable input buffer and disable bypass function
Bit 3
VRBUFP: A/D Converter Positive Reference Voltage Input (VRP) Buffer Control
0: Disable input buffer and enable bypass function
1: Enable input buffer and disable bypass function
Bit 2
ADCDL: A/D Converted Data Latch Function Enable Control
0: Disable data latch function
1: Enable data latch function
If the A/D converted data latch function is enabled, the latest converted data value will
be latched and not be updated by any subsequent converted results until this function
is disabled. Although the converted data is latched into the data registers, the A/D
converter circuits remain operational, but will not generate interrupt and EOC will not
change. It is recommended that this bit should be set high before reading the converted
data in the ADRL, ADRM and ADRH registers. After the converted data has been
read out, the bit can then be cleared to low to disable the A/D converter data latch
function and allow further conversion values to be stored. In this way, the possibility
of obtaining undesired data during A/D converter conversions can be prevented.
Bit 1
EOC: End of A/D Conversion Flag
0: A/D conversion in progress
1: A/D conversion ended
This bit must be cleared by software.
Bit 0
Unimplemented, read as “0”
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• ADCS Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
ADCK4
ADCK3
ADCK2
ADCK1
ADCK0
R/W
—
—
—
R/W
R/W
R/W
R/W
R/W
POR
—
—
—
0
0
0
0
0
Bit 7~5
Unimplemented, read as “0”
Bit 4~0
ADCK4~ADCK0: A/D Converter Clock Source fMCLK Divided Ratio Selection
00000~11110: fMCLK=fSYS/2 / (ADCK[4:0]+1)
11111: fMCLK=fSYS
A/D Operation
The A/D converter provides three operational modes, which are Power down mode, Sleep mode and
Reset mode, controlled respectively by the ADOFF, ADSLP and ADRST bits in the ADCR0 register.
The following table illustrates the operating mode selection.
LDOEN ADOFF ADSLP ADRST
Operating Mode
Description
0
1
x
x
Power down mode
Bandgap off, LDO off, VCM generator off,
PGA off, ADC off, Temperature sensor off,
VRN/VRP buffer off, SINC filter off
1
1
x
x
Power down mode
Bandgap on, LDO on, VCM generator off,
PGA off, ADC off, Temperature sensor off,
VRN/VRP buffer off, SINC filter off
0
0
1
x
Sleep mode
Bandgap on, LDO off, VCM generator off,
(External voltage must be
PGA on, ADC off, Temperature sensor off,
supplied on LDO output pin) VRN/VRP buffer off, SINC filter on
0
0
0
0
Normal mode
Bandgap on, LDO off, VCM generator on/off(1),
(External voltage must be
PGA on, ADC on, Temperature sensor on/off(2),
supplied on LDO output pin) VRN/VRP buffer on/off(3), SINC filter on
0
0
0
1
Reset mode
Bandgap on, LDO off, VCM generator on/off(1),
(External voltage must be
PGA on, ADC on,Temperature sensor on/off(2),
supplied on LDO output pin) VRN/VRP buffer on/off(3), SINC filter reset
1
0
1
x
Sleep mode
Bandgap on, LDO on, VCM generator off,
PGA on, ADC off, Temperature sensor off,
VRN/VRP buffer off, SINC filter on
1
0
0
0
Normal mode
Bandgap on, LDO on, VCM generator on/off(1),
PGA on, ADC on, Temperature sensor on/off(2),
VRN/VRP buffer on/off(3), SINC filter on
1
0
0
1
Reset mode
Bandgap on, LDO on, VCM generator on/off(1),
PGA on, ADC on, Temperature sensor on/off(2),
VRN/VRP buffer on/off(3), SINC filter reset
“x” unknown
Note: 1. The VCM generator can be switched on or off by the bandgap on or off.
2. The Temperature sensor can be switched on or off by configuring the CHSN[3:0] or CHSP[3:0] bits
3. The VRN buffer can be switched on or off by configuring the VRBUFN bit while the VRP buffer can be
switched on or off by configuring the VRBUFP bit
A/D Operation Mode Selection
Rev. 1.10
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To enable the A/D converter, the first step is to disable the A/D converter power down and sleep
mode by clearing the ADOFF and ADSLP bits to make sure the A/D converter is powered up. The
ADRST bit in the ADCR0 register is used to start and reset the A/D converter after power on. To set
ADRST bit from low to high and then low again, an analog to digital converted data in SINC filter
will be initiated. After this setup is complete, the A/D Converter is ready for operation. These three
bits are used to control the overall start operation of the internal analog to digital converter.
The EOC bit in the ADCR1 register is used to indicate when the analog to digital conversion process is
complete. This bit will be automatically set to “1” by the Hardware after a conversion cycle has ended.
In addition, the corresponding A/D interrupt request flag will be set in the interrupt control register,
and if the interrupts are enabled, an appropriate internal interrupt signal will be generated. This A/D
internal interrupt signal will direct the program flow to the associated A/D internal interrupt address
for processing. If the A/D internal interrupt is disabled, the microcontroller can poll the EOC bit in the
ADCR1 register to check whether it has been set “1” as an alternative method of detecting the end of
an A/D conversion cycle. The A/D converted data will be updated continuously by the new converted
data. If the A/D converted data latch function is enabled, the latest converted data will be latched and
the following new converted data will be discarded until this data latch function is disabled.
The clock source for the A/D converter should be typically fixed at a value of 4MHz, which
originates from the system clock fSYS, and can be chosen to be either fSYS or a subdivided version
of fSYS. The division ratio value is determined by the ADCK4~ADCK0 bits in the ADCS register to
obtain a 4MHz clock source for the A/D converter.
The differential reference voltage supply to the A/D Converter can be supplied from either the
internal power supply, VCM and AVSS, or from an external reference source, VREFP and VREFN.
The desired selection is made using the VREFS bit in the ADCR0 register.
Summary of A/D Conversion Steps
The following summarises the individual steps that should be executed in order to implement an
A/D conversion process.
• Step 1
Enable the power LDO, VCM for PGA and A/D converter.
• Step 2
Select the PGA, A/D converter, reference voltage gains by PGAC0 register
• Step 3
Select the PGA settings for input connection, VCM voltage level and buffer option by PGAC1
register
• Step 4
Select the required A/D conversion clock source by correctly programming bits ADCK4~ADCK0
in the ADCS register.
• Step 5
Select output data rate by configuring the ADOR[2:0] bits in the ADCR0 register and FLMS[2:0]
bits in the ADCR1 register.
• Step 6
Select which channel is to be connected to the internal PGA by correctly programming the
CHSP3~CHSP0 and CHSN3~CHSN0 bits which are also contained in the PGACS register.
• Step 7
Release the power down mode and sleep mode by clearing the ADOFF and ADSLP bits in
ADCR0 register.
Rev. 1.10
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• Step 8
Reset the A/D by setting the ADRST to high in the ADCR0 register and clearing this bit to “0” to
release reset status.
• Step 9
If the interrupts are to be used, the interrupt control registers must be correctly configured to
ensure the A/D converter interrupt function is active. The master interrupt control bit, EMI, and
the A/D converter interrupt bit, ADE, must both be set high to do this.
• Step 10
To check when the analog to digital conversion process is complete, the EOC bit in the ADCR1
register can be polled. The conversion process is complete when this bit goes high. When this
occurs the A/D data registers ADRL, ADRM and ADRH can be read to obtain the conversion
value. As an alternative method, if the interrupts are enabled and the stack is not full, the program
can wait for an A/D interrupt to occur.
Note: When checking for the end of the conversion process, if the method of polling the EOC bit in
the ADCR1 register is used, the interrupt enable step above can be omitted.
Programming Considerations
During microcontroller operations where the A/D converter is not being used, the A/D internal
circuitry can be switched off to reduce power consumption, by setting bit ADOFF high in the
ADCR0 register. When this happens, the internal A/D converter circuits will not consume power
irrespective of what analog voltage is applied to their input lines.
A/D Converter Transfer Function
Each device contains a 24-bit Delta Sigma A/D converter and its full-scale converted digitised value
is from 8388607 to -8388608 in decimal value. The converted data format is formed by a two’s
complement binary value. The MSB of the converted data is the signed bit. Since the full-scale
analog input value is equal to the amplified value of the VCM or differential reference input voltage,
ΔVR_I, selected by the VREFS bit in ADCR0 register, this gives a single bit analog input value of
ΔVR_I divided by 8388608.
1 LSB = ΔVR_I / 8388608
The A/D Converter input voltage value can be calculated using the following equation:
ΔSI_I = (PGAGN × ADGN × ΔDI±) + DCSET
ΔVR_I = VREGN × ΔVR±
ADC_Conversion_Data = (ΔSI_I / ΔVR_I) × K
Where K is equal to 2
Note: 1. The PGAGN, ADGN, VREGN values are decided by the PGS, AGS, VGS control bits.
23
2. ΔSI_I: Differential Input Signal after amplification and offset adjustment.
3. PGAGN: Programmable Gain Amplifier gain
4. ADGN: A/D Converter gain
5. VREGN: Reference voltage gain
6. ΔDI±: Differential input signal derived from external channels or internal signals
7. DCSET: Offset voltage
8. ΔVR±: Differential Reference voltage
9. ΔVR_I: Differential Reference input voltage after amplification
Rev. 1.10
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Body Fat Measurment Flash MCU
Due to the digital system design of the Delta Sigma A/D Converter, the maximum number of the
A/D converted value is 8388607 and the minimum value is -8388608, therefore, we can have the
middle number 0. The ADC_Conversion_Data equation illustrates this range of converted data
variation.
A/D Conversion Data
(2’s Compliment, Hexadecimal)
Decimal Value
0x7FFFFF
8388607
0x800000
-8388608
A/D Conversion Data Range
The above A/D converter conversion data table illustrates the range of A/D conversion data.
The following diagram shows the relationship between the DC input value and the A/D converted
data which is presented by the Two’s Complement.
�� Digital o�tp�t
Two's complement
0111 1111 1111 1111 1111 1111
0
DC inp�t val�e
(D+ - D-) * PGAGN * ADGN + DCSET
(REFP - REFN) * VREGN
1000 0000 0000 0000 0000 0000
Rev. 1.10
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Body Fat Measurment Flash MCU
�� Digital o�tp�t
Two's complement
0111 1111 1111 1111 1111 1111
0
DC inp�t val�e
(D+ - D-) * PGAGN * ADGN + DCSET
(REFP - REFN) * VREGN
1000 0000 0000 0000 0000 0000
A/D Converted Data
The A/D converted data is related to the input voltage and the PGA selections. The format of the
A/D converter output is a two’s complement binary code. The length of this output code is 24 bits
and the MSB is a signed bit. When the MSB is “0”, which represents the input is “positive”, on the
other hand, as the MSB is “1”, it represents the input is “negative”. The maximum value is 8388607
and the minimum value is -8388608. If the input signal is over the maximum value, the converted
data is limited by the 8388607, and if the input signal is less than the minimum value, the converted
data is limited by -8388608.
Rev. 1.10
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A/D Converted Data to Voltage
The designer can recover the converted data by the following equations:
If MSB=0 (Positive Converted data): Input Voltage=
(Converted _data)  LSB  DCSET
PGA  ADGN
If MSB=1(Negative Converted data): Input voltage=
Two's_complement_of_Converted_data  LSB  DCSET
PGA  ADGN
Note: Two’s complement=One’s complement +1
A/D Programming Example
• Example: Using an EOC polling method to detect the end of conversion
#include bh66f2650.inc
data .section 'data'
adc_result_data_l db ?
adc_result_data_m db ?
adc_result_data_h db ?
code .section ‘code’
start:
clr
ADE
; Disable A/D converter interrupt
mov
a, 083H
; Power control for PGA, A/D converter
mov
PWRC, a
; PWRC=10000011, LDO enable, VCM enable, LDO Bypass
; disable, LDO output voltage: 3.3V
mov
a, 000H
mov
PGAC0, a
; PGA gain=1, A/D converter gain=1, VREF gain=1
mov
a, 000H
mov
PGAC1, a
; VCM=1.25V, INIS, INX, DCSET in default value
set
VRBUFP
; enable buffer for VREF+
set
VRBUFN
; enable buffer for VREFset
VREFS
; for using external reference
clr
ADOR2
; for 10Hz output data rate, ADOR[2:0]=001, FLMS[2:0]=000
clr
ADOR1
set
ADOR0
clr
FLMS2
clr
FLMS1
clr
FLMS0
loop:
clr
set
clr
clr
ADOFF
ADRST
ADRST
EOC
;
;
;
;
snz
EOC
;
jmp
loop
;
clr
adc_result_data_h
clr
adc_result_data_m
clr
adc_result_data_l
mov
a, ADRL
mov
adc_result_data_l, a ;
mov
a, ADRM
mov
adc_result_data_m, a ;
mov
a, ADRH
mov
adc_result_data_h, a ;
get_adc_value_ok:
clr
EOC
;
jmp
loop ;
end
Rev. 1.10
A/D converter exit power down mode.
A/D converter in reset mode
A/D converter in convertsion (continuos mode)
Clear “EOC” flag
Polling “EOC” flag
Wait for read data
Get Low byte A/D converter value
Get Middle byte A/D converter value
Get High byte A/D converter value
Clearing read flag
for next data read
131
January 04, 2018
BH66F2650/BH66F2660
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Temperature Sensor
The devices provide an internal temperature sensor to compensate the device due to temperature
effects. By selecting the PGA input channels as VTSOP and VTSON, the A/D Converter can obtain
temperature information allowing compenstiaon to be made to the A/D converted data.
VOREG
I
VTSO+
VTSO-
A/D Converter
PGA
AVSS
Serial Interface Module – SIM
Each device contains a Serial Interface Module, which includes both the four line SPI interface and
the two line I2C interface types, to allow an easy method of communication with external peripheral
hardware. Having relatively simple communication protocols, these serial interface types allow the
microcontroller to interface to external SPI or I2C based hardware such as sensors, Flash memory,
etc. As both interface types share the same pins and registers, the choice of whether the SPI or I2C
type is used is made using the SIM operating mode control bits, named SIM2~SIM0, in the SIMC0
register. These pull-high resistors of the SIM pin-shared I/O pins are selected using pull-high control
registers when the SIM function is enabled and the corresponding pins are used as SIM input pins.
SPI Interface
The SPI interface is often used to communicate with external peripheral devices such as sensors,
Flash memory devices etc. Originally developed by Motorola, the four line SPI interface is a
synchronous serial data interface that has a relatively simple communication protocol simplifying
the programming requirements when communicating with external hardware devices.
The communication is full duplex and operates as a slave/master type, where the devices can be
either master or slave. Although the SPI interface specification can control multiple slave devices
from a single master, but these devices are provided only one SCS pin. If the master needs to control
multiple slave devices from a single master, the master can use I/O pin to select the slave devices.
SPI Maste�
SPI Slave
SCK
SCK
SDO
SDI
SDI
SDO
SCS
SCS
SPI Master/Slave Connection
Rev. 1.10
132
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BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
SPI Interface Operation
The SPI interface is a full duplex synchronous serial data link. It is a four line interface with pin
names SDI, SDO, SCK and SCS. Pins SDI and SDO are the Serial Data Input and Serial Data Output
lines; SCK is the Serial Clock line and SCS is the Slave Select line. As the SPI interface pins are pinshared with normal I/O pins and with the I2C function pins, the SPI interface must first be enabled
by setting the correct bits in the SIMC0 and SIMC2 registers. The SPI can be disabled or enabled
using the SIMEN bit in the SIMC0 register. Communication between devices connected to the SPI
interface is carried out in a slave/master mode with all data transfer initiations being implemented
by the master. The Master also controls the clock signal. As these devices only contains a single SCS
pin only one slave device can be utilized. The SCS pin is controlled by software, set CSEN bit to “1”
to enable SCS pin function, set CSEN bit to “0” the SCS pin will be floating state.
Data B�s
SIMD
SDI Pin
TX/RX Shift Register
CKEG
CKPOLB
SDO Pin
Clock Edge/Pola�it�
Cont�ol
B�s� Stat�s
SCK Pin
fSYS
fSUB
PTM� CCRP match f�eq�enc�/�
Clock
So��ce
Select
WCOL
TRF
SIMICF
SCS Pin
CSEN
SPI Block Diagram
The SPI function in these devices offer the following features:
• Full duplex synchronous data transfer
• Both Master and Slave modes
• LSB first or MSB first data transmission modes
• Transmission complete flag
• Rising or falling active clock edge
The status of the SPI interface pins is determined by a number of factors such as whether the device
is in the master or slave mode and upon the condition of certain control bits such as CSEN and
SIMEN.
Rev. 1.10
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SPI Registers
There are three internal registers which control the overall operation of the SPI interface. These are
the SIMD data register and two registers SIMC0 and SIMC2. Note that the SIMC1 register is only
used by the I2C interface.
Bit
Register
Name
7
6
5
4
3
2
1
0
SIMC0
SIM2
SIM1
SIM0
—
SIMDEB1
SIMDEB0
SIMEN
SIMICF
SIMD
D7
D6
D5
D4
D3
D2
D1
D0
SIMC2
D7
D6
CKPOLB
CKEG
MLS
CSEN
WCOL
TRF
SIM Registers List
The SIMD register is used to store the data being transmitted and received. The same register is used
by both the SPI and I2C functions. Before the device writes data to the SPI bus, the actual data to
be transmitted must be placed in the SIMD register. After the data is received from the SPI bus, the
device can read it from the SIMD register. Any transmission or reception of data from the SPI bus
must be made via the SIMD register.
• SIMD Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
x
x
x
x
x
x
x
x
“x” unknown
There are also two control registers for the SPI interface, SIMC0 and SIMC2. Note that the SIMC2
register also has the name SIMA which is used by the I2C function. The SIMC1 register is not used
by the SPI function, only by the I2C function. Register SIMC0 is used to control the enable/disable
function and to set the data transmission clock frequency. Although not connected with the SPI
function, the SIMC0 register is also used to control the Peripheral Clock Prescaler. Register SIMC2
is used for other control functions such as LSB/MSB selection, write collision flag etc.
• SIMC0 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
SIM2
SIM1
SIM0
—
SIMDEB1
SIMDEB0
SIMEN
SIMICF
R/W
R/W
R/W
R/W
—
R/W
R/W
R/W
R/W
POR
1
1
1
—
0
0
0
0
Bit 7~5
SIM2~SIM0: SIM Operating Mode Control
000: SPI master mode; SPI clock is fSYS/4
001: SPI master mode; SPI clock is fSYS/16
010: SPI master mode; SPI clock is fSYS/64
011: SPI master mode; SPI clock is fSUB
100: SPI master mode; SPI clock is PTM2 CCRP match frequency/2
101: SPI slave mode
110: I2C slave mode
111: Unused mode
These bits setup the overall operating mode of the SIM function. As well as selecting
if the I2C or SPI function, they are used to control the SPI Master/Slave selection and
the SPI Master clock frequency. The SPI clock is a function of the system clock but
can also be chosen to be sourced from the PTM2. If the SPI Slave Mode is selected
then the clock will be supplied by an external Master device.
Bit 4
Unimplemented, read as “0”
134
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Bit 3~2
SIMDEB[1:0]: I2C Debounce Time Selection
The SIMDEB[1:0] bits are of no used in SPI mode of SIM, please ignore these
selection bits when operate in SPI mode.
Bit 1
SIMEN: SIM Control
0: Disable
1: Enable
The bit is the overall on/off control for the SIM interface. When the SIMEN bit is
cleared to “0” to disable the SIM interface, the SDI, SDO, SCK and SCS, or SDA
and SCL lines will be in a floating condition and the SIM operating current will be
reduced to a minimum value. When the bit is high the SIM interface is enabled. The
SIM configuration option must have first enabled the SIM interface for this bit to be
effective. If the SIM is configured to operate as an SPI interface via the SIM2~SIM0
bits, the contents of the SPI control registers will remain at the previous settings when
the SIMEN bit changes from low to high and should therefore be first initialised by
the application program. If the SIM is configured to operate as an I2C interface via the
SIM2~SIM0 bits and the SIMEN bit changes from low to high, the contents of the I2C
control bits such as HTX and TXAK will remain at the previous settings and should
therefore be first initialised by the application program while the relevant I2C flags
such as HCF, HAAS, HBB, SRW and RXAK will be set to their default states.
Bit 0
SIMICF: SIM SPI Incomplete Flag
0: SIM SPI incompleted is not occurred
1: SIM SPI incompleted is occurred
The SIMICF bit is determined by SCS pin. When SCS pin is set high, it will clear the
SPI counter. Meanwhile, the interrupt is occurred and the incomplete flag, SIMICF, is
set high.
• SIMC2 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
CKPOLB
CKEG
MLS
CSEN
WCOL
TRF
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~6
D7~D6: Undefined bit
This bit can be read or written by user software program.
Bit 5
CKPOLB: Determines the Base Condition of the Clock Line
0: The SCK line will be high when the clock is inactive
1: The SCK line will be low when the clock is inactive
The CKPOLB bit determines the base condition of the clock line, if the bit is high,
then the SCK line will be low when the clock is inactive. When the CKPOLB bit is
low, then the SCK line will be high when the clock is inactive.
Bit 4
CKEG: Determines SPI SCK Active Clock Edge Type
CKPOLB=0
0: SCK is high base level and data capture at SCK rising edge
1: SCK is high base level and data capture at SCK falling edge
CKPOLB=1
0: SCK is low base level and data capture at SCK falling edge
1: SCK is low base level and data capture at SCK rising edge
The CKEG and CKPOLB bits are used to setup the way that the clock signal outputs
and inputs data on the SPI bus. These two bits must be configured before data transfer
is executed otherwise an erroneous clock edge may be generated. The CKPOLB bit
determines the base condition of the clock line, if the bit is high, then the SCK line
will be low when the clock is inactive. When the CKPOLB bit is low, then the SCK
line will be high when the clock is inactive. The CKEG bit determines active clock
edge type which depends upon the condition of CKPOLB bit.
135
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Bit 3
MLS: SPI Data Shift Order
0: LSB
1: MSB
This is the data shift select bit and is used to select how the data is transferred, either
MSB or LSB first. Setting the bit high will select MSB first and low for LSB first.
Bit 2
CSEN: SPI SCS Pin Control
0: Disable
1: Enable
The CSEN bit is used as an enable/disable for the SCS pin. If this bit is low, then the
SCS pin will be disabled and placed into a floating condition. If the bit is high the SCS
pin will be enabled and used as a select pin.
Bit 1
WCOL: SPI Write Collision Flag
0: No collision
1: Collision
The WCOL flag is used to detect if a data collision has occurred. If this bit is high it
means that data has been attempted to be written to the SIMD register during a data
transfer operation. This writing operation will be ignored if data is being transferred.
The bit can be cleared by the application program.
Bit 0
TRF: SPI Transmit/Receive Complete Flag
0: Data is being transferred
1: SPI data transmission is completed
The TRF bit is the Transmit/Receive Complete flag and is set high automatically when
an SPI data transmission is completed, but must cleared to “0” by the application
program. It can be used to generate an interrupt.
SPI Communication
After the SPI interface is enabled by setting the SIMEN bit high, then in the Master Mode, when
data is written to the SIMD register, transmission/reception will begin simultaneously. When the
data transfer is complete, the TRF flag will be set automatically, but must be cleared using the
application program. In the Slave Mode, when the clock signal from the master has been received,
any data in the SIMD register will be transmitted and any data on the SDI pin will be shifted into
the SIMD register. The master should output an SCS signal to enable the slave device before a
clock signal is provided. The slave data to be transferred should be well prepared at the appropriate
moment relative to the SCS signal depending upon the configurations of the CKPOLB bit and CKEG
bit. The accompanying timing diagram shows the relationship between the slave data and SCS signal
for various configurations of the CKPOLB and CKEG bits.
The SPI will continue to function in special IDLE Modes if the clock source used by the SPI
interface is still active.
Rev. 1.10
136
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
SIMEN=1� CSEN=0 (Exte�nal P�ll-high)
SCS
SIMEN� CSEN=1
SCK (CKPOLB=1� CKEG=0)
SCK (CKPOLB=0� CKEG=0)
SCK (CKPOLB=1� CKEG=1)
SCK (CKPOLB=0� CKEG=1)
SDO (CKEG=0)
D7/D0
D6/D1
D5/D�
D�/D3
D3/D�
D�/D5
D1/D6 D0/D7
SDO (CKEG=1)
D7/D0
D6/D1
D5/D�
D�/D3
D3/D�
D�/D5
D1/D6
D0/D7
SDI Data Capt��e
W�ite to SIMD
SPI Master Mode Timing
SCS
SCK (CKPOLB=1)
SCK (CKPOLB=0)
SDO
D7/D0
D6/D1
D5/D�
D�/D3
D3/D�
D�/D5
D1/D6
D0/D7
SDI Data Capt��e
W�ite to SIMD
(SDO does not change �ntil fi�st SCK edge)
SPI Slave Mode Timing – CKEG=0
SCS
SCK (CKPOLB=1)
SCK (CKPOLB=0)
SDO
D7/D0
D6/D1
D5/D�
D�/D3
D3/D�
D�/D5
D1/D6
D0/D7
SDI Data Capt��e
W�ite to SIMD
(SDO changes as soon as w�iting occ��s; SDO is floating if SCS=1)
Note: Fo� SPI slave mode� if SIMEN=1 and CSEN=0� SPI is alwa�s enabled
and igno�es the SCS level.
SPI Slave Mode Timing – CKEG=1
Rev. 1.10
137
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BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
SPI T�ansfe�
Maste�
Maste� o� Slave
?
A
W�ite Data
into SIMD
Clea� WCOL
Slave
Y
SIM[�:0]=000� 001�
010� 011 o� 100
SIM[�:0]=101
WCOL=1?
N
N
Config��e CKPOLB�
CKEG� CSEN and MLS
T�ansmission
completed?
(TRF=1?)
Y
SIMEN=1
Read Data
f�om SIMD
A
Clea� TRF
T�ansfe� finished?
N
Y
END
SPI Transfer Control Flowchart
Rev. 1.10
138
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BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
I2C Interface
The I2C interface is used to communicate with external peripheral devices such as sensors etc.
Originally developed by Philips, it is a two line low speed serial interface for synchronous serial
data transfer. The advantage of only two lines for communication, relatively simple communication
protocol and the ability to accommodate multiple devices on the same bus has made it an extremely
popular interface type for many applications.
VDD
SDA
SCL
Device
Slave
Device
Maste�
Device
Slave
I2C Master/Slave Bus Connection
I2C Interface Operation
The I2C serial interface is a two line interface, a serial data line, SDA, and serial clock line, SCL. As
many devices may be connected together on the same bus, their outputs are both open drain types.
For this reason it is necessary that external pull-high resistors are connected to these outputs. Note
that no chip select line exists, as each device on the I2C bus is identified by a unique address which
will be transmitted and received on the I2C bus.
When two devices communicate with each other on the bidirectional I2C bus, one is known as the
master device and one as the slave device. Both master and slave can transmit and receive data;
however, it is the master device that has overall control of the bus. For the devices, which only
operate in slave mode, there are two methods of transferring data on the I2C bus, the slave transmit
mode and the slave receive mode. The pull-up control function pin-shared with SCL/SDA pin is still
applicable even if I2C device is activated and the related internal pull-up register could be controlled
by its corresponding pull-up control register.
Data B�s
I�C Data Registe�
(SIMD)
SCL Pin
Add�ess
Compa�ato�
Di�ection Cont�ol
HTX
fSYS
SDA Pin
I�C Add�ess Registe�
(SIMA)
Debo�nce
Ci�c�it��
SIMDEB[1:0]
Data in MSB
M
U
X
Shift Registe�
Read/W�ite Slave
Add�ess Match–HAAS
I�C Inte���pt
SRW
Data o�t MSB
TXAK
�-bit Data T�ansfe� Conplete–HCF
T�ansmit/Receive
Cont�ol Unit
fSUB
Detect Sta�t o� Stop
Time-o�t Cont�ol
HBB
SIMTOF
SIMTOEN
Add�ess Match
I2C Block Diagram
Rev. 1.10
139
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
START signal
f�om Maste�
Send slave add�ess
and R/W bit f�om Maste�
Acknowledge
f�om slave
Send data b�te
f�om Maste�
Acknowledge
f�om slave
STOP signal
f�om Maste�
I2C Registers
There are three control registers associated with the I2C bus, SIMC0, SIMC1 and SIMTOC, one
address register, SIMA and one data register, SIMD. The SIMD register, which is shown in the
above SPI section, is used to store the data being transmitted and received on the I2C bus. Note that
the SIMA register also has the name SIMC2 which is used by the SPI function. Bit SIMEN and bits
SIM2~SIM0 in register SIMC0 are used by the I2C interface. The SIMTOC register is used for I2C
time-out control.
Register
Name
Bit
7
6
5
4
SIMC0
SIM2
SIM1
SIM0
—
3
SIMC1
HCF
HAAS
HBB
HTX
TXAK
SIMD
D7
D6
D5
D4
D3
SIMA
A6
A5
A4
A3
A2
2
1
0
SIMEN
SIMICF
SRW
IAMWU
RXAK
D2
D1
D0
A1
A0
D0
SIMDEB1 SIMDEB0
SIMTOC SIMTOEN SIMTOF SIMTOS5 SIMTOS4 SIMTOS3
SIMTOS2 SIMTOS1 SIMTOS0
I2C Register List
• SIMC0 Register
Bit
7
6
5
4
3
2
1
0
Name
SIM2
SIM1
SIM0
—
SIMDEB1
SIMDEB0
SIMEN
SIMICF
R/W
R/W
R/W
R/W
—
R/W
R/W
R/W
R/W
POR
1
1
1
—
0
0
0
0
Bit 7~5
Rev. 1.10
SIM2~SIM0: SIM Operating Mode Control
000: SPI master mode; SPI clock is fSYS/4
001: SPI master mode; SPI clock is fSYS/16
010: SPI master mode; SPI clock is fSYS/64
011: SPI master mode; SPI clock is fSUB
100: SPI master mode; SPI clock is PTM2 CCRP match frequency/2
101: SPI slave mode
110: I2C slave mode
111: Unused mode
These bits setup the overall operating mode of the SIM function. As well as selecting
if the I2C or SPI function, they are used to control the SPI Master/Slave selection and
the SPI Master clock frequency. The SPI clock is a function of the system clock but
can also be chosen to be sourced from the PTM2. If the SPI Slave Mode is selected
then the clock will be supplied by an external Master device.
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Bit 4
Unimplemented, read as “0”
Bit 3~2
SIMDEB1~SIMDEB0: I2C Debounce Time Selection
00: No debounce
01: 2 system clock debounce
1x: 4 system clock debounce
Bit 1
SIMEN: SIM Control
0: Disable
1: Enable
The bit is the overall on/off control for the SIM interface. When the SIMEN bit is
cleared to “0” to disable the SIM interface, the SDI, SDO, SCK and SCS, or SDA
and SCL lines will be in a floating condition and the SIM operating current will be
reduced to a minimum value. When the bit is high the SIM interface is enabled. The
SIM configuration option must have first enabled the SIM interface for this bit to be
effective. If the SIM is configured to operate as an SPI interface via the SIM2~SIM0
bits, the contents of the SPI control registers will remain at the previous settings when
the SIMEN bit changes from low to high and should therefore be first initialised by
the application program. If the SIM is configured to operate as an I2C interface via the
SIM2~SIM0 bits and the SIMEN bit changes from low to high, the contents of the I2C
control bits such as HTX and TXAK will remain at the previous settings and should
therefore be first initialised by the application program while the relevant I2C flags
such as HCF, HAAS, HBB, SRW and RXAK will be set to their default states.
Bit 0
SIMICF: SIM SPI Incomplete Flag
SIMICF is of no used in I2C mode of SIM, please ignore this flag when operate in I2C
mode.
• SIMC1 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
HCF
HAAS
HBB
HTX
TXAK
SRW
IAMWU
RXAK
R/W
R
R
R
R/W
R/W
R
R/W
R
POR
1
0
0
0
0
0
0
1
Bit 7
HCF: I2C Bus Data Transfer Completion Flag
0: Data is being transferred
1: Completion of an 8-bit data transfer
The HCF flag is the data transfer flag. This flag will be “0” when data is being
transferred. Upon completion of an 8-bit data transfer the flag will go high and an
interrupt will be generated.
Bit 6
HAAS: I2C Bus Address Match Flag
0: Not address match
1: Address match
The HAAS flag is the address match flag. This flag is used to determine if the slave
device address is the same as the master transmit address. If the addresses match then
this bit will be high, if there is no match then the flag will be low.
Bit 5
HBB: I2C Bus Busy Flag
0: I2C Bus is not busy
1: I2C Bus is busy
The HBB flag is the I2C busy flag. This flag will be “1” when the I2C bus is busy
which will occur when a START signal is detected. The flag will be cleared to “0”
when the bus is free which will occur when a STOP signal is detected.
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Rev. 1.10
Bit 4
HTX: Select I2C Slave Device is Transmitter or Receiver
0: Slave device is the receiver
1: Slave device is the transmitter
Bit 3
TXAK: I2C Bus Transmit Acknowledge Flag
0: Slave send acknowledge flag
1: Slave do not send acknowledge flag
The TXAK bit is the transmit acknowledge flag. After the slave device receipt of 8-bit
of data, this bit will be transmitted to the bus on the 9th clock from the slave device.
The slave device must always set TXAK bit to “0” before further data is received.
Bit 2
SRW: I2C Slave Read/Write Flag
0: Slave device should be in receive mode
1: Slave device should be in transmit mode
The SRW flag is the I 2C Slave Read/Write flag. This flag determines whether
the master device wishes to transmit or receive data from the I2C bus. When the
transmitted address and slave address is match, that is when the HAAS flag is set high,
the slave device will check the SRW flag to determine whether it should be in transmit
mode or receive mode. If the SRW flag is high, the master is requesting to read data
from the bus, so the slave device should be in transmit mode. When the SRW flag is “0”,
the master will write data to the bus, therefore the slave device should be in receive
mode to read this data.
Bit 1
IAMWU: I2C Address Match Wake Up Function Control
0: Disable
1: Enable
This bit should be set to “1” to enable the I2C address match wake up from the SLEEP
or IDLE Mode. If the IAMWU bit has been set before entering either the SLEEP or
IDLE mode to enable the I2C address match wake up, then this bit must be cleared by
the application program after wake-up to ensure correct device operation.
Bit 0
RXAK: I2C Bus Receive Acknowledge Flag
0: Slave receives acknowledge flag
1: Slave does not receive acknowledge flag
The RXAK flag is the receiver acknowledge flag. When the RXAK flag is “0”, it
means that a acknowledge signal has been received at the 9th clock, after 8 bits of data
have been transmitted. When the slave device in the transmit mode, the slave device
checks the RXAK flag to determine if the master receive wishes to receive the next
byte. The slave transmitter will therefore continue sending out data until the RXAK
flag is “1”. When this occurs, the slave transmitter will release the SDA line to allow
the master to send a STOP signal to release the I2C bus.
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The SIMD register is used to store the data being transmitted and received. The same register is
used by both the SPI and I2C functions. Before the device write data to the I2C bus, the actual data to
be transmitted must be placed in the SIMD register. After the data is received from the I2C bus, the
device can read it from the SIMD register. Any transmission or reception of data from the I2C bus
must be made via the SIMD register.
• SIMD Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
x
x
x
x
x
x
x
x
“x” unknown
• SIMA Register
Bit
7
6
5
4
3
2
1
0
Name
A6
A5
A4
A3
A2
A1
A0
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7~1
A6~A0: I C Slave address
A6~A0 is the I2C slave address bit 6~bit 0.
The SIMA register is also used by the SPI interface but has the name SIMC2. The
SIMA register is the location where the 7-bit slave address of the slave device is
stored. Bit 7~Bit 1 of the SIMA register define the device slave address. Bit 0 is not
defined.
When a master device, which is connected to the I2C bus, sends out an address, which
matches the slave address in the SIMA register, the slave device will be selected. Note
that the SIMA register is the same register address as SIMC2 which is used by the SPI
interface.
Bit 0
D0: Undefined bit
This bit can be read or written by user software program.
2
• SIMTOC Register
Rev. 1.10
Bit
7
Name
SIMTOEN
6
5
4
3
2
1
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
SIMTOF SIMTOS5 SIMTOS4 SIMTOS3 SIMTOS2 SIMTOS1
0
SIMTOS0
Bit 7
SIMTOEN: I2C interface Time-out control
0: Disable
1: Enable
Bit 6
SIMTOF: I2C interface Time-out flag
0: No occurred
1: Occurred
The SIMTOF flag is set by the time-out circuitry when the time-out event occurs and
cleared by software program.
Bit 5~0
SIMTOS5~SIMTOS0: I2C interface Time-out period selection
The I2C Time-Out clock source is fSUB/32.
The I2C Time-Out time is ([SIMTOS5:SIMTOS0] + 1) × (32/fSUB)
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I2C Bus Communication
Communication on the I2C bus requires four separate steps, a START signal, a slave device address
transmission, a data transmission and finally a STOP signal. When a START signal is placed on the
I2C bus, all devices on the bus will receive this signal and be notified of the imminent arrival of data
on the bus. The first seven bits of the data will be the slave address with the first bit being the MSB.
If the address of the slave device matches that of the transmitted address, the HAAS bit in the SIMC1
register will be set and an I2C interrupt will be generated. After entering the interrupt service routine,
the slave device must first check the condition of the HAAS bit and SIMTOF bit to determine
whether the interrupt source originates from an address match or from the completion of an 8-bit data
transfer or from the I2C communication time-out. During a data transfer, note that after the 7-bit slave
address has been transmitted, the following bit, which is the 8th bit, is the read/write bit whose value
will be placed in the SRW bit. This bit will be checked by the slave device to determine whether to go
into transmit or receive mode. Before any transfer of data to or from the I2C bus, the microcontroller
must initialise the bus, the following are steps to achieve this:
• Step 1
Set the SIM2~SIM0 bits to “110” and the SIMEN bits to “1” in the SIMC0 register to enable the
I2C bus.
• Step 2
Write the slave address to the I2C bus address register SIMA.
• Step 3
Set the interrupt enable bit SIME to enable the SIM interrupt.
Sta�t
Set SIM[�:0]=110
Set SIMEN
W�ite Slave
Add�ess to SIMA
No
Yes
I�C B�s
Inte���pt=?
CLR SIME
Poll SIMF to decide when
to go to I�C B�s ISR
SET SIME
Wait fo� Inte���pt
Goto Main P�og�am
Goto Main P�og�am
I2C Bus Initialisation Flowchart
Rev. 1.10
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I2C Bus Start Signal
The START signal can only be generated by the master device connected to the I2C bus and not by
the slave device. This START signal will be detected by all devices connected to the I2C bus. When
detected, this indicates that the I2C bus is busy and therefore the HBB bit will be set. A START
condition occurs when a high to low transition on the SDA line takes place when the SCL line
remains high.
Slave Address
The transmission of a START signal by the master will be detected by all devices on the I2C bus.
To determine which slave device the master wishes to communicate with, the address of the slave
device will be sent out immediately following the START signal. All slave devices, after receiving
this 7-bit address data, will compare it with their own 7-bit slave address. If the address sent out by
the master matches the internal address of the microcontroller slave device, then an internal I2C bus
interrupt signal will be generated. The next bit following the address, which is the 8th bit, defines
the read/write status and will be saved to the SRW bit of the SIMC1 register. The slave device will
then transmit an acknowledge bit, which is a low level, as the 9th bit. The slave device will also set
the status flag HAAS when the addresses match.
As an I2C bus interrupt can come from three sources, when the program enters the interrupt
subroutine, the HAAS bit and SIMTOF bit should be examined to see whether the interrupt source
has come from a matching slave address or from the completion of a data byte transfer or from the
I2C communication time-out. When a slave address is matched, the device must be placed in either
the transmit mode and then write data to the SIMD register, or in the receive mode where it must
implement a dummy read from the SIMD register to release the SCL line.
I2C Bus Read/Write Signal
The SRW bit in the SIMC1 register defines whether the slave device wishes to read data from the
I2C bus or write data to the I2C bus. The slave device should examine this bit to determine if it is to
be a transmitter or a receiver. If the SRW flag is “1” then this indicates that the master device wishes
to read data from the I2C bus, therefore the slave device must be setup to send data to the I2C bus as
a transmitter. If the SRW flag is “0” then this indicates that the master wishes to send data to the I2C
bus, therefore the slave device must be setup to read data from the I2C bus as a receiver.
I2C Bus Slave Address Acknowledge Signal
After the master has transmitted a calling address, any slave device on the I 2C bus, whose
own internal address matches the calling address, must generate an acknowledge signal. The
acknowledge signal will inform the master that a slave device has accepted its calling address. If no
acknowledge signal is received by the master then a STOP signal must be transmitted by the master
to end the communication. When the HAAS flag is high, the addresses have matched and the slave
device must check the SRW flag to determine if it is to be a transmitter or a receiver. If the SRW flag
is high, the slave device should be setup to be a transmitter so the HTX bit in the SIMC1 register
should be set high. If the SRW flag is low, then the microcontroller slave device should be setup as a
receiver and the HTX bit in the SIMC1 register should be cleared to “0”.
Rev. 1.10
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I2C Bus Data and Acknowledge Signal
The transmitted data is 8-bit wide and is transmitted after the slave device has acknowledged receipt
of its slave address. The order of serial bit transmission is the MSB first and the LSB last. After
receipt of 8-bit of data, the receiver must transmit an acknowledge signal, level “0”, before it can
receive the next data byte. If the slave transmitter does not receive an acknowledge bit signal from
the master receiver, then the slave transmitter will release the SDA line to allow the master to send
a STOP signal to release the I2C Bus. The corresponding data will be stored in the SIMD register.
If setup as a transmitter, the slave device must first write the data to be transmitted into the SIMD
register. If setup as a receiver, the slave device must read the transmitted data from the SIMD register.
When the slave receiver receives the data byte, it must generate an acknowledge bit, known as
TXAK, on the 9th clock. The slave device, which is setup as a transmitter will check the RXAK bit
in the SIMC1 register to determine if it is to send another data byte, if not then it will release the
SDA line and await the receipt of a STOP signal from the master.
SCL
Sta�t
Slave Add�ess
1
SDA
0
1
1
0
1
SRW
ACK
1
0
0
Data
SCL
1
0
0
1
ACK
0
1
0
Stop
0
SDA
S=Sta�t (1 bit)
SA=Slave Add�ess (7 bits)
SR=SRW bit (1 bit)
M=Slave device send acknowledge bit (1 bit)
D=Data (� bits)
A=ACK (RXAK bit for transmitter, TXAK bit for receiver, 1 bit)
P=Stop (1 bit)
S
SA SR
M
D
A
D
A
……
S
SA SR
M
D
A
D
A
……
P
I2C Communication Timing Diagram
Note: When a slave address is matched, the device must be placed in either the transmit mode
and then write data to the SIMD register, or in the receive mode where it must implement a
dummy read from the SIMD register to release the SCL line.
Rev. 1.10
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Body Fat Measurment Flash MCU
Sta�t
No
No
No
HTX=1?
Yes
HAAS=1?
Yes
SIMTOF=1?
Yes
Yes
SET SIMTOEN
CLR SIMTOF
SRW=1?
No
RETI
Read f�om SIMD to
�elease SCL Line
RETI
Yes
SET HTX
CLR HTX
CLR TXAK
W�ite data to SIMD to
�elease SCL Line
D�mm� �ead f�om SIMD
to �elease SCL Line
RETI
RETI
RXAK=1?
No
CLR HTX
CLR TXAK
W�ite data to SIMD to
�elease SCL Line
D�mm� �ead f�om SIMD
to �elease SCL Line
RETI
RETI
I2C Bus ISR Flowchart
I2C Time-out Function
In order to reduce the I2C lockup problem due to reception of erroneous clock sources, a time-out
function is provided. If the clock source connected to the I2C bus is not received for a while, then
the I2C circuitry and the SIMC1 register will be reset, the SIMTOF bit in the SIMTOC register will
be set high after a certain time-out period. The Time Out function enable/disable and the time-out
period are managed by the SIMTOC register.
I2C Time-out Operation
The time-out counter starts to count on an I2C bus “START” & “address match” condition, and
is cleared by an SCL falling edge. Before the next SCL falling edge arrives, if the time elapsed is
greater than the time-out period specified by the SIMTOC register, then a time-out condition will
occur. The time-out function will stop when an I2C “STOP” condition occurs. There are 64 time-out
period selections which can be selected using the SIMTOS0~SIMTOS5 bits in the SIMTOC register.
Rev. 1.10
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SCL
Slave Add�ess
Sta�t
0
1
SDA
1
1
SRW
0
1
0
ACK
1
0
I�C time-o�t
co�nte� sta�t
Stop
SCL
1
0
0
1
0
1
0
0
SDA
I�C time-o�t co�nte� �eset on
SCL negative t�ansition
I2C Time-out Diagram
When an I2C time-out counter overflow occurs, the counter will stop and the SIMTOEN bit will
be cleared to “0” and the SIMTOF bit will be set high to indicate that a time-out condition has
occurred. When an I2C time-out occurs, the I2C internal circuitry will be reset and the registers will
be reset into the following condition:
Registers
After I2C Time-out
SIMD, SIMA, SIMC0
No change
SIMC1
Reset to POR condition
I C Registers after Time-out
2
Serial Peripheral Interface – SPIA
Each device contains an independent SPI function. It is important not to confuse this independent
SPI function with the additional one contained within the combined SIM function, which is
described in another section of this datasheet. This independent SPI function will carry the name
SPIA to distinguish it from the other one in the SIM.
The SPIA interface is often used to communicate with external peripheral devices such as sensors,
Flash or EEPROM memory devices etc. Originally developed by Motorola, the four line SPIA
interface is a synchronous serial data interface that has a relatively simple communication protocol
simplifying the programming requirements when communicating with external hardware devices.
The communication is full duplex and operates as a slave/master type, where the devices can be
either master or slave. Although the SPIA interface specification can control multiple slave devices
from a single master, however the device is provided with only one SCSA pin. If the master needs to
control multiple slave devices from a single master, the master can use I/O pins to select the slave
devices.
SPIA Interface Operation
The SPIA interface is a full duplex synchronous serial data link. It is a four line interface with pin
names SDIA, SDOA, SCKA and SCSA. Pins SDIA and SDOA are the Serial Data Input and Serial
Data Output lines, the SCKA pin is the Serial Clock line and SCSA is the Slave Select line. As the
SPIA interface pins are pin-shared with normal I/O pins, the SPIA interface must first be enabled by
configuring the corresponding selection bits in the pin-shared function selection registers. The SPIA
can be disabled or enabled using the SPIAEN bit in the SPIAC0 register. Communication between
devices connected to the SPIA interface is carried out in a slave/master mode with all data transfer
Rev. 1.10
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initiations being implemented by the master. The Master also controls the clock signal. As each
device only contains a single SCSA pin only one slave device can be utilized.
The SCSA pin is controlled by the application program, set the SACSEN bit to “1” to enable the
SCSA pin function and clear the SACSEN bit to “0” to place the SCSA pin into a floating state.
SPIA Maste�
SPIA Slave
SCKA
SCKA
SDOA
SDIA
SDIA
SDOA
SCSA
SCSA
SPIA Master/Slave Connection
The SPIA function in these devices offer the following features:
• Full duplex synchronous data transfer
• Both Master and Slave modes
• LSB first or MSB first data transmission modes
• Transmission complete flag
• Rising or falling active clock edge
The status of the SPIA interface pins is determined by a number of factors such as whether the
device is in the master or slave mode and upon the condition of certain control bits such as SACSEN
and SPIAEN.
Data B�s
SPIAD
SDIA
TX/RX Shift Register
SACKEG
SACKPOLB
SDOA
Clock
Edge/Pola�it�
Cont�ol
B�s�
Stat�s
SCKA
fSYS
fSUB
PTM1 CCRP match f�eq�enc�/�
Clock So��ce
Select
SAWCOL
SATRF
SPIAICF
SCSA
SACSEN
SPIA Block Diagram
Rev. 1.10
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SPIA Registers
There are three internal registers which control the overall operation of the SPIA interface. These are
the SPIAD data register and two registers, SPIAC0 and SPIAC1.
Register
Name
SPIAC0
Bit
7
6
SASPI2 SASPI1
SPIAC1
—
—
SPIAD
D7
D6
5
4
3
2
1
0
SASPI0
—
—
—
SPIAEN
SPIAICF
SACKPOLB SACKEG
D5
D4
SAMLS
SACSEN SAWCOL
D3
D2
D1
SATRF
D0
SPIA Registers List
SPIA Data Register
The SPIAD register is used to store the data being transmitted and received. Before the device
writes data to the SPIA bus, the actual data to be transmitted must be placed in the SPIAD register.
After the data is received from the SPIA bus, the device can read it from the SPIAD register. Any
transmission or reception of data from the SPIA bus must be made via the SPIAD register.
• SPIAD Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
x
x
x
x
x
x
x
x
“x” unknown
Bit 7~0
D7~D0: SPIA Data Register bit 7~bit 0
SPIA Control Registers
There are also two control registers for the SPIA interface, SPIAC0 and SPIAC1. The SPIAC0
register is used to control the enable/disable function and to set the data transmission clock
frequency. The SPIAC1 register is used for other control functions such as LSB/MSB selection,
write collision flag etc.
• SPIAC0 Register
Bit
7
6
5
4
3
2
1
0
Name
SASPI2
SASPI1
SASPI0
—
—
—
SPIAEN
SPIAICF
R/W
R/W
R/W
R/W
—
—
—
R/W
R/W
POR
1
1
1
—
—
—
0
0
Bit 7~5
SASPI2~SASPI0: SPIA Operating Mode Control
000: SPIA master mode; SPIA clock is fSYS/4
001: SPIA master mode; SPIA clock is fSYS/16
010: SPIA master mode; SPIA clock is fSYS/64
011: SPIA master mode; SPIA clock is fSUB
100: SPIA master mode; SPIA clock is PTM1 CCRP match frequency/2
101: SPIA slave mode
110: Unimplemented
111: Unimplemented
These bits are used to control the SPIA Master/Slave selection and the SPIA Master
clock frequency. The SPIA clock is a function of the system clock but can also be
chosen to be sourced from PTM1 and fSUB. If the SPIA Slave Mode is selected then the
clock will be supplied by an external Master device.
Bit 4~2
Rev. 1.10
Unimplemented, read as “0”
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Bit 1
SPIAEN: SPIA Enable Control
Bit 0
SPIAICF: SPIA Incomplete Flag
0: SPIA incomplete condition is not occurred
1: SPIA incomplete condition is occured
This bit is only available when the SPIA is configured to operate in an SPIA slave
mode. If the SPIA operates in the slave mode with the SPIAEN and SACSEN bits
both being set to “1” but the SCSA line is pulled high by the external master device
before the SPIA data transfer is completely finished, the SPIAICF bit will be set to 1
together with the SATRF bit. When this condition occurs, the corresponding interrupt
will occur if the interrupt function is enabled. However, the SATRF bit will not be set
to “1” if the SPIAICF bit is set to “1” by software application program.
0: Disable
1: Enable
The bit is the overall on/off control for the SPIA interface. When the SPIAEN bit
is cleared to “0” to disable the SPIA interface, the SDIA, SDOA, SCKA and SCSA
lines will lose their SPIA function and the SPIA operating current will be reduced to a
minimum value. When the bit is high the SPIA interface is enabled.
• SPIAC1 Register
Rev. 1.10
Bit
7
6
5
4
3
Name
—
—
SACKPOLB
SACKEG
SAMLS
2
1
R/W
—
—
R/W
R/W
R/W
R/W
R/W
R/W
POR
—
—
0
0
0
0
0
0
SACSEN SAWCOL
0
SATRF
Bit 7~6
Unimplemented, read as “0”
Bit 5
SACKPOLB: SPIA Clock Line Base Condition Selection
0: The SCKA line will be high when the clock is inactive
1: The SCKA line will be low when the clock is inactive
The SACKPOLB bit determines the base condition of the clock line, if the bit is high,
then the SCKA line will be low when the clock is inactive. When the SACKPOLB bit
is low, then the SCKA line will be high when the clock is inactive.
Bit 4
SACKEG: SPIA SCKA Clock Active Edge Type Selection
SACKPOLB=0
0: SCKA has high base level with data capture on SCKA rising edge
1: SCKA has high base level with data capture on SCKA falling edge
SACKPOLB=1
0: SCKA has low base level with data capture on SCKA falling edge
1: SCKA has low base level with data capture on SCKA rising edge
The SACKEG and SACKPOLB bits are used to setup the way that the clock signal
outputs and inputs data on the SPIA bus. These two bits must be configured before a
data transfer is executed otherwise an erroneous clock edge may be generated. The
SACKPOLB bit determines the base condition of the clock line, if the bit is high,
then the SCKA line will be low when the clock is inactive. When the SACKPOLB
bit is low, then the SCKA line will be high when the clock is inactive. The SACKEG
bit determines active clock edge type which depends upon the condition of the
SACKPOLB bit.
Bit 3
SAMLS: SPIA Data Shift Order
0: LSB first
1: MSB first
This is the data shift select bit and is used to select how the data is transferred, either
MSB or LSB first. Setting the bit high will select MSB first and low for LSB first.
Bit 2
SACSEN: SPIA SCSA Pin Control
0: Disable
1: Enable
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The SACSEN bit is used as an enable/disable for the SCSA pin. If this bit is low, then
the SCSA pin will be disabled and placed into a floating state. If the bit is high the
SCSA pin will be enabled and used as a select pin.
Bit 1
SAWCOL: SPIA Write Collision Flag
0: No collision
1: Collision
The SAWCOL flag is used to detect if a data collision has occurred. If this bit is high
it means that data has been attempted to be written to the SPIAD register during a data
transfer operation. This writing operation will be ignored if data is being transferred.
The bit can be cleared by the application program.
Bit 0
SATRF: SPIA Transmit/Receive Complete Flag
0: SPIA data is being transferred
1: SPIA data transmission is completed
The SATRF bit is the Transmit/Receive Complete flag and is set “1” automatically
when an SPIA data transmission is completed, but must set to “0” by the application
program. It can be used to generate an interrupt.
SPIA Communication
After the SPIA interface is enabled by setting the SPIAEN bit high, then in the Master Mode, when
data is written to the SPIAD register, transmission/reception will begin simultaneously. When the
data transfer is complete, the SATRF flag will be set automatically, but must be cleared using the
application program. In the Slave Mode, when the clock signal from the master has been received,
any data in the SPIAD register will be transmitted and any data on the SDIA pin will be shifted into
the SPIAD register.
The master should output an SCSA signal to enable the slave device before a clock signal is provided.
The slave data to be transferred should be well prepared at the appropriate moment relative to the
SCSA signal depending upon the configurations of the SACKPOLB bit and SACKEG bit. The
accompanying timing diagram shows the relationship between the slave data and SCSA signal for
various configurations of the SACKPOLB and SACKEG bits.
The SPIA will continue to function even in the IDLE Mode.
SPIAEN=1� SACSEN=0 (Exte�nal P�ll-high)
SCSA
SPIAEN� SACSEN=1
SCKA (SACKPOLB=1� SACKEG=0)
SCKA (SACKPOLB=0� SACKEG=0)
SCKA (SACKPOLB=1� SACKEG=1)
SCKA (SACKPOLB=0� SACKEG=1)
SDOA (SACKEG=0)
D7/D0
D6/D1
D5/D�
SDOA (SACKEG=1)
D7/D0
D6/D1
D5/D� D�/D3
D�/D3 D3/D�
D3/D�
D�/D5
D1/D6 D0/D7
D�/D5
D1/D6 D0/D7
SDIA Data Capt��e
W�ite to SPIAD
SPIA Master Mode Timing
Rev. 1.10
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SCSA
SCKA (SACKPOLB=1)
SCKA (SACKPOLB=0)
SDOA
D7/D0
D6/D1
D5/D�
D�/D3
D3/D�
D�/D5
D1/D6
D0/D7
D1/D6
D0/D7
SDIA Data Capt��e
W�ite to SPIAD
(SDOA does not change �ntil fi�st SCKA edge)
SPIA Slave Mode Timing – SACKEG=0
SCSA
SCKA (SACKPOLB=1)
SCKA (SACKPOLB=0)
SDOA
D7/D0
D6/D1
D5/D�
D�/D3
D3/D�
D�/D5
SDIA Data Capt��e
W�ite to SPIAD
(SDOA changes as soon as w�iting occ��s; SDOA is floating if SCSA=1)
Note: Fo� SPIA slave mode� if SPIAEN=1 and SACSEN=0� SPIA is alwa�s
enabled and igno�es the SCSA level.
SPIA Slave Mode Timing – SACKEG=1
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SPIA T�ansfe�
Maste�
A
W�ite Data
into SPIAD
Clea� SAWCOL
Slave
Maste� o� Slave
?
Yes
SASPI[�:0]=000� 001�
010� 011 o� 100
SAWCOL=1?
SASPIA[�:0]=101
No
No
Config��e SACKPOLB�
SACKEG� SACSEN and SAMLS
T�ansmission
completed?
(SATRF=1?)
Yes
SPIAEN=1
Read Data
f�om SPIAD
A
Clea� SATRF
T�ansfe� finished?
No
Yes
END
SPIA Transfer Control Flowchart
Rev. 1.10
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SPIA Bus Enable/Disable
To enable the SPIA bus, set SACSEN=1 and SCSA=0, then wait for data to be written into the
SPIAD (TXRX buffer) register. For the Master Mode, after data has been written to the SPIAD
(TXRX buffer) register, then transmission or reception will start automatically. When all the data has
been transferred the SATRF bit should be set. For the Slave Mode, when clock pulses are received
on SCKA, data in the TXRX buffer will be shifted out or data on SDIA will be shifted in.
To disable the SPIA bus SCKA, SDIA, SDOA, SCSA will become I/O pins or the other functions.
SPIA Operation
All communication is carried out using the 4-line interface for either Master or Slave Mode.
The SACSEN bit in the SPIAC1 register controls the overall function of the SPIA interface. Setting
this bit high will enable the SPIA interface by allowing the SCSA line to be active, which can then
be used to control the SPIA interface. If the SACSEN bit is low, the SPIA interface will be disabled
and the SCSA line will be an I/O pin or the other functions and can therefore not be used for control
of the SPIA interface. If the SACSEN bit and the SPIAEN bit in the SPIAC0 register are set high,
this will place the SDIA line in a floating condition and the SDOA line high. If in Master Mode the
SCKA line will be either high or low depending upon the clock polarity selection bit SACKPOLB
in the SPIAC1 register. If in Slave Mode the SCKA line will be in a floating condition. If SPIAEN is
low then the bus will be disabled and SCSA, SDIA, SDOA and SCKA will all become I/O pins or the
other functions. In the Master Mode the Master will always generate the clock signal. The clock and
data transmission will be initiated after data has been written into the SPIAD register. In the Slave
Mode, the clock signal will be received from an external master device for both data transmission
and reception. The following sequences show the order to be followed for data transfer in both
Master and Slave Mode.
Master Mode
• Step 1
Select the clock source and Master mode using the SASPI2~SASPI0 bits in the SPIAC0 control
register.
• Step 2
Setup the SACSEN bit and setup the SAMLS bit to choose if the data is MSB or LSB first, this
must be same as the Slave device.
• Step 3
Setup the SPIAEN bit in the SPIAC0 control register to enable the SPIA interface.
• Step 4
For write operations: write the data to the SPIAD register, which will actually place the data into
the TXRX buffer. Then use the SCKA and SCSA lines to output the data. After this go to step 5.
For read operations: the data transferred in on the SDIA line will be stored in the TXRX buffer
until all the data has been received at which point it will be latched into the SPIAD register.
• Step 5
Check the SAWCOL bit if set high then a collision error has occurred so return to step 4. If equal
to “0” then go to the following step.
• Step 6
Check the SATRF bit or wait for a SPIA serial bus interrupt.
Rev. 1.10
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Body Fat Measurment Flash MCU
• Step 7
Read data from the SPIAD register.
• Step 8
Clear SATRF.
• Step 9
Go to step 4.
Slave Mode
• Step 1
Select the SPIA Slave mode using the SASPI2~SASPI0 bits in the SPIAC0 control register.
• Step 2
Setup the SACSEN bit and setup the SAMLS bit to choose if the data is MSB or LSB first, this
setting must be the same with the Master device.
• Step 3
Setup the SPIAEN bit in the SPIAC0 control register to enable the SPIA interface.
• Step 4
For write operations: write the data to the SPIAD register, which will actually place the data into
the TXRX buffer. Then wait for the master clock SCKA and SCSA signal. After this, go to step 5.
For read operations: the data transferred in on the SDIA line will be stored in the TXRX buffer
until all the data has been received at which point it will be latched into the SPIAD register.
• Step 5
Check the SAWCOL bit if set high then a collision error has occurred so return to step 4. If equal
to “0” then go to the following step.
• Step 6
Check the SATRF bit or wait for a SPIA serial bus interrupt.
• Step 7
Read data from the SPIAD register.
• Step 8
Clear SATRF.
• Step 9
Go to step 4.
Error Detection
The SAWCOL bit in the SPIAC1 register is provided to indicate errors during data transfer. The bit
is set by the SPIA serial Interface but must be cleared by the application program. This bit indicates
a data collision has occurred which happens if a write to the SPIAD register takes place during a
data transfer operation and will prevent the write operation from continuing.
Rev. 1.10
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UART Interface
Each device contains an integrated full-duplex asynchronous serial communications UART interface
that enables communication with external devices that contain a serial interface. The UART function
has many features and can transmit and receive data serially by transferring a frame of data with
eight or nine data bits per transmission as well as being able to detect errors when the data is
overwritten or incorrectly framed. The UART function possesses its own internal interrupt which
can be used to indicate when a reception occurs or when a transmission terminates.
The integrated UART function contains the following features:
• Full-duplex, Universal Asynchronous Receiver and Transmitter (UART) communication
•
•
•
•
•
•
•
•
•
8 or 9 bits character length
Even, odd or no parity options
One or two stop bits
Baud rate generator with 8-bit prescaler
Parity, framing, noise and overrun error detection
Support for interrupt on address detect (last character bit=1)
Transmitter and receiver enabled independently
2-byte deep FIFO receive data buffer
Transmit and receive multiple interrupt generation sources
♦♦ Transmitter empty
♦♦ Transmitter idle
♦♦ Receiver full
♦♦ Receiver overrun
♦♦ Address mode detect
♦♦ RX pin wake-up interrupt (RX enable, RX falling edge)
UART External Pin Interfacing
To communicate with an external serial interface, the internal UART has two external pins known
as TX and RX. The TX and RX pins are the UART transmitter and receiver pins respectively. Along
with the UARTEN bit, the TXEN and RXEN bits, if set, will automatically setup these I/O or other
pin-shared functional pins to their respective TX output and RX input conditions and disable any
pull-high resistor option which may exist on the TX or RX pins. When the TX or RX pin function
is disabled by clearing the UARTEN and TXEN or RXEN bit, the TX or RX pin can be used as a
general purpose I/O or other pin-shared functional pin.
UART Data Transfer Scheme
The block diagram shows the overall data transfer structure arrangement for the UART interface.
The actual data to be transmitted from the MCU is first transferred to the TXR register by the
application program. The data will then be transferred to the Transmit Shift Register from where it
will be shifted out, LSB first, onto the TX pin at a rate controlled by the Baud Rate Generator. Only
the TXR register is mapped onto the MCU Data Memory, the Transmit Shift Register is not mapped
and is therefore inaccessible to the application program.
Data to be received by the UART is accepted on the external RX pin, from where it is shifted in,
LSB first, to the Receiver Shift Register at a rate controlled by the Baud Rate Generator. When
the shift register is full, the data will then be transferred from the shift register to the internal RXR
register, where it is buffered and can be manipulated by the application program. Only the RXR
register is mapped onto the MCU Data Memory, the Receiver Shift Register is not mapped and is
therefore inaccessible to the application program.
Rev. 1.10
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It should be noted that the actual register for data transmission and reception, although referred to
in the text, and in application programs, as separate TXR and RXR registers, only exists as a single
shared register in the Data Memory. This shared register known as the TXR_RXR register is used
for both data transmission and data reception.
T�ansmitte� Shift Registe�
MSB
Receive� Shift Registe�
LSB
…………………………
TX Pin
RX Pin
MSB
…………………………
Ba�d Rate
Gene�ato�
fH
TXR Register
LSB
RXR Register
B�ffe�
MCU Data B�s
UART Data Transfer Scheme
UART Status and Control Registers
There are five control registers associated with the UART function. The USR, UCR1 and UCR2
registers control the overall function of the UART, while the BRG register controls the Baud rate.
The actual data to be transmitted and received on the serial interface is managed through the TXR_
RXR data register.
Bit
Register
Name
USR
7
6
5
4
3
2
1
0
PERR
NF
FERR
OERR
RIDLE
RXIF
TIDLE
TXIF
UCR1
UARTEN
BNO
PREN
PRT
STOPS
TXBRK
RX8
TX8
UCR2
TXEN
RXEN
BRGH
ADDEN
WAKE
RIE
TIIE
TEIE
TXR_RXR
D7
D6
D5
D4
D3
D2
D1
D0
BRG
D7
D6
D5
D4
D3
D2
D1
D0
UART Register List
USR Register
The USR register is the status register for the UART, which can be read by the program to determine
the present status of the UART. All flags within the USR register are read only. Further explanation
on each of the flags is given below.
Bit
7
6
5
4
3
2
1
0
Name
PERR
NF
FERR
OERR
RIDLE
RXIF
TIDLE
TXIF
R/W
R
R
R
R
R
R
R
R
POR
0
0
0
0
1
0
1
1
Bit 7
Rev. 1.10
PERR: Parity Error Flag
0: No parity error is detected
1: Parity error is detected
The PERR flag is the parity error flag. When this read only flag is “0”, it indicates a
parity error has not been detected. When the flag is “1”, it indicates that the parity of
the received word is incorrect. This error flag is applicable only if Parity mode (odd or
even) is selected. The flag can also be cleared by a software sequence which involves
a read to the status register USR followed by an access to the RXR data register.
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Rev. 1.10
Bit 6
NF: Noise Flag
0: No noise is detected
1: Noise is detected
The NF flag is the noise flag. When this read only flag is “0”, it indicates no noise
condition. When the flag is “1”, it indicates that the UART has detected noise on the
receiver input. The NF flag is set during the same cycle as the RXIF flag but will not
be set in the case of as overrun. The NF flag can be cleared by a software sequence
which will involve a read to the status register USR followed by an access to the RXR
data register.
Bit 5
FERR: Framing Error Flag
0: No framing error is detected
1: Framing error is detected
The FERR flag is the framing error flag. When this read only flag is “0”, it indicates
that there is no framing error. When the flag is “1”, it indicates that a framing error
has been detected for the current character. The flag can also be cleared by a software
sequence which will involve a read to the status register USR followed by an access to
the RXR data register.
Bit 4
OERR: Overrun Error Flag
0: No overrun error is detected
1: Overrun error is detected
The OERR flag is the overrun error flag which indicates when the receiver buffer has
overflowed. When this read only flag is “0”, it indicates that there is no overrun error.
When the flag is “1”, it indicates that an overrun error occurs which will inhibit further
transfers to the RXR receive data register. The flag is cleared by a software sequence,
which is a read to the status register USR followed by an access to the RXR data
register.
Bit 3
RIDLE: Receiver Status
0: Data reception is in progress (data being received)
1: No data reception is in progress (receiver is idle)
The RIDLE flag is the receiver status flag. When this read only flag is “0”, it indicates
that the receiver is between the initial detection of the start bit and the completion of
the stop bit. When the flag is “1”, it indicates that the receiver is idle. Between the
completion of the stop bit and the detection of the next start bit, the RIDLE bit is “1”
indicating that the UART receiver is idle and the RX pin stays in logic high condition.
Bit 2
RXIF: Receive RXR Data Register Status
0: RXR data register is empty
1: RXR data register has available data
The RXIF flag is the receive data register status flag. When this read only flag is “0”,
it indicates that the RXR read data register is empty. When the flag is “1”, it indicates
that the RXR read data register contains new data. When the contents of the shift
register are transferred to the RXR register, an interrupt is generated if RIE=1 in the
UCR2 register. If one or more errors are detected in the received word, the appropriate
receive-related flags NF, FERR, and/or PERR are set within the same clock cycle. The
RXIF flag is cleared when the USR register is read with RXIF set, followed by a read
from the RXR register, and if the RXR register has no data available.
Bit 1
TIDLE: Transmission Idle
0: Data transmission is in progress (data being transmitted)
1: No data transmission is in progress (transmitter is idle)
The TIDLE flag is known as the transmission complete flag. When this read only
flag is “0”, it indicates that a transmission is in progress. This flag will be set to “1”
when the TXIF flag is “1” and when there is no transmit data or break character being
transmitted. When TIDLE is equal to “1”, the TX pin becomes idle with the pin state
in logic high condition. The TIDLE flag is cleared by reading the USR register with
TIDLE set and then writing to the TXR register. The flag is not generated when a data
character or a break is queued and ready to be sent.
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Bit 0
TXIF: Transmit TXR Data Register Status
0: Character is not transferred to the transmit shift register
1: Character has transferred to the transmit shift register (TXR data register is
empty)
The TXIF flag is the transmit data register empty flag. When this read only flag is “0”,
it indicates that the character is not transferred to the transmitter shift register. When
the flag is “1”, it indicates that the transmitter shift register has received a character
from the TXR data register. The TXIF flag is cleared by reading the UART status
register (USR) with TXIF set and then writing to the TXR data register. Note that
when the TXEN bit is set, the TXIF flag bit will also be set since the transmit data
register is not yet full.
UCR1 Register
The UCR1 register together with the UCR2 register are the two UART control registers that are used
to set the various options for the UART function, such as overall on/off control, parity control, data
transfer bit length etc. Further explanation on each of the bits is given below.
Bit
7
6
5
4
3
2
1
0
Name
UARTEN
BNO
PREN
PRT
STOPS
TXBRK
RX8
TX8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
W
POR
0
0
0
0
0
0
x
0
“x” unknown
Rev. 1.10
Bit 7
UARTEN: UART Function Enable Control
0: Disable UART. TX and RX pins are in a floating state
1: Enable UART. TX and RX pins function as UART pins
The UARTEN bit is the UART enable bit. When this bit is equal to “0”, the UART
will be disabled and the RX pin as well as the TX pin will be set in a floating state.
When the bit is equal to “1”, the UART will be enabled and the TX and RX pins will
function as defined by the TXEN and RXEN enable control bits.
When the UART is disabled, it will empty the buffer so any character remaining in
the buffer will be discarded. In addition, the value of the baud rate counter will be
reset. If the UART is disabled, all error and status flags will be reset. Also the TXEN,
RXEN, TXBRK, RXIF, OERR, FERR, PERR and NF bits will be cleared, while the
TIDLE, TXIF and RIDLE bits will be set. Other control bits in UCR1, UCR2 and
BRG registers will remain unaffected. If the UART is active and the UARTEN bit is
cleared, all pending transmissions and receptions will be terminated and the module
will be reset as defined above. When the UART is re-enabled, it will restart in the
same configuration.
Bit 6
BNO: Number of Data Transfer Bits Selection
0: 8-bit data transfer
1: 9-bit data transfer
This bit is used to select the data length format, which can have a choice of either
8-bit or 9-bit format. When this bit is equal to “1”, a 9-bit data length format will be
selected. If the bit is equal to “0”, then an 8-bit data length format will be selected. If
9-bit data length format is selected, then bits RX8 and TX8 will be used to store the 9th
bit of the received and transmitted data respectively.
Note: If BNO=1 (9-bit data transfer), parity function is enabled, the 9th bit of data is
the parity bit which will not be transferred to RX8.
If BNO=0 (8-bit data transfer), parity function is enabled, the 8th bit of data is
the parity bit which will not be transferred to RX7.
Bit 5
PREN: Parity Function Enable Control
0: Parity function is disabled
1: Parity function is enabled
This is the parity enable bit. When this bit is equal to “1”, the parity function will be
enabled. If the bit is equal to “0”, then the parity function will be disabled.
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Bit 4
PRT: Parity Type Selection Bit
0: Even parity for parity generator
1: Odd parity for parity generator
This bit is the parity type selection bit. When this bit is equal to “1”, odd parity type
will be selected. If the bit is equal to “0”, then even parity type will be selected.
Bit 3
STOPS: Number of Stop Bits Selection
0: One stop bit format is used
1: Two stop bits format is used
This bit determines if one or two stop bits are to be used for the TX pin. When this bit
is equal to “1”, two stop bits are used. If this bit is equal to “0”, then only one stop bit
is used.
Bit 2
TXBRK: Transmit Break Character
0: No break character is transmitted
1: Break characters transmit
The TXBRK bit is the Transmit Break Character bit. When this bit is “0”, there are
no break characters and the TX pin operates normally. When the bit is “1”, there are
transmit break characters and the transmitter will send logic zeros. When this bit is
equal to “1”, after the buffered data has been transmitted, the transmitter output is held
low for a minimum of a 13-bit length and until the TXBRK bit is reset.
Bit 1
RX8: Receive Data Bit 8 for 9-bit Data Transfer Format (read only)
This bit is only used if 9-bit data transfers are used, in which case this bit location will
store the 9th bit of the received data known as RX8. The BNO bit is used to determine
whether data transfers are in 8-bit or 9-bit format.
Bit 0
TX8: Transmit Data Bit 8 for 9-bit Data Transfer Format (write only)
This bit is only used if 9-bit data transfers are used, in which case this bit location
will store the 9th bit of the transmitted data known as TX8. The BNO bit is used to
determine whether data transfers are in 8-bit or 9-bit format.
UCR2 register
The UCR2 register is the second of the two UART control registers and serves several purposes. One
of its main functions is to control the basic enable/disable operation of the UART Transmitter and
Receiver as well as enabling the various UART interrupt sources. The register also serves to control
the baud rate speed, receiver wake-up enable and the address detect enable. Further explanation on
each of the bits is given below.
Bit
7
6
5
4
3
2
1
0
Name
TXEN
RXEN
BRGH
ADDEN
WAKE
RIE
TIIE
TEIE
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7
Rev. 1.10
TXEN: UART Transmitter Enable Control
0: UART transmitter is disabled
1: UART transmitter is enabled
The bit named TXEN is the Transmitter Enable Bit. When this bit is equal to “0”, the
transmitter will be disabled with any pending data transmissions being aborted. In
addition the buffers will be reset. In this situation the TX pin will be set in a floating
state.
If the TXEN bit is equal to “1” and the UARTEN bit is also equal to “1”, the transmitter
will be enabled and the TX pin will be controlled by the UART. Clearing the TXEN bit
during a transmission will cause the data transmission to be aborted and will reset the
transmitter. If this situation occurs, the TX pin will be set in a floating state.
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Rev. 1.10
Bit 6
RXEN: UART Receiver Enable Control
0: UART receiver is disabled
1: UART receiver is enabled
The bit named RXEN is the Receiver Enable Bit. When this bit is equal to “0”, the
receiver will be disabled with any pending data receptions being aborted. In addition
the receive buffers will be reset. In this situation the RX pin will be set in a floating
state. If the RXEN bit is equal to “1” and the UARTEN bit is also equal to “1”, the
receiver will be enabled and the RX pin will be controlled by the UART. Clearing the
RXEN bit during a reception will cause the data reception to be aborted and will reset
the receiver. If this situation occurs, the RX pin will be set in a floating state.
Bit 5
BRGH: Baud Rate Speed Selection
0: Low speed baud rate
1: High speed baud rate
The bit named BRGH selects the high or low speed mode of the Baud Rate Generator.
This bit, together with the value placed in the baud rate register BRG, controls the
Baud Rate of the UART. If this bit is equal to “1”, the high speed mode is selected. If
the bit is equal to “0”, the low speed mode is selected.
Bit 4
ADDEN: Address Detect Function Enable Control
0: Address detection function is disabled
1: Address detection function is enabled
The bit named ADDEN is the address detect function enable control bit. When this
bit is equal to “1”, the address detect function is enabled. When it occurs, if the 8th
bit, which corresponds to RX7 if BNO=0 or the 9th bit, which corresponds to RX8 if
BNO=1, has a value of “1”, then the received word will be identified as an address,
rather than data. If the corresponding interrupt is enabled, an interrupt request will be
generated each time the received word has the address bit set, which is the 8th or 9th
bit depending on the value of BNO. If the address bit known as the 8th or 9th bit of the
received word is “0” with the address detect function being enabled, an interrupt will
not be generated and the received data will be discarded.
Bit 3
WAKE: RX Pin Falling Edge Wake-up UART Function Enable Control
0: RX pin wake-up UART function is disabled
1: RX pin wake-up UART function is enabled
This bit is used to control the wake-up UART function when a falling edge on the RX
pin occurs. Note that this bit is only available when the UART clock (fH) is switched
off. There will be no RX pin wake-up UART function if the UART clock (fH) exists.
If the WAKE bit is set to 1 as the UART clock (fH) is switched off, a UART wakeup request will be initiated when a falling edge on the RX pin occurs. When this
request happens and the corresponding interrupt is enabled, an RX pin wake-up UART
interrupt will be generated to inform the MCU to wake up the UART function by
switching on the UART clock (fH) via the application program. Otherwise, the UART
function can not resume even if there is a falling edge on the RX pin when the WAKE
bit is cleared to “0”.
Bit 2
RIE: Receiver Interrupt Enable Control
0: Receiver related interrupt is disabled
1: Receiver related interrupt is enabled
This bit enables or disables the receiver interrupt. If this bit is equal to “1” and when
the receiver overrun flag OERR or receive data available flag RXIF is set, the UART
interrupt request flag will be set. If this bit is equal to “0”, the UART interrupt request
flag will not be influenced by the condition of the OERR or RXIF flags.
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Bit 1
TIIE: Transmitter IdleInterrupt Enable Control
0: Transmitter idle interrupt is disabled
1: Transmitter idle interrupt is enabled
This bit enables or disables the transmitter idle interrupt. If this bit is equal to “1” and
when the transmitter idle flag TIDLE is set, due to a transmitter idle condition, the
UART interrupt request flag will be set. If this bit is equal to “0”, the UART interrupt
request flag will not be influenced by the condition of the TIDLE flag.
Bit 0
TEIE: Transmitter Empty Interrupt Enable Control
0: Transmitter empty interrupt is disabled
1: Transmitter empty interrupt is enabled
This bit enables or disables the transmitter empty interrupt. If this bit is equal to “1”
and when the transmitter empty flag TXIF is set, due to a transmitter empty condition,
the UART interrupt request flag will be set. If this bit is equal to “0”, the UART
interrupt request flag will not be influenced by the condition of the TXIF flag.
TXR_RXR Register
The TXR_RXR register is the data register which is used to store the data to be transmitted on the
TX pin or being received from the RX pin.
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
x
x
x
x
x
x
x
x
“x” unknown
Bit 7~0
D7~D0: UART Transmit/Receive Data bit 7~bit 0
Baud Rate Generator
To setup the speed of the serial data communication, the UART function contains its own dedicated
baud rate generator. The baud rate is controlled by its own internal free running 8-bit timer, the period
of which is determined by two factors. The first of these is the value placed in the baud rate register
BRG and the second is the value of the BRGH bit with the control register UCR2. The BRGH bit
decides if the baud rate generator is to be used in a high speed mode or low speed mode, which in
turn determines the formula that is used to calculate the baud rate. The value in the BRG register, N,
which is used in the following baud rate calculation formula determines the division factor. Note that
N is the decimal value placed in the BRG register and has a range of between 0 and 255.
UCR2 BRGH Bit
0
1
Baud Rate (BR)
fH / [64 (N+1)]
fH / [16 (N+1)]
By programming the BRGH bit which allows selection of the related formula and programming the
required value in the BRG register, the required baud rate can be setup. Note that because the actual
baud rate is determined using a discrete value, N, placed in the BRG register, there will be an error
associated between the actual and requested value. The following example shows how the BRG
register value N and the error value can be calculated.
Rev. 1.10
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• BRG Register
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
x
x
x
x
x
x
x
x
“x” unknown
Bit 7~0
D7~D0: Baud RateValues
By programming the BRGH bit in UCR2 Register which allows selection of the
related formula described above and programming the required value in the BRG
register, the required baud rate can be setup.
Calculating the Baud Rate and error values
For a clock frequency of 4MHz, and with BRGH set to “0” determine the BRG register value N, the
actual baud rate and the error value for a desired baud rate of 4800.
From the above table the desired baud rate BR = fH / [64 (N+1)]
Re-arranging this equation gives N = [fH / (BR × 64)] − 1
Giving a value for N = [4000000 / (4800×64)] − 1 = 12.0208
To obtain the closest value, a decimal value of 12 should be placed into the BRG register. This gives
an actual or calculated baud rate value of BR = 4000000 / [64 × (12 + 1)] = 4808
Therefore the error is equal to (4808 − 4800) / 4800 = 0.16%
The following table shows actual values of baud rate and error values for the two values of BRGH.
Baud Rate
K/BPS
fSYS=8MHz
Baud Rates for BRGH=0
BRG
Kbaud
Baud Rates for BRGH=1
Error (%)
BRG
Kbaud
Error (%)
—
0.3
—
—
—
—
—
1.2
103
1.202
0.16
—
—
—
2.4
51
2.404
0.16
207
2.404
0.16
4.8
25
4.808
0.16
103
4.808
0.16
9.6
12
9.615
0.16
51
9.615
0.16
19.2
6
17.8857
-6.99
25
19.231
0.16
38.4
2
41.667
8.51
12
38.462
0.16
57.6
1
62.500
8.51
8
55.556
-3.55
115.2
0
125
8.51
3
125
8.51
250
—
—
—
1
250
0
Baud Rates and Error Values
Rev. 1.10
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Body Fat Measurment Flash MCU
UART Setup and Control
For data transfer, the UART function utilizes a non-return-to-zero, more commonly known as NRZ,
format. This is composed of one start bit, eight or nine data bits, and one or two stop bits. Parity
is supported by the UART hardware, and can be setup to be even, odd or no parity. For the most
common data format, 8 data bits along with no parity and one stop bit, denoted as 8, N, 1, is used
as the default setting, which is the setting at power-on. The number of data bits and stop bits, along
with the parity, are setup by programming the corresponding BNO, PRT, PREN, and STOPS bits
in the UCR1 register. The baud rate used to transmit and receive data is setup using the internal
8-bit baud rate generator, while the data is transmitted and received LSB first. Although the UART
transmitter and receiver are functionally independent, they both use the same data format and baud
rate. In all cases stop bits will be used for data transmission.
Enabling/Disabling the UART Interface
The basic on/off function of the internal UART function is controlled using the UARTEN bit in the
UCR1 register. If the UARTEN, TXEN and RXEN bits are set, then these two UART pins will act
as normal TX output pin and RX input pin respectively. If no data is being transmitted on the TX
pin, then it will default to a logic high value.
Clearing the UARTEN bit will disable the TX and RX pins and allow these two pins to be used as
normal I/O or other pin-shared functional pins. When the UART function is disabled the buffer will
be reset to an empty condition, at the same time discarding any remaining residual data. Disabling
the UART will also reset the error and status flags with bits TXEN, RXEN, TXBRK, RXIF, OERR,
FERR, PERR and NF being cleared while bits TIDLE, TXIF and RIDLE will be set. The remaining
control bits in the UCR1, UCR2 and BRG registers will remain unaffected. If the UARTEN bit in
the UCR1 register is cleared while the UART is active, then all pending transmissions and receptions
will be immediately suspended and the UART will be reset to a condition as defined above. If the
UART is then subsequently re-enabled, it will restart again in the same configuration.
Data, Parity and Stop Bit Selection
The format of the data to be transferred is composed of various factors such as data bit length,
parity on/off, parity type, address bits and the number of stop bits. These factors are determined by
the setup of various bits within the UCR1 register. The BNO bit controls the number of data bits
which can be set to either 8 or 9, the PRT bit controls the choice of odd or even parity, the PREN
bit controls the parity on/off function and the STOPS bit decides whether one or two stop bits are to
be used. The following table shows various formats for data transmission. The address bit, which is
the MSB of the data byte, identifies the frame as an address character or data if the address detect
function is enabled. The number of stop bits, which can be either one or two, is independent of the
data length and are only to be used for Transmitter. There is only one stop bit for Receiver.
Start Bit
Data Bits
Address Bits
Parity Bits
Stop Bit
Example of 8-bit Data Formats
1
8
0
0
1
1
7
0
1
1
1
7
1
0
1
Example of 9-bit Data Formats
1
9
0
0
1
1
8
0
1
1
1
8
1
0
1
Transmitter Receiver Data Format
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Body Fat Measurment Flash MCU
The following diagram shows the transmit and receive waveforms for both 8-bit and 9-bit data
formats.
Pa�it� Bit
Sta�t Bit
Bit 0
Bit 1
Bit �
Bit 3
Bit �
Bit 5
Bit 6
Bit 7
Stop Bit
Next
Sta�t
Bit
8-bit data format
Pa�it� Bit
Sta�t Bit
Bit 0
Bit 1
Bit �
Bit 3
Bit �
Bit 5
Bit 6
Bit 7
Bit �
Stop Bit
Next
Sta�t
Bit
9-bit data format
UART Transmitter
Data word lengths of either 8 or 9 bits can be selected by programming the BNO bit in the UCR1
register. When BNO bit is set, the word length will be set to 9 bits. In this case the 9th bit, which
is the MSB, needs to be stored in the TX8 bit in the UCR1 register. At the transmitter core lies the
Transmitter Shift Register, more commonly known as the TSR, whose data is obtained from the
transmit data register, which is known as the TXR register. The data to be transmitted is loaded
into this TXR register by the application program. The TSR register is not written to with new data
until the stop bit from the previous transmission has been sent out. As soon as this stop bit has been
transmitted, the TSR can then be loaded with new data from the TXR register, if it is available. It
should be noted that the TSR register, unlike many other registers, is not directly mapped into the
Data Memory area and as such is not available to the application program for direct read/write
operations. An actual transmission of data will normally be enabled when the TXEN bit is set, but
the data will not be transmitted until the TXR register has been loaded with data and the baud rate
generator has defined a shift clock source. However, the transmission can also be initiated by first
loading data into the TXR register, after which the TXEN bit can be set. When a transmission of
data begins, the TSR is normally empty, in which case a transfer to the TXR register will result in
an immediate transfer to the TSR. If during a transmission the TXEN bit is cleared, the transmission
will immediately cease and the transmitter will be reset. The TX output pin will then return to the
I/O or other pin-shared function.
Transmitting Data
When the UART is transmitting data, the data is shifted on the TX pin from the shift register, with
the least significant bit first. In the transmit mode, the TXR register forms a buffer between the
internal bus and the transmitter shift register. It should be noted that if 9-bit data format has been
selected, then the MSB will be taken from the TX8 bit in the UCR1 register. The steps to initiate a
data transfer can be summarized as follows:
• Make the correct selection of the BNO, PRT, PREN and STOPS bits to define the required word
length, parity type and number of stop bits.
• Setup the BRG register to select the desired baud rate.
• Set the TXEN bit to ensure that the UART transmitter is enabled and the TX pin is used as a
UART transmitter pin.
• Access the USR register and write the data that is to be transmitted into the TXR register. Note
that this step will clear the TXIF bit.
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Body Fat Measurment Flash MCU
This sequence of events can now be repeated to send additional data. It should be noted that when
TXIF is “0”, data will be inhibited from being written to the TXR register. Clearing the TXIF flag is
always achieved using the following software sequence:
• A USR register access
• A TXR register write execution
The read-only TXIF flag is set by the UART hardware and if set indicates that the TXR register is
empty and that other data can now be written into the TXR register without overwriting the previous
data. If the TEIE bit is set then the TXIF flag will generate an interrupt. During a data transmission,
a write instruction to the TXR register will place the data into the TXR register, which will be
copied to the shift register at the end of the present transmission. When there is no data transmission
in progress, a write instruction to the TXR register will place the data directly into the shift register,
resulting in the commencement of data transmission, and the TXIF bit being immediately set. When
a frame transmission is complete, which happens after stop bits are sent or after the break frame, the
TIDLE bit will be set. To clear the TIDLE bit the following software sequence is used:
• A USR register access
• A TXR register write execution
Note that both the TXIF and TIDLE bits are cleared by the same software sequence.
Transmit Break
If the TXBRK bit is set then break characters will be sent on the next transmission. Break character
transmission consists of a start bit, followed by 13×N ‘0’ bits and stop bits, where N=1, 2, etc. If a
break character is to be transmitted then the TXBRK bit must be first set by the application program
and then cleared to generate the stop bits. Transmitting a break character will not generate a transmit
interrupt. Note that a break condition length is at least 13 bits long. If the TXBRK bit is continually
kept at a logic high level then the transmitter circuitry will transmit continuous break characters.
After the application program has cleared the TXBRK bit, the transmitter will finish transmitting the
last break character and subsequently send out one or two stop bits. The automatic logic highs at the
end of the last break character will ensure that the start bit of the next frame is recognized.
UART Receiver
The UART is capable of receiving word lengths of either 8 or 9 bits can be selected by programming
the BNO bit in the UCR register. If the BNO bit is set, the word length will be set to 9 bits with the
MSB being stored in the RX8 bit of the UCR1 register. At the receiver core lies the Receive Serial
Shift Register, commonly known as the RSR. The data which is received on the RX external input
pin is sent to the data recovery block. The data recovery block operating speed is 16 times that of the
baud rate, while the main receive serial shifter operates at the baud rate. After the RX pin is sampled
for the stop bit, the received data in RSR is transferred to the receive data register, if the register is
empty. The data which is received on the external RX input pin is sampled three times by a majority
detect circuit to determine the logic level that has been placed onto the RX pin. It should be noted
that the RSR register, unlike many other registers, is not directly mapped into the Data Memory area
and as such is not available to the application program for direct read/write operations.
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Receiving Data
When the UART receiver is receiving data, the data is serially shifted in on the external RX input
pin to the shift register, with the least significant bit LSB first. The RXR register is a two byte deep
FIFO data buffer, where two bytes can be held in the FIFO while a third byte can continue to be
received. Note that the application program must ensure that the data is read from RXR before the
third byte has been completely shifted in, otherwise this third byte will be discarded and an overrun
error OERR will be subsequently indicated. The steps to initiate a data transfer can be summarized
as follows:
• Make the correct selection of BNO, PRT and PREN bits to define the word length and parity
type.
• Setup the BRG register to select the desired baud rate.
• Set the RXEN bit to ensure that the UART receiver is enabled and the RX pin is used as a UART
receiver pin.
At this point the receiver will be enabled which will begin to look for a start bit.
When a character is received, the following sequence of events will occur:
• The RXIF bit in the USR register will be set when the RXR register has data available. There
will be at most one more characters available before an overrun error occurs.
• When the contents of the shift register have been transferred to the RXR register and if the RIE
bit is set, then an interrupt will be generated.
• If during reception, a frame error, noise error, parity error, or an overrun error has been detected,
then the error flags can be set.
The RXIF bit can be cleared using the following software sequence:
• A USR register access
• An RXR register read execution
Receive Break
Any break character received by the UART will be managed as a framing error. The receiver will
count and expect a certain number of bit times as specified by the values programmed into the
BNO and plusing one STOP bit. If the break is much longer than 13 bit times, the reception will
be considered as complete after the number of bit times specified by BNO and plusing one STOP
bit. The RXIF bit is set, FERR is set, zeros are loaded into the receive data register, interrupts are
generated if appropriate and the RIDLE bit is set. A break is regarded as a character that contains
only zeros with the FERR flag set. If a long break signal has been detected, the receiver will regard
it as a data frame including a start bit, data bits and the invalid stop bit and the FERR flag will be
set. The receiver must wait for a valid stop bit before looking for the next start bit. The receiver will
not make the assumption that the break condition on the line is the next start bit. The break character
will be loaded into the buffer and no further data will be received until stop bits are received. It
should be noted that the RIDLE read only flag will go high when the stop bits have not yet been
received. The reception of a break character on the UART registers will result in the following:
• The framing error flag, FERR, will be set
• The receive data register, RXR, will be cleared
• The OERR, NF, PERR, RIDLE or RXIF flags will possibly be set
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Idle Status
When the receiver is reading data, which means it will be in between the detection of a start bit and
the reading of a stop bit, the receiver status flag in the USR register, otherwise known as the RIDLE
flag, will have a zero value. In between the reception of a stop bit and the detection of the next start
bit, the RIDLE flag will have a high value, which indicates the receiver is in an idle condition.
Receiver Interrupt
The read only receive interrupt flag RXIF in the USR register is set by an edge generated by the
receiver. An interrupt is generated if RIE bit is “1”, when a word is transferred from the Receive
Shift Register, RSR, to the Receive Data Register, RXR. An overrun error can also generate an
interrupt if RIE is “1”.
Managing Receiver Errors
Several types of reception errors can occur within the UART module, the following section describes
the various types and how they are managed by the UART.
Overrun Error – OERR flag
The RXR register is composed of a two byte deep FIFO data buffer, where two bytes can be held
in the FIFO register, while a third byte can continue to be received. Before this third byte has been
entirely shifted in, the data should be read from the RXR register. If this is not done, the overrun
error flag OERR will be consequently indicated.
In the event of an overrun error occurring, the following will happen:
• The OERR flag in the USR register will be set.
• The RXR contents will not be lost.
• The shift register will be overwritten.
• An interrupt will be generated if the RIE bit is set.
The OERR flag can be cleared by an access to the USR register followed by a read to the RXR
register.
Noise Error – NF Flag
Over-sampling is used for data recovery to identify valid incoming data and noise. If noise is
detected within a frame the following will occur:
• The read only noise flag, NF, in the USR register will be set on the rising edge of the RXIF bit.
• Data will be transferred from the Shift register to the RXR register.
• No interrupt will be generated. However this bit rises at the same time as the RXIF bit which
itself generates an interrupt.
Note that the NF flag is reset by a USR register read operation followed by an RXR register read
operation.
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Body Fat Measurment Flash MCU
Framing Error – FERR Flag
The read only framing error flag, FERR, in the USR register, is set if a zero is detected instead of
stop bits. If two stop bits are selected, only the first stop bit is detected, it must be high. If the first
stop bit is low, the FERR flag will be set. The FERR flag and the received data will be recorded in
the USR and RXR registers respectively, and the flag is cleared in any reset.
Parity Error – PERR Flag
The read only parity error flag, PERR, in the USR register, is set if the parity of the received word is
incorrect. This error flag is only applicable if the parity is enabled, PREN bit is “1”, and if the parity
type, odd or even is selected. The read only PERR flag and the received data will be recorded in
the USR and RXR registers respectively. It is cleared on any reset, it should be noted that the flags,
FERR and PERR, in the USR register should first be read by the application program before reading
the data word.
UART Module Interrupt Structure
Several individual UART conditions can generate a UART interrupt. When these conditions exist,
a low pulse will be generated to get the attention of the microcontroller. These conditions are a
transmitter data register empty, transmitter idle, receiver data available, receiver overrun, address
detect and an RX pin wake-up. When any of these conditions are created, if its corresponding
interrupt control is enabled and the stack is not full, the program will jump to its corresponding
interrupt vector where it can be serviced before returning to the main program. Four of these
conditions have the corresponding USR register flags which will generate a UART interrupt if its
associated interrupt enable control bit in the UCR2 register is set. The two transmitter interrupt
conditions have their own corresponding enable control bits, while the two receiver interrupt
conditions have a shared enable control bit. These enable bits can be used to mask out individual
UART interrupt sources.
The address detect condition, which is also a UART interrupt source, does not have an associated
flag, but will generate a UART interrupt when an address detect condition occurs if its function is
enabled by setting the ADDEN bit in the UCR2 register. An RX pin wake-up, which is also a UART
interrupt source, does not have an associated flag, but will generate a UART interrupt if the UART
clock (fH) is switched off and the WAKE and RIE bits in the UCR2 register are set when a falling
edge on the RX pin occurs.
Note that the USR register flags are read only and cannot be cleared or set by the application
program, neither will they be cleared when the program jumps to the corresponding interrupt
servicing routine, as is the case for some of the other interrupts. The flags will be cleared
automatically when certain actions are taken by the UART, the details of which are given in the
UART register section. The overall UART interrupt can be disabled or enabled by the related
interrupt enable control bits in the interrupt control registers of the microcontroller to decide whether
the interrupt requested by the UART module is masked out or allowed.
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Body Fat Measurment Flash MCU
USR Registe�
UCR� Registe�
T�ansmitte� Empt�
Flag TXIF
TEIE
T�ansmitte� Idle
Flag TIDLE
TIIE
0
1
RIE
0
1
Receive� Ove���n
Flag OERR
OR
Receive� Data
Available RXIF
RX Pin
Wake-�p
WAKE
ADDEN
0
1
INTC�
Registe�
UART Inte���pt
Req�est Flag
URF
URE
INTC0
Registe�
EMI
0
1
0
1
0
1
RX7 if BNO=0
RX8 if BNO=1
UCR� Registe�
UART Interrupt Scheme
Address Detect Mode
Setting the Address Detect Mode bit, ADDEN, in the UCR2 register, enables this special mode.
If this bit is enabled then an additional qualifier will be placed on the generation of a Receiver
Data Available interrupt, which is requested by the RXIF flag. If the ADDEN bit is “1”, then when
data is available, an interrupt will only be generated, if the highest received bit has a high value.
Note that the related interrupt enable control bit and the EMI bit must also be enabled for correct
interrupt generation. This highest address bit is the 9th bit if BNO bit is “1” or the 8th bit if BNO
bit is “0”. If this bit is high, then the received word will be defined as an address rather than data. A
Data Available interrupt will be generated every time the last bit of the received word is set. If the
ADDEN bit is “0”, then a Receiver Data Available interrupt will be generated each time the RXIF
flag is set, irrespective of the data last bit status. The address detect mode and parity enable are
mutually exclusive functions. Therefore if the address detect mode is enabled, then to ensure correct
operation, the parity function should be disabled by resetting the parity enable bit PREN to “0”.
ADDEN
0
1
Bit 9 if BNO=1
Bit 8 if BNO=0
UART Interrupt
Generated
0
√
1
√
0
×
1
√
ADDEN Bit Function
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UART Power Down and Wake-up
When the UART clock (fH) is switched off, the UART will cease to function, all clock sources to
the module are shutdown. If the UART clock (fH) is off while a transmission is still in progress, then
the transmission will be paused until the UART clock (fH) source derived from the microcontroller
is activated. In a similar way, if the device executes the “HALT” instruction and switches off the
system clock while receiving data, then the reception of data will likewise be paused. When the
device enters the IDLE or SLEEP Mode, note that the USR, UCR1, UCR2, transmit and receive
registers, as well as the BRG register will not be affected. It is recommended to make sure first that
the UART data transmission or reception has been finished before the microcontroller enters the
IDLE or SLEEP mode.
The UART function contains a receiver RX pin wake-up function, which is enabled or disabled
by the WAKE bit in the UCR2 register. If this bit, along with the UART enable bit, UARTEN, the
receiver enable bit, RXEN and the receiver interrupt bit, RIE, are all set when the UART clock (fH)
is off, then a falling edge on the RX pin will trigger an RX pin wake-up UART interrupt. Note that
as it takes certain system clock cycles after a wake-up, before normal microcontroller operation
resumes, any data received during this time on the RX pin will be ignored.
For a UART wake-up interrupt to occur, in addition to the bits for the wake-up being set, the global
interrupt enable bit, EMI, and the UART interrupt enable bit, URE, must also be set. If these two
bits are not set then only a wake up event will occur and no interrupt will be generated. Note also
that as it takes certain system clock cycles after a wake-up before normal microcontroller resumes,
the UART interrupt will not be generated until after this time has elapsed.
Rev. 1.10
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Body Fat Measurment Flash MCU
Body Fat Measurement Function
The body fat circuit consists of sine generator, operational amplifier and filter. It is high quality,
flexibility and high integration for body fat measurement. The whole module power is from LDO.
Sine Wave Generator
The sine generator consists of a frequency divider, counter, RAM, 10-bit D/A converter and OP0. It
offers the wide range 5kHz~500kHz sine wave generator and 32×9 bits RAM for sine wave pattern
by software setting.The frequency divider will multiply by DN/M to generate a clock to counter. The
related details refer to following formula.
• System clock / M = sine wave frequency
• System clock × (DN/M) = counter count rate
• The M must be the multiple of N and 8.
• M = N × DN
• DNR = DN / 2
• DN: sine wave cycle data number (DN ≤ 64)
• DNR: 1/2 sine wave cycle stored in RAM(DNR ≤ 32) data number
Please refer to following table and figure in details.
System Frequency
The Frequency of Sine Wave (kHz)
4MHz
8MHz
12MHz
500
50
5
500
50
5
500
50
5
M
8
80
800
16
160
1600
24
240
2400
N
1
2
20
1
4
25
1
5
50
DN
8
40
40
16
40
64
24
48
48
DNR
4
20
20
8
20
32
12
24
24
Note: The sine wave generator circuit consists of a 10-bit D/A converter and a smoothing filter
whose frequency at -3dB is equal to 489kHz. When the output frequency is 500kHz, the
output wave amplitude will decrease and therefore it is impossible to achieve a full range of
VOREG~0.
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511
0
P0
P�
P1
PDNR-3 PDNR-1
PDNR-�
-51�
It is only necessary to generate a half sine wave pattern P0~PDNR-1 which is stored in RAM sector
3 (00H~3FH). The sine pattern [7:0] is stored using even addresses and the sine pattern [8] is stored
using odd addresses. Once the sine generator is enabled, the CPU cannot writes/read any data to/
from this RAM. The sine generator will then read this RAM data and transmit it to an 10-bit D/A
converter.
The controller reads a half sine pattern from RAM and generates a sine waveform on the SIN pin.
Refer to following figure.
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DN_CNT>=DNR
“0”
0
“1”
1
D[9]
SINE[�:0]
0
�'s
Complement
00H
+
D[9:0]
DAC
1
SINE0[7:0]
SINE0[�]
01H
0�H
D[�:0]
SINE1[7:0]
SINE1[�]
03H
SINE0[�:0]
SINE1[�:0]
SINE�[�:0]
SINE3[�:0]
3BH
3CH
SINE30[7:0]
SINE30[�]
3DH
3EH
SINE30[�:0]
SINE31[�:0]
SINE31[7:0]
SINE31[�]
3FH
SINE Wave Pattern
RAM (Sector 3)
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Body Fat Measurement Registers
There are a series of registers control the overall operation of the body fat measurement function.
Sine Wave Generator
The sine wave generator is controlled by three registers. Details are given as below.
• SGC Register
Bit
7
6
5
4
3
2
1
0
Name
SGEN
D6
D5
BREN
—
—
—
—
R/W
R/W
R/W
R/W
R/W
—
—
—
—
POR
0
0
0
0
—
—
—
—
Bit 7
SGEN: Sine Generator Enabled
0: Disable
1: Enable
When this bit is equal to “0”, the OP0 and 10-bit D/A converter will be in a power
down mode.
Bit 6~5
D6~D5: Reserved bits, must be fixed as “00”.
Bit 4
BREN: Bias Resistors Control bit
0: Disable – power down mode
1: Enable – normal mode
Bit 3~0
Unimplemented, read as “0”
• SGN Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
D5
D4
D3
D2
D1
D0
R/W
—
—
R/W
R/W
R/W
R/W
R/W
R/W
POR
—
—
0
0
0
0
0
0
Bit 7~6 Unimplemented, read as “0”
Bit 5~0
D5~D0: Sine Generator Data
The multiplicator of system frequency (N)
The multiplicator (N) is equal to D[5:0]+1
• SGDNR Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
D4
D3
D2
D1
D0
R/W
—
—
—
R/W
R/W
R/W
R/W
R/W
POR
—
—
—
0
0
0
0
0
Bit 7~5 Unimplemented, read as “0”
Bit 4~0
D4~D0: Data Number of Sample
1/2 sine wave cycle numerical value is stored in RAM Sector 3. DNR is equal to
D[4:0]+1.
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Amplifier
Five registers are associated with the amplifier operation. The OPAC register for controlling the
operational amplifier, the SWC0, SWC1 and SWC2 registers for configuring the switch condition as
well as the DACO register for setting the 6-bit D/A converter output.
• OPAC Register
Bit
7
6
5
4
3
2
1
0
Name
OPAEN
—
—
—
OP2G3
OP2G2
OP2G1
OP2G0
R/W
R/W
—
—
—
R/W
R/W
R/W
R/W
POR
0
—
—
—
0
0
0
0
Bit 7
OPAEN: Operational Amplifier Control
0: Disable
1: Enable
When this bit is equal to “0”, OP1, OP2 and 6-bit D/A converter will be in a power
down mode.
Bit 6~4
Unimplemented, read as “0”
Bit 3~0
OP2G3~OP2G0: OP2 Gain Control
0001: 1.14
0010: 1.31
0011: 1.50
0100: 1.73
0101: 2.00
0110: 2.33
0111: 2.75
1000: 3.285
1001: 4.00
1010: 5.00
others: 1.00
• SWC0 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
IHR2
VHR1
IHL1
VHL2
IFR2
VFR1
IFL1
VFL2
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7
IHR2: Switch IHR2 Control Bit
0: Off
1: On
Bit 6
VHR1: Switch VHR1 Control Bit
0: Off
1: On
Bit 5
IHL1: Switch IHL1 Control Bit
0: Off
1: On
Bit 4
VHL2: Switch VHL2 Control Bit
0: Off
1: On
Bit 3
IFR2: Switch IFR2 Control Bit
0: Off
1: On
Bit 2
VFR1: Switch VFR1 Control Bit
0: Off
1: On
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Bit 1
IFL1: Switch IFL1 Control Bit
0: Off
1: On
Bit 0
VFL2: Switch VFL2 Control Bit
0: Off
1: On
• SWC1 Register
Bit
7
6
5
4
3
2
1
0
Name
—
VHL1
IHL2
VRFN
VRFP1
IRF1
VRFP2
IRF2
R/W
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
—
0
0
0
0
0
0
0
Bit 7
Unimplemented, read as “0”
Bit 6
VHL1: Switch VHL1 Control Bit
0: Off
1: On
Bit 5
IHL2: Switch IHL1 Control Bit
0: Off
1: On
Bit 4
VRFN: Switch VRFN Control Bit
0: Off
1: On
Bit 3
VRFP1: Switch VRFP1 Control Bit
0: Off
1: On
Bit 2
IRF1: Switch IRF1 Control Bit
0: Off
1: On
Bit 1
VRFP2: Switch VRFP2 Control Bit
0: Off
1: On
Bit 0
IRF2: Switch IRF2 Control Bit
0: Off
1: On
• SWC2 register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
—
VHR2
IHR1
VFL1
VFR2
IFL2
IFR1
—
R/W
—
R/W
R/W
R/W
R/W
R/W
R/W
—
POR
—
0
0
0
0
0
0
—
Bit 7
Unimplemented, read as “0”
Bit 6
VHR2: switch VHR2 control bit
0: Off
1: On
Bit 5
IHR1: switch IHR1 control bit
0: Off
1: On
Bit 4
VFL1: switch VFL1 control bit
0: Off
1: On
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Bit 3
VFR2: switch VFR2 control bit
0: Off
1: On
Bit 2
IFL2: switch IFL2 control bit
0: Off
1: On
Bit 1
IFR1: switch IFR1 control bit
0: Off
1: On
Bit 0
Unimplemented, read as “0”
• DACO Register
Bit
7
6
5
4
3
2
1
Name
—
—
D5
D4
D3
D2
D1
D0
R/W
—
—
R/W
R/W
R/W
R/W
R/W
R/W
POR
—
—
0
0
0
0
0
0
Bit 7~6
Unimplemented, read as “0”
Bit 5~0
D5~D0: 6-bit D/A Converter Output Voltage=0.5VOREG × ((D[5:0]+1)/64)
0
Filter
The FTRC register controls the operation of the filter part.
• FTRC Register
Bit
7
6
5
4
3
2
1
0
Name
FTREN
—
—
HYSEN
—
—
SW19
SW18
R/W
R/W
—
—
R/W
—
—
R/W
R/W
POR
0
—
—
0
—
—
0
0
Bit 7
Rev. 1.10
FTREN: Filter Control Bit
0: Disable
1: Enable
When this bit is equal to “0”, CP0 and PMOS will be in a power down mode.
Bit 6~5
Unimplemented, read as “0”
Bit 4
HYSEN: CP0 Hysteresis control bit
0: Disable
1: Enable
Bit 3~2
Unimplemented, read as “0”
Bit 1
SW19: Switch 19 Control Bit
0: Off
1: On
Bit 0
SW18: Switch 18 Control Bit
0: Off
1: On
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Interrupts
Interrupts are an important part of any microcontroller system. When an external event or an
internal function such as a Timer Module or an A/D converter requires microcontroller attention,
their corresponding interrupt will enforce a temporary suspension of the main program allowing the
microcontroller to direct attention to their respective needs. The devices contain several external
interrupt and internal interrupt functions. The external interrupts are generated by the action of the
external INT0~INT1 pins, while the internal interrupts are generated by various internal functions
such as the Timer Modules (TMs), Time Bases, Serial Interface Module (SIM), Serial Peripheral
Interface (SPIA), UART, Low Voltage Detector (LVD), EEPROM and the A/D converter.
Interrupt Registers
Overall interrupt control, which basically means the setting of request flags when certain
microcontroller conditions occur and the setting of interrupt enable bits by the application program,
is controlled by a series of registers, located in the Special Purpose Data Memory. The registers fall
into three categories. The first is the INTC0~INTC3 registers which setup the primary interrupts,
the second is the MFI0~MFI2 registers which setup the Multi-function interrupts. Finally there is an
INTEG register to setup the external interrupts trigger edge type.
Each register contains a number of enable bits to enable or disable individual registers as well as
interrupt flags to indicate the presence of an interrupt request. The naming convention of these
follows a specific pattern. First is listed an abbreviated interrupt type, then the (optional) number of
that interrupt followed by either an “E” for enable/disable bit or “F” for request flag.
Function
Enable Bit
Request Flag
Notes
Global
EMI
INTn Pin
INTnE
INTnF
A/D Converter
ADE
ADF
Multi-function
MFnE
MFnF
n=0~2
Time Base
TBnE
TBnF
n=0~1
LVD
LVE
LVF
—
EEPROM
DEE
DEF
—
UART
URE
URF
—
SIM
SIME
SIMF
—
SPIA
SPIAE
SPIAF
—
STMPE
STMPF
STMAE
STMAF
PTMnPE
PTMnPF
PTMnAE
PTMnAF
STM
PTM
—
—
n=0~1
—
—
n=0~2
Interrupt Register Bit Naming Conventions
Bit
Register
Name
7
6
5
4
3
2
1
0
INTEG
—
—
—
—
INT1S1
INT1S0
INT0S1
INT0S0
INTC0
—
ADF
INT1F
INT0F
ADE
INT1E
INT0E
EMI
INTC1
—
MF2F
MF1F
MF0F
—
MF2E
MF1E
MF0E
INTC2
SIMF
URF
TB1F
TB0F
SIME
URE
TB1E
TB0E
INTC3
—
—
—
SPIAF
—
—
—
SPIAE
MFI0
PTM0AF
PTM0PF
STMAF
STMPF
PTM0AE
PTM0PE
STMAE
STMPE
MFI1
PTM2AF
PTM2PF
PTM1AF
PTM1PF
PTM2AE
PTM2PE
PTM1AE
PTM1PE
MFI2
—
—
DEF
LVF
—
—
DEE
LVE
Interrupt Register List
Rev. 1.10
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INTEG Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
INT1S1
INT1S0
INT0S1
INT0S0
R/W
—
—
—
—
R/W
R/W
R/W
R/W
POR
—
—
—
—
0
0
0
0
Bit 7~4
Unimplemented, read as “0”
Bit 3~2
INT1S1~INT1S0: Interrupt Edge Control for INT1 Pin
00: Disable
01: Rising edge
10: Falling edge
11: Rising and falling edges
Bit 1~0
INT0S1~INT0S0: Interrupt Edge Control for INT0 Pin
00: Disable
01: Rising edge
10: Falling edge
11: Rising and falling edges
INTC0 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
—
ADF
INT1F
INT0F
ADE
INT1E
INT0E
EMI
R/W
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
—
0
0
0
0
0
0
0
Bit 7
Unimplemented, read as “0”
Bit 6
ADF: A/D Converter Interrupt Request Flag
0: No request
1: Interrupt request
Bit 5
INT1F: External Interrupt 1Request Flag
0: No request
1: Interrupt request
Bit 4
INT0F: External Interrupt 0 Request Flag
0: No request
1: Interrupt request
Bit 3
ADE: A/D Converter Interrupt Control
0: Disable
1: Enable
Bit 2
INT1E: External Interrupt 1 Control
0: Disable
1: Enable
Bit 1
INT0E: External Interrupt 0 Control
0: Disable
1: Enable
Bit 0
EMI: Global Interrupt Control
0: Disable
1: Enable
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INTC1 Register
Bit
7
6
5
4
3
2
1
0
Name
—
MF2F
MF1F
MF0F
—
MF2E
MF1E
MF0E
R/W
—
R/W
R/W
R/W
—
R/W
R/W
R/W
POR
—
0
0
0
—
0
0
0
Bit 7
Unimplemented, read as “0”
Bit 6
MF2F: Multi-function Interrupt 2 Request Flag
0: No request
1: Interrupt request
Bit 5
MF1F: Multi-function Interrupt 1 Request Flag
0: No request
1: Interrupt request
Bit 4
MF0F: Multi-function Interrupt 0 Request Flag
0: No request
1: Interrupt request
Bit 3
Unimplemented, read as “0”
Bit 2
MF2E: Multi-function Interrupt 2 Control
0: Disable
1: Enable
Bit 1
MF1E: Multi-function Interrupt 1 Control
0: Disable
1: Enable
Bit 0
MF0E: Multi-function Interrupt 0 Control
0: Disable
1: Enable
INTC2 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
SIMF
URF
TB1F
TB0F
SIME
URE
TB1E
TB0E
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7
SIMF: Serial Interface Module Interrupt Request Flag
0: No request
1: Interrupt request
Bit 6
URF: UART Interrupt Request Flag
0: No request
1: Interrupt request
Bit 5
TB1F: Time Base 1 Interrupt Request Flag
0: No request
1: Interrupt request
Bit 4
TB0F: Time Base 0 Interrupt Request Flag
0: No request
1: Interrupt request
Bit 3
SIME: Serial Interface Module Interrupt Control
0: Disable
1: Enable
Bit 2
URE: Serial Interface Module Interrupt Control
0: Disable
1: Enable
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Bit 1
TB1E: Time Base 1 Interrupt Control
0: Disable
1: Enable
Bit 0
TB0E: Time Base 0 Interrupt Control
0: Disable
1: Enable
INTC3 Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
SPIAF
—
—
—
SPIAE
R/W
—
—
—
R/W
—
—
—
R/W
POR
—
—
—
0
—
—
—
0
Bit 7~5
Unimplemented, read as “0”
Bit 4
SPIAF: SPIA Interrupt Request Flag
0: No request
1: Interrupt request
Bit 3~1
Unimplemented, read as “0”
Bit 0
SPIAE: SPIA Interrupt Control
0: Disable
1: Enable
MFI0 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
PTM0AF
PTM0PF
STMAF
STMPF
PTM0AE
PTM0PE
STMAE
STMPE
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
Bit 7
PTM0AF: PTM0 CCRA Comparator Interrupt Request Flag
0: No request
1: Interrupt request
Bit 6
PTM0PF: PTM0 CCRP Comparator Interrupt Request Flag
0: No request
1: Interrupt request
Bit 5
STMAF: STM CCRA Comparator Interrupt Request Flag
0: No request
1: Interrupt request
Bit 4
STMPF: STM CCRP Comparator Interrupt Request Flag
0: No request
1: Interrupt request
Bit 3
PTM0AE: PTM0 CCRA Comparator Interrupt Control
0: Disable
1: Enable
Bit 2
PTM0PE: PTM0 CCRP Comparator Interrupt Control
0: Disable
1: Enable
Bit 1
STMAE: STM CCRA Comparator Interrupt Control
0: Disable
1: Enable
Bit 0
STMPE: STM CCRP Comparator Interrupt Control
0: Disable
1: Enable
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Body Fat Measurment Flash MCU
MFI1 Register
Bit
7
6
5
4
3
2
1
0
Name
PTM2AF
PTM2PF
PTM1AF
PTM1PF
PTM2AE
PTM2PE
PTM1AE
PTM1PE
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
0
0
0
0
0
0
0
0
0
Bit 7
PTM2AF: PTM2 CCRA Comparator Interrupt Request Flag
0: No request
1: Interrupt request
Bit 6
PTM2PF: PTM2 CCRP Comparator Interrupt Request Flag
0: No request
1: Interrupt request
Bit 5
PTM1AF: PTM1 CCRA Comparator Interrupt Request Flag
0: No request
1: Interrupt request
Bit 4
PTM1PF: PTM1 CCRP Comparator Interrupt Request Flag
0: No request
1: Interrupt request
Bit 3
PTM2AE: PTM2 CCRA Comparator Interrupt Control
0: Disable
1: Enable
Bit 2
PTM2PE: PTM2 CCRP Comparator Interrupt Control
0: Disable
1: Enable
Bit 1
PTM1AE: PTM1 CCRA Comparator Interrupt Control
0: Disable
1: Enable
Bit 0
PTM1PE: PTM1 CCRP Comparator Interrupt Control
0: Disable
1: Enable
MFI2 Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
Name
—
—
R/W
—
—
DEF
LVF
—
—
DEE
LVE
R/W
R/W
—
—
R/W
R/W
POR
—
—
0
0
—
—
0
0
Bit 7~6
Unimplemented, read as “0”
Bit 5
DEF: Data EEPROM Interrupt Request Flag
0: No request
1: Interrupt request
Bit 4
LVF: LVD Interrupt Request Flag
0: No request
1: Interrupt request
Bit 3~2
Unimplemented, read as “0”
Bit 1
DEE: Data EEPROM Interrupt Control
0: Disable
1: Enable
Bit 0
LVE: LVD Interrupt Control
0: Disable
1: Enable
184
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Body Fat Measurment Flash MCU
Interrupt Operation
When the conditions for an interrupt event occur, such as a TM Comparator P, Comparator A
match or A/D conversion completion etc., the relevant interrupt request flag will be set. Whether
the request flag actually generates a program jump to the relevant interrupt vector is determined by
the condition of the interrupt enable bit. If the enable bit is set high then the program will jump to
its relevant vector; if the enable bit is “0” then although the interrupt request flag is set an actual
interrupt will not be generated and the program will not jump to the relevant interrupt vector. The
global interrupt enable bit, if cleared to zero, will disable all interrupts.
When an interrupt is generated, the Program Counter, which stores the address of the next instruction
to be executed, will be transferred onto the stack. The Program Counter will then be loaded with a
new address which will be the value of the corresponding interrupt vector. The microcontroller will
then fetch its next instruction from this interrupt vector. The instruction at this vector will usually
be a “JMP” which will jump to another section of program which is known as the interrupt service
routine. Here is located the code to control the appropriate interrupt. The interrupt service routine
must be terminated with a “RETI”, which retrieves the original Program Counter address from
the stack and allows the microcontroller to continue with normal execution at the point where the
interrupt occurred.
The various interrupt enable bits, together with their associated request flags, are shown in the
accompanying diagrams with their order of priority. Some interrupt sources have their own
individual vector while others share the same multi-function interrupt vector. Once an interrupt
subroutine is serviced, all the other interrupts will be blocked, as the global interrupt enable bit,
EMI bit will be cleared automatically. This will prevent any further interrupt nesting from occurring.
However, if other interrupt requests occur during this interval, although the interrupt will not be
immediately serviced, the request flag will still be recorded.
If an interrupt requires immediate servicing while the program is already in another interrupt service
routine, the EMI bit should be set after entering the routine, to allow interrupt nesting. If the stack
is full, the interrupt request will not be acknowledged, even if the related interrupt is enabled, until
the Stack Pointer is decremented. If immediate service is desired, the stack must be prevented from
becoming full. In case of simultaneous requests, the accompanying diagram shows the priority that
is applied. All of the interrupt request flags when set will wake-up the device if it is in SLEEP or
IDLE Mode, however to prevent a wake-up from occurring the corresponding flag should be set
before the device is in SLEEP or IDLE Mode.
Rev. 1.10
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EMI a�to disabled in ISR
Legend
xxF
Req�est Flag� no a�to �eset in ISR
xxF
Req�est Flag� a�to �eset in ISR
Inte���pt
Name
Req�est
Flags
Enable
Bits
Maste�
Enable
Vecto�
xxE
Enable Bits
INT0 Pin
INT0F
INT0E
EMI
0�H
INT1 Pin
INT1F
INT1E
EMI
0�H
A/D Conve�te�
ADF
ADE
EMI
0CH
M. F�nct. 0
MF0F
MF0E
EMI
10H
M. F�nct. 1
MF1F
MF1E
EMI
1�H
M. F�nct. �
MF�F
MF�E
EMI
1�H
Time Base 0
TB0F
TB0E
EMI
�0H
Time Base 1
TB1F
TB1E
EMI
��H
UART
URF
URE
EMI
��H
SIM
SIMF
SIME
EMI
�CH
SPIA
SPIAF
SPIAE
EMI
30H
Inte���pt
Name
Req�est
Flags
Enable
Bits
STM P
STMPF
STMPE
STM A
STMAF
STMAE
PTM0 P
PTM0PF
PTM0PE
PTM0 A
PTM0AF
PTM0AE
PTM1 P
PTM1PF
PTM1PE
PTM1 A
PTM1AF
PTM1AE
PTM� P
PTM�PF
PTM�PE
PTM� A
PTM�AF
PTM�AE
LVD
LVF
LVE
EEPROM
DEE
DEF
Inte���pts contained within
M�lti-F�nction Inte���pts
P�io�it�
High
Low
Interrupt Structure
External Interrupt
The external interrupts are controlled by signal transitions on the pins INT0~INT1. An external
interrupt request will take place when the external interrupt request flags, INT0F~INT1F, are set,
which will occur when a transition, whose type is chosen by the edge select bits, appears on the
external interrupt pins. To allow the program to branch to its respective interrupt vector address,
the global interrupt enable bit, EMI, and respective external interrupt enable bit, INT0E~INT1E,
must first be set. Additionally the correct interrupt edge type must be selected using the INTEG
register to enable the external interrupt function and to choose the trigger edge type. As the external
interrupt pins are pin-shared with I/O pins, they can only be configured as external interrupt pins if
their external interrupt enable bit in the corresponding interrupt register has been set and the external
interrupt pin is selected by the corresponding pin-shared function selection bits. The pin must also
be setup as an input by setting the corresponding bit in the port control register.
When the interrupt is enabled, the stack is not full and the correct transition type appears on the
external interrupt pin, a subroutine call to the external interrupt vector, will take place. When the
interrupt is serviced, the external interrupt request flags, INT0F~INT1F, will be automatically
reset and the EMI bit will be automatically cleared to disable other interrupts. Note that any pullhigh resistor selections on the external interrupt pins will remain valid even if the pin is used as an
external interrupt input. The INTEG register is used to select the type of active edge that will trigger
the external interrupt. A choice of either rising or falling or both edge types can be chosen to trigger
an external interrupt. Note that the INTEG register can also be used to disable the external interrupt
function.
Rev. 1.10
186
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Body Fat Measurment Flash MCU
LVD Interrupt
The Low Voltage Detector Interrupt is contained within the Multi-function Interrupt. An LVD
Interrupt request will take place when the LVD Interrupt request flag, LVF, is set, which occurs
when the Low Voltage Detector function detects a low power supply voltage. To allow the program
to branch to its respective interrupt vector address, the global interrupt enable bit, EMI, Low Voltage
Interrupt enable bit, LVE, and associated Multi-function interrupt enable bit, must first be set. When
the interrupt is enabled, the stack is not full and a low voltage condition occurs, a subroutine call to
the Multi-function Interrupt vector, will take place. When the Low Voltage Interrupt is serviced, the
EMI bit will be automatically cleared to disable other interrupts, however only the Multi-function
interrupt request flag will be also automatically cleared. As the LVF flag will not be automatically
cleared, it has to be cleared by the application program.
EEPROM Interrupt
The EEPROM Interrupt is contained within the Multi-function Interrupt. An EEPROM Interrupt
request will take place when the EEPROM Interrupt request flag, DEF, is set, which occurs
when an EEPROM Write cycle ends. To allow the program to branch to its respective interrupt
vector address, the global interrupt enable bit, EMI, and EEPROM Interrupt enable bit, DEE, and
associated Multi-function interrupt enable bit, must first be set. When the interrupt is enabled, the
stack is not full and an EEPROM Write cycle ends, a subroutine call to the respective EEPROM
Interrupt vector will take place. When the EEPROM Interrupt is serviced, the EMI bit will be
automatically cleared to disable other interrupts, however only the Multi-function interrupt request
flag will be also automatically cleared. As the DEF flag will not be automatically cleared, it has to be
cleared by the application program.
A/D Converter Interrupt
The A/D Converter Interrupt is controlled by the termination of an A/D conversion process. An
A/D Converter Interrupt request will take place when the A/D Converter Interrupt request flag, ADF,
is set, which occurs when the A/D conversion process finishes. To allow the program to branch to its
respective interrupt vector address, the global interrupt enable bit, EMI, and A/D Interrupt enable bit,
ADE, must first be set. When the interrupt is enabled, the stack is not full and the A/D conversion
process has ended, a subroutine call to the A/D Converter Interrupt vector, will take place. When the
interrupt is serviced, the A/D Converter Interrupt flag, ADF, will be automatically cleared. The EMI
bit will also be automatically cleared to disable other interrupts.
Multi-function Interrupts
Within these devices there are three Multi-function interrupts. Unlike the other independent
interrupts, these interrupts have no independent source, but rather are formed from other existing
interrupt sources, namely the TM Interrupts, EEPROM interrupt and LVD interrupt.
A Multi-function interrupt request will take place when any of the Multi-function interrupt request
flags, MFnF are set. The Multi-function interrupt flags will be set when any of their included functions
generate an interrupt request flag. To allow the program to branch to its respective interrupt vector
address, when the Multi-function interrupt is enabled and the stack is not full, and either one of the
interrupts contained within each of Multi-function interrupt occurs, a subroutine call to one of the
Multi-function interrupt vectors will take place. When the interrupt is serviced, the related MultiFunction request flag will be automatically reset and the EMI bit will be automatically cleared to
disable other interrupts.
However, it must be noted that, although the Multi-function Interrupt flags will be automatically
reset when the interrupt is serviced, the request flags from the original source of the Multi-function
interrupts will not be automatically reset and must be manually reset by the application program.
Rev. 1.10
187
January 04, 2018
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Body Fat Measurment Flash MCU
Serial Interface Module Interrupt
The Serial Interface Module Interrupt is also known as the SIM Interrupt. A SIM Interrupt request
will take place when the SIM Interrupt request flag, SIMF, is set, which occurs when a byte of
data has been received or transmitted by the SIM interface, an I2C address match or I2C time-out
occurrence. To allow the program to branch to its respective interrupt vector address, the global
interrupt enable bit, EMI, and the Serial Interface Interrupt enable bit, SIME, must first be set.
When the interrupt is enabled, the stack is not full and any of the above described situations occurs,
a subroutine call to the SIM interrupt vector, will take place. When the SIM Interface Interrupt is
serviced, the interrupt request flag, SIMF, will be automatically reset and the EMI bit will be cleared
to disable other interrupts.
SPIA Interrupt
The Serial Peripheral Interface Interrupt, also known as the SPIA Interrupt, will take place when the
SPIA Interrupt request flag, SPIAF, is set, which occurs when a byte of data has been received or
transmitted by the SPIA interface. To allow the program to branch to its respective interrupt vector
address, the global interrupt enable bit, EMI, and the Serial Interface Interrupt enable bit, SPIAE,
must first be set. When the interrupt is enabled, the stack is not full and a byte of data has been
transmitted or received by the SPIA interface, a subroutine call to the respective Interrupt vector,
will take place. When the interrupt is serviced, the Serial Interface Interrupt flag, SPIAF, will be
automatically cleared. The EMI bit will also be automatically cleared to disable other interrupts.
UART Interrupt
Several individual UART conditions can generate a UART Interrupt. When these conditions exist,
a low pulse will be generated to get the attention of the microcontroller. These conditions are a
transmitter data register empty, transmitter idle, receiver data available, receiver overrun, address
detect and an RX pin wake-up. To allow the program to branch to the respective interrupt vector
addresses, the global interrupt enable bit, EMI, and UART Interrupt enable bit, URE, must first
be set. When the interrupt is enabled, the stack is not full and any of these conditions are created,
a subroutine call to the UART Interrupt vector will take place. When the interrupt is serviced, the
UART Interrupt flag, URF, will be automatically cleared. The EMI bit will also be automatically
cleared to disable other interrupts. However, the USR register flags will be cleared automatically
when certain actions are taken by the UART, the details of which are given in the UART section.
Time Base Interrupts
The function of the Time Base Interrupts is to provide regular time signal in the form of an internal
interrupt. They are controlled by the overflow signals from their respective timer functions. When
these happens their respective interrupt request flags, TB0F or TB1F will be set. To allow the
program to branch to their respective interrupt vector addresses, the global interrupt enable bit, EMI
and Time Base enable bits, TB0E or TB1E, must first be set. When the interrupt is enabled, the stack
is not full and the Time Base overflows, a subroutine call to their respective vector locations will
take place. When the interrupt is serviced, the respective interrupt request flag, TB0F or TB1F, will
be automatically reset and the EMI bit will be cleared to disable other interrupts.
The purpose of the Time Base Interrupt is to provide an interrupt signal at fixed time periods. Its
clock source, fPSC, originates from the internal clock source fSYS, fSYS/4 or fSUB and then passes
through a divider, the division ratio of which is selected by programming the appropriate bits in the
TB0C and TB1C registers to obtain longer interrupt periods whose value ranges. The clock source
which in turn controls the Time Base interrupt period is selected using the CLKSEL1~CLKSEL0
bits in the PSCR register.
Rev. 1.10
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Body Fat Measurment Flash MCU
TB0[�:0]
TB0ON
fPSC/�� ~ fPSC/�15
fSYS
M
U
X
fSYS/�
fSUB
fPSC
M
U
X
Time Base 0 Inte���pt
M
U
X
Time Base 1 Inte���pt
P�escale�
fPSC/�� ~ fPSC/�15
CLKSEL[1:0]
TB1ON
TB1[�:0]
Time Base Interrupt
PSCR Register
Bit
7
6
5
4
3
2
1
0
Name
—
—
—
—
—
—
CLKSEL1
CLKSEL0
R/W
—
—
—
—
—
—
R/W
R/W
POR
—
—
—
—
—
—
0
0
Bit 7~2
Unimplemented, read as “0”
Bit 1~0
CLKSEL1~CLKSEL0: Prescaler clock source selection
00: fSYS
01: fSYS/4
1x: fSUB
TB0C Register
Bit
7
6
5
4
3
2
1
0
Name
TB0ON
—
—
—
—
TB02
TB01
TB00
R/W
R/W
—
—
—
—
R/W
R/W
R/W
POR
0
—
—
—
—
0
0
0
Bit 7
Rev. 1.10
TB0ON: Time Base 0 Control
0: Disable
1: Enable
Bit 6~3
Unimplemented, read as “0”
Bit 2~0
TB02~TB00: Select Time Base 0 Time-out Period
000: 28/fPSC
001: 29/fPSC
010: 210/fPSC
011: 211/fPSC
100: 212/fPSC
101: 213/fPSC
110: 214/fPSC
111: 215/fPSC
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TB1C Register
Bit
7
6
5
4
3
2
1
0
Name
TB1ON
—
—
—
—
TB12
TB11
TB10
R/W
R/W
—
—
—
—
R/W
R/W
R/W
POR
0
—
—
—
—
0
0
0
Bit 7
TB1ON: Time Base 1 Control
0: Disable
1: Enable
Bit 6~3
Unimplemented, read as “0”
Bit 2~0
TB12~TB10: Select Time Base 1 Time-out Period
000: 28/fPSC
001: 29/fPSC
010: 210/fPSC
011: 211/fPSC
100: 212/fPSC
101: 213/fPSC
110: 214/fPSC
111: 215/fPSC
Timer Module Interrupts
Each of the Standard Type TM and Periodic Type TM has two interrupts. All of the TM interrupts
are contained within the Multi-function Interrupts. For the Standard Type TM and the Periodic
Type TM, each has two interrupt request flags of STMPF, STMAF and PTMnPF, PTMnAF and two
enable bits of STMPE, STMAE and PTMnPE, PTMnAE. A TM interrupt request will take place
when any of the TM request flags are set, a situation which occurs when a TM comparator P or A
match situation happens.
To allow the program to branch to its respective interrupt vector address, the global interrupt enable
bit, EMI, respective TM Interrupt enable bit, and relevant Multi-function Interrupt enable bit, MFnE,
must first be set. When the interrupt is enabled, the stack is not full and a TM comparator match
situation occurs, a subroutine call to the relevant Multi-function Interrupt vector locations, will take
place. When the TM interrupt is serviced, the EMI bit will be automatically cleared to disable other
interrupts, however only the related MFnF flag will be automatically cleared. As the TM interrupt
request flags will not be automatically cleared, they have to be cleared by the application program.
Interrupt Wake-up Function
Each of the interrupt functions has the capability of waking up the microcontroller when in the
SLEEP or IDLE Mode. A wake-up is generated when an interrupt request flag changes from low to
high and is independent of whether the interrupt is enabled or not. Therefore, even though the device
is in the SLEEP or IDLE Mode and its system oscillator stopped, situations such as external edge
transitions on the external interrupt pins or a low power supply voltage may cause their respective
interrupt flag to be set high and consequently generate an interrupt. Care must therefore be taken if
spurious wake-up situations are to be avoided. If an interrupt wake-up function is to be disabled then
the corresponding interrupt request flag should be set high before the device enters the SLEEP or
IDLE Mode. The interrupt enable bits have no effect on the interrupt wake-up function.
Rev. 1.10
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Programming Considerations
By disabling the relevant interrupt enable bits, a requested interrupt can be prevented from being
serviced, however, once an interrupt request flag is set, it will remain in this condition in the
interrupt register until the corresponding interrupt is serviced or until the request flag is cleared by
the application program.
Where a certain interrupt is contained within a Multi-function interrupt, then when the interrupt
service routine is executed, as only the Multi-function interrupt request flags, MFnF, will be
automatically cleared, the individual request flag for the function needs to be cleared by the
application program.
It is recommended that programs do not use the “CALL” instruction within the interrupt service
subroutine. Interrupts often occur in an unpredictable manner or need to be serviced immediately.
If only one stack is left and the interrupt is not well controlled, the original control sequence will be
damaged once a CALL subroutine is executed in the interrupt subroutine.
Every interrupt has the capability of waking up the microcontroller when it is in SLEEP or IDLE
Mode, the wake up being generated when the interrupt request flag changes from low to high. If it is
required to prevent a certain interrupt from waking up the microcontroller then its respective request
flag should be first set high before enter SLEEP or IDLE Mode.
As only the Program Counter is pushed onto the stack, then when the interrupt is serviced, if the
contents of the accumulator, status register or other registers are altered by the interrupt service
program, their contents should be saved to the memory at the beginning of the interrupt service
routine. To return from an interrupt subroutine, either a RET or RETI instruction may be executed.
The RETI instruction in addition to executing a return to the main program also automatically sets
the EMI bit high to allow further interrupts. The RET instruction however only executes a return to
the main program leaving the EMI bit in its present zero state and therefore disabling the execution
of further interrupts.
Rev. 1.10
191
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Low Voltage Detector – LVD
Each device contains a Low Voltage Detector function, also known as LVD. This enabled the device
to monitor the power supply voltage, VDD, or LVDIN pin input voltage, and provide a warning signal
should it fall below a certain level. This function may be especially useful in battery applications
where the supply voltage will gradually reduce as the battery ages, as it allows an early warning
battery low signal to be generated. The Low Voltage Detector also has the capability of generating
an interrupt signal.
LVD Register
The Low Voltage Detector function is controlled using a single register with the name LVDC. Three
bits in this register, VLVD2~VLVD0, are used to select one of eight fixed voltages below which a
low voltage condition will be determined. A low voltage condition is indicated when the LVDO bit
is set. If the LVDO bit is low, this indicates that the VDD or LVDIN pin input voltage is above the
preset low voltage value. The LVDEN bit is used to control the overall on/off function of the low
voltage detector. Setting the bit high will enable the low voltage detector. Clearing the bit to “0”
will switch off the internal low voltage detector circuits. As the low voltage detector will consume a
certain amount of power, it may be desirable to switch off the circuit when not in use, an important
consideration in power sensitive battery powered applications.
LVDC Register
Rev. 1.10
Bit
7
6
5
4
3
2
1
0
Name
—
—
LVDO
LVDEN
VBGEN
VLVD2
VLVD1
VLVD0
R/W
—
—
R
R/W
R/W
R/W
R/W
R/W
POR
—
—
0
0
0
0
0
0
Bit 7~6
Unimplemented, read as “0”
Bit 5
LVDO: LVD Output Flag
0: No Low Voltage Detect
1: Low Voltage Detect
Bit 4
LVDEN: Low Voltage Detector Control
0: Disable
1: Enable
Bit 3
VBGEN: Bandgap Buffer Control
0: Disable
1: Enable
Bit 2~0
VLVD2~VLVD0: Select LVD Voltage
000: VLVDIN ≤ 1.04V
001: 2.2V
010: 2.4V
011: 2.7V
100: 3.0V
101: 3.3V
110: 3.6V
111: 4.0V
Note: When the VLVD bit field is set to 000B, the LVD function will be implemented
by comparing the LVD reference voltage with a voltage value of 1.04V which
is derived from the LVDIN pin. Otherwise, the LVD function will operate by
comparing the LVD reference voltage with a specific voltage value which is
generated by the internal LVD circuit when the VLVD bit field is set to any other
value except 000B.
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LVD Operation
The Low Voltage Detector function operates by comparing the power supply voltage, VDD or LVDIN
pin input voltage with a pre-specified voltage level stored in the LVDC register. When the power
supply voltage, VDD or LVDIN pin input voltage fall below this pre-determined value, the LVDO bit
will be set high indicating a low power supply voltage condition. The Low Voltage Detector function
is supplied by a reference voltage which will be automatically enabled. When the device is in the
SLEEP mode, the low voltage detector will be disabled even if the LVDEN bit is high. After enabling
the Low Voltage Detector, a time delay tLVDS should be allowed for the circuitry to stabilise before
reading the LVDO bit. Note also that as the VDD voltage or LVDIN pin pinput voltage may rise and
fall rather slowly, at the voltage nears that of VLVD, there may be multiple bit LVDO transitions.
VLVDIN o� VDD
VLVD
LVDEN
LVDO
tLVDS
LVDIN
tLVD
LVD Operation
The Low Voltage Detector interrupt is contained within the Multi-function interrupt, providing
an alternative means of low voltage detection, in addition to polling the LVDO bit. The interrupt
will only be generated after a delay of tLVD after the LVDO bit has been set high by a low voltage
condition. When the device is powered down the Low Voltage Detector will remain active if the
LVDEN bit is high. In this case, the LVF interrupt request flag will be set, causing an interrupt to be
generated if VDD or LVDIN pin input voltage falls below the preset LVD voltage. This will cause the
device to wake-up from the IDLE Mode, however if the Low Voltage Detector wake up function is
not required then the LVF flag should be first set high before the device enters the IDLE Mode.
When LVD function is enabled, it is recommenced to clear LVD flag first, and then enables interrupt
function to avoid mistake action.
Rev. 1.10
193
January 04, 2018
BH66F2650/BH66F2660
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16-bit Multiplication Division Unit – MDU
Each device contains a 16-bit Multiplication Division Unit, MDU, which integrates a 16-bit
unsigned multiplier and a 32-bit/16-bit divider. The MDU, in replacing the software multiplication
and division operations, can therefore save large amounts of computing time as well as the Program
and Data Memory space. It also reduces the overall microcontroller loading the results in the overall
system perfofmance improvements.
fSYS
MDUWR0
16/3�-bit Dividend
/
16-bit M�ltiplicand
MDUWR1
MDUWR�
MDUWR3
MDWEF
+/-
MDWOV
Shift Cont�ol
16-bit Diviso�
/
16-bit M�ltiplie�
MDUWR�
MDUWR5
16-bit MDU Block Diagram
MDU registers
The multiplication and division operations are implemented in a specific way, a specific write
access sequence of a series of MDU data registers. The status register, MDUWCTRL, provides the
indications for the MDU operation. The data register each is used to store the data regarded as the
different operand corresponding to different MDU operations.
Bit
Register
Name
7
6
5
4
3
2
1
0
MDUWR0
D7
D6
D5
D4
D3
D2
D1
D0
MDUWR1
D7
D6
D5
D4
D3
D2
D1
D0
MDUWR2
D7
D6
D5
D4
D3
D2
D1
D0
MDUWR3
D7
D6
D5
D4
D3
D2
D1
D0
MDUWR4
D7
D6
D5
D4
D3
D2
D1
D0
MDUWR5
D7
D6
D5
D4
D3
D2
D1
D0
–
–
–
–
–
–
MDUWCTRL MDWEF MDWOV
MDU Registers List
MDUWRn Register (n=0~5)
Bit
7
6
5
4
3
2
1
0
Name
D7
D6
D5
D4
D3
D2
D1
D0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
POR
x
x
x
x
x
x
x
x
“x” unknown
Bit 7~0
Rev. 1.10
D7~D0: 16-bit MDU data register n
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BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
MDUWCTRL Register
Bit
7
6
5
4
3
2
1
0
Name
MDWEF
MDWOV
—
—
—
—
—
—
R/W
R
R
—
—
—
—
—
—
POR
0
0
—
—
—
—
—
—
Bit 7
MDWEF: 16-bit MDU Error Flag
0: Normal
1: Abnormal
This bit will be set to 1 if the data register MDUWRn is written or read as the MDU
operation is executing. This bit should be cleared to 0 by reading the MDUWCTRL
register if it is equal to 1 and the MDU operation is completed.
Bit 6
MDWOV: 16-bit MDU Overflow Flag
0: No overflow occurs
1: Multiplication product > FFFFH or Divisor = 0
When an operation is completed, this bit will be updated by hardware to a new value
corresponding to the current operation situation.
Bit 5~0
Unimplemented, read as “0”
Multiplication Division Unit Operation
For this MDU the multiplication or division operation is carried out in a specific way and is
determined by the write access sequence of the six MDU data registers, MDUWR0~MDUWR5. The
low byte data, regardless of the dividend, multiplicand, divisor or multiplier, must first be written
into the corresponding MDU data register followed by the high byte data. All MDU operations
will be executed after the MDUWR5 register is write-accessed together with the correct specific
write access sequence of the MDUWRn. Note that it is not necessary to consecutively write data
into the MDU data registers but must be in a correct write access sequence. Therefore, a non-write
MDUWRn instruction or an interrupt, etc., can be inserted into the correct write access sequence
without destroying the write operation. The relationship between the write access sequence and the
MDU operation is shown in the following.
• 32-bit/16-bit Division Operation: Write data sequentially into the six MDU data registers from
MDUWR0 to MDUWR5.
• 16-bit/16-bit Division Operation: Write data sequentially into the specific four MDU data
registers in a sequence of MDUWR0, MDUWR1, MDUWR4 and MDUWR5 with no write
access to MDUWR2 and MDUWR3.
• 16-bit/16-bit Multiplication Operation: Write data sequentially into the specific four MDU data
register in a sequence of MDUWR0, MDUWR4, MDUWR1 and MDUWR5 with no write access
to MDUWR2 and MDUWR3.
After the specific write access sequence is determined, the MDU will start to perform the
corresponding operation. The calculation time necessary for these MDU operations are different.
During the calculation time any read/write access to the six MDU data registers is forbidden. After
the completion of each operation, it is necessary to check the operation status in the MDUWCTRL
register to make sure that whether the operation is correct or not. Then the operation result can
be read out from the corresponding MDU data registers in a specific read access sequence if the
operation is correctly finished. The necessary calculation time for different MDU operations is listed
in the following.
• 32-bit/16-bit division operation: 17 × tSYS.
• 16-bit/16-bit division operation: 9 × tSYS.
• 16-bit/16-bit multiplication operation: 11 × tSYS.
Rev. 1.10
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Body Fat Measurment Flash MCU
The operation results will be stored in the corresponding MDU data registers and should be read
out from the MDU data registers in a specific read access sequence after the operation is completed.
Noe that it is not necessary to consecutively read data out from the MDU data registers but must be
in a correct read access sequence. Therefore, a non-read MDUWRn instruction or an interrupt, etc.,
can be inserted into the correct read access sequence without destroying the read operation. The
relationship between the operation result read access sequence and the MDU operation is shown in
the following.
• 32-bit/16-bit division operation: Read the quotient from MDUWR0 to MDUWR3 and remainder
from MDUWR4 and MDUWR5 sequentially.
• 16-bit/16-bit division operation: Read the quotient from MDUWR0 and MDUWR1 and
remainder from MDUWR4 and MDUWR5 sequentially.
• 16-bit/16-bit multiplication operation: Read the product sequentially from MDUWR0 to
MDUWR3.
The overall important points for the MDU read/write access sequence and calculation time are
summarized in the following table.
Items
Operations
Write Sequence
First write
↓
↓
↓
↓
Last write
32-bit / 16-bit Division
16-bit / 16-bit Division
Dividend Byte 0 written to MDUWR0
Dividend Byte 1 written to MDUWR1
Dividend Byte 2 written to MDUWR2
Dividend Byte 3 written to MDUWR3
Divisor Byte 0 written to MDUWR4
Divisor Byte 1 written to MDUWR5
Dividend Byte 0 written to MDUWR0
Dividend Byte 1 written to MDUWR1
Divisor Byte 0 written to MDUWR4
Divisor Byte 1 written to MDUWR5
Calculation Time
17 × tSYS
9 × tSYS
Read Sequence
First read
↓
↓
↓
↓
Last read
Quotient Byte 0 read from MDUWR0
Quotient Byte 1 read from MDUWR1
Quotient Byte 2 read from MDUWR2
Quotient Byte 3 read from MDUWR3
Remainder Byte 0 read from MDUWR4
Remainder Byte 1 read from MDUWR5
Quotient Byte 0 read from MDUWR0
Quotient Byte 1 read from MDUWR1
Remainder Byte 0 read from MDUWR4
Remainder Byte 1 read from MDUWR5
16-bit × 16-bit Multiplication
Multiplicand Byte 0 written to MDUWR0
Multiplier Byte 0 written to MDUWR4
Multiplicand Byte 1 written to MDUWR1
Multiplier Byte 1 written to MDUWR5
11 × tSYS
Product Byte 0 written to MDUWR0
Product Byte 1 written to MDUWR1
Product Byte 2 written to MDUWR2
Product Byte 3 written to MDUWR3
MDU Operations Summary
Rev. 1.10
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BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Application Circuits
8-electrode
VOREG
VDD
VOREG/VREFP
VDD/VIN
1μF
10μF
0.1μF
AVSS/VREFN
VSS
VCM
1μF
1K
1K
AN0
1K
1K
0.1μF
AN1
AN2
AN3
RFC
VOREG
0.1μF
RF IC
100kΩ
100kΩ
SPI/UART
CP0N
33kΩ
0.1μF
TO
HVR
HVL
FVR
FVL
RF2
RF1
1kΩ
200Ω
I/O
LED Panel
FIR
FIL
HIR
HIL
RF
BH66F2660-8
BH66F2650-8
SIN
2.7kΩ
Rev. 1.10
0.1μF
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Body Fat Measurment Flash MCU
4-electrode
VOREG
VDD
VOREG/VREFP
VDD/VIN
1μF
10μF
0.1μF
AVSS/VREFN
VSS
VCM
1μF
1K
1K
AN0
1K
1K
0.1μF
AN1
AN2
AN3
RFC
VOREG
0.1μF
RF IC
100kΩ
100kΩ
SPI/UART
CP0N
33kΩ
0.1μF
TO
FVR
FVL
RF2
RF1
1kΩ
200Ω
I/O
LED Panel
FIR
FIL
RF
BH66F2660
BH66F2650
SIN
2.7kΩ
Rev. 1.10
0.1μF
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Body Fat Measurment Flash MCU
Instruction Set
Introduction
Central to the successful operation of any microcontroller is its instruction set, which is a set of
program instruction codes that directs the microcontroller to perform certain operations. In the case
of Holtek microcontroller, a comprehensive and flexible set of over 60 instructions is provided to
enable programmers to implement their application with the minimum of programming overheads.
For easier understanding of the various instruction codes, they have been subdivided into several
functional groupings.
Instruction Timing
Most instructions are implemented within one instruction cycle. The exceptions to this are branch,
call, or table read instructions where two instruction cycles are required. One instruction cycle is
equal to 4 system clock cycles, therefore in the case of an 8MHz system oscillator, most instructions
would be implemented within 0.5μs and branch or call instructions would be implemented within
1μs. Although instructions which require one more cycle to implement are generally limited to
the JMP, CALL, RET, RETI and table read instructions, it is important to realize that any other
instructions which involve manipulation of the Program Counter Low register or PCL will also take
one more cycle to implement. As instructions which change the contents of the PCL will imply a
direct jump to that new address, one more cycle will be required. Examples of such instructions
would be “CLR PCL” or “MOV PCL, A”. For the case of skip instructions, it must be noted that if
the result of the comparison involves a skip operation then this will also take one more cycle, if no
skip is involved then only one cycle is required.
Moving and Transferring Data
The transfer of data within the microcontroller program is one of the most frequently used
operations. Making use of three kinds of MOV instructions, data can be transferred from registers to
the Accumulator and vice-versa as well as being able to move specific immediate data directly into
the Accumulator. One of the most important data transfer applications is to receive data from the
input ports and transfer data to the output ports.
Arithmetic Operations
The ability to perform certain arithmetic operations and data manipulation is a necessary feature of
most microcontroller applications. Within the Holtek microcontroller instruction set are a range of
add and subtract instruction mnemonics to enable the necessary arithmetic to be carried out. Care
must be taken to ensure correct handling of carry and borrow data when results exceed 255 for
addition and less than 0 for subtraction. The increment and decrement instructions INC, INCA, DEC
and DECA provide a simple means of increasing or decreasing by a value of one of the values in the
destination specified.
Rev. 1.10
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BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Logical and Rotate Operation
The standard logical operations such as AND, OR, XOR and CPL all have their own instruction
within the Holtek microcontroller instruction set. As with the case of most instructions involving
data manipulation, data must pass through the Accumulator which may involve additional
programming steps. In all logical data operations, the zero flag may be set if the result of the
operation is zero. Another form of logical data manipulation comes from the rotate instructions such
as RR, RL, RRC and RLC which provide a simple means of rotating one bit right or left. Different
rotate instructions exist depending on program requirements. Rotate instructions are useful for serial
port programming applications where data can be rotated from an internal register into the Carry
bit from where it can be examined and the necessary serial bit set high or low. Another application
which rotate data operations are used is to implement multiplication and division calculations.
Branches and Control Transfer
Program branching takes the form of either jumps to specified locations using the JMP instruction
or to a subroutine using the CALL instruction. They differ in the sense that in the case of a
subroutine call, the program must return to the instruction immediately when the subroutine has
been carried out. This is done by placing a return instruction “RET” in the subroutine which will
cause the program to jump back to the address right after the CALL instruction. In the case of a JMP
instruction, the program simply jumps to the desired location. There is no requirement to jump back
to the original jumping off point as in the case of the CALL instruction. One special and extremely
useful set of branch instructions are the conditional branches. Here a decision is first made regarding
the condition of a certain data memory or individual bits. Depending upon the conditions, the
program will continue with the next instruction or skip over it and jump to the following instruction.
These instructions are the key to decision making and branching within the program perhaps
determined by the condition of certain input switches or by the condition of internal data bits.
Bit Operations
The ability to provide single bit operations on Data Memory is an extremely flexible feature of all
Holtek microcontrollers. This feature is especially useful for output port bit programming where
individual bits or port pins can be directly set high or low using either the “SET [m].i” or “CLR [m].i”
instructions respectively. The feature removes the need for programmers to first read the 8-bit output
port, manipulate the input data to ensure that other bits are not changed and then output the port with
the correct new data. This read-modify-write process is taken care of automatically when these bit
operation instructions are used.
Table Read Operations
Data storage is normally implemented by using registers. However, when working with large
amounts of fixed data, the volume involved often makes it inconvenient to store the fixed data in
the Data Memory. To overcome this problem, Holtek microcontrollers allow an area of Program
Memory to be set as a table where data can be directly stored. A set of easy to use instructions
provides the means by which this fixed data can be referenced and retrieved from the Program
Memory.
Other Operations
In addition to the above functional instructions, a range of other instructions also exist such as
the “HALT” instruction for Power-down operations and instructions to control the operation of
the Watchdog Timer for reliable program operations under extreme electric or electromagnetic
environments. For their relevant operations, refer to the functional related sections.
Rev. 1.10
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Body Fat Measurment Flash MCU
Instruction Set Summary
The instructions related to the data memory access in the following table can be used when the
desired data memory is located in Data Memory sector 0.
Table Conventions
x: Bits immediate data
m: Data Memory address
A: Accumulator
i: 0~7 number of bits
addr: Program memory address
Mnemonic
Description
Cycles
Flag Affected
Add Data Memory to ACC
Add ACC to Data Memory
Add immediate data to ACC
Add Data Memory to ACC with Carry
Add ACC to Data memory with Carry
Subtract immediate data from the ACC
Subtract Data Memory from ACC
Subtract Data Memory from ACC with result in Data Memory
Subtract immediate data from ACC with Carry
Subtract Data Memory from ACC with Carry
Subtract Data Memory from ACC with Carry, result in Data Memory
Decimal adjust ACC for Addition with result in Data Memory
1
1Note
1
1
1Note
1
1
1Note
1
1
1Note
1Note
Z, C, AC, OV, SC
Z, C, AC, OV, SC
Z, C, AC, OV, SC
Z, C, AC, OV, SC
Z, C, AC, OV, SC
Z, C, AC, OV, SC, CZ
Z, C, AC, OV, SC, CZ
Z, C, AC, OV, SC, CZ
Z, C, AC, OV, SC, CZ
Z, C, AC, OV, SC, CZ
Z, C, AC, OV, SC, CZ
C
1
1
1
1Note
1Note
1Note
1
1
1
1Note
1
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Increment Data Memory with result in ACC
Increment Data Memory
Decrement Data Memory with result in ACC
Decrement Data Memory
1
1Note
1
1Note
Z
Z
Z
Z
Rotate Data Memory right with result in ACC
Rotate Data Memory right
Rotate Data Memory right through Carry with result in ACC
Rotate Data Memory right through Carry
Rotate Data Memory left with result in ACC
Rotate Data Memory left
Rotate Data Memory left through Carry with result in ACC
Rotate Data Memory left through Carry
1
1Note
1
1Note
1
1Note
1
1Note
None
None
C
C
None
None
C
C
Arithmetic
ADD A,[m]
ADDM A,[m]
ADD A,x
ADC A,[m]
ADCM A,[m]
SUB A,x
SUB A,[m]
SUBM A,[m]
SBC A,x
SBC A,[m]
SBCM A,[m]
DAA [m]
Logic Operation
AND A,[m]
OR A,[m]
XOR A,[m]
ANDM A,[m]
ORM A,[m]
XORM A,[m]
AND A,x
OR A,x
XOR A,x
CPL [m]
CPLA [m]
Logical AND Data Memory to ACC
Logical OR Data Memory to ACC
Logical XOR Data Memory to ACC
Logical AND ACC to Data Memory
Logical OR ACC to Data Memory
Logical XOR ACC to Data Memory
Logical AND immediate Data to ACC
Logical OR immediate Data to ACC
Logical XOR immediate Data to ACC
Complement Data Memory
Complement Data Memory with result in ACC
Increment & Decrement
INCA [m]
INC [m]
DECA [m]
DEC [m]
Rotate
RRA [m]
RR [m]
RRCA [m]
RRC [m]
RLA [m]
RL [m]
RLCA [m]
RLC [m]
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Mnemonic
Description
Cycles Flag Affected
Data Move
MOV A,[m]
MOV [m],A
MOV A,x
Move Data Memory to ACC
Move ACC to Data Memory
Move immediate data to ACC
1
1Note
1
None
None
None
Clear bit of Data Memory
Set bit of Data Memory
1Note
1Note
None
None
2
1Note
1Note
1Note
1Note
1Note
1Note
1Note
1Note
1Note
2
2
2
2
None
None
None
None
None
None
None
None
None
None
None
None
None
None
2Note
2Note
2Note
None
None
None
2Note
None
1
1Note
1Note
1
1Note
1
1
None
None
None
TO, PDF
None
None
TO, PDF
Bit Operation
CLR [m].i
SET [m].i
Branch Operation
JMP addr
SZ [m]
SZA [m]
SZ [m].i
SNZ [m]
SNZ [m].i
SIZ [m]
SDZ [m]
SIZA [m]
SDZA [m]
CALL addr
RET
RET A,x
RETI
Jump unconditionally
Skip if Data Memory is zero
Skip if Data Memory is zero with data movement to ACC
Skip if bit i of Data Memory is zero
Skip if Data Memory is not zero
Skip if bit i of Data Memory is not zero
Skip if increment Data Memory is zero
Skip if decrement Data Memory is zero
Skip if increment Data Memory is zero with result in ACC
Skip if decrement Data Memory is zero with result in ACC
Subroutine call
Return from subroutine
Return from subroutine and load immediate data to ACC
Return from interrupt
Table Read Operation
TABRD [m] Read table (specific page) to TBLH and Data Memory
TABRDL [m] Read table (last page) to TBLH and Data Memory
ITABRD [m] Increment table pointer TBLP first and Read table to TBLH and Data Memory
Increment table pointer TBLP first and Read table (last page) to TBLH and
ITABRDL [m]
Data Memory
Miscellaneous
NOP
CLR [m]
SET [m]
CLR WDT
SWAP [m]
SWAPA [m]
HALT
No operation
Clear Data Memory
Set Data Memory
Clear Watchdog Timer
Swap nibbles of Data Memory
Swap nibbles of Data Memory with result in ACC
Enter power down mode
Note: 1. For skip instructions, if the result of the comparison involves a skip then up to three cycles are required, if
no skip takes place only one cycle is required.
2. Any instruction which changes the contents of the PCL will also require 2 cycles for execution.
3. For the “CLR WDT” instruction the TO and PDF flags may be affected by the execution status. The TO
and PDF flags are cleared after the “CLR WDT” instructions is executed. Otherwise the TO and PDF
flags remain unchanged.
Rev. 1.10
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Extended Instruction Set
The extended instructions are used to support the full range address access for the data memory.
When the accessed data memory is located in any data memory sections except sector 0, the
extended instruction can be used to access the data memory instead of using the indirect addressing
access to improve the CPU firmware performance.
Mnemonic
Description
Cycles
Flag Affected
Add Data Memory to ACC
Add ACC to Data Memory
Add Data Memory to ACC with Carry
Add ACC to Data memory with Carry
Subtract Data Memory from ACC
Subtract Data Memory from ACC with result in Data Memory
Subtract Data Memory from ACC with Carry
Subtract Data Memory from ACC with Carry, result in Data Memory
Decimal adjust ACC for Addition with result in Data Memory
2
2Note
2
2Note
2
2Note
2
2Note
2Note
Z, C, AC, OV, SC
Z, C, AC, OV, SC
Z, C, AC, OV, SC
Z, C, AC, OV, SC
Z, C, AC, OV, SC, CZ
Z, C, AC, OV, SC, CZ
Z, C, AC, OV, SC, CZ
Z, C, AC, OV, SC, CZ
C
2
2
2
2Note
2Note
2Note
2Note
2
Z
Z
Z
Z
Z
Z
Z
Z
Increment Data Memory with result in ACC
Increment Data Memory
Decrement Data Memory with result in ACC
Decrement Data Memory
2
2Note
2
2Note
Z
Z
Z
Z
Rotate Data Memory right with result in ACC
Rotate Data Memory right
Rotate Data Memory right through Carry with result in ACC
Rotate Data Memory right through Carry
Rotate Data Memory left with result in ACC
Rotate Data Memory left
Rotate Data Memory left through Carry with result in ACC
Rotate Data Memory left through Carry
2
2Note
2
2Note
2
2Note
2
2Note
None
None
C
C
None
None
C
C
Move Data Memory to ACC
Move ACC to Data Memory
2
2Note
None
None
Clear bit of Data Memory
Set bit of Data Memory
2Note
2Note
None
None
Arithmetic
LADD A,[m]
LADDM A,[m]
LADC A,[m]
LADCM A,[m]
LSUB A,[m]
LSUBM A,[m]
LSBC A,[m]
LSBCM A,[m]
LDAA [m]
Logic Operation
LAND A,[m]
LOR A,[m]
LXOR A,[m]
LANDM A,[m]
LORM A,[m]
LXORM A,[m]
LCPL [m]
LCPLA [m]
Logical AND Data Memory to ACC
Logical OR Data Memory to ACC
Logical XOR Data Memory to ACC
Logical AND ACC to Data Memory
Logical OR ACC to Data Memory
Logical XOR ACC to Data Memory
Complement Data Memory
Complement Data Memory with result in ACC
Increment & Decrement
LINCA [m]
LINC [m]
LDECA [m]
LDEC [m]
Rotate
LRRA [m]
LRR [m]
LRRCA [m]
LRRC [m]
LRLA [m]
LRL [m]
LRLCA [m]
LRLC [m]
Data Move
LMOV A,[m]
LMOV [m],A
Bit Operation
LCLR [m].i
LSET [m].i
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Body Fat Measurment Flash MCU
Mnemonic
Description
Cycles Flag Affected
Branch
LSZ [m]
LSZA [m]
LSNZ [m]
LSZ [m].i
LSNZ [m].i
LSIZ [m]
LSDZ [m]
LSIZA [m]
LSDZA [m]
Skip if Data Memory is zero
Skip if Data Memory is zero with data movement to ACC
Skip if Data Memory is not zero
Skip if bit i of Data Memory is zero
Skip if bit i of Data Memory is not zero
Skip if increment Data Memory is zero
Skip if decrement Data Memory is zero
Skip if increment Data Memory is zero with result in ACC
Skip if decrement Data Memory is zero with result in ACC
2Note
2Note
2Note
2Note
2Note
2Note
2Note
2Note
2Note
None
None
None
None
None
None
None
None
None
3Note
3Note
3Note
None
None
None
3Note
None
2Note
2Note
2Note
2
None
None
None
None
Table Read
LTABRD [m] Read table to TBLH and Data Memory
LTABRDL [m] Read table (last page) to TBLH and Data Memory
LITABRD [m] Increment table pointer TBLP first and Read table to TBLH and Data Memory
Increment table pointer TBLP first and Read table (last page) to TBLH and
LITABRDL [m]
Data Memory
Miscellaneous
LCLR [m]
LSET [m]
LSWAP [m]
LSWAPA [m]
Clear Data Memory
Set Data Memory
Swap nibbles of Data Memory
Swap nibbles of Data Memory with result in ACC
Note: 1. For these extended skip instructions, if the result of the comparison involves a skip then up to four cycles
are required, if no skip takes place two cycles is required.
2. Any extended instruction which changes the contents of the PCL register will also require three cycles for
execution.
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Instruction Definition
ADC A,[m]
Description
Operation
Affected flag(s)
ADCM A,[m]
Description
Operation
Affected flag(s)
ADD A,[m]
Description
Add Data Memory to ACC with Carry
The contents of the specified Data Memory, Accumulator and the carry flag are added.
The result is stored in the Accumulator.
ACC ← ACC + [m] + C
OV, Z, AC, C, SC
Add ACC to Data Memory with Carry
The contents of the specified Data Memory, Accumulator and the carry flag are added.
The result is stored in the specified Data Memory.
[m] ← ACC + [m] + C
OV, Z, AC, C, SC
Add Data Memory to ACC
The contents of the specified Data Memory and the Accumulator are added.
The result is stored in the Accumulator.
Operation
Affected flag(s)
ACC ← ACC + [m]
OV, Z, AC, C, SC
ADD A,x
Description
Add immediate data to ACC
The contents of the Accumulator and the specified immediate data are added.
The result is stored in the Accumulator.
ACC ← ACC + x
OV, Z, AC, C, SC
Operation
Affected flag(s)
ADDM A,[m]
Description
Operation
Affected flag(s)
AND A,[m]
Description
Operation
Affected flag(s)
AND A,x
Description
Operation
Affected flag(s)
ANDM A,[m]
Description
Operation
Affected flag(s)
Rev. 1.10
Add ACC to Data Memory
The contents of the specified Data Memory and the Accumulator are added.
The result is stored in the specified Data Memory.
[m] ← ACC + [m]
OV, Z, AC, C, SC
Logical AND Data Memory to ACC
Data in the Accumulator and the specified Data Memory perform a bitwise logical AND
operation. The result is stored in the Accumulator.
ACC ← ACC ″AND″ [m]
Z
Logical AND immediate data to ACC
Data in the Accumulator and the specified immediate data perform a bit wise logical AND
operation. The result is stored in the Accumulator.
ACC ← ACC ″AND″ x
Z
Logical AND ACC to Data Memory
Data in the specified Data Memory and the Accumulator perform a bitwise logical AND
operation. The result is stored in the Data Memory.
[m] ← ACC ″AND″ [m]
Z
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Affected flag(s)
Subroutine call
Unconditionally calls a subroutine at the specified address. The Program Counter then
increments by 1 to obtain the address of the next instruction which is then pushed onto the
stack. The specified address is then loaded and the program continues execution from this
new address. As this instruction requires an additional operation, it is a two cycle instruction.
Stack ← Program Counter + 1
Program Counter ← addr
None
CLR [m]
Description
Operation
Affected flag(s)
Clear Data Memory
Each bit of the specified Data Memory is cleared to 0.
[m] ← 00H
None
CLR [m].i
Description
Operation
Affected flag(s)
Clear bit of Data Memory
Bit i of the specified Data Memory is cleared to 0.
[m].i ← 0
None
CLR WDT
Description
Operation
Clear Watchdog Timer
The TO, PDF flags and the WDT are all cleared.
WDT cleared
TO ← 0
PDF ← 0
TO, PDF
CALL addr
Description
Operation
Affected flag(s)
CPL [m]
Description
Operation
Affected flag(s)
CPLA [m]
Description
Operation
Affected flag(s)
DAA [m]
Description
Operation
Affected flag(s)
Rev. 1.10
Complement Data Memory
Each bit of the specified Data Memory is logically complemented (1′s complement). Bits which
previously contained a 1 are changed to 0 and vice versa.
[m] ← [m]
Z
Complement Data Memory with result in ACC
Each bit of the specified Data Memory is logically complemented (1′s complement). Bits which
previously contained a 1 are changed to 0 and vice versa. The complemented result is stored in
the Accumulator and the contents of the Data Memory remain unchanged.
ACC ← [m]
Z
Decimal-Adjust ACC for addition with result in Data Memory
Convert the contents of the Accumulator value to a BCD (Binary Coded Decimal) value
resulting from the previous addition of two BCD variables. If the low nibble is greater than 9
or if AC flag is set, then a value of 6 will be added to the low nibble. Otherwise the low nibble
remains unchanged. If the high nibble is greater than 9 or if the C flag is set, then a value of 6
will be added to the high nibble. Essentially, the decimal conversion is performed by adding
00H, 06H, 60H or 66H depending on the Accumulator and flag conditions. Only the C flag
may be affected by this instruction which indicates that if the original BCD sum is greater than
100, it allows multiple precision decimal addition.
[m] ← ACC + 00H or
[m] ← ACC + 06H or
[m] ← ACC + 60H or
[m] ← ACC + 66H
C
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DEC [m]
Description
Operation
Affected flag(s)
Decrement Data Memory
Data in the specified Data Memory is decremented by 1.
[m] ← [m] − 1
Z
DECA [m]
Description
Decrement Data Memory with result in ACC
Data in the specified Data Memory is decremented by 1. The result is stored in the
Accumulator. The contents of the Data Memory remain unchanged.
ACC ← [m] − 1
Z
Operation
Affected flag(s)
Affected flag(s)
Enter power down mode
This instruction stops the program execution and turns off the system clock. The contents of
the Data Memory and registers are retained. The WDT and prescaler are cleared. The power
down flag PDF is set and the WDT time-out flag TO is cleared.
TO ← 0
PDF ← 1
TO, PDF
INC [m]
Description
Operation
Affected flag(s)
Increment Data Memory
Data in the specified Data Memory is incremented by 1.
[m] ← [m] + 1
Z
INCA [m]
Description
Increment Data Memory with result in ACC
Data in the specified Data Memory is incremented by 1. The result is stored in the Accumulator.
The contents of the Data Memory remain unchanged.
ACC ← [m] + 1
Z
HALT
Description
Operation
Operation
Affected flag(s)
Operation
Affected flag(s)
Jump unconditionally
The contents of the Program Counter are replaced with the specified address. Program
execution then continues from this new address. As this requires the insertion of a dummy
instruction while the new address is loaded, it is a two cycle instruction.
Program Counter ← addr
None
MOV A,[m]
Description
Operation
Affected flag(s)
Move Data Memory to ACC
The contents of the specified Data Memory are copied to the Accumulator.
ACC ← [m]
None
MOV A,x
Description
Operation
Affected flag(s)
Move immediate data to ACC
The immediate data specified is loaded into the Accumulator.
ACC ← x
None
MOV [m],A
Description
Operation
Affected flag(s)
Move ACC to Data Memory
The contents of the Accumulator are copied to the specified Data Memory.
[m] ← ACC
None
JMP addr
Description
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NOP
Description
Operation
Affected flag(s)
No operation
No operation is performed. Execution continues with the next instruction.
No operation
None
OR A,[m]
Description
Logical OR Data Memory to ACC
Data in the Accumulator and the specified Data Memory perform a bitwise
logical OR operation. The result is stored in the Accumulator.
ACC ← ACC ″OR″ [m]
Z
Operation
Affected flag(s)
OR A,x
Description
Operation
Affected flag(s)
ORM A,[m]
Description
Operation
Affected flag(s)
RET
Description
Operation
Affected flag(s)
RET A,x
Description
Operation
Affected flag(s)
RETI
Description
Operation
Affected flag(s)
RL [m]
Description
Operation
Affected flag(s)
Rev. 1.10
Logical OR immediate data to ACC
Data in the Accumulator and the specified immediate data perform a bitwise logical OR
operation. The result is stored in the Accumulator.
ACC ← ACC ″OR″ x
Z
Logical OR ACC to Data Memory
Data in the specified Data Memory and the Accumulator perform a bitwise logical OR
operation. The result is stored in the Data Memory.
[m] ← ACC ″OR″ [m]
Z
Return from subroutine
The Program Counter is restored from the stack. Program execution continues at the restored
address.
Program Counter ← Stack
None
Return from subroutine and load immediate data to ACC
The Program Counter is restored from the stack and the Accumulator loaded with the specified
immediate data. Program execution continues at the restored address.
Program Counter ← Stack
ACC ← x
None
Return from interrupt
The Program Counter is restored from the stack and the interrupts are re-enabled by setting the
EMI bit. EMI is the master interrupt global enable bit. If an interrupt was pending when the
RETI instruction is executed, the pending Interrupt routine will be processed before returning
to the main program.
Program Counter ← Stack
EMI ← 1
None
Rotate Data Memory left
The contents of the specified Data Memory are rotated left by 1 bit with bit 7 rotated into bit 0.
[m].(i+1) ← [m].i; (i=0~6)
[m].0 ← [m].7
None
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RLA [m]
Description
Operation
Affected flag(s)
RLC [m]
Description
Operation
Affected flag(s)
RLCA [m]
Description
Operation
Affected flag(s)
RR [m]
Description
Operation
Affected flag(s)
RRA [m]
Description
Operation
Affected flag(s)
RRC [m]
Description
Operation
Affected flag(s)
Rev. 1.10
Rotate Data Memory left with result in ACC
The contents of the specified Data Memory are rotated left by 1 bit with bit 7 rotated into bit 0.
The rotated result is stored in the Accumulator and the contents of the Data Memory remain
unchanged.
ACC.(i+1) ← [m].i; (i=0~6)
ACC.0 ← [m].7
None
Rotate Data Memory left through Carry
The contents of the specified Data Memory and the carry flag are rotated left by 1 bit. Bit 7
replaces the Carry bit and the original carry flag is rotated into bit 0.
[m].(i+1) ← [m].i; (i=0~6)
[m].0 ← C
C ← [m].7
C
Rotate Data Memory left through Carry with result in ACC
Data in the specified Data Memory and the carry flag are rotated left by 1 bit. Bit 7 replaces the
Carry bit and the original carry flag is rotated into the bit 0. The rotated result is stored in the
Accumulator and the contents of the Data Memory remain unchanged.
ACC.(i+1) ← [m].i; (i=0~6)
ACC.0 ← C
C ← [m].7
C
Rotate Data Memory right
The contents of the specified Data Memory are rotated right by 1 bit with bit 0 rotated into bit 7.
[m].i ← [m].(i+1); (i=0~6)
[m].7 ← [m].0
None
Rotate Data Memory right with result in ACC
Data in the specified Data Memory is rotated right by 1 bit with bit 0
rotated into bit 7. The rotated result is stored in the Accumulator and the contents of the
Data Memory remain unchanged.
ACC.i ← [m].(i+1); (i=0~6)
ACC.7 ← [m].0
None
Rotate Data Memory right through Carry
The contents of the specified Data Memory and the carry flag are rotated right by 1 bit. Bit 0
replaces the Carry bit and the original carry flag is rotated into bit 7.
[m].i ← [m].(i+1); (i=0~6)
[m].7 ← C
C ← [m].0
C
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Body Fat Measurment Flash MCU
RRCA [m]
Description
Operation
Affected flag(s)
SBC A,[m]
Description
Operation
Affected flag(s)
SBC A, x
Description
Operation
Affected flag(s)
SBCM A,[m]
Description
Operation
Affected flag(s)
SDZ [m]
Description
Operation
Affected flag(s)
SDZA [m]
Description
Operation
Affected flag(s)
Rev. 1.10
Rotate Data Memory right through Carry with result in ACC
Data in the specified Data Memory and the carry flag are rotated right by 1 bit. Bit 0 replaces
the Carry bit and the original carry flag is rotated into bit 7. The rotated result is stored in the
Accumulator and the contents of the Data Memory remain unchanged.
ACC.i ← [m].(i+1); (i=0~6)
ACC.7 ← C
C ← [m].0
C
Subtract Data Memory from ACC with Carry
The contents of the specified Data Memory and the complement of the carry flag are
subtracted from the Accumulator. The result is stored in the Accumulator. Note that if the
result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is
positive or zero, the C flag will be set to 1.
ACC ← ACC − [m] − C
OV, Z, AC, C, SC, CZ
Subtract immediate data from ACC with Carry
The immediate data and the complement of the carry flag are subtracted from the
Accumulator. The result is stored in the Accumulator. Note that if the result of subtraction is
negative, the C flag will be cleared to 0, otherwise if the result is positive or zero, the C flag
will be set to 1.
ACC ← ACC − [m] − C
OV, Z, AC, C, SC, CZ
Subtract Data Memory from ACC with Carry and result in Data Memory
The contents of the specified Data Memory and the complement of the carry flag are
subtracted from the Accumulator. The result is stored in the Data Memory. Note that if the
result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is
positive or zero, the C flag will be set to 1.
[m] ← ACC − [m] − C
OV, Z, AC, C, SC, CZ
Skip if decrement Data Memory is 0
The contents of the specified Data Memory are first decremented by 1. If the result is 0 the
following instruction is skipped. As this requires the insertion of a dummy instruction while
the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program
proceeds with the following instruction.
[m] ← [m] − 1
Skip if [m]=0
None
Skip if decrement Data Memory is zero with result in ACC
The contents of the specified Data Memory are first decremented by 1. If the result is 0, the
following instruction is skipped. The result is stored in the Accumulator but the specified
Data Memory contents remain unchanged. As this requires the insertion of a dummy
instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0,
the program proceeds with the following instruction.
ACC ← [m] − 1
Skip if ACC=0
None
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SET [m]
Description
Operation
Affected flag(s)
Set Data Memory
Each bit of the specified Data Memory is set to 1.
[m] ← FFH
None
SET [m].i
Description
Operation
Affected flag(s)
Set bit of Data Memory
Bit i of the specified Data Memory is set to 1.
[m].i ← 1
None
SIZ [m]
Description
Skip if increment Data Memory is 0
The contents of the specified Data Memory are first incremented by 1. If the result is 0, the
following instruction is skipped. As this requires the insertion of a dummy instruction while
the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program
proceeds with the following instruction.
[m] ← [m] + 1
Skip if [m]=0
None
Operation
Affected flag(s)
SIZA [m]
Description
Operation
Affected flag(s)
SNZ [m].i
Description
Operation
Affected flag(s)
SNZ [m]
Description
Operation
Affected flag(s)
SUB A,[m]
Description
Operation
Affected flag(s)
Rev. 1.10
Skip if increment Data Memory is zero with result in ACC
The contents of the specified Data Memory are first incremented by 1. If the result is 0, the
following instruction is skipped. The result is stored in the Accumulator but the specified
Data Memory contents remain unchanged. As this requires the insertion of a dummy
instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not
0 the program proceeds with the following instruction.
ACC ← [m] + 1
Skip if ACC=0
None
Skip if Data Memory is not 0
If the specified Data Memory is not 0, the following instruction is skipped. As this requires the
insertion of a dummy instruction while the next instruction is fetched, it is a two cycle
instruction. If the result is 0 the program proceeds with the following instruction.
Skip if [m].i ≠ 0
None
Skip if Data Memory is not 0
If the specified Data Memory is not 0, the following instruction is skipped. As this requires the
insertion of a dummy instruction while the next instruction is fetched, it is a two cycle
instruction. If the result is 0 the program proceeds with the following instruction.
Skip if [m]≠ 0
None
Subtract Data Memory from ACC
The specified Data Memory is subtracted from the contents of the Accumulator. The result is
stored in the Accumulator. Note that if the result of subtraction is negative, the C flag will be
cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1.
ACC ← ACC − [m]
OV, Z, AC, C, SC, CZ
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SUBM A,[m]
Description
Operation
Affected flag(s)
Subtract Data Memory from ACC with result in Data Memory
The specified Data Memory is subtracted from the contents of the Accumulator. The result is
stored in the Data Memory. Note that if the result of subtraction is negative, the C flag will be
cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1.
[m] ← ACC − [m]
OV, Z, AC, C, SC, CZ
Operation
Affected flag(s)
Subtract immediate data from ACC
The immediate data specified by the code is subtracted from the contents of the Accumulator.
The result is stored in the Accumulator. Note that if the result of subtraction is negative, the C
flag will be cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1.
ACC ← ACC − x
OV, Z, AC, C, SC, CZ
SWAP [m]
Description
Operation
Affected flag(s)
Swap nibbles of Data Memory
The low-order and high-order nibbles of the specified Data Memory are interchanged.
[m].3~[m].0 ↔ [m].7~[m].4
None
SWAPA [m]
Description
Swap nibbles of Data Memory with result in ACC
The low-order and high-order nibbles of the specified Data Memory are interchanged. The
result is stored in the Accumulator. The contents of the Data Memory remain unchanged.
ACC.3~ACC.0 ← [m].7~[m].4
ACC.7~ACC.4 ← [m].3~[m].0
None
SUB A,x
Description
Operation
Affected flag(s)
SZ [m]
Description
Operation
Affected flag(s)
SZA [m]
Description
Operation
Affected flag(s)
SZ [m].i
Description
Operation
Affected flag(s)
Rev. 1.10
Skip if Data Memory is 0
If the contents of the specified Data Memory is 0, the following instruction is skipped. As this
requires the insertion of a dummy instruction while the next instruction is fetched, it is a two
cycle instruction. If the result is not 0 the program proceeds with the following instruction.
Skip if [m]=0
None
Skip if Data Memory is 0 with data movement to ACC
The contents of the specified Data Memory are copied to the Accumulator. If the value is zero,
the following instruction is skipped. As this requires the insertion of a dummy instruction
while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the
program proceeds with the following instruction.
ACC ← [m]
Skip if [m]=0
None
Skip if bit i of Data Memory is 0
If bit i of the specified Data Memory is 0, the following instruction is skipped. As this requires
the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle
instruction. If the result is not 0, the program proceeds with the following instruction.
Skip if [m].i=0
None
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TABRD [m]
Description
Operation
Affected flag(s)
TABRDL [m]
Description
Operation
Affected flag(s)
ITABRD [m]
Description
Operation
Affected flag(s)
ITABRDL [m]
Description
Operation
Affected flag(s)
XOR A,[m]
Description
Operation
Affected flag(s)
XORM A,[m]
Description
Operation
Affected flag(s)
XOR A,x
Description
Operation
Affected flag(s)
Rev. 1.10
Read table (specific page) to TBLH and Data Memory
The low byte of the program code (specific page) addressed by the table pointer pair
(TBLP and TBHP) is moved to the specified Data Memory and the high byte moved to TBLH.
[m] ← program code (low byte)
TBLH ← program code (high byte)
None
Read table (last page) to TBLH and Data Memory
The low byte of the program code (last page) addressed by the table pointer (TBLP) is moved
to the specified Data Memory and the high byte moved to TBLH.
[m] ← program code (low byte)
TBLH ← program code (high byte)
None
Increment table pointer low byte first and read table to TBLH and Data Memory
Increment table pointer low byte, TBLP, first and then the program code addressed by the
table pointer (TBHP and TBLP) is moved to the specified Data Memory and the high byte
moved to TBLH.
[m] ← program code (low byte)
TBLH ← program code (high byte)
None
Increment table pointer low byte first and read table (last page) to TBLH and Data Memory
Increment table pointer low byte, TBLP, first and then the low byte of the program code
(last page) addressed by the table pointer (TBLP) is moved to the specified Data Memory and
the high byte moved to TBLH.
[m] ← program code (low byte)
TBLH ← program code (high byte)
None
Logical XOR Data Memory to ACC
Data in the Accumulator and the specified Data Memory perform a bitwise logical XOR
operation. The result is stored in the Accumulator.
ACC ← ACC ″XOR″ [m]
Z
Logical XOR ACC to Data Memory
Data in the specified Data Memory and the Accumulator perform a bitwise logical XOR
operation. The result is stored in the Data Memory.
[m] ← ACC ″XOR″ [m]
Z
Logical XOR immediate data to ACC
Data in the Accumulator and the specified immediate data perform a bitwise logical XOR
operation. The result is stored in the Accumulator.
ACC ← ACC ″XOR″ x
Z
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Extended Instruction Definition
The extended instructions are used to directly access the data stored in any data memory sections.
LADC A,[m]
Description
Operation
Affected flag(s)
LADCM A,[m]
Description
Operation
Affected flag(s)
LADD A,[m]
Description
Add Data Memory to ACC with Carry
The contents of the specified Data Memory, Accumulator and the carry flag are added.
The result is stored in the Accumulator.
ACC ← ACC + [m] + C
OV, Z, AC, C, SC
Add ACC to Data Memory with Carry
The contents of the specified Data Memory, Accumulator and the carry flag are added.
The result is stored in the specified Data Memory.
[m] ← ACC + [m] + C
OV, Z, AC, C, SC
Add Data Memory to ACC
The contents of the specified Data Memory and the Accumulator are added.
The result is stored in the Accumulator.
Operation
Affected flag(s)
ACC ← ACC + [m]
OV, Z, AC, C, SC
LADDM A,[m]
Description
Add ACC to Data Memory
The contents of the specified Data Memory and the Accumulator are added.
The result is stored in the specified Data Memory.
[m] ← ACC + [m]
OV, Z, AC, C, SC
Operation
Affected flag(s)
LAND A,[m]
Description
Operation
Affected flag(s)
Logical AND Data Memory to ACC
Data in the Accumulator and the specified Data Memory perform a bitwise logical AND
operation. The result is stored in the Accumulator.
ACC ← ACC ″AND″ [m]
Z
Operation
Affected flag(s)
Logical AND ACC to Data Memory
Data in the specified Data Memory and the Accumulator perform a bitwise logical AND
operation. The result is stored in the Data Memory.
[m] ← ACC ″AND″ [m]
Z
LCLR [m]
Description
Operation
Affected flag(s)
Clear Data Memory
Each bit of the specified Data Memory is cleared to 0.
[m] ← 00H
None
LCLR [m].i
Description
Operation
Affected flag(s)
Clear bit of Data Memory
Bit i of the specified Data Memory is cleared to 0.
[m].i ← 0
None
LANDM A,[m]
Description
Rev. 1.10
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LCPL [m]
Description
Operation
Affected flag(s)
LCPLA [m]
Description
Operation
Affected flag(s)
Complement Data Memory
Each bit of the specified Data Memory is logically complemented (1′s complement). Bits which
previously contained a 1 are changed to 0 and vice versa.
[m] ← [m]
Z
Complement Data Memory with result in ACC
Each bit of the specified Data Memory is logically complemented (1′s complement). Bits which
previously contained a 1 are changed to 0 and vice versa. The complemented result is stored in
the Accumulator and the contents of the Data Memory remain unchanged.
ACC ← [m]
Z
Affected flag(s)
Decimal-Adjust ACC for addition with result in Data Memory
Convert the contents of the Accumulator value to a BCD (Binary Coded Decimal) value
resulting from the previous addition of two BCD variables. If the low nibble is greater than 9
or if AC flag is set, then a value of 6 will be added to the low nibble. Otherwise the low nibble
remains unchanged. If the high nibble is greater than 9 or if the C flag is set, then a value of 6
will be added to the high nibble. Essentially, the decimal conversion is performed by adding
00H, 06H, 60H or 66H depending on the Accumulator and flag conditions. Only the C flag
may be affected by this instruction which indicates that if the original BCD sum is greater than
100, it allows multiple precision decimal addition.
[m] ← ACC + 00H or
[m] ← ACC + 06H or
[m] ← ACC + 60H or
[m] ← ACC + 66H
C
LDEC [m]
Description
Operation
Affected flag(s)
Decrement Data Memory
Data in the specified Data Memory is decremented by 1.
[m] ← [m] − 1
Z
LDECA [m]
Description
Operation
Affected flag(s)
Decrement Data Memory with result in ACC
Data in the specified Data Memory is decremented by 1. The result is stored in the
Accumulator. The contents of the Data Memory remain unchanged.
ACC ← [m] − 1
Z
LINC [m]
Description
Operation
Affected flag(s)
Increment Data Memory
Data in the specified Data Memory is incremented by 1.
[m] ← [m] + 1
Z
LINCA [m]
Description
Increment Data Memory with result in ACC
Data in the specified Data Memory is incremented by 1. The result is stored in the Accumulator.
The contents of the Data Memory remain unchanged.
ACC ← [m] + 1
Z
LDAA [m]
Description
Operation
Operation
Affected flag(s)
Rev. 1.10
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LMOV A,[m]
Description
Operation
Affected flag(s)
Move Data Memory to ACC
The contents of the specified Data Memory are copied to the Accumulator.
ACC ← [m]
None
LMOV [m],A
Description
Operation
Affected flag(s)
Move ACC to Data Memory
The contents of the Accumulator are copied to the specified Data Memory.
[m] ← ACC
None
LOR A,[m]
Description
Logical OR Data Memory to ACC
Data in the Accumulator and the specified Data Memory perform a bitwise
logical OR operation. The result is stored in the Accumulator.
ACC ← ACC ″OR″ [m]
Z
Operation
Affected flag(s)
LORM A,[m]
Description
Operation
Affected flag(s)
LRL [m]
Description
Operation
Affected flag(s)
LRLA [m]
Description
Operation
Affected flag(s)
LRLC [m]
Description
Operation
Affected flag(s)
LRLCA [m]
Description
Operation
Affected flag(s)
Rev. 1.10
Logical OR ACC to Data Memory
Data in the specified Data Memory and the Accumulator perform a bitwise logical OR
operation. The result is stored in the Data Memory.
[m] ← ACC ″OR″ [m]
Z
Rotate Data Memory left
The contents of the specified Data Memory are rotated left by 1 bit with bit 7 rotated into bit 0.
[m].(i+1) ← [m].i; (i=0~6)
[m].0 ← [m].7
None
Rotate Data Memory left with result in ACC
The contents of the specified Data Memory are rotated left by 1 bit with bit 7 rotated into bit 0.
The rotated result is stored in the Accumulator and the contents of the Data Memory remain
unchanged.
ACC.(i+1) ← [m].i; (i=0~6)
ACC.0 ← [m].7
None
Rotate Data Memory left through Carry
The contents of the specified Data Memory and the carry flag are rotated left by 1 bit. Bit 7
replaces the Carry bit and the original carry flag is rotated into bit 0.
[m].(i+1) ← [m].i; (i=0~6)
[m].0 ← C
C ← [m].7
C
Rotate Data Memory left through Carry with result in ACC
Data in the specified Data Memory and the carry flag are rotated left by 1 bit. Bit 7 replaces the
Carry bit and the original carry flag is rotated into the bit 0. The rotated result is stored in the
Accumulator and the contents of the Data Memory remain unchanged.
ACC.(i+1) ← [m].i; (i=0~6)
ACC.0 ← C
C ← [m].7
C
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LRR [m]
Description
Operation
Affected flag(s)
LRRA [m]
Description
Operation
Affected flag(s)
LRRC [m]
Description
Operation
Affected flag(s)
LRRCA [m]
Description
Operation
Affected flag(s)
LSBC A,[m]
Description
Operation
Affected flag(s)
LSBCM A,[m]
Description
Operation
Affected flag(s)
Rev. 1.10
Rotate Data Memory right
The contents of the specified Data Memory are rotated right by 1 bit with bit 0 rotated into bit 7.
[m].i ← [m].(i+1); (i=0~6)
[m].7 ← [m].0
None
Rotate Data Memory right with result in ACC
Data in the specified Data Memory is rotated right by 1 bit with bit 0
rotated into bit 7. The rotated result is stored in the Accumulator and the contents of the
Data Memory remain unchanged.
ACC.i ← [m].(i+1); (i=0~6)
ACC.7 ← [m].0
None
Rotate Data Memory right through Carry
The contents of the specified Data Memory and the carry flag are rotated right by 1 bit. Bit 0
replaces the Carry bit and the original carry flag is rotated into bit 7.
[m].i ← [m].(i+1); (i=0~6)
[m].7 ← C
C ← [m].0
C
Rotate Data Memory right through Carry with result in ACC
Data in the specified Data Memory and the carry flag are rotated right by 1 bit. Bit 0 replaces
the Carry bit and the original carry flag is rotated into bit 7. The rotated result is stored in the
Accumulator and the contents of the Data Memory remain unchanged.
ACC.i ← [m].(i+1); (i=0~6)
ACC.7 ← C
C ← [m].0
C
Subtract Data Memory from ACC with Carry
The contents of the specified Data Memory and the complement of the carry flag are
subtracted from the Accumulator. The result is stored in the Accumulator. Note that if the
result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is
positive or zero, the C flag will be set to 1.
ACC ← ACC − [m] − C
OV, Z, AC, C, SC, CZ
Subtract Data Memory from ACC with Carry and result in Data Memory
The contents of the specified Data Memory and the complement of the carry flag are
subtracted from the Accumulator. The result is stored in the Data Memory. Note that if the
result of subtraction is negative, the C flag will be cleared to 0, otherwise if the result is
positive or zero, the C flag will be set to 1.
[m] ← ACC − [m] − C
OV, Z, AC, C, SC, CZ
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LSDZ [m]
Description
Operation
Affected flag(s)
Skip if decrement Data Memory is 0
The contents of the specified Data Memory are first decremented by 1. If the result is 0 the
following instruction is skipped. As this requires the insertion of a dummy instruction while
the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program
proceeds with the following instruction.
[m] ← [m] − 1
Skip if [m]=0
None
Affected flag(s)
Skip if decrement Data Memory is zero with result in ACC
The contents of the specified Data Memory are first decremented by 1. If the result is 0, the
following instruction is skipped. The result is stored in the Accumulator but the specified
Data Memory contents remain unchanged. As this requires the insertion of a dummy
instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not 0,
the program proceeds with the following instruction.
ACC ← [m] − 1
Skip if ACC=0
None
LSET [m]
Description
Operation
Affected flag(s)
Set Data Memory
Each bit of the specified Data Memory is set to 1.
[m] ← FFH
None
LSET [m].i
Description
Operation
Affected flag(s)
Set bit of Data Memory
Bit i of the specified Data Memory is set to 1.
[m].i ← 1
None
LSIZ [m]
Description
Skip if increment Data Memory is 0
The contents of the specified Data Memory are first incremented by 1. If the result is 0, the
following instruction is skipped. As this requires the insertion of a dummy instruction while
the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the program
proceeds with the following instruction.
[m] ← [m] + 1
Skip if [m]=0
None
LSDZA [m]
Description
Operation
Operation
Affected flag(s)
LSIZA [m]
Description
Operation
Affected flag(s)
LSNZ [m].i
Description
Operation
Affected flag(s)
Rev. 1.10
Skip if increment Data Memory is zero with result in ACC
The contents of the specified Data Memory are first incremented by 1. If the result is 0, the
following instruction is skipped. The result is stored in the Accumulator but the specified
Data Memory contents remain unchanged. As this requires the insertion of a dummy
instruction while the next instruction is fetched, it is a two cycle instruction. If the result is not
0 the program proceeds with the following instruction.
ACC ← [m] + 1
Skip if ACC=0
None
Skip if Data Memory is not 0
If the specified Data Memory is not 0, the following instruction is skipped. As this requires the
insertion of a dummy instruction while the next instruction is fetched, it is a two cycle
instruction. If the result is 0 the program proceeds with the following instruction.
Skip if [m].i ≠ 0
None
218
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LSNZ [m]
Description
Operation
Affected flag(s)
LSUB A,[m]
Description
Operation
Affected flag(s)
Skip if Data Memory is not 0
If the content of the specified Data Memory is not 0, the following instruction is skipped. As
this requires the insertion of a dummy instruction while the next instruction is fetched, it is a
two cycle instruction. If the result is 0 the program proceeds with the following instruction.
Skip if [m] ≠ 0
None
Subtract Data Memory from ACC
The specified Data Memory is subtracted from the contents of the Accumulator. The result is
stored in the Accumulator. Note that if the result of subtraction is negative, the C flag will be
cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1.
ACC ← ACC − [m]
OV, Z, AC, C, SC, CZ
Operation
Affected flag(s)
Subtract Data Memory from ACC with result in Data Memory
The specified Data Memory is subtracted from the contents of the Accumulator. The result is
stored in the Data Memory. Note that if the result of subtraction is negative, the C flag will be
cleared to 0, otherwise if the result is positive or zero, the C flag will be set to 1.
[m] ← ACC − [m]
OV, Z, AC, C, SC, CZ
LSWAP [m]
Description
Operation
Affected flag(s)
Swap nibbles of Data Memory
The low-order and high-order nibbles of the specified Data Memory are interchanged.
[m].3~[m].0 ↔ [m].7~[m].4
None
LSWAPA [m]
Description
Swap nibbles of Data Memory with result in ACC
The low-order and high-order nibbles of the specified Data Memory are interchanged. The
result is stored in the Accumulator. The contents of the Data Memory remain unchanged.
ACC.3~ACC.0 ← [m].7~[m].4
ACC.7~ACC.4 ← [m].3~[m].0
None
LSUBM A,[m]
Description
Operation
Affected flag(s)
LSZ [m]
Description
Operation
Affected flag(s)
LSZA [m]
Description
Operation
Affected flag(s)
Rev. 1.10
Skip if Data Memory is 0
If the contents of the specified Data Memory is 0, the following instruction is skipped. As this
requires the insertion of a dummy instruction while the next instruction is fetched, it is a two
cycle instruction. If the result is not 0 the program proceeds with the following instruction.
Skip if [m]=0
None
Skip if Data Memory is 0 with data movement to ACC
The contents of the specified Data Memory are copied to the Accumulator. If the value is zero,
the following instruction is skipped. As this requires the insertion of a dummy instruction
while the next instruction is fetched, it is a two cycle instruction. If the result is not 0 the
program proceeds with the following instruction.
ACC ← [m]
Skip if [m]=0
None
219
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BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
LSZ [m].i
Description
Operation
Affected flag(s)
LTABRD [m]
Description
Operation
Affected flag(s)
LTABRDL [m]
Description
Operation
Affected flag(s)
LITABRD [m]
Description
Operation
Skip if bit i of Data Memory is 0
If bit i of the specified Data Memory is 0, the following instruction is skipped. As this requires
the insertion of a dummy instruction while the next instruction is fetched, it is a two cycle
instruction. If the result is not 0, the program proceeds with the following instruction.
Skip if [m].i=0
None
Read table (current page) to TBLH and Data Memory
The low byte of the program code (current page) addressed by the table pointer (TBLP) is
moved to the specified Data Memory and the high byte moved to TBLH.
[m] ← program code (low byte)
TBLH ← program code (high byte)
None
Read table (last page) to TBLH and Data Memory
The low byte of the program code (last page) addressed by the table pointer (TBLP) is moved
to the specified Data Memory and the high byte moved to TBLH.
[m] ← program code (low byte)
TBLH ← program code (high byte)
None
Increment table pointer low byte first and read table to TBLH and Data Memory
Increment table pointer low byte, TBLP, first and then the program code addressed by the
table pointer (TBHP and TBLP) is moved to the specified Data Memory and the high byte
moved to TBLH.
[m] ← program code (low byte)
TBLH ← program code (high byte)
Affected flag(s)
None
LITABRDL [m]
Description
Increment table pointer low byte first and read table (last page) to TBLH and Data Memory
Increment table pointer low byte, TBLP, first and then the low byte of the program code
(last page) addressed by the table pointer (TBLP) is moved to the specified Data Memory and
the high byte moved to TBLH.
[m] ← program code (low byte)
TBLH ← program code (high byte)
None
Operation
Affected flag(s)
LXOR A,[m]
Description
Operation
Affected flag(s)
LXORM A,[m]
Description
Operation
Affected flag(s)
Rev. 1.10
Logical XOR Data Memory to ACC
Data in the Accumulator and the specified Data Memory perform a bitwise logical XOR
operation. The result is stored in the Accumulator.
ACC ← ACC ″XOR″ [m]
Z
Logical XOR ACC to Data Memory
Data in the specified Data Memory and the Accumulator perform a bitwise logical XOR
operation. The result is stored in the Data Memory.
[m] ← ACC ″XOR″ [m]
Z
220
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Package Information
Note that the package information provided here is for consultation purposes only. As this
information may be updated at regular intervals users are reminded to consult the Holtek website for
the latest version of the Package/Carton Information.
Additional supplementary information with regard to packaging is listed below. Click on the relevant
section to be transferred to the relevant website page.
• Further Package Information (include Outline Dimensions, Product Tape and Reel Specifications)
• Packing Meterials Information
• Carton information
Rev. 1.10
221
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
48-pin LQFP (7mm×7mm) Outline Dimensions
Symbol
Dimensions in inch
Min.
Nom.
Max.
A
—
0.354 BSC
—
B
—
0.276 BSC
—
C
—
0.354 BSC
—
D
—
0.276 BSC
—
E
—
0.020 BSC
—
F
0.007
0.009
0.011
G
0.053
0.055
0.057
H
—
—
0.063
I
0.002
—
0.006
J
0.018
0.024
0.030
K
0.004
—
0.008
α
0°
―
7°
Symbol
Rev. 1.10
Dimensions in mm
Min.
Nom.
Max.
A
—
9.00 BSC
—
B
—
7.00 BSC
—
C
—
9.00 BSC
—
D
—
7.00 BSC
—
E
—
0.50 BSC
—
F
0.17
0.22
0.27
G
1.35
1.40
1.45
H
—
—
1.60
I
0.05
—
0.15
J
0.45
0.60
0.75
K
0.09
—
0.20
α
0°
―
7°
222
January 04, 2018
BH66F2650/BH66F2660
Body Fat Measurment Flash MCU
Copyright© 2018 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time
of publication. However, Holtek assumes no responsibility arising from the use of
the specifications described. The applications mentioned herein are used solely
for the purpose of illustration and Holtek makes no warranty or representation that
such applications will be suitable without further modification, nor recommends
the use of its products for application that may present a risk to human life due to
malfunction or otherwise. Holtek's products are not authorized for use as critical
components in life support devices or systems. Holtek reserves the right to alter
its products without prior notification. For the most up-to-date information, please
visit our web site at http://www.holtek.com.tw/en/home.
Rev. 1.10
223
January 04, 2018
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