31.00mm [1.220"] 29.00mm [1.142"] 1.00mm typ. 31.00mm [1.220"] A th b F w A a 29.00mm [1.142"] Ø 0.51mm pad (x876) [Ø 0.020"] Top View 2 3.76mm [0.148" ± 0.015"] 1 1.68mm [0.066"] 1.00mm typ. [0.039"] Ø0.20mm typ. [0.008"] Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. Non-clad. 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Description: Giga-snaP BGA Land Socket 876 position (1.0mm pitch) SMT pads to gold plated terminal pins. Pin asignment 1:1. Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice. LS-BGA876A-41 Drawing Status: Released © 2008 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: E Smolentseva Date: 06/05/08 File: LS-BGA876A-41 Dwg Modified: Scale: 2:1 Rev: A