NXP LD6836CX413H Ultra low dropout regulators, low noise, 300 ma Datasheet

LD6836 series
Ultra low dropout regulators, low noise, 300 mA
Rev. 2 — 5 October 2012
Product data sheet
1. Product profile
1.1 General description
The LD6836 series is a small-size Low DropOut regulator (LDO) family with a typical
voltage drop of 90 mV at 300 mA current rating. Operating input voltages can range from
2.3 V to 5.5 V. The devices are available with fixed output voltages between 1.2 V
and 3.6 V.
In disabled mode the LD6836x/xxH devices show a high-ohmic state at the output pin
while the LD6836x/xxP devices contain a pull-down switching transistor to provide a
low-ohmic output state (auto discharge function).
The LD6836CX4 and LD6836CX4/C devices are in a 0.4 mm pitch Wafer-Level
Chip-Scale Package (WLCSP) making them ideal for use in portable applications
requiring component miniaturization. The LD6836TD devices are in a small SOT753
Surface-Mounted Device (SMD) plastic package. All devices are manufactured in
monolithic silicon technology.
1.2 Features and benefits













300 mA output current rating
Input voltage range 2.3 V to 5.5 V
Fixed output voltage between 1.2 V and 3.6 V
Dropout voltage 90 mV at 300 mA output rating
Low quiescent current in shutdown mode (typical 0.1 A)
30 V RMS output noise voltage (typical value) at 10 Hz to 100 kHz
Turn-on time 150 s
55 dB Power Supply Rejection Ratio (PSRR) at 1 kHz
Over-temperature protection
Output current limiter
LD6836x/xxH: high-ohmic (3-state) output state when disabled
LD6836x/xxP: low-ohmic output state when disabled (auto discharge function)
Integrated ElectroStatic Discharge (ESD) protection up to 10 kV Human Body
Model (HBM)
 WLCSP with 0.4 mm pitch and package size of 0.76 mm  0.76 mm  0.47 mm
 Small SOT753 SMD plastic package (SOT23-5 compatible)
 Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (dark green compliant)
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
1.3 Applications
Analog and digital interfaces requiring lower than standard supply voltages in mobile
appliances such as smartphones, mobile phone handsets and cordless telephones. Other
typical applications are digital still cameras, mobile internet devices, personal navigation
devices and portable media players.
2. Pinning information
2.1 Pinning
bump A1
index area
1
2
A
5
4
B
001aao107
1
Fig 1.
2
transparent top view,
solder balls facing down
3
Pin configuration for SOT753
Fig 2.
Pin configuration for WLCSP4
2.2 Pin description
Table 1.
Symbol
Pin
Description
IN
1
regulator input voltage
GND
2
supply ground
EN
3
device enable input; active HIGH
n.c.
4
not connected
OUT
5
regulator output voltage
Table 2.
LD6836_SER
Product data sheet
Pin description for SOT753
Pin description for WLCSP4
Symbol
Pin
Description
GND
A1
supply ground
EN
A2
device enable input; active HIGH
OUT
B1
regulator output voltage
IN
B2
regulator input voltage
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
2 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
LD6836CX4
WLCSP4
wafer-level chip-scale package; 4 bumps (2  2)
LD6836CX4/C
WLCSP4
wafer-level chip-scale package with backside
coating; 4 bumps (2  2) [1]
-
LD6836TD
-
plastic surface-mounted package; 5 leads
SOT753
[1]
Version
[1]
-
Size 0.76 mm  0.76 mm.
3.1 Ordering options
Further information on output voltage is available on request; see Section 18 “Contact
information”.
Table 4.
Type number
Nominal output
voltage
Type number
Nominal output
voltage
LD6836CX4/12H
1.2 V
LD6836CX4/25H
2.5 V
LD6836CX4/13H
1.3 V
LD6836CX4/27H
2.7 V
LD6836CX4/14H
1.4 V
LD6836CX4/28H
2.8 V
LD6836CX4/16H
1.6 V
LD6836CX4/29H
2.9 V
LD6836CX4/18H
1.8 V
LD6836CX4/30H
3.0 V
LD6836CX4/20H
2.0 V
LD6836CX4/33H
3.3 V
LD6836CX4/22H
2.2 V
LD6836CX4/36H
3.6 V
LD6836CX4/23H
2.3 V
-
-
Table 5.
LD6836_SER
Product data sheet
Type number extension of high-ohmic output in WLCSP4
Type number extension of pull-down output in WLCSP4
Type number
Nominal output
voltage
Type number
Nominal output
voltage
LD6836CX4/12P
1.2 V
LD6836CX4/23P
2.3 V
LD6836CX4/13P
1.3 V
LD6836CX4/25P
2.5 V
LD6836CX4/14P
1.4 V
LD6836CX4/27P
2.7 V
LD6836CX4/16P
1.6 V
LD6836CX4/28P
2.8 V
LD6836CX4/18P
1.8 V
LD6836CX4/29P
2.9 V
LD6836CX4/20P
2.0 V
LD6836CX4/30P
3.0 V
LD6836CX4/21P
2.1 V
LD6836CX4/33P
3.3 V
LD6836CX4/22P
2.2 V
LD6836CX4/36P
3.6 V
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
3 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
Table 6.
Type number
Nominal output
voltage
Type number
Nominal output
voltage
LD6836CX4/C12P
1.2 V
LD6836CX4/C23P
2.3 V
LD6836CX4/C13P
1.3 V
LD6836CX4/C25P
2.5 V
LD6836CX4/C14P
1.4 V
LD6836CX4/C27P
2.7 V
LD6836CX4/C16P
1.6 V
LD6836CX4/C28P
2.8 V
LD6836CX4/C18P
1.8 V
LD6836CX4/C29P
2.9 V
LD6836CX4/C20P
2.0 V
LD6836CX4/C30P
3.0 V
LD6836CX4/C21P
2.1 V
LD6836CX4/C33P
3.3 V
LD6836CX4/C22P
2.2 V
LD6836CX4/C36P
3.6 V
Table 7.
Product data sheet
Type number extension of high-ohmic output in SOT753
Type number
Nominal output
voltage
Type number
Nominal output
voltage
LD6836TD/12H
1.2 V
LD6836TD/23H
2.3 V
LD6836TD/13H
1.3 V
LD6836TD/27H
2.7 V
LD6836TD/14H
1.4 V
LD6836TD/28H
2.8 V
LD6836TD/16H
1.6 V
LD6836TD/29H
2.9 V
LD6836TD/18H
1.8 V
LD6836TD/30H
3.0 V
LD6836TD/20H
2.0 V
LD6836TD/33H
3.3 V
LD6836TD/22H
2.2 V
LD6836TD/36H
3.6 V
Table 8.
LD6836_SER
Type number extension of pull-down output in WLCSP4 with backside coating
Type number extension of pull-down output in SOT753
Type number
Nominal output
voltage
Type number
Nominal output
voltage
LD6836TD/12P
1.2 V
LD6836TD/23P
2.3 V
LD6836TD/13P
1.3 V
LD6836TD/25P
2.5 V
LD6836TD/14P
1.4 V
LD6836TD/27P
2.7 V
LD6836TD/16P
1.6 V
LD6836TD/28P
2.8 V
LD6836TD/18P
1.8 V
LD6836TD/29P
2.9 V
LD6836TD/20P
2.0 V
LD6836TD/30P
3.0 V
LD6836TD/21P
2.1 V
LD6836TD/33P
3.3 V
LD6836TD/22P
2.2 V
LD6836TD/36P
3.6 V
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
4 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
4. Block diagram
VIN
VOUT
R1
VEN
Vreference
GENERATOR
THERMAL
PROTECTION
R2
OVERCURRENT
PROTECTION
GND
001aan756
Fig 3.
Block diagram of LD6836x/xxH
VIN
VOUT
R1
VEN
Vreference
GENERATOR
THERMAL
PROTECTION
R2
OVER CURRENT
PROTECTION
GND
Fig 4.
LD6836_SER
Product data sheet
001aan299
Block diagram of LD6836x/xxP (auto discharge function)
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
5 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
5. Limiting values
Table 9.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
VIN
voltage on pin IN
4 ms transient
total power dissipation
Ptot
Min
Max
Unit
0.5
+6.0
V
LD6836CX4, LD6836CX4/C
[1]
-
770
mW
LD6836TD
[1]
-
800
mW
Tstg
storage temperature
55
+150
C
Tj
junction temperature
40
+125
C
Tamb
ambient temperature
VESD
electrostatic discharge voltage
40
+85
C
human body model level 6
[2]
-
10
kV
machine model class 3
[3]
-
400
V
[1]
The (absolute) maximum power dissipation depends on the junction temperature Tj. Higher power dissipation is allowed with lower
ambient temperatures. The conditions to determine the specified values are Tamb = 25 C and the use of a two layer Printed-Circuit
Board (PCB).
[2]
According to IEC 61340-3-1.
[3]
According to JESD22-A115C.
6. Recommended operating conditions
Table 10. Operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Tamb
Tj
Conditions
Min
Typ
Max
Unit
ambient temperature
40
-
+85
C
junction temperature
-
-
+125
C
voltage on pin IN
2.3
-
5.5
V
voltage on pin EN
0
-
VIN
V
0.7
1.0
-
F
Pin IN
VIN
Pin EN
VEN
Pin OUT
CL(ext)
[1]
[1]
external load capacitance
See Section 10.1 “Capacitor values”.
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
6 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
7. Thermal characteristics
Table 11.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from junction to ambient LD6836CX4, LD6836CX4/C
LD6836TD
Typ
Unit
[1][2]
130
K/W
[1][2]
125
K/W
[1]
The overall Rth(j-a) can vary depending on the board layout. To minimize the effective Rth(j-a), all pins must have a solid connection to
larger Cu layer areas for example to the power and ground layer. In multi-layer PCB applications, the second layer is used to create a
large heat spreader area directly below the LDO. If this layer is either ground or power, it is connected with several vias to the top layer
connecting to the device ground or supply. Avoid the use of solder-stop varnish under the chip.
[2]
Use the measurement data given for a rough estimation of the Rth(j-a) in your application. The actual Rth(j-a) value can vary in applications
using different layer stacks and layouts.
8. Characteristics
Table 12. Electrical characteristics
At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V);
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
dropout voltage
IOUT = 300 mA; VIN < VO(nom)
LD6836CX4, LD6836CX4/C
-
90
160
mV
LD6836TD
-
100
200
mV
Tamb = +25 C
3
0.5
+3
%
30 C  Tamb  +85 C
4
-
+4
%
Output voltage
Vdo
VO
output voltage variation
[1]
VOUT < 1.8 V; IOUT = 1 mA
VOUT  1.8 V; IOUT = 1 mA
Tamb = +25 C
2
0.5
+2
%
30 C  Tamb  +85 C
3
-
+3
%
0.1
-
+0.1
%/V
-
0.0025 0.01
%/mA
-
-
300
mA
350
-
-
mA
350
-
-
mA
-
600
-
mA
Line regulation error
VO/(VOxVI)
relative output voltage
variation with input voltage
VIN = (VO(nom) + 0.2 V) to 5.5 V
[1]
Load regulation error
VO/(VOxIO)
relative output voltage
variation with output current
1 mA  IOUT  300 mA
Output current
IOUT
IOM
current on pin OUT
peak output current
VIN = (VO(nom) + 0.2 V) to 5.5 V
VO(nom) > 1.8V;
[1]
VOUT = 0.95  VO(nom)
VO(nom) < 1.8 V;
VOUT = 0.9  VO(nom)
Isc
short-circuit current
LD6836_SER
Product data sheet
pin OUT
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
7 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
Table 12. Electrical characteristics …continued
At recommended input voltages and Tamb = 40 C to +85 C; voltages are referenced to GND (ground = 0 V);
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Regulator quiescent current
quiescent current
Iq
VEN = 1.4 V; IOUT = 0 mA
-
70
100
A
VEN = 1.4 V; 1 mA  IOUT  300 mA
-
155
250
A
VEN  0.4 V
-
0.1
1
A
-
55
-
dB
Ripple rejection and output noise
[1]
PSRR
power supply rejection ratio
VIN = VO(nom) + 1.0 V; IOUT = 30 mA;
fripple = 1 kHz
Vn(o)(RMS)
RMS output noise voltage
fripple = 10 Hz to 100 kHz;
CL(ext) = 1 F
-
30
-
V
0
-
0.4
V
1.1
-
5.5
V
-
150
-
s
-
300
-
s
-
100
-

Enable input and timing
VIL
LOW-level input voltage
pin EN
VIH
HIGH-level input voltage
pin EN
regulator start-up time
VIN = 5.5 V; VOUT = 0.95  VO(nom);
IOUT = 300 mA; CL(ext) = 1 F
tstartup(reg)
[1]
LD6836x/xxP; auto discharge function
tsd(reg)
regulator shutdown time
Rpd
pull-down resistance
VIN = 5.5 V; VOUT = 0.05  VO(nom);
CL(ext) = 1 F
Over-temperature protection
Tsd
shutdown temperature
-
160
-
C
Tsd(hys)
shutdown temperature
hysteresis
-
20
-
K
[1]
VO(nom) = nominal output voltage (device specific).
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
8 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
9. Dynamic behavior
9.1 Power Supply Rejection Ratio (PSRR)
PSRR stands for the capability of the regulator to suppress unwanted signals on the input
voltage like noise or ripples.
V out  ripple 
for all frequencies
PSRR  dB  = 20 log -------------------------V in  ripple 
3655
G%
,287
,287
,287
,287
,287
,287
P$
P$
P$
P$
P$
P$
3655
G%
DDD
,287
,287
,287
,287
,287
,287
P$
P$
P$
P$
P$
P$
IUHTXHQF\ +]
VIN = 4.6 V; VOUT = 3.6 V; CL(ext) = 1 F
Fig 5.
IUHTXHQF\ +]
VIN = 3.5 V; VOUT = 2.5 V; CL(ext) = 1 F
PSRR for LD6836CX4/36H
Fig 6.
3655
G%
PSRR of LD6836TD/25H
DDD
,287
,287
,287
,287
,287
,287
P$
P$
P$
P$
P$
P$
IUHTXHQF\ +]
VIN = 2.2 V; VOUT = 1.2 V; CL(ext) = 1 F
Fig 7.
PSRR of LD6836CX4/12H
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
9 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
9.2 Dropout
The dropout voltage is defined as the smallest input to output voltage difference at a
specified load current when the regulator operates within its linear region. This means that
the input voltage is below the nominal output voltage value and the pass transistor works
as a plain resistor.
A small dropout voltage guarantees lower power consumption and efficiency
maximization.
DDD
9GR
P9
Fig 8.
7DPE ƒ&
7DPE ƒ&
7DPE ƒ&
DDD
9GR
P9
,287 P$
Dropout voltage as a function of output
current for LD6836CX4/25x
Fig 9.
7DPE ƒ&
7DPE ƒ&
7DPE ƒ&
,287 P$
Dropout voltage as a function of output
current for LD6836TD/36x
9.3 Accuracy
The LD6836 series guarantees high accuracy of the nominal output voltage.
DDD
,287 P$
9287
9
,287 P$
,287 P$
,287 P$
,287 P$
9,1 9
Fig 10. Working voltage tolerance for LD6836CX4/25x
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
10 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
9.4 Quiescent current
Quiescent (or ground) current is the difference between input and output current of the
regulator.
DDD
,*1'
7DPE ƒ&
IOUT = 0 mA
Fig 11. Quiescent current for LD6836CX4/25H
9.5 Noise
Output noise voltage of an LDO circuit is given as noise density or RMS output noise
voltage over a defined frequency spectrum (10 Hz to 100 kHz). Permanent conditions are
a constant output current and a ripple-free input voltage. The output noise voltage is
generated by the LDO regulator.
DDD
QRLVH
ȝ9Y+]
,287
,287
,287
,287
,287
,287
P$
P$
P$
P$
P$
P$
IUHTXHQF\ +]
Fig 12. Noise density for LD6836x/25x
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
11 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
9.6 Line Regulation
Line regulation is the capability of the circuit to maintain the nominal output voltage while
varying the input voltage.
DDD
9,1
9
9287
9
9287
DDD
9287
9,1
9
9287
9
9,1
WLPH PV
9,1
IOUT = 300 mA
WLPH PV
IOUT = 300 mA
Fig 13. Line regulation for LD6836CX4/33P
Fig 14. Line regulation for LD6836CX4/25P
9.7 Load Regulation
Load regulation is the capability of the circuit to maintain the nominal output voltage while
varying the output current.
DDD
,287
$
9287
9
9287
DDD
,287
$
9287
9
9287
,287
,287
WLPH PV
VIN = 5.5 V
Product data sheet
WLPH PV
VIN = 5.5 V
Fig 15. Load regulation for LD6836CX4/33P
LD6836_SER
Fig 16. Load regulation for LD6836CX4/25P
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
12 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
9.8 Start-up and shutdown
Start-up time defines the time needed for the LDO to achieve 95 % of its typical output
voltage level after activation via the enable pin. Shutdown time defines the time needed
for the LDO to pull-down the output voltage to 10 % of its nominal output voltage after
deactivation via the enable pin.
DDD
9HQDEOH
9
9287
9(1
DDD
9HQDEOH
9
9287
9
9287
9
9(1
9287
WLPH PV
Fig 17. Start-up for LD6836x/33P
WLPH PV
Fig 18. Shutdown for LD6836x/25P
9.9 Enable threshold voltage
An active HIGH signal enables the LDO when the signal exceeds the minimum input
HIGH voltage threshold. The LDO is in Off state as long the signal is below the maximum
LOW threshold. The input voltage threshold is independent from the LDO input voltage.
DDD
9287
9
+,*+WR/2:
/2:WR+,*+
9(1 9
Fig 19. Enable threshold voltage
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
13 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
10. Application information
10.1 Capacitor values
The LD6836 series require external capacitors at the output to guarantee a stable
regulator behavior. Do not under-run the specified minimum Equivalent Series
Resistance (ESR). The absolute value of the total capacitance attached to the output pin
OUT influences the shutdown time (tsd(reg)) of the LD6836 series. Also an input capacitor
is recommended to keep the input voltage stable.
Table 13.
External load capacitor
Symbol
Parameter
Conditions
Ci(ext)
external input capacitance
[1]
CL(ext)
external load capacitance
[1]
ESR
equivalent series resistance
[1]
Min
Typ
Max
Unit
0.7
1.0
0.7
1.0
-
F
5
-
500
m
F
The minimum value of capacitance for stability and correct operation is 0.7 F. The specified capacitor
tolerance is 30 % or better over the temperature and operating conditions range. The recommended
capacitor type is X7R to meet the full device temperature specification of 40 C to +125 C.
IN
IN
OUT
EN
GND
1μF
OUT
1μF
001aan647
Fig 20. Application diagram
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
14 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
11. Test information
11.1 Quality information
This product has been qualified in accordance with NX1-00023 NXP Semiconductors
Quality and Reliability Specification and is suitable for use in consumer applications.
12. Marking
12.1 WLCSP4
WLCSP dies are laser marked with the following information (see Table 14 to 16 and
Figure 21):
1. Shaded area: marking of pin A1
2. The character N gives the version code and describes the output mode of the LDO. If
the code is legible, the LDO has an integrated pull down transistor (“P“ version). If the
character N is rotated counterclockwise by 90°, the LDO is a “H“ version.
3. “YYY” symbolizes a placeholder for some characters of the lot ID
7UDQVSDUHQWWRSYLHZ
DDD
Fig 21. Marking WLCSP4
Table 14.
LD6836_SER
Product data sheet
Marking code of high-ohmic output
Type number
Nominal output voltage
Marking code
LD6836CX4/12H
1.2 V
A
LD6836CX4/27H
2.7 V
P
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
15 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
Table 15.
Marking of pull-down output
Type number
Nominal
Marking
output voltage code
Type number
Nominal
Marking
output voltage code
LD6836CX4/12P 1.2 V
A
LD6836CX4/23P 2.3 V
L
LD6836CX4/13P 1.3 V
B
LD6836CX4/25P 2.5 V
N
LD6836CX4/14P 1.4 V
C
LD6836CX4/27P 2.7 V
P
LD6836CX4/16P 1.6 V
E
LD6836CX4/28P 2.8 V
Q
LD6836CX4/18P 1.8 V
G
LD6836CX4/29P 2.9 V
R
LD6836CX4/20P 2.0 V
I
LD6836CX4/30P 3.0 V
S
LD6836CX4/21P 2.1 V
J
LD6836CX4/33P 3.3 V
V
LD6836CX4/22P 2.2 V
K
LD6836CX4/36P 3.6 V
Y
Table 16.
Marking code of pull-down output with backside coating
Type number
Nominal
Marking
output voltage code
Type number
Nominal
Marking
output voltage code
LD6836CX4/C12P 1.2 V
A
LD6836CX4/C23P 2.3 V
L
LD6836CX4/C13P 1.3 V
B
LD6836CX4/C25P 2.5 V
N
LD6836CX4/C14P 1.4 V
C
LD6836CX4/C27P 2.7 V
P
LD6836CX4/C16P 1.6 V
E
LD6836CX4/C28P 2.8 V
Q
LD6836CX4/C18P 1.8 V
G
LD6836CX4/C29P 2.9 V
R
LD6836CX4/C20P 2.0 V
I
LD6836CX4/C30P 3.0 V
S
LD6836CX4/C21P 2.1 V
J
LD6836CX4/C33P 3.3 V
V
LD6836CX4/C22P 2.2 V
K
LD6836CX4/C36P 3.6 V
Y
12.2 SOT753
;<=
[[
[[[[
WUDQVSDUHQWWRSYLHZ
DDD
Circle (bottom left) = marking of pin 1
XYZ = version; for marking code corresponding to type number see Table 17 and 18
All other characters = lot ID information
Fig 22. Marking SOT753
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
16 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
Table 17.
Marking code of high-ohmic output
Type number
Nominal
Marking
output voltage code
9AH
LD6836TD/23H 2.3 V
9LH
LD6836TD/13H 1.3 V
9BH
LD6836TD/27H 2.7 V
9PH
LD6836TD/14H 1.4 V
9CH
LD6836TD/28H 2.8 V
9QH
LD6836TD/16H 1.6 V
9EH
LD6836TD/29H 2.9 V
9RH
LD6836TD/18H 1.8 V
9GH
LD6836TD/30H 3.0 V
9SH
LD6836TD/20H 2.0 V
9JH
LD6836TD/33H 3.3 V
9VH
LD6836TD/22H 2.2 V
9KH
LD6836TD/36H 3.6 V
9YH
Marking of pull-down output
Type number
Product data sheet
Type number
LD6836TD/12H 1.2 V
Table 18.
LD6836_SER
Nominal
Marking
output voltage code
Nominal
Marking
output voltage code
Type number
Nominal
Marking
output voltage code
LD6836TD/12P 1.2 V
9AP
LD6836TD/23P 2.3 V
9LP
LD6836TD/13P 1.3 V
9BP
LD6836TD/25P 2.5 V
9NP
LD6836TD/14P 1.4 V
9CP
LD6836TD/27P 2.7 V
9PP
LD6836TD/16P 1.6 V
9EP
LD6836TD/28P 2.8 V
9QP
LD6836TD/18P 1.8 V
9GP
LD6836TD/29P 2.9 V
9RP
LD6836TD/20P 2.0 V
9JP
LD6836TD/30P 3.0 V
9SP
LD6836TD/21P 2.1 V
9ZP
LD6836TD/33P 3.3 V
9VP
LD6836TD/22P 2.2 V
9KP
LD6836TD/36P 3.6 V
9YP
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
17 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
13. Package outline
WLCSP4: wafer level chip-size package; 4 bumps (2 x 2)
D
bump A1
index area
A2
A
E
A1
detail X
e
b
B
e
A
1
2
X
European
projection
wlcsp4_2x2_po
Fig 23. Package outline LD6836CX4 (WLCSP4)
Table 19.
Dimensions for Figure 23
Symbol
Min
Typ
Max
Unit
A
0.44
0.47
0.50
mm
A1
0.18
0.20
0.22
mm
A2
0.26
0.27
0.28
mm
b
0.21
0.26
0.31
mm
D
0.71
0.76
0.81
mm
E
0.71
0.76
0.81
mm
e
-
0.4
-
mm
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
18 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
:/&63ZDIHUOHYHOFKLSVL]HSDFNDJHZLWKEDFNVLGHFRDWLQJEXPSV [
'
$
EXPS$
LQGH[DUHD
$
$
(
$
GHWDLO;
H
E
%
H
$
;
(XURSHDQ
SURMHFWLRQ
ZOFVSB[BFBSR
Fig 24. Package outline LD6836CX4/C (WLCSP4 with backside coating)
Table 20.
Dimensions for Figure 24
Symbol
Min
Typ
Max
Unit
A
0.47
0.51
0.55
mm
A1
0.18
0.20
0.22
mm
A2
0.26
0.27
0.28
mm
A3
0.03
0.04
0.05
mm
b
0.21
0.26
0.31
mm
D
0.71
0.76
0.81
mm
E
0.71
0.76
0.81
mm
e
-
0.4
-
mm
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
19 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
Plastic surface-mounted package; 5 leads
SOT753
D
E
B
y
A
X
HE
5
v M A
4
Q
A
A1
c
1
2
3
Lp
detail X
bp
e
w M B
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.100
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
SOT753
SC-74A
EUROPEAN
PROJECTION
ISSUE DATE
02-04-16
06-03-16
Fig 25. Package outline LD6836 series (SOT753)
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
20 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
14. Soldering
D
e
c
(4×)
e
solder resist
E
solder paste = solderland
f
(4×)
occupied area
Dimensions in mm
wlcsp4_2x2_fr
a. LD6836CX4 (WLCSP4)
'
H
F
î
H
VROGHUUHVLVW
(
VROGHUSDVWH VROGHUODQG
I
î
RFFXSLHGDUHD
'LPHQVLRQVLQPP
ZOFVSB[BFBIU
b. LD6836CX4/C (WLCSP4 with backside coating)
Fig 26. Reflow soldering footprint WLCSP4
Table 21.
LD6836_SER
Product data sheet
Dimensions for Figure 26
Symbol
Min
Typ
Max
Unit
c
-
0.25
-
mm
D
0.71
0.76
0.81
mm
E
0.71
0.76
0.81
mm
e
-
0.4
-
mm
f
-
0.325
-
mm
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
21 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
3.45
1.95
0.45 0.55
(5×) (5×)
0.95
3.3
2.825
solder lands
solder resist
0.95
solder paste
occupied area
2.4
Dimensions in mm
0.7
(5×)
0.8
(5×)
sot753_fr
Fig 27. Reflow soldering footprint SOT753
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
22 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 28) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 22 and 23
Table 22.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
LD6836_SER
Product data sheet
< 350
 350
< 2.5
235
220
 2.5
220
220
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
23 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
Table 23.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 28.
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 28. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
24 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
16. Revision history
Table 24.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
LD6836_SER v.2
20121005
Product data sheet
-
LD6836_SER v.1
-
-
Modifications:
LD6836_SER v.1
LD6836_SER
Product data sheet
•
Section 9.2 “Dropout”: corrected
20121004
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
25 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
LD6836_SER
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
26 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
LD6836_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 5 October 2012
© NXP B.V. 2012. All rights reserved.
27 of 28
LD6836 series
NXP Semiconductors
Ultra low dropout regulators, low noise, 300 mA
19. Contents
1
1.1
1.2
1.3
2
2.1
2.2
3
3.1
4
5
6
7
8
9
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
10
10.1
11
11.1
12
12.1
12.2
13
14
15
15.1
15.2
15.3
15.4
16
17
17.1
17.2
17.3
17.4
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended operating conditions. . . . . . . . 6
Thermal characteristics . . . . . . . . . . . . . . . . . . 7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Dynamic behavior . . . . . . . . . . . . . . . . . . . . . . . 9
Power Supply Rejection Ratio (PSRR). . . . . . . 9
Dropout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Quiescent current . . . . . . . . . . . . . . . . . . . . . . 11
Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Line Regulation. . . . . . . . . . . . . . . . . . . . . . . . 12
Load Regulation . . . . . . . . . . . . . . . . . . . . . . . 12
Start-up and shutdown . . . . . . . . . . . . . . . . . . 13
Enable threshold voltage . . . . . . . . . . . . . . . . 13
Application information. . . . . . . . . . . . . . . . . . 14
Capacitor values . . . . . . . . . . . . . . . . . . . . . . . 14
Test information . . . . . . . . . . . . . . . . . . . . . . . . 15
Quality information . . . . . . . . . . . . . . . . . . . . . 15
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
WLCSP4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
SOT753 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Soldering of SMD packages . . . . . . . . . . . . . . 22
Introduction to soldering . . . . . . . . . . . . . . . . . 22
Wave and reflow soldering . . . . . . . . . . . . . . . 22
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 27
18
19
Contact information . . . . . . . . . . . . . . . . . . . . 27
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 5 October 2012
Document identifier: LD6836_SER
Similar pages