Top View Features Directly mounts to target PCB (needs tooling A holes) with hardware 30.23mm [1.190"] Minimum real estate required Compression plate distributes forces evenly Clamshell lid A 10 25.48mm [1.003"] Materials: Side View (Section AA) 4 1 1 Clam Shell Lid: Black anodized Aluminum. Height = 16.5 mm. 2 Socket Base: Black anodized Aluminum. Height = 6 mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 8.5 mm. 4 Compression Screw: Clear anodized Aluminum. Height = 25 mm, Fluted Knob 5 IC Guide: Torlon 6 Socket Base Screw: Socket Head Cap Screw, alloy steel with black oxide finish, 0-80 Thread, 3/8" long. 7 Customer's QFN IC 8 Elastomer Guide: Non-clad FR4. Thickness = 0.475mm. 9 Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. 10 Latch: Black anodised Aluminum. 34.5mm + IC thickness 3 10 2 5 8 Customer's PCB 11 11 7 9 Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. 6 CG-QFN-7002 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev:B Drawing: M.A. Fedde Date: 11/2/09 File: CG-QFN-7002 Dwg.mcd Modified: 05/07/14, DH All Tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View Orientation Mark 1.250mm±0.125mm (x4) C* e typ. 1.25mm±0.13mm (x4) B 15.225mm±0.125mm sqr. Socket size Z2 max *Note: MLF pattern is not symmetrical with respect to the mounting holes. It is offset 0.25mm to the right of center. 2.54mm +0.025mm (x2) - 0.025mm Non plated alignment hole Ø 0.850mm A2 max Y x X mm 5.08mm pad (x N) +0.050mm (x4) - 0.050mm Non plated mounting hole Ø 1.610mm A1 max Z1 max 12.725mm±0.125mm (x4) **** To effectively conduct heat away from the package a thermal pad is recommended with vias spaced 1.0 to 1.2 mm pitch and a diameter of 0.3 to 0.33 mm. Ideally 1 via for every 3 leads has been shown to work well. Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask CG-QFN-7002 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com All dimensions are in mm unless stated otherwise Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 3:1 Rev:B Drawing: M.A. Fedde Date: 11/2/09 File: CG-QFN-7002 Dwg.mcd Modified: 05/07/14, DH Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. PAGE 2 of 3 MLF60A MLF64A MLF48A MLF44C MLF24D MLF36B 2.97 2.72 2.81 3.18 3.2 3.2 1.68 1.68 1.45 1.68 1.68 1.68 9.36 9.36 9.82 9.36 9.36 9.36 A1max 7.45 7.78 7.6 6.87 7.11 6.82 Z2max 9.36 9.36 9.82 9.36 9.36 9.36 A2 max 7.45 e 0.4 X 0.25 Y 0.96 N 76 7.78 7.6 6.87 7.11 6.82 0.5 0.5 0.65 0.65 1.27 0.8 0.28 0.28 0.45 0.37 0.76 0.42 0.69 1.06 1.06 1.06 1.06 60 64 48 44 24 36 D max 9.15 9.15 9.15 9.10 9.15 9.15 9.15 E min 8.85 8.85 8.85 8.90 8.85 8.85 8.85 E max 9.15 9.15 9.15 9.10 9.15 9.15 9.15 4 9 . 0 Z1max 9.36 8 2 . 7 B 1.68 6 3 . 9 C 2.89 8 2 . 7 Package Code MLF76A Thermal Pad Recommendations 6.84 x 6.84 7.08 x 7.08 7.58 x 7.58 7.5 x 7.5 6.84 x 6.84 5.5 x 5.5 6.84 x 6.84 All dimensions are in mm. Package Code MLF76A MLF60A MLF64A MLF48A MLF44C MLF24D MLF36B D D2 L D2 e 0.4 0.5 0.5 0.65 0.65 0.65 0.8 D min 8.85 8.85 8.85 8.90 8.85 8.85 8.85 b min 0.15 0.18 0.18 0.35 0.23 0.55 0.28 b max 0.25 0.3 0.3 0.45 0.35 0.65 0.4 L min 0.4 0.5 0.3 0.35 0.5 0.6 0.5 L max 0.6 0.75 0.5 0.45 0.75 0.8 0.75 D2 5.45 7.18 7.68 7.50 6.94 5.5 6.94 N 76 60 64 48 44 24 36 b E e L D CG-QFN-7002 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev:B Drawing: M.A. Fedde Date: 11/2/09 File: CG-QFN-7002 Dwg.mcd Modified: 05/07/14, DH PAGE 3 of 3