MA-COM MADP-000208 Surmount tm 8ï m pin diode pair Datasheet

MADP-000208-13180W
SURMOUNT TM 8m PIN Diode Pair
RoHS Compliant
Rev. V2
Outline Drawing
Features
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M/A-COM Products
Surface Mount Device
8 µm I-Region Length Devices
Two PIN diodes in Flexible Configuration
No Wire bonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
Description
The MADP-000208-13180W is a pair of silicon
glass PIN diodes incorporated onto one chip and
is fabricated using M/A-COM Technology Solutions
patented HMICTM process. The device features
three silicon pedestals embedded in low loss, low
dispersion glass (k=4.1, Tanδ=0.002). The diodes
are formed on the top of pedestals and connections
to the backside of the device are made via electrically conductive sidewalls. Selective backside
metallization is applied to produce a surface mount
device. This vertical topology provides for exceptional heat transfer and also allows the topside to be
fully encapsulated with silicon nitride. An additional
polymer layer is also added to provide scratch and
impact protection. These protective coatings prevent damage to the junction and the anode airbridge during handling and assembly.
Bottom Side Contacts (Circuit Side)
Dim.
Inches
Millimeter
min
max
min
max
A
0.0440
0.0460
1.118
1.168
Applications
B
0.0140
0.0160
0.355
0.406
The MADP-000208-13180W packageless devices
are suitable for usage in high incident power, 44.8
dBm C.W at 2 GHz., series, shunt, or series-shunt
switches. The low parasitic inductance, < 0.12
nH, and excellent RC constant, make these devices an attractive alternative for high frequency
switch elements when compared to their plastic
device counterparts.
C
0.0045
0.0055
0.114
0.140
D
0.0115
0.0125
0.292
0.318
E
0.0055
0.0065
0.140
0.165
F
0.0055
0.0065
0.140
0.165
G
0.0115
0.0125
0.292
0.318
Ordering Information
Part Number
Package
MADP-000208-13180W
200 pieces per tray
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADP-000208-13180W
SURMOUNT TM 8m PIN Diode Pair
RoHS Compliant
M/A-COM Products
Rev. V2
Electrical Specifications1,2,3: TA = +25°C
D1 - J1 to J3 & D2 - J3 to J4
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Capacitance (CT)4
-10 V, 1 MHz
pF
—
0.81
0.90
Resistance (RS)
+10 mA, 1 GHz
+100 mA, 1 GHz
Ω
—
—
0.40
0.30
0.62
0.52
Forward Voltage (VF)4
+5 mA
+100 mA
V
—
—
0.78
1.00
0.90
1.1
Reverse Leakage Current (IR)4
| -90V |
µA
—
—
10
°C/W
—
58
—
µS
—
0.5
—
C.W. Thermal Resistance (RθJL)
Lifetime (TL)
1.
2.
3.
4.
+10 mA / -6 mA ( 50% - 90% V )
Total capacitance (CT), is equivalent to the sum of Junction Capacitance (CJ) and Parasitic Capacitance (CPAR)
Series resistance (RS) is equivalent to the total diode resistance: RS = RJ (Junction Resistance) + RC (Ohmic Resistance)
RS is measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package using Sn60/Pb40 solder.
On wafer measurement.
Application Schematic
Absolute Maximum Ratings
Parameter
Absolute Maximum
Forward Current
500 mA
Reverse Voltage
- 90 V
Operating Temperature
-55 °C to +125°C
Storage Temperature
-55 °C to +150°C
Junction Temperature
+175°C
C.W. Incident Power
44.8 dBm @ 2 GHz
Mounting Temperature
for RoHS Solders
+260 °C for 10 seconds
D2
J4
D1
J3
J1
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADP-000208-13180W
SURMOUNT TM 8m PIN Diode Pair
RoHS Compliant
M/A-COM Products
Rev. V2
Typical Performance Curves @ 25°C
Resistance vs. Frequency @ 5, 10 & 20 mA
Resistance vs. Forward Current @ 30, 500, 1000 MHz
0.7
0.8
0.7
5 mA
10 mA
20 mA
0.6
30 MHz
500 MHz
1000 MHz
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.0
0.5
1.0
1.5
2.0
0.2
0.0
20.0
Capacitance vs. Frequency @ 10 & 40 V
0.90
0.85
0.85
0.80
0.80
0.70
0.0
10 Volts
40 Volts
0.2
0.4
0.6
0.8
1.0
1.2
60.0
80.0
100.0
Capacitance vs. Voltage @ 30, 500, 1000 MHz
0.90
0.75
40.0
Current (mA)
Frequency (GHz)
1.4
0.75
1.6
1.8
0.70
30 MHz
500 MHz
1000 MHz
0
8
16
24
32
40
Voltage (V)
Frequency (GHz)
Series Inductance vs. Frequency @ 5, 10 & 20 mA
Series Inductance vs. Forward Current @ 500 & 1000 MHz
0.12
0.12
0.10
0.11
0.08
0.10
0.06
5 mA
10 mA
20 mA
0.04
500 MHz
1000 MHz
0.09
0.02
0.00
0.0
3
0.08
0.2
0.4
0.6
0.8
1.0
1.2
Frequency (GHz)
1.4
1.6
1.8
0
20
40
60
80
100
I (mA)
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADP-000208-13180W
SURMOUNT TM 8m PIN Diode Pair
RoHS Compliant
M/A-COM Products
Rev. V2
Die Handling and Mounting Information
Handling: All semiconductor chips should be handled with care to avoid damage or contamination
from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickups is
strongly recommended for individual components. Bulk handling should ensure that abrasion and
mechanical shock are minimized.
Electro-Static Sensitivity: The MADP-000208-13108W Diode Pair are ESD, Class 1A sensitive
(HBM). Proper ESD precautions should be taken.
Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform, RoHS
compliant solders or electrically conductive silver epoxy. The metal RF and D.C. ground plane
mounting surface must be free of contamination and should have a surface flatness of < ±0.002”.
Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is
recommended. When hot forming gas is applied, the temperature should be approximately 290oC.
The chip should not be exposed to temperatures greater than 320oC for more than 10 seconds.
Eutectic Die Attachment Using Reflow Oven: Please visit the www.macomtech.com and see
Application Note M538, “Surface Mounting Instructions” for the recommended time-temperature
profile.
Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive,
silver epoxy, approximately 1–2 mils in thickness, should be used to minimize ohmic and thermal
resistance. A thin epoxy fillet should be visible around the perimeter of the bond pad after placement
to ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically 150°C
for 1 hour.
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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