Rohm BU4930FVE-TR Low voltage standard cmos voltage detector ic Datasheet

Datasheet
Voltage Detector IC Series
Low Voltage Standard
CMOS Voltage Detector ICs
BU48xx series
BU49xx series
●General Description
ROHM standard CMOS reset IC series is a high-accuracy,
low current consumption reset IC series. The lineup was
established with two output types (Nch open drain and
CMOS output) and detection voltage range from 0.9V to
4.8V in increments of 0.1V, so that the series may be
selected according to the application at hand.
●Features
Ultra-low current consumption
High accuracy detection, Ultra-low voltage detection
Two output types (Nch open drain and CMOS output)
Wide operating temperature range
Very small and low height package
Package SSOP5 and SOP4 is similar to SOT-23-5 and
SC-82 respectively (JEDEC)
●Key Specifications
Detection voltage:
0.9V to 4.8V
0.1V steps
±1.0%
0.55µA (Typ.)
-40°C to +125°C
High accuracy detection voltage:
Ultra-low current consumption:
Operating temperature range:
●Package
SSOP5
2.90mm x 2.80mm x 1.25mm
SOP4
2.00mm x 2.10mm x 0.95mm
VSOF5
1.60mm x 1.60mm x 0.60mm
SOT89-3F
4.50mm x 4.15mm x 1.50mm
●Applications
All electronic devices that use micro controllers and logic
circuits
●Typical Application Circuit
VDD1
VDD2
VDD1
RL
RST
BU48xx
CIN
CIN
CL
Micro
controller
CL
(Capacitor for
noise filtering)
(Capacitor for
noise filtering)
GND
(Open Drain Output type)
BU48xx series
RST
BU49xx
Micro
controller
GND
(CMOS Output type)
BU49xx series
○Product structure:Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
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TSZ22111・14・001
BU48xx series
Datasheet
BU49xx series
●Connection Diagram & Pin Descriptions
SSOP5
TOP VIEW
N.C.
SOP4
TOP VIEW
N.C.
VOUT
PIN
No.
1
2
3
4
5
Function
VOUT
VDD
GND
N.C.
Reset output
Power supply voltage
GND
Unconnected terminal
N.C.
Unconnected terminal
VSOF5
TOP VIEW
Lot. No
1
VOUT
VDD GND
Symbol
N.C.
3
Marking
Lot. No
Marking
GND
4
PIN
No.
1
2
3
4
Symbol
VOUT
VDD
N.C.
GND
2
VDD
Function
Reset output
Power supply voltage
Unconnected terminal
GND
SOT89-3F
TOP VIEW
GND VDD
4
5
Marking
Lot.No
Marking
1 2 3
VOUT SUB N.C
PIN
No.
1
2
3
4
5
Lot. No
Symbol
Function
VOUT
SUB
N.C.
VDD
GND
Reset output
Substrate*
Unconnected terminal
Power supply voltage
GND
1
2
3
VOUT VDD GND
PIN
No.
1
2
3
Symbol
VOUT
VDD
GND
Function
Reset output
Power supply voltage
GND
*Connect the substrate to VDD
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BU48xx series
Datasheet
BU49xx series
●Ordering Information
B
U
x
Part
Number
x
Output Type
48 : Open Drain
49 : CMOS
x
x
x
Reset Voltage Value
09 : 0.9V
0.1V step
48 : 4.8V
-
Package
G
: SSOP5
F
: SOP4
FVE : VSOF5
FP3 : SOT89-3F
T
R
Packaging and
forming specification
TR : Embossed tape
and reel
SSOP5
5
<Tape and Reel information>
+6 °
4° −4°
2.9±0.2
1
2
0.2Min.
2.8±0.2
+0.2
1.6 −0.1
4
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.42 −0.04
0.05±0.05
1.1±0.05
1.25Max.
+0.05
0.13 −0.03
0.95
0.1
Direction of feed
SOP4
∗ Order quantity needs to be multiple of the minimum quantity.
Reel
(Unit : mm)
VSOF5
0.9±0.05
1.6 ± 0.05
1
2
0.05
4
5
1.2 ± 0.05
3
0.27±0.15
4
+0.05
0.13 –0.03
(MAX 1.28 include BURR)
+0.2
1.25 –0.1
+6°
4° –4°
1.3
0.2MAX
1.6±0.05
1.0±0.05
2.0±0.2
2.1±0.2
2
1
3
S
0.13±0.05
0.1
0.6MAX
+0.05
0.42 –0.04
0.05±0.05
1.05Max.
)
S
+0.05
0.32 –0.04
0.5
(Unit : mm)
0.22±0.05
(Unit : mm)
SOT89-3F
0.61
1.045±0.155
2.5±0.1
4.15±0.1
4.5±0.1
1
2
3
S
1.6MAX
0.42±0.02
1.50
0.425±0.045
0.505±0.045
(Unit : mm)
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BU48xx series
Datasheet
BU49xx series
●Lineup
Output Type
Open Drain
Detection Voltage Marking
Part Number
CMOS
Marking
Part Number
4.8V
JR
BU4848
LH
BU4948
4.7V
JQ
BU4847
LG
BU4947
4.6V
JP
BU4846
LF
BU4946
4.5V
JN
BU4845
LE
BU4945
4.4V
JM
BU4844
LD
BU4944
4.3V
JL
BU4843
LC
BU4943
4.2V
JK
BU4842
LB
BU4942
4.1V
JJ
BU4841
LA
BU4941
4.0V
JH
BU4840
KZ
BU4940
3.9V
JG
BU4839
KY
BU4939
3.8V
JF
BU4838
KX
BU4938
3.7V
JE
BU4837
KW
BU4937
3.6V
JD
BU4836
KV
BU4936
3.5V
JC
BU4835
KU
BU4935
3.4V
JB
BU4834
KT
BU4934
3.3V
JA
BU4833
KS
BU4933
3.2V
HZ
BU4832
KR
BU4932
3.1V
HY
BU4831
KQ
BU4931
3.0V
HX
BU4830
KP
BU4930
2.9V
HW
BU4829
KN
BU4929
2.8V
HV
BU4828
KM
BU4928
2.7V
HU
BU4827
KL
BU4927
2.6V
HT
BU4826
KK
BU4926
2.5V
HS
BU4825
KJ
BU4925
2.4V
HR
BU4824
KH
BU4924
2.3V
HQ
BU4823
KG
BU4923
2.2V
HP
BU4822
KF
BU4922
2.1V
HN
BU4821
KE
BU4921
2.0V
HM
BU4820
KD
BU4920
1.9V
HL
BU4819
KC
BU4919
1.8V
HK
BU4818
KB
BU4918
1.7V
HJ
BU4817
KA
BU4917
1.6V
HH
BU4816
JZ
BU4916
1.5V
HG
BU4815
JY
BU4915
1.4V
HF
BU4814
JX
BU4914
1.3V
HE
BU4813
JW
BU4913
1.2V
HD
BU4812
JV
BU4912
1.1V
HC
BU4811
JU
BU4911
1.0V
HB
BU4810
JT
BU4910
0.9V
HA
BU4809
JS
BU4909
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BU48xx series
Datasheet
BU49xx series
●Absolute Maximum Ratings
Parameter
Symbol
Limits
Unit
Power Supply Voltage
VDD
-0.3 to +7
V
Nch Open Drain Output
GND-0.3 to +7
Output Voltage
VOUT
V
CMOS Output
GND-0.3 to VDD+0.3
Output Current
Io
70
mA
*1*4
SSOP5
540
Power
*2*4
SOP4
Pd
400
mW
Dissipation
*3*4
VSOF5
210
Operation Temperature Range
Topt
-40 to +125
°C
Ambient Storage Temperature
Tstg
-55 to +125
℃
*1 When used at temperatures higher than Ta=25℃, the power is reduced by 5.4mW per 1℃ above 25℃.
*2 When used at temperatures higher than Ta=25℃, the power is reduced by 4.0mW per 1℃ above 25℃.
*3 When used at temperatures higher than Ta=25℃, the power is reduced by 2.1mW per 1℃ above 25℃.
*4 When a ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board)is mounted.
●Electrical Characteristics
Parameter
Symbol
Condition
VDD=HL , Ta=25℃,RL=470kΩ
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
VDET=1.8V
VDET=2.5V
Detection Voltage
Detection Voltage
Temperature Coefficient
Hysteresis Voltage
VDET=3.0V
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
VDET=3.3V
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
VDET=4.2V
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
VDET
VDET/∆T Ta=-40℃ to 125℃
∆VDET
*1
VDD=LHL
Ta=-40℃ to 125℃
RL=470kΩ
VDET≤1.0V
VDET≥1.1V
Min.
VDET(T)
×0.99
1.782
1.741
1.718
2.475
2.418
2.386
2.970
2.901
2.864
3.267
3.191
3.150
4.158
4.061
4.009
Limits
Typ.
Unit
1.8
2.5
3.0
3.3
4.2
-
Max.
VDET(T)
×1.01
1.818
1.860
1.883
2.525
2.584
2.615
3.030
3.100
3.139
3.333
3.410
3.452
4.242
4.341
4.394
-
±30
-
ppm/℃
VDET
×0.03
VDET
×0.03
VDET
×0.05
VDET
×0.05
VDET
×0.08
VDET
×0.07
V
VDET(T)
V
*1 Guaranteed by design.(Outgoing inspection is not done on all products.)
VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
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Datasheet
BU49xx series
Unless Otherwise Specified Ta=-25 to 125℃
Parameter
Symbol
Condition
VDET=0.9-1.3V
VDET=1.4-2.1V
VDET=2.2-2.7V
Circuit Current when ON
IDD1
VDD=VDET-0.2V
VDET=2.8-3.3V
VDET=3.4-4.2V
VDET=4.3-4.8V
VDET=0.9-1.3V
VDET=1.4-2.1V
VDET=2.2-2.7V
Circuit Current when OFF
VDD=VDET+2.0V
IDD2
VDET=2.8-3.3V
VDET=3.4-4.2V
VDET=4.3-4.8V
VOL≤0.4V, Ta=25 to 125℃, RL=470kΩ
Operating Voltage Range
VOPL
VOL≤0.4V, Ta=-40 to 25℃, RL=470kΩ
VDD=0.85V, ISINK = 20 µA
‘Low’ Output Voltage (Nch)
VDD=1.5V, ISINK = 1 mA, VDET=1.7-4.8V
VOL
VDD=2.4V, ISINK = 4 mA, VDET=2.7-4.8V
VDD=4.8V,ISOURCE=1.7mA,
VDET=0.9V to 3.9V
‘High’ Output Voltage (Pch)
VOH
(only BU49xx)
VDD=6.0V,ISOURCE=2.0mA,
VDET=4.0V to 4.8V
VDD=VDS=7V
Output Leak Current when
Ta=-40℃ to 85℃
OFF
Ileak
VDD=VDS=7V
(only BU48xx)
Ta=85℃ to 125℃
* This product is not designed for protection against radioactive rays.
VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Min.
0.70
0.90
-
Limit
Typ.
0.15
0.20
0.25
0.30
0.35
0.40
0.30
0.35
0.40
0.45
0.50
0.55
-
Max.
0.88
1.05
1.23
1.40
1.58
1.75
1.40
1.58
1.75
1.93
2.10
2.28
0.05
0.5
0.5
VDD-0.5
-
-
VDD-0.5
-
-
-
0
0.1
-
0
1
Unit
µA
µA
V
V
V
V
µA
●Block Diagrams
VDD
VDD
VOUT
VOUT
Vref
Vref
GND
GND
Fig.1
BU48xx Series
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BU49xx Series
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BU48xx series
Datasheet
BU49xx series
●Typical Performance Curves
"LOW" OUTPUT CURRENT : IOL [mA]
CIRCUIT CURRENT : IDD [µA]
0.7
【BU4816】
【BU4816F】
【BU4916】
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
1
2
3
4
5
6
7
5
【BU4816】
【BU4816F】
【BU4916】
4
3
2
VDD =1.2V
1
0
0.0
VDD SUPPLY VOLTAGE :VDD [V]
0.5
1.5
2.0
2.5
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.3 Circuit Current
Fig.4 “LOW” Output Current
25
7
20
OUTPUT VOLTAGE: VOUT [V]
:
【BU4916】
【BU4916F】
"HIGH" OUTPUT CURRENT
I OH [mA]
1.0
VDD =6.0V
15
VDD =4.8V
10
5
BU4816F】
【【BU4816】
【BU4916】
6
5
4
3
2
1
0
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
DRAIN-SOURCE VOLTAGE : VDS[V]
VDD SUPPLY VOLTAGE :VDD [V]
Fig.5 “High” Output Current
Fig.6 I/O Characteristics
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BU48xx series
Datasheet
BU49xx series
●Typical Performance Curves – continued
0.8
2.0
【BU4816】
【BU4816F】
【BU4916】
DETECTION VOLTAGE: VDET[V]
OUTPUT VOLTAGE : VOUT [V]
1.0
0.6
0.4
0.2
0.0
0.0
0.5
1.0
1.5
2.0
Low to high(VDET+∆VDET)
1.5
High to low(VDET)
【BU4816】
BU4816F】
【【BU4916】
1.0
-40
2.5
【BU4816】
【BU4816F】
【BU4916】
CIRCUIT CURRENT WHEN OFF : IDD2 [µA]
CIRCUIT CURRENT WHEN ON : IDD1 [µA]
0.5
0.4
0.3
0.2
0.1
40
80
80
120
Fig.8 Detecting Voltage
Release Voltage
Fig.7 Operating Limit Voltage
0
40
TEMPERATURE : Ta[℃]
VDD SUPPLY VOLTAGE : VDD [V]
0.0
-40
0
120
1.0
【BU4816】
【BU4816F】
【BU4916】
0.8
0.6
0.4
0.2
0.0
-40
0
40
80
120
TEMPERATURE : Ta[℃]
TEMPERATURE : Ta[℃]
Fig.10 Circuit Current when OFF
Fig.9 Circuit Current when ON
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BU48xx series
Datasheet
BU49xx series
●Typical Performance Curves – continued
MINIMUM OPERATING VOLTAGE
: V OPL [V]
1.0
【BU4816】
【BU4816F】
【BU4916】
0.8
0.6
0.4
0.2
0.0
-40
0
40
80
120
TEMPERATURE : Ta[℃]
Fig.11 Operating Limit Voltage
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BU48xx series
Datasheet
BU49xx series
●Application Information
Explanation of Operation
For both the open drain type(Fig.12)and the CMOS output type(Fig.13), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BU48xx series uses an open drain output
type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in this
case becomes VDD or the voltage of the other power supply].
VDD
VDD
VDD
R1
R1
RL
Vref
Q2
Vref
RESET
R2
R2
VOUT
VOUT
Q1
R3
R3
RESET
Q1
GND
GND
Fig.12 (BU48xx type internal block diagram)
Fig.13 (BU49xx type internal block diagram)
Reference Data
Examples of Output rising value(tPLH)and Output falling value(tPHL)
Part Number
tPLH[µs]
BU4845
23.3
BU4945
3.5
tPHL[µs]
275.9
354.3
VDD=4.3V5.1V
VDD=5.1V4.3V
* This data is for reference only.
This figure will vary with the application, so please confirm actual operation conditions before use.
Timing Waveforms
Example:The following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in
Fig.12 and 13).
①When the power supply is turned on, the output is unsettled
from after over the operating limit voltage (VOPL) until tPHL.
Therefore it is possible that the reset signal is not outputted
VDD
when the rise time of VDD is faster than tPHL.
VDET+ΔVDET
⑤
②When VDD is greater than VOPL but less than the reset release
VDET
voltage (VDET + VDET), output (VOUT) voltages will switch to L.
VOPL
③If VDD exceeds the reset release voltage (VDET + VDET), then
0V
VOUT switches from L to H (with a delay of tPLH).
④If VDD drops below the detection voltage (VDET) when the
VOUT
power supply is powered down or when there is a power
VOH
supply fluctuation, VOUT switches to L (with a delay of tPHL).
tPLH
tPHL
tPLH
⑤The potential deference between the detection voltage and the
release voltage is known as the hysteresis width (VDET). The
tPHL
VOL
system is designed such that the output does not flip-flop with
power supply fluctuations within this hysteresis width,
①
③
④
②
preventing malfunctions due to noise.
Fig.14
Timing Waveforms
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BU48xx series
Datasheet
BU49xx series
●Circuit Applications
1) Examples of a common power supply detection reset circuit
VDD1
VDD2
RL
RST
BU48xx
Micro
controller
CIN
CL
(Capacitor for
noise filtering)
GND
Application examples of BU48xx series
(Open Drain output type) and BU49xx series
(CMOS output type) are shown below.
CASE1:The power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection (V DD1).
Use the Open Drain Output Type (BU48xx series).
Attach a load resistance (RL) between the output and
VDD2. (As shown Fig.15)
Fig.15 Open Drain Output type
VDD1
Micro
RST controller
BU49xx
CASE2:The power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use CMOS output type (BU43xx series) or Open Drain
Output Type (BU48xx series). Attach a load
resistance (RL) between the output and VDD1.
(As shown Fig.16)
When a capacitance CL for noise filtering for setting the
output delay time is connected to the VOUT pin (the reset
signal input terminal of the microcontroller), please take
into account the waveform of the rise and fall of the output
voltage (VOUT).
CIN
CL
(Capacitor for
noise filtering)
GND
Fig.16 CMOS Output type
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
VDD1
VDD2
VDD3
RL
BU48Exxx
NO.1
BU48xx
NO.2
RST
microcontroller
CT
CT
GND
Fig.17
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BU48xx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller
(VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.
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BU48xx series
Datasheet
BU49xx series
3) Examples of the power supply with resistor dividers
In applications where the power supply input terminal (VDD) of an IC is connected through resistor
dividers, it is possible that a through current will momentarily flow into the circuit when the output logic
switches, resulting in malfunctions (such as output oscillatory state).
(Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when
the output level switches from “High” to “Low” or vice versa.)
V1
IDD
R2
I1
R1
Through
Current
VDD
BU48xx
BU49xx
CIN
VOUT
CL
GND
VDD
VDET
0
Fig.18
A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and
the input voltage to descends, when the output switches from “Low” to “High”. When the input voltage
decreases and falls below the detection voltage, the output voltage switches from “High” to “Low”. At this
time, the through-current stops flowing through output “Low”, and the voltage drop is eliminated. As a
result, the output switches from “Low” to “High”, which again causes the through current to flow and the
voltage drop. This process is repeated, resulting in oscillation.
Consider the use of BD48xx when the power supply input it with resistor dividers.
VDD - IDD Peak Current Ta=25°C
Tem p - ID D (B U 42xx)
V D D 3V
V D D 6V
V D D 7V
V D D 4V
BU49xx,BU43xx
10
2.5
BU48xx,BU42xx
BD52xx
IDD peak Current[mA]
BD53xx
IDD-peak[mA]
1
0.1
0.01
2.0
1.5
1.0
0.5
0.0
0.001
3
4
5
6
7
8
9
10
-50 -30 -10
10
VDD[V]
Fig.19
30 50
Tem p
70
90
110 130
Current Consumption vs. Power Supply Voltage
* This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
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BU48xx series
Datasheet
BU49xx series
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2)
Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3)
Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4)
Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5)
Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6)
Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7)
The VDD line impedance might cause oscillation because of the detection current.
8)
A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9)
Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) External parameters
The case of needless “Delay Time”, recommended to insert more 470kΩ resister between VDD and CT. The
recommended value of RL Resistor is over 10kΩ to 1MΩ for VDET=1.5V to 4.8V, and over 100kΩ to 1MΩ for VDET=0.9V
to 1.4V. The recommended value of CT Capacitor is over 100pF to 0.1µF. There are many factors (board layout, etc)
that can affect characteristics. Please verify and confirm using practical applications.
11) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
12) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
14) CT pin discharge
Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input
pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.
15) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is
assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD
terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the
pull up resistor should be less than 1/10 of the assumed leak resistance. The value of Rct depends on the external
resistor that is connected to CT terminal, so please consider the delay time that is decided by t × RCT × CCT changes.
.
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TSZ02201-0R7R0G300060-1-2
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Datasheet
Notice
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1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
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(Note 1)
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intend to use our Products in devices requiring extremely high reliability (such as medical equipment
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Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
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Applications.
(Note1) Medical Equipment Classification of the Specific Applications
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5.
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6.
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confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
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8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
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Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
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Precaution for Electrostatic
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1.
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[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
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3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
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4.
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Notice - GE
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Datasheet
General Precaution
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ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
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3.
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