Release by PARA LIGHT DCC PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 http://www.para.com.tw E-mail: [email protected] DATA SHEET PART NO.: L-T670TBCT REV: A / 0 CUSTOMER’S APPROVAL : _______________ DCC : ____________ DRAWING NO. : DS-7A-10-0006 DATE : 2010-12-13 PAGE 1 of 15 PARA-FOR-065 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT REV: A / 0 l Features Û Û Û Û Û Û l Top view, Wide view angle, Blue color PLCC 2 package SMD LED . EIA STD package, packing in 8mm tape on 7" diameter reels (ANSI/EIA-481-B-2001). Compatible with automatic Pick & Place equipment. Compatible with IR Reflow soldering and TTW soldering. Pb free product and acceptable lead-free process. Meet RoHS Green Product. Application Û Û Backlighting (Switches, keys, displays, illuminated advertising) Emergency lighting / Signal and symbol luminaries. l Package Outline Dimensions SIDE VIEW TOP VIEW 3.50 2.80 2.70 0.15 c 0.80 2.40 3.20 POLARITY + - BACK VIEW 0.80 2.18 1.90 FRONT VIEW 0.75 0.75 Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.10mm (.004") unless otherwise noted. DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 DATE : 2010-12-13 PAGE 2 of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT REV: A / 0 l CHIP MATERIALS Û Û Û Dice Material : InGaN Light Color : Blue Lens Color : Water Clear l Absolute Maximum Ratings(Ta=25℃) Symbol Parameter Rating Unit PD Power Dissipation 55 mW IPF Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) 100 mA IF Continuous Forward Current 20 mA VR Reverse Voltage 5 V 2000 V Note A ESD Electrostatic Discharge Threshold(HBM) Topr Operating Temperature Range -40 ~ + 85 ℃ Tstg Storage Temperature Range -40 ~ + 85 ℃ Tsld Soldering Temperature (One times MAX.) Reflow Soldering:260℃ (for 10seconds) Hand Soldering:350℃ (for 3 seconds) Note A : HBM : Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD. l Electro-Optical Characteristics (Ta=25℃) Parameter Luminous Intensity Symbol Min. Typ. IV 28 Max. Unit Test Condition 40 mcd IF=5mA Viewing Angle 2θ1/2 120 Deg Peak Emission Wavelength λp 460 nm Measurement @Peak Dominant Wavelength lD 465 nm IF=5mA Spectrum Radiation Bandwidth Δl 25 nm IF=5mA Forward Voltage VF 3.0 V IF=5mA DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 3.6 DATE : 2010-12-13 PAGE 3 of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT REV: A / 0 Notes: 1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Caution in ESD : Static Electricity and surge damages the LED. It is recommended use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact Array Spectrometer and “KEITHLEY” Source Meter Model : 2400. l Typical Electro-Optical Characteristics Curves Fig.1 Relative Intensity vs. Wavelength DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 DATE : 2010-12-13 PAGE 4 of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT REV: A / 0 l Typical Electro-Optical Characteristics Curves Luminous lntensity(mcd) (25℃ Ambient Temperature Unless Otherwise Noted) Fig.2 Forward Current vs.Forward Voltage Fig.3 Luminous Intensity vs.Forward Current Relative luminous intensity(%) Relative Luminous lntensity Normalized of 5mA 1000 100 10 1 -60 - 40 -20 -0 20 40 60 80 100 Ambient Temperature Ta( ℃ ) Fig.4 Relative Luminous Intensity vs.Forward Current Fig.5 Luminous Intensity vs.Ambient Temperature 0° Forward Current IF(mA) 25 10° 20° 30° 20 15 40° 1.0 0.9 10 7.5 5 50° 0.8 0.7 0 20 40 60 80 100 0.5 0.3 0.1 0.2 0.4 0.6 60° 70° 80° 90° Ambient Temperature Ta( ℃ ) Fig.6 Forward Current Derating Curve DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 Fig.7 Relative Intensity vs.Angle DATE : 2010-12-13 PAGE 5 of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT REV: A / 0 l Bin Code List Luminous Intensity(IV), Unit:mcd@5mA Bin Code Min Max N 28 45 P 45 71 Forward Voltage(VF), Unit:V@5mA Bin Code Tolerance of each bin are±10% Min Max 14 2.9 3.0 15 3.0 3.1 16 3.1 3.2 17 3.2 3.3 18 3.3 3.4 19 3.4 3.5 20 3.5 3.6 Tolerance of each bin are±0.1Volt Dominant Wavelength (Hue),Unit: nm@5mA Bin Code Min Max AB 460 465 AC 465 470 Tolerance of each bin are±1nm DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 DATE : 2010-12-13 PAGE 6 of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT REV: A / 0 l Label Explanation L-L-T670TBCT CUS. PART NO: To be denominated. CUSTOMER: To be denominated. PART NO: Refer to P15 P16--- Luminous Intensity Code 16--- Forward Voltage Code AC--- Dominant Wavelength LOT NO: E L S 7 8 0001 A B C D E F A---E: For series number B---L: Local F: Foreign C---S: SMD D---Year E---Month F---SPEC. PACKING QUANTITY OF BAG : 2000pcs for T670 series 2000pcs for T650 series 2000pcs for S020 series DATE CODE：2007 G G--- Year H--- Month I --- Day 08 H 29 I DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 DATE : 2010-12-13 PAGE 7 of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT REV: A / 0 l Reel Dimensions Notes: 1. Taping Quantity : 2000pcs 2. The tolerances unless noted is±0.1mm, Angle±0.5°, Unit: mm. l Suggest Soldering Pad Dimensions 1.6 2.2 1.8 DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 DATE : 2010-12-13 PAGE 8 of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT REV: A / 0 1.75±0.10 (.069±.004) l Package Dimensions Of Tape And Reel 2.00±0.05 (.079±.002) 4.00±0.10 (.157±.004) *2.03+0.10 (.080+.004) 3.50±0.05 (.138±.002) *8.00+0.30 -0.10 ( 0.315+.012 -.004 5° *3.66±.10 (.144±.004) ) *0.23± 0.03 (.009± .001) 4.00±0.10 (.157±.004) Notes: All dimensions are in millimeters. l Packaging Of Electronic Components On Continuous Tapes DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 DATE : 2010-12-13 PAGE 9 of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT Moisture Resistant Packaging Label H:\S M D\SM D\S M D° ü × ° \± ê ? ? .jpg H:\S MD\ SM D\S MD° ü × ° \± ê ? ? .jpg H:\S MD\ SM D\SM D° ü× ê ° \± ? ? .jpg l REV: A / 0 Reel Label Desiccant Aluminum moistue-proof bag 240 H:\S M D\S M D\S MD ° \± ê °ü × pg ? ? j. 145 210 5 25 Label Box 435 Carton Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm. l Cleaning Û Û Û If cleaning is required , use the following solutions for less than 1 minute and less than 40℃. Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not.) Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be confirm whether any damage to the LEDS will occur. DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 DATE : 2010-12-13 PAGE 10of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT ● REV: A / 0 Suggest Sn/Pb IR Reflow Soldering Profile Condition: ● Suggest Pb-Free IR Reflow Soldering Profile Condition: DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 DATE : 2010-12-13 PAGE 11 of 15 Release Release by by PARA LIGHT DCC PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT REV: A / 0 l CAUTIONS 1. Static Electricity: * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria: (VF>2.0V,at IF=0.5m A ) 2. Storage : * Before opening the package : The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. * After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to reseal the moisture proof bag again. If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should e performed using the following conditions. Baking treatment: more than 24hours at 65±5℃. * Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. 3. Soldering: Do not apply any stress to the LED lens during soldering while the LED is at high temperature. Recommended soldering condition. * Reflow Soldering : Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max. * Soldering Iron : (Not recommended) Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering. DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 DATE : 2010-12-13 PAGE 12 of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT REV: A / 0 4. Lead-Free Soldering For Reflow Soldering : 1、Pre-Heat Temp: 150-180℃,120sec.Max. 2、Soldering Temp: Temperature Of Soldering Pot Over 240℃,40sec.Max. 3、Peak Temperature: 260℃，10sec. 4、Reflow Repetition: 2 Times Max. 5、Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu For Soldering Iron (Not Recommended) : 1、Iron Tip Temp: 350℃ Max. 2、Soldering Iron: 30w Max. 3、Soldering Time: 3 Sec. Max. One Time. 5. Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED. 6. Reliability 1、Criteria For Judging The Damage Item Symbol Test Conditions Forward Voltage VF Reverse Current Luminous Intensity Criteria for Judgement MIN. Max. IF=5mA - U.S.L.*)×1.1 IR VR=5V - U.S.L.*)×2.0 IV IF=5mA L.S.L**)×0.7 - *) U.S.L.: Upper Standard Level **) L.S.L: Lower Standard Level DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 DATE : 2010-12-13 PAGE 13 of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT REV: A /0 2、Test Items And Results Reference Standard Test Item Test Condition Note Tsld=260℃,10sec. (Pre treatment 30 2times ℃,70%,168hrs) JEITA Tsld=215℃,3sec. 1time Solder ability (Reflow Soldering) ED-4701300 303 (Lead Solder) over 95% JEITA -40℃ ~ 100℃ 100cycles Thermal Shock ED-4701300 307 30min. 30min. JEITA -40℃ ~ 25℃~100℃~25℃ Temperature Cycle 100cycles ED-4701100 105 30min. 5min. 30min. 5min JEITA ED-4701200High Temperature Storage Ta=100℃ 1000hrs. 201 JEITA Temperature Humidity Storage Ta=60℃,RH=90% 1000hrs. ED-4701100 103 JEITA Low Temperature Storage Ta=-40℃ 1000hrs. ED-4701200 202 Steady State Operating Life 1000hrs. Ta=25℃,IF=20mA Condition Steady State Operating Life 500hrs. Ta=85℃,IF=5mA of High Temperature Resistance to Soldering Heat JEITA (Reflow Soldering) ED-4701300 301 Number of Damaged 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 Steady State Operating Life of High Humidity Heat Ta=60℃,RH=90%,IF=15mA 500hrs. 0/50 Steady State Operating Life of Low Temperature Ta=-30℃,IF=20mA 500hrs. 0/50 Vibration JEITA ED-4701400 403 100~2000~100HzSweep 4min.200m/s2 3direction,4cycles 48min 0/50 Substrate Bending JEITA ED-4702 3mm,5±1sec 1time 0/50 Stick JEITA ED-4702 5N,10±1sec 1time 0/50 7.Others: The appearance and specifications of the product may be modified for improvement without notice. DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 DATE : 2010-12-13 PAGE 14 of 15 Release by PARA LIGHT DCC SURFACE MOUNT DEVICE LED Part No. : L-T670TBCT l PART NO. SYSTEM : L – T 67 0 X X T - X X X X REV: A / 0 XXXX : Special specification for customer T : Taping for 7 inch reel TC : Taping for 13 inch reel Lens color C : Water Clear W : White Diffused T : Color Transparent D : Color Diffused KY : 9mil AlInGap 590nm Super Yellow KR : 9mil AlInGap 630 nm Super Red TE : 14mil AlInGap 624 nm Super Red TY: 14mil AlInGap590 nm Super Yellow LB : InGaN ITO rough 470nm Blue LG : InGaN ITO rough520nm Green W : InGaN + YAG White color TB：InGaN 465nm Blue 0 : Single chip 1/2 : Super thin single chip 5/6 : Dual chip F : Three chip(Full color) C : PCB Top View Type T :PLCC Top View Type S : Side View Type DRAWING NO. : DS-7A-10-0006 PARA-FOR-068 650 : 670 : 020 : 3020 3528 3812 1.3T TYPE 1.9T TYPE 0.6T TYPE DATE : 2010-12-13 PAGE 15 of 15