Formosa HFM105-MS Smd high effciency rectifier Datasheet

SMD High Effciency Rectifiers
Formosa
MS
HFM101-MS THRU HFM107-MS
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
Issued Date
DS-121311
2012/03/02
Revised Date
-
Revision
A
Page.
7
SMD High Effciency Rectifiers
Formosa
MS
HFM101-MS THRU HFM107-MS
1.0A Surface Mount High
Effciency Rectifiers-50-1000V
Package outline
Features
• Batch process design, excellent power dissipation offers
SOD-123S
better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
optimize board space.
0.154(3.9)
0.138(3.5)
• Tiny plastic SMD package.
• High current capability.
• Ultrafast recovery time for high efficiency.
• High surge current capability.
• Glass passivated chip junction.
• Lead-free parts meet RoHS requirments.
• Suffix "-H" indicates Halogen free parts, ex. HFM101-MS-H.
0.018(0.45) Typ.
0.044(1.1)
0.079(2.0)
0.063(1.6)
0.028(0.7)
0.119(3.0)
0.103(2.6)
Mechanical data
0.009(0.22)
0.007(0.18)
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123S/MINI SMA
• Terminals :Plated terminals, solderable per MIL-STD-750,
0.040(1.00)
0.036(0.90)
0.032 (0.8) Typ.
0.032(0.8) Typ.
Method 2026
Dimensions in inches and (millimeters)
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.0155 gram
Maximum ratings and Electrical Characteristics (AT
PARAMETER
o
T A=25 C unless otherwise noted)
CONDITIONS
Forward rectified current
See Fig.2
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
MAX.
UNIT
IO
1.0
A
I FSM
30
A
Symbol
MIN.
TYP.
O
V R = V RRM T J = 25 C
Reverse current
Diode junction capacitance
f=1MHz and applied 4V DC reverse voltage
Storage temperature
*1
V RRM
(V)
V RMS*2
(V)
*3
VR
(V)
HFM101-MS
50
35
50
HFM102-MS
100
70
100
HFM103-MS
200
140
200
HFM104-MS
400
280
400
HFM105-MS
600
420
600
HFM106-MS
800
560
800
HFM107-MS
1000
700
1000
*4
VF
(V)
Operating
temperature
T J, ( OC)
*5
t rr
(ns)
1.00
μA
150
20
CJ
T STG
SYMBOLS
5.0
IR
O
V R = V RRM T J = 125 C
pF
O
+175
-65
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
50
*3 Continuous reverse voltage
1.30
-55 to +150
*4 Maximum forward voltage@I F=1.0A
1.70
75
*5 Maximum Reverse recovery time, note 1
Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A
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TEL:886-2-22696661
FAX:886-2-22696141
Page 2
Document ID
Issued Date
DS-121311
2012/03/02
Revised Date
-
Revision
A
Page.
7
Rating and characteristic curves (HFM101-MS THRU HFM107-MS)
FIG.2-TYPICAL FORWARD CURRENT
DERATING CURVE
FIG.1-TYPICAL FORWARD
CHARACTERISTICS
M
710
S
S~
S~
H
04
FM
-M
-M
01
5-
M
M1
H
FM
10
HF
M1
1.0
HF
.1
1.2
1.0
0.8
0.6
0.4
0.2
0
0
P.C.B. Mounted on
0.2 " x 0.2 " (5 mm x 5 mm)
Copper Pad Areas
25
50
75
100
125
150
175
LEAD TEMPERATURE (°C)
TJ=25 C
Pulse Width 300us
1% Duty Cycle
.01
.6
.8
1.0
1.2
1.4
1.6
1.8
FORWARD VOLTAGE,(V)
FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE
RECOVERY TIME CHARACTERISTICS
50W
NONINDUCTIVE
10W
NONINDUCTIVE
( )
(+)
D.U.T.
25Vdc
(approx.)
PULSE
GENERATOR
(NOTE 2)
( )
PEAK FORWAARD SURGE CURRENT,(A)
.001
.4
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
50
40
30
8.3ms Single Half
TJ=25 C
Sine Wave
20
JEDEC method
10
0
1
5
(+)
1W
NONINDUCTIVE
50
10
100
NUMBER OF CYCLES AT 60Hz
OSCILLISCOPE
(NOTE 1)
NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.
2. Rise Time= 10ns max., Source Impedance= 50 ohms.
FIG.5-TYPICAL JUNCTION CAPACITANCE
140
trr
JUNCTION CAPACITANCE,(pF)
INSTANTANEOUS FORWARD CURRENT,(A)
HF
S
M1
03
-M
S
AVERAGE FORWARD CURRENT,(A)
10
|
|
|
|
|
|
|
|
+0.5A
0
-0.25A
-1.0A
120
100
80
60
40
20
1cm
SET TIME BASE FOR
50 / 10ns / cm
0
.01
.05
.1
.5
1
5
10
50
100
REVERSE VOLTAGE,(V)
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Page 3
Document ID
Issued Date
DS-121311
2012/03/02
Revised Date
-
Revision
A
Page.
7
SMD High Effciency Rectifiers
Formosa
MS
HFM101-MS THRU HFM107-MS
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Marking
Type number
Marking code
HFM101-MS
HFM102-MS
HFM103-MS
HFM104-MS
HFM105-MS
HFM106-MS
HFM107-MS
H1
H2
H3
H4
H5
H6
H7
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD-123S
0.044 (1.10)
0.040 (1.00)
0.079 (2.00)
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TEL:886-2-22696661
FAX:886-2-22696141
Page 4
Document ID
Issued Date
DS-121311
2012/03/02
Revised Date
-
Revision
A
Page.
7
SMD High Effciency Rectifiers
Formosa
MS
HFM101-MS THRU HFM107-MS
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOD-123S
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.00
3.85
1.10
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
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TEL:886-2-22696661
FAX:886-2-22696141
Page 5
Document ID
Issued Date
DS-121311
2012/03/02
Revised Date
-
Revision
A
Page.
7
SMD High Effciency Rectifiers
Formosa
MS
HFM101-MS THRU HFM107-MS
Reel packing
PACKAGE
SOD-123S
REEL SIZE
7"
COMPONENT
SPACING
REEL
(pcs)
(m/m)
4.0
3,000
BOX
(pcs)
30,000
INNER
BOX
REEL
DIA,
CARTON
SIZE
CARTON
APPROX.
GROSS WEIGHT
(m/m)
(m/m)
(m/m)
(pcs)
(kg)
183*183*123
178
382*262*387
240,000
8.7
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
o
150 C
o
200 C
60~120sec
Tsmax to T L
-Ramp-upRate
o
<3 C /sec
Time maintained above:
-Temperature(T L )
-Time(t L )
o
217 C
60~260sec
o
o
255 C- 0/ + 5 C
Peak Temperature(T P )
o
Time within 5 C of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 C /sec
o
o
Time 25 C to Peak Temperature
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<6minutes
Page 6
Document ID
Issued Date
DS-121311
2012/03/02
Revised Date
-
Revision
A
Page.
7
SMD High Effciency Rectifiers
Formosa
MS
HFM101-MS THRU HFM107-MS
High reliability test capabilities
Item Test
Conditions
Reference
O
MIL-STD-750D
METHOD-2031
O
MIL-STD-202F
METHOD-208
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16" ± 1/32"
2. Solderability
at 245 ± 5 C for 5 sec.
3. High Temperature Reverse Bias
V R=80% rate at T J=150 C for 168 hrs.
4. Forward Operation Life
Rated average rectifier current at T A=25 C for 500hrs.
MIL-STD-750D
METHOD-1038
O
MIL-STD-750D
METHOD-1027
O
O
5. Intermittent Operation Life
6. Pressure Cooker
T A = 25 C, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
JESD22-A102
O
15P SIG at T A=121 C for 4 hrs.
O
MIL-STD-750D
METHOD-1051
O
7. Temperature Cycling
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
8.3ms single half sine-wave , one surge.
9. Humidity
at T A=85 C , RH=85% for 1000hrs.
10. High Temperature Storage Life
at 175 C for 1000 hrs.
MIL-STD-750D
METHOD-4066-2
MIL-STD-750D
METHOD-1021
O
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MIL-STD-750D
METHOD-1031
O
Page 7
Document ID
Issued Date
DS-121311
2012/03/02
Revised Date
-
Revision
A
Page.
7
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