MCP9600
Thermocouple EMF to Temperature Converter,
±1.5 °C Maximum Accuracy
Features
Description
• Thermocouple Electromotive Force (EMF) to °C
Converter
- Integrated Cold-Junction Compensation
• Supported Types (designated by NIST ITS-90):
- Type K, J, T, N, S, E, B and R
• ±1.5°C (Max.) Hot-Junction Accuracy
• Measurement Resolution:
- Hot- and Cold-Junctions: 0.0625°C (typical)
• Four Programmable Temperature Alert Outputs
- Monitor Hot- or Cold-Junction Temperatures
- Detect Rising or Falling Temperatures
- Up to 255°C of Programmable Hysteresis
• Programmable Digital Filter for Temperature
• Low Power:
- Shutdown Mode
- Burst Mode: 1 to 128 Temperature Samples
• 2-Wire Interface: I2C Compatible, 100 kHz
- Supports Eight Devices per I2C bus
• Operating Voltage Range: 2.7V to 5.5V
• Operating Current: 300 µA (typical)
• Shutdown Current: 2 µA (typical)
• Package: 20-lead MQFN
Microchip Technology Inc.’s MCP9600 converts
thermocouple EMF to degree Celsius with integrated
Cold-Junction compensation. This device corrects the
thermocouple nonlinear error characteristics of eight
thermocouple types and outputs ±1.5°C accurate
temperature data for the selected thermocouple. The
correction coefficients are derived from the National
Institute of Standards and Technology (NIST) ITS-90
Thermocouple Database.
Typical Applications
This sensor uses an industry standard 2-Wire, I2C
compatible serial interface and supports up to eight
devices per bus by setting the device address using the
ADDR pin.
GND
VINTypes K, J, T,
N, E, B, S, R
VIN+ 2
ADDR
GND
GND
14 Alert 3
EP
21
GND 3
13 GND
VIN- 4
12 Alert 2
GND 5
11 Alert 1
6
7
8
9 10
GND
ADDR
TC-
15 Alert 4
GND
MCP9600
TC+
GND 1
VDD
VIN+
4
Alert
SCL
20 19 18 17 16
VDD
I2C
MCP9600
5x5 MQFN*
GND
PIC® MCU
Package Type
SDA
Petrochemical Thermal Management
Hand-Held Measurement Equipment
Industrial Equipment Thermal Management
Ovens
Industrial Engine Thermal Monitor
Temperature Detection Racks
The temperature alert limits have multiple user
programmable configurations such as alert polarity as
either an active-low or active-high push-pull output, and
output function as comparator mode (useful for
thermostat-type operation) or interrupt mode for
microprocessor-based systems. In addition, the alerts
can detect either a rising or a falling temperature with
up to 255°C hysteresis.
GND
•
•
•
•
•
•
The MCP9600 digital temperature sensor comes with
user-programmable registers which provide design
flexibility for various temperature sensing applications.
The registers allow user-selectable settings such as
Low-Power modes for battery-powered applications,
adjustable digital filter for fast transient temperatures
and four individually programmable temperature alert
outputs which can be used to detect multiple
temperature zones.
* Includes Exposed Thermal Pad (EP); see Table 3-1.
2015-2016 Microchip Technology Inc.
DS20005426B-page 1
MCP9600
MCP9600 Registers
MCP9600 Evaluation Board (ADM00665)
MCP9600
DS20005426B-page 2
2015-2016 Microchip Technology Inc.
MCP9600
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VDD............................................................................................................................................................................ 6.0V
Voltage at all Input/Output Pins......................................................................................................... GND – 0.3V to 6.0V
Storage Temperature ..............................................................................................................................-65°C to +150°C
Ambient Temperature with Power Applied ..............................................................................................-40°C to +125°C
Junction Temperature (TJ) .................................................................................................................................... +150°C
ESD Protection on all Pins (HBM:MM)........................................................................................................... (4 kV:300V)
Latch-up Current at each Pin ............................................................................................................................. ±100 mA
† Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C
(where: TA = TC, defined as Device Ambient Temperature).
Parameters
Sym.
Min.
Typ.
Max.
Unit
Conditions
-1.5
±0.5
+1.5
°C
TA = 0°C to +85°C,
-3.0
±1
+3.0
°C
TA = -40°C to +125°C
Thermocouple Sensor Measurement Accuracy
TH Hot-Junction Accuracy (VDD = 3.3V)
TH_ACY
TH = TC + T∆
TC Cold-Junction Accuracy (VDD = 3.3V)
TC_ACY
-1.0
±0.5
+1.0
°C
TA = 0°C to +85°C
-2.0
±1
+2.0
°C
TA = -40°C to +125°C
-0.5
±0.25
+0.5
°C
TA = 0°C to +85°C,
VDD = 3.3V (Note 1)
T∆ Junctions Temperature Delta Accuracy
Type K: T∆ = -200°C to +1372°C
VEMF range: -5.907 mV to 54.886 mV
T∆_ACY
Type J: T∆ = -150°C to +1200°C
VEMF range: -3.336 mV to 47.476 mV
Type T: T∆ = -200°C to +400°C
VEMF range: -5.603 mV to 20.81 mV
Type N: T∆ = -150°C to +1300°C
VEMF range: -3.336 mV to 47.476 mV
Type E: T∆ = -200°C to +1000°C
VEMF range: -8.825 mV to 76.298 mV
Type S: T∆ = 250°C to +1664°C
VEMF range: -1.875 mV to 17.529 mV
TA = 0°C to +85°C,
VDD = 3.3V (Note 1, 2)
Type B: T∆ = 1000°C to +1800°C
VEMF range: -4.834 mV to 13.591 mV
Type R: T∆ = 250°C to +1664°C
VEMF range: -1.923 mV to 19.732 mV
Note 1:
2:
3:
The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius conversion Database. T is also defined as the temperature difference
between the Hot and Cold Junctions or temperatures from the NIST ITS-90 database.
The device measures temperature below the specified range, however the sensitivity to changes in temperature
reduces exponentially. Type R and S measure down to -50°C, or -0.226mVEMF and -0.235mVEMF, respectively.
Type B measures down to 500°C or 1.242mVEMF (see Figures 2-7, 2-8, 2-14 and Figures 2-10, 2-11 and 2-17).
Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the
thermocouple input pins. This parameter is characterized but not production tested.
2015-2016 Microchip Technology Inc.
DS20005426B-page 3
MCP9600
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C
(where: TA = TC, defined as Device Ambient Temperature).
Parameters
Sym.
Min.
Typ.
Max.
Unit
Conditions
TC and TH Temperature Resolution
TRES
—
±0.0625
—
°C
With max. Resolution
Sampling Rate (TA = +25°C)
tCONV
—
320
—
ms
18-bit Resolution
—
80
—
ms
16-bit Resolution
—
20
—
ms
14-bit Resolution
Sensor Characteristics
Temperature Calculation Time
—
5
—
ms
12-bit Resolution
tCALC
—
12
—
ms
TA = +25°C
VOERR
—
±2
—
µV
VOERR_DRF
—
50
—
nV/°C
GERR
—
—
±0.04
GERR_DRF
—
±0.01
—
%FS
Thermocouple Input
Offset Error
Offset Error Drift
Full-Scale Gain Error
Full-Scale Gain Error Drift
Full-Scale Integral Nonlinearity
Voltage Resolution
Differential Mode Range
%FS TA = 0°C to +85°C
INL
—
10
—
ppm
VRES
—
2
—
µV
18-bit Resolution
VIN_DF
-250
—
+250
mV
ADC input range
300
—
k
Differential Mode Impedance
ZIN_DF
—
Common-Mode Range
VIN_CM
VDD-0.3
—
VDD+0.3
V
Common-Mode Impedance
ZIN_CM
—
25
—
M
Common-Mode Rejection Ratio
CMRR
—
105
—
dB
Power Supply Rejection Ratio
PSRR
—
60
—
dB
Line Regulation
VLine_R
—
0.2
—
°C/V
Low-Level Voltage
VOL
—
—
0.4
V
IOL= 3 mA
High-Level Voltage
VOH
VDD-0.5
—
—
V
IOH= 3 mA
Operating Voltage
VDD
2.7
—
5.5
V
I2C
IDD
—
0.3
0.5
mA
—
1.5
2.5
mA
(Note 3)
Alert 1, 2, 3, 4 Outputs
Operating Voltage and Current
Inactive Current
I2C Active Current or during tCALC
VDD=3.3V, TA = 85°C
Shutdown Current
ISHDN
—
2
5
µA
I2C Inactive
Power On Reset (POR) Thresholds
VPOR
1.0
2.1
2.6
V
Rising/Falling VDD
tRSP
—
3
—
s
Time to 63%, +25°C
(Air) to +125°C (oil
bath), 2x2 inch PCB
Thermal Response
5x5 mm MQFN Package (Cold-Junction)
Note 1:
2:
3:
The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90
Thermocouple EMF to Degree Celsius conversion Database. T is also defined as the temperature difference
between the Hot and Cold Junctions or temperatures from the NIST ITS-90 database.
The device measures temperature below the specified range, however the sensitivity to changes in temperature
reduces exponentially. Type R and S measure down to -50°C, or -0.226mVEMF and -0.235mVEMF, respectively.
Type B measures down to 500°C or 1.242mVEMF (see Figures 2-7, 2-8, 2-14 and Figures 2-10, 2-11 and 2-17).
Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the
thermocouple input pins. This parameter is characterized but not production tested.
DS20005426B-page 4
2015-2016 Microchip Technology Inc.
MCP9600
INPUT/OUTPUT PIN DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C
(where: TA = TC, defined as Device Ambient Temperature).
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
2
Serial Input/Output and I C Slave Address Input (ADDR)
Input (SCL, SDA)
High-Level Voltage
VIH
0.7VDD
—
—
V
VIL
—
—
0.3VDD
V
ILEAK
—
—
±2
µA
Low-Level Voltage
VOL
—
—
0.4
V
IOL= 3 mA
High-Level Current (leakage)
IOH
—
—
1
µA
VOH = VDD
Low-Level Current
IOL
6
—
—
mA
VOL = 0.6V
CIN
—
5
—
pF
V
Low-Level Voltage
Input Current
Output (SDA)
Capacitance
I2C Slave Address Selection Levels (Note 1)
Command Byte <1100 000x>
VADDR
Command Byte <1100 001x>
Command Byte <1100 010x>
GND
—
—
VADDR_L
(Note 2)
VADDR_TYP
(Note 2)
VADDR_H
(Note 2)
Address = 0
Address = 1
Address = 2
Command Byte <1100 011x>
Address = 3
Command Byte <1100 100x>
Address = 4
Command Byte <1100 101x>
Address = 5
Command Byte <1100 110x>
Address = 6
Command Byte <1100 111x>
Address = 7
—
—
VDD
VHYST
—
0.05VDD
—
V
TSP
—
50
—
ns
SDA and SCLK Inputs
Hysteresis
Spike Suppression
Note 1:
2:
VDD > 2V
The ADDR pin can be tied to VDD or VSS. For additional slave addresses, resistive divider network can be
used to set voltage levels that are rationed to VDD. The device supports up to 8 levels (see Section 6.3.1
“I2C Addressing” for recommended resistor values).
VADDR_TYP = Address*VDD/8 + VDD/16,
VADDR_L = VADDR_TYP - VDD/32, and
VADDR_H = VADDR_TYP + VDD/32 (where: Address = 1, 2, 3, 4, 5, 6).
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Specified Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
JA
—
38.8
—
°C/W
Note 1
Thermal Package Resistances
Thermal Resistance, MQFN
Note 1:
Operation in this range must not cause TJ to exceed the Maximum Junction Temperature (+150°C).
2015-2016 Microchip Technology Inc.
DS20005426B-page 5
MCP9600
SENSOR SERIAL INTERFACE TIMING SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, GND = Ground, TA = -40°C to +125°C, VDD = 2.7V to 5.5V
and CL = 80 pF (Note 1).
Parameters
Sym.
Min.
Max.
Units
fSCL
10
100
kHz
Low Clock (Note 2)
tLOW
4700
—
ns
High Clock
tHIGH
4000
—
ns
2-Wire
I2
C Interface
Serial Port Frequency
Rise Time (Note 3)
tR
—
1000
ns
Fall Time (Note 3)
tF
20
300
ns
Data in Setup Time (Note 2)
tSU:DAT
250
—
ns
Data in Hold Time
tHD:DAT
0
—
ns
Start Condition Setup Time
tSU:STA
4700
—
ns
Start Condition Hold Time
tHD:STA
4000
—
ns
Stop Condition Setup Time
tSU:STO
4000
—
ns
Bus Idle/Free
tB-FREE
10
—
µs
Cb
—
400
pf
tSTRETCH
60
—
µs
Bus Capacitive Load
Clock Stretching
EE
P
TO
-F
R
U
-S
tB
tS
tL
O
H
IG
tH
W
H
C
TR
ET
I
-D
D
tH
tS
U
-D
AT
A
tR
,t
F
SD
A
SC
L
tS
tH
tS
U
-S
TA
R
T
D
-S
TA
R
T
3:
All values referred to VIL MAX and VIH MIN levels.
This device can be used in a Standard-mode I2C-bus system, but the requirement tSU:DAT 250 ns must
be met.
Characterized, but not production tested.
AC
K
Note 1:
2:
Start Condition
FIGURE 1-1:
DS20005426B-page 6
Data Transmission
Stop Condition
Timing Diagram.
2015-2016 Microchip Technology Inc.
MCP9600
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.500
Type K
Type K
Sensitivity (Δ°C/LSb)
0.50
Tǻ_ACY (°C)
0.25
0.00
-0.25
-0.50
-200
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
Sensitivity (Δ°C/LSb)
Type J
0.25
0.00
-0.25
-0.50
-200
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
1800
FIGURE 2-2:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type J.
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
1800
FIGURE 2-4:
Temperature Sensitivity with
18-Bit Resolution, Type K.
0.500
0.50
Tǻ_ACY (°C)
0.000
-200
1800
FIGURE 2-1:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type K.
0.250
Type J
0.250
0.000
-200
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
1800
FIGURE 2-5:
Temperature Sensitivity with
18-Bit Resolution, Type J.
0.500
0.50
Type N
Sensitivity (Δ°C/LSb)
Type N
Tǻ_ACY (°C)
0.25
0.00
-0.25
-0.50
-200
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
1800
FIGURE 2-3:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type N.
2015-2016 Microchip Technology Inc.
0.250
0.000
-200
300
800
1300
1800
Tǻ Temperature, ITS-90 Database (°C)
FIGURE 2-6:
Temperature Sensitivity with
18-Bit Resolution, Type N.
DS20005426B-page 7
MCP9600
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.500
0.50
Sensitivity (Δ°C/LSb)
Type S
0.25
Tǻ_ACY (°C)
Specified Range
0.00
-0.25
Specified Range
0.250
Type S
-0.50
-200
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
1800
FIGURE 2-7:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type S.
1800
0.500
Type R
Specified Range
Tǻ_ACY (°C)
0.25
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
FIGURE 2-10:
Temperature Sensitivity with
18-Bit Resolution, Type S.
Sensitivity (Δ°C/LSb)
0.50
0.000
-200
0.00
-0.25
Specified Range
0.250
Type R
-0.50
-200
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
1800
FIGURE 2-8:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type R.
Type E
Tǻ_ACY (°C)
0.25
0.00
-0.25
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
1800
FIGURE 2-9:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type E.
DS20005426B-page 8
1800
0.500
Type E
-0.50
-200
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
FIGURE 2-11:
Temperature Sensitivity with
18-Bit Resolution, Type R.
Sensitivity (Δ°C/LSb)
0.50
0.000
-200
0.250
0.000
-200
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
1800
FIGURE 2-12:
Temperature Sensitivity with
18-Bit Resolution, Type E.
2015-2016 Microchip Technology Inc.
MCP9600
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.50
0.500
Sensitivity (Δ°C/LSb)
Type T
Tǻ_ACY (°C)
0.25
0.00
-0.25
-0.50
-200
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
0.250
0.000
-200
1800
FIGURE 2-13:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type T.
1800
0.500
Type B
Sensitivity (Δ°C/LSb)
Type B
0.25
Specified Range
Tǻ_ACY (°C)
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
FIGURE 2-16:
Temperature Sensitivity with
18-Bit Resolution, Type T.
0.50
0.00
-0.25
-0.50
-200
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
Specified Range
0.250
0.000
-200
1800
FIGURE 2-14:
Typical Temperature
Accuracy from NIST ITS-90 Database, Type B.
300
800
1300
Tǻ Temperature, ITS-90 Database (°C)
1800
FIGURE 2-17:
Temperature Sensitivity with
18-Bit Resolution, Type B.
10
0.4
Gain Error (% of FSR)
Offset Error (µV)
Type T
5
0
-5
VDD = 3.3V
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-10
-0.4
-40
-20
FIGURE 2-15:
(VIN+, VIN-).
0
20
40
60
Temperature (°C)
80
100
120
Input Offset Error Voltage
2015-2016 Microchip Technology Inc.
-40
-20
FIGURE 2-18:
0
20
40
60
Temperature (°C)
80
100
120
Full-Scale Gain Error.
DS20005426B-page 9
MCP9600
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.005
Integral Nonlinearity (% of FSR)
10.0
TA = +25°C
5.0
2.5
0.0
-100
-75
-50 -25
0
25
50
Input Voltage (% of Full-Scale)
75
0.003
0.002
0.001
0.000
100
Input Noise, % of Full-Scale.
FIGURE 2-19:
0.004
2.5
40%
VDD = 3.3V
722 units at -40°C, +45°C, +125°C
64 units at other temperatures
4.5
5.0
5.5
TA = -40°C to +125°C
VDD = 3.3V
2787 units
30%
Occurrences
1.0
Spec Limit
0.0
3.3V
Average
-1.0
20%
10%
+Std.
Dev.
Stdev+
Stdev-Std.
Dev.
FIGURE 2-20:
Cold-Junction Sensor
Temperature Accuracy.
400
300
1.0
0.8
0.6
0.4
0.2
0.0
Temperature Accuracy (°C)
FIGURE 2-23:
Cold-Junction Sensor
Temperature Accuracy Distribution.
T-40C
A = -40°C
35C
TA = +35°C
85C
TA = +85°C
125C
TA = +125°C
SDA, and Alert 1, 2, 3, 4 outputs
-0.2
-1.0
-20
0
20
40
60
80 100 120
Tǻ Temperature, ITS-90 Database (°C)
200
500
T-40C
A = -40°C
35C
TA = +35°C
85C
TA = +85°C
125C
TA = +125°C
Alert 1, 2, 3, 4 outputs
400
VDD - VOH (µA)
-40
-0.4
0%
-2.0
-0.6
Tǻ_ACY (°C)
3.5
4.0
VDD (V)
Integral Nonlinearity across
FIGURE 2-22:
VDD.
2.0
VOL (µA)
3.0
-0.8
Noise (µV, rms)
7.5
300
200
100
100
0
2.5
3.0
FIGURE 2-21:
across VDD.
DS20005426B-page 10
3.5
4.0
VDD (V)
4.5
5.0
5.5
SDA and Alert Outputs, VOL
2.5
3.0
FIGURE 2-24:
VDD.
3.5
4.0
VDD (V)
4.5
5.0
5.5
Alert Outputs, VOH across
2015-2016 Microchip Technology Inc.
MCP9600
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
500
2.0
400
85C
TA = +85°C
300
TA = -40°C
-40C
35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C
200
2.5
3.0
3.5
4.0
VDD (V)
4.5
5.0
0.0
2.5
5.5
I2C Inactive IDD across VDD.
FIGURE 2-25:
-40C
TA = -40°C
35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C
1500
1000
3.5
4.0
VDD (V)
4.5
5.0
5.5
T-40C
A = -40°C
TA = +35°C
35C
85C
TA = +85°C
125C
TA = +125°C
40.0
tSTRETCH (µs)
2000
3.0
FIGURE 2-28:
SDA, SCL and ADDR Input
Pins Leakage Current, ILEAK across VDD.
60.0
2500
I2C Active, IDD (µA)
TA = +125°C
125C
1.0
100
20.0
0.0
500
2.5
3.0
FIGURE 2-26:
5.0
3.5
4.0
VDD (V)
4.5
5.0
2.5
5.5
I2C Active IDD across VDD.
2.0%
ΔtCALC (%)
1.0%
3.0
2.0
3.0
3.5
4.0
VDD (V)
4.5
5.5
Conditions:
tCALC = 12 ms (typical)
VDD = 3.3V
TA = Room Temperature
0.0%
-40C
TA = -40°C
35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C
-1.0%
1.0
5.0
FIGURE 2-29:
I2C Interface Clock Stretch
Duration, tSTRETCH across VDD.
-40C
TA = -40°C
35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C
4.0
ISHDN (µA)
T-40C
A = -40°C
35C
TA = +35°C
ILEAK (µA)
I2C Inactive, IDD (µA)
ADDR/SDA/SCL pins
-2.0%
0.0
2.5
3.0
FIGURE 2-27:
across VDD.
3.5
4.0
VDD (V)
4.5
5.0
5.5
Shutdown Current, ISHDN
2015-2016 Microchip Technology Inc.
2.5
3.0
3.5
4.0
VDD (V)
4.5
5.0
5.5
FIGURE 2-30:
Temperature Calculation
Duration, tCALC change across VDD.
DS20005426B-page 11
MCP9600
NOTES:
DS20005426B-page 12
2015-2016 Microchip Technology Inc.
MCP9600
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
3.1
PIN FUNCTION TABLE
5x5 MQFN
Symbol
Pin Function
1, 3, 5,13, 17
GND
Electrical ground
2
VIN+
Thermocouple Positive Terminal input
4
VIN-
Thermocouple Negative Terminal input
6, 7, 9, 10, 18
GND
Not electrical ground; must be tied to ground
8
VDD
Power
11
Alert 1
Alert Output 1
12
Alert 2
Alert Output 2
14
Alert 3
Alert Output 3
15
Alert 4
Alert Output 4
16
ADDR
I2C Save Address selection voltage input
19
SCL
I2C Clock Input
20
SDA
I2C Data Input
21
EP
Exposed Thermal Pad (EP); must be connected to GND
Ground Pin (GND)
3.6
Serial Clock Line (SCL)
The GND pin is the system ground pin. Pins 1, 3, 5, 13
and 17 are system ground pins and they are at the
same potential. However, pins 6, 7, 9, 10 and 18 must
be connected to ground for normal operation.
The SCL is a clock input pin. All communication and
timing is relative to the signal on this pin. The clock is
generated by the host or master controller on the bus
(see Section 4.0 “Serial Communication”).
3.2
3.7
Thermocouple Input (VIN+, VIN-)
The thermocouple wires are directly connected to
these inputs. The positive node is connected to the
VIN+ pin while the negative node connects to the VINnode. The thermocouple voltage is converted to degree
Celsius.
3.3
Serial Data Line (SDA)
SDA is a bidirectional input/output pin used to serially
transmit data to/from the host controller. This pin
requires a pull-up resistor (see Section 4.0 “Serial
Communication”).
Power Pin (VDD)
VDD is the power pin. The operating voltage range, as
specified in the DC Electrical Specification table, is
applied on this pin.
3.4
Push-Pull Alert Outputs
(Alert 1, 2, 3, 4)
The MCP9600’s Alert pins are user-programmable
push-pull outputs which can be used to detect rising or
falling temperatures. The device outputs signals when
the
ambient
temperature
exceeds
the
user-programmed temperature alert limit.
3.5
I2C Slave Address Pin (ADDR)
This pin is used to set the I2C slave address. This pin
can be tied to VDD, GND, or a ratio of VDD can be
selected to set up to eight address levels using a
resistive voltage divider network.
2015-2016 Microchip Technology Inc.
DS20005426B-page 13
MCP9600
NOTES:
DS20005426B-page 14
2015-2016 Microchip Technology Inc.
MCP9600
4.0
SERIAL COMMUNICATION
4.1
2-Wire Standard Mode I2C
Protocol-Compatible Interface
The MCP9600’s serial clock input (SCL) and the
bidirectional serial data line (SDA) form a 2-Wire
bidirectional data communication line (refer to the
Input/Output Pin DC Characteristics table and Sensor
Serial Interface Timing Specifications table).
The following bus protocol has been defined:
TABLE 4-1:
Term
MCP9600 SERIAL BUS
PROTOCOL DESCRIPTIONS
Description
Master
The device that controls the serial bus,
typically a microcontroller
Slave
The device addressed by the master,
such as the MCP9600
Transmitter Device sending data to the bus
Receiver
Device receiving data from the bus
START
A unique signal from master to initiate
serial interface with a slave
STOP
A unique signal from the master to
terminate serial interface from a slave
Read/Write A read or write to the MCP9600
registers
ACK
A receiver Acknowledges (ACK) the
reception of each byte by polling the
bus
NAK
A receiver Not-Acknowledges (NAK) or
releases the bus to show End-of-Data
(EOD)
Busy
Communication is not possible
because the bus is in use
Not Busy
The bus is in the idle state, both SDA
and SCL remain high
Data Valid
SDA must remain stable before SCL
becomes high in order for a data bit to
be considered valid. During normal
data transfers, SDA only changes state
while SCL is low.
4.1.1
DATA TRANSFER
Data transfers are initiated by a Start condition
(START), followed by a 7-bit device address and a
read/write bit. An Acknowledge (ACK) from the slave
confirms the reception of each byte. Each access must
be terminated by a Stop condition (STOP).
This device supports the Receive Protocol. The
register can be specified using the pointer for the initial
read. Each repeated read or receive begins with a Start
condition and address byte. The MCP9600 retains the
previously selected register. Therefore, it outputs data
from the previously-specified register (repeated pointer
specification is not necessary).
4.1.2
MASTER/SLAVE
The bus is controlled by a master device (typically a
microcontroller) that controls the bus access and
generates the Start and Stop conditions. The MCP9600
is a slave device and does not control other devices in
the bus. Both master and slave devices can operate as
either transmitter or receiver. However, the master
device determines which mode is activated.
4.1.3
START/STOP CONDITION
A high-to-low transition of the SDA line (while SCL is
high) is the Start condition. All data transfers must be
preceded by a Start condition from the master. A
low-to-high transition of the SDA line (while SCL is
high) signifies a Stop condition.
If a Start or Stop condition is introduced during data
transmission, the MCP9600 releases the bus. All data
transfers are ended by a Stop condition from the
master.
4.1.4
ADDRESS BYTE
Following the Start condition, the host must transmit an
8-bit address byte to the MCP9600. The address for
the
MCP9600
Temperature
Sensor
is
‘11,0,0,A2,A1,A0’ in binary, where the A2, A1 and
A0 bits are set externally by connecting the
corresponding VADDR voltage levels on the ADDR pin
(see Section “Input/Output Pin DC Characteristics”). The 7-bit address transmitted in the serial bit
stream must match the selected address for the
MCP9600 to respond with an ACK. Bit 8 in the address
byte is a read/write bit. Setting this bit to ‘1’ commands
a read operation, while ‘0’ commands a write operation
(see Figure 4-1).
Command Byte
SCL
1
2
3
4
SDA
1 1
0
0 A2 A1 A0
Start
6
7
Slave
Address
8
9
A
C
K
R/W
MCP9600 Response
Repeated communication is initiated after tB-FREE.
FIGURE 4-1:
2015-2016 Microchip Technology Inc.
5
Device Addressing.
DS20005426B-page 15
MCP9600
4.1.5
DATA VALID
After the Start condition, each bit of data in
transmission needs to be settled for a time specified by
tSU-DATA before SCL toggles from low-to-high (see the
Sensor Serial Interface Timing Specifications section).
4.1.6
ACKNOWLEDGE (ACK/NAK)
Each receiving device, when addressed, is expected to
generate an ACK bit after the reception of each byte.
The master device must generate an extra clock pulse
for ACK to be recognized.
The acknowledging device pulls down the SDA line for
tSU-DATA before the low-to-high transition of SCL from
the master. SDA also needs to remain pulled-down for
tHD-DAT after a high-to-low transition of SCL.
During read, the master must signal an End-of-Data
(EOD) to the slave by not generating an ACK bit (NAK)
once the last bit has been clocked out of the slave. In
this case, the slave will leave the data line released to
enable the master to generate the Stop condition.
4.1.7
CLOCK STRETCHING
2
During the I C read operation, this device will hold the
I2C clock line low for tSTRECH after the falling edge of
the ACK signal. In order to prevent bus contention, the
master controller must release or hold the SCL line low
during this period.
In addition, the master controller must provide eight
consecutive clock cycles after generating the ACK bit
from a read command. This allows the device to push
out data from the SDA output shift registers. Missing
clock cycles could result in bus contention. At the end
of the data transmission, the master controller must
provide the NAK bit, followed by a STOP bit to
terminate communication.
MCP9600 Clock Stretching – tSTRETCH
7
A
0
8
R
1
A
C
K
X
2
X
3
X
4
X
5
X
6
X
7
X
8
X
A
C
K
TH MSB Data
MCP9600
FIGURE 4-2:
4.1.8
Master
Clock Stretching.
SEQUENTIAL READ
During sequential read, the device transmits data from
the proceeding register starting from the previously set
register pointer. The MCP9600 maintains an internal
address pointer, which is incremented at the
completion of each read-data transmission followed by
ACK from the master. A stop bit terminates the
sequential read.
DS20005426B-page 16
2015-2016 Microchip Technology Inc.
MCP9600
1
2
3
4
5
6
7
8
1
1
0
0
A
2
A
1
A
0
W C
K
1
2
3
4
5
6
7
8
0
0
0
0
0
0
X
X
SCL
SDA
S
A
TABLE 4-2:
Address Byte
MCP9600
1
2
3
4
5
6
7
8
1
1
0
0
A
2
A
1
A
0
R C
A
C P
K
POINTERS
Read Only
Registers
Pointer
TH
0000 0000
T∆
0000 0001
TC
0000 0010
MCP9600 Clock Stretching
1
2
3
4
5
6
7
8
0
0
0
0
0
0
0
1
1
2
3
4
5
6
7
8
1
0
0
1
0
1
0
0
SCL
SDA
S
A
K
Address Byte
A
C
K
P
LSB Data
MSB Data
Master
MCP9600
N
A
K
Master
Note: this is an example pseudo routine:
i2c_start();
i2c_write(b’1100 0000’);
// send START command
// WRITE Command
// also, make sure bit 0 is cleared ‘0’
i2c_write(b’0000 00XX’);
i2c_stop();
i2c_start();
i2c_write(b’1100 0001’);
// Write TH, T∆, or TC registers
// send STOP command
// send START command
// READ Command
// also, make sure bit 0 is set ‘1’
UpperByte = i2c_read(ACK);
// READ 8 bits
// and Send ACK bit
LowerByte = i2c_read(NAK);
// READ 8 bits
// and Send NAK bit
// send STOP command
i2c_stop();
//Convert the temperature data
if ((UpperByte
UpperByte =
Temperature
}else
Temperature
& 0x80) == 0x80){
//TA 0°C
UpperByte & 0x7F;
//Clear SIGN
= 1024 - (UpperByte x 16 + LowerByte / 16);
//TA 0°C
= (UpperByte x 16 + LowerByte / 16);
//Temperature = Ambient Temperature (°C)
FIGURE 4-3:
Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
2015-2016 Microchip Technology Inc.
DS20005426B-page 17
MCP9600
1
2
3
4
5
6
7
8
1
1
0
0
A
2
A
1
A
0
W C
K
1
2
3
4
5
6
7
8
0
0
0
0
0
1
0
X
1
2
3
4
5
6
7
8
X
X
X
X
X
X
X
X
SCL
SDA
S
A
A
C
K
A
C
K
P
Register Data
Address Byte
TABLE 4-3:
MCP9600
POINTERS
Read/Write
Registers
Pointer
Status
0000 0100
Configuration
0000 0101
0000 0110
MCP9600 Clock Stretching
1
2
3
4
5
6
7
8
1
1
0
0
A
2
A
1
A
0
R C
1
2
3
4
5
6
7
8
X
X
X
X
X
X
X
X
SCL
SDA
S
A
K
Address Byte
N
A
K
P
LSB Data
Master
MCP9600
Note: this is an example pseudo routine:
i2c_start();
i2c_write(b’1100 0000’);
// send START command
// WRITE Command
// also, make sure bit 0 is cleared ‘0’
i2c_write(b’0000 01XX’);
i2c_write(b’XXXX XXXX’);
i2c_stop();
i2c_start();
i2c_write(b’1100 0001’);
// Write Status or Configuration registers
// Write register data
// send STOP command
// send START command
// READ Command
// also, make sure bit 0 is set ‘1’
Data = i2c_read(NAK);
// READ 8 bits
// and Send NAK bit
i2c_stop();
FIGURE 4-4:
DS20005426B-page 18
// send STOP command
Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
2015-2016 Microchip Technology Inc.
MCP9600
1
2
3
4
5
6
7
8
1
1
0
0
A
2
A
1
A
0
W C
K
1
2
3
4
5
6
7
8
0
0
0
1
0
0
X
X
1
2
3
4
5
6
7
8
X
X
X
X
X
X
X
X C
SCL
SDA
S
A
Address Byte
TABLE 4-4:
MCP9600
A
C
K
Pointer
Alert 1
0001 0000
Alert 2
0001 0001
Alert 3
0001 0010
Alert 4
0001 0011
K
Alert 1, 2, 3, 4 MSB
POINTERS
Alert Limit
Registers
A
1
2
3
4
5
6
7
8
X
X
X
X
X
X
X
X
A
C P
K
Alert 1, 2, 3, 4 LSB
MCP9600 Clock Stretching
1
2
3
4
5
6
7
8
1
1
0
0
A
2
A
1
A
0
R C
1
2
3
4
5
6
7
8
X
X
X
X
X
X
X
X
1
2
3
4
5
6
7
8
X
X
X
X
X
X
X
X
SCL
SDA
S
Address Byte
A
K
MCP9600
MSB Data
A
C
K
Master
LSB Data
N
A
K
P
Master
Note: this is an example pseudo routine:
i2c_start();
i2c_write(b’1100 0000’);
// send START command
//WRITE Command
//also, make sure bit 0 is cleared ‘0’
i2c_write(b’0001
i2c_write(b’XXXX
i2c_write(b’XXXX
i2c_stop();
i2c_start();
i2c_write(b’1100
00XX’);
XXXX’);
XXXX’);
// Write Alert registers
// Write register Upper Byte
// Write register Lower Byte
// send STOP command
// send START command
0001’);
//READ Command
//also, make sure bit 0 is set ‘1’
UpperByte = i2c_read(ACK);
// READ 8 bits
//and Send ACK bit
LowerByte = i2c_read(NAK);
// READ 8 bits
//and Send NAK bit
i2c_stop();
FIGURE 4-5:
// send STOP command
Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
2015-2016 Microchip Technology Inc.
DS20005426B-page 19
MCP9600
MCP9600 Clock Stretching
1
2
3
4
5
6
7
8
1
1
0
0
A
2
A
1
A
0
R
1
2
3
4
5
6
7
8
0
0
0
0
0
0
0
0
SCL
SDA
S
Address Byte
A
C
K
A
C
K
TH MSB Data
MCP9600
MCP9600 Clock Stretching
Note 1
1
2
3
4
5
6
7
8
X
X
X
X
X
X
X
X
A
C
K
1
2
3
4
5
6
7
8
X
X
X
X
X
X
X
X
TH LSB Data
A
C
K
X
X
X
X
Master
Master
TC MSB Data
X
X
N
A
K
P
Master
TC LSB Data
Device ID LSB
Note 1: All registers can be read sequentially starting from the previously set register pointer.
Note: this is an example pseudo routine:
i2c_start();
i2c_write(b’1100 0000’);
// send START command
// WRITE Command
// also, make sure bit 0 is cleared ‘0’
i2c_write(b’0000 0000’);
i2c_stop();
i2c_start();
i2c_write(b’1100 0001’);
// Write TH register to set the starting register for sequential read
// send STOP command
// send START command
// READ Command
// also, make sure bit 0 is set ‘1’
for (i=0; i<29, i++){
Data_Buffer[i] = i2c_read(ACK);
// READ 8 bits
// and Send ACK bit
}
Data_Buffer[i] = i2c_read(NAK);
// READ 8 bits
// and Send NAK bit
i2c_stop();
FIGURE 4-6:
DS20005426B-page 20
// send STOP command
Timing Diagram to Sequential Read all Registers Starting from TH Register.
2015-2016 Microchip Technology Inc.
MCP9600
5.0
FUNCTIONAL DESCRIPTION
The MCP9600 temperature sensor consists of an 18-bit
delta-sigma analog-to-digital converter which is used to
measure the thermocouple voltage or EMF, a digital
temperature sensor used to measure cold-junction or
ambient temperature and a processor core which is
used to compute the EMF to degree Celsius conversion
using coefficients derived from NIST ITS-90
coefficients. Figure 5-1 shows a block diagram of how
these functions are structured in the device.
+
VIN+
ADC core
Del Sig
Thermocouple
VIN-
User Registers:
Thermocouple Hot-Junction, TH
Error correction
Thermocouple Junctions Delta, T∆
Thermocouple Cold-Junction, TC
Digital
Filter
Thermocouple
Type
Selection
Sensor Status
Sensor Configuration
Device Resolution & Power Modes
Configuration
Alert 1 Limit
Alert 1 Output
Alert 2 Limit
Alert 2 Output
Alert 3 Limit
Alert 3 Output
Alert 4 Limit
Alert 4 Output
Hysteresis
Configuration
Hysteresis
Configuration
Hysteresis
Configuration
Hysteresis
Device ID
I2C Module
SCL
SDA
ADDR
FIGURE 5-1:
Functional Block Diagram.
2015-2016 Microchip Technology Inc.
DS20005426B-page 21
MCP9600
The MCP9600 device has several registers that are
user-accessible. These registers include the
thermocouple
temperature
(cold-junction
compensated), hot-junction temperature, cold-junction
temperature, raw ADC data, user programmable Alert
limit registers, and status and configuration registers.
The temperature and the raw ADC data registers are
read-only registers, used to access the thermocouple
and the ambient temperature data. In addition, the four
Alert Temperature registers are individually controlled
and can be used to detect a rising and/or a falling
temperature change. If the ambient temperature drifts
beyond the user-specified limits, the MCP9600 device
outputs an alert flag at the corresponding pin (refer to
REGISTER 5-1:
Section 5.3.3 “Alert configuration Registers”). The
Alert limits can also be used to detect critical
temperature events.
The MCP9600 also provides a status and configuration
registers which allow users to detect device statuses.
The configuration registers provide various features
such as adjustable temperature measurement resolution and Shutdown modes. The thermocouple types
can also be selected using the configuration registers.
The registers are accessed by sending a Register
Pointer to the MCP9600 using the serial interface. This
is an 8-bit write-only pointer. Register 5-1 describes the
pointer definitions.
REGISTER POINTER
U-0
U-0
U-0
U-0
W-0
W-0
W-0
W-0
—
—
—
—
P3
P2
P1
P0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Write ‘0’
bit 3-0
P<3:0>: Pointer bits
0000 0000 = Thermocouple Hot-Junction Register - TH
0000 0001 = Junctions Temperature Delta Register - T∆
0000 0010 = Cold-Junction Temperature Register - TC
0000 0011 = Raw ADC Data
0000 0100 = Status
0000 0101 = Thermocouple Sensor Configuration
0000 0110 = Device Configuration
0000 1000 = Alert 1 Configuration
0000 1001 = Alert 2 Configuration
0000 1010 = Alert 3 Configuration
0000 1011 = Alert 4 Configuration
0000 1100 = Alert 1 Hysteresis - THYST1
0000 1101 = Alert 2 Hysteresis - THYST2
0000 1110 = Alert 3 Hysteresis - THYST3
0000 1111 = Alert 4 Hysteresis - THYST4
0001 0000 = Temperature Alert 1 Limit - TALERT1
0001 0001 = Temperature Alert 2 Limit - TALERT2
0001 0010 = Temperature Alert 3 Limit - TALERT3
0001 0011 = Temperature Alert 4 Limit - TALERT4
0010 0000 = Device ID/Rev Register
DS20005426B-page 22
x = Bit is unknown
2015-2016 Microchip Technology Inc.
MCP9600
TABLE 5-1:
SUMMARY OF REGISTERS AND BIT ASSIGNMENTS
Pointer
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
Hot-Junction
Temperature – TH
Register
00000000
SIGN
1024°C
512°C
256°C
128°C
64°C
32°C
16°C
8°C
4°C
2°C
1°C
0.5°C
0.25°C
0.125°C
0.0625°C
Junctions Temperature Delta – T∆
00000001
SIGN
1024°C
512°C
256°C
128°C
64°C
32°C
16°C
8°C
4°C
2°C
1°C
0.5°C
0.25°C
0.125°C
0.0625°C
Cold-Junction
Temperature – TC
00000010
8°C
4°C
2°C
1°C
Raw data ADC
00000011
SIGN
128°C
64°C
32°C
16°C
0.5°C
0.25°C
0.125°C
0.0625°C
bit 17
bit 16
SIGN
bit 15
bit 8
bit 7
Status
00000100 Flag, Burst
Complete
Thermocouple
00000101
Sensor Configuration
—
Device
Configuration
00000110 Cold-Junc.
Alert 1 Configuration
00001000
00001001
00001010
00001011
00001100
00001101
00001110
00001111
00010000
Alert 2 Configuration
Alert 3 Configuration
Alert 4 Configuration
Alert 1 Hysteresis
Alert 2 Hysteresis
Alert 3 Hysteresis
Alert 4 Hysteresis
Alert 1 Limit
bit 0
Flag, TH
Updated
—
Flag, Input
Range
Thermocouple Type Select
Type K, J, T, N, S, E, B, R
ADC Resolution
Alert 4
Status
Alert 3
Status
—
Alert 2
Status
Alert 1
Status
Filter Coefficients
Burst Mode Temperature Samples
Shutdown Modes
Resolution
Interrupt
Clear
—
—
Monitor TH
or TC
Detect
Rising or
Falling
Temps
128°C
64°C
32°C
16°C
8°C
SIGN
1024°C
512°C
256°C
8°C
4°C
2°C
1°C
1024°C
512°C
256°C
Active- High Comparator
or
or
Active-Low
Interrupt
Output
Mode
Enable
Alert
Output
4°C
2°C
1°C
128°C
64°C
32°C
16°C
0.5°C
0.25°C
—
—
128°C
64°C
32°C
16°C
Alert 2 Limit
00010001
SIGN
8°C
4°C
2°C
1°C
0.5°C
0.25°C
—
—
Alert 3 Limit
00010010
SIGN
1024°C
512°C
256°C
128°C
64°C
32°C
16°C
8°C
4°C
2°C
1°C
0.5°C
0.25°C
—
—
Alert 4 Limit
00010011
SIGN
1024°C
512°C
256°C
128°C
64°C
32°C
16°C
8°C
4°C
2°C
1°C
0.5°C
0.25°C
—
—
Device ID/Rev
00100000
0
1
0
0
0
0
0
0
Rev ID Major
2015-2016 Microchip Technology Inc.
Rev ID Minor
DS20005426B-page 23
MCP9600
5.1
Thermocouple Temperature
Sensor Registers
This device integrates three temperature registers that
are used to read the cold and hot-junction
temperatures and the sum of the two junctions to
output the absolute thermocouple temperature. In
addition, the raw ADC data which is used to derive the
thermocouple temperature is available. The following
sections describe each register in detail.
5.1.1
The temperature bits are in two’s complement format,
therefore, positive temperature data and negative temperature data are computed differently. Equation 5-1
shows how to convert the binary data to temperature in
degree Celsius.
Temperature
Sensor core
THERMOCOUPLE TEMPERATURE
REGISTER – TH
This register contains the cold-junction compensated
and error-corrected Thermocouple temperature in
degree Celsius. The temperature data from this
register is the absolute Thermocouple Hot-Junction
Temperature TH to the specified accuracy, Section 1.0
“Electrical Characteristics”. TH is the sum of the
values in T∆ and TC registers as shown in Figure 5-2.
EQUATION 5-1:
Delta
Sigma
18-bit
VIN-
TH
Thermocouple
Temperature
T∆
ADC core
VIN+
Error Corrected
Temperature
ADC
Thermocouple Register’s
FIGURE 5-2:
Block Diagram.
TEMPERATURE
CONVERSION
TC
Temperature 0°C
TH = (UpperByte x 24 + LowerByte x 2-4)
Temperature 0°C
TH = 1024 - (UpperByte x 24 + LowerByte x 2-4)
REGISTER 5-2:
THERMOCOUPLE TEMPERATURE REGISTER (READ ONLY)
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
SIGN
1024°C
512°C
256°C
128°C
64°C
32°C
16°C
bit 15
bit 8
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
8°C
4°C
2°C
1°C
0.5°C
0.25°C
0.125°C
0.0625°C
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15
SIGN:
1 = TA 0°C
0 = TA 0°C
bit 14-0
TH: Data in two’s complement format
This register contains the error corrected and cold-junction compensated Thermocouple temperature.
DS20005426B-page 24
2015-2016 Microchip Technology Inc.
MCP9600
5.1.2
THERMOCOUPLE JUNCTIONS
DELTA TEMPERATURE REGISTER –
T∆
This register contains the error corrected
Thermocouple Hot-Junction temperature without the
Cold-Junction compensation. The error correction
methodology uses several coefficients to convert the
digitized Thermocouple EMF voltage to degree
Celsius. Each Thermocouple type has a unique set of
coefficients as specified by NIST, and these
coefficients are available in the configuration register
for user selection as shown in Figure 5-3.
EQUATION 5-2:
ADC core
VIN+
VIN-
Thermocouple Types:
-
Temperature 0°C
T∆ = (UpperByte x 24 + LowerByte x 2-4)
Type K
Type J
Type T
Type N
Type S
Type E
Type B
Type R
ADC code to
degree Celsius
conversion using
coefficients
derived from
NIST look-up
table database.
T∆
(see Register 5-6)
T∆ = 1024 - (UpperByte x 24 + LowerByte x 2-4)
The temperature bits are in two’s complement format,
therefore, positive temperature data and negative
temperature data are computed differently, as shown
in Equation 5-2.
REGISTER 5-3:
Check if the ADC
code is within
range for the
selected thermocouple type
User-Selectable,
TEMPERATURE
CONVERSION
Temperature 0°C
ADC
Delta
Sigma
18-bit
Thermocouple
Junctions Delta
Temperature – T∆
FIGURE 5-3:
Thermocouple Hot-Junction
Register – T∆ Block Diagram.
HOT-JUNCTION TEMPERATURE REGISTER (READ ONLY)
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
SIGN
1024°C
512°C
256°C
128°C
64°C
32°C
16°C
bit 15
bit 8
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
8°C
4°C
2°C
1°C
0.5°C
0.25°C
0.125°C
0.0625°C
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
SIGN:
1 = TA 0°C
0 = TA 0°C
bit 14-0
T∆: Data in two’s complement format
This register contains Thermocouple Hot-Junction temperature data.
2015-2016 Microchip Technology Inc.
x = Bit is unknown
DS20005426B-page 25
MCP9600
5.1.3
COLD-JUNCTION/AMBIENT
TEMPERATURE REGISTER (TC)
TABLE 5-2:
The MCP9600 integrates an ambient temperature
sensor which can be used to measure the
Thermocouple Cold-Junction temperature. For
accurate measurement, the MCP9600 will have to be
placed at close proximity to the Thermocouple
cold-junction to detect the junction ambient
temperature. This is a 16-bit double buffered read-only
register. The temperature resolution is user selectable
to 0.0625°C/LSb or 0.25°C/LSb resolutions and setting
the resolution determines the temperature update rate
as shown in Table 5-2.
EQUATION 5-3:
TEMPERATURE
CONVERSION
RESOLUTION VS.
CONVERSION TIME
Resolution
Conversion
Time
(typical)
Register Bits
(Note 1)
0.0625°C
250 ms
SSSS XXXX XXXX XXXX
0.25°C
63 ms
SSSS XXXX XXXX XX00
Note 1:
‘S’ is Sign and ‘X’ is unknown bit.
TC
Ambient Temperature
Sensor Core
Thermocouple
Cold-Junction
Temperature -TC
Selectable Resolution
Temperature 0°C
- 0.0625°C
- 0.25°C
TC = (UpperByte x 24 + LowerByte x 2-4)
(see Register 5-8)
Temperature 0°C
TC = 1024 - (UpperByte x
24
+ LowerByte x
2-4)
FIGURE 5-4:
Thermocouple
Cold-Junction Register – TC Block Diagram.
The temperature bits are in two’s complement format,
therefore, positive temperature data and negative temperature data are computed differently, as shown in
Equation 5-3.
REGISTER 5-4:
R-0
COLD-JUNCTION TEMPERATURE REGISTER
R-0
R-0
R-0
SIGN
R-0
R-0
R-0
R-0
128°C
64°C
32°C
16°C
bit 15
bit 8
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
8°C
4°C
2°C
1°C
0.5°C
0.25°C
0.125°C
0.0625°C
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-12
SIGN:
1 = TA 0°C
0 = TA 0°C
bit 11-0
TC: Data in two’s complement format
This register contains Thermocouple Cold-Junction temperature or the device ambient temperature
data. Bits 1 and 0 may remain clear ‘0’ depending on the status of the resolution register.
DS20005426B-page 26
2015-2016 Microchip Technology Inc.
MCP9600
5.1.4
ANALOG TO DIGITAL CONVERTER
– ADC
ADC Core
The MCP9600 uses an 18-bit Delta Sigma Analog-to-Digital converter to digitize the Thermocouple
EMF voltage and the data is available in the ADC register. The ADC measurement resolution is selectable
which enables the user choose faster conversion times
with reduced resolution. This feature is useful to detect
fast transient temperatures.
TABLE 5-3:
Conversion
Time
(typical)
Raw ADC Register
Bit Format
(Note 1)
18 bit/2 µV
320 ms
SSSS SSSX XXXX XXXX
XXXX XXXX
16 bit/8 µV
80 ms
SSSS SSSX XXXX XXXX
XXXX XX00
14 bit/32 µV
20 ms
SSSS SSSX XXXX XXXX
XXXX 0000
12 bit/128 µV
5 ms
SSSS SSSX XXXX XXXX
XX00 0000
2:
ADC
Delta
Sigma
VIN-
Raw ADC
Code Register
Selectable Resolutions:
ADC RESOLUTION (Note 2)
Resolution/
Sensitivity
(typical)
Note 1:
VIN+
-
18 bit
16 bit
14 bit
12 bit
(see Register 5-7)
FIGURE 5-5:
Delta Sigma Analog to
Digital Converter, ADC Core – Block Diagram.
‘S’ is the Sign bit and ‘X’ is the ADC data
bit.
See Section 6.2.2 “Conversion Time
vs. Self-Heat”.
REGISTER 5-5:
R-0
SAMPLE: 24-BIT REGISTER
R-0
R-0
R-0
R-0
R-0
R-0
SIGN
R-0
ADC Data
bit 23
bit 16
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
ADC Data
bit 15
bit 8
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
ADC Data
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 23-0
x = Bit is unknown
ADC Data<23:0>: Raw ADC Data, including sign bits
2015-2016 Microchip Technology Inc.
DS20005426B-page 27
MCP9600
5.2
Sensor Status and Configuration
Registers
This device provides various temperature and
measurement status bits which can be monitored
regularly by the master controller. In addition, this
device integrates various user programmable features
which can be useful to develop complex thermal
management applications. The following sections
describe each features in detail.
REGISTER 5-6:
5.2.1
STATUS REGISTER
The Status register contains several flag bits that indicate statuses, such as temperature alert, the ADC input
range status for the selected thermocouple type and
the temperature register update status for both single
conversion or burst mode conversions.
STATUS REGISTER
R/W-0
R/W-0
R-0
R-0
R-0
R-0
R-0
R-0
Flag,
Burst Complete
Flag,
TH Update
—
Flag,
Input Range
Alert 4 Status
Alert 3 Status
Alert 2 Status
Alert 1 Status
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
Burst Complete, Flag bit: Burst mode Conversions Status flag
1 = T∆ register Burst mode Conversions Complete
0 = Writing 0 has no effect
Once Burst mode is enabled, this bit is normally set after the first Burst is complete. User can clear it
and poll the bit periodically until the next Burst of temperature conversions is complete (see
Register 5-8).
bit 6
TH update, Flag bit: Temperature Update flag
1 = Temperature Conversion Complete
0 = Writing 0 has no effect
This bit is normally set. User can clear it and poll the bit until the next temperature conversion is
complete.
bit 5
Unimplemented: Read as “0”.
bit 4
Input Range, Flag bit: ADC Input Voltage Range Detection bit (READ ONLY)
1 = The input voltage (or the Thermocouple EMF Voltage) exceeds the range for the selected Thermocouple type
0 = The input voltage (or the Thermocouple EMF Voltage) is within measurement range for the
selected Thermocouple type
If this bit is set, then the MCP9600 does not convert the input voltage (EMF) to Degree Celsius (Temperature data conversion is bypassed). Both T∆ and TH registers hold the previous temperature data.
bit 3
Alert 4 Status (READ ONLY)
1 = TX TALERT4
0 = TX ≤TALERT4
Where: TX is either TH or TC (User selectable, see Register 5-10)
bit 2
Alert 3 Status (READ ONLY)
1 = TX TALERT3
0 = TX ≤TALERT3
Where: TX is either TH or TC (User selectable, see Register 5-10)
bit 1
Alert 2 Status (READ ONLY)
1 = TX TALERT2
0 = TX ≤TALERT2
Where: TX is either TH or TC (User selectable, see Register 5-10)
bit 0
Alert 1 Status (READ ONLY)
1 = TX TALERT1
0 = TX ≤TALERT1
Where: TX is either TH or TC (User selectable, see Register 5-10)
DS20005426B-page 28
2015-2016 Microchip Technology Inc.
MCP9600
THERMOCOUPLE SENSOR
CONFIGURATION REGISTER
EQUATION 5-4:
The MCP9600 sensor configuration register is used to
select the thermocouple sensor types and to select the
digital filter options. This device supports eight thermocouple types. Each type has a unique set of error correction coefficients that are derived from the NIST
Thermocouple EMF voltage conversion database.
In addition, this device integrates a first order recursive
Infinite Impulse Response (IIR filter), also known as
Exponential Moving Average (EMA). The filter uses the
current new temperature sample and the previous filter
output to calculate the next filter output. It also adds
more weight to the current temperature data, allowing
a faster filter response to the immediate change in
temperature. This feature can be used to filter out fast
thermal transients or thermal instability at the
Thermocouple Hot-Junction temperature. Writing this
register resets the filter.
The filter equation is shown in Equation 5-4 and the
filter coefficient n is user selectable from level 0 to 7. A
coefficient of 0 disables the filter function, and 7
provides maximum digital filter. Figure 5-6 shows the
filter response to a step function, which can be used to
extrapolate the filter performance to various
temperature changes.
REGISTER 5-7:
R-0
—
DIGITAL FILTER
Y
=
k X + 1 – k Y–1
k
=
2 2 + 1
n
Where:
Y = New filtered temperature in T∆
X = Current, unfiltered hot-junction
temperatures
Y-1 = Previous filtered temperature
n = User selectable filter coefficient
1.0
Filter Output (°C)
5.2.2
n=0
n=1
n=2
n=3
n=4
n=5
n=6
n=7
0.5
0.0
0.0
32.0
64.0
96.0
Number of Temperature Samples
FIGURE 5-6:
128.0
Filter Step Response.
SENSOR CONFIGURATION REGISTER
R/W-0
R/W-0
R/W-0
Thermocouple Type Select Type K, J, T,
N, S, E, B, R
R-0
—
R/W-0
R/W-0
R/W-0
Filter Coefficients
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Write ‘0’
bit 6-4
Thermocouple Type:
000 = Type K
001 = Type J
010 = Type T
011 = Type N
100 = Type S
101 = Type E
110 = Type B
111 = Type R
bit 3
Unimplemented:
bit 2-0
Filter coefficient - n:
000 = n = 0 - Filter Off
001 = n = 1 - Minimum Filter
010 = n = 2
011 = n = 3
100 = n = 4 - Mid Filter
101 = n = 5
110 = n = 6
111 = n = 7 - Maximum Filter
2015-2016 Microchip Technology Inc.
x = Bit is unknown
DS20005426B-page 29
MCP9600
5.2.3
DEVICE CONFIGURATION
REGISTER
The Device Configuration register allows user to configure various functions such as sensor measurement
resolutions and power modes. The resolution register
is used to select the sensor resolution for the desired
temperature conversion time. When resolutions are
changed, the change takes effect when the next measurement cycle begins.
This device integrates two low-power operating modes,
Shutdown Mode and Burst Mode, which can be
selected using bit 0 and bit 1. When the shutdown
mode is executed, all power consuming activities are
disabled and the operating current remains at ISHDN.
During the Shutdown mode all registers are accessible,
however, I2C activity on the bus increases the current.
The Burst mode enables users to execute a given number of temperature samples (defined by bits 4-2) before
entering Shutdown mode. Each temperature sample is
compared to the user set alert temperature limits, and
if the alert conditions are true then the device asserts
the corresponding alert output. In addition, if the filter
option is enabled, then the filter engine is applied to
each temperature sample. The alert thresholds are
also compared to the filtered temperature data. This
feature is useful for battery power applications where
temperature is sampled upon request from the master
controller.
Burst Mode Command
Shutdown Mode
Shutdown Mode
Normal Operation
1←samples→128
Burst Mode Operation.
FIGURE 5-7:
REGISTER 5-8:
R/W-0
DEVICE CONFIGURATION REGISTER
R/W-0
Cold-Junction
Resolution
R/W-0
ADC Resolution
R/W-0
R/W-0
R/W-0
R/W-0
Burst Mode Temperature Samples
R/W-0
Shutdown Modes
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Cold-Junction / Ambient Sensor Resolution (see Table 5-2):
0 = 0.0625°C
1 = 0.25°C
bit 6-4
ADC Measurement Resolution (see Table 5-3):
00 = 18-bit Resolution
01 = 16-bit Resolution
10 = 14-bit Resolution
11 =12-bit Resolution
bit 3
Number of Temperature Samples:
000 = 1 Sample
001 = 2 Samples
010 = 4 Samples
011 = 8 Samples
100 = 16 Samples
101 = 32 Samples
110 = 64 Samples
111 = 128 Samples
bit 2-0
Shutdown Modes:
00 = Normal Operation
01 = Shutdown Mode
10 = Burst Mode
11 = Unimplemented: this setting has no effect
DS20005426B-page 30
x = Bit is unknown
2015-2016 Microchip Technology Inc.
MCP9600
5.3
Temperature Alert Registers
TABLE 5-4:
This device provides four temperature alert registers
that are individually configured, which allow users to
monitor multiple temperature zones with a single
device. The following sections describe each alert features in detail.
5.3.1
ALERT LIMIT REGISTERS
ALERT LIMIT REGISTERS
Register
Register Pointer
Alert 1 Limit – TALERT1
0001 0000
Alert 2 Limit – TALERT2
0001 0001
Alert 3 Limit – TALERT3
0001 0010
Alert 4 Limit – TALERT4
0001 0011
This device integrates four individually-controlled
temperature Alert Limit Registers. Each alert limit is
individually set to detect a rising or a falling
temperature or either the Thermocouple temperature
register TH or the Cold-Junction TC registers. The
corresponding Alert Limit Outputs can also be enabled
for temperature status indicators. All alert functions are
configured using the Alert Limit configuration registers,
Register 5-11, and the alert output hysteresis is set
using the Alert Hysteresis registers, Register 5-10.
REGISTER 5-9:
ALERT LIMITS 1, 2, 3 AND 4 REGISTERS
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
SIGN
1024°C
512°C
255°C
128°C
64°C
32°C
16°C
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
8°C
4°C
2°C
1°C
0.5°C
0.25°C
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15
SIGN:
1 = TA 0°C
0 = TA 0°C
bit 14-2
Alert 1, 2, 3 and 4: Data in two’s complement format
bit 1-0
Unimplemented:
TH
0
TC
1
x = Bit is unknown
Output Mode Control
Comparator
0
0
Interrupt
1
1
Digital Comparator
TH/TC
Alert Output
Alert Limit
+/Alert Hysteresis
Rise/Fall
FIGURE 5-8:
Int. Clear
Active High/Low
Comparator/Interrupt Mode
Alert Limits Set to Detect TH and TC.
2015-2016 Microchip Technology Inc.
DS20005426B-page 31
MCP9600
TALERT1
TALERT1
TALERT1 - THYST1
TALERT2
TALERT2
TALERT3 + THYST3
TH
TALERT2 - THYST2
TALERT3
TALERT3
TALERT4
Interrupt
(Active-Low)
Int. Clear
Comparator
Interrupt
Int. Clear
Comparator
Interrupt
FIGURE 5-9:
DS20005426B-page 32
(Active-Low)
Int. Clear
Alert 3 Output
(Active-Low)
Alert 2 Output
TALERT4 + THYST4
Comparator
Alert 4 Output
(Active-Low)
Alert 1 Output
TALERT4
Comparator
Interrupt
Int. Clear
Alert Limits Boundary Conditions and Output Characteristics when Set to Detect TH.
2015-2016 Microchip Technology Inc.
MCP9600
5.3.2
ALERT HYSTERESIS REGISTER
TABLE 5-5:
This device integrates four individually controlled
temperature Alert Hysteresis registers for each alert
output, with a range of 0°C to 255°C.
The alert hysteresis directions are set using bit 3 of the
corresponding
Alert
Configuration
registers
(Register 5-10) to detect rising or falling temperatures.
For rising temperatures, hysteresis range is below the
alert limit where as for falling temperatures, the hysteresis range is above the alert limit as shown on
Figure 5-10.
REGISTER 5-10:
ALERT HYSTERESIS
REGISTERS
Register
Register Pointer
Alert 1 Hysteresis – THYST1
0000 1100
Alert 2 Hysteresis – THYST2
0000 1101
Alert 3 Hysteresis – THYST3
0000 1110
Alert 4 Hysteresis – THYST4
0000 1111
ALERT 1, 2, 3 AND 4 HYSTERESIS REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R-0
R-0
R-0
128°C
64°C
32°C
16°C
8°C
4°C
2°C
1°C
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Alert Hysteresis: Alert Hysteresis range 0x00 to 0xFF, which represents 1°C to 255°C.
is
es
ter
s
Hy
is
es
ter
s
Hy
Alert Output
ACtive -Low
ACtive -Low
Alert Output
THYST
cold
Hot
Rising Temperature
ACtive -High
H
THYST
cold
sis
ere
yst
Hot
Falling Temperature
Alert Output
H
is
es
ter
s
y
ACtive -High
Alert Output
THYST
TALERT
TALERT
cold
TALERT
Hot
Rising Temperature
FIGURE 5-10:
x = Bit is unknown
TALERT
THYST
cold
Hot
Falling Temperature
Graphical Description of Alert Output Hysteresis Direction.
2015-2016 Microchip Technology Inc.
DS20005426B-page 33
MCP9600
5.3.3
ALERT CONFIGURATION
REGISTERS
The microcontroller will have acknowledged the
interrupt signal from the corresponding alert output by
clearing the interrupt using bit 7 of the corresponding
configuration register.
This device integrates four individually-controlled
temperature Alert Outputs. Each output is configured
for the corresponding alert output using the Alert Output configuration registers.
The Rise/Fall bit (bit 3) and the temperature selection
bit (bit 4) can be used to detect and maintain the
Thermocouple temperature or the Cold-Junction
temperature to the desired temperature window.
The configuration registers are used to enable each
output, select the alert function mode as Comparator or
Interrupt mode, Active-High or Active-Low output,
detect rising or falling temperatures, and detect TH or
TC temperature registers.
TABLE 5-6:
The Comparator mode is useful for thermostat-type
applications, such as on/off switches for fan controllers,
buzzer or LED indicators. The Alert output asserts and
deasserts when the temperature exceeds the
user-specified limit and the user-specified hysteresis
limit. The Interrupt mode is useful for interrupt driven
microcontroller-based systems. The Alert Outputs are
asserted each time the temperature exceeds the user
specified Alert limit and Hysteresis limits.
REGISTER 5-11:
ALERT CONFIG. REGISTERS
Register
Register Pointer
Alert 1 Configuration
0000 1000
Alert 2 Configuration
0000 1001
Alert 3 Configuration
0000 1010
Alert 4 Configuration
0000 1011
ALERT 1, 2, 3 AND 4 CONFIGURATION REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R-0
R-0
R-0
Interrupt Clear
—
—
Monitor
TH/TC
Rise/Fall
Active Hi/Lo
Comp/Int.
Alert Enable
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
Interrupt Clear:
1 = Clears Interrupt flag (forced ‘0’ by device)
0 = Normal State or Cleared State
bit 6-5
Unimplemented: Read as ‘0’
bit 4
Monitor TH or TC:
1 = Alert Monitor for TC Cold-Junction Sensor
0 = Alert Monitor for TH Thermocouple Temperature
bit 3
Alert Temperature Direction, Rise/Fall:
1 = Alert Limit for Rising or Heating Temperatures
0 = Alert Limit for Falling or Cooling Temperatures
bit 2
Alert State:
1 = Active High
0 = Active Low
bit 1
Alert Mode:
1 = Interrupt Mode: Interrupt Clear bit (bit 7) must be set to deassert the alert output
0 = Comparator Mode
bit 0
Alert Enable:
1 = Alert Output is Enabled
0 = Alert Output is Disabled
DS20005426B-page 34
2015-2016 Microchip Technology Inc.
MCP9600
5.3.4
DEVICE ID AND REVISION ID
REGISTER
The Device ID and Revision ID register is a 16-bit
read-only register, which can be used to identify this
device among other devices on the I2C bus. The upper
8-bit indicates the device ID of 0x40, while the lower
8-bit indicates the device revision. The device revision
byte is divided to the nibbles, where the upper nibble
indicates the major revision and the lower nibble
indicates minor revisions for each major revision. The
initial release is indicated by a major revision of 1 and
a minor revision of 0, or 0x4010.
REGISTER 5-12:
R-0
.
DEVICE ID AND REVISION ID REGISTER
R-1
R-0
R-0
R-0
R-0
R-0
R-0
Device ID
bit 15
bit 8
R-0
R-0
R-0
R-1
R-0
Major
R-0
R-0
R-0
Minor
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-8
Device ID: 0x40 (hex)
bit 7-0
Revision: 0x10 (hex)
Release, Revision 1.0
2015-2016 Microchip Technology Inc.
x = Bit is unknown
DS20005426B-page 35
MCP9600
NOTES:
DS20005426B-page 36
2015-2016 Microchip Technology Inc.
MCP9600
6.0
APPLICATION INFORMATION
6.1
Layout Considerations
The MCP9600 does not require any additional
components to digitize thermocouples. However, it is
recommended that a decoupling capacitor of 0.1 µF to
1 µF be used between the VDD and GND pins. A
high-frequency ceramic capacitor is recommended. It
is necessary for the capacitor to be located as close as
possible to the VDD and ground pins of the device in
order to provide effective noise protection.
In addition, good PCB layout is key for better thermal
conduction from the PCB temperature to the sensor
die. The PCB provides thermal conduction from the die
to the thermocouple cold-junction, therefore the component placement positioning and the copper layout
techniques are key for optimum cold-junction compensation. The recommended implementation for optimum
temperature sensitivity is to extend copper ground pad
around the device pins, as shown in Figure 6-1.
Thermal Pad
VIN+/VIN-
FIGURE 6-2:
Placement.
6.2
6.1.1
Recommended PCB
COLD-JUNCTION COMPENSATION
Copper provides better thermal conductivity than PCB
FR4 to the ambient temperature. It also provides better
thermal conduction than the 5 mm x 5 mm MQFN
plastic package which houses the temperature sensor
die. Therefore, when connecting the thermocouple wire
to the PCB, it is recommended to place ground copper
between the thermocouple connector footprint, where
dissimilar conductive material is attached to the PCB
and the MCP9600 exposed pad. This allows
temperature to stabilize to the local ambient
temperature (between the thermocouple connector
junction and the PCB copper) and the copper trace
conducts the temperature to the package exposed pad
where the temperature sensor die is placed. The
placement of the sensor exposed pad to the
thermocouple connector junction greatly determines
the temperature sensor’s sensitivity to the local
junction
temperature
changes.
Figure 6-2
demonstrates the recommended techniques.
2015-2016 Microchip Technology Inc.
Thermal Considerations
The potential for self-heating errors exist if the
MCP9600 SDA, SCL and Alert outputs are heavily
loaded (high current) with pull-up resistors and circuits
such as high-current LEDs or buzzer loads. The temperature rise due to self-heat increases the ambient
temperature sensor output, resulting in an increased
temperature offset error compared to the thermocouple
cold-junction ambient temperature.
6.2.1
FIGURE 6-1:
Layout.
Recommended Component
SELF-HEAT DURING OPERATION
During normal operation, the typical self-heating error
is negligible due to the relatively small current
consumption of the MCP9600. However, this device
integrates a processor to compute the equations
necessary to convert the thermocouple EMF voltage to
degrees Celsius. The processor also maintains the I2C
bus. During I2C communication, the device operating
current increases to IDD = 1.5 mA (typical), I2C Active
specification. If the bus is continually polled for data at
frequent intervals, then the processor power dissipates
heat to the temperature sensor and the effect of
self-heat can be detected. Therefore, the
recommended implementation is to maintain polling to
no more than three times per temperature conversion
period of 320 ms, or use the Burst Mode feature to
manage self heat (Section 6.2.3 “Using Burst Mode
to Manage Self-Heat”). Equation 6-1 can also be used
to determine the effect of self-heat.
DS20005426B-page 37
MCP9600
EQUATION 6-1:
EFFECT OF
SELF-HEATING
T
T
6.2.3
= JA V DD I DD
= J C V DD I DD
T = T
J
– TA
Where:
TJ = Junction Temperature
TA = Ambient Temperature
JA = Package Thermal Resistance
- Junction to Ambient
JC = Package Thermal Resistance
- Junction to Case
At room temperature (TA = +25°C) with maximum
IDD = 2.5 mA (maximum) and VDD = 3.3V, the
self-heating due to power dissipation T is 0.32°C for
the MQFN package.
6.2.2
CONVERSION TIME VS.
SELF-HEAT
Once the ADC completes digitization, the processor initiates the data computation routine for tCALC which also
increases IDD. During the 18-bit ADC conversion time
(3 SPS, Samples per Second), the increased current
lasts for approximately 5% of the one second period.
The effect of self-heat for the total power consumed per
second, including the 5% tCALC period, is negligible.
However, as the ADC resolution is reduced from 18-bit
to 16-bit, the power consuming tCALC period increases
to 20% per second. This change in resolution adds
approximately 0.04°C (typical) temperature error due
to self-heat. Table 6-1 provides an estimate for
self-heat for all resolutions using Equation 6-1.
In order to reduce the effects of self heat for lower
resolution settings, the Burst Mode feature is
recommended to manage the effects of self-heat.
TABLE 6-1:
Resolution
ADC RESOLUTION VS.
SELF-HEAT
SPS
(typ.)
tCALC Duration
per Second
The Burst mode feature is useful to manage power
dissipation while maintaining the device sensitivity to
changes in temperature (Section 5.2.3 “Device
Configuration Register”). While the device is in low
power, or Shutdown mode, the master controller
executes Burst-mode to sample temperature. The
number of temperature samples and the measurement
resolution settings are selected while executing the
command. While in Burst-mode, if the temperature
data exceeds the Alert Limits the device asserts the
corresponding Alert Output. The alert outputs are used
so the master controller does not need to continually
poll the latest temperature data, and potentially
increase the temperature error.
In addition, with some applications monitoring several
hundred degrees of temperature changes, 18-bit
resolution may not be necessary. In this case, a fewer
number of Burst samples with reducing the resolution
enables the user to monitor fast transient temperatures
at the Burst intervals. 12-bit ADC resolution provides
approximately 3°C resolution (for Type K), and a new
sample of temperature data is computed at
approximately 20 ms intervals. Therefore, the number
of Burst mode samples per second can be selected to
manage the effects of self-heat using these estimates.
The temperature conversion status during Burst mode
can also be momentarily polled (using bit 7 of the
Section 5.2.1 “Status Register”) to detect whether
the on-going sample bursts are completed. The master
controller may terminate an on-going burst by executing a Shutdown Command or reset the Burst mode by
sending another Burst Command.
6.2.4
ALERT OUTPUTS
The Alert outputs are intended to drive high impedance
loads. Typically, the outputs are connected to a microcontroller input pin. However, if the outputs are used to
drive indicators, such as LEDs or buzzers, then a buffer
circuit is recommended in order to minimize the effects
of self-heat due to the applied load (see Figure 6-3).
T
18 bit
3
5%
0.0096°C
16 bit
15
20%
0.0384°C
14 bit
60
80%
0.1536°C
12 bit
240
100%
0.1920°C
Note:
USING BURST MODE TO MANAGE
SELF-HEAT
VDD = 3.3V, and IDD = 1.5 mA (typical).
VDD
Active High
NPN
Alert Output
FIGURE 6-3:
DS20005426B-page 38
Alert Output Buffer.
2015-2016 Microchip Technology Inc.
MCP9600
6.3
Device Features
6.3.2
I2C ADDRESSING
6.3.1
The MCP9600 supports up to eight devices on the I2C
bus. Applications such as large thermal management
racks with several thermocouple sensor interfaces are
able to monitor various temperature zones with minimal
pin-count microcontrollers. This reduces the total solution cost, while providing a highly accurate thermal
management solution using the MCP9600.
VDD
R2B
R2A
®
PIC
microcontroller
Alert
4
ADDR
VIN+
MCP9600
Unit 2/8
VIN-
GND
Types K, J, T,
N, E, B, S, R
The MCP9600 uses a switched-capacitor amplifier
input stage to gain the input signal to a maximum
resolution of 2 µV/LSb at 18-bit ADC setting. An
internal input capacitor is used for charge storage. The
differential input impedance ZIN_DF is dominated by the
sampling capacitor and the switched-capacitor
amplifier sampling frequency. During sampling period,
the charging and discharging of the sampling capacitor
creates dynamic input currents at the input pins.
Adding a 10-100 nF capacitor between the inputs can
improve stability.
Since the sampling capacitor is only switching to the
input pins during a conversion process, the input
impedance is only valid during conversion periods.
During low-power or Shutdown mode, the input amplifier stage is disabled, therefore the input impedance is
ZIN_CM, which is due to the leakage current from ESD
protection diodes, as shown in Figure 6-5.
Sampling
Switch
Up to eight
MCP9600 on
I2C bus
I2C
VDD
INPUT IMPEDANCE
RSS
VIN+,VIN-
SS
RS
R7A R7B
ADDR
CSAMPLE
(3.2 pF)
V
VIN+
MCP9600
4
Alert
TABLE 6-2:
Unit 7/8
GND
VINTypes K, J, T,
N, E, B, S, R
RECOMMENDED
RESISTOR VALUES FOR
I2C ADDRESSING
Values
FIGURE 6-5:
6.3.3
Thermocouple Input Stage.
OPEN AND SHORT DETECTION
CIRCUITS
External circuits can be added to detect the
thermocouple status as open (physically disconnected)
or as short (thermocouple wire in contact with the
system ground or VDD). If a passive circuit is added to
the input stage, then the circuit loading effect to the
MCP9600 ADC inputs must be considered. System
calibration is also required to ensure proper accuracy.
In addition, external loads can degrade the device
performance, such as input offset, gain, and Integral
Nonlinearity (INL) errors. If a low impedance active
circuit is added, then both offset and gain errors must
be calibrated.
Device #
Command
Byte
1
1100 000X
ADDR pin tied to GND
2
1100 001X
R2A = 10
R2B = 2.2
3
1100 010X
R3A = 10
R3B = 4.3
4
1100 011X
R4A = 10
R4B = 7.5
5
1100 100X
R5A = 10
R5B = 13
6
1100 101X
R6A = 10
R6B = 22
6.3.3.1
7
1100 110X
R7A = 10
R7B = 43
8
1100 111X
ADDR pin tied to VDD
For open circuit detection, the Input Range Flag bit,
bit 4 of the Status Register (Register 5-6), can be used
to detect open-circuit conditions. This would require a
few external resistors as shown in Figure 6-6. The
passive circuit does not affect the MCP9600 accuracy
(The recommended value for RB set to 10 k. When
the Thermocouple is connected, the input
common-mode voltage is 0.5*VDD. And when the
Thermocouple is disconnected, the voltage at VIN+
Note:
RXA (k)
RXB (k)
Standard 5% tolerance resistors are used in
the table, however, 1% tolerance resistors
provide better ratio matching.
FIGURE 6-4:
Implementation.
I2C Address Selection
2015-2016 Microchip Technology Inc.
Open-Circuit Detection Technique
DS20005426B-page 39
MCP9600
input is 0.66*VDD and the voltage at the VIN- input is
pulled-down to VSS. This change forces the Input
Range Flag bit to be set. The master controller can
momentarily poll the status bit to detect the open-circuit
condition.
2RB RB VDD
6.3.5
ESD PROTECTION USING FERRITE
BEADS
Ferrite beads are highly recommended to protect the
MCP9600 and other circuits from ESD discharge
through the thermocouple wire. The beads suppress
fast transient signals such as ESD and can be added
in-line to the ADC inputs, as shown in Figure 6-9.
MCP9600
2RB RB VDD
VIN+
+
MCP9600
Del Sig
Thermocouple
+
VIN2RB
RB = 10 k
Thermocouple
FIGURE 6-6:
Adding Open-Circuit
Detection Resistors.
6.3.4
+
Thermocouple
RA
VIN+
RA
C
VIN-
L
2RB
ALIASING AND ANTI-ALIASING
FILTER
Aliasing occurs when the input signal contains
time-varying signal with frequency greater than half the
sample rate. In the aliasing conditions, the ADC can
output unexpected codes. The ADC integrates a first
order sinc filter, however, an external anti-aliasing filter
can provide an added filter for high noise applications.
This can be done with a simple RC low-pass filter at the
inputs as shown in Figure 6-7. Open-circuit detection
resistors can also be added as shown in Figure 6-8.
L
FIGURE 6-9:
RA
VIN+
RA
C
VIN-
Del Sig
RB = 10 k
RA = 100
C = 0.1 µF
L = Ferrite Bead
Adding Ferrite Beads.
ADC core
Del Sig
RA = 100
C = 0.1 µF
Adding a Low-Pass Filter.
FIGURE 6-7:
2RB RB VDD
MCP9600
+
Thermocouple
2RB
RA
VIN+
RA
C
VIN-
Del Sig
RB = 10 k
RA = 100
C = 0.1 µF
FIGURE 6-8:
Adding Open-Circuit
Detection Resistors with an Input Low-Pass
Filter.
DS20005426B-page 40
2015-2016 Microchip Technology Inc.
MCP9600
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
20-Lead MQFN (5x5x1.0 mm)
PIN 1
Example
PIN 1
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
MCP9600
E/MX e
^^3
1520256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2015-2016 Microchip Technology Inc.
DS20005426B-page 41
MCP9600
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
NOTE 1
A
B
N
1
2
E
(DATUM B)
(DATUM A)
2X
0.10 C
2X
TOP VIEW
0.10 C
0.10 C
C
SEATING
PLANE
A1
A
20X
(A3)
0.08 C
SIDE VIEW
D2
E2
2
K
1
NOTE 1
N
20X b
0.10
0.05
L
e
C A B
C
BOTTOM VIEW
Microchip Technology Drawing C04-186A Sheet 1 of 2
DS20005426B-page 42
2015-2016 Microchip Technology Inc.
MCP9600
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
A
Overall Height
Standoff
A1
Terminal Thickness
A3
Overall Length
D
Exposed Pad Length
D2
Overall Width
E
Exposed Pad Width
E2
b
Terminal Width
Terminal Length
L
K
Terminal-to-Exposed-Pad
MIN
0.90
0.00
3.15
3.15
0.25
0.35
0.20
MILLIMETERS
NOM
20
0.65 BSC
0.95
0.02
0.20 REF
5.00 BSC
3.25
5.00 BSC
3.25
0.30
0.40
-
MAX
1.00
0.05
3.35
3.35
0.35
0.45
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-186A Sheet 2 of 2
2015-2016 Microchip Technology Inc.
DS20005426B-page 43
MCP9600
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
EV
20
1
Y2
C2
ØV
2
G
EV
Y1
E
X1
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
W2
Optional Center Pad Width
Optional Center Pad Length
T2
Contact Pad Spacing
C1
C2
Contact Pad Spacing
Contact Pad Width (X20)
X1
Contact Pad Length (X20)
Y1
Distance Between Pads
G
Thermal Via Diameter
V
Thermal Via Pitch
EV
MIN
MILLIMETERS
NOM
0.65 BSC
MAX
3.35
3.35
4.50
4.50
0.40
0.55
0.20
0.30
1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-286B
DS20005426B-page 44
2015-2016 Microchip Technology Inc.
MCP9600
APPENDIX A:
REVISION HISTORY
Revision B (June 2016)
The following is the list of modifications:
1.
2.
3.
4.
Corrected the pin description error for pins 19
and 20 on page 1.
Added the MCP9600 Evaluation Board picture
on page 2.
Added Section 6.3.3.1 “Open-Circuit Detection Technique” and updated Section 6.3.4
“Aliasing and Anti-Aliasing Filter” and
Section 6.3.5 “ESD Protection using Ferrite
Beads”.
Updated the Product Identification System
section.
Revision A (August 2015)
• Original release of this document.
2015-2016 Microchip Technology Inc.
DS20005426B-page 45
MCP9600
NOTES:
DS20005426B-page 46
2015-2016 Microchip Technology Inc.
MCP9600
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X](2)
X
/XX
Tape and Reel
Option
Temperature
Range
Package
PART NO.(1)
Device
Device:
MCP9600: Signal Conditioning IC(1)
MCP9600T: Signal Conditioning IC(1) (Tape and Reel)
Tape and Reel
Option:
T
Examples:
a)
MCP9600-E/MX:
b)
MCP9600T-E/MX:
Extended temperature,
20LD MQFN package
Tape and Reel,
Extended temperature,
20LD MQFN package
= Tape and Reel(2)
Note 1:
Temperature Range:
E
= -40°C to +125°C
Package:
MX = More Thin Plastic Quad Flat, MQFN, 20-lead
2015-2016 Microchip Technology Inc.
2:
For custom Thermocouple Types or custom
features, please contact your local Microchip
sales office. Minimum purchase volumes are
required.
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
DS20005426B-page 47
MCP9600
NOTES:
DS20005426B-page 48
2015-2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
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ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0655-6
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2015-2016 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005426B-page 49
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Germany - Karlsruhe
Tel: 49-721-625370
India - Pune
Tel: 91-20-3019-1500
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Italy - Venice
Tel: 39-049-7625286
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15
DS20005426B-page 50
2015-2016 Microchip Technology Inc.