TI1 JM38510/33201BSA Octal buffers/drivers with 3-state output Datasheet

SN54F240, SN74F240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993
•
SN54F240 . . . J PACKAGE
SN74F240 . . . DB, DW, OR N PACKAGE
(TOP VIEW)
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
Package Options Include Plastic
Small-Outline (SOIC) and Shrink
Small-Outline (SSOP) Packages, Ceramic
Chip Carriers, and Plastic and Ceramic
DIPs
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
description
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. Taken together with the ′F241 and
′F244, these devices provide the choice of
selected combinations of inverting and
noninverting outputs, symmetrical OE (active-low
output-enable) inputs, and complementary OE
and OE inputs.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
2Y4
1A1
1OE
VCC
SN54F240 . . . FK PACKAGE
(TOP VIEW)
The ′F240 is organized as two 4-bit buffers/line
drivers with separate output enable (OE) inputs.
When OE is low, the device passes data from the
A inputs to the Y outputs. When OE is high, the
outputs are in the high-impedance state.
1A2
2Y3
1A3
2Y2
1A4
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
The SN74F240 is available in TI’s shrink
small-outline package (DB), which provides the
same I/O pin count and functionality of standard
small-outline packages in less than half the
printed-circuit-board area.
2OE
•
The SN54F240 is characterized for operation over
the full military temperature range of – 55°C to
125°C. The SN74F240 is characterized for
operation from 0°C to 70°C.
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
OE
A
L
H
L
L
L
H
H
X
Z
Copyright  1993, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2–1
SN54F240, SN74F240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993
logic symbol†
1OE
1A1
1A2
1A3
1A4
1
logic diagram (positive logic)
1
1OE
EN
2
18
4
16
6
14
8
12
1Y1
2
18
4
16
1A1
1Y2
1Y3
1A2
14
1Y3
1A3
2OE
EN
8
2A1
2A2
2A3
2A4
11
9
13
7
15
5
17
3
1Y2
1Y4
6
19
1Y1
12
1Y4
1A4
2Y1
2Y2
2Y3
19
2OE
2Y4
† This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
11
9
13
7
15
5
17
3
2Y1
2A1
2A2
2Y2
2Y3
2A3
2A4
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 1.2 V to 7 V
Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 mA to 5 mA
Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . – 0.5 V to 5.5 V
Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC
Current into any output in the low state: SN54F240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74F240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Operating free-air temperature range: SN54F240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C
SN74F240 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
2–2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54F240, SN74F240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993
recommended operating conditions
SN54F240
SN74F240
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.5
5
5.5
UNIT
VCC
VIH
Supply voltage
VIL
IIK
Low-level input voltage
0.8
0.8
V
Input clamp current
– 18
– 18
mA
IOH
IOL
High-level output current
– 12
– 15
mA
64
mA
TA
Operating free-air temperature
70
°C
High-level input voltage
2
2
Low-level output current
V
48
– 55
125
V
0
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V
VCC = 4.75 V,
VOL
VCC = 4
4.5
5V
IOZH
IOZL
VCC = 5.5 V,
VCC = 5.5 V,
II
IIH
VCC = 5.5 V,
VCC = 5.5 V,
IIL
IOS‡
VCC = 5.5 V,
VCC = 5.5 V,
ICC
VCC = 5.5 V
II = – 18 mA
IOH = – 3 mA
IOH = – 12 mA
IOH = – 15 mA
SN54F240
TYP†
MAX
MIN
– 1.2
2.4
3.3
2
3.2
IOH = – 3 mA
IOL = 48 mA
– 1.2
2.4
3.3
2
3.1
UNIT
V
V
2.7
0.38
IOL = 64 mA
VO = 2.7 V
0.55
0.42
VO = 0.5 V
VI = 7 V
VI = 2.7 V
VI = 0.5 V
VO = 0
Outputs high
SN74F240
TYP†
MAX
MIN
V
µA
50
50
– 50
– 50
µA
0.1
0.1
mA
20
20
µA
–1
mA
– 225
mA
–1
– 100
0.55
– 225
– 100
19
29
19
29
Outputs low
50
75
50
75
Outputs disabled
42
63
42
63
mA
† All typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2–3
SN54F240, SN74F240
OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SDFS061A – D2932, MARCH 1987 – REVISED OCTOBER 1993
switching characteristics (see Note 2)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 5 V,
CL = 50 pF,
RL = 500 Ω,
TA = 25°C
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500 Ω,
TA = MIN to MAX†
′F240
tPLH
tPHL
Any A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
SN54F240
SN74F240
MIN
TYP
MAX
MIN
MAX
MIN
2.2
4.7
7
2.2
9
2.2
8
1.2
3.1
4.7
1.2
6
1.2
5.7
1.2
3.1
5.3
1.2
6.7
1.2
6.1
3.2
6.5
9
3.2
10.5
3.2
10
1.2
3.6
5.3
1.2
6.5
1.2
6.3
1.2
5.6
8
1.2
12.5
1.2
9.5
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 2: Load circuits and waveforms are shown in Section 1.
2–4
POST OFFICE BOX 655303
UNIT
• DALLAS, TEXAS 75265
MAX
ns
ns
ns
PACKAGE OPTION ADDENDUM
www.ti.com
2-Oct-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-9758501Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629758501Q2A
SNJ54F
240FK
5962-9758501QRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9758501QR
A
SNJ54F240J
5962-9758501QSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9758501QS
A
SNJ54F240W
JM38510/33201B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
33201B2A
JM38510/33201BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
33201BRA
JM38510/33201BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
33201BSA
M38510/33201B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
33201B2A
M38510/33201BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
33201BRA
M38510/33201BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
33201BSA
SN54F240J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54F240J
SN74F240DBLE
OBSOLETE
SSOP
DB
20
TBD
Call TI
Call TI
0 to 70
SN74F240DW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
F240
SN74F240DWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
F240
SN74F240DWRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
F240
SN74F240N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74F240N
SN74F240NSR
ACTIVE
SO
NS
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74F240
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
2-Oct-2014
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SNJ54F240FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629758501Q2A
SNJ54F
240FK
SNJ54F240J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9758501QR
A
SNJ54F240J
SNJ54F240W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9758501QS
A
SNJ54F240W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
2-Oct-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54F240, SN74F240 :
• Catalog: SN74F240
• Military: SN54F240
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74F240DWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
SN74F240NSR
SO
NS
20
2000
330.0
24.4
9.0
13.0
2.4
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74F240DWR
SOIC
DW
20
2000
367.0
367.0
45.0
SN74F240NSR
SO
NS
20
2000
367.0
367.0
45.0
Pack Materials-Page 2
PACKAGE OUTLINE
DW0020A
SOIC - 2.65 mm max height
SCALE 1.200
SOIC
C
10.63
TYP
9.97
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
20
1
13.0
12.6
NOTE 3
18X 1.27
2X
11.43
10
11
B
7.6
7.4
NOTE 4
20X
0.51
0.31
0.25
C A B
2.65 MAX
0.33
TYP
0.10
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.3
0.1
1.27
0.40
DETAIL A
TYPICAL
4220724/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
www.ti.com
EXAMPLE BOARD LAYOUT
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
(R0.05)
TYP
10
11
(9.3)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220724/A 05/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
11
10
(9.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4220724/A 05/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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