Material Content Data Sheet Sales Product Name IGB10N60T MA# MA000960648 Package PG-TO263-3-2 Issued 29. August 2013 Weight* 1460.44 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus lead silver tin 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7439-92-1 7440-22-4 7440-31-5 0.963 0.07 0.853 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.07 659 659 584 0.256 0.02 851.691 58.31 58.39 583176 175 583935 1.409 0.10 0.10 965 965 8.912 0.61 6102 98.035 6.71 487.204 33.36 40.68 333602 406831 9.657 0.66 0.66 6612 6612 0.228 0.02 0.001 0.00 1.174 0.08 0.031 0.00 0.025 0.00 67127 156 0.02 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 156 21 0.08 Important Remarks: 1. 0 804 17 842 1000000