TI1 LM2940QML 1a low dropout regulator Datasheet

LM2940QML, LM2940QML-SP
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SNVS389B – MAY 2010 – REVISED MAY 2013
LM2940QML 1A Low Dropout Regulator
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FEATURES
DESCRIPTION
•
The LM2940 positive voltage regulator features the
ability to source 1A of output current with a dropout
voltage of typically 0.5V and a maximum of 1V over
the entire temperature range. Furthermore, a
quiescent current reduction circuit has been included
which reduces the ground current when the
differential between the input voltage and the output
voltage exceeds approximately 3V. The quiescent
current with 1A of output current and an input-output
differential of 5V is therefore only 30 mA. Higher
quiescent currents only exist when the regulator is in
the dropout mode (VIN − VOUT ≤ 3V).
1
2
•
•
•
•
•
•
Available with Radiation Ensure
– ELDRS Free 100 krad(Si)
Dropout Voltage Typically 0.5V @IO = 1A
Output Current in Excess of 1A
Output Voltage Trimmed Before Assembly
Reverse Battery Protection
Internal Short Circuit Current Limit
Mirror Image Insertion Protection
Designed also for vehicular applications, the LM2940
and all regulated circuitry are protected from reverse
battery installations or 2-battery jumps. During line
transients, such as load dump when the input voltage
can momentarily exceed the specified maximum
operating voltage, the regulator will automatically shut
down to protect both the internal circuits and the load.
The LM2940 cannot be harmed by temporary mirrorimage insertion. Familiar regulator features such as
short circuit and thermal overload protection are also
provided.
CONNECTION DIAGRAMS
Figure 1. 16-Lead Ceramic Surface-Mount Package (CFP) Top View
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2013, Texas Instruments Incorporated
LM2940QML, LM2940QML-SP
SNVS389B – MAY 2010 – REVISED MAY 2013
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Equivalent Schematic Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings (1)
Input Voltage (Survival Voltage ≤ 100mS)
60V
Internal Power Dissipation with no heat sink (TA = +25°C) (2)
1W
Maximum Junction Temperature
150°C
−65°C ≤ TA ≤ +150°C
Storage Temperature Range
Lead Temperature (Soldering 10 seconds)
300°C
θJA
Thermal Resistance
θJC
16LD CFP "WG" (device 01, 02) (Still Air)
122°C/W
16LD CFP "GW" (device 03, 04) (Still Air)
136°C/W
16LD CFP "WG" (device 01, 02) (500LF/Min Air flow)
77°C/W
16LD CFP "GW" (device 03, 04) (500LF/Min Air flow)
87°C/W
16LD CFP "WG" (device 01, 02) (3)
16LD CFP "GW" (device 03, 04)
5°C/W
13°C/W
Package Weight CFP "WG" (device 01, 02)
360 mg
Package Weight CFP "GW" (device 03, 04)
410 mg
ESD Susceptibility (4)
(1)
(2)
(3)
(4)
4KV
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For specified specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. With heat sinking,
the maximum power is 5 Watts, but then this will depend upon the temperature of the heat sink, the efficiency of the heat sink, and the
efficiency of the heat flow between the package body and the heat sink. We can not predict these values.
The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full
advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either
metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be
calculated using θJA, rather than θJC, thermal resistance. It must not be assumed that the device leads will provide substantial heat
transfer out of the package, since the thermal resistance of the lead frame material is very poor, relative to the material of the package
base. The stated θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance
between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and
must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.
Human body model, 1.5 kΩ in series with 100 pF.
Recommended Operating Conditions (1)
Input Voltage
26V
−55°C ≤ TA ≤ 125°C
Temperature Range
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For specified specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
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SNVS389B – MAY 2010 – REVISED MAY 2013
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Table 1. Quality Conformance Inspection Mil-Std-883, Method 5005 - Group A
Subgroup
Description
Temp °C
1
Static tests at
+25
2
Static tests at
+125
3
Static tests at
-55
4
Dynamic tests at
+25
5
Dynamic tests at
+125
6
Dynamic tests at
-55
7
Functional tests at
+25
8A
Functional tests at
+125
8B
Functional tests at
-55
9
Switching tests at
+25
10
Switching tests at
+125
11
Switching tests at
-55
12
Settling time at
+25
13
Settling time at
+125
14
Settling time at
-55
LM2940-5.0 Electrical Characteristics SMD: 5962R8958701 DC Parameters
The following conditions apply, unless otherwise specified.
DC: VI = 10V, IO = 1A, CO = 22µF
Symbol
Parameter
VO
Conditions
Notes
VIN = 10V, IOUT = 5mA
VIN = 6V, IOUT = 5mA
VIN = 7V, IOUT = 5mA
VIN = 26V, IOUT = 5mA
Output Voltage
VIN = 10V, IOUT = 1A
VIN = 6V, IOUT = 1A
VIN = 6V, IOUT = 50mA
VIN = 10V, IOUT = 50mA
Reverse Polarity Input Voltage DC RO = 100Ω
IQ
See (1)
VIN = 10V, IOUT = 5mA
VIN = 7V, IOUT = 5mA
Quiescent Current
VIN = 26V, IOUT = 5mA
VIN = 10V, IOUT = 1A
(1)
4
Min
Max
Unit
Subgroups
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
V
1, 2, 3
0.0
15
mA
1
0.0
20
mA
2, 3
0.0
15
mA
1
0.0
20
mA
2, 3
0.0
15
mA
1
0.0
20
mA
2, 3
0.0
50
mA
1
0.0
100
mA
2, 3
-15
Functional test only.
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SNVS389B – MAY 2010 – REVISED MAY 2013
LM2940-5.0 Electrical Characteristics SMD: 5962R8958701 DC Parameters (continued)
The following conditions apply, unless otherwise specified.
DC: VI = 10V, IO = 1A, CO = 22µF
Symbol
VRLine
VRLoad
Parameter
Conditions
Line Regulation
7V ≤ VIN ≤ 26V, IOUT = 5mA
Load Regulation
VIN = 10V, 50mA ≤ IOUT ≤ 1A
VDO
Notes
IOUT = 1A
Dropout Voltage
IOUT = 100mA
ISC
Short Circuit Current
VIN = 10V
Subgroups
Min
Max
Unit
-40
40
mV
1
-50
50
mV
2, 3
-50
50
mV
1
-100
100
mV
2, 3
0.0
0.7
V
1
0.0
1.0
V
2, 3
0.0
200
mV
1
0.0
300
mV
2, 3
1.5
A
1
1.3
A
2, 3
Unit
Subgroups
LM2940-5.0 Electrical Characteristics SMD: 5962R8958701 AC Parameters
The following conditions apply, unless otherwise specified.
AC: VI = 10V, IO = 1A, CO = 22µF
Symbol
RR
Parameter
Conditions
Notes
Min
Max
Max Line Transient
VO ≤ 6V, RO = 100Ω, t = 20mS
See (1)
40
V
1, 2, 3
Reverse Polarity Input Voltage
Transient
t = 20mS, RO = 100Ω
See (1)
-45
V
1, 2, 3
(1)
Ripple Rejection
VIN = 10V, 1VRMS, ƒ = 1KHz,
IOUT = 5mA
See
60
dB
4
See (1)
50
dB
5, 6
NO
Output Noise Voltage
VIN = 10V, IOUT = 5mA,
10Hz - 100KHz
See (1)
0.0
700
µVRMS
1, 2, 3
ZO
Output Impedance
VIN = 10V, ƒO = 120Hz
IOUT = 100mA DC and 20mA AC
See (1)
1.0
Ω
1, 2, 3
(1)
Functional test only.
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LM2940-5.0 Electrical Characteristics SMD: 5962R8958702 DC Parameters
The following conditions apply, unless otherwise specified.
DC: VI = 10V, IO = 1A, CO = 22µF
Symbol
Parameter
VO
Conditions
Notes
VIN = 10V, IOUT = 5mA
VIN = 6V, IOUT = 5mA
VIN = 7V, IOUT = 5mA
VIN = 26V, IOUT = 5mA
Output Voltage
VIN = 10V, IOUT = 1A
VIN = 6V, IOUT = 1A
VIN = 6V, IOUT = 50mA
VIN = 10V, IOUT = 50mA
Reverse Polarity Input Voltage DC RO = 100Ω
IQ
See (1)
VIN = 10V, IOUT = 5mA
VIN = 7V, IOUT = 5mA
Quiescent Current
VIN = 26V, IOUT = 5mA
VIN = 10V, IOUT = 1A
VRLine
VRLoad
Line Regulation
7V ≤ VIN ≤ 26V, IOUT = 5mA
Load Regulation
VIN = 10V, 50mA ≤ IOUT ≤ 1A
VDO
IOUT = 1A
Dropout Voltage
IOUT = 100mA
ISC
(1)
6
Short Circuit Current
VIN = 10V
Subgroups
Min
Max
Unit
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
4.85
5.15
V
1
4.75
5.25
V
2, 3
V
1, 2, 3
-15
0.0
15
mA
1
0.0
20
mA
2, 3
0.0
15
mA
1
0.0
20
mA
2, 3
0.0
15
mA
1
0.0
20
mA
2, 3
0.0
50
mA
1
2, 3
0.0
100
mA
-40
40
mV
1
-50
50
mV
2, 3
-50
50
mV
1
-100
100
mV
2, 3
0.0
0.7
V
1
2, 3
0.0
1.0
V
0.0
200
mV
1
0.0
300
mV
2, 3
1.5
A
1
1.3
A
2, 3
Functional test only.
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SNVS389B – MAY 2010 – REVISED MAY 2013
LM2940-5.0 Electrical Characteristics SMD: 5962R8958702 AC Parameters
The following conditions apply, unless otherwise specified.
AC: VI = 10V, IO = 1A, CO = 22µF
Symbol
Parameter
Conditions
VO ≤ 6V, RO = 100Ω, t = 20mS
Max Line Transient
Notes
Min
Max
Unit
Subgroups
See (1)
40
V
1, 2, 3
(1)
-45
V
1, 2, 3
Reverse Polarity Input Voltage
Transient
t = 20mS, RO = 100Ω
See
Ripple Rejection
VIN = 10V, 1VRMS, ƒ = 1KHz,
IOUT = 5mA
See (1)
60
dB
4
See
(1)
50
dB
5, 6
NO
Output Noise Voltage
VIN = 10V, IOUT = 5mA,
10Hz - 100KHz
See
(1)
0.0
700
µVRMS
1, 2, 3
ZO
Output Impedance
VIN = 10V, ƒO = 120Hz
IOUT = 100mA DC and 20mA AC
See (1)
1.0
Ω
1, 2, 3
RR
(1)
Functional test only.
LM2940-5.0 Electrical Characteristics SMD: 5962R8958702 DC Drift Parameters
The following conditions apply, unless otherwise specified.
DC: VI = 10V, IO = 1A, CO = 22µF, “Delta calculations performed on QMLV devices at group B, subgroup 5 only”
Symbol
Parameter
VO
Output Voltage
VRLOAD
Min
Max
Unit
Subgroups
VIN = 10V, IOUT = 5mA
-30
30
mV
1
VIN = 6V, IOUT = 5mA
-30
30
mV
1
VIN = 7V, IOUT = 5mA
-30
30
mV
1
VIN = 26V, IOUT = 5mA
-30
30
mV
1
VIN = 10V, IOUT = 1A
-30
30
mV
1
VIN = 6V, IOUT = 1A
-30
30
mV
1
VIN = 6V, IOUT = 50mA
-30
30
mV
1
VIN = 10V, IOUT = 50mA
-30
30
mV
1
VIN = 10V, 50mA ≤ IOUT ≤ 1A
-20
20
mV
1
Conditions
Load Regulation
Notes
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Typical Performance Characteristics
8
Dropout Voltage
Dropout Voltage
vs. Temperature
Figure 2.
Figure 3.
Output Voltage
vs. Temperature
Quiescent Current
vs. Temperature
Figure 4.
Figure 5.
Quiescent Current
Quiescent Current
Figure 6.
Figure 7.
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Typical Performance Characteristics (continued)
Line Transient Response
Load Transient Response
Figure 8.
Figure 9.
Ripple Rejection
Low Voltage Behavior
Figure 10.
Figure 11.
Low Voltage Behavior
Low Voltage Behavior
Figure 12.
Figure 13.
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SNVS389B – MAY 2010 – REVISED MAY 2013
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Typical Performance Characteristics (continued)
10
Output at Voltage Extremes
Output at Voltage Extremes
Figure 14.
Figure 15.
Output at Voltage Extremes
Output Capacitor ESR
Figure 16.
Figure 17.
Peak Output Current
Output Impedance
Figure 18.
Figure 19.
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SNVS389B – MAY 2010 – REVISED MAY 2013
Typical Application
*Required if regulator is located far from power supply filter.
**COUT must be at least 22 μF to maintain stability. May be increased without bound to maintain regulation during
transients. Locate as close as possible to the regulator. This capacitor must be rated over the same operating
temperature range as the regulator and the ESR is critical; see curve.
APPLICATION HINTS
EXTERNAL CAPACITORS
The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both
ESR (Equivalent Series Resistance) and minimum amount of capacitance.
MINIMUM CAPACITANCE:
The minimum output capacitance required to maintain stability is 22 μF (this value may be increased without
limit). Larger values of output capacitance will give improved transient response.
ESR LIMITS:
The ESR of the output capacitor will cause loop instability if it is too high or too low. The acceptable range of
ESR plotted versus load current is shown in the graph below. It is essential that the output capacitor meet
these requirements, or oscillations can result.
Figure 20. Output Capacitor ESR Limits
It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer
must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the
design.
For aluminum electrolytic capacitors, ESR will increase by about 30X as the temperature is reduced from 25°C to
−40°C. This type of capacitor is not well-suited for low temperature operation.
Solid tantalum capacitors have a more stable ESR over temperature, but are more expensive than aluminum
electrolytics. A cost-effective approach sometimes used is to parallel an aluminum electrolytic with a solid
Tantalum, with the total capacitance split about 75/25% with the Aluminum being the larger value.
If two capacitors are paralleled, the effective ESR is the parallel of the two individual values. The “flatter” ESR of
the Tantalum will keep the effective ESR from rising as quickly at low temperatures.
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HEATSINKING
A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of
the application. Under all possible operating conditions, the junction temperature must be within the range
specified under Absolute Maximum Ratings.
To determine if a heatsink is required, the power dissipated by the regulator, PD, must be calculated.
The figure below shows the voltages and currents which are present in the circuit, as well as the formula for
calculating the power dissipated in the regulator:
IIN = IL ÷ IG
PD = (VIN − VOUT) IL + (VIN) IG
Figure 21. Power Dissipation Diagram
The next parameter which must be calculated is the maximum allowable temperature rise, TR (max). This is
calculated by using the formula:
TR (max) = TJ(max) − TA (max)
where
•
•
TJ (max) is the maximum allowable junction temperature
TA (max) is the maximum ambient temperature which will be encountered in the application
(1)
Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient
thermal resistance, θ(JA), can now be found:
θ(JA) = TR (max)/PD
12
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(2)
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SNVS389B – MAY 2010 – REVISED MAY 2013
REVISION HISTORY
Released
05/10/2010
Revision
A
Section
Changes
New Release, Corporate format
1 MDS data sheets converted into one Corp. data
sheet format added reference to New ELDRS device.
Change AC subgroups from 4, 5, 6, 7, 8A, 8B to 1, 2,
3 for parameters Max Line Transient, Reverse Polarity
Input Voltage Transient, Output Noise Voltage, Output
Impedance. To bring it into agreement with the SMD.
MNLM2940-5.0-X Rev 1A1 will be archived.
12/10/2010
B
Ordering Information, Absolute Max Ratings
Ordering Information — Added LM2940GW5.0/883,
LM2940GW5.0RLQV. Absolute Max Ratings —
Added Theta JA and Theta JC along with Package
Weight for 'GW' devices. LM2940QML Rev A will be
archived.
02/5/2013
B
All
layout of National Data Sheet to TI format
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PACKAGE OPTION ADDENDUM
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27-Jul-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-8958703XA
ACTIVE
CFP
NAC
16
42
TBD
Call TI
Call TI
-55 to 125
LM2940GW5.0
/883 Q
5962-89587
03XA ACO
03XA >T
5962R8958702V9A
ACTIVE
DIESALE
Y
0
34
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
5962R8958704VXA
ACTIVE
CFP
NAC
16
42
TBD
Call TI
Call TI
-55 to 125
LM2940-5.0 MDE
ACTIVE
DIESALE
Y
0
34
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
LM2940-5.0-MW8
ACTIVE
WAFERSALE
YS
0
1
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
LM2940GW5.0/883
ACTIVE
CFP
NAC
16
42
TBD
Call TI
Call TI
-55 to 125
LM2940GW5.0
/883 Q
5962-89587
03XA ACO
03XA >T
LM2940GW5.0RLQV
ACTIVE
CFP
NAC
16
42
TBD
Call TI
Call TI
-55 to 125
LM2940GW5.0
RLQMLV Q
5962R89587
04VXA ACO
04VXA >T
LM2940GW5.0
RLQMLV Q
5962R89587
04VXA ACO
04VXA >T
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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27-Jul-2016
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM2940QML, LM2940QML-SP :
• Military: LM2940QML
• Space: LM2940QML-SP
NOTE: Qualified Version Definitions:
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 2
MECHANICAL DATA
NAC0016A
WG16A (RevG)
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